Adhesives, Sealants and Coatings for the Electronics Industry

AL S R INDUSTRY LECTR Second Edition Ernest W. Flick r-l "P NOYES PUBLICATIONS Park Ridge, New Jersey, U.S.A. C...

Author: Ernest W. Flick

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AL

S

R INDUSTRY

LECTR

Second Edition

Ernest W. Flick

r-l "P

NOYES PUBLICATIONS Park Ridge, New Jersey, U.S.A.

Copyright 0 1992 by Ernest W. Flick No part of this book may be reproduced or utilized in any form or by any means, electronic or mechanical, including photocopying, recording or by any information storage and retrieval system, without permission in writing from the Publisher. Library of Congress Catalog Card Number: 91-44715 ISBN: O-8155-1295-3 Printed in the United States Published in the United States of America Noyes Publications Mill Road, Park Ridge, New Jersey 07656

by

10987654321

Library

of Congress

Cataloging-in-Publication

Data

Flick, Ernest W. Adhesives, sealants, and coatings for the electronics industry by Ernest W. Flick. -- 2nd ed. p. cm. Includes index. ISBN O-8155-1295-3 1. Electronics--Materials--Catalogs. 2. Coatings-Catalogs. 3. Sealing compounds--Catalogs. I. Title. TK7871.FSS 1992 914471s 621.381--dc20 CIP

/

Preface

The second edition of this industrial guide is a collection of more than 2,500 adhesives, sealants, coatings and related products, which are available to the electronics and related industries. It is the result of information received from 80 manufacturers and distributors of these products. The data, including product specifications, represent selections from the manufacturers’ descriptions made at no cost to, nor influence from, the makers or distributors of these materials. Only the most recent information has been included. It is believed that all of the products listed here are currently available, which will be of interest to readers concerned with product discontinuances. The market for electronics adhesives, sealants and coatings continues to be an expanding one, with sales showing consistently strong growth. 1990 sales were $200 million, and 1995 sales are projected, at a 9% growth rate, to be $305 million (in constant 1990 dollars). A large segment of the demand is for surface mount technology and other miniaturization efforts. Diverse products such as printed circuit boards, camcorders, VCRs, and desktop computers are constantly being upgraded with new and better adhesive agents, often made of high-performance specialty materials. As”enviromnentally friendly”products have become more desirabie, the industry is working toward using less solvents, removing them completely where possible, and replacing them with waterborne, hot-melt, or totally solid products. In addition, the industry is always seeking stronger and/or faster products. Automotive electronics have also created a niche for silicone-based adhesives which can withstand broad temperature fluctuations and corrosive environments. The book is divided into the following I. II. III. IV. V. VI.

eleven sections

Adhesives-General Adhesives-Cyanoacrylate Adhesives-Epoxy Caulks and Sealants Coatings Conductive Compounds V

based on end use:

vi

Preface

VII. VIII. IX. X. XI.

Encapsulating, Potting, Casting, Impregnating Compounds Films and Tapes Insulating Products Silicones Miscellaneous

In addition to the sections listed above, the book contains a valuable list of Suppliers’ Addresses and a Trade Name Index. In each section, companies are presented alphabetically and each company’s products, which fit into that particular section, are listed thereafter. The reader seeking a particular product should check any section which might be applicable. The table of contents is organized in such a way as to be a subject index for the book. Each product in the book lists the following information, as available, in the manufacturer’s own words: Company name and product category. Tradename and product number. A description of the product’s (3) Product description/characterization. main features, as described by the supplier. Typical end uses may also be included. ii;

My fullest appreciation is expressed to the companies and organizations who supplied the information for this book. Newburyport, Massachusetts January, 1992

Ernest W. Flick

NOTICE To the best of our knowledge the information in this publication is accurate; however, the Publisher does not assume any responsibility for the accuracy or completeness of, or consequences arising from, such information. This industrial guide does not purport to contain detailed user instructions, and by its range and scope could not possibly do so. Mention of trade names or commercial products does not constitute endorsement or recommendation for use by the Publisher. In some cases adhesive, sealant and coating products could be toxic, and therefore due caution should be exercised. Final determination of the suitability of any information or product for use contemplated by any user, and the manner of that use, is the sole responsibility of the user. We strongly recommend that users seek and adhere to a manufacturer’s or supplier’s current instructions for handling each material they use. The Author and Publisher have used their best efforts to include only the most recent data available. The reader is cautioned to consult the supplier in case of questions regarding current availability.

Contents and Subject Index

........................ SECTION I: ADHESIVES-GENERAL Ashland Chemical, Inc. ................................. ....................... PLIOBOND Industrial Adhesives Bostik .............................................. .................................. Contact Adhesives ........................... General Purpose Adhesives Hot Melt Adhesives: Bulk Hot Melts .................... ............. Hot Melt Adhesives: Rope Form Hot Melts .................... Hot Melt Adhesives and Applicators Glue Guns, Hot Melt Glue Camidges--1” diameter, Hot Melt Glue Sticks--%” diameter Castall, Inc. ......................................... Adhesives Specially Designed for Electronic or General .................................... Applications CASTALL, CASTALL QUICK CURE CASTALL LClOOO Light Cure Series ................... CASTALL LC2000-T Light Cure Series ................. CASTALL LC3000 Light Cure Series ................... CASTALL LC-3080 Light Cure Series .................. Dymax Corp. ........................................ DYMAX Engineering Adhesives: Product 488 Gel: LIGHTWELD UV Curing Adhesives for Use with Clear Plastic .... DYMAX Engineering Adhesives: Product 911 and 912: ........... MULTI-CURE Adhesives and LIGHT-WELD DYMAX MULTI-CURE Surface Mount Adhesive 995 ...... Flexhar Machine Corp. ................................ .............. AUTOCRETE Hi-Temp Ceramic Adhesive vii

1 2 2 3 3 5 7 11 12

15 15 23 24 25 27 28 28 29 30 31 31

. ..

vu1


Furane Products ..................................... Electronic Grade Adhesives .......................... Surface Mounting ..............................

32 32 32

EPIBOND Thermal Transfer/Component

Protection

.............

35

URALANE General Purpose ............................... Electronic Grade Surface Mount Adhesives ...............

35 41

Syringe Dispense, Screen Printing and Dispense for High Stand-Off Components, Software Pin Transfer, Hardware Pin Transfer EPIBOND Die Attach Adhesives: Polyimide Surface Mount Adhesives ............................ GC Electronics ...................................... Adhesives ....................................... Epoxy Cements ................................

.............

45 46 49 49 49

QUICK STIK, SUPER GLUE .................. Silicone Rubber Adhesive/Sealant Epoxy Glue ................................... Cyanoacrylate Adhesives .........................

49 50 50

GR-R-RIP, GELWELD, PERh4ABOND Solvent Release Adhesives

........................

51

General Purpose Plastic Cement, GC BOND, Service Cement, Rubber-to-Metal Cement, Acrylic Cement, vinylite Cement, PEM-LOK IPS Corp. .......................................... WELD-ON 1007 High Strength Cement for Rigid Vinyl (PVC) and Kydex ................................ WELD-ON 1591 Acrylonitrile-Butadiene-Styrene (ABS) ..... WELD-ON 1707 Acrylonitrile-Butadiene-Styrene (ABS) ..... WELD-ON 1993 High Strength Cement for Rigid Vinyl .’ .. (PVC), Kydex or Acrylivin ....................... WELD-ON 3050 Noryl Cement ....................... ITWDevcon ......................................... DEVCON MVP Methacrylate Adhesives for Bonding All Materials ....................................... Loctite Corp. ........................................ Bonding .........................................

SPEEDBONDER, Threadlocker

55 55 55 56 56 57 5& 58 59 59

DEPEND

Adhesives

.............................

63

LOCTITE DRI-LOC, LOCQUIC Mereco Division ...................................... MERECO CLN-738 Surface Mount Adhesive ............. METRE-SET 321 One-Part Adhesive Epoxy ..............

68 68 68

Contents and Subject Index Norland Products Inc. ................................. ...................... NORLAND Electronic Adhesive NEA ..................................... Pacer Technology ..................... ANA-LOK Anaerobic Compounds ANL ............................... Permabond International QUICKBOND High Speed Toughened Acrylic Adhesive ..................... System: QUICKBOND 650,612 Permagile Industries Inc. ............................... .......... INSULBOND Industrial and Electrical Adhesives ................ INSULBOND Special Purpose Adhesives Sauereisen Cements ................................... Electric Heater Cement No. 6 ........................ INSA-LUTE Adhesive Cement No. 1 ................... ALUSEAL Adhesive Cement No. 2 .................... INSA-LUTE Hi-Temp Cement No. 7 ................... SAUEREISEN Cement No. 31. ....................... SAUEREISEN Electric Insulating Cement No. 12 .......... .............. SAUEREISEN Electric Refractory Cement SAUEREISEN Electric Resistor Cement No. 78 ........... ............ SAUEREISEN Electrical Cement No. DW-30 SAUEREISEN Electrical Refractory Cement No. 75 ........ SAUEREISEN ELECTROTEMP Cement No. 8 .......... SAUEREISEN INSULTEMP Cement No. 10 ............. SAUEREISEN Low Expansion Cement No. 29 ............ Sheldahl ........................................... SHELDAHL Bonding Materials: Unsupported Acrylic Adhesive T1615 (MUC) ............................ SHELDAHL FLEXCONNECT Materials Thermoplastic Polyester Adhesive T-100, T-300, T-400 ................ 3MCo. ............................................ High Performance Adhesives for the Electrical and Electronics Industry ............................... Two-Part Epoxies .............................. SCOTCH-WELD ........................... Two-Part Urethanes ............................. One-Part Epoxies Hot Melts ................................... JET-MELT ................................ Cyanoacrylates PRONTO ................................ Bonding Film Thermoset Plastics, Inc. ...............................

ix 69 69 71 71 76 76 77 77 79 81 81 82 82 83 84 85 86 87 88 89 90 91 92 93 93 94 97 97 97 100 100 101 102 103 104

x

Contents and Subject Index Electronic Grade Adhesives One Component/Elevated Temperature Curing . ....... ........ ...... Surface Mount Adhesives ..... ........ ....... Standard Syringe Dispense, Syringe Dispense for High Stand-Off Components and Screen Printing, Hardware Pin Transfer, So&are Pin Transfer J.H. Young Co., Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . Temporary Adhesives and Waxes . . . . . . . . . . . . . .

. . . . . . . 104 . . . . . . . 106

. . . . . . . 108 . . . . . . . 108

............... SECTION II: ADHESIVES-CYANOACRnATE Apple Adhesives Inc. ................................. SUPERSET Cyanoacrylate Adhesives .................. Bostik ............................................ ......... Engineering Adhesives: Cyanoacrylate Adhesives General Purpose Cyanoacrylates, Special Pei$ormance Cyanoacylates Fel-Pro Chemical Products Division ...................... ...... PRO GRIP Instant Bonding Cyanoacrylate Adhesives ........................................ ITWDevcon ..... DEVCON ZIP GRIP Cyanoacrylate Instant Adhesives Loctite Corp. ....................................... Bonding ........................................ Instant Adhesives .............................. SUPERBONDER, PRISM, BLACK MAX, TAK PAK Oneida Electronic Mfg. Inc. ............................ ........ INSTANT-WELD Alpha Cyanaoacrylate Adhesive ..................... INSTANT-WELD 847 Adhesive INSTANT-WELD 8.50 Series ........................ .................................... Pacer Technology ........ Instant Adhesives: Standard Grade Cyanoacrylates Ethyl Types, Methyl Types Instant Adhesives: Advanced Technology Series .......... PX, m, HI, HC, HP .............................. Permabond International PERMABOND Cyanoacrylates (Instant Adhesives) ........ POWERBOND PERMABOND High Performance Cyanoacrylate ..................................... Adhesives

109 110 110 118 118

120 120 123 123 126 126 126 136 136 140 141 142 142 147 155 15.5

160

SECTION III: ADHESIVES-EPOXY . . . . . . . . . . . . . . . . . . . . . . . . 161 Abatron, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162 One-Component Epoxy Systems . . . . . . . . . . . . . . . . . . , . . . 162 ABOCAST 5 Variable-Ratio Epoxy Adhesives for Structural

Contents and Subject Index and Electric Applications .......................... ABOWELD 80054/ABOCURE 8005-4 ................ Bacon Industries Inc. ................................. ALLABOND TWENTY/TWENTY Adhesive ............ BostIk ............................................ Engineering Adhesives: BOSTIK 7575 Two Component Epoxy ........................................ Engineering Adhesives: M890 Acrylic Adhesive .......... Conap, Inc. ........................................ CONASTIC Dielectric Adhesive AD-20 ................ CONASTIC Dielectric Staking Adhesive ST-115 .......... CONATHANE EN-5 .............................. CONATHANE EN-6 .............................. CONATHANE EN-7 .............................. CONATHANE EN-8 .............................. CONATHANE EN-9 .............................. CONATHANE EN-9 (OZR) ........................ CONATHANE EN-10 ............................. CONATHANE EN-11 ............................. CONATHANE EN-12 ............................. Copps Industries, Inc. ................................ Solvent-Free, 100% Solids Hi Rel Epoxies .............. Rapid Gel, Intermediate Gel, Extended Gel, Heat Cure Systems ITWDevcon ........................................ DEVCON Epoq Adhesives for Bonding All Durable Materials ...................................... S-MINUTE, 2-TON Dimiter Emulsion & Chemical Co. ....................... “F’ and “E” Series Epoxies .......................... Dow Chemical ...................................... Epoxy Products for Adhesives and Sealants .............. Bisphenol A Epoxy Resins ....................... D.E.R., Pol~@ycol Resins, Novolac Resins, TACTE Resins Fenwal Inc. ........................................ TRU-BOND Epoxy Adhesives ....................... H.B. Fuller Co. ..................................... Electrical/Electronic Products: Epoxies ................ FE Furane Products .................................... EPIBOND Die Attach Adhesives: Epoxy ............... EPIBOND Electrically Insulating Thermally Conductive Epoxy Adhesives .......................

xi 164 165 166 166 167 167 167 168 168 168 169 169 170 170 171 171 172 172 173 174 174

179 179 184 184 185 185 185

189 189 195 195 202 202 205

xii

Contents and Subject Indm

Hardman Inc. ...................................... ........................... Adhesive Selector Guide EPOWELD,

KALEX,

MONOPOXY;

EPOCAP

Key Polymer Corp. ................................... .................... Epoxy Products: General Purpose Mereco Division ..................................... MERECO System No. CLN-662 Thixotropic, High Operating Temperature, Room Temperature Hardening Epoxy System .......................... METRE-GRIP 303 Series-Multi-Purpose Epoxy ..................................... Adhesives .............................. Permabond International PERMABOND ESP308, ESP309, and ESP310 ........... Permagile Industries Inc. .............................. ............................. INSULCAST Epoxies Curing Agents ................................... Smooth-On, Inc. .................................... EA-40 ......................................... METALSET A-4. Highly Versatile Ahuninum Filled ....... SUPER INSTANT EPOXY ......................... Sympiastics Inc. ..................................... SYMPOXY 1010-596 A&B, 4235-596 A&B and 4440-596 A&B.. ....................................... ................... SYMPOXY 1574 Adhesive/Sealant SYMPOXY 4120 A&B, 4130 A&B and 4150 A&B Adhesive/ Sealants ....................................... ................. SYMPOXY 4235-72 Adhesive/Sealant ................. SYMPOXY 4234-10 Adhesive/Sealant Tra-Con, Inc. ....................................... ................................. Epoxy Adhesives SUPERTHEM,

206 206 214 214 215

215 216 217 217 218 218 221 222 222 223 224 225 225 226 227 228 228 229 229

TM-BOND

SECTION Iv: CAULKS AND SEALANTS .................... American Sealants, Inc. ............................... AS1 306 Electronic Grade Self-Levehing Sihcone ................................ Sealant/Adhesive ............. ASI 388 Electronic Grade Sealant/Adhesive Chomerics, Inc. ..................................... CHO-BOND Caulks and Sealants ..................... Dow Corning Corp. .................................. DOW CORNING 736 Heat Resistant Sealant ............ Fel-Pro Inc. ........................................ .............. PRO-LOCK Anaerobic Adhesive Sealants ....................................... GE Silicones

249 250 250 251 252 252 255 255 256 256 257

Contents and Subject Index RTV Silicone Adhesive Sealants: RTV 133, RTV 160, RTV 162, RTV 167, RTV 6424 .................. General Electric Co. .................................. RTV Adhesive Sealant Products ...................... Loctite Corp. ....................................... LOCTITE Impregnation System ...................... FLEXSEAL Mereco Division ..................................... ...... MERECO METASIL 5002 Flexible Adhesive/Sealant MERECO METASIL 5004T/MERECO METASIL 5004LV RTV-1 Non-Corrosive Adhesive Sealants ........ MERECO METASIL 5005 RTV General Purpose Silicone Adhesive Sealant ................................ METASIL 5017 Mold Making Silicone Rubber ........... MERECO XLN-647 Thixotropic Sealant Epoxy .......... MERECO 3890 Series: Age-Resistant Low-Slump ................. Elastomeric Epoxy Adhesive/SeaIant ................................ SECTION v: COATINGS Castall, Inc. ........................................ Coatings Specially Designed for Electronic or ............................. General Applications CASTALL Chomerics, Inc. ..................................... CHO-SHIELD Coatings ............................ Conap, Inc. ........................................ ..... CONAP Dielectric Conformal Coatings for Electronics CONATHANE Dock Resins Corp. ................................... Conformal Coatings ............................... Dymax Corp. ....................................... DYMAX Engineering Adhesives: MULTI-CURE 984-LVF UF Curing Conformal Coating ............... Electra-Science Laboratories, Inc. ........................ High Temperature, Polyimide-Based Coatings Conductive Gold and Silver Compositions: #A-25, #I-30, #A-25-G, #A-25-SD/Insulating Composition, #A-25-1 ............ Polymer Dielectric Coatings #500 Resin-Based Thick Films ........................................ Polymer Protective Coatings 242-S, 242-SB, 242-D ......... Polymer Resistive Coatings #RS-15100, #RS-15100P, #RS-16000, #RS-16100 Series ...................... .... Protective Coating #22H: Room Temperature, Aircure Protective Coatings #55H-D and #55H-S: High

xiii

257 260 260 262 262 263 263 264 265 265 266 267 268 269 269 276 276 279 279 284 284 285 285 286

286 287 288 289 290

xiv

Contents and Subject Index .......................... Temperature Application ......................... Protective Coating #240-SB Furan Products ..................................... Conformal Coatings ............................... ACRYLANE, EPOCAST, SILFLEX, URALANE GC Electronics ..................................... Coatings ....................................... PRINT KOTE, CONKOAT, RED-X, Q DOPE, EMI-RFI SHIELD, INSUL-VOLT, STATIC HALT, Q-DOPE, CORONA DOPE, RED GLPT, LIQUID TRPE, HIGH VOLTAGE PUTTY GE Silicones ....................................... Silicone Conformal Coatings: ECC 440, ECC 443, ECC 450, ECC 453, SR 900 ........................ Magnolia Plastics, Inc. ................................ MAGNOLIA 3900 & 3901 and MAGNOLIA 3900 & 3901 UV ...................................... Mavidon Corp. ..................................... Coatings ....................................... MAVIDON Mereco Division ..................................... ............. MERECO CN-785U Circuit Board Coating ....... META-CLAD 1175 Clear Epoxy Protective Varnish ............... METACLAD DP-537 Protective Coating ........... METACOTE 1031 Silicone Protective Coating METAGEL 1870 Series: Thixotropic Conformal Dip Coating Compound .............................. Miller-Stephenson Chemical Co., Inc. ..................... Couformal Coatings ............................... Conformal Protective Coating: Aerosol Products ......... Products Research & Chemical Corp. ..................... PR-1568 Couformal Coating ......................... Ranbar Technology Inc. ............................... Thermelec Electrical Insulating Varnishes ............... Electrical Specialties .............................. Solvent Baking Varnish, Clear, Water Reducible Varnish, Air Dry Clear Varnish, 100% Reactive Varnish Symplastics Inc. ..................................... SYMPOXY 1495 Dip Coating ....................... TACC International Corp. ............................. Conformal Coatings ...............................

SECTION VI: CONDUCTIVE

COMPOUNDS

291 292 293 293 294 294

298 298 301 301 302 302 312 312 313 313 314 315 316 316 317 320 320 321 321 321

325 325 326 326

. . . . . . . . . . . . . . . . . 328

Contents and Subject Index Abatron, Inc. ....................................... ................... Electrically Conductive Compounds Silver Filled .................................. Nickel Filled ................................. Carbon Filled ................................ ABOCOAT, ABOKELD, ABOCURE Able&k ........................................... Hybrid Adhesive Pastes ............................ ABLEBOND Polymer Conductor P2134 .......................... Polymer Conductor P2136 .......................... ....................... Polymer Conductor P2313-XP Polymer Conductor P2422 .......................... Polymer Conductor P2545 .......................... Polymer Conductor P254S .......................... Polymer Conductor P2609 .......................... ............. Polymer Overcoat P62OO Series Soldermask ..................... Polymer Dielectrics/Encapsulants Polymer Resistor Systems ........................... A.I. Technology, Inc. ................................. .......................... Flexible PRIMA SOLDER ........................... Rigid PRIMA SOLDER Aremco Products, Inc. ................................ ...... AREMCO-BOND Electrically Conductive Adhesives AREMCO-SHIELD EMI/RFI Conductive Adhesive/ Putty/Coating .................................. HEAT-AWAY High Temperature Conductive Greases ..... PYRO-DUCT High Temperature Electrically Conductive Coatings ...................................... Bacon Industries Inc. ................................. ..................... Electrically Conductive Adhesives CONDUCTING TWENTY/TWENTY .............. Thermally Conductive Silicone Compounds Thermally Conductive Adhesive LCA-127 ............... Chomerics ......................................... ................... CHO-BOND Conductive Adhesives CHO-FLEX Conductive Coatings and Ink .............. Cotronics Corp. ..................................... Hi Temp Conductive Adhesives: For Electronic and Industrial Applications ............................ .......................... Electrically Conductive .......................... Thermally Conductive DURALCO Dymax Corp. .......................................

xv 329 329 329 330 330 334 334 336 336 337 337 338 338 339 339 340 341 342 342 343 346 346 347 348 349 350 350 352 353 354 354 357 358 358 358 359 360

xvi

Contents and Subject Index DYMAX MULTI-CURE Thermally Conductive Adhesive 991 .......................................... Electra-Kinetic Systems, Inc. ........................... .................. CONDUCT-X Conductive Adhesives Electra-Science Laboratories, Inc. ........................ Conductive Adhesives and Coatings Silver Compositions: #1109, #1109-S, #1110-S, #2209/Thermally Conducting, Electrically Insulating #1109-I for Use as Adhesive .......................... and for Chip Attachment ESL #1107-S Silver-Filled Conductive Polymer ........... #1900 Silver-Filled Solventless Epoxy/#1000 Insulative ................ Epoxy/#610 Reactive Vehicle Thinner Epoxy Technology Inc. ................................ EPO-TEK Electrically Conductive Epoxies-Microelectronic Grade: Silver Filled Elevated Temperature Cure ........ EPO-TEK Electrically Conductive Epoxies-Microelectronic Grade: Silver Filled Room Temperature Cure .......... EPO-TEK Electrically Conductive Epoxies-Microelectronic Grade: Gold Filled Elevated Temperature Cure ......... EPO-TEK Electrically Conductive Epoxies-Microelectronic Grade: Pd:Ag Filled Elevated Temperature Cure ........ EPO-TEK Epoxies Thermally Conductive/Electrically Insulating-Microelectronic Grade .................... Alumina Filled Elevated Temperature Cure, Insulating Elevated Temperature Cure Furane Products .................................... ....... EPIBOND Electrically Conductive Epoxy Adhesives ............... URALANE Thermal Transfer Adhesives Key Polymer Carp .................................... ................ Epoxy Products: Conductive Adhesives Magnolia Plastics, Inc. ................................ Conductive Adhesives .............................. MAGNOLIA, MAGNOBOND Mavidon Corp. ..................................... Adhesives ...................................... Heat Sink Adhesive, Flameout Adhesive Electrically Conductive Products ...................... Conductive Adhesive, Conductive Ink, Dielectric, Resistive Ink, Conductive Epoxy Mereco Division ..................................... METADUCT 1202 Silver Adhesive and Cement .......... METADUCT 1240 Flexible, Electrically Conductive OneComponent Epoxy Adhesive and Coating .............. META-SHIELD 1234 Conductive Copper Paint ..........

360 361 361 365

365 366 367 368 368 371 372 374 375

379 379 380 382 382 383 383 387 387 388

399 399 400 401

Contents and Subject Index TACC International Corp. ............................. Electrically Conductive Resins ....................... Tecknit ........................................... Conductive Adhesives-Two Part: Silver, Nickel, or Carbon Filled RTV ..............................

xvii 402 402 404 404

CON/RTV Conductive Caulking: Silver-Filled Flexible Resin Caulking System .............................. Conductive Caulking: Silver-Filled Flexible Resin Caulking System (Conductive) .................... Conductive Epoxy: Silver-Filled Epoxy Systems .......... Conductive Grease: Conductive Silver-Filled Silicone Grease ....................................... Conductive Systems ............................... Electrically Conductive Acrylic and Latex ............... TECK-BOND Silver-Plated Copper-Filled Adhesives ....... Thermoset Plastics, Inc. ............................... Microelectronic Resin Systems: Electrically Conductive Materials ............................. Tra-Con, Inc. ....................................... Conductive Epoxy Adhesives ........................

TM-DUCT,

TM-SHIELD,

405 406 407 408 409 410 412 414

414 416 416

TM-CAST

SECTION VII: ENCAPSULATING, PO’ITING, CASTING, IMPREGNATING COMPOUNDS .......................... Abatron, Inc. ....................................... Casting for Electrical and Structural Uses ............... ABOCAST, ABOCURE, EPOXIT One-Component Structural/Dielectric Epoxy Systems

420 421 421 ......

427

ABOKELD The “VR” Epoxy Series ............................ Bacon Industries Inc. ................................. Clear General Purpose Potting Compound P-51 .......... General Purpose Potting Compound C-84/BA-63 ......... Instrument Grade Potting Compounds P-80C and P-80F .... Instrument Grade Potting Compounds P-82C and P-82F .... Low Cost Potting Compound P-85 .................... Microcircuit Grade Potting Compound P-86 ............. Coil Impregnants ................................. Epoxy Resin Potting Compounds .....................

428 433 433 434 435 436 437 438 439 442

Highly-Filled Gyro-Grade Low Coefficient of Expansion, Light Weight-Glass Microballoon Filled, Thermally Conductive Potting Compounds Non-Magnetic

Potting

Compounds

....................

453

...

XV111


Biwax Corp. ........................................ ............ Impregnating Compounds High Temperature ............. Impregnating Compounds Low Temperature .................. Potting Compounds Heat Conductive ............... Potting, Dipping and Coating Compounds Sealing Compounds ............................... Special Compounds ...............................

454 454 456 458 459 462 463

Screw and Fastener Coating, W?re Spotting, Potting Greases Miscellaneous Impregnating, Potting, Dipping Compounds Bonded Products, Inc. ................................ EPI-SEAL Clear Epoxy PE-X001 ..................... EPI-SEAL Clear Epoxy PE-X002 ..................... EPI-SEAL Clear Epoxy PE-X003 ..................... CasChem, Inc. ...................................... QURE Polyurethane Systems for Electrical Applications ....................... in Potting and Encapsulation Conap, Inc. ........................................ CONATHANE High Technology Potting, Casting and ............................. Molding Compounds Cotronics Corp. ..................................... DURAPOT Epoxies: High Performance Potting ............... Compounds for Electronic Applications John C. Dolph Co. ................................... DOLPHON Epoxy Resins ..........................

. . 466 468 468 469 470 471 471 482 482 483 483 487 487

One Package Impregnant, Dipping, Wet winding, Impregnating, Casting and Potting, Bonding DOLPHON Polybutadiene Resins: Potting, Casting and Coating ....................................... Solventless Polyester Resins ......................... Emerson & Cuming, Inc. .............................. .............. Encapsulants: General Purpose (Unfiied)

498 500 503 503

One Component-Epoxy Based, One Component Systems-UV Curable, Two Component SystemsEpoxy Based, Two Component Systems-Urethane Based Encapsulants:

General

Purpose

(Filled)

. . . . . . . . . . . . . . . . 507

One Component Systems-Epoxy Based, Two Component Systems-Epoxy Based, Two Component Systems-Silicone Based Encapsulants:

Low Viscosity

. . . . . . . . . . . . . . . . . . . . . . . . 513

One Component System-Epoxy Based Two Component Systems-Epoxy Based Two Component SystemsUrethane Based

Contents and Subject Index Encapsulants:

Low Temperature

Performance

xiw

. . . . . . . . . . . 518

Two Component Systems-Epoxy Based, Two Component Systems-Silicone Based Two Component SystemsUrethane Based Encapsulants:

High Temperature

Performance

. . . . . . . . . . . 525

One Component Systems-Epoxy Based; Two Component Systems-Epoxy Based, Two Component SystemsSilicone Based Encapsulants: Dispensable . . . . . . . . . . . . . . . . . . . . . . . . . . 533 One Component Systems-Epoxy Based . . . . . . . . . . . . . 533 Two Component Systems-Epoxy Based . . . . . . . . . . . . . 535

STYCXST Two Component Systems-Silicone Based . . . . . . , . . . . . 537 Encapsulants: Fire Resistant . . . . . . . . . . . . . . . . . . . . . . . . 538

One Component Systems-Epoxy Based Two Component Systems-Epoxy Based Encapsulants:

. . . . . . . . . . . . . . . . . . . . . . . . . . 542

Lightweight

One Component Systems-Epoxy Based Two Component Systems-Epoxy Based, Two Component SystemsSilicone Based; Two Component Systems-Urethane Based Encapsulants:

Optically

Clear

. . . . . . . . . . . . . . . . . . . . . . . 544

One Component Systems-Epoxy Based One Component Systems-Silicone Based, One Component SystemsW Curable, Two Component Systems-Epoxy Based, Two Component Systems-Silicone Based Encapsulants:

Thermally

Conductive

. . . . . . . . . . . . . . . . . . 549

One Component Systems-Epoxy Based, Two Component Systems-Epoxy Based, Two Component Systems-Epoxy Based Encapsulants:

Specialty

. . . . . . . . . . . . . . . . . . . . . . . . . . . . 555

One Component Systems-Silicone Based, Two Component Systems-Epoxy Based, Two Component Systems-Silicone Based, Two Component SystemsUrethane Based Encapsulants: Curing Agents . . . . . . . Fenwal Inc. . . . . . . . . . . . . . . . . . . . . . . . TRU-CAST Potting and Casting Resins Furane Products ... ...... .......... EPOCAST Glob Top Encapsulants ... Potting, Encapsulating and Impregnating Conformal Coatings . . . . . . . . . . . . .

URALANE, ACRYLANE, GE Silicones

.. ..... .. ... .. ... .. . .... ... ..... .. Products .... ...

. . . . .

... ... ... ... ... for ....

. . . . .

. . . . .

. . . . .

.. .. _. .. ..

. . . . .

559 563 563 573 573

. . . . . . 576

EPOCAST, SZLFLEX

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579

xx

Contents and Subject Index Addition-Cure RTV Silicone Encapsulants: RTV 615, RTV 627, RTV 655 .............................. ........... Condensation-Cure RTV Silicone Encapsulants General Purpose Encapsulants: RTV 11, RTV 12, RTV 21, RTV 41 ................................ High-Temperature Encapsulants: RTV 31, RTV 60, RTV88 ....................................... Low-Temperature Encapsulants: RTV 511, RTV 560, RTV 577 ...................................... Encapsulants (Room Temperature Cure) ............... Encapsulants (RT or Heat Cure) ..................... General Polymers Corp. ............................... POLYCAST 25 Epoxy Resin Compound ................ POLYCAST 62 Epoxy Resin System ................... POLYCAST XP-242 Epoxy Resin System ............... Key Polymer Carp .................................... .................. Epoxy Products: Potting Compounds Magnolia Plastics Inc. ................................ Electrical Systems ................................ MAGNOLIA Mavidon Corp. ..................................... Encapsulants .................................... Semiconductor Encapsulant, Epoxy Casting Compound, Casting Compountt, Potthg Compound Permagile Industries Inc. .............................. INSULCAST Epoxy Selector, Guide for Electrical and ............................ Electronic Compounds INSULCURE Products Research & Chemical Corp. ..................... ............. PR-1201-Q Potting and Molding Compound PR-1201-RLS Potting and Se&rig ..................... ............... PR-1520 Potting and Molding Compound ............... PR-1527 Potting and Molding Compound ............... PR-1535 Potting and Molding Compound ............... PR-1538 Potting and Molding Compound PR-1546 Potting, Embedding and Encapsulating Compound .................................... .............. PRC-1547 Potting and Molding Compound ........................ PR-1564 Molding Compound ............... PR-1570 Potting and Molding Compound ............... PR-1574 Potting and Molding Compound ........................ PR-1590 Molding Compound ............... PR-1592 Potting and Molding Compound ............... PR-1660 Potting and Molding Compound

579 579 580 580 581 582 587 589 589 589 590 591 591 592 592 605 605

610 610 618 618 619 620 621 622 623 624 625 626 627 628 629 630 631

Contents and Subject Index P/S 727 Potting and Sealing Compound ................ P/S 799 Potting and Molding Compound ............... Quadrant Chemical Corp. ............................. A-2191F/B-2912F Encapsulating Resin ................. A-2238 VO/B-2250 Encapsulating Resin ................ A-2249 VO/B-2250 Encapsulating Resin ................ Symplastics Inc. ..................................... ARALDITE 506/SYMPOXY CA-803 ................. SYMPOXY 1002-31 and 1010-31 A & B ................ SYMPOXY 1002-32 and 1010-32 A & B ................ SYMPOXY 1003-3 A & B .......................... SYMPOXY 1004-201 A & B, 1007-201 A & B and 1010-201 A & B ................................ SYMPOXY 1005 A-B-C ............................ SYMPOXY 1006-35 ............................... .......... SYMPOXY1006-72A&BandlOlO-72A&B SYMPOXY 1006-284 and 1006-74 .................... SYMPOXY 1006-803 .............................. SYMPOXY 1007-213 A & B ........................ SYMPOXY 1007-728 and 1350-728 .................... SYMPOXY 1010 ABC ............................. SYMPOXY 1OlOFR ABC .......................... SYMPOXY 1010-6 and 1010-803 ..................... SYMPOXY 1010-35 ............................... SYMPOXY 1010-809 A & B ........................ SYMPOXY 1010-50 A & B, 4235-50 A & B and W-250 A & B ....................................... SYMPOXY 1010-74 A & B ......................... SYMPOXY 1010-802 A & B ........................ SYMPOXY 1010-807 A & B ........................ SYMPOXY 1010-812 A & B ........................ SYMPOXY 1015 A & B ........................... SYMPOXY 1064-561 A & B ........................ SYMPOXY 1064-809 A & B ........................ SYMPOXY 1225-35 ............................... SYMPOXY 1225-20 ............................... SYMPOXY 1225/85 .............................. SYMPOXY 1225FR-284 ............................ SYMPOXY 1225FR-803 ............................ SYMPOXY 1230-56 A & B and 1282-56 A & B for Small Potting Applications .............................. SYMPOXY 1230/284 Potting/Casting System ............ SYMPOXY 1230-561 Potting/Casting System ............ SYMPOXY 1230-803 Potting System ..................

xxi 632 633 634 634 635 636 637 637 638 639 640 641 642 643 644 645 646 647 648 649 650 651 652 652 653 654 655 656 656 657 657 658 658 659 659 660 660 661 662 662 663

xxii

Contents and Subject Index SYMPOXY 1230-201 A & B Potting/Casting System ...... SYMPOXY 1250 Potting/Casting Resin ................ SYMPOXY 1250-50 A & B and 1350-50 A & B .......... SYMPOXY 1250-213 A & B and Potting/Casting System ... ............ SYMPOXY 1273-72 A & B Adhesive/Sealant SYMPOXY 1273-20 Epoxy Sealant and Potting .................................... Compound .......... SYMPOXYUU-284A&Band1281_9A&B SYMPOXY 1282-201 Potting/Casting/Impregnating ................................... Applications SYMPOXY 1279FR-284 A & B Potting/Casting ................................... Applications ............ SYMPOXY 1282-284 End Fill Epoxy System SYMPOXY 1282-561 Potting/Casting System ............ SYMPOXY 1282-803 Potting/Casting/Impregnating ....................................... System SYMPOXY 1282-2213 A & B Potting/Casting System ...... ...... SYMPOXY 1287-809 A & B Potting/Casting System SYMPOXY 1350-6 Potting/Casting System .............. SYMPOXY 1350-8 Potting/Casting System .............. SYMPOXY 1350-803 Potting/Casting System ............ SYMPOXY 1350-2218 A & B Epoxy System for Potting/ Casting ....................................... SYMPOXY 1425/56 Potting System ................... SYMPOXY 1425-284 Potting/Casting/Adhesive/Sealant ................................... Applications SYMPOXY 1425-213 A & B Shock Resistant System ...... SYMPOXY 1426-596 A & B Potting/Casting System ...... SYMPOXY 1454-596 Potting/Casting System ............ SYMPOXY 1515-591 Epoxy Tooling Resin .............. SYMPOXY 1610-74 Potting/Casting Resin .............. SYMPOXY 1870 Tooling/Casting System ............... SYMPOXY 1871 Potting and Casting System ............ SYMPOXY 1873 Potting/Casting Resin ................ SYMPOXY 1874 ................................. SYh4POXY 1874: Physical and Electrical Properties ....... SYMPOXY 1949 Fluidized Bed Coating Powder .......... ... SYMPOXY 2100-810 A & B Potting and Casting System SYMPOXY 1950, 1951, 1954, 1955 Epoxy for Potting/ .................. Casting/Encapsulation Applications SYMPOXY 2202 A & B Potting/Casting/Coating System .... ......... SYMPOXY 2205 A & B Potting/Casting System SYMPOXY 2218 and 2221 FR A & B for Potting/Casting ................................... Applications

663 664 666 666 667 667 668 669 669 670 670 671 671 672 672 673 673 674 674 675 675 676 676 677 678 679 679 680 681 682 684 684 685 687 687 688

Contents and Subject Index SYMPOXY 2285 A & B Epoxy Potting/Casting/ Impregnating System . . . . . . . . . . . . . . . . . . . . . . . . . SYMPOXY 2650 ABC Epoxy System for Impregnations SYMPOXY 2660A,B,C Epoxy System for Impregnation SYMPOXY 2660FR A,B,C Epoxy System for Impregnation SYMPOXY 18752 Potting and Casting Resin . . . . . . . . SYMPOXY 18755 A & B Potting/Casting System . . . . . SYMPOXY 1877 Potting/Casting Resin . . . . . . . . . . . . 3M Co. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SCOTCH-WELD EPX Applicator System .......... TACC International Corp. . . . . . . . . . . . . . . . . . . . . . . . . . Casting, Potting, Encapsulating Resins ............. Tra-Con, Inc. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Casting Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TRA-CAST ....................... SECTION VIII: FILMS AND TAPES Ablestik ........................................... Hybrid Adhesive Films ............................. Electrically Conductive .......................... ABLEFILM ........................... Electrically Insulative .......................... Thermally Conductive Adhesives Research, Inc. .............................. Conductive Pressure Sensitive Adhesives ................ ARCLRD A.I. Technology, Inc. ................................. Flexible ESP Series ............................... Flexible ZSP Series ............................... : .................. Flexible TACK FILM ........... American Biltrite Inc. ................................ Printed Circuit Board Products ....................... THERM-X Electrical Tapes ......................... Arlon ............................................. Circuit Materials ................................. High Performance Adhesive Coated Dielectrics Flame Retardant Acrylic Coated Aramid Paper: NOMEX, Phenolic Coated Aramid Dielectrk, Flame Retardant Acrylic Coated Polyimide Films, Acrylic Coated Poiyimide Film, Epoxy Coated Polyimide Film, Flame Retardant Epoxy Coated Polyimide Film ........................... Adhesive Cast Fiis Acrylic Cast Film, Flame Retardant Acrylic

.... .... .... .. .... .... .... . . . . .... .... .... .... ....

xxiii

689 689 690 691 692 693 693 694 694 697 697 700 700

710 711 711 711 713 714 715 715

.......

718 718 719 720 721 721 724 732 732 732

738

xxiv


Cast Film, Epoxy Cast Film, Flame Retardant Epoxy Cast Film Adhesive Coated Polyester Films .................. Flame Retardant Acrylic Coated Polyester Film, Heat Seal Coated Polyester Film Overlay, Heat Seal Coated Polyester Film Overlay Flame Retardant Copper Laminates ............................. Copper Foil/Polyester Film Laminate, Copper Foil/Polyester Film Laminate Flame Retardant Adhesive Coated Copper Foils .................... Epoxy Coated Copper Foil, Phenolic Coated Copper Foil CHR Industries ..................................... KAPTON TEMP-R-TAPE Protection Tape ............. STRIP-N-STICK Silicone Rubber Tapes ................ TEMP-R-TAPE D926 Wave Solder Protection Tape ....... TEMP-R-TAPE M797 Conformal Coating Protection Tape ......................................... TEMP-R-TAPE C-665 ............................. Custom Coating & Laminating Corp. ..................... Silicone Printed Circuit Board Masking Tapes ............ Dielectric Polymers, Inc. ............................... NELTAPE Specialty Tapes ......................... Fume Mask, Platers Tape, Printed Circuit Board Tape Finite Industries Inc. ................................. Electrical Tapes .................................. FINITE Printed Circuit Board Tapes ......................... Sheldahl .......................................... SHELDAHL FLEXCONNECT Materials Flame Retardant Adhesive on Polyester Film T-1694 ................... SHELDAHL FLEXCONNECT Materials Polyester Resin on Polyimide Film: T-320 ......................... SHELDAHL FLEXCONNECT Materials SellExtinguishing Adhesive Coated Polyester T-34.0 ......... SHELDAHL FLEXCONNECT Materials 1 Mil Adhesive x 2 Mil Polyester Film x 1 Mil Adhesive T-1502 ........... Thermosetting Structural Adhesive T-1401 .............. Tesa Tuck Inc. ...................................... Electronic Tapes ................................. Electronic Packaging (Bandoliering) Tapes ........... TESABELT Hot-Air Levelling Tape .........................

742

745

747

749 749 750 751 751 751 752 752 754 754 758 758 760 765 765 766 767 768 769 770 770 770 771

Contents and Subject Index TESAFILM Wave Solder Tape

xxv

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 771 772 773 773 773

SECTION Ix: INSULATING PRODUCTS .................... Ablestik ........................................... Hybrid Adhesive Pastes ............................ ........................... Electrically Insulative

ABLEBOND 775

Castall, Inc. ........................................ Epoxies Specially Designed for Electronic ............................ Insulating Applications

775

CASTALL, General Purpose, Military Grade, Thermally Conductive, Flame Retardant, Specialty Materials, Epoxy Hardeners Silicones Specially Designed for Electronic ............................ Insulating Applications

797

77termalIy Conductive Grease Compounds, Two Component RTV Compounds Urethanes Specially Designed for Electronic ............................ Insulating Applications John C. Dolph Co. ................................... Insulating Varnishes ............................... Baking Varnishes ..............................

808 824 824 824

HI-THERM, DOLPHON, AQUA-THERM Solventless Varnishes Air Drying Varnishes

........................... ...........................

828 828

............................ ............................ ............................ ...........................

830 830 831 831

SMVTHITE Insulating Lacquers Insulating Enamels Machinery Enamels Masking Compounds

DOLFLEX ............................. Sealing Compounds ................................. The P.D. George Co. PEDIGREE No. 1000-70 Water Borne Insulating Varnish Hexcel Chemical Products ............................. EPOLITE Brand Electrical Insulating Products ...........

...

832 833 833 834

834

Heat Cure Epoxies-One Component, Room Temperature Cure Epom-es-Two Component Thermoset Plastics, Inc. ............................... Electrical/Electronic Insulating Resins: Epoxy

...........

842 842

Oven Curing, Room Temperature Curing THERMOSET Polyurethane

Electrical/Electronic Insulating ...................................

Resins: 851

xxvi

Contents and Subject Index Room Temperature Curing THERMOSET Electrical/Electronic Insulating Resins: Silicone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 853 Room Temperature Curing

SECTION x: SILICONES ................................ Ducey Chemical, Inc. ................................. 2-Part Silicone RTVs (Room Temperature Silicone Rubbers) ...................................... GE Silicones ....................................... ................... Semiconductor Packaging Materials Junction Coatings, Gels, Adhesives, Molding Compounds Solventless Silicone Dielectric Gels: RTV 6156, RTV 6166, RTV 6186, RTV 6196 .................... General Electric Co. .................................. Condensation Cure RTV Silicone Rubber Products ........ General Purpose Products, High Temperature Products, Special Purpose Products ........... Addition Cure RTV Silicone Rubber Products General Purpose Products, Special Purpose Products ....... Silicone General Purpose and Dielectric Compounds GE Dielectric Compounds ........................................ IlWDevcon ..................... DEVCON SILITE RTV Silicone Permagile Industries Inc. .............................. INSULCAST R.T.V.S. (Room Temperature Vulcanizing Silicone) ...................................... INSULCAST R.T.V.S. (Room Temperature Vulcanizing ....................... Silicone): R.T.V.S. Catalysts ......................... SECTION XI: MISCELLANEOUS Ablestik Laboratories .................................. P3300 Series Polymer Resistor Ink .................... P3500 Series Polymer Resistor System for Keypads and Contacts ................................... P3900 Series Polymer Resistor Ink .................... P7110-XP Flexible Polymer Multilayer Dielectric .......... P7130 Polymer Multilayer Dielectric Series .............. ................... P7552 Polymer Multilayer Dielectric Aremco Products,‘Inc. ................................ ............ AREMCO High Temperature Coatings/Tape CERAMACOAT, AREMCO-COAT, CERAMXDIP, PYRO-PAIN T. PYRO-TAPE

856 857 857 858 858

867 869 869

875 878 882 882 883 883 891 892 893 893 893 894 895 895 896 897 897

Contents and Subject Index Bacon Industries Inc. ................................. Epoxy Resin Finishing Compounds .................... Dock Resins Corp. ................................... Acrylics for Electronics Industry ...................... John C. Dolph Co. ...................................

DOLPH-SPRAY Fluorocarbons)

High Technology Electronic Resins: DOLPHON CB-1078 and DOLPHON CB-1109 ................... Dynaloy, Inc. .......................................

Solvent Selection Guide: Ethylene Glycol Ether Base ...... URESOLW,

Selection Selection Selection Selection

900 900 901

901 902

Aerosol Products (Contain no

................................. Insulators, Machinery Lacquers, Anti-Corrosion

Solvent Solvent Solvent Solvent

xxvii

URZBOLVE PLUS, DYh’ASOLW Methanol Base ...............

Guide: Guide: Guide: Guide:

Methylene Chloride Base ........ Propylene Glycol Ether Base ..... Special Solvents ...............

DECAP Dynamold, Inc. ..................................... Moldable Shim Material ............................ Moldable Shim Materials MS-26 AND DMS-4-828 ........ Electra-Science Laboratories, Inc. ........................ ESL High Technology Materials Systems ............... High Reliability System ......................... Conductive, Resistive, Dielectric, Solder, Protection Consumer Products System ...................... Nitrogen Firing System ......................... High Voltage System ........................... Microwave/High Frequency System ................ Aluminum Nitride Substrate System ................ Beryllia Substrate System ........................ Polymer Thick Film Systems ..................... Porcelain Enameled Steel (PES) System ............. Surface Mounting Materials ...................... Cerdip Dotting Metallizations ..................... Solar Cell System .............................. Thick Film Cermet Cap&or System ............... Potentiometer System .......................... Thermal Printhead System ....................... Sensor Systems ............................... Capacitive Pressure Sensors ...................... ....................... Resistance Thermometers Thermistors ..................................

902

904 905 905 906

907 908 909 910 910 912 915 915 915

915 916 916 916 917 917 917 918 918 919 919 919 919 919 920 920 920 920

xxviii


Display Systems ............................... DC Gas Dischaee, AC Gas Discharge Through-Hole Printing System .................... Ceramic or PC Boards Dielectric Tape Systems ......................... Cojire, Dimensionally Stable Chip Resistor System ........................... H.B. Fuller Co. ...................................... Electrical/Electronic Products: Hot Melts .............. .............. Electrical/Electronic Products: Urethanes Loctite Corp. ....................................... Electronic Assembly Aids ........................... .................. Thermally Conductive Adhesives OUTPUT Instant Adhesives ............................... TAK PAEC, SUPERBONDER ..................... Ultraviolet Curing Adhesives IMPRW LITE-TAK ..................... Conformal Coating Products SHRDO WCVRE, NWA-SIL Adhesives for Surface Mounted Devices ............. CHIPBONDER Potting Products .............................. Sealing Products .............................. Electronic Assembly Aids: Bonding Products Technical Information .................................... Electronic Assembly Aids: Coating Products Technical Information .................................... Electronic Assembly Aids: Potting Products Technical Information .................................... ................ Sealing Products Technical Information Electronic Assembly Aids: Surface Mount Products ............................ Technical Information ..................... Solvents, Primers, and Activators LOCQUIC, DEPEND Mavidon Corp. ..................................... SG 21 Thermal Grease ............................. Q-MAX A-27 RF Lacquer .......................... Mereco Division ..................................... META-GEL 156 Epoxy Dip Compound ................ National Starch and Chemical Corp. ..................... THERMID EL-5000 Series: Spin Coatable Polyimides ..... Ancillary Products ............................. Polyimide Thinner T-310, Adhesion Promoter AP-20

921 921 922 922 923 923 926 929 929 929 929 930 931 932 933 934 935 938 939 940 942 943 947 947 947 948 948 949 949 950

Contents and Subject Index THERMID Paste EL-9410 .......................... THERMID PASTE EL-9411: For Superior Hybrid .......................... Microcircuitry Protection .................................... Pacer Technology Accelerators, Primers, Debonder and Protective Hand Cream ................................... Pierce & Stevens Industrial Group ....................... .................. Products for the Electronics Industry .............................. Emission Binder External Black Conductive Coating ................. ........................... Aluminizing Coating Frit Vehicle .................................. P&S Products Research & Chemical Corp. ..................... P/S 775 Polyurethane Primer ......................... P/S 776 Polyurethane Primer ........................ Quadrant Chemical Corp. ............................. .......... Automotive Electronics/Automotive Computers .................. High Voltage Electronic Transformer ........................... Marine Coil and Ignition Telecommunications/General Potting and Casting ......... Thermoset Plastics, Inc. ............................... Microelectronic Resin Systems: Dielectric Materials ....... Transene Co., Inc. ................................... OHMEX-AG: Thermosetting Silver for Ohmic Bonding ............................... to Semiconductors Silver Epoxy Paste: Screenable Thermosetting Silver .............................. for Ohmic Bonding Microcircuit Silvers for Conductive Bonding in ................................ Microelectronics SILVER-BOND: Low Temperature Thermosetting Silver ... Gold-Epoxy Pastes: Thermosetting Gold for Ohmic Bonding ...................................... NICKEL-BOND Low Temperature Thermosetting Nickel ... INSUL-BOND Epoxy Adhesives ...................... TRANSEPOXY Self Catalyzed Epoxy Systems ........... .......................... TRANSISTOR EPOXIES General Purpose Epoxies ........................... ................................ LED Encapsulants .... EPOTHERM Thermally Conductive Epoxy Compounds Silver Conductive Pastes for Thick Film Microelectronic Circuits ........................... Palladium-Silver Pastes Conductor for Thick Film ................................... Microcircuits

xxix 951 952 953 953 955 955 955 955 956 956 957 957 957 958 958 960 962 963 966 966 968 968 968 969 969 970 970 971 972 972 973 974 974 975 975

xxx

Contents and Subject Index Gold Alloy Cermet Compositions: Conductors for .......................... Thick Fihn Microcircuits Gold Conductive Pastes: for Thick Fihn Microelectronics ................................ Nickel Electrode Paste-Type 801: Conductive Nickel Metallization ................................... Copper Conductive Paste: for Thick Fihn Hybrid Applications ................................... Buried Electrode Inks for Multilayer Ceramic Capacitor .... Moly Metalizing Preparations: High Temperature Metallizing for Alumina ........................... Tungsten Metallizmg Preparations: for Alumina and Sapphire Substrates ........................... Beryllia and Sapphire Metallizing: for High Temperature Metallizing .......................... RTM Process: Room Temperature Metallizing for Alumina ...................................... Dielectric Crossover Pastes: for Multilayer Thick Fihn Hybrid Circuits ............................. Vitreous-Crossover Paste: for Multilayer Thick Fihn Hybrid Circuits ................................. Microcircuit Silvers ............................... FARADEX Capacitor Dielectric Pastes ................ SES-Black: Modified Silicone Elastomer for Light Absorption .................................... MBS: Moisture Barrier Silicone ...................... Silicone Semi-Gel: Transparent Dielectric Potting ........

976 976 977 977 977 978 978 979 979 980 980 981 982 983 983 984

TRANSLASTIC HYBRISIL-100: Conformal Coatings for Thin Film/ ThickFihn .................................... Solder Glass Sealant Pastes: Hermetic Sealing of Hybrid Microelectronic Packages .................... OHM-RESIST: Thick Fihn ,Resistor Compositions ........ Improved Solder Fluxes: Selective Solder Fhtxing for Electronic Applications .........................

984 985 986 987

NEUTRAFLUX Solder Creams: for Microelectronic Soldering ........... Ziegler Chemical & Mineral Corp. ....................... Specialty Asphalt Products: Electronics Industry ..........

988 989 989

IMPREG WAX, Pottkg Compounds SUPPLIERS’

ADDRESSES

TRADE NAME INDEX

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 990

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 996

Section I Adhesives General

1

2

Adhesives, Sealants and Coatingsfor the Electronics Industry

ASHLAND CHEMICAL, INC.: PLIOBOND Industrial Adhesives: Base Polymer: Nitrile Rubber Base Resin: Thermosetting Phenolic PLIOBOND 20: Total Solids, %: 20 Viscosity, cps: 600 Specific Gravity: 0.87 Pounds/Gallon: 7.2 Color: Tan Solvent: MEK Flash Point, F Seta: 20 PL IOBOND 30: Total Solids, %: 30 Viscosity, cps: 4,000 Specific Gravity: 0.89 Pounds/Gallon: 7.4 Color: Tan Solvent: MEK Flash Point, F Seta: 20 PLIOBOND 40: Total Solids, %: 40 Viscosity, cps: 30,000 Specific Gravity: 0.93 Pounds/Gallon: 7.7 Color: Tan Solvent: MEK Flash Point, F Seta: 20 PLIOBOND 1000: Total Solids, %: 20 Viscosity, cps: 600 Specific Gravity: 0.87 Pounds/Gallon: 7.2 Color: Tan Solvent: MEK Flash Point, F Seta: 20 PLIOBOND HT-30: Total Solids, %: 30 Viscosity, cps: 4,000 Specific Gravity: 0.89 Pounds/Gallon: 7.4 Color: Tan Solvents: MEK/Alcohol Flash Point, F Seta: 21

Adhesives-General

BOSTIK: Contact Adhesives: 1096: Base: Neoprene Rubber Color: Buff Viscosity: Thin Syrup Solvent: Toluol Solids: 23-25% Application Technique: Brush, Roller Shelf Life: Minimum 6 mos. @ 7OF+lO Weight/Gallon: 7.3 lbs. High green strength & heat resistance. Heat reactivatable. Bonds wide range of materials. 1142A: Base: Neoprene Rubber Color: Red Viscosity: Very Thin Syrup Solvent: Ketone & Aliphatic Hydrocarbons Solids: 23% Application Technique: Spray, Brush, Roller Shelf Life: Minimum 6 mos. 8 70FklO Weight/Gallon: 6.9 lbs. Excellent heat and water resistance. Bonds wide range of materials. Flexible application methods. Meets MMM-A-121. 1515N: Base: Compounded Neoprene Color: Neutral Viscosity: Thin Syrup Solvent: Ketone w/Aliphatic & Aromatic Hydrocarbons Solids: 18%*1 Application Technique: Brush, Roller Shelf Life: Minimum 6 mos. @ 70FklO Weight/Gallon: 6.8 lbs. Excellent general purpose adhesive. Excellent heat and humidity resistance. High initial and ultimate strength. 1530N: Base: Compounded Neoprene Color: Red Viscosity: Very Thin Syrup Solvent: Ketone w/Aliphatic & Aromatic Hydrocarbons Solids: 16%*1 Application Technique: Spray Shelf Life: Minimum 6 mos. C 70F*lO Weight/Gallon: 6.7 lbs. Excellent heat, humidity and static stress resistance. High initial strength. Long "Open Tack."

3

4


BOSTIK: Contact Adhesives(Continued): 1531: Base: Compounded Neoprene Color: Neutral Viscosity: Very Thin Syrup Solvent: Ketone w/Aliphatic & Aromatic Hydrocarbons solids: 16%+-l Application Technique: Spray Shelf Life: Minimum 6 mos. @ 70F+-10 Weiqht/Gallon: 6.7 lbs. Excellent heat, humidity and static stress resistance. High initial strength. Long "Open Tack." 1600: Base: Compounded Neoprene Color: Amber Viscosity: Thin Syrup Solvent: Chlorinated Solvents Solids: 12%+-l Application Technique: Brush, Roller Shelf Life: Minimum 6 mos. @ 70F+-10 Weight/Gallon: 10.75 lbs. Non flammable solvent. Flexible bonds. Excellent heat, humidity and solvent resistance. 8230: 8230 WH: Base: Synthetic Elastomer Color: Green White Viscosity: Very Thin Syrup Solvent: None-Water Solids: 50% Application Technique: Brush, Roller, Spray Shelf Life: Minimum 6 mos. @ 70F+-10 Weight/Gallon: 8.93 lbs. Broad bonding range. High solids. Aggressive adhesion to wide range of materials.

Adhesives-General

BOSTIK: General Purpose Adhesives: 1007: Base: Neoprene Color: Yellow-Brown Viscosity: 150-500 cps Solvent: Toluene Solids: 21% Application Technique: Brush, Roller, Spray Shelf Life: 12 mos @ 60-80F Weight/Gallon: 7.9 lbs Use as primer. Dries in 1 hour at room temperature. Improves adhesion on many surfaces. 1009A: Base: Neoprene Color: Black Viscosity: 2400 cps Solvent: Toluene Solids: 23% Application Technique: Brush, Roller, Coater Shelf Life: 6 mos @ 60-80F Weight/Gallon: 7.5 lbs. 2 part w/1008B. High performance. Repositionable up to 2 hours. 1074: Base: Neoprene Color: Buff Viscosity: Thin Syrup Solvent: Toluene Solids: 18-22% Application Technique: Brush Shelf Life: 12 mos. a 60-80F Weight/Gallon: 7.32 lbs. Excellent leather adhesive. Fast drvins. Good flexibility and resistance to heat and moisture. - 1076: Base: Neoprene Color: Tan Viscosity: 900 cps Solvent: Toluene Solids: 21% Application Technique: Brush, Roller Shelf Life: 6 mos. @ 60-80F Weight/Gallon: 7.0 lbs. High green strength. General purpose adhesion. Bonds rubber, fabrics, sponge plastics and woods.

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Adhesives, Sealants and Coatings for the Electronics Industry

BOSTIK: General Purpose Adhesives(Continued): 2009: Base: Natural Rubber Color: Tan Viscosity: 9500 cps Solvent: Naphtha Solids: 16% Aovlication Techniaue: Brush Shelf Life: 6 mos.‘@ 60-80F Weight/Gallon: 8.8 lbs. Fast, aggressive tack. Fast drying. Economical. 4041: Base: Nitrile Rubber Color: White Clear Viscosity: 1000 cps Solvent: Ketone Solids: 22% Application Technique: Roller, Coater, Brush Shelf Life: 6 mos. @ 60-80F Weight/Gallon: 7.1 lbs. Fast drying. High initial bond strength. Very flexible. 4050: Base: Nitrile Rubber Color: Straw-Clear Viscosity: 1000 cps Solvent: Ketone Solids: 22% Aoolication Techniaue: Roller, Coater Shelf Life: 12 mos: 8 60-80F Weight/Gallon: 7.2 lbs. Good plasticizer resistance. Low heat reactivation temperature. Bonds plastic films and metal foils. Meets MIL-A-43365. 4585: Base: Nitrile Rubber Color: Tan Viscosity: 9000-11,000 cps Solvent: MEK Solids: 28-30% Application Technique: Brush Shelf Life: 12 mos. 8 60-80F Weight/Gallon: 7.6 lbs. Fast drying. Fuel resistant. High temperature resistant. 8702: Base: Synthetic Resin Color: White-Clear Viscosity: 2000-2500 cps Solvent: Water Solids: 51% Application Technique: Roller, Coater, Brush Shelf Life: 6 mos. @ 60-80F Weight/Gallon: 8.4 lbs. High tack (pressure sensitive). Excellent peel strength. Non flammable.

Adhesives-General

BOSTIK: Hot Melt Adhesives: Bulk Hot Melts: 4101: Amber Form: l/4 in. Pellet Odor: None Softening Range: 233 to 262F Typical Viscosity @ 400F: 96,000 cps Temperature Resistance: -50 to 2OOF Operating Temperature: 375 to 450F Max Open Time: 7 sec. Excellent plasticizer resistance. Excellent resistance to solvents heat and oil. High performance adhesion. 4165: Cream l/4 in. Pellet Odor: None Softening Range: 304 to 320F Tvpical Viscosity @ 400F: 61,000 CPS Temperature Resistance: -50 to 250F Operating Temperature: 400 to 475F Max Open Time: 2 sec. Provides excellent bonds on vinyls and woven or non-woven fabrics. Excellent plasticizer resistance. Excellent heat resistance. 4252: Color: Light Amber Form: l/4 in. Pellet Odor: None Softening Range: 251 to 272F Typical Viscosity @ 400F: 2,200 Temperature Resistance: -20 to 250F Operating Temperature: 350 to 425F Max Open Time: 10 sec. High heat resistance. Low operating viscosity. Bonds many porous substrates. 4315: Color: Light Amber Form: 114 in. Pellet Odor: None Softening Range: 225 to 2351 Typical Viscosity @ 400F: 17,000 cps Temperature Resistance: -50 to 170F Operating Temperature: 325 to 475F Max. Open Time: 6 sec. General purpose adhesive. Bonds many packaging and porous materials. FDA food packaging approved.

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BOSTIK: Hot Melt Adhesives: Bulk Hot Melts(Continued): 4342: Color: Amber Form: l/4 in. Pellet Odor: None Softening Range: 230 to 240F Typical Viscosity 8 400F: 30,000 cps Temperature Resistance: -20 to 165F Operating Temperature: 375 to 425F Max Open Time: 5 set Good adhesion to high pressure laminates. Excellent edge banding adhesive. Bonds wood and particle-board. 7102: Light Tan Form: Granular Odor: None Softening Range: 200 to 225F Typical Viscosity @ 400F: 50,000 cps Temperature Resistance: -50 to 165F Operating Temperature: 350 to 450F Max Open Time: 7 sec. Good plasticizer resistance. Bonds plastics, wood and paper. Particularly suited for vinyl. 7116: Light Tan Form: Granular Odor: None Softening Range: 259 to 277F Typical Viscosity @ 400F: 20,000 cps Temperature Resistance: -20 to 250F Operating Temperature: 375 to 450F Max Open Time: 3 sec. High performance. Bonds fabrics, PVC, films and foils. Excellent for vinyl edge folding. 7210: Light Amber Form: Granular Odor: None Softening Range: 225 to 250F Typical Viscosity @ 400F: 2,500 cps Temperature Resistance: -20 to 180F Operating Temperature: 350 to 400F Max. Open Time: 15 sec. Low operating viscosity. Good heat and chemical resistance. Bonds a broad range of materials.

Adhesives-General

BOSTIK: Hot Melt Adhesives: Bulk Hot Melts(Continued): 7213: Amber Form: Granular Odor: None Softening Range: 340 to 347F Typical Viscosity @ 400F: 5,000 cps Temperature Resistance: -40 to 270F Operating Temperature: 400 to 450F Max. Open Time: 3 sec. Excellent temperature resistance. Designed for electrical potting applications. Low viscosity. 7228: Amber Form: Granular Odor: None Softening Range: 355 to 365F Typical Viscosity @ 400F: 10,000 cps Temperature Resistance: -20 to 300F Operating Temperature: 400 to 450F Max Open Time: 2 sec. Exceptional heat resistance. Bonds non-wovens and filter material. Low viscosity. 8363: Off White Form: Pellets Odor: Slight Softening Range: 167 to 197F Typical Viscosity @ 400F: 10,000 cps Temperature Resistance: -20 to 125F Operating Temperature: 325 to 400F Max Open Time: 40 sec. General purpose adhesive. Bonds a broad range of materials. Designed for use in BOSTIK BOSS. 8384: Translucent Form: Pellets Odor: Slight Softening Range: 165 to 200F Typical Viscosity @ 400F: 9,500 cps Temperature Resistance: -20 to 125F Operating Temperature: 325 to 400F Max Open Time: 40 sec. Bonds wide range of materials. Economical. Designed for use in BOSTIK BOSS.

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BOSTIK: Hot Melt Adhesives: Bulk Hot Melts(Continued): 8386: Light Amber Form: Slats Odor: Slisht Softening-Range: 179 to 184F Typical Viscosity @ 350F: 1,000 cps Temperature Resistance: -20 to 15iF Operating Temperature: 320 to 360F Max Open Time: 15 sec. High performance packaging. Bonds coated and wax substrates. Good adhesion at low temperature. 8387: Light Yellow Form: Slats Odor: Slisht Softening-Range: 199 to 207F Typical Viscosity @ 350F: 1,800 cps Temperature Resistance: -20 to 16iF Operating Temperature: 320 to 360F Max Open Time: 5 sec. General purpose packaging. Economical. Use for case and carton sealing. Rope Form Hot Melts: 1101: Amber

Form: l/4 in. Profile Odor: None Softening Range: 233 to 262F Typical Viscosity @ 400F: 96,000 cps Temperature Resistance: -50 to 200F Operating Temperature: 375 to 450F Max Open Time: 7 sec. High performance adhesion. Excellent plasticizer resistance. Excellent resistance to solvents heat and cold. 1165: Cream Form: l/4 in. Profile Odor: None Softening Range: 304 to 320F Typical Viscosity @ 400F: 61,000 cps Temperature Resistance: -50 to 250F Operating Temperature: 400 to 475F Max Open Time: 2 sec. Exceptional plasticizer resistance. Excellent heat resistance. Provides excellent bond on vinyls and woven or non-woven fabrics.

Adhesives-General

BOSTIK: Hot Melt Adhesives: Rope Form Hot Melts: 1252: Light Amber Form: l/4 in. Profile Odor: None Softening Range: 251-272F Typical Viscosity @ 400F: 2,200 cps Temperature Resistance: -20 to 250F Operating Temperature: 350 to 425F Max Open Time: 10 sec. High heat resistance. Low operating viscosity. Bonds many porous substrates. 1315: Light Amber Form: l/4 in. Profile Odor: None Softeninq Ranqe: 225 to 235F Typical Viscosity 8 400F: 17,000 cps Temperature Resistance: -50 to 170F Operating Temperature: 325 to 475F Max Open Time: 6 sec. General purpose adhesion. Bonds many packaging materials. Meets FDA regulations for food packaging 21 CFR 375-105. 1323: Off White Form: l/4 in. Profile Odor: None Softeninq Ranqe: 225 to 240F Typical Viscosity 8 400 F: 32,000 cps Temperature Resistance: -50 to 170F Operating Temperature: 400 to 450F Max Open Time: 3 sec. Good heat and cold resistance. General packaging and paper bonding. 1372: Light Amber Form: l/4 in. Profile Odor: None Softening Range: 186 to 192F Typical Viscosity 8 400F: 2,000 cps Temperature Resistance: -20 to 160F Operating Temperature: 325 to 375F Max Onen Time: 5 sec. Designed for carton closing applications. Meets FDA regulations for food packaging 21 CFR 375-105. Good heat and cold resistance.

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BOSTIK: Hot Melt Adhesives & Applicators: Glue Guns: BOSTIK's TG-3 and TG-4 glue guns offer the industrial user ease and reliability in packaging, product assembly, potting, electronic and other industrial applications. The TG-4 is a rugged industrial glue gun that delivers more than 4 oounds of adhesive an hour. It offers electric solid state design, and five interchangeable nozzles. Designed for smaller jobs, the TG-3 delivers 1.4 pounds of adhesive an hour. Both are light weight for easy one-hand operation. Hot Melt Glue Cartridges--l" diameter: 2240 Amber: Typical Viscosity @ 375F/@ 450F: 1600 to 6750 cps Maximum Open Time: 30 sec. Temperature Resistance: OF to 300F High heat resistance. Good flow properties. Good electrical properties. 2370 Clear: Typical Viscosity @ 375F/@ 450F: 9000 to 1850 cps Maximum Open Time: 30 sec. Temperature Resistance: -4OF to 160F High performance. Good shock resistance. Good all-purpose adhesion in a clear product. 2385 Amber: Typical Viscosity @ 375F/@ 450F: 5400 to 2800 cps Maximum Open Time: 50 sec. Temperature Resistance: -2OF to 150F General purpose bonding of paper, wood, cardboard, foam and fabrics. 2391 Tan: Typical Viscosity @ 375F/@ 450F: 1450 to 525 cps Maximum Open Time: 40 sec. Temperature Resistance: -2OF to 160F Verastile packeging product. Good "hot tack." FDA listed 21 CFR 175-105.

Adhesives-General

BOSTIK: Hot Melt Adhesives & Applicators(Continued): Hot Melt Glue Sticks--&" diameter: 6160 White: Form: 4 in. Typical @ 400F: 25,000 cps Maximum Open Time: 30 sec. Temperature Resistance: -2OF to 175F Excellent plasticizer resistance. God vinyl adhesion. Very flexible bond. Amber: Form: 12 in. Typical @ 400F: 6,500 cps Maximum Open Time: 30 sec. Temperature Resistance: -OF to 300F High heat resistance. Good flow properties. Good electrical properties. 6240

Straw: Form: 4 in.115 in. Typical @ 400F: 6,000 cps Maximum Open Time: 50 sec. Temperature Resistance: -2OF to 140F Long open time. Good adhesion to metal and plastics. High performance. 6323

Clear: Form: 4 in. Typical @ 400F: 12,000 cps Maximum Open Time: 60 sec. Temperature Resistance: -4OF to 140F High performance, versatile adhesion. Good bonds on metals and polyolefins. Very flexible, long open time. 6330

Off White: Form: 4in.115 in. Typical @ 400F: 10,000 cps Maximum Open Time: 40 sec. Temperature Resistance: -2OF to 125F Good general purpose characteristics. materials. FDA listed 21 CFR 175-105. 6363

Bonds a broad range of

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BOSTIK: Hot Melt Adhesives & Applicators(Continued): Hot Melt Glue Sticks--&" diameter: 6368 Light Amber: Form: 4 in.115 in. Typical @ 400F: 17,000 cps Maximum Open Time: 6 sec. Temperature Resistance: -5OF to 170F Designed for packaging. Good temperature resistance. Fast setting. 6370 Clear: Form: 4 in. 10 in. 15 in. Typical @ 400F: 6,000 cps Maximum Open Time: 60 sec. Temperature Resistance: -4OF to 140F Very flexible. Bonds wide range of floral, craft, and upholstery materials. Economical. 6377 White: Form: 4 in. Typical @ 400F: 5,750 cps Maximum Open Time: 60 sec. Temperature Resistance: -4OF to 140F Adhesive caulk sealer. Flexible with long open time. Bonds broad range of materials. 6384N Translucent: Form: 4 in./15 in. Typical @ 400F: 8,500 cps Maximum Open Time: 40 sec. Temperature Resistance: -2OF to 125F General purpose characteristics. Bonds plastics, wood, porous materials. Economical. 6390 Light Straw: Form: 4 in.110 in.115 in. Typical @ 400F: 9,000 cps Maximum Open Time: 40 sec. Temperature Resistance: -4OF to 160F Good heat resistance. Bonds plastics, wood, porous materia .s. Economical, general-purpose adhesion.

Adhesives-General

CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications: CASTALL E-100: CASTALL E-100 is an unmodified epoxy resin which has high strength and is transparent material that adheres well to metals, ceramics, plastics, glass and acrylics. CASTALL E-110 A&B: CASTALL E-110 A&B is an excellent epoxy for use as a high temperature staking compound bonding to glass, plastic, stainless steel and titanium. CASTALL E-310 A&B: CASTALL E-310 A&B is an excellent thermally conductive epoxy adhesive for bonding metals, plastics, glass, masonry and wood. CASTALL E-341: CASTALL E-341 is an excellent thermally conductive epoxy adhesive for thin glue line applications to most substrates. CASTALL E-403 and CASTALL E-409: CASTALL E-403 and E-409 are excellent general purpose epoxy adhesives with good adhesion to metals, ceramics and plastics. CASTALL E-500 and E-505: CASTALL E-500 is a filled epoxy where high peel, shock and vibration resistance are needed. By varying the amount of hardener RT-10 used, you can vary the rigidity, peel strength, heat resistance, and thermal shock resistance. E-505 is an unfilled version of E-500. CASTALL E-523 A&B and E-523LV: CASTALL E-523 A&B is a filled two component, room temperature curing structural epoxy adhesive and E-523LV is a low viscosity version of E-523. Exhibiting exceptional adhesion to many substrates. CASTALL E-1520: CASTALL E-1520 is a thixotropic epoxy paste that is thermally conductive with good adhesion to a variety of substrates. Its prime use is to form bonds between fabricated heat sinks and power devices.

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CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): CASTALL QUICK CURE: CASTALL's QUICK CURE is a general epoxy adhesive where a very fast cure of approximately five minutes is required. CASTALL U-2630 R&I Series: CASTALL U-2630, U-2633 and U-2634 are a series of two part, solvent free urethane laminating adhesives and coatings. The laminating adhesives are used in plastic laminating. The coatings are used on plastics, fabrics, etc. CASTALL U-2710 and U-2720: CASTALL U-2710 and U-2720 are one-part, solvent based urethane adhesives. They provide excellent adhesion in bonding composition stocks to a variety of materials. Reactivation temperaatures as low as 130F consistently provide high quality bonds. U-2720 is an excellent general adhesive for difficult to bona substrates, such as PVC, rubber, nylon, polycarbonate, ABS, etc. CASTALL U-2730: CASTALL U-2730 is a one-part laminating adhesive with high initial green strength. Used to bona fabric to neoprene sponge, PVC to urethane, etc. E-100: Color: Amber Mix Ratio Resin/Hardener (ubw): 100/14 Specific Gravity @ 25C: 1;:s Viscosity @ 25C, cps: 12000 Shore Ha&ness: D89 Pot Life 50 gm @ 25C hrs.: 3/4 Cure Time Hrs. @ 25C, 65C, IOOC: 12-24/2/---Tensile Strength @ 25C, psi: 11000 Lap Shear Al/Al: 1700 Compressive Strength @ 25C, psi: 18000 Linear Shrinkage in/in: 0.010 Thermal Conductivity: 5.1 (1.5) Dielectric Constant @ 25C/lOOkc: 4.2 Dielectric Strength volts/mil: 450 Dissipation Factor @ 25C/lOOkc: 0.035 Volume Resistivity @ 25C/ohm-cm: 10 15

Adhesives-General

CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): E-110 A&B: Color: Amber Mix Ratio Resin/Hardener (pbw): 100/3.5 Specific Gravity @ 25C: 1.16 Viscositv B 25C. ens: Paste Shore Hardness:.D88 Pot Life 50gm @ 25C hrs.: 12 Cure Time Hrs. @ 25C, 65C, IOOC: ----/----12 Tensile Strength @ 25C, psi: 12800 Lap Shear Al/Al: 1200 Compressive Strength @ 25C, psi: 19300 Linear Shrinkage in/in: 0.010 Thermal Conductivity: 5.1 (1.5) Dielectric Constant @ 25C/lOOkc: 4.2 Dielectric Strensth volts/mil: 450 Dissipation Factor @ 25C/lOOkc: 0.035 Volume Resistivity @ ZSC/ohm-cm: 10 15 E-310 A&B: Color: Black Mix Ratio Resin/Hardener (pbw): lOO/lOO Specific Gravity 8 25C: 1.60 Viscositv a 25C. cos: Paste Shore Hardness:'D75 Pot Life 50gm @ 25C hrs.: 2 Cure Time Hrs. B 25C. 65C. 1OOC: 16/l/---Tensile Strength @ 25C, psi: 8300 Lap Shear Al/Al: 2200 Compressive Strength @ 25C, psi: 7400 Linear Shrinkage in/in: 0.004 Thermal Conductivity: 37 (10.7) Dielectric Constant @ 25C/lOOkc: 4.7 Dielectric Strencth volts/mil: 450 Dissipation Factor @ 25C/iOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: 10 13 E-341: Color: Black Mix Ratio Resin/Hardener (pbw): 100/5.5 Snecific Gravitv @ 25C: 1.90 Viscosity @ 25C; cps: 13000 Shore Hardness: D88 Pot Life 50gm @ 25C hrs.: 2 Cure Time Hrs. 8 25C, 65C, IOOC: l2-24/2/---Tensile Strength @ 25C, psi: 8340 Lap Shear Al/Al: 2100 Comoressive Strencth @ 25C. osi: 24500 Linear Shrinkage in/in: 0.803 Thermal Conductivity: 26 (7.7) Dielectric Constant-s 25C/lOOkc: 5.7 Dielectric Strength volts/mil: 500 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: 10 16

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CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): E-403: Color: Black Mix Ratio Resin/Hardener (pbw): 100/7.0 Specific Gravity @ 25C: 1.55 Viscosity @ 25C; cps: 6000 Shore Hardness: D85 Pot Life 50gm @ 25C hrs.: l-2 Cure Time Hrs. @ 25C. 65C, IOOC: 12-24/2/---Tensile Strength @ 25C, p&i: 7200 Lap Shear Al/Al: 2100 Compressive Strength @ 25C, psi: 16400 Linear Shrinkaue in/in: 0.004 Thermal Conductivity: 7.8 (2.3) Dielectric Constant @ 25C/lOOkc: 4.0 Dielectric Strength volts/mil: 450 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: IO 16 E-4092

Color: Grey Mix Ratio Resin/Hardener (pbw): 100/6.0 Specific Gravity @ 25C: 1.75 Viscositv a 25C. CDS: 50000 Shore Hardness:.D9i Pot Life 50gm @ 25C hrs.: 1 Cure Time Hrs. @ 25C. 65C. IOOC: 12-24/2/---Tensile Strength @ 25C, psi: 8430 Lap Shear Al/Al: 1500 Comeressive Strensth @ 25C. nsi: 28400 Linear Shrinkage in/in: O.bO2 Thermal Conductivity: 8.5 (2.5) Dielectric Constant-@ 25C/lOOkc: 3.8 Dielectric Strength volts/mil: 425 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: IO 15 E-500/RT-10: Coior: Black Mix Ratio Resin/Hardener (pbw): lOO/lOO Specific Gravity @ 25C: 1.35 Viscosity @ 25C, cps: 175000 Shore Hardness: D63 Pot Life 50gm @ 25C hrs.: l-3 Cure Time Hrs. @ 25C, 65C, IOOC: 12-24/2/---Tensile Strength @ 25C, psi: 8000 Lap Shear Al/Al: 3100 Compressive Strength @ 25C, psi: 12000 Linear Shrinkage in/in: 0.002 Thermal Conductivity: 8.0 (2.3) Dielectric Constant (a 25C/lOOkc: 4.1 Dielectric Strength volts)mil: 450 Dissipation Factor @ 25C/lOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: IO 13

Adhesives-General

CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): E-505/RT-10: Color: Amber Mix Ratio Resin/Hardener (pbw): lOO/lOO Specific Gravity @ 25C: 1.05 Viscosity @ 25C; cps: 12000 Shore Hardness: D85 Pot Life 50gm @ 25C hrs.: l-3 Cure Time Hrs. @ 25C, 65C, 1OOC: 12-48/2/---Tensile Strength @ 25C, psi: 9000 Lap Shear Al/Al: 2400 Compressive Strength @ 25C, psi: 11000 Linear Shrinkaae in/in: 0.002 Thermal Conductivity: 5.1 (1.5) Dielectric Constant @ 25C/lOOkc: 3.2 Dielectric Strenath volts/mil: 450 Dissipation Factor @ 25C/iOOkc: 0.015 Volume Resistivity @ 25C/ohm-cm: 10 12 E-523 A&B: Color: Grey Mix Ratio Resin/Hardener (pbw): 150/100 Specific Gravity @ 25C: 1.24 Viscositv a 25C. CDS: 19000 Shore Hardness:'D75 Pot Life 50 gm @ 25C hrs.: l-2 Cure Time Hrs. @ 25C, 65C, 1OOC: 48/2-4/l-3 Tensile Strength @ 25C, psi: 8500 Lap Shear Al/Al: 1700 Comnressive Strenath @ 25C. usi: 17000 Linear Shrinkage in/in: O.oOi Thermal Conductivity: 5.1 (1.5) Dielectric Constant@ 25C/lOOkc: 3.5 Dielectric Strength volts/mil: 400 Dissipation Factor @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 12 E-523LV A&B: Color: Grey Mix Ratio Resin/Hardener (pbw): 150/100 Specific Gravity @ 25C: 1.22 Viscosity @ 25C, cps: 10000 Shore Hardness: D75 Pot Life 50gm @ 25C hrs.: l-2 Cure Time Hrs. @ 25C, 65C, IOOC: 12-24/2/---Tensile Strength @ 25C, psi: 8500 Lap Shear Al/Al: 1700 Compressive Strength @ 25C, psi: 17000 Linear Shrinkage in/in: 0.001 Thermal Conductivity: 5.1 (1.5) Dielectric Constant a 25C/lOOkc: 3.5 Dielectric Strength voltsjmil: 400 Dissipation Factor @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 12

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CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): E-1520: Color: Black Mix Ratio Resin/Hardener (pbw): 100/3.4 Specific Gravity @ 25C: 2.35 Viscositv B 25C. cos: Paste Shore Hardness:.D93 Pot Life 50gm @ 25C hrs.: l-2 Cure Time Hrs. @ 25C, 65C, 1OOC: 12-24/2/---Tensile Strength @ 25C, psi: 10500 Lap Shear Al/Al: 2200 Compressive Strength @ 25C, psi: 29400 Linear Shrinkage in/in: 0.002 Thermal Conductivity: 33 (9.7) Dielectric Constant 8 25C/lOOkc: 6.1 Dielectric Strenath volts/mil: 500 Dissipation Factor @ 25C/jOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: 10 16 QUICK CURE: Color: Yellow Mix Ratio Resin/Hardener (pbw): lOO/lOO Specific Gravity @ 25C: 1.18 Viscositv a 25C. CDS: 17000 Shore Ha;dness:.DB?l Pot Life 50qm @ 25C hrs.: .05 Cure Time Hrs. a 25C. 65C. 1OOC: 2-4/----/---Tensile Strength @ 25C, psi: 3800 Lap Shear Al/Al: 900 Comnressive Strenath @ 25C. osi: 7000 Linear Shrinkage in/in: 0.606 Thermal Conductivity: 5.0 (1.5) Dielectric Constant @ 25C/lOOkc: 4.3 Dielectric Strength volts/mil: 350 Dissipation Factor 8 25C/lOOkc: 0.020 Volume Resistivity @ 25C/ohm-cm: 10 10 U-2360 R&I: Color: Tan Mix Ratio Resin/Hardener (pbw): 57/10 Soecific Gravitv @ 25C: 1.20 Viscosity @ 25C; cps: 13500 Shore Hardness: A55 Pot Life 5Ogm 8 25C hrs.: l/3 Cure Time Hrs. 8 25C, 65C, 1OOC: 4/l/---Tensile Strength 8 25C, psi: 2060 Lap Shear Al/Al: P17 Compressive Strength @ 25C, psi: N/A Linear Shrinkage in/in: 0.013 Thermal Conductivity: 1.8 (7.5) Dielectric Constant a 25C/lOOkc: 3.6 Dielectric Strength voltsjmil: 420 Dissipation Factor @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 12

Adhesives-General

CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): U-2633 R&I: Color: Tan Mix Ratio Resin/Hardener (pbw): 14/10 Specific Gravity @ 25C: 1.20 Viscosity @ 25C: cps: 12000 Shore Hardness: A80 Pot Life 50gm @ 25C hrs.: l/4 Cure Time Hrs. @ 25C. 65C. 1OOC: 4/1/---Tensile Strenath @ 25C. &i: 2170 Lap Shear Al/Al: 615 ’ _ Compressive Strength @ 2X, psi: N/A Linear Shrinkage in/in: 0.011 Thermal Conductivity: 1.8 (7.5) Dielectric Constant @ 25C/lOOkc: 4.1 Dielectric Strength volts/mil: 425 Dissipation Factor @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 13 U-2634 R&I: Color: Tan Mix Ratio Resin/Hardener (pbw): 23/10 Specific Gravity @ 25C: 1.16 Viscosity @ 25C; cps: 12000 Shore Hardness: A85 Pot Life 5Ogm @ 25C hrs.: l/4 Cure Time Hrs. @ 25C, 65C, IOOC: 2/0.5/Tensile Strength @ 25C, psi: 6100 Lap Shear Al/Al: PI5 Compressive Strength @ 25C, psi: N/A Linear Shrinkage in/in: 0.013 Thermal Conductivity: 1.8 (7.5) Dielectric Constant @ 25C/lOOkc: 4.2 Dielectric Strenath volts/mil: 420 Dissipation Factror @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 13 U-2710: Color: Clear Mix Ratio: One part Specific Gravity @ 25C: 0.89 Viscositv B 25C; CDS: 3500 Shore Ha;&ess:.A8$ Pot Life 5Ogm @ 25C hrs.: N/A Cure Time H;s. @ 25C, 65C, 1OOC: 5 min. Tensile Strength @ 25C, psi: 5000 Lap Shear Al/Al: P15 Compressive Strength @ 25C, psi: N/A Linear Shrinkage in/in: N/A Thermal Conductivity: 1.7 (7.4) Dielectric Constant @ 25C/lOOkc: 5.5 Dielectric Strength volts/mil: 390 Dissipation Factor @ 25C/lOOkc: 0.04 Volume Resistivity @ 25C/ohm-cm: 10 13

21

22


CASTALL, INC.: Adhesives Specially Designed for Electronic or General Applications (Continued): U-2720: Color: Clear Mix Ratio Resin/Hardener (pbw): One-part Specific Gravity @ 25C: 0.90 Viscosity @ 25C; cps: 2500 Shore Hardness: A85 Pot Life 50gm @ 25C hrs.: N/A Cure Time Hrs. @ 25C, 65C, 1OOC: 8 min. Tensile Strength @ 25C, psi: 5200 Lap Shear Al/Al: P18 Compressive Strength @ 25C, psi: N/A Linear Shrinkaae in/in: N/A Thermal Conductivity: 1.7.(7.4) Dielectric Constant @ 25C/lOOkc: 5.5 Dielectric Strength volts/mil: 390 Dissipation Factor @ 25C/lOOkc: 0.04 Volume Resistivity @ 25C/ohm-cm: 10 13 U-2730: Color: Amber Mix Ratio Resin/Hardener (pbw): One-part Specific Gravity @ 25C: 0.94 Viscosity @ 25C, cps: 8000 Shore Hardness: A80 Pot Life 50gm @ 25C hrs.: N/A Cure Time Hrs. @ 25C, 65C, 1OOC: 5 min. Tensile Strength @ 25C, psi: 5000 Lap Shear Al/Al: P12 Compressive Strength @ 25C, psi: N/A Linear Shrinkage in/in: N/A Thermal Conductivitv: 1.7 (7.4) Dielectric Constant-@ 25C/iOOkc: 5.5 Dielectric Strength volts/mil: 425 Dissipation Factor @ 25C/lOOkc: 0.03 Volume Resistivity @ 25C/ohm-cm: 10 13

Adhesives-General

CASTALL, INC.: CASTALL LClOOO Light Cure Series: * Low medium and high viscosity one-part clear Shore D 85 compounds * Cure in seconds * Excellent electrical insulators Part of a series of visible light curing single part sealants, conformal coatings, wire tacking agents, and potting compounds. Typical Properties: Uncured: LClOOl: Viscosity - cps: 1000 Color: transparent Specific Gravity: 1.15 Lc1003: Viscosity - cps: 3000 Color: transparent Specific Gravity: 1.15 Lclolo: Viscosity - cps: 10,000 Color: transparent Specific Gravity: 1.15 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/0" thickness: lo-25 sec. Physical Properties: Shore D Hardness: 85 Dielectric Strength - v/mil: 790 Volume Resistivity -25C-ohm/cm: 10 13 Temperature Range: -60C to 125C t-761" to 257F)

23

24

Adhesives, Sealants and Coatings for the Electronics Zndzuty

CASTALL, INC.: CASTALL LC2000-T Light Cure Series: * High viscosity thixotropic one-part clear Shore D85 compounds * Cure in seconds * Excellent electrical insulators * Viscosities vary from pourable to non-sag A series of thixotropic visible light curing single part sealants, conformal coatings, wire tacking agents, and potting compounds. Typical Properties: Uncured: LC2009-T: Viscosity - cps @ 25C: 9300 Color: Amber Specific Gravity: 1.15 Thixotropic Index Range to LC2100-T: Viscosity - cps @ 25C: 100,000 Specific Gravity: 1.18 Thixotropic Index Range: 4.9 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/8" thickness: IO-25 sec. Physical Properties: Shore D Hardness: 85 Dielectric Strength - v/mil: 790 Volume Resistivity - 25C -ohm/cm: 10 13 Use Temperature Range: -60 to 125C (-76 to 257F)

Adhesives-General

CASTALL,

INC.:

CASTALL

LC3000

25

Light Cure Series:

* Soft to hard one-part clear elastomer and adhesive compounds * Cure in seconds * Excellent adhesion and low shrinkage Part of a series of visible light curing single part sealants, gasketing conformal coatings, wire tacking agents, and potting compounds. Products with the suffix "H" are dual cure - visible light or heat - 15 minutes at 225F. Typical Properties: Uncured: Lc3010: Viscosity - cps @ 25C: 64,000 Color: amber Specific Gravity: 1.08 Lc3040: viscosity - cps @ 25C: 47,000 Color: amber Specific Gravity: 1.08 LC3060: Viscosity - cps @ 25C: 9,000 Color: amber Specific Gravity: 1.12 LC3065: Viscosity - cps @ 25C: 600 Color: amber Specific Gravity: 1.10 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/8" thickness: IO-25 sec. Physical Properties: LC3010: Shore A Hardness: 30 Linear Shrinkage %: 0.2 Lc3040: Shore A Hardness: 50 Dielectric Strength - v/mil: 650 Volume Resistivity - 25C - ohm/cm: 10 i3 Use Temperature Range: -60 to 125C (-76F to 257F) Linear Shrinkage %: 0.9 LC3060: Shore A Hardness: 90 Linear Shrinkage %: 0.04 LC3065: Shore A Hardness: 90 Linear Shrinkage %: 0.04

26


CASTALL, INC.: CASTALL ~~3000 Light Cure Series (Continued): Typical Properties: Uncured: LC-3068: Viscosity - cps @ 25C: 300 Color: amber Specific Gravity: 1.08 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/8" thickness: IO-25 sec. Phvsical Prooerties: *Shore A Hardness: 95 Dielectric Strength - v/mil: 650 Volume Resistivitv - 25C -ohm/cm: 10 13 Use Temperature Range: -60C to 125C (-76F to 257F) Linear Shrinkage %: .034 LC-3072: Uncured: Viscosity - cos @ 25C: 150 Color: amber Specific Gravity: 1.05 Physical Properties: Shore A Hardness: 98 Linear Shrinkage %: .055

Adhesives-General

CASTALL, INC.: CASTALL LC-3080 Light Cure Series: * Hard one-part clear elastomer and adhesive. * Cures in seconds. * Excellent adhesion and low shrinkage. Part of a series of visible light curing single part sealants, gasketing conformal coatings, wire tacking agents, and potting compounds. Products with the suffix "H" are dual cure - visible light or heat - 15 minutes at 225F. Typical Properties: Cured: LC3080: Viscosity - cps @ 25c: 47,000 Color: amber Specific Gravity: 1.08 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/8" thickness: IO-25 sec. Physical Properties: Shore A Hardness: 50 Dielectric Strength - v/mil: 650 Volume Resistivity - 25C - ohm/cm: 10 13 Use Temperature Range: -60C to 125C (-76F to 257F) Linear Shrinkage %: 0.9 Typical Properties: Uncured: LC-3068: Viscosity - cps @ 25C: 300 Color: amber Specific Gravity: 1.08 Curing (with 400-450 nm light): Cure Time, l/16" thickness: 3-10 sec. Cure Time, l/8" thickness: IO-25 sec. Physical Properties: Shore A Hardness: 95 Dielectric Strength - v/mil: 650 Volume Resistivity - 25C - ohm/cm: 10 13 Use Temperature Range: -60C to 125C (-76F to 257F) Linear Shrinkage %: 0.34 LC-3072: Viscosity - cps @ 25C: 150 Color: amber Specific Gravity: 1.05 Physical Properties: Shore A Hardness: 98 Linear Shrinkage %: 0.55

27

28


DYMAX CORP: DYMAX Engineering Adhesives: Product 400 Gel: LIGHT-WELD W Curing Adhesives for Use with Clear Plastic: LIGHT-WELD product 488 Gel is a structural adhesive designed for high speed assembly of transparent film and sheet materials where structural strength is required. This product cures when exposed to UV light, in the 300-400 nanometer range. LIGHT-WELD 488 Gel is designed as a general purpose, laminating adhesive and for bonding, potting and tacking to difficult to bond plastics. Product 488 Gel is extremely flexible with a high degree of moisture resistance. It bonds to surfaces such as DAP, Noryl, glass, epoxy board, metal and Mylar. Uncured Properties: Composition: Urethane oligomer/(Meth)acrylate monomer blends Viscosity: 24000-29000 cps Color: Hazy Flash Point: >200F (93.3C) Solubility: Isopropyl alcohol, chlorinated solvents Toxicity: Low Cured Properties: Max Cured Film Thickness: l/4" Shore D Hardness: 25 Tensile (cured film at break): 500 psi Elongation: 300 Shrinkage on Cure: 5.8% Water Absorption: .l% Cure Data: Time to Full Cure: Bonding: (4 set Tacking: (60 set Potting: (60 set Coating: (10 set Lamp Intensity: Bonding: 20-45 milliwatts/cm 2 Tackins: 130-170 milliwatts/cm 2 Potting: 20-45 milliwatts/cm 2 Coating: 120-150 milliwatts/cm 2 Factors Affecting Curing: Dark surfaces lengthen cure time. Full range (UV-A, B & C) lamps provide faster cures than filtered sources. All UV sources degrade with use. Check output with a radiometer. Thicker films require longer cures. Light intensity decreases as distance from UV source increases. Some clear plastics may contain UV inhibitors.

Adhesives4eneral

DYMAX CORP.: DYMAX Engineering Adhesives: Products 911 and 912: MULTI-CURE Adhesives and LIGHT-WELD: The 900 Series UV curing adhesives have been formulated to cure rapidly under longwave (UV-A, 320 to 380 nanometers) UV light at intensities under 20 milliwatts/cm 2. Specifically, these products have been designed for wire tacking on printed circuit boards. Materials can also be used for a wide variety of strain relief and wire unit applications. These products withstand thermal shock from solder while resisting brief solvent and aqueous washes. MULTI-CURE 911: MULTI-CURE 911 is specifically designed to provide rapid, structural wire tacking of PCBs. Product 911 is a non-migrating gel. Cure occurs with W light or in combination with heat. MULTI-CURE 911 has excellent adhesion to a wide variety of surfaces. LIGHT-WELD 912: LIGHT-WELD 912 has been formulated to cure rapidly under long wave UV light. Product 912 is designed for wire-tacks on PCBS and withstands thermal shock from solder while resisting most solvent and aqueous washes. Uncured Properties: 911 and 912: Composition: Urethane oligomer/(Meth)acrylate monomer blends Viscosity Standard: Won-flowing thixotropic paste Color: Light straw Flash Point: >200F (93.3C) Solubility: Isopropyl alcohol, chlorinated solvents Toxicity: Low Cured Properties: 911: Max Cured Film Thickness: l/0" Thermal Range: -40/300F Shore D Hardness: 65-70 Dielectric Strength kv/mm: 800 Surface Resistivity (IO 13 Ohm): .301 Linear Coefficient of Expansion (mm/mm/CxlO -4): 1.41 Resistance to Freon TMS: (% strength retention): 100% 912: Max Cured Film Thickness: >1/8" Thermal Range: -65/350F Shore D Hardness: 80 Tensile Strength: glass to steel: 2,500 psi Dielectric Strength kv/mm: ,500 Surface Resistivity (IO 13 Ohm): .077 Linear Coefficient of Expansion (mm/mm/CxlO -4): 1.53 Resistance to Freon TMS: (% strength retention): 75%

29

30

Adhesives, Sealants and Coatings for the Electronics Zndusfry

DYMAX

CORP.:

DYMAX

MULTI-CURE

Surface Mount Adhesive 995:

MULTI-CURE 995 is a single component, solvent-free, electrical grade, urethane acrylic adhesive that has insulating characteristics. Because DYMAX adhesives are resilient, there is no need to carefullv match thermal expansion coefficients with the SMD and the circuit board materials. MULTI-CURE 995 is a non-stringing thixotropic paste with a high thixotropic ratio for easy dispensing in narrow peaks using needle-tip applicators, screening or pin transfers. There is no outflow at elevated temperatures. The SMD can be easily removed without damaging PWAs. (Use of standard hot air SMD board repair machines at 425F for several seconds and removing with tweezers is a typical procedure.) MULTI-CURE 995 can be cured several different ways: 1. Heat only 2. W light only 3. UV light followed by heat 4. Simultaneous UV light and heat Physical Properties: Resin type: Modified Urethane Consistency: Thixotropic paste Color: Red Viscosity: 65,000-85,000 cps Curing Options: Heat cure (following pre-heat cycle): 12oc: I20

Adhesives-General

FURANE PRODUCTS: Electronic Grade Adhesives (Continued): Surface Mounting

(Continued):

EPIBOND 7251-200 Blue: Color/Filler Type: blue Application Method: syringe dispense/screen print Specific Gravity (system): 2.1 System Viscositv (x 1000 CDS): 200 Pot Life at 25C-(hours): ,300 Gel Time (minutes/C): 3/150 Cure Schedule (minutes/C): 60/125 or 4/215 Lap Shear Strength at 25C (Al/Al) (psi): 2500 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivitv: 18x10 -4 Tg (C): 84 CTE (in/in/C): Alpha 1: 35x10 -6 Alnha 2: 140x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 15 Shelf Life (months/C): 6/O Flash Point (C): >I20 EPIBOND 7261: Color/Filler Type: yellow Application Method: pin transfer/stamping Specific Gravity (system): 1.55 System Viscosity (x 1000 cps): 130 Pot Life at 25C (hours): ,168 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/Cl: 15/80 or 2.5/120 Lap Shear Strength at 25C (Al/Al) (psi): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Ts (C): 60 CTE.(in/in/C): Alpha 1: 50x10 -6 Alpha 2: 145x10 -6 Volume Resistivity 25C (ohm/cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): ,120

33

34


FURANE PRODUCTS: Electronic Grade Adhesives Surface Mounting

(Cont

(Continued):

EPIBOND 7262: Color/Filler Type: yellow Application Method: syringe dispense/screen pr Specific Gravity (system): 1.95 System Viscosity (x 1000 cps): 100 Pot Life at 25C (hours): ,168 Gel Time (minutes/C): 5/80 Cure schedule (minutes/C): 15180 or 2.5/120 Lap Shear Strength at 25C (Al/Al) (psi): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 16x10 -4 Tg (C): 73 CTE (in/in/C): Alpha 1: 41x10 -6 Alpha 2: 131x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): ,120 EPIBOND 7263: Color/Filler Type: black Application Method: pin transfer/stamping Specific Gravity (system): 1.42 System Viscosity (x 1000 cps): 34-48 Pot Life at 25C (hours): >168 Gel Time (minutes/C): lo/80 Cure schedule (minutes/C): 30/80 or 3/120 Lap Shear Strength at 25C (Al/Al) (psi): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Tg (C): 95 CTE (in/in/C): Alpha 1: 50x10 -6 Aluha 2: 147x10 -6 Volume Resistivit; 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): >I20

Adhesives-General

FURANE PRODUCTS: Electronic Grade Adhesives Surface Mounting

(Continued):

(Continued):

EPIBOND 7272: Color/Filler Type: red Application Method: syringe dispense/screen print Specific Gravity (system): 2.02 System Viscosity (x 1000 cps): 110 Pot Life at 25C (hours): ,168 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/C): 15/80 or 2.51120 Lap Shear Strength at 2% (Al/Al) (psi): ~2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Tg (C): 76 CTE (in/in/C): Alpha 1: 44x10 -6 Alpha 2: 155x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): >I20 Thermal Transfer/Component

Protection:

URALANE 7760: Color/Filler Tvve: off-white Application Method: syringe dispense/screen print Specific Gravity (system): 2.06 System Viscosity (x-1000 cps): 500 Pot Life at 25C (hours): 3 Gel Time (minutes/C): 5/100 Cure Schedule (minutes/C): 60/100 Lap Shear Strength at 25C (Al/Al) (psi): 200 Operating Temperature (C): Continuous: 115 Intermittent: 220 Thermal Conductivity: 16.5x10 -4 Tg (C): -63 CTE (in/in/C): Alpha 1: 29x10 -6 Alpha 2: 88x10 -6 Volume Resistivity 25C (ohm-cm): 2.9x10 14 Shelf Life (months/C): 31-40 Flash Point (C): >93

35

36


FURANE

PRODUCTS:

Electronic Grade Adhesives

Thermal Transfer/Component

Protection

(Continued):

(Continued):

URALANE 7762: Color/Filler Type: pink Application Method: syringe dispense Specific Gravity (system): 2.0 System Viscosity (x 1000 cps): 190 Pot Life at 25C (hours): 3 Gel Time (minutes/C): 5/100 Cure Schedule (minutes/C): 30/100 Lap Shear Strength at 25C (~l/~l) (psi): 200 Operating Temperature (C): Continuous: 115 Intermittent: 220 Thermal Conductivity: 16.5x10 -4 Tg (C): -63 CTE (in/in/C): Alpha 1: 29x10 -6 Alwha 2: 88x10 -6 Volume Resistivity 25C (ohm-cm): 2.9x10 14 Shelf Life (months/C): 3/-40 Flash Point (C): >93 URALANE

7764:

Color/Filler Type: black Application Method: syringe dispense Specific Gravity (system): 2.0 System Viscosity (x 1000 cps): >2000 Pot Life at 25C (hours): 3 Gel Time (minutes/C): IO/l00 Cure Schedule (minutes/C): 60/100 Lap Shear Strength at 25C (Al/Al) (psi): >300 Operating Temperature (C): Continuous: 115 Intermittent: 220 Thermal Conductivity: 16.5x10 -4 Tg (C): -66 CTE (in/in/C): Alpha 1: 38x10 -6 Alpha 2: 245x10 -6 Volume Resistivity 25C (ohm-cm): 1x10 14 Shelf Life (months/C): 3/-40 Flash Point (C): >93

AdhesivesGeneral

FURANE PRODUCTS: Electronic Grade Adhesives Thermal Transfer/Component

(Continued):

Protection:

URALANE 7765: Color/Filler Type: orange Application Method: syringe dispense Specific Gravity (system): 0.95 System Viscositv (x 1000 cus): 93 URALANE 7766: Color/Filler Type: off-white Application Method: syringe dispense/screen print Specific Gravity (system): 1.32 System Viscosity (x 1000 cps): 210 Pot Life at 25C (hours): 3 Gel Time (minutes/C): lo/100 Cure Schedule (minutes/C): 90/100 or 180/85 Lap Shear Strength at 25C (Al/Al) (psi): 125 Operating Temperature (C): Continuous: 115 Intermittent: 220 Thermal Conductivity: 12x10 -4 Tg (C): -74 CTE (in/in/C): Alpha 1: 45x10 -6 Alpha 2: 124x10 -6 Volume Resistivity 25C (ohm-cm): 1.1x10 15 Shelf Life (months/C): 3/-40 Flash Point (C): ,120

37

38


FURANE PRODUCTS: Electronic Grade Adhesives

(Continued):

General Purpose: EPIBOND 7000-A/B: Color/Filler Type: silver-gray Mix Ratio (pbw): 100:85 Specific Gravity (system): 3.0 System Viscosity (x 1000 cps): non-flow paste Pot Life at 25C (minutes): 40 Gel Time (minutes/C): lo/150 Cure Schedule (hours/C): 2165 Lap Shear Strength at 25C (Al/Al) (psi): 1200 Operating Temperature (C): Continuous: 125 Intermittent: 150 Thermal Conductivity: 32x10 -4 Tg (C): 80 CTE (in/in/C): Alpha 1: 56x10 -6 Aloha 2: 155x10 -6 Volume Resistivity 25C (ohm-cm): 0.003 Shelf Life (months/C): 12/25 Flash Point (C): ,120 EPIBOND 7001-A/B: Color/Filler Type: silver Application Method: 100:6 Specific Gravity (system): 3.1 SVStem

ViSCOSitV

(X

1000

CDS):

100

Pot Life at 25C-(minutes):'3;5 Gel Time (minutes/C): 30165 Cure Schedule (hours/C): 2/65 Lap Shear Strength at 25C (Al/Al) (psi): >I200 Operating Temperature (C): Continuous: 125 Intermittent: 150 Thermal Conductivity: 47x10 -4 Tg (C): 60 CTE (in/in/C): Alpha 1: 95x10 -6 Aloha 2: 259x10 -6 Volume Resistivit; 25C (ohm-cm): 0.003 Shelf Life (months/C): 6125 Flash Point (C): ,120

Adhesives-General

FURANE

PRODUCTS:

General Purpose


(Continued):

(Continued):

EPIBOND 7100-A/B: Color/Filler Type: copper Mix Ratio (pbw): 95:5 Specific Gravity (system): 2.3 System Viscosity (x 1000 cps): non-flow paste Pot Life at 25C (hours): 1 Gel Time (minutes/C): 25/150 Cure Schedule (hours/C): 24/25+ l/65 Lap Shear Strength at 25C (Al/Al) (psi): 1100 Operating Temperature (C): Continuous: 125 Intermittent: 175 Thermal Conductivity: 40x10 -4 Tg (C): 93 CTE (in/in/C): Alpha 1: 39x10 -6 Alpha 2: 123x10 -6 Volume Resistivity 25C (ohm-cm): 0.001 Shelf Life (months/C): 12125 Flash Point (C): ,120 EPIBOND

7101-A/B:

Color/Filler Type: copper Mix Ratio (pbw): 100:53 Specific Gravity (system): 2.3 System Viscosity (x 1000 cps): smooth paste Pot life at 25C (hours): 3 Gel Time (minutes/C): 25/150 Cure Schedule (hours/C): 24/25+ l/65 Lap Shear Strength at 25C (Al/Al) (psi): 1200 Operating Temperature (C): Continuous: 125 Intermittent: 175 Thermal Conductivity: 40x10 -4 Tg (C): 42 CTE (in/in/C): Alpha 1: 47x10 -6 Alpha 2: 210x10 -6 Volume Resistivitv 25C (ohm-cm): 0.003 Shelf Life (months/C): i2/25 Flash Point (C): >I20

39

40


FURANE

PRODUCTS:


(Continued):

General Purpose (Continued): EPIBOND 7103: Color/Filler Type: copper Snecific Gravitv (system): 4.3 System Viscosity (x-1000 cps): 90 Pot Life at 25C (hours): >96 Gel Time (minutes/C): lo/l50 Cure Schedule (hours/C): 2/150 or l/l 75 Lap Shear Strength at 25C (Al/Al) (psi): 1500 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 40x10 -4 Tg (C): 150 CTE (in/in/C): Alpha 1: 79x10 -6 Alpha 2: 271x10 -6 Volume Resistivity 25C (ohm-cm): (0.01 Shelf Life (months/C): 3/O Flash Point (C): >120

Adhesives-General

FURANE PRODUCTS: Electronic Grade Surface Mount Adhesives: Syringe Dispense: EPIBOND 7262: Color/Filler Type: yellow Other Application Method: screen print Suecific Gravitv (svstem): 2.09 System Viscosity iA Cps): 100 Pot Life at 25C (hours): ,300 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/C): 15/80 or 2.51120 Lap Shear Strength at 25C (Al/Al) (psi) (1 hr/lZOC): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 12x10 -4 Tg (C): 73 CTE (in/in/C): Alpha 1: 41x10 -6 Alpha 2: 131x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): >I20 EPIBOND 7272: Color/Filler Type: red Other Anolication Method: screen orint Specific-Gravity (system): 2.09 . System Viscosity (x1000 cps): 100 Pot Life at 25C (hours): ,300 Gel Time (minutes/C): S/80 Cure Schedule (minutes/C): 15/80 or 2.5/120 Lap Shear Strength at 25C (Al/Al) (psi) (1 hr/lZOC): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivitv: 12x10 -4 Tg (C): 76 CTE (in/in/C): Alpha 1: 44x10 -6 Alpha 2: 155x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): ,120

41

42


FURANE PRODUCTS: Electronic Grade Surface Mount Adhesives (Continued): Syringe Dispense (Continued): EPIBOND 7077: (conductive solder replacement) Color/Filler Type: silver Other Application Methods: screen print Specific Gravity (system): 3.17 System Viscosity (x1000 cps): Soft Paste Pot Life at 25C (hours): >300 Gel Time (minutes/C): 3/150 21215 Cure Schedule (minutes/C): 5/160 Lap Shear Strength at 25C (Al/Al) (psi) (I hr/lZOC): 1000 Operating Tempetrature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 40x10 -4 Tg (C): 75 CTE (in/in/C): Alpha 1: 59x10 -6 Alpha 2: 168x10 -6 Volume Resistivity 25C (ohm-cm): 0.003 Shelf Life (months/C): 6/O Flash Point (C): >I20 Screen Printing and Dispense for High Stand-Off Components: EPIBOND 7262-200: Color/Filler Type: yellow Specific Gravity (system): 2.0 System Viscosity (x1000 cps): 200 Pot Life at 25C (hours): ,300 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/C): 15/80 or 2.5/120 Lap Shear Strength at 25C (Al/Al) (psi) (I hr/lZOC): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 12x10 -4 Tg (C): 73 CTE (in/in/C): Alpha 1: 41x10 -6 Alpha 2: 131x10 -6 Volume Resistivitv 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): ,120

Adhesives-General

FURANE PRODUCTS: Electronic Grade Surface Mount Adhesives: Software Pin Transfer: EPIBOND 7263: Color/Filler Type: black Other Application Method: syringe dispense Specific Gravity (system): 7.40 System Viscosity (x1000 cps): 42 Pot life at 25C (hours): >300 Gel Time (minutes/C): IO/80 Cure Schedule (minutes/C): 30180 or 31120 Lap Shear Strength at 25C (Al/Al) (psi) (1 hr/l20C): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Tg (C): 95 CTE (in/in/C): Alpha 1: 50x10 -6 Alpha 2: 147x10 -6 Volume Resistivity 25C (ohm-cm): ,1x10 14 Shelf Life (months/C): 6/O Flash Point (C): ,120 Hardware Pin Transfer: EPIBOND 7261: Color/Filler Type: yellow Other Application Method: syringe dispense Specific Gravity (system): 1.55 System Viscosity (x1000 cps): 145 Pot Life at 25C (hours): ,500 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/C): 15/80 or 2.51120 Lap Shear Strength at 25C (Al/Al)(psi)(l hr/lZOC): >2000 Operating Temperatures (C!):Continuous: 175 Intermittent: 220 Thermal Conductivity: 10x10 -4 Tg (C): 60 CTE (in/in/C): Alpha 1: 50x10 -6 Alpha 2: 145x10 -6 Volume Resistivity 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): ,120

43

44


FURANE PRODUCTS: Electronic Grade Surface Mount Adhesives (Continued): Hardware Pin Transfer (Continued): EPIBOND 7271: Color/Filler Type: Red Other Application Method: syringe dispense Snecific Gravitv (svstem): 1.55 System Viscosity (xjOO0 Cps): 145 Pot Life at 25~ (hours): ,500 Gel Time (minutes/C): 5/80 Cure Schedule (minutes/C): 15/80 or 2.51120 Lap Shear Strength at 25C (Al/Al) (psi) (1 hr/lZOC): >2000 Operating Temperature (C): Continuous: 175 Intermittent: 220 Thermal Conductivity: 10x10 -4 Tg (C): 60 CTE (in/in/C): Alpha 1: 50x10 -6 Alpha 2: 145x10 -6 Volume Resistivitv 25C (ohm-cm): >lxlO 14 Shelf Life (months/C): 6/O Flash Point (C): >120

Adhesives-General

FURANE PRODUCTS: EPIBOND Die Attach Adhesives: Polyimide: EPIBOND 7300: Color/Filler Type: silver Specific Gravity: 3.0 System Application Method: Stamping/Styringe dispenser Pot Life 25C (days): 18 Gel Time ISOC (minutes): 30 Cure Schedule (hours/C): O-5/150+ 0.5;275 Die Shear Strength (psi): >2000 Thermal Conductivity: 60 Weight Loss 300C (%): 0.7 Tg (C): 196 Volume Resistivity 25C (ohm-cm): .00008 Shelf Life: 12/O Ammonium t5 Potassium (8 Chloride (5 Sodium t5

45

46


FURANE PRODUCTS: Surface Mount Adhesives: EPIBOND 7077 Electrically Conductive Surface Mount Adhesive: Features/Benefits: * 100% solids exhibiting low outgassing * Excellent wet strength to hold components in place during processing * Fast cures in less than 5 minutes at 160C in IR oven * Reworkable for component replacement * Low ionic contaminment levels minimize corrosion potential * Very smooth, thixotropic consistency designed for screening applications EPIBOND 7251 Blue Surface Mount Adhesive: Features/Benefits: * Highly thixotropic, displaying excellent dot-height retention without tailing during dispensing * Excellent wet strength to hold components in place during processing * Cures in less than 5 minutes at 160C in IR oven * Viscosity is factory adjustable to meet application needs * Low ionic contaminant levels meet corrosion EPIBOND 7260 Surface Mount Adhesive (for Software Pin Transfer Equipment): Features/Benefits: * Designed for software pin transfer equipment * Excellent dot-height retention without tailing * Fast cure * Excellent wet strength to hold components in place during processing * Low ionic contaminant levels to minimize potential of corrosion * Easily reworked EPIBOND 7261 Surface Mount Adhesive (for Hardware Pin Transfer Equipment): * Designed for the attachment of standard components using hardware pin transfer equipment * Excellent dot-height retention without tailing * Fast cure * Excellent wet strength to hold components in place during processing * Low ionic contaminant levels to minimize potential of corrosion * Easily reworked

Adhesives-General

FURANE PRODUCTS: EPIBOND Surface Mount Adhesives (Continued): EPIBOND 7262 Surface Mount Adhesive (for Automatic Dispensing Equipment): Features/Benefits: Designed for automated syringe dispensing equipment Excellent dot-height retention without tailing Fast cure Excellent wet strength to hold components in place during processing Low ionic contaminant levels to minimize potential of corrosion Easily reworked EPIBOND 7263 Surface Mount Adhesive (for Software Pin Transfer Equipment): Features/Benefits: Designed for software pin transfer equipment Excellent dot-height retention without tailing Fast cure Excellent wet strength to hold components in place during processing Low ionic contaminant levels to minimize potential of corrosion Easily reworked EPIBOND 7271 Red Surface Mount Adhesive (for Hardware Pin Transfer Equipment): Features/Benefits: Designed for the attachment of standard components using hardware pin transfer equipment Excellent dot-height retention without tailing Fast cure Excellent wet strength to hold components in place during processing Low ionic contaminant levels to minimize potential of corrosion Easily reworked EPIBOND 7272 Surface Mount Adhesive (for Automatic Dispensing Equipment): Features/Benefits: Designed for automated syringe dispensing equipment Excellent dot-height retention without tailing Fast cure Excellent wet strength to hold components in place during processing Low ionic contaminant levels to minimize potential of corrosion Easily reworked

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FURANE PRODUCTS: EPIBOND Surface Mount Adhesives (Continued): EPIBOND 7272-200 Surface Mount Adhesive (for Automatic Dispensing Equipment): Features/Benefits: * Designed for automated syringe dispensing equipment * Excellent dot-height retention without tailing * Fast cure * Excellent wet strength to hold components in place during processing * Low ionic contaminant levels to minimize potential of corrosion * Easily reworked EPIBOND 7274 Surface Mount Adhesive (for Hardware Pin Transfer Equipment): Features/Benefits: * Designed for the attachment of standard components using hardware pin transfer equipment * Excellent dot-height retention without tailing * Fast cure * Excellent wet strength to hold components in place during processing * Low ionic contaminant levels to minimize potential of corrosion * Easily reworked

Adhesives-General

49

GC ELECTRONICS: Adhesives: Epoxy Cements: QUICK STIK: 5 Minutes Set Clear, fast curing epoxy adhesive. In view of its short pot life, use is recommended when a single repair must be made and the mixed adhesives can be used within one or two minutes. Cemented items can be safely handled within eight to twelve minutes, with full hardness obtained after several hours. This cement is relatively thin in consistency and should be used to cement closely matching surfaces. The glue line is usually invisible. Epoxy SUPER GLUE: 5-5 Hour Set Versatile epoxy cement particularly suitable for cementing non-porous materials. Cures at room temperature. Bond strength of over 3000 psi. Will not shrink through curing. Resistant to water, solvents, heat, cold and fungus. Excellent dielectric properties. Mix in equal parts from two tubes. Silicone Rubber Adhesive/Sealant: One-component elastomer cures to a tough, rubbery solid when exposed to moisture in the air. Designed to fulfill industrial and electronic service sealing and bonding requirements, Silicone Rubber Sealant has excellent adhesive strength, high elongation and outstanding insulation and heat resistance qualities. Develops primerless adhesion to a variety of materials, including metal, glass, most wood, silicone resin, vulcanized silicone rubber, ceramic, natural and synthetic fibers; most plastics and painted surfaces. Resists weathering, vibration and exposure to oil, moisture, ozone, and temperatures from sub-zero to 450F. Cures to a tack-free surface in 20 minutes. Full cure, 24 hours. Ideal for many sealing, bonding and insulating applications, including general electrical insulation, potting exposed electronic components, bonding gaskets for heating and refrigeration units, formed-in-place gaskets for gear boxes, compressors, pumps and outdoor motor covers, pressure sealing of aircraft cabins and cockpits, caulking sheet metal stacks, ductwork and equipment housings, and as an anti-abrasion coating. As Cured--Electrical: ASTM D257 Volume Resistivity, ohm-cm: 1.5 X 10 15 ASTM D149 Dielectric Strength, volts/mil: 550 ASTM D150 Dielectric Constant: at 60 Hz: 2.8 at 100 Hz: 2.8 at 100 KHz: 2.8 ASTM D150 Dissipation Factor: at 60 Hz: 0.0015 at 100 Hz: 0.0015 at 100 KHz: 0.0015

50


GC ELECTRONICS: Adhesives (Continued): Epoxy Glue: 5 Hours Set Provides an exceptionally hard and strong bond. Good dielectric properties. Gray-white in color with fillers added to increase viscosity and make it thixotropic (nonrunning). May be used to fill gaps or to replace broken sections. Bonds may be over-filled and filed or sanded after curing. Cyanoacrylate Adhesives: GR-R-RIP: World famous alpha cyanoacrylate rapid bonding adhesive. Bond strength not affected by temperatures from -112F to +212F (-8OC to +lOOC). GELWELD: Gel Cyanoacrylate Adhesive Alpha Cyanoacrylate super strength adhesive in a "gel" form-will not drip or run. Fills gaps well. PERMABOND Super Glue Regular Formula: Ethyl Cyanoacrylate Adhesive Medium viscosity formula for efficient wicking action, faster curing time. Excellent for bonding any combination of plastic, rubber or metal parts. This grade is ideal for small or fine work on non-porous, smooth surfaces. It fills gaps of .003-.005". Highly resistant to acid, alkali water, solvents and fungus. Non-toxic. Meets Mil. Spec. MIL-A-46050B Type 1 Class 2 PERMABOND High Viscosity Formula: Ethyl Cyanoacrylate Adhesive Higher viscosity means less wicking, no drop and slower speed of cure. Fills gaps .015-.017". This grade has a higher skin adherence, which makes it ideal for surfaces which are irregular or rough, or have a high degree of porosity, such as wood or ceramic. Its slowest cure time makes it ideal for applications where there is more than one operation, or minor adjustment is needed within 30 seconds. Meets Mil. Spec. MIL-A-46050C Type II Class 3.

Adhesives-General

51

GC ELECTRONICS: Adhesives (Continued): PERMABOND 910: Methyl Cyanoacrylate Adhesive Forms strong, lasting bonds in seconds between either similar or dissimilar materials--metal, porcelain, plastic, glass, most rubbers, hardwoods, and other non-porous materials with smooth, close-fitting surfaces. And, the bond resists softening at temperatures up to 320F (16OC). Your most versatile adhesive for bonding...attaching...fixturing. Cures to a strength of 5000 psi; because it is solvent-free, there is no shrinking during curing... and no solvent fumes. Meets Mil. Spec. MIL-A-46050C Type I Class 2 Solvent Release Adhesives: General Purpose Plastic Cement: A solvent-release adhesive with a special Nitrocellulose Lacquer Base. The bond is usually invisible and hard, but not brittle. It adheres especially well to plastics, paper, leather, ceramics and metal. Quick-drying and waterproof, this allpurpose cement is widely used by repairmen, model builders, hobbyists and do-it-yourselfers. GC BOND: Thermoplastic adhesive based on synthetic components with unusually strong bonding characteristics to most materials. Produces a waterproof, resilient and long-lasting flexible bond. Light tan in color. GC BOND's uses range from cementing paper and cardboard to cementing electronic components to circuit boards and chassis. Sticks well to all metals and glass. Dries in 15 to 30 minutes. Service Cement: A quick-drying and waterproof clear adhesive which forms a strong, hard but vibration-resistant bond with minimal shrinkage. This is a true universal adhesive for shop, industry, home and hobby use. Ideal for speaker repairs. May also be used for gluing porous or semi-porous materials to each other or to metals, plastics, etc. This cement is not suitable for metal-tometal, glass-to-metal or other non-porous to non-porous surfaces, for which PERMABOND, GR-R-RIP or epoxy cements are more suitable.

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GC ELECTRONICS: Adhesives (Continued): Rubber-to-Metal Cement: A heavy-bodied, black rubber-based cement with outstanding bonding qualities to many materials such as natural and synthetic rubber, metal, wood and plastics. Dries fairly quickly and produces a lasting, flexible bond which often exceeds the strength of the material itself. Used to cement any rubber or flexible plastic part to cabinets, chassis or panels; also for gaskets, weather strips, etc. Acrylic Cement: Consists of solvent for acrylics (plexiglass, lucite and others). slishtlv thickened with dissolved acrylic resin. It actually t'weids112 items made of plexiglass. The-joint is usually invisible and stronger than the material itself. Cements many items used in electronics for decorative or functional purposes as well as acrylic signs, art objects and decorative pieces. Also has fairly good adhesive qualities to such surfaces as wood, other plastics, cardboard and fibers. Vinylite Cement: Vinyl resin-base cement that is waterproof, almost invisible and has excellent resistance to moisture, most acids and alkalis. Used to cement items made of rigid or flexible vinyl, wood, cardboard, paper, metal, plastics, glass. Very flexible. Lends itself particularly well to items where a rigid bond is not desirable.

Adhesives-General

GC ELECTRONICS: Adhesives

(Continued):

SUPER GLUE: Base: Bisphenol A (Resin) Polvamide (Hardener) Color: Transparent Light Straw Flashpoint: Above 149C (3OOF) Specific Gravity: 1.16 (Resin) 0.97 (Hardener) Curing/Drying Time: 4-6 Hrs. QUIK-STIK: Base: Mod. Epoxy Resin Color: Clear Flashpoint: Above 149C (300F) Specific Gravity: 1.17 (Resin) 1.13 (Hardener) Curing/Drying Time: 0-12 Mins. GR-R-RIP!: Base: Alpha or Ethyl Cyanoacrylate Color: Clear Flashpoint: 83C (182F) Specific Gravity: 1.05-1.08 Curing/Drying Time: 15-60 Sets. Suggested Solvent: GC #IO-130 or Acetone, M.E.K. PERMABOND: Base: Alpha or Ethyl Cyanoacrylate Color: Clear Flashpoint: 83C (182F) Specific Gravity: 1.05-1.08 Curing/Drying Time: 15-60 Sets. Suggested Solvent: GC #lo-130 or Acetone, M._E.K. PERMA-LOK: Base: Dimethylacrylate Esters Color: Green Flashpoint: 93C (200F) Specific Gravity: 1.07 Service Cement: Base: Nitrocellulose Lacauer Color: Clear Light Straw‘ Flashpoint: -9C (15F) (Extremely Flammable) Specific Gravity: 0.98 Curing/Drying Time: IO-15 Mins. Suggested Solvent: GC #lo-312 Series or Lacquer Thinner

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Adhesives, Sealants and Coatings for the Electronics Zndusty

GC ELECTRONICS: Adhesives (Continued): General Purpose Plastic Cement: Base: Nitrocellulose Lacquer Color: Clear Light Straw Flashpoint: -9C (ISF) O.C. (Extremely Flammable) Specific Gravity: 0.95 Curing/Drying Time: lo-15 Mins. Suggested Solvent: GC #lo-312 Series or Lacquer Thinner Epoxy Glue: Color: Grey White Flashpoint: Above 204C (400F) Specific Gravity: 1.14 (Resin) 1.2 (Hardener) Curing/Drying Time: 2 hrs. Rubber-to-Metal Cement: Base: Rubber Resin Color: Black Flashpoint: -lOC (14F) C.C. Specific Gravity: 0.90 Curing/Drying Time: 15-20 Mins. Suggested Solvent: Petroleum Naphtha or GC #IO-6702 Acrylic Cement: Base: Acrylic Resin Color: Clear Flashpoint: Non-Flammable Specific Gravity: 1.3-1.4 Curing/Drying Time: 15 Mins. Suggested Solvent: Methylene Chloride GC

BOND: Base: Synthetic Thermoplastic Resin Color: Tan Flashpoint: -7 (20F) O.C. (Extremely Flammable) Specific Gravity: -87 Curing/Drying Time: 4 hrs. Suggested Solvent: Methyl Ethyl Ketone

Vinylite Cement: Base: Vinvl Resin Color: Clear Flashpoint: -20C t-4") (Extremelv Flammable) Specific Gravity: .86 Curing/Drying Time: 25 min. Suggested Solvent: Acetone

Adhesives-General

IPS CORP.: WELD-ON 1007 High Strength Cement for Rigid Vinyl (PVC) and Kydex: For Bonding: Rigid vinyl and Kydex to themselves and to each other. General Description: WELD-ON 1007 is a clear, light bodied, syrupy, free flowing, very fast curing, high strength, solvent cement. It is specifically formulated for solvent cementing rigid Polyvinyl Chloride (PVC) and Kydex. Uses: General usage for vinyl where a bodied cement is desired. It is suitable for a wide variety of applications. It may be used on both large and small assemblies, large displays, signs, lighting fixtures, housewares, large and small containers, toys, electrical or electronic assemblies, decorator items, etc. Properties of Bond: Initial bond forms very quickly, so that some parts may be handled within just a few minutes of application. Bond strength continues to develop very rapidly, reaching a substantial level within hours. Joints are weather resistant and will generally have physical and chemical properties similar to those of rigid vinyl. WELD-ON 1591 Acrylonitrile-Butadiene-Styrene

(ABS):

For Bonding: ABS plastics to itself only - e.g., Cycolac, Kralon, Lustrane, etc. Description: WELD-ON 1591 is a black, sirupy, bodied, fast drying solvent cement. It forms high strength bonds in joining ABS materials. Uses: General usage for ABS where a bodied cement is desired. It is suitable for a wide variety of applications. It may be used on both large and small assemblies where black color is desirable, large displays, signs, lighting fixtures, housewares, large and small containers, toys, electrical and electronic housings, decorator items, etc. For near clear cement, ask for WELD-ON 1707. Properties of Bond: High strength, rigid, generally free from crazing. Chemical, physical and electrical properties are similar to those of ABS materials.

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IPS CORP.: WELD-ON 1707 Acrylonitrile-Butadiene-Styrene

(ABS):

For Bonding: ABS plastics to itself only--e.g., Cycolac, Kralastic, Kralon-Lustrane, etc. Description: WELD-ON 1707 is a milky, sirupy, bodied, fast drying solvent cement. It forms high strength bonds in joining ABS materials. Uses: General usage for ABS where a bodied cement is desired. It is suitable for a wide variety of applications. It may be used on both large and small assemblies, large displays, signs, lighting fixtures, housewares, large and small containers, toys, electrical or electronic assemblies, decorator items, etc. Properties of Bond: High strength, rigid, generally free from crazing. Chemical, physical and electrical properties are similar to those of ABS materials. WELD-ON 1993 High Strength Cement for Rigid Vinyl (PVC), Kydex or Acrylivin: For Bonding: Rigid vinyl and Kydex or Acrylivin to themselves and to each other. May also be used for joining some flame retardant ABS materials 11%" or thicker. General Description: WELD-ON 1993 is a clear, medium bodied, syrupy, free flowing, very fast curing, high strength, solvent cement. It is specifically formulated for solvent cementing rigid Polyvinyl Chloride (PVC) and Kydex or Acrylivin. Uses: General usage for vinyl where a heavy bodied cement is required to fill unvoidable gaps. It is suitable for a wide variety of applications. It may be used on both large and small assemblies, large displays, signs, lighting fixtures, housewares, large and small containers, toys, electrical or electronic assemblies, decorator items, etc. Properties of Bond: Initial bond forms very quickly, so that some parts may be handled within just a few minutes of application. Bond strength continues to develop very rapidly, reaching a substantial level within hours. Joints are weather resistant and will generally have physical and chemical properties similar to those of rigid vinyl.

Adhesives-General

57

IPS CORP.: WELD-ON 3050 Noryl* Cement: For Bonding: Noryl to itself and to other plastics such as ABS, styrene, acrylics, etc. Description: WELD-ON 3050 is a milky, fast drying, medium bodied solvent type cement. It cures with the dissipation of solvents forming high strength, rigid joints. Initial bond will usually take place within minutes and may be of sufficient strength for handling. The following bond strength data was obtained with compressive shear loading, at 0_050"/min. The material tested was l/4" thick Noryl* with lap joints of 1 square inch of bonding area. Both surfaces were liberally coated with cement and assembled after 60 seconds. Samples were cured and tested at room temperature. R.T. Cure: 2 Hrs. Bond Strength (Avg. PSI): 200 R.T. Cure: 16 Hrs. Bond Strength (Avg. PSI): 890 R.T. Cure: 72 Hrs. Bond Strength (Avg. PSI): 1290 R.T. Cure: 1 Wk. Bond Strength (Avg. PSI): 1400 Uses: General usage for Noryl* where a bodied cement is desired. It is suitable for a wide variety of applications. It may be used on both large and small assemblies, lighting fixtures, housewares, large and small containers, electrical or electronic assemblies, decorator items, etc.

* Note: Noryl is a registered trademark of General Electric Corp.

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Adhesives, Sealants and Coatings for the Electronics Zndustry

ITW DEVCON: DEVCON MVP Methacrylate Adhesives for Bonding All Materials: A one to one mix methacrylate that has high tensile, peel and impact strength. MVP 11 is formulated for bonding dissimilar substrates and offer some flexibility for thermal expansion and other high stress applications. Adheres well to most plastics and metal with minimal surface preparation. Designed Performance: * High non-sag viscosity * Excellent peel and impact * Gapfilling to .I25 * Rapid 5 minute fixturing * Easy mixing with 1:l available in dual syringe with metering * High strength, 4,000 psi * Bonds flexible vinyls and reinforced plastics * Bonds sheet metals and plastics in combination Uncured (Liquid): Type: Meter-Mix Viscosity (centipoise): 50,000 Color: amber Flashpoint (F): 50 Toxicity: Moderate Solvents present: none Application: Recommended maximum gap: typical use: plastics metals

.125"

Curing Hardening: Fixture strength on metals, steel, aluminum, alloys, brass: 7-10 min. Fixture strength on plastics, nylon, ABS, vinyl, urethane, acrylic, polycarbonate, phenolic: 7-10 min. Functional strength (hours): 1 Full strength (hours): 4 Cured Adhesive: Adhesive tensile shear (psi) on steel and aluminum laps: 4,000 Impact strength (ft. lbs./in 2): 25 T-Peel (lb per linear inch): 45 Compressive shear (psi) on plastics: substrate failure Temperature range (F): -65 to 250

Adhesives-General

59

LOCTITE CORP.: Bonding: LOCTITE developed engineering adhesives to meet customer needs for adhesives that combine tensile, shear, and peel strength with maximum impact, shear, and peel strength with maximum impact, stress, and shock resistance. For maximum application versatility, these adhesives come in both activator-cured and UV-cured formulations. The UV-cured formulations are especially useful for bonding transparent substrates, and in sealing and coating applications. LOCTITE engineering adhesives can be conveniently dispensed and cured on line with either manual or automatic process equipment. High Impact SPEEDBONDER 324: Tough, activator-cured adhesive that bonds most any material. Cures in minutes when in contact with Activator 707 and forms flexible bonds on gaps up to .040" thick. Withstands shock and temperatures to 275F. Bonds: - Speaker magnets - Prepared surfaces where impact and peel are severe - Firearm parts - Auto glass components - DC motor magnets - Decorative wood to cutlery - Mirrors to housings Severe Environment SPEEDBONDER 325: Solvent-resistant, activator-cured adhesive. Cures in minutes when in contact with Activator 707 and forms flexible bonds on gaps up to .040" thick. Designed for severe environments and temperatures up to 350F. Bonds: - Electronic components used in high temperature systems - Fuel pump components - Identification tags on pipelines - DC motor magnets on motors designed for extreme environments High Performance SPEEDBONDER 326: Activator-cured adhesive with very high cure speed. Bonds rapidly when cured with LOCQUIC Primer N. Strong bonds on gaps up to .020" thick . Bonds: - DC motor magnets - Jewelry--stones to mounts - Ferrite magnets to steel housing - Preformed aluminum structural elements

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LOCTITE CORP.: Bonding(Continued): Ultraviolet Adhesive 350: UV-cured adhesive with excellent adhesion. Forms tough bonds with glass, metal, and a variety of thermoplastics. Retains strength when exposed to water or humidity. Bonds and seals: - Glass to itself - Glass to other materials - Tamperproof screws - Seals electrical relays Tough Ultraviolet Adhesive 352: Tough, flexible, UV or activator-cured adhesive. Highly resistant to vibration and impact. Bonds and seals: - Glass to other materials - Metal with cured fillet - Small potting applications High Strength Flexible SPEEDBONDER 392: High tensile strength combined with flexibility for outstanding impact and peel resistance. Bonds bare and galvanized steel and steel coated with phosphate and dichromate. Resistant to thermal cycling and severe environment. Cures in less than a minute with Activator 792. Bonds: - Motor magnets to housings - Speaker magnet to pole pieces - Galvanized strectural elements DEPEND No Mix Adhesive 330: Versatile, tough, activator-cured adhesive with high peel and impact strength. Used with DEPEND Activator 738, it cures in just minutes. Excellent for porous substrates and applications that involve flexing and bending. Bonds almost all combinations of materials. Bonds: - Ferrite magnets to steel housings - Fuel pump components - Glass to steel in solar collector panels - Aluminum and steel to ABS/graphite - Screws to enclosures for tamperproofing - Metal signs to concrete walls - Metal automobile window latch levers to glass Primers: LOCQUIC Activator 707, LOCQUIC Primer N and DEPEND Activator 738 aid cure of Engineering Adhesive.

Adhesives-General

LOCTITE CORP.: Bonding(Continued): Engineering Adhesives Technical Information: 324: Color: Amber Gap Filling: .040" Viscosity cp: 15,000 Tensile Strength psi: 5,000 Temperature Range: -65 to 275F (-54 to 135C) Cure Speed: Fixture: 3 min. Full: 12-24 hrs. Recommended Primer: Activator 707 325: Color: Amber Gap Filling: -040" Viscosity cp: 20,000 Tensile Strength psi: 6,000 Temperature Range: -65 to 350F (-54 to 18OC) Cure Speed: Fixture: 5 min. Full: 12-24 hrs. Recomended Primer: Activator 707 326: Color: Amber Gap Filling: .020" Viscosity cp: 15,000 Tensile Strength psi: 5,000 Temperature Range: -65 to 225F (-54 to 107C) Cure Speed: Fixture: 2 min. Full: 12-24 hrs. Recommended Primer: N uv350: Color: Amber Gap Filling: .OlO" Viscosity cp: 5,000 Tensile Strength psi: 800 Temperature Range: -65 to 250F (-54 to 125C) Cure Speed: Fixture: 5-15 sec. Full: 30-90 sec. Recommended Primer: UV light

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LOCTITE CORP.: Bonding(Continued): Engineering Adhesives Technical Information(Continued): UV352: Color: Lt. Brown Gap Filling: .040" Viscosity cp: 20,000 Tensile Strength psi: 5,000 Temperature Range: -65 to 275F (-54 to 15OC) Cure speed: Fixture: 2-3 min. Full: 24 hrs. Recommended Primer: UV light or Activator 707 DEPEND 330: Color: Pale Yellow Gap Filling: .030" Viscosity cp: 70,000 Tensile Strength psi: 2,700 Temperature Range: -60 to 250F (-51 to 12%) Cure Speed: Fixture: l-2 min. Full: 4-24 hrs. Recommended Primer: Activator 738 392 :

Color: Lt. Tan Gap Filling: .025" Viscosity cp: 68,000/15,000 Tensile Strbgth psi: 2,800 Temperature Range: -40 to 300F (-40 to 149C) Cure Speed: Fixture: 30-60 sec. Full: 4-24 hrs. Recommended Primer: Activator 792

AdhesivesGeneral

63

LOCTITE CORP.: Threadlocker Adhesives: Invented by Loctite Corporation as a revolutionary method to positively lock and seal threaded fasteners, LOCTITE threadlocker adhesives have found wide acceptance in a range of applicationsfrom delicate electronic components to heavy construction equipment. They have become a standard in worldwide automotive assembly, as well as critical military and aerospace systems. In response to industry needs, Loctite has pioneered threadlockers with precisely controlled strength; threadlockers resistant to extreme enviroments; and even pre-applied threadlockers for high volume applications and easier inspection. LOCTITE threadlocker adhesives can be applied with manual, semi-automatic, or automatic systems, and are formulated in strengths and viscosities for virtually any application. Removable Threadlocker 242: Medium strength, general purpose. Ideal for all nut and bolt applications. Especially well suited for l/4" or larger fasteners. Removable with hand tools. Replaces: - Lockwashers - Plastic insert fasteners Locks: - Machine tool access bolts - Conveyor roller bolts - Gear box bolts - Construction equipment nuts and bolts - Bearing cover cap screws - Crawler truck bolts - Drive shaft fasteners - Mounting bolts on motors, pumps, etc. - Shaft coupling bolts Small Screw Threadlocker 222: Low strength. Perfect for small fasteners, long engagement length fasteners, and components requiring occasional adjustment. Best for l/4" and smaller fasteners. Removable with hand tools. Locks: - Set screws - Adjustment screws - Calibration screws - Thermostat screws - Relay lock screws

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LOCTITE CORP.: Threadlocker Adhesives(Continued): Permanent Threadlocker 262: High strength. Controlled torque tension. Designed for severe vibration/stress applications or extreme environmental/ chemical conditions. Especially useful where Grade 5 and 8 fasteners are subjected to heavy shock, vibration, and stress levels. Removable with heat and hand tools. Locks: - Loader transmission bolts - Refrigeration hardware - Railroad traction-motor mounting bolts - Railroad pedestal frame key bolts - Differential case bolts - Replaces 5a and 5b fits Penetrating Threadlocker 290: Formulated especially for pre-assembled fasteners. Penetrates by capillary action. Simplifies preventive maintenance. (Also used to seal welds.) Locks, vibration-proofs, and seals: - Instrumentation screws - Electrical connector set screws - Carburetor choke set screws - Virtually all small-to-medium size fasteners High Temperature Threadlocker 272: High temperature/high strength for extreme duty applications. Permanently locks: - Rolling mill conveyor bolts - Furnace mounting studs LOCTITE DRI-LOC Pre-applied Threadlockers: DRI-LOC Threadlocker is a dry-to-the-touch film applied by fastener suppliers and independent contractors. Locks: - Ring gear bolts - Carburetor screws - Transmission nuts - Head bolts - Truck axle bolts - Tower bolts Seals: - Transmission bolts - Pipe plugs, fittings Also Available for Specific Uses: - High Strength Threadlocker 271 (Very high strength for fasteners up to 1" in diameter.) - High Strength Threadlocker 277 (High viscosity/high strength for fasteners over 1" in diameter.) Primers: LOCQUIC Primers T and N aid cure on inactive surfaces such as aluminum, black oxide, stainless steel, and thermoset plastics.

Adhesives-General

LOCTITE CORP.: Threadlocker Adhesives(Continued): Threadlocker Performance Information: 200: Color: Yellow Torque in. lbs.: 220/105 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 10 min. Full: 72 hrs. 201

: Color: Yellow Torque in. lbs.: 2451130 Temperature Range: -65 to 400F (-54 to 204C) Cure Speeds, Steel: Fixture: 10 min. Full: 72 hrs.

202: Color: Green Torque in. lbs.: 200/105 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 10 min. Full: 72 hrs. 203: Color: Silver Torque in. lbs.: 160/75 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 10 min. Full: 72 hrs. 204: Color: Red Torque in. lbs.: 280/250 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 10 min. Full: 72 hrs.

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LOCTITE CORP.: Threadlocker Adhesives(Continued): Threadlocker Technical Information: 222: Color: Purple Gap Fill: .005" Viscosity cp: 2000 Torque in. lbs.: SO/20 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 20 min. Full: 24 hrs. Fixture w/Primer: 5 min. Full w/Primer: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type II Grade M 242: Color: Blue Gap Fill: -005" Viscosity cp: 2000 Torque in. lbs.: 100/35 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 20 min. Full: 24 hrs. Fixture w/Primer: 5 min. Full w/Primer: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type II Grade N 262: Color: Red Gap Fill: .005" Viscosity cp: 3000 Torque in. lbs.: 150/100 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 10 min. Full: 24 hrs. Fixture w/Primer: 5 min. Full w/Primer: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type II Grade 0 271: Color: Red Gap Fill: -007" Viscosity cp: 500 Torque in. lbs.: 200/250 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 20 min. Full: 24 hrs. Fixture w/Primer: 5 min. Full w/Primer: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type I Grade K

Adhesives-General

LOCTITE CORP.: Threadlocker Adhesives(Continued): Threadlocker Technical Information(Continued): 27'2: Color: Red Gap Fill: .007" Viscosity cp: 7000 Torque in. lbs.: 2251240 Temperature Range: -65 to 450F (-54 to 232C) Cure Speeds, Steel: Fixture: 30 min. Full: 24 hrs. Fixture w/Primer: 5 min. Full w/Primer: 24 hrs. Recommended Primer: T or N 277: Color: Red Gap Fill: .OlO" Viscosity cp: 6500 Torque in. lbs.: 250/200 Temperature Range: -65 to 300F (-54 to 149C) Cure Speeds, Steel: Fixture: 60 min. Full: 24 hrs. Fixture w/Primer: IO min. Full w/Primer: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type I Grade L 290 :

Color: Green Gap Fill: .004" Viscosity cp: 12 Torque in. lbs.: 60/200 Temperature Range: -65 to 400F (-54 to 204C) Cure Speeds, Steel: Fixture: 3 min. Full: 24 hrs. Recommended Primer: T or N Military Spec. MIL-S-46163: Type III Grade R

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MERECO DIVISION: MERECO CLN-738 Surface Mount Adhesive: Form: Thin Paste Color: As Specified SP. Gr.: 1.16 Viscosity: Thixotropic gel Cure Times: Recommended minimum cure - 5 minutes at 250F or 3 minutes at 300F. For maximum properties cure 30 min. at 300F. Gel time (2 mil film) at 250F = 2 min. at 300F = 1 min. Characteristics of Cured Components: Hardness Tests: 83: Shore D Lap Shear (Al-Al): 2500 psi METRE-SET 321 One-Part Adhesive Epoxy: METRE-SET 321 is a unique, one part, high strength, thermostting, epoxy adhesive. It does not contain plasticizers, other resin modifiers which detract from properties or solvents which release vapors during cure. The bonds formed are strong and resilient, have good electrical insulation, high dielectric strength, low loss factor, chemical resistance and are capable of continuous duty up to temperatures of 200C (400F). METRE-SET 321 bonds to glass, ceramics, wood, metals including brass and many plastics (not for use with acetal) including Ryton. METRE-SET 321 is cured with heat. Sources of heat include ovens, infra-red and hot plates. Recommended curing temperatures range from 140C (285F) to 204C (400F). Typical Product Properties: Color: Black, brown or gray Form: Soft paste Viscosity (25C), cP: 60,000 Specific Gravity (25/25C): 1.33 Flash Point, F: 380 Typical Cured Properties: (after 2 hours at ISOC): Mechanical: Color: Brown Form: Solid Specific Gravity (25/25C): 1.34 Tensile Shear (Aluminum to Aluminum), psi: 25C (77F): 3200 85C (185F): 3000 120C (250F): 2000 150C (300F): 1300 Thermal: Operating Range, C: -55 to 204 Electrical: Dielectric Constant (1000 Hz): 3.8

Adhesives-General

69

NORLAND PRODUCTS INC.: NORLAND Electronic Adhesive: NEA 121: NEA 121 is a clear, low viscosity adhesive that cures when exposed to uv light and/or heat. Applications include tacking, filling and sealing precision components, and tamperproofing adjustable components. NEA 121 is ideal for spot curing small areas. NEA 123: NEA 123 is a thixotropic paste that cures under uv light and/or heat. This fast curing adhesive is ideal for wire tacking, capacitor bonding and coil terminating. NEA 123 contains a latent heat catalyst that can quickly cure areas that are not exposed to ultraviolet light. The heat cure is not required if all the adhesive receives proper exposure to uv light. NEA 141: NEA 141 is a medium viscosity, thixotropic paste which cures under ultraviolet light. This adhesive was designed for coil terminating. NEA 155: NEA 155 is a red, thixotropic paste that cures in minutes at high temperatures to form an electrically insulating polymer. The adhesive can be readily applied by syringe, screen printing or pin transfer techniques. It is ideal for bonding SMT devices or printed circuit boards so that they can pass through the solder bath without shifting. NEA 121: Recommended For: Tacking, filling, sealing and tamperproofing precision components Cure: UV/heat Glass: Excellent Adhesion to Metal: Excellent Plastic: Fair Viscosity at 25 Degrees C: 300 cps Color: Clear Refractive Index: N/A Modulus psi: 160,000 Tensile psi: 3,500 Elongation at Failure: 30% Shore D Hardness: 85

70


NORLAND PRODUCTS INC.: NORLAND Electronic Adhesive(Continued): NEA 123: Recommended For: High viscosity thixotropic paste for wire tacking, chip bonding and coil terminating Cure: VV/heat Glass: Excellent Adhesion to Metal: Good Plastic: Good to Excellent Viscosity at 25C: Thixotropic Paste Color: Translucent Refractive Index: N/A Modulus psi: 50,000 Tensile psi: 3,600 Elongation at Failure: 60% Shore D Hardness: 60 NEA 141: Recommended For: Medium viscosity thixotropic paste ideal for coil terminating Cure: UV Glass: Excellent Adhesion to Metal: Good Plastic: Good to Excellent Viscosity at 25 Degrees C: Thixotropic Paste Color: Translucent Refractive Index: N/A Modulus psi: 40,000 Tensile psi: 2,800 Elongation at Failure: 60% Shore D Hardness: 55 NEA 155: Recommended For: A fast curing adhesive for bonding, sealing or potting electronic components Cure: Heat Glass: Excellent Adhesion to Metal: Excellent Plastic: Fair Viscosity at 25 Degrees C: Thixotropic Paste Color: Red Refractive Index: N/A Modulus psi: 160,000 Tensile psi: 3,500 Elongation at Failure: 5% Shore D Hardness: 90

Adhesives-General

71

PACER TECHNOLOGY: ANA-LOK Anaerobic Compounds: ANL-22: Low strength * Removable for locking/sealing small screws under 1/4" in diameter * May be disassembled with hand tools * Meets MIL-S-46163A, Type II, Grade M ANL-42: Medium strength * Removable general purpose adhesive, for locking/sealing fasteners over l/4" in diameter * May be disassembled with hand tools * Meets MIL-S-46163A, Type II, Grade N ANL-71: High strength * Permanent, for locking/sealing fasteners up to 1" in diameter. Disassembly difficult * Meets MIL-S-46163A, Type I, Grade L ANL-77: High Strength * Permanent locking/sealing large bolts and studs for fasteners 1" in diameter and larger. Disassembly difficult; heat required. * Meets MIL-S-46163A, Type I, Grade L ANL-90: High Strength * Penetrating permanent, for locking/sealing preassembled fasteners. Also used to seal weld and casting porosity. Disassembly difficult. * Meets MIL-S-46163A, Type III, Grade R ANL-RC: High Strength * General purpose, retaining compound for retaining bearings, bushing, collars, keys, and splines. -005" gap filling capability allows slip fit instead of press fit parts. * Meets MIL-R-46082B, Type I ANL-RC/HT: High Temperature * Retaining compound for retaining bearings, bushings, collars, gears, and other cylindrical parts. Fills gaps to .015" and resists temperatures up to 450F (232C.3 * Meets MIL-R-46082B, Type II

72


PACER TECHNOLOGY: ANA-LOK Anaerobic Compounds (Continued): ANL-22: Generic Type: Low Strength Color: Purple Viscosity (cps): 900-5000 Fixture Time (min.): 5-15 Working Time (hrs.): 2 Full Cure (hrs.): 24 Gap Filled (inch): .OlO Specific Gravity: 1.07 Flash Point (F, TOC): 219 Corrosivity (MIL-S-22473D): none Toxicity: Low Shelf Life (R.T.): 1 yr. min. Soluble in: Acetone, MEK, 1 ,I,1 Trichloroethane Locking Torque Breakaway: 25-70 (in-lbs) Prevail: 15-60 Shear Strength (lbs/in 2): 570-990 Service Temperature: (-65 to +300F) (-54 to +149C) Linear Expansion (mm/c): 15 x 10 -5 Hardness: Rockwell: R25 Decomposition Temp. (F): 410 ANL-42: Generic Type: Medium Strength Color: Blue Viscosity (cps): 900-5000 Fixture Time (min.): 5-15 Working Time (hrs.): 2 Full Cure (hrs.): 24 Gap Filled (inch): .OlO Specific Gravity: 1.11 Flash Point (F, TOC): 219 Corrosivity (MIL-S-22473D): none Toxicity: Low Shelf Life (R.T.): 1 vr. min. Soluble in/Acetone, MEK, l,l,l Trichloroethane Locking Torque Breakaway: SO-105 (in-lbs) Prevail: 60-130 Shear Strength (lb/in 2): 1140-2130 Service Temperature: (-65 to +300F) (-54 to +149C) Linear Expansion (mm/c): 15 x 10 -5 Hardness: Rockwell: R65 Decomposition Temp. (F): 432

Adhesives-General

PACER TECHNOLOGY: ANA-LOK Anaerobic Compounds (Continued): ANL-71: Generic Type: High Strength ((1" Fasteners) Color: Red Viscosity (cps): 450-550 Fixture Time (min.): 5-15 Working Time ihrs.j: 2 Full Cure (hrs.): 24 Gap Filled (inch): .008 Specific Gravity: 1.10 Flash Point (F, TOCf: 219 Corrosivity (MIL-S-22473D): none Toxicitv: Low Shelf Life (R-T.): 1 yr. min. Soluble In: Acetone, MEK, l,l,l, Trichloroethane Lockins Torcfue Breakaway: 175-260 (inllbs)- Prevail: 215-305 Shear Strength (lb/in 2): 215-305 Service Temoerature: (-65 to +300F) (-54 to +149C) Linear Expansion (mm/c): 8 x 10 -5 Hardness: Rockwell: Ml10 Decomposition Temp. (F): 486 ANL-77: Generic Type: High Strength (>I" Fasteners) Color: Red Viscosity (cps): 6000-8000 Fixture Time (min.): 5-15 Workinc Time (hrs.): 2 Full Cure (hrs.): 24 Gap Filled (inch): .OlO Soecific Gravitv: 1.11 Fiash Point (F,-TOC): 219 Corrosivitv (MIL-S-22473D): none Toxicity: Low Shelf Life (R.T.): 1 yr. min. Soluble In: Acetone, MEK, I,1 ,I Trichloroethane Locking Torque Breakaway: 220-305 (Prevail): 170-260 (in-lbs) Shear Strength (lb/in 2): 2840-4970 Service Temperature: (-65 to +300F) (-54 to +149C) Linear Expansion (mm/c): 8 x 10 -5 Hardness: Rockwell: Ml10 Decomposition Temp. (F): 504

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PACER TECHNOLOGY: ANA-LOK Anaerobic Compounds (Continued): ANL-90: Generic Type: Wicking Grade Color: Green Viscosity (cps): IO-25 Fixture Time (min.): l-10 Working Time (hrs.): 1 Full Cure (hrs.): 24 Gap Filled (inch): .002 Specific Gravity: 1.08 Flash Point (F, TOC): 219 Corrosivity (MIL-S-22473D): Toxicitv: Low Shelf Life (R.T.): 1 yr. min. Soluble In: Acetone, MEK, l,l,l, Trichloroethane Locking Torque Breakaway: 50-105 Prevail: 170-350 (in-lbs) Shear Strength (lb/in 2): 2130-3550 Service Temaerature: (-65 to +300F) (-54 to +149C) Linear Expansion (mm/b): 7.3 x 10 -5 Hardness: Rockwell: M89 Decomposition Temp. (F): 437 ANL-RC: Generic Type: Retaining Compound Color: Green Viscosity (cps): 100-300 Fixture Time (min.): 5-25 Workina Time (hrs.): 2 Full Cure (hrs.): 24 Gap Filled (inch): .005 Specific Gravity: 1.08 Flash Point (F, TOC): 219 Corrosivity (MIL-S-22473D): none Toxicitv: Low Shelf Life (R.T.): 1 yr. min. Soluble In: Acetone, MEK, 1,l.l Trichloroethane Locking Torque Breakaway: 300-480 (in-lbs) Prevail: 220-440 Shear Strength (lb/in 2): 4260-5680 Service Temperature: (-65 to +3OOF) (-54 to +149C) Linear Expansion (mm/C): 4.6 x 10 -5 Hardness: Rockwell: Ml08 Decomposition Temp. (F): 496

Adhesives-General

PACER

TECHNOLOGY:

ANA-LOK

Anaerobic Compounds (Continued):

ANL-RC/HT: Generic Type: Retaining Compound Color: Green Viscosity (cps): 800-1100 Fixture Time (min.): lo-15 Working Time fhrs.): 2 Full Cure (hrs.): 24 Gap Filled (inch): .015 Specific Gravity: 1.12 Flash Point (F, TOC): 212 Corrosivity (MIL-S-22473D): none Toxicity: Low Shelf Life (R.T.): 1 yr. min. Soluble In: Acetone, MEK, l,l,l, Trichloroethane Locking Torque Breakaway: 87-175 Prevail: 174-347 (in-lbs) Shear Strength (lb/in 2): 2500-3700 Service Temperature: (-65 to +430F): (-54 to +232C) Linear Expansion (mm/C): 2.41 x 10 -5 Hardness: Rockwell: Ml12 Decomposition Temp. (F): 548

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PERMABOND INTERNATIONAL: QUICKBOND High Speed Toughened Acrylic Adhesive System: QUICKBOND 650, 612: QUICKBOND Toughened Adhesives are two-component, no-mix acrylic adhesives that offer convenience in assembly combined with excellent peel and impact resistance, shear strength and durability. Cure of adhesive is achieved by interfacial contact of adhesive with activator. The Adhesive System cures rapidly at room temperature and bonds to oily metals, cleaned metals and plastics. It does not contain solvents. The resultant adhesive bond is load bearing and resistant to ultra-violet, radiation, weathering, humidity and high temperature conditions. Features and Benefits: * No mixing errors causing poor performance * No-mix system eliminates waste due to premature cure * 100% reactive * Room temperature cure saves energy * Cures fast for handling strength in minutes * Versatile--bonds to most materials including oily surfaces Typical Applications: * outdoor protective strips * speaker magnets * magnet to motors * honing stones * PCS stiffeners * paddle boards * elevator doors * brackets * cork clutch * nameplates * tophat stiffeners to sheetmetal * solar panels * fishing lures 612 Adhesive: Viscosity @ 25C/77F: 20,000 cps Color: translucent Solvent: none Flashpoint: 8C/47F On-part life, max.: 3 minutes 650 Adhesive: Viscosity @ 25C/77F: 30,000 cps Color: translucent Solvent: none Flashpoint: 67C/l52F On-part life, max.: 15 minutes 610 Activator: Viscosity @ 25C/77F: 100 cps Color: amber Solvent: none Flashpoint: over 93C/200F On-part life, max.: 24 hours

Adhesives-General

PERMAGILE INDUSTRIES INC.: INSULBOND Industrial and Electrical Adhesives: INSULBOND "Tough-Line" Adhesives Combine Toughness of Nylon with Adhesion and Chemical Inertness of Epoxy 810: (810

L.V.): Feature: Adjustable Flexibility Catalyst & Ratio: Cure 22 Variable (Cure 24) Mixed Viscosity: 60,000 (30,000) Pot Life: 90 Shear Al/Al psi: 3,000 Max. Service Temperature C: 130 Thermal Conductivity BTU's: 2.5 Thermal Expansion X10 -6/C: 50 Dielectric Strength Volts/Mil: 400

802: (802 L.V.): Feature: Adjustable Flexibility Transparent Catalyst & Ratio: Cure 22 Variable (Cure 24) Mixed Viscosity: 20,000 (15,000) Pot Life: 75 Shear Al/Al psi: 2,500 Max. Service Temperature C: 130 Thermal Conductivity BTU's: 1.5 Thermal Expansion X10 -6/C: 80 Dielectric Strength Volts/Mil: 400 861: Feature: Low Density Catalyst & Ratio: INSULCURE 9 9 PHR Mixed Viscosity: 2,500 Pot Life: 25 Shear Al/Al asi: 1,500 Max. Service-Temperature C: 125 Thermal Conductivity BTU's: 1.0 Thermal Expansion Xi0 -6/C: 40 Dielectric Strength Volts/Mil: 350

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PERMAGILE INDUSTRIES INC.: INSULBOND Industrial and Electrical Adhesives (Continued): 825-M: Feature: Metal Patch Catalyst & Ratio: Mix A & B I:1 Ratio Mixed Viscosity: Thixotropic Pot Life: 30 Shear Life Al/Al psi: 2,100 Max. Service Temperature C: 125 Thermal Conductivity BTU's: 12 Thermal Expansion X10 -6/C: 20 Dielectric Strength Volts/Mil: N.A. T-BOND 830: Feature: Thixotropic 1 to 1 Ratio Catalyst & Ratio: Mix A & B I:1 Ratio Mixed Viscosity: Thixotropic Pot Life: 120 Shear Al/Al psi: 3,200 Max. Service Temperature C: 100 Thermal Conductivity BTU's: 4.0 Thermal Expansion X10 -6/C: 4.0 Dielectric Strength Volts/Mil: 400 815: Feature: Fire Retardant Adjustable Flexibility Catalyst & Ratio: INSULCURE 24 Variable Mixed Viscosity: 30,000 Pot Life: 90 Shear Al/Al psi: 3,000 Max. Service Temperature C: 130 Thermal Conductivity BTU's: 2.5 Thermal Expansion X10 -6/C: 50 Dielectric Strength Volts/Mil: 400

Adhesives-General

PERMAGILE INDUSTRIES INC.: INSULBOND Special Purpose Adhesives: 820: Feature: Fast Cure 6-8 Min. Gel Transparent Catalyst & Ratio: Mix A & B I:1 Mixed Viscosity CDS: 2,000 Pot Life Min.:-5-6 . Shear Al/Al psi: 2,500 Max. Service-Temperature C: 130 Thermal Conductivity BTU's: 1.5 Thermal Expansion X10 -6/C: 75 Dielectric Strength Volts/Mil: 375 860: Feature: Flexible High Peel Strength Catalyst & Ratio: Mix A & B 3:2 Mixed Viscosity cps: 8,000 Pot Life Min.: 25 Shear Al/Al osi: 2,500 Max. Service-Temperature C: 100 Thermal Conductivity BTU's: 1.5 Thermal Expansion Xi0 -6/C: 75 Dielectric Strength Volts/Mil: 370 850: Feature: Water White R.T. Cure Tough Catalyst & Ratio: Mix A & B 100:40 Mixed Viscositv ens: 1,000 Pot Life Min.:-25‘ Shear Al/Al psi: 2,000 Max. Service-Temperature C: 130 Thermal Conductivity BTU's: 1.5 Thermal Expansion X10 -6/C: 80 Dielectric Strength Volts/Mil: 400

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PERMAGILE INDUSTRIES INC.: INSULBOND Special Purpose Adhesives (Continued): 841: Feature: High Thermal Conductivity Hard/Rigid Catalyst & Ratio: INSULCURE 9 or 17 3-4 PHR 4-5 Mixed Viscosity cps.: 90,000 Pot Life Min.: 5 hrs. (11) Shear Al/Al psi: 2,000 Max. Service‘TempeGature C: 180 Thermal Conductivity BTU's: 10.3 Thermal Expansion Xi0 -6/C: 24 Dielectric Strength Volts/Mil: 500 833: Feature: Fire Retardant Conforms to U.L. 94V-0 Catalyst & Ratio: INSULCURE 9 or 11 5-6 PHR 7-8 Mixed Viscosity cps: 2,200 (9) Pot Life Min.: 45 Shear Al/Al psi: 1,500 Max. Service Temperature C: 155 Thermal Conductivity BTU's: 4.6 Thermal Expansion X10 -6/C: 40 Dielectric Strength Volts/Mil: 425 840: Feature: Non-Flowing Sealant/Filler Catalyst & Ratio: INSULCURE 9 or 11 6-7 PHR 8-9 Mixed Viscosity cps: Thixotropic Pot Life Min.: 30 (9) Shear Al/Al psi: 2,000 Max. Service Temperature C: 180 (11) Thermal Conductivity BTU's: 4.0 Thermal Expansion X10 -6/C: 40 Dielectric Strength Volts/Mil: 450

Adhesives-General

81

SAUEREISEN CEMENTS: Electric Heater Cement No. 6: Air-setting refractory for: * Appliances * Coatings * Embedding

* Heaters * Insulating * Molding

SAUEREISEN Electric Heater Cement No. 6 is a versatile high-temperature cement used for refractory coatings, lining furnaces, embedding electric heating elements, coating resistors, molding and insulating. No. 6 is supplied in powder form and need only be mixed with water to apply. Characteristics: * Resists oil, electricity, most solvents, and all acids (except hydrofluoric) * Resists temperatures up to 2500F (137OC) * Heat conductive and thermal shock resistant * Excellent abrasion resistance * Excellent for embedding and insulating * Withstands white heat * Can be applied to practically any surface * Air sets to extreme hardness * Odorless Physical Properties: Color: Tan to Gray Compessive strength: 2700 psi (189 kg/cm 2) Dielectric constant: 5.0-7.0 Dielectric strength: at 70F (2lC): 12.5 to 51.0 Volts/mil (490 to 2000 Volts/mm) at 750F (399C): (15.0 Volts/mil (59 Volts/mm) at 1475F (8OlC): (3.8 Volts/mil (149 Volts/mm) Maximum service temperature: 2500F (137OC) Shear strength: 300 psi (21 kg/cm 2) Tensile strength: 285 psi (20 kg/cm 2) Volume resistivity: at 70F (21C): 10 7 - 10 8 ohm-cm at 750F (398C): 10 4 - 10 5 ohm-cm at 1475F (8OlC): 10 2 - IO 3 ohm-cm

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SAUEREISEN CEMENTS: INSA-LUTE Adhesive Cement No. 1: Strong inorganic adhesive for: * Insulating * Appliances * Metals * Assembling * Sealing * Ceramics Characteristics: * Heat conductive and thermal shock resistant * Insulates electricity * Resists all acids (except hydrofluoric) * Resists oil and fire * Resists temperature to 1800F (982C) * More economical than resins or silicones * Replaces resins for high temperature applications * Good mechanical bond * Can be colored * One part cement, ready to use * Odorless Physical Properties: Coefficient of thermal expansion: 6.2 x 10 -6 in/in/F Color: Off white Compressive strength: 3900 psi (274 kg/cm 2) Dielectric constant: 3.5-6.0 Dielectric strength: at 70F (21C): 12.5 to 51.0 Volts/mil (490 to 2000 Volts/mm) at 750F (399C): (15.0 Volts/mil (588 Volts/mm) at 1475F (8OlC): cl.3 Volts/rail (51 Volts/mm) Maximum service temperature: 1800F (982C) Modulus of rupture: 460 psi (32 kg/cm 2) Shear strength: 710 psi (49 kg/cm 2) Tensile strength: 410 psi (28 kg/cm 2) Volume resistivity: at 70F (2lC): 10 8 - 10 9 ohm-cm at 750F (399C): 10 4 - 10 5 ohm-cm at 1475F (8OlC): 10 2 - IO 3 ohm-cm ALUSEAL Adhesive Cement No. 2: Strong ceramic adhesive for: * Insulating * Assembling * Bonding * Sealing Characteristics: * Insulates electricity * Heat conductive * Good mechanical bond * Thermal shock resistant Physical Properties: Coefficient of thermal expansion, 200-IOOOF: 7.6 x 10 -6 in/in/F Color: White Compressive strength, 7 days: 3600 psi Density: 153 pcf (2.45 gm/cm 3) Dielectric constant @ 70F: 107.2 Dielectric strength @ 70F: 49 volts/mil Dissipation factor @ 70F: 0.55 Maximum service temperature: 3000F

Adhesives-General

83

SAUEREISEN CEMENTS: INSA-LUTE Hi-Temp Cement No. 7: High-grade silica refractory for: * Heaters * Appliances * Soldering Irons * Assembling * Coating * Switches SAUEREISEN INSA-LUTE Hi-Temp Cement No. 7 is a highgrade silica cement used by leading electrical manufacturers for assembling, coating resistors, embedding resistance wires and high-temperature insulation applications. Characteristics: * Heat conductive and thermal shock resistant * Resists electricity * Resists oil, most solvents and all acids (except hydrofluoric) * Adheres to glass, porcelain, metal and wood * Resists temperature to 2500F (1371C) * Replaces organics for high heat protection * More economical than organics * Odorless Physical Properties: Coefficient of thermal expansion: 6.0 x 10 -6 in/in/F Color: White Compressive strength: 3500 psi (246.1 kg/cm 2) Dielectric constant: 3.5-6.0 Dielectric strength: at 70F (21C): 12.5 to 51.0 Volts/mil (490 to 2000 Volts/mm) at 750F (399C): ~15.0 Volts/mil (588 Volts/mm) at 1475F (802C): cl.3 Volts/mil (51 Volts/mm) Maximum service temperature: 2500F (1371C) Shear strength: 600 psi (42.2 kg/cm 2) Tensile strength: 400 psi (28.1 kg/cm 2) Volume resistivity: at 70F (21C): 10 8 - 10 9 ohm-cm at 750F (399C): IO 4 - 10 5 ohm-cm at 1475F (802C): 10 2 - 10 3 ohm-cm

84


SAUEREISEN

CEMENTS:

SAUEREISEN

Synthetic ceramic for: * Assembling * Insulating * Molding

Cement No. 31: * Potting * Refractories * Sealing

SAUEREISEN Cement No. 31 is a white, porcelain-like cement that is widely used throughout industry in a variety of applications, including assembling, sealing, insulating and cementing of porcelain, tile, ceramics, metal, wood and glass.

Characteristics: * Adheres to practically all surfaces that are clean and free of oil and grease * Resists oil, electricity, and most solvents * Heat conductive and thermal shock resistant * Resists all acids (except hydrofluoric) * Fireproof and qasproof * Resists temperatures to 1750F (954C) Physical Properties: Absorption: 13.8% Bond strength: 200 psi (14 kg/cm 2) Coefficient of thermal expansion: 6.5 x 10 -6 in/in/F (11.3 x 10 -6 cm/cm/C) Color: Off white Compressive strength: 2200 psi (154 kg/cm 2) Density: 121 pcf (1.94 gm/cm 2) Dielectric constant: 5.0-7.0 Dielectric strength: at 70F (21C): 12.5 to 38.0 Volts/mil (490 to 1490 Volts/mm) at 750F (399C): 12.5 to 38.0 Volts/mil (490 to 1490 Volts/ mm) at 1475F (8OlC): (2.0 Volts/mil (78 Volts/mm) Flexural strength: 455 psi (31 kg/cm 2) Linear shrinkage: 0.004 in/in (0.004 cm/cm) Maximum service temperature: 1750F (954C) Shear strength: 430 psi (30 kg/cm 2) Tensile strength: 400 psi (28 kg/cm 2) Volume resistivity: at 70F (21C): 10 9 - 10 11 ohm-cm at 750F (399C): 10 7 - 10 8 ohm-cm at 1475F (8OlC): 10 2 - 10 3 ohm-cm

AdhesivesGeneral

85

SAUEREISEN CEMENTS: SAUEREISEN Electric Insulating Cement No. 12: Excellent dielectric strength for: * Encapsulating * Embedding * Elements * Resistors * Potting * Assembling SAUEREISEN Electric Insulating Cement No. 12 is a two-part, inorganic cement used for applications requiring high dielectric strength and volume resistivity. However, the cement does not reauire firina at elevated temueratures to achieve its maximum properties. No. 12 will withstand temperatures to 2200F. No. 12 bonds extremely well to high alumina ceramics. Low shrinkage makes No. 12 an excellent cement for potting applications. No. 12 will not arc or support combustion. The cement does not give off toxic or noxious fumes during mixing, application, cure or heating. Characteristics: * High dielectric strength * Heat conductive and thermal shock resistant * Resists temperature to 2200F (1204C) * Oil and solvent resistant * Specially developed for potting and encapsulation * Excellent bond strength * Extremely hard surface upon setting/excellent abrasion resistance * Chemically setting at room temperature * Odorless Physical Properties: Coefficient of thermal expansion: 3.1 x 10 -6 in/in/F (5.58 x 10 -6 cm/cm/C) Color: Off white Compressive strength: 4000 psi (281 kg/cm 2) Density: 180 pcf (2.88 gm/cm 3) Maximum service temperature: 2200F (1204C) Modulus of rupture: 510 psi (35 kg/cm 2) Shrinkage: ~0.8% Tensile strength: 290 psi (20 kg/cm 2) Thermal conductivity: 8.0-11.0 Btu-in/ft 2-hr-F (2.74-3.77 x 10 -3 Cal-cm/cm 2-set-C)

86


SAUEREISEN CEMENTS: SAUEREISEN Electric Refractory Cement No. 350: SAUEREISEN Electric Refractory No. 350 is a chemicalsetting refractory cement for assembling and bonding ceramic shapes; potting: and coating electric heating elements, resistors and induction heating coils. It can be used as a wash coating for sand-resin bodies and as a refractory coating. No. 350 exhibits excellent coating properties and can be applied by dipping, spraying, pouring or automatic dispenser. Characteristics: * Refractory - withstands temperatures to 1700F (927C) * Heat conductive and thermal shock resistant * Insulates electricity * Resists oil, solvents and most acids * Excellent coating/potting properties * Odorless, non-toxic Physical Properties: Color: Gray Compressive strength: 2000 psi (141 kg/cm 2) Density: Wet: 124 pcf (1.99 gm/cm 3) Dry @ 220F (104C): 99 pcf (1.59 gm/cm 3) Dielectric strength @ 70F (21C): 3.26 volts/mil (127 volts/mm) Dielectric constant: 8.08 Flexural strength: 1100 psi (77 kg/cm 2) Maximum service temperature: 1700F (927C) Modulus of elasticity: 6.57 x 10 4 psi (4.5 x 10 3 kg/cm 2) Pot life: 1 hr Tensile strength: 507 psi (35.2 kg/cm 2)

Adhesives-General

87

SAUEREISEN CEMENTS: SAUEREISEN Electric Resistor Cement No. 78: Electrical refractory for: * Elements * Heaters * Hot Plates

* Irons * Ovens * Resistors

SAUEREISEN Electric Resistor Cement No. 78 is an ideal electrical refractory cement for coating resistors, coils, electric heating elements, furnaces, and embedding resistance wire. It replaces insulating varnish, enamel, mica, etc. The cement is also available in powder form known as SAUEREISEN Electric Resistor Cement No. P-78. When mixed with water to the proper consistency, No. P-70 has the same characteristics as No. 70. Characteristics: * Heat conductive and thermal shock resistant * Safely insulates electricity * Resists oil, solvents and most acids * Resists temperatures to 2600F (1427C) * Odorless Physical Properties: Coefficient of thermal expansion: 13.0 x 10 -6 in/in/F (23.4 x 10 -6 cm/cm/C) Color: Tan to Gray Compressive strength: 3300 psi (232 kg/cm 2) Dielectric constant: 3.4-4.5 Dielectric strength: at 70F (21C): 12.5 to 51.0 Volts/mil (490 to 2000 Volts/mm) at 750F‘(399C): (15.0 Volts/mil ?588 Volts/mm) at 1475F (8OlC): (1.3 volts/mil (51 Volts/mm) Maximum service temoerature: 2600F (1427C) Shear strength: 375.psi (26.4 kg/cm‘2) Tensile strength: 325 psi (22.8 kg/cm 2) Volume Resistivity: at 70F: 10 8 - 10 9 ohm-cm at 750F: 10 5 - IO 6 ohm-cm at 1475F: 10 3 - 10 4 ohm-cm

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SAUEREISEN

A * * *

CEMENTS:

SAUEREISEN

Electrical Cement No. DW-30:

porcelain-like sealer for: * Heaters Appliances * Insulating Elements * Cutlery Embedding

SAUEREISEN Electrical Cement No. DW-30 is an inorganic, chemically-setting, magnesium oxide base material which develops a slight expansion while hardening into a porcelain-like body. Since No. DW-30 is dimensionally stable from -1OOF to +900F and will not injure resistance wires at elevated temperatures, it is recommended for embedding heating elements and resistor wires. No. DW-30 is also recommended for cementing knife blades into plastic, ceramic, wood or metal handles, weighting candlesticks or similar items, or sealing set screws. No. DW-30 is supplied as a powder and need only be mixed with water to apply. Characteristics: Insulates electricity Refractory and fireproof Withstands temperatures to 900F (48X) Heat conductive and thermal shock resistant Resists water and most solvents Strong porcelain-like body Non-shrink Odorless Chemical set Physical Properties: Color: Tan/pink Compressive strength: 4500 psi (316 kg/cm 2) Density: 120 pcf (2 gm/cm 3) Maximum service temperature: 900F (482C) Tensile strength: 300 psi (21 kg/cm 2)

Adhesives-General

89

SAUEREISEN CEMENTS: SAUEREISEN Electrical Refractory Cement No. 75: Calcium Aluminate castable cement for: * Gunning * Corrosion Resistance * Potting * Assembling * Sealing * Thermal Shock SAUEREISEN Electrical Refractory Cement No. 75 is a castable, hydraulically-setting cement. It is recommended as a bonding mortar or refractory coating and for embedding, potting, sealing, assembling, encapsulating, and insulating. It has excellent thermal shock resistance. Characteristics: * Insulates electricity at high and low temperatures * Withstands temperatures to 2600F (1427C) * Heat conductive and thermal shock resistant * Unaffected by water and moisture * Low shrinkage * Resists solvents, alkalies, and mild acids * Resists impact and abrasion * Easy to use/odorless * Adheres to metal, ceramics, brick, and other surfaces * High strength * Good volume stability * Unaffected by carbon monoxide or other reducing atmospheres * Hardens by hydraulic set even in confined areas * More economical than organics Physical Properties: Autoclave expansion: 0.04% Compressive strength: 3500 psi (246 kg/cm 2) Density: 150 pcf (240 gm/cm 3) Flexural strength: 800 psi (56 kg/cm 2) Maximum service temperature: 2600F (1427C) pH range: 4.0 thru 12.0

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SAUEREISEN CEMENTS: SAUEREISEN ELECTROTEMP Cement No. 8: Superior electrical insulation for: * Appliances * Heaters * Elements * Pyrometers * Furnaces * Resistors SAUEREISEN ELECTROTEMP Cement No. 8 is primarily used where high electrical insulation and thermal conductivity are desired. No. 8 is a non-corrosive, chemical-setting zircon base cement ideal for potting applications subject to high temperature and/or thermal shock. No. 8 is supplied in powder form and need only to be mixed with water to apply. Characteristics: * Provides maximum electrical resistance * Heat conductive and thermal shock resistant * Excellent bonding properties * Chemical set * Easy to mix and apply * Ideal for potting applications * Odorless Physical Properties: Coefficient of thermal expansion: 2.6 x 10 -6 in/in/F Color: Off white Compressive strength: 4500-5500 psi (316 kg/cm 2) Density: 160 pcf (2.56 gm/cm 3) Dielectric constant: 3-O-4.0 Dielectric strength: at 70F (21C): 76.0 to 101.5 Volts/mil (2900 to 3900 Volts/mm) at 750F (398C): 25.0 to 38.0 Volts/mil (980 to 1490 Volts/mm) at 1475F (8OlC): 12.5 to 25.0 Volts/mil (490 to 980 Volts/mm) Maximum service temperature: 2600F (1426C) Modulus of rupture: 450 psi (31 kg/cm 2) Tensile strength: 250 psi (17 kg/cm 2) Thermal conductivity: IO-12 Btu-in/ft 2-hr-F (3.4-4.1 x 10 -3 Cal-cm/cm 2-set-C) Volume resistivitv: at 70F (21C): i0 10 - 10 11 ohm-cm at 750F (398C): 10 9 - IO 10 ohm-cm at 1475F (8OlC): 10 8 - 10 9 ohm-cm

Adhesives-General

SAUEREISEN CEMENTS: SAUEREISEN INSULTEMP Cement No. 10: Superior electrical insulation/thermal conductivity for: * Heating Elements * Resistors * Induction Coils * Light Bulb Assembly SAUEREISEN INSULTEMP No. 10 is primarily used where high electrical insulation and/or thermal conductivity are desired and it is impractical to use a cement which must be fired at a high temperature. No. 10 offers the highest thermal conductivity and lowest coefficient of thermal expansion, making it the ideal material for high temperature ceramic bonding/ potting applications. Characteristics: * Heat conductive and thermal shock resistant * High electrical resistance * Excellent bonding properties * Chemical set * Low shrinkage * Mix with water Physical Properties: Coefficient of thermal expansion: 2.26 x 10 -6 in/in/F (4.06 x 10 -6 cm/cm/C) Color: White Compressive strenqth, 7 days: 2,500 psi (175 kg/cm 2) Density: 146 pcf (2.34 qm/cm 3) Dielectric constant @ 70F: 6.86 Dielectric strength @ 70F: 55 Volts/mil (2090 volts/mm) Maximum service temperature: 2400F (1316C) Modulus of rupture: 800 psi Tensile strength: 400 psi Thermal conductivity: 18-20 Btu-in/ft 2-hr-F 6.15-6.83 Cal-cm/cm 2-set-C Volume Resistivity @ 70F: 1.46 x 10 10 ohm-cm

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SAUEREISEN CEMENTS: SAUEREISEN Low Expansion Cement No. 29: Zircon base cement for: * Assembling * Elements * Embedding

* Insulating * Resistors * Sealing

SAUEREISEN Low Expansion Cement No. 29 is an inorganic cement used for embedding heating elements; insulating thermocouples; coating resistors and coils; sealing and assembling parts which require high resistance to electricity, chemicals, and thermal shock; and aerospace applications. No. 29 adheres to glass, porcelain, ceramics, metals and other surfaces. Characteristics: * Resists water, oil, electricity, most solvents, and all acids (except hydrofluoric) * Resists temperatures to 1550F (843C) as well as cryogenic conditions * Excellent mechanical strength * Heat conductive and thermal shock resistant * Ceramic-like body * Odorless * Chemical set Physical Properties: Absorption: IO-12% Coefficient of thermal expansion: 4.6 x 10 -6 in/in/F (8.28 x 10 -6 cm/cm/C) Color: Tan Compressive strength: 3900 psi (274 kg/cm 2) Density:,141 pcf (2.26 gm/cm 3) Dielectric constant: 5-O-7.0 Dielectric strength: at 70F (21C): 25.0 to 51.0 Volts/mil (980 to 2000 Volts/mm) at 750F (399C): 12.5 to 25.0 Volts/mil (490 to 980 Volts/ mm) at 1475F (8OlC): Cl.3 Volts/mil (51 Volts/mm) Maximum service temperature: 1550F (843C) Shrinkage: 0.50% Tensile strength: 425 psi (29 kg/cm 2) Thermal conductivity at 500F (260C): 8 Btu-in/ft 2-hr-F (2.7 x 10 -3 Cal-cm/cm 2-set-C!) Volume resistivity: at 70F (21C): 10 7 - IO 9 ohm-cm at 750F‘(399C): 10 4 - 10 6 ohm-cm at 1475F (8OlC): 10 2 - 10 3 ohm-cm

Adhesives-General

SHELDABL: SHELDAHL Bonding Materials: Unsupported Acrylic Adhesive T1615 (MUC): T1615 is an unsupported acrylic adhesive on a release carrier. This cast adhesive can be used in a variety of bonding applications. It has excellent adhesion to polyimide film, copper foils, (treated and untreated) and etched circuits as a bond ply. * * * * *

Excellent shelf life stability at ambient temperatures. Excellent dimensional stability during adhesive bonding. Lot-to-lot consistency. Low flow adhesive system minimizes adhesive squeezeout. Excellent electrical properties.

Properties: Peel Strength: As received: Treated copper: 8.0 lbs/in Shiny copper: 5.0 lbs/in After solder: Treated copper: 8.0 lbs/in Shiny copper: 5.0 lbs/in After thermal cvclins: Treated conoer: 8.0 lbs/in __ Dimensional Stability: _ Method B: .OOl" in/in Method C: .002" in/in Adhesive Flow: .005" in. Volatile Content: 1.5% volatiles Solder Float: 5 minutes: 550F 30 seconds: 600F Chemical Resistance: % of As Received Peel Strength: Isopropyl Alcohol: 90 Toluene: 90 MEK: 90 Methylene Chloride/Trichloroethylene (50/50): 90 2N NHCl: 90 2N NaOH: 90 RISTON Stripper S 1100X: 90 Sequential: Methylene Chloride: 2N NaOH: 90 2N H2S04: Insulation Resistance: 1 x 10 5 Dielectric Strength: 1000 Moisture Absorption: 5.5

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SHELDAHL FLEXCONNECT Materials Thermoplastic Polyester Adhesive T-100, T-300, T-400:

SHELDAHL:

T-100: Unsupported Adhesive T-300: Adhesive on Polyester Film T-400: Adhesive on Both Sides of Polyester Film Unsealed tape is milky-white becoming clear when sealed: Visible evidence of seal Not sticky or tacky: Easy to apply Solvent-free adhesive system: No drying time Thermally activated adhesive system: Allows efficient processing High bond strength to a variety of substrates Five year shelf life when stored in ambient conditions T-100: 2.5 mil polyester based thermoplastic resin Physical: Ultimate tensile strength, psi: 840 Elongation %: 550 Propagating tear strength gm/mil: 152 Initial tear strenqth sm/mil: 160 Moisture Absorption %:-I;2 Water Vapor Permeability: 89.0 Hvdrosen Permeability: 277 F&g& Resistance: Inert Shelf Life, Yrs: >5 Bond Strength lb/in: 4 Density: 1.26 Dimensional: Area Factor ft Z/lb/mil: 153 Thickness Tolerance, %: +-lo max. Thermal: Melting Temperature Range F: 280-340 Service Temperature Intermittent, F: 260 Service Temperature Continuous, F: 180 El.ectrical: Dielectric Strength, volts/mil: 1000 Dielectric Constant: 4.6 Dissipation Factor: .13 Volume Resistivity ohm/cm: 1x10 13 Surface Resistivity, ohms: 3x10 9

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95

SHELDAHL: SHELDAHL FLEXCONNECT Materials Thermoplastic Polyester Adhesive T-100, T-300, T-400 (Continued): T-300: I mil polyester resin on 1 mil polyester film Physical: Ultimate tensile strength, psi: 22,200 Elongation %: 120 Tensile modulus. osi: 500,000 Propagating tear strength'gm/mil: 85.5 Initial tear strength gm/mil: 222 Folding endurance I/2 kg loading: 50,000 Moisture Absorption %: 0.8 Water Vapor Permeability: 1.0 Hydrogen Permeability: 235 Fungus Resistance: Inert Shelf Life, Yrs.: >5 Bond Strength lb/in: 4 Density: I.33 Dimensional: Area Factor ft 2/lb/mil: 146 Thickness Tolerance, 8: +-lo max. Coefficient of linear expansion, inch/F: 1.5x10 -5 Coefficient of hygroscopic expansion inches/inch/% R.H.: 11x10 -6 Thermal: Melting Service Service Thermal

Temperature Range F: 280-340 Temperature Intermittent, F: 260 Temperature Continuous, F: 180 Shrink I/2 hr at 300F, 8: 1.25

Electrical: Dielectric Strength. volts/mil: 4000 Dielectric Constant: 3.4 Dissipation Factor: 0.005 Volume Resistivity ohm/cm: 1x10 17 Surface Resistivity, ohms: 5x10 II

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SHELDAHL: SHELDAHL FLEXCONNECT Materials Thermoplastic Polyester Adhesive T-100, T-300, T-400 (Continued): T-400: 1 mil polyester resin on both sides of 2 mil polyester film Physical: Ultimate tensile strength, psi: 22,200 Elongation %: 130 Tensile modulus, psi: 550,000 Propagating tear strength gm/mil: 70 Initial tear strength gm/mil: 250 Folding endurance l/2 kg loading: 50,000 Moisture Absorption %: 0.8 Water Vapor Permeability: 1.0 Hydrogen Permeability: 200 Fungus Resistance: Inert Shelf Life, Yrs.: >5 Bond Strength lb/in: 4 Density: 1.33 Dimensional: Area Factor ft Z/lb/mil: 146 Thickness Tolerance, %: +-lo max. Coefficient of linear expansion, inch/F: 1.5x10 -5 Coefficient of hygroscopic expansion inches/inch/% R.H.: 11x10 -6 Thermal: Melting Service Service Thermal

Temperature Range F: 280-340 Temperature Intermittent, F: 260 Temperature Continuous, F: 180 Shrink l/2 hr at 300F, 8: 1.25

Electrical: Dielectric Strength, volts/mil: 3500 Dielectric Constant: 3.3 Dissipation Factor: 0.005 Volume Resistivity ohm-cm: 1x10 17 Surface Resistivity, ohms: 3x10 9

Adhesives-General

3M

co.: High Performance Adhesives for the Electrical and Electronics Industry:

Two-Part Epoxies: SCOTCH-WELD DP-100 Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 1:l Color: Clear Viscosity (cps): B-12,000 A-14,000

@ 23C

Mixed Work Life @ 23C: 3-5 Min. Handling Strength @ 23C: 15-20 Min. Full Cure Schedule: 24-28 Hr. @ 23C or 1-2 Hr. @ 65C Shore D Hardness: 81 Comments: Low viscosity Rigid Good for component sealing Clear Meets corrosion resistance requirements Mil-S-46163 SCOTCH-WELD DP-100 NS Epoxy Adhesive: Base Resin: Epoxy Mix Ratio: I:1 Color: Translucent Viscosity (B:A): B-100,000 A- 90,000 @ 23C Mixed Work Life (a 23C: 3-5 Min. Handling Strength @ 23C: 15-20 Min. Full Cure Schedule: 24-48 Hr. @ 23C or l- 2 Hr. @ 65C Shore D Hardness: 80-85 Comments: Non-sag version of DP-100 SCOTCH-WELD DP-110 Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): I:1 Color: Translucent Gray Viscosity (cps): B: 30,000 A: 30.000 (d 23C Mixed Work Life @ 23C:'9-IO-Min. Handling Strength @ 23C: 20-30 Min. Full Cure Schedule: 48-72 Hr @ 23C or I- 2 Hr:' @ 65C Shore D Hardness: 40-45 Comments: Flexible Translucent/Gray Fast cure Good for structural bonding

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3M CO.: High Performance Adhesives for the Electrical and Electronics Industry(Continued): Two-Part Epoxies(Continued): SCOTCH-WELD DP-190 Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 1:l Color: Gray Viscosity (cps): B-100,000 A- 52,000 @ 23C Mixed Work Life @ 23C: 90 Min. Handling Strength @ 23C: 12-16 Hr. Full Cure Schedule: 7D @ 23C or 2 Hr. @ 65C Shore D Hardness: 76 Comments: High flexibility Good adhesion to metals, ceramics & plastics Good for structural bonding SCOTCH-WELD DP-260 Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 1:l Color: Translucent Viscosity (cps): B-90,000 A-50,000 @ 23C Mixed Work Life (a 23C: 50-60 Min. Handling Strength @ 23C: 4-6 Hr. Full Cure Schedule: 2D @ 23C or 1 Hr. @ 80C Shore D Hardness: 83 Comments: Noncorrosive to copper Meets corrosion resistance requirements of Mil-S-4616 Non-exothermic potting compounds Clear version is crystal clear SCOTCH-WELD DP-270 Potting Compound/Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 1:l Color: Clear Biack Viscosity (cps): B-22,000 ~-18,000 @ 23C Mixed Work Life @ 23C: 60-70 Min. Handling Strength @ 23C: 4-6 .Hr. Full Cure Schedule: 2D @ 23C or 1 Hr. @ 80C Shore D Hardness: 82 Comments: Noncorrosive to copper Meets corrosion resistance requirements of Mil-S-46163 Non-exotherming potting compounds Clear version is crystal clear

Adhesives-General

3M CO.: High Performance Adhesives for the Electrical and Electronics Industry(Continued): Two-Part Epoxies(Continued): SCOTCH-WELD DP-420 EPOXY Adhesive: Base Resin: Epoxy- Mix Ratio (B:A): 2:l Color: Off White Viscosity (cps): B-80,000 A-10,000 @ 23C Mixed Work Life @ 23C: 20 Min. Handling Strength @ 23C: 2-3 Hr. Full Cure Schedule: 3-4 D @ 23C l-2 Hr. @ 65C Shore D Hardness: 80 Comments: High peel and shear strength Excellent durability Controlled flow SCOTCH-WELD DP-460 Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 2:l Color: Off White Viscosity (cps): B-80,000 A-10,000 @ 23C Mixed Work Life @ 23C: 60 Min. Handling Strength @ 23C: 4-6 Hr. Full Cure Schedule: 7D @ 23C or 2 Hr. @ 65C Shore D Hardness: 80 Comments: High peel and shear strength Excellent durability Controlled flow SCOTCH-WELD 1838 B/AL Epoxy Adhesive: Base Resin: Epoxy Mix Ratio (B:A): 1:l Color: Translucent Viscosity (cps): B-11,000 A-10,000 @ 23C Mixed Work Life @ 23C: 90 Min. Handling Strength @ 23C: 8-10 Hr. Full Cure Schedule: 7D @ 23C or 2 Hr. @ 65C Shore D Hardness: 66 Comments: Excellent environmental resistance Low viscosity Rigid Good for potting

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3M co. : High Performance Adhesives for the Electrical and Electronics Industry(Continued): Two-Part Urethanes: SCOTCH-WELD DP-605 Urethane Adhesive: Base Resin: Urethane Mix Ratio (B:A): I:1 Color: Off White Viscosity (cps): B-100,000 A-175.000 B 23C Mixed work Life @ 23C:'3-5 Min. Handling Strenqth @ 23C: 15-20 Min. ~~11 Cure Schedule: 24-48 Hr. @ 23C l-2 Hr. @ 65C Shore D Hardness: 50 Comments: Very flexible, Shore A Hardness--92 Impact resistant Non-sag Excellent plastic adhesion One-Part Epoxies: SCOTCH-WELD 1386 Epoxy Adhesive: Base Resin: Epoxy Color: Cream Viscosity (cps): Syrup 200,000 @ 23C Full Cure Schedule: 60 Min @ 177C or 10 Min @ 204C or 5 Min @ 232C Shore D Hardness: 75 Comments: High strength at elevated temperatures Good impregnation resin Meets Mil-A-8623A, Type III SCOTCH-WELD 2214 Regular Epoxy Adhesive: Base Resin: Epoxy Color: Gray Viscosity (cps): Paste 130 Set @ 23C Full Cure Schedule: 40 Min @ 12lC or 10 Min @ 149C or 5 Min @ 177C Shore D Hardness: 81 Comments: High temperature resistant High impact strength Metallic filled Meets MMM-A-132, Type 1, Class 3

Adhesives-General

3M CO.: High Performance Adhesives for the Electrical and Electronics Industry(Continued): One-Part Epoxies(Continued): SCOTCH-WELD 2214 Hi-Flex Epoxy Adhesive: Base Resin: Epoxy Color: Gray Viscosity (cps): Paste 200 Set @ 23C Full Cure Schedule: 40 Min. @ 121C or 10 Min. @ 149C or 5 Min. @ 177C Shore D Hardness: 81 Comments: Flexible Deaerated Metallic filled SCOTCH-WELD 2214NMF Epoxy Adhesive: Base Resin: Epoxy Color: Cream Viscosity (cps): Paste 100 Set @ 23C Full Cure Schedule: 40 Min. @ 121C or 10 Min. @ 149C or 5 Min. @ l77C Shore D Hardness: 84 Comments: Good electrical properties Non-metallic filled SCOTCH-WELD 2290 Epoxy Adhesive: Base Resin: Epoxy Color: Amber Viscosity (cps): Solution 40-80 cps Full Cure Schedule: Dry 15 Min. @ 121C (B-Stage) Cure 30 Min. @ 177C Shore D Hardness: Comments: 21% solids, B-stageable Passes solder float @ 288C Hot Melts: --___ JET-MELT 3748 Hot Melt Adhesive: Base Resin: Polypropylene Color: Translucent Viscosity (cps): 5000 @ 19OC Bonding Range/Set Time: 45-50 sec. Shore D Hardness: 25 Comments: Excellent hot/cold thermal shock resistance Noncorrosive to copper Good polyolefin adhesion UL94 v-2

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3M CO.: High Performance Adhesives for the Electrical and Electronics Industry(Continued): Hot Melts(Continued): JET-MELT 3764 Hot Melt Adhesive: Base Resin: Ethylene vinyl acetate Color: Clear Viscosity (cps): 10,500 @ 19OC Boiling Range/Set Time: 35-40 sec. Shore D Hardness: 18 Comments: Bonds to polyolefins Good shock resistance Low cost, clear UL 94 v-2 JET-MELT 3779 Hot Melt Adhesive: Base Resin: Polyamide Color: DK Amber Viscosity (cps): a000 @ 19OC Bonding Range/Set Time: 25-30 sec. Shore D Hardness: 45 Comments: High temperature resistance UL 94 v-o Cyanoacrylates: PRONTO CA-4OH Instant Adhesive: Base Resin: Cyanoacrylate (ethyl) Color: Clear Viscosity (cps): 400-600 @ 23C Bonding Range/Set Time: l-30 Set w/o Activator Full Cure Schedule: 12-24 Hr. @ 23C Shore D Hardness: 83 Comments: Higher viscosity version of CA-40 Meets Mil-A-46050C PRONTO CA-50 Gel Instant Adhesive: Base Resin: Cyanoacrylate (ethyl) Color: Clear Viscosity (cps): 50,000 @ 23C Bonding Range/Set Time: 60-120 Set w/o Activator Full Cure Schedule: 12-24 Hr. @ 23C Shore D Hardness: M73 Rockwell Comments: Slowest cure time Non-sag, non-running Allows .020" gap filling

Adhesives-General

High Performance Adhesives for the Electrical and Electronics Industry(Continued):

3M co.:

Cyanoacrylates(Continued): PRONTO CA-100 Instant Adhesive: Base Resin: Cyanoacrylate (ethyl) Color: Clear Viscosity (cps): 3000 @ 23C Boiling Range/Set Time: 35-60 Sec. w/o Activator Full Cure Schedule: 12-24 Hr. @ 23C Shore D Hardness: M50 Rockwell Comments: Slow cure Tough, impact resistant Meets Mil-A-46050C, Type II, Class 3 Bondinq Film: SCOTCH-WELD 4060 Thermoplastic Film Adhesive: Base Resin: Ethvlene Acrvlic Acid Co-oolvmer _ _ Color: Translucent Viscosity (cps): 3 mil and 5.5 mil unsupported film Full Cure Schedule: Bring Bondline to 150C then cool Shore D Hardness: 52 Comments: Thermoplastic film Low flow at bonding temperature Excellent solvent resistance Shore A Hardness--93

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THERMOSET PLASTICS, INC.: Electronic Grade Adhesives One Component/Elevated Temperature Curing: EP-233: Thixotropic formula with a slight degree of flow for venetration into bonds. Available in several colors and viscosities. Good thermal conductivity. Mixed Viscosity: Thixotropic, slightly flowable Mix Ratio: One Part Shelf Life @ 25C: 3-6 MO. Typical Cure Schedule: 60 Min. @ 12OC Method of Application: Automatic Dispensing/Syringe Weight of Tubular Extrusion: 0.00372 lbs (1.6867 grams) Specific Gravity @ 25C: 1.68 Color Resin/Hardener Mixed: Gray Tensile Shear Strength @ 25C (Substrate indicated): 1,800 psi (Al/Al) DC-232: Clear, low viscosity, unfilled. Provides excellent impregnation to fine void spaces. Formulated with a degree of high temperature flexibility to withstand thermal cycle stress. Appropriate for closely fitting substrates. Mixed Viscosity @ 25C: 1,500 cps Mix Ratio: One Part Approx. Shelf Life @ 25C: 3 MO. Typical Cure Schedule: 4-6 Hrs. @ 12OC Method of Application: Brush/Automatic Dispensing/Syringe Weight of Tubular Extrusion: 0.00237 lbs (1.0743 grams) Specific Gravity @ 25C: 1.07 Color Resin/Hardener Mixed: Clear Tensile Shear Strength @ 25C (Substrate indicated): 1,700 psi (Al/Al) EP-539: High peel strength, thermally conductive, moderately fast curing. High viscosity, but slightly flowable. Mixed Viscosity @ 25C: 250,000 cps Mix Ratio: One Part Approx. Shelf Life @ 25C: l-3 MO. Tvnical Cure Schedule: 40 Min B 12OC Method of Application: Automatic Dispense/Syringe Weight of Tubular Extrusion: 0.00418 lbs (1.8976 grams) Specific Gravity @ 25C: 1.89 Color Resin/Hardener Mixed: Black Tensile Shear Strength @ 25C (Substrate indicated): 2,000 psi (Al/Al)

Adhesives-General

THERMOSET PLASTICS, INC.: Electronic Grade Adhesives One Component/Elevated Temperature Curing (Continued): EP-548: Light bodied paste. Very fast cure. Frequently used in high volume bonding of small dimension parts. Mixed Viscosity @ 25C: Paste Mix Ratio: One Part Approx. Shelf Life @ 25C: 2 MO. Typical Cure Schedule: 2 Min. @ 130C (at bond line) Method of Application: Automatic Dispense/Syringe Weight of Tubular Extrusion: 0.00261 lbs (1.847 grams) Suecific Gravitv B 25C: 1.18 Color Resin/Hardener Mixed: Yellow Tensile Shear Strength @ 25C (Substrate indicated): 1,500 psi (Al/Al) EP-598: Heavy bodied paste which will not sag on a vertical surface during an elevated temperature cure. Mixed Viscosity @ 25C: Paste Mix Ratio: One Part Approx. Shelf Life @ 25C: 2 MO. Typical Cure Schedule: 2 Hrs. @ 12OC Method of Application: Automatic Dispense/Spatula Weight of Tubular Extrusion: 0.00338 lbs. (1.5361 grams) Specific Gravity @ 25C: 1.53 Color Resin/Hardener Mixed: Tan Tensile Shear Strength @ 25C (Substrate indicated): 1,900 psi (Al/Al)

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THERMOSET PLASTICS, INC.: Surface Mount Adhesives: standard Syringe Dispense: ME 147: Yellow Viscosity @ 25C (cP): 125,000 Thixotropic Index (lRPM/lORPM): 4.8 Specific-Gravity: 1.21 Cure Schedule (IR Oven): 2 minutes @ 12OC Pot Life (Weeks @ RT): 3 Shear Strength (psi): 2,500 Thermal Conductivity (W/mK): 0.2 Syringe Dispense for High Stand-off Components and Screen Printing: ME 160: Red Other Application Methods: Hardware Pin Transfer Viscosity @ 25C (cP): 200,000 Thixotropic Index (lRPM/lORPM): 6.5 Specific Gravity: 1.13 Cure Schedule (IR Oven): 2 Minutes @ 120C Pot Life (Weeks @ RT): 3 Shear Strength (psi): 2,500 Thermal Conductivity (W/mK): 0.2 Hardware Pin Transfer: ME 133: Yellow Other Application Methods: Syringe Dispense/Screen Print Viscosity @ 25C (cP): 100,000 Thixotropic Index (lRPM/lORPM): 4.0 Specific Gravity: 1.21 Cure Schedule (IR Oven): 2 minutes @ 120~ Pot Life (Weeks @ RT): 3 Shear Strength (psi): 2,500 Thermal Conductivity (W/mK): 0.2

Adhesives-General

THERMOSET PLASTICS, INC.: Surface Mount Adhesives

(Continued):

Hardware Pin Transfer(Continued): ME

161: Red Other Application Methods: Syringe Dispense/Screen Print Viscosity @ 25C (cP): 350,000 Thixotropic Index (lRPM/lORPM): 7.0 Specific Gravity: 1.13 Cure Schedule (IR Oven): 2 minutes @ 120C Pot Life (Weeks @ RT): 3 Shear Strength (psi): 2,500 Thermal Conductivity (W/mK): 0.2

ME 163: Red Other Application Methods: Syringe Dispense/Screen Print Viscosity @ 25C (cP): 150,000 Thixotropic Index (lRPM/lORPM): 5.0 Scecific Gravitv: 1.13 &re Schedule (IR Oven): 2 minutes @ 120C Pot Life (Weeks @ RT): 3 Shear Strength (psi): 2,500 Thermal Conductivity (W/mK): 0.2 Software Pin Transfer: ME 127: Yellow Other Application Methods: Syringe Dispense Viscosity @ 25C (cP): 36,000 Thixotrocic Index (lRPM/lORPM): 2.5 Specific-Gravity: i.22 Cure Schedule (IR Oven): 2 minutes @ 120C Pot Life (Weeks @ RT): 3 Shear Strength (psi): 1,500 Thermal Conductivity (W/mK): 0.2

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J.H. YOUNG CO., INC.: Temporary Adhesives and Waxes: The J.H. Young Company manufactures a line of temporary adhesives and waxes. In general, these products are used to hold down glass lenses, prisms, semiconductors, or ceramics and ferrites during all phases of production. These waxes are used when mechanical clamping is not reasonable. They are temporary, and are easily removed when the process is complete, using a solvent or other means. The terms used in the industry, such as "wax" and "pitch" often have little to do with the ingredients of these materials. Here are some common applications: Semiconductors: Most work in semiconductors or ceramics would use stacking waxes. Applications include polishing and dicing. The 7036 is widely used in these fields because of its resistance to solvents and pH extremes. (7036 is easily removed with acetone). Application details vary widely with circumstances. The best bonds are achieved when the workpiece, the substrate and the wax are all at least warm (roughly 200F, IOOC). Naturally, the thinnest glue line is achieved when all are hot (roughly 400F, 2OOC). For some users, a hair-dryer may provide the necessary heat. Ceramics: The chief application in ceramics is in polishing recording heads, mostly for computer disks. Blocking: An inexpensive material is generally used to hold lenses with a noticeable curvature to an alumimum or cast iron block. Blanchard Grinding: A Blanchard Grinder is used to grind a lens blank to the intended curvature. Stacking or Edging: Many flat pieces are stacked together so the edges may be ground to size. Centering: A finished lens is mounted against the end of a tube which fits in a lathe. Polishing Other

Section II Adhesives Cyanoacrylate

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APPLE ADHESIVES INC.: SUPERSET Cyanoacrylate Adhesives: SUPERSET increases productivity and offers substantial cost saving advantages: - Eliminates fastening procedures such as drilling, tapping, riveting, brazing, soldering, etc. saving time, space and manpower. - Eliminates heat curing. - Eliminates clamping. - Frees up space required to store parts during bond cure. - Can be automatically dispensed. SUPERSET is convenient and easy to use: - Applies directly from bottle. - Contains no solvents. - Is non-flammable. - Does not require special ventilation equipment. SUPERSET improves product design: - Eliminates the need for bulky fasteners. - Improves strength by the reduction of stress points associated with metal fasteners. - Reduces weight by the elimination of metal fasteners. - Provides more variety due to the ability to bond dissimilar materials without special assembly techniques and the ability to use materials which cannot be brazed, welded or soldered. SUPERSET Cyanoacrylate Adhesives are available in two different types: Ethyl and Methyl. Ethyl Cyanoacrylates are recommended for use where bonding rubber and plastic together or in combination with metals. Methyl Cyanoacrylates are recommended when bonding metal to metal. SUPERSET Accelerator: SUPERSET Adhesives are the fastest and most economical approach to bonding. They can be used on an unlimited number of substrates of similar materials. However, when bonding dissimilar metals or surfaces that contain an acidic residue, a slow or inhibited cure may result. This can easily be prevented by the use of SUPERSET Accelerator. SUPERSET Accelerator can also be used to lessen cure time of higher viscosity SUPERSET grades, especially where gaps or voids exist up to .020", and to prevent whitening. SUPERSET Adhesives meet Military Specification MIL-A-46050B as follows: Type I Class 2--SUPERSET 170E, 175M Type I Class I--SUPERSET 104E, 103M

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111

APPLE ADHESIVES, INC.: SUPERSET Cyanoacrylate Adhesives (Continued): Liquid Adhesive (Monomer): 104E: Resin: Ethyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - Very Fast Setting - Low Viscositv - Penetrating action - Parts should be closely matched Setting Time (Sec.): 15 Specific Gravity: i-046 Viscosity (cps) @ 20C: 2-3 Flash Point:.80C (176F) Soluble in: MEK. Acetone, Nitromethane Shelf Life @ 5OC (moS.):'l4 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer): 104E: Appearance: Colorless, Transparent and Solid Specific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.26 Softening Temp.: 145C (293F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 1.26 Dielectric Constant (0 10 MHZ): 3.5 Dielectric Loss (8 10 MHZ): 0.066 LOW Temperature Resistance: -8OC/24 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 85 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in acetone, (MEK) methylethylketone, nitromethane, (DMF) dimethylformamide, dimethyl sulfoxide.

112


APPLE ADHESIVES INC.: SUPERSET Cyanoacrylate Adhesives (Continued): Liquid Adhesive Monomer: 170E: Resin: Ethyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - Fast Setting - Medium Viscosity - Parts should be closely matched - Moderate strength on hard to bond plastics such as polyethylene and polypropylene Setting Time (Sec.): 30 Soecific Gravitv: 1.046 Viscosity (cps)-@ 20C: 50-75 Flash Point: 80C (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life @ 50C (mos.): 14 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer): 170E Appearance: Colorless, Transparent and Solid Specific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.26 Softening Temp.: 145C (293F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 1.26 Dielectric Constant (@ 10 MHZ): 3.5 Dielectric Loss (@ 10 MHZ): 0.066 Low Temperature Resistance: -8OC/24 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 85 Weather Resistance: No noticeable change observed after 216 hours (Corresoondina 1 Yr.) Maximum Cure Time: 24 Hours _ Solubility: Soluble in acetone, (MEK) methylethylketone, nitromethane, (DMF) dimethylformamide, dimethyl sulfoxide


113

APPLE ADHESIVES INC.: SUPERSET Cyanoacrylate Adhesives (Continued): Liquid Adhesive (Monomer): 180E: Resin: Ethyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - For use in bonding wood, plastic and other porous materials - Very fast setting - High viscositv Setting-Time (Sec.7: 15 Specific Gravity: 1.046 Viscosity (cps)-@ 20C: 250-350 Flash Point: 80C (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life @ 50C (mos.): 14 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point 8 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer): 180E: Appearance: Colorless, Transparent and Solid Specific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.26 Softening Temp.: 145C (293F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 126 Dielectric Constant (@ 10MHZ): 3.5 Dielectric Loss (@ 10 MHZ): 3.5 Low Temperature Resistance: -8OC/24 Hrs (-112F) No Change Vol. Insulation Resistance (ohm-cm 8 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 85 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in acetone, (MEK) methylethylketone, nitromethane, DMF (dimethylformamide), dimethyl sulfoxide

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SUPERSET

Cyanoacrylate Adhesives

(Continued): Liquid Adhesive (Monomer): 198E: Resin: Ethyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - Very High Viscosity - Bonds irregular surfaces - Excellent for bonding rubber and plastic parts - Slower setting allows for adjustment of parts Settina Time (Sec.): 45 Specific Gravity: 1.046 Viscosity (cps) @ 20C: 1300-1700 Flash Point: 80C (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life @ 50C (mos.): 14 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer): 198E: Appearance: Colorless, Transparent and Solid Soecific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.26 Softening Temp.: 145C (293F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 1.26 Dielectric Constant (@ IOMHZ): 3.5 Dielectric Loss (@ IOMHZ): 0.066 Low Temperature Resistance: -8OC/24 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 20C) (Value x 10 12): 8.5 Hardness (Shore A): 85 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in acetone, (MEK) methylethylketone, nitromethane, DMF (dimethylformamide), dimethyl sulfoxide

Adhesives-Cyanoacrylte

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(Continued): Liquid Adhesive (Monomer): 103M: Resin: Methyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - Fast Setting - Low Viscosity - Penetrating action - Parts should be closely matched - Bonds Metals Setting Time (Sec.): 25 Specific Gravity: 1.046 Viscosity (cps) @ 20C: 2-3 Flash Point: 80C (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life (a 50C (mos.): 14 Refractive Index inZO/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer) 103M: Appearance: Colorless, Transparent and Solid Specific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value of 10 -4): 1.22 Softening Temp.: 165C (329F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 1.26 Dielectric Constant (@ 10 MHZ): 3.3 Dielectric Loss (a 10 MHZ): 0.066 Low Temperature Resistance: -8OC/24 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 8.5 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in nitromethane and dimethyl-formamide (DMF)

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APPLE ADHESIVES INC.: SUPERSET Cyanoacrylate Adhesives (Continued): Liquid Adhesive (Monomer): 175M: Resin: Methyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - Fast Setting - Medium Viscosity - Parts should be well matched Setting Time (Sec.): 40 Specific Gravity: 1.046 Viscosity (cps)-@ ZOC: 50-100 Flash Point: 8OC (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life @ 50C (mos.): 14 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6 mm Hg.: 65C (149F) Cured Adhesive (Polymer): 175M: Appearance: Colorless, Transparent and Solid Snecific Gravitv: 1.25 Refractive Inde; (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.22 Softeninu Temo.: 165C (329F'3 Coef. of-Thermal Exp. iin/in F) (Value x 10 -4): 1.26 Dielectric Constant (@ 10 MHZ): 3.3 Dielectric Loss (@ IO MHZ): 0.066 Low Temperature Resistance: -8OC/24 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 90 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in nitromethane and dimethyl-formamide (DMF)


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117


(Continued): Liquid Resin (Monomer): 185M: Resin: Methyl Cyanoacrylate Appearance: Colorless and Transparent Characteristics: - High Viscosity - Bonds irregular surfaces - Bonds Metals - Slow setting allows adjustment of parts Setting Time (Sec.): 55 Specific Gravity: 1.046 Viscosity (cps) @ 20C: 300-500 Flash Point: 80C (176F) Soluble in: MEK, Acetone, Nitromethane Shelf Life @ 50C (mos.): 14 Refractive Index (n20/DC): 1.439 Frozen State Melting Point: 2C (35F) Boiling Point @ 6mm Hg.: 65C (149F) Cur

.ed Adhesive (Polymer): 185M: Appearance: Colorless, Transparent and Solid Specific Gravity: 1.25 Refractive Index (n20/DC): 1.49 Coef. of Linear Exp. (Value x 10 -4): 1.22 Softening Temp.: 165C (329F) Coef. of Thermal Exp. (in/in F) (Value x 10 -4): 1.26 Dielectric Constant (8 10 MHZ): 3.3 Dielectric Loss (8 10 MHZ): 0.066 Low Temperature Resistance: -800124 Hrs. (-112F) No Change Vol. Insulation Resistance (ohm-cm @ 2OC) (Value x 10 12): 8.5 Hardness (Shore A): 90 Weather Resistance: No noticeable change observed after 216 hours (Corresponding 1 Yr.) Maximum Cure Time: 24 Hours Solubility: Soluble in nitromethane and dimethyl-formamide (DMF)

118

Adhesives, Sealants and Coatings for the Electronics industry

BOSTIK: Engineering Adhesives: Cyanoacrylate Adhesives: Cyanoacrylate adhesives are instant bonding adhesives for metal, plastics, rubber, ceramics and glass. Single component, solvent-free adhesives that bond in seconds to closely mated surfaces, cyanoacrylates offer convenience and ease for production assembly and maintenance applications. Bostik cyanoacrylate adhesives are available in several different formulations and sizes. 7430: Designation: General purpose fast cure. Viscosity (cp): 40-50 Cure Time: 2-3 sec. Gap Fill: .003" Temperature Range: -65F to 180F Tensile Lbs/In: 4700 Impact Lbs/In: 7-10 7431: Designation: Penetrating type. Viscosity (cp): 2-5 Cure Time: l-2 sec. Gap Fill: .002" Temperature Range: -65F to 180F Tensile Lbs/In: 4000 Impact Lbs/In: 3-5 7432: Designation: Rubber and plastic. Viscosity (cp): 90-110 Cure Time: 3-5 sec. Gap Fill: .004" Temperature Range: -65F to 180F Tensile Lbs/In: 4000 Impact Lbs/In: 3-5 7433: Designation: Wood and fiber Viscosity (cp): 275-325 Cure Time: 7-10 sec. Gap Fill: .006" Temperature Range: -65F to 180F Tensile Lbs/In: 4000 Impact Lbs/In: 4-6

Adhesives-Cyanoacrylafe

BOSTIK: Engineering Adhesives: Cyanoacrylate Adhesives (Continued): General Purpose Cyanoacrylates: 7434: Desisnation: Porous surfaces. Viscosity (cp): 1450-1550 Cure Time: IO-15 sec. Gap Fill: .OlO" Temperature Range: -65F to 180F Tensile Lbs/In: 4000 Impact Lbs/In: 4-6 7435: Designation: Maximum qan filler. Viscosity (cp): 2300 - _ Cure Time: 15-25 sec. Gap Fill: .015" Temperature Range: -65F to 180F Tensile Lbs/In: 4000 Impact Lbs/In: 4-6 Special Performance Cyanoacrylates: 7532: Designation: For critical surfaces. Viscositv (co): 90-110 Cure Time:.315 sec. Gap Fill: .004" Temperature Range: -65F to 18OF Tensile Lbs/In: 4000 Impact Lbs/In: 3-5 7533: Designation: High temperature. Viscosity (cp): 90-110 Cure Time: 3-5 sec. Gap Fill: .004" Temperature Range: -65F to 275F Tensile Lbs/In: 3600 Impact Lbs/In: IO-15 7535: Designation: Severe service. Viscosity (cp): 4800-5200 Cure Time: 2-4 min. Gap Fill: .020" Temperature Range: -65F to 250F Tensile Lbs/In: 3200 Impact Lbs/In:.20-25

1 I9

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FEL-PRO CHEMICAL PRODUCTS DIVISION: PRO GRIP Instant Bonding Cyanoacrylate Adhesives: -

Instant Bond High Strength Bonds Metal, Rubber and Plastic 1 Part - No Mixing No Heating No Solvents

PRO GRIP 4000: Its viscosity and "ethyl-cyanoacrylate" formula make it the most versatile of the PRO GRIP adhesives. It has high water resistance, weather resistance, and is suited to rubber, plastic, and metal bonding. Use PRO GRIP 4000 for production and maintenance bonding of rubber and plastic, replacing or installing knobs and handles, bonding plexiglass, attaching nameplates, fastening rubber to conveyor belts, etc. Meets Military Specification MIL-A-46050B, Type 1, Class 2. PRO GRIP 5500: PRO GRIP 5500 is a "methyl-cyanoacrylate" designed for maximum bonding strength for metals and ceramics. PRO GRIP 5500 is a good all-around adhesive for such diverse jobs as making O-rings, bonding electronics parts to PC boards, applying strain gages, appliance manufacturing, instrumentation and fastening metal parts on machinery for both maintenance and production. Meets Military Specification MIL-A-46050B, Type 1, Class 2. PRO GRIP 7000: The higher viscosity of PRO GRIP 7000 makes it the ideal adhesive where some porosity and surface roughness is present. Like PRO GRIP 4000, it is an "ethyl-cyanoacrylate" which gives it excellent water and weathering resistance. Set-up time is slightly longer than other PRO GRIP adhesives. PRO GRIP 7000 is especially useful on vertical or inverted surfaces. Its higher viscosity keeps it in place while the parts are being positioned and mated. Features of PRO GRIP, the professional cyanoacrylate adhesive: Single part: No catalyst or mixing needed. Fast bonding: Instantly sets up. Seldom needs clamping. High strength: Good initial strength. Depending on surface material, ultimate bond strengths up to 3200 psi are achieved. Clean to use: Transparent, no stringy and sticky residue. No solvents: Cures without shrinkage. No heat needed for cure.

Adhesives-Cyanoacrylte

FEL-PRO INC.: PRO GRIP Instant Bonding Cyanoacrylate Adhesives (Continued): PRO GRIP 4000: Adhesive Strength, PSI (Lap Shear): Rubber: Neoprene: 120 psi SF# Nitrile: 90 psi SF# SBR: 70 asi SF# Plastic: A ~ Rigid PVC: 550 psi SF# Polystyrene: 550 psi SF# Polyacrylic: 900 psi SF# ABS: 640 psi SF# Nylon: 900 psi SF# Phenolic: 680 psi SF# Polycarbonate: 1300 psi SF# Cellulose Acetate: 500 psi Metal: Steel: 2400 psi Aluminum: 1600 psi Copper: 1600 psi Stainless Steel: 2450 psi Color: Clear Viscosity: medium 100 cps Maximum Temperature: 175 Setting Time: 3-40 sec. PRO GRIP 5500: Adhesive Strength, Psi (Lap Shear): Rubber: Neoprene: 190 psi SF# Nitrile: 155 psi SF# SBR: 40 vsi SF# Plastic: _ ~ Rigid PVC: 500 psi SF# Polystyrene: 480 psi SF# Polyacrylic: 850 psi SF# ABS: 640 psi SF# Nvlon: 850 nsi SF# Phenolic: 680 psi SF# Polycarbonate: 1250 psi SF# Cellulose Acetate: 400 psi Metal: Steel: 3200 psi Aluminum: 1850 psi Copper: 1580 psi Stainless Steel: 2750 psi Color: Clear Viscosity: medium 100 cps Maximum Temperature: 175 Setting Time: 3-40 sec. # SF: Substrate Failed

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I22


FEL-PRO INC.: PRO GRIP Instant Bonding Cyanoacrylate Adhesives (Continued): PRO GRIP 7000: Adhesive Strength, PSI (Lap Shear): Rubber: Neoprene: 195 psi SF# Nitrile: 90 psi SF# SBR: 70 psi SF# Plastic: Rigid PVC: 580 psi SF# Polystyrene: 580 psi SF# Polyacrylic: 850 psi SF# ABS: 640 psi SF# Nylon: 850 psi SF# Phenolic: 890 psi SF# Polycarbonate: 1320 psi SF# Cellulose Acetate: 500 psi Metal: Steel: 2300 psi Aluminum: 1500 psi Copper: 1420 psi Stainless Steel: 2200 psi Color: Clear Viscosity: high 1500 cps Maximum Temperature: 175 Setting Time: IO-80 sec. #SF: Substrate Failed


123

ITW DEVCON: DEVCON ZIP GRIP Cyanoacrylate Instant Adhesives: ZIP GRIP 4495 General Purpose Adhesive: DEVCON's ZIP GRIP adhesives are single component, moisturecuring cyanoacrylates which cure in seconds on most smooth, close-fitting substrates. They cure best at room temperature and need not be refrigerated during storage. Devcon offers several different types of ZIP GRIP adhesives formulated with specific properties. Original ZIP GRIP 4404: This is the original ZIP GRIP cyanoacrylate designed to bond all metal and rubber parts with smooth, clean, closefitting surfaces. It performs well for bonding O-rings and making static seals, can be used to fixture small parts in place for machining or alignment, and is used to permanently bond metal-to-metal and rubber/plastics to metal surfaces. High-Performance ZIP GRIP 4414: This is a medium viscosity adhesive that features fast fixturing time and good weather resistance. It bonds plastics, insulating trims, and vinyl. Gap Filling ZIP GRIP 4416: A high-viscosity (1,500 cps) adhesive with a slower fixturing time which permits some repositioning following assembly and application of the adhesive. Maximum recommended gap: .OlO". Wicking Grade ZIP GRIP 4420: Designed for bonding close-fitting components, this grade of ZIP GRIP features an extremely low viscosity (3 cps.), and rapid fixturing speed. High-Viscosity ZIP GRIP 4422: With a viscosity of 2,500 cps., this grade is ideal for filling large gaps up to .020". It is an excellent choice for bonding poorly machined surfaces, and porous materials including plastics and metals. ZIP GRIP 95 Gel: This is a high-performance ethyl gel designed for bonding all types of rubber, plastics, and combinations of metals and non-metal surfaces. Recause of its thick gel consistency, it is recommended for bonding on porous and rough surfaces, as well as for filling large gaps.

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ITW DEVCON:

DEVCON

ZIP

GRIP

Cyanoacrylate Instant Adhesives

(Continued): 4404: Base: Methyl Color: Clear Gap fill: .003" Viscositv (ens): 40 Adhesive-tensile shear strength, psi: 2,500 Cure Speed: Fixture: 15-20 sec. Full: 8 hours MIL-SPEC: Type 1 MIL-A-46050C: Class 2 Temperature range: -65F to 180F 4414: Base: Ethyl Color: Clear Gap fill: .006" Viscositv (cos): 120 Adhesive^tensile shear strength, psi: Substrate failure. Bond is stronger than substrate being bonded. Cure speed: Fixture: 20-30 sec. Full: 24 hours MIL-SPEC: Type II MIL-A-46050C: Class 2 Temperature range: -65F to 18OF 4416: Base: Ethyl Color: Clear Gap fill: -010" Viscosity (cps) 1,500 Adhesive tensile shear strength, psi: Substrate failure. Bond is stronger than substrate being bonded. Cure Speed: Fixture: 40-50 sec. Full: 4 hours MIL-SPEC: Type II MIL-A-46050C: Class 3 Temperature renge: -65F to 180F 4420: Base: Ethyl Color: Clear Gap fill: .002" Viscosity (cps): 3 Adhesive tensile shear strength, psi: Substrate failure. Bond is stronger than substrate being bonded. Cure speed: Fixture: lo-20 sec. Full: 4 hours MIL-SPEC: Type II MIL-A-46050C: Class 1 Temperature range: - 65F to 180F

Adhesives-Cyanoauylate

ITW DEVCON:

ZIP GRIP

125

Cyanoacrylate Instant Adhesives (Continued):

4422: Base: Ethyl Color: Clear Gap fill: .020" Viscosity (cps): 2,500 Adhesive tensile shear strength, psi: Substrate failure. Bond is stronger than substrate being bonded. Cure speed: Fixture: 50-60 sec. Full: 4 hours MIL-SPEC: Type II MIL-A-46050C: Class 3 Temperature range: -65F to 180F 4496:

Base: Methyl Color: Clear Gap fill: .006" Viscosity (cps): 120 Adhesive tensile shear strength, psi: Substrate failure. Bond is stronger than substrate being bonded. Cure speed: Fixture: 30-40 sec. Full: 24 hrs. MIL-SPEC: Type I MIL-A-46050C: Class 2 Temperature range: -65F to 180F ZIP GRIP 95 Gel:

Base: Ethyl Color: Clear Amber Gap fill: .030" Viscosity (cps): Gel Adhesive tensile shear strength, psi: 2,200 Cure speed: Fixture: IO-15 sec. Full: 8 hours MIL-SPEC: N/A Temperature range: -65F to 180F

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LOCTITE CORP.: Bonding: Instant Adhesives: LOCTITE instant adhesives are available in a choice of viscosities, cure speeds, gap-filling capability, and substrate compatibility. The ultra-high performance PRISM family offers additional products that surpass the most stringent demands, including toughened formulations, low odor and low blooming products, and surface insensitive formulations. SUPERBONDER Instant Adhesives: SUPERBONDER Instant Adhesives offer a wide range of application versatility. They may be applied directly from containers or with automated equipment. They contain no solvents and are non-flammable. Low toxicity. Mild odor. SUPERBONDER 409 Gel Instant Adhesive: Thixotropic gel formulation fills large gaps and is nonrunning. For general purpose use on metal, plastic and rubber. SUPERBONDER 414 Plastic & Vinyl Instant Adhesive: Medium viscosity (IlOcp), high strength. Ideal for bonding plastic and vinyl parts with gaps to .006". Good humidity and weather resistance. SUPERBONDER 416 Gap Filling Instant Adhesive: High viscosity (1500 cp). Designed to bond irregular surfaces or large gaps between mating surfaces. This slower-setting adhesive allows adjustment of parts after assembly. SUPERBONDER 420 Penetrating Instant Adhesive: Very low viscosity (5 cp). Designed to penetrate by capillary action between pre-assembled components. Parts must be closefitting: gaps to .002". SUPERBONDER 430 Metal Bonding Instant Adhesive: Medium viscosity (80 cp). Fills gaps to .005". Especially effective on plated and anodized metals bonded to themselves or to other materials. SUPERBONDER 495 General Purpose Instant Adhesive: Low viscosity (40 cp). Engineered to bond rubber, metal and plastic parts with gaps to -004". Will wick between pre-assembled parts with gaps to .006".

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127

LOCTITE CORP.: Bonding(Continued): Instant Adhesives(Continued): SUPERBONDER Instant Adhesives(Continued): SUPERBONDER 498 Thermal Cycling Resistant Instant Adhesive: Medium viscosity (700 cp) high temperature (to 223F, intermittent to 250F) instant adhesive with excellent resistance to thermal cycling. SUPERBONDER 499 Gel Instant Adhesive: Thixotropic high temperature (to 223F, intermittent to 250F) gel formation bonds all metals, and most plastics and rubber compounds. Offers excellent thermal cycling resistance. PRISM Instant Adhesives: PRISM adhesives are LOCTITE's highest performance instant adhesives. They work where other instants fail. They are specially formulated to provide the strongest bond on hard-to-bond surfaces and resist extreme environmental conditions. PRISM Surface Insensitive Instant Adhesives: Creates stronger bonds on a wider variety of difficult substrates and under a greater range of surface and environmental conditions than other instant adhesives. PRISM 401 Surface Insensitive Instant Adhesive: Medium viscosity (100 cp). Excellent strength and cure speed on porous substrates. Cures in dry conditions. PRISM 406 Surface Insensitive Instant Adhesive: Low viscosity (20 cp). Very fast curing speed in dry conditions. Excellent results with difficult to bond rubber compounds. PRISM 447 Surface Insensitive Instant Adhesive: Medium high viscosity (600 cp). Excellent strength and adhesion to a wide range of porous substrates. Cures in dry conditions. PRISM 454 Surface Insensitive Instant Gel Adhesive: Non-flowing gel. Ultra high performance general purpose adhesive with excellent gap-filling, strength, and adhesion to a very wide range of substrates.

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Adhesives, Sealants and Coatings for the Electronics Industty

LOCTITE CORP.: Bonding(Continued): PRISM Instant Adhesives(Continued): PRISM Surface Insensitive Instant Adhesives(Continued): PRISM Toughened Instant Adhesives: Combine excellent peel and impact resistance with shear strength. For high stress, high temperature, high humidity, and high vibration and impact applications. PRISM 405 Toughened Instant Adhesive (White): Medium viscosity (300 cp). For excellent strength in high stress, high temperature (to 223F) high humidity applications. PRISM 410 Toughened Instant Adhesive (Black): High viscosity (3,500 cp). Good gap filling ability for high temperature (to 223F), high humidity applications. PRISM 411 Toughened Instant Adhesive (Clear): Very high viscosity (5,000 cp). Good gap filling ability for applications needing a stress, humidity and temperature resistant (to 212F) adhesive. PRISM Odorless, Non-Frosting Instant Adhesives: Cure on sensitive substrates with invisible bond line without frosting or crazing. Eliminates need for ventilation. PRISM 408 Odorless, Non-Frosting Instant Adhesive: Very low viscosity (5 cp). Designed to penetrate by capillary action between preassembled components. Parts must be close-fitting: gaps to .002". PRISM 460 Odorless, Non-Frosting Instant Adhesive: Low viscosity (50 cp). Excellent strength and appearance combined with minimal odor. PRISM 403 Odorless, Non-Frosting Instant Adhesive: Medium viscosity (1,OOOcp). Excellent strength and appearance. For less precisely fitted parts. Ethyl based.


LOCTITE CORP.: Bonding(Continued): SUPERBONDER Instant Adhesives Technical Information: 409: Color: Clear Gap Fill: .008" Base: ethyl Viscosity cp: Thixo. Gel Strength psi Tensile Shear: 2500 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: 50-70 sec. Full: 24 hrs. Specific Gravity: 1.05 414: Color: Clear Gap Fill: .006" Base: ethyl Viscosity cp: 110 Strength psi Tensile Shear: 2500 Temperature Range: -65 to 180F(-54 to 82C) Cure Speed: Fixture: 30-40 sec. Full: 24 hrs. Mil. Spec. MIL-A-46050C: Type II Class II Specific Gravity: 1.05 416: Color: Clear Gap Fill: .OlO" Base: ethyl Viscosity cp: 1500 Strength psi Tensile Shear: 2500 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: SO-60 sec. Full: 24 hrs. Mil. Spec. MIL-A-46050C: Type II Class III Specific Gravity: 1.05 420: Color: Clear Gap Fill: .002" Base: ethvl Viscosity-cp: 5 Strength psi Tensile Shear: 2500 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: 15-30 sec. Full: 24 hrs. Mil. Spec. MIL-A-46050C: Type II Class I Specific Gravity: 1.05

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LOCTITE CORP.: Bonding(Continued): SUPERBONDER Instant Adhesives Technical Information(Continued): 430: Color: Clear Gap Fill: .005" Base: methyl Viscosity cp: 80 Strength psi Tensile Shear: 2500 Temperature Range: -65 to 180F (-54 to 82C1 Cure Speed: Fixture: 20-40 sec. Full: 24 hrs. Mil. Spec. MIL-A-46050C: Type I Class II Specific Gravity: 1.09 495: Color: Clear Gap Fill: .004" Base: ethyl Viscosity cp: 40 Strength psi Tensile Shear: 2500 Temnerature Ranse: -65 to 180F (-54 to 82C) Cur;? Speed: Fixture: 20-40 sec. Full: 24 hrs. Mil-A-Spec MIL-A-46050C: Type II Class I Specific Gravity: 1.05 498: Color: Clear Gap Fill: .006" Base: ethyl Viscosity cp: 700 Strength psi Tensile Shear: 3000 Temuerature Ranqe: -40 to 223F (-40 to 106C) Cure Speed: Fixture: 30-60 sec. Full: 24 hrs. Specific Gravity: 1.05 499: Color: Clear Gap Fill: .004" Base: ethyl Viscosity cp: Thixo. Gel Strength psi Tensile Shear: 3200 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 60-80 sec. Full: 24 hrs. Specific Gravity: 1.10


LOCTITE CORP.: Bonding(Continued): PRISM Adhesives Technical Information: 401: Color: Clear Gap Fill: .008" Base: ethyl Viscosity cp: 100 Strength psi Tensile Shear: 3235 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: O-20 sec. Full: 24 hrs. Specific Gravity: 1.05 Approvals: USP Class IV 406: Color: Clear Gap Fill: .004" Base: ethyl Viscosity cp: 20 Strength psi Tensile Shear: 2878 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: O-20 sec. Full: 24 hrs. Specific Gravity: 1.05 Approvals: USP Class IV 447: Color: Clear Gap Fill: .008" Base: ethyl Viscosity cp: 600 Strength psi Tensile Shear: 3386 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: O-20 sec. Full: 24 hrs. Specific Gravity: 1.05 454: Color: Clear Gap Fill: .008" Base: ethyl Viscosity cp: Thixo. Gel Strength psi Tensile Shear: 3000 Temperature Range: -65 to 180F (-54 to 82C) Cure Speed: Fixture: 15-90 sec. Full: 24 hrs. Specific Gravity: 1.10 Approvals: USP Class VI

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LOCTITE CORP.: Bonding(Continued): PRISM Adhesives Technical Information(Continued): 405: Color: White Gap Fill: .007" Base: ethvl Viscosity*cp: 300 Strenqth psi Tensile Shear: 3273 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.05 410: Color: Black Gap Fill: .008" Base: ethyl Viscosity cp: 3500 Strength psi Tensile Shear: 3568 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.10 411: Color: Clear Gap Fill: .008" Base: ethyl Viscosity cp: 5000 Strength psi Tensile Shear: 3191 Temperature Range: -65 to 212F (-54 to 1OOC) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.10 408: Color: Clear Gap Fill: .002" Base: alkoxy alkyl Viscosity cp: 5 Strength psi Tensile Shear: 2608 Temperature Range: -65 to 160F (-54 to 71C) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.05 Approvals: USP Class IV


LOCTITE CORP.: Bonding(Continued): PRISM Adhesives Technical Information(Continued): 460: Color: Clear Gap Fill: .004" Base: alkoxy alkyl Viscositv cw: 50 Strength-psi Tensile Shear: 2400 Temperature Range: -65 to 160F (-54 to 71C) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.06 Approvals: USP Class IV 403: Color: Clear Gap Fill: .008" Base: alkoxy alkyl Viscosity cp: 1000 Strength psi Tensile Shear: 2954 Temwerature Range: -65 to 160F (-54 to 71C) Cure Speed: Fixture: 60 sec. Full: 24 hrs. Specific Gravity: 1.09

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LOCTITE CORP.: Bonding(Continued): PRISM Surface Insensitive Instant Adhesives(Continued): BLACK MAX Tough Adhesive 380: A one-part, fast curing, high temperature (to 223F, intermittent to 250F) adhesive. Excellent peel, impact, and tensile shear strength. Exceptional thermal cycling resistance. Bonds metal, rubber, and plastics. Bonds: - Joints in speakers - Automotive engine vacuum harness - Plastic sole plate to golf club head TAK PAK 444 Instant Adhesive: Medium viscosity (700~~) instant adhesive formulated specifically for PCB assembly and repair. Replaces epoxies, silicones, hot melts for mounting components, reinforcing standoffs, wire tacking and board repair. Available in kit form with TAK PAK accelerator or as separate items. TAK PAK 382 Ultra Performance Adhesive Kit: Designed to cut PCB assembly, repair and modification, TAK PAK 382 is a high temperature (to 223F, intermittent to 250F), high viscosity instant adhesive that withstands thermal cycling. Cures instantly with TAK PAK Accelerator. Available in kit or as separate items. Can be applied with high-speed process equipment. Applications: - Secure wires - Tamperproof settings - Attach capacitors - Repair cracks - Strain relieve leads TAK PAK Accelerator 710: Speeds cure of all TAK PAK adhesives. Contains no salts. Can be sprayed, brushed, or applied with fine felt tip. Primers: - TAK PAK Accelerator, Accelerator 711 aid cure of instant adhesives. Solvent: X-NMS Clean-Up Solvent 768 quickly and safely dissolves cured instant adhesives.


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LOCTITE CORP.: Bonding(Continued): SUPERBONDER Instant Adhesives Technical Information(C!ontinued): BLACK MAX 380: Color: Black Gap Fill: -015" Base: ethvl Viscosity*cp: 1000 Strenqth psi Tensile Shear: 3100 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 2-3 min. Full: 120 hrs. Specific Gravity: 1.10 U.P. TAK PAK 382: Color: Clear Base: ethyl Viscositv cw: 5000 Strength-psi Tensile Shear: 3500 Temperature Range: -65 to 223F (-54 to 106C) Cure Speed: Fixture: 10 sec. Full: 24 hrs. Specific Gravity: 1.05 TAK PAK 444: Color: Clear Base: ethyl Viscosity cp: 700 Temwerature Ranqe: -65 to 180F (-54 to 82C) Cure Speed: _ Fixture: 30-60 sec. Full: 24 hrs. Mil. Spec. MIL-A-46050C: Type II Class III Specific Gravity: 1.05

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ONEIDA ELECTRONIC MFG. INC.: INSTANT-WELD Alpha Cyanaoacrylate Adhesive: Red Label (Ethyl): Use when bonding any combination of plastic, r,ubber, ceramic or glass. Red Label No. 101: Viscosity: 2-3 cps Setting Time: lo-20 seconds Physical Properties: Appearance: Colorless, Transparent liquid Viscosity (cps @ 2OC): 2-3 Refractive Index: 1.45 Flash Point: 182F Solubilitv Parameter: 10.5 Density: i.O5-1.08 Shelf-Life at 5C: 12 Months Soluble in: M.E.K./Acetone/Nitromethane Main Ingredients: Ethyl Cyanoacrylate Polymer (Solid State After Resinified): Appearance: Colorless transparent solid Softening Point: 284-293F Melting Point: 347-374F Blue Label (Ethyl): Use when bonding any combination of plastic, rubber, ceramic or glass. Blue Label No. 102: Viscosity: 75 cps Setting Time: 45-60 seconds Physical Properties: Type: Blue Label Appearance: Colorless, Transparent Liquid Viscosity (cps @ 2OC): 75' Refractive Index: 1.44 Flash Point: 182F Solubilitv Parameter: 10.5 Density: i .05-1.08 Shelf-Life at 5C: 12 Months Soluble in: Acetone/methvlethvlketone (MEK)/nitromethane Main Ingredients: Ethyl Cyanoacrylate Polymer (Solid State After Resinified): Appearance: Colorless transparent solid Softening Point: 280-293F Melting Point: 340-365F


ONEIDA ELECTRONIC MFG. INC.: INSTANT-WELD Alpha Cyanoacrylate Adhesive (Continued): Purple Label (Ethyl): This formula of a special ethyl cyanoacrylate was developed for bonding natural latex rubber and hard to bond plastics. It has superior wetting properties and a very fast speed of cure. In general, Oneida does not recommended using it for bonding metal to metal. Purple Label No. 105: Viscosity: 30-40 cps Setting Time: 45-60 seconds Physical Properties: Type: Brown Label Appearance: Colorless Viscosity (cps @ 2OC): 30-40 cps Refractive Index: 1.45 Flash Point: 182F Density: 1.05-1.08 Shelf-Life at 5C: 12 months Soluble In: Acetone, methylethylketone (MEK), nitromethane, dimethvlformamide (DMF) Main Ingredients: Ethyl-Cyanoacrylate Polymer (Solid State After Resinified): Appearance: Colorless Transparent (Solid) Softening Point: 284-293F Melting Point: 340-3651;' Red/White Label (Ethyl): Highly suitable for wire tacking applications on printed circuit boards (in combination with #55-15 Filler/Setter). This viscous ethyl cyanoacrylate has good nonmigrating and gapfilling properties. Red/White Label No. 106: Viscosity: 1300-1700 cps Setting Time: 60-120 seconds Type: Red/White Label Appearance: Colorless, Transparent Viscosity (cps @ 2OC): 1300-1700 Refractive Index: 1.45 Flash Point: 182F Density: 1.05-1.08 Shelf-Life at 5C: 12 months Soluble in: Acetone, methylethylketone (MEK), nitromethane, dimethylformamide (DMF) Main Ingredients: Ethyl-Cyanoacrylate Polymer (Solid State After Resinated): Appearance: Colorless, Transparent (Solid) Softening Point: 284-293F Melting Point: 340-365F

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ONEIDA ELECTRONIC MFG. INC.: INSTANT-WELD Alpha Cyanoacrylate Adhesives (Continued): Yellow/Blue Label (Methyl): INSTANT-WELD 107 is a methyl cyanoacrylate of medium viscosity to complement INSTANT-WELD 747 and 130. Recommended for metal to metal bonding because of its higher strength and better thermal behavior than ethyl cyanoacrylates. Yellow/Blue Label No. 107: Viscosity: 80-100 cps Setting Time: 45-60 seconds Yellow/Blue Label TvDe: __ Appearance: Colorless Transparent Viscosity (cps @ 20C): 80-100 Refractive Index: 1.46 Flash Point: 175F Density: 1.08-1.10 Shelf-Life at 5C: 12 months Soluble in: Dimethylformamide and nitromethane, MEK, Toluene Main Ingredients: Methyl-Cyanoacrylate Polvmer (Solid State After Resinified): Appearance: Colorless Transparent (Solid) Softening Point: 320-328F Melting Point: 392-401F White Label (Methyl): Use when metal is one or both of the bonded components, such as metal to plastic or metal to rubber, glass, etc; White Label No. 130: Viscosity: 500-550 cps Setting Time: 90 seconds Physical Properties: Type: White Label Viscosity (cps @ 20C): 500-550 Refractive Index: 1.50 Flash Point: 181F Densitv: 1.08-1.10 Shelf-Life at 5C: 12 months Soluble in: MEK/Nitromethane/Toluene Main Ingredients: Methyl-Cyanoacrylate Polymer (Solid State After Resinified): Appearance: Colorless, transparent Softening Point: 320-329F Melting Point: 392-401F


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ONEIDA ELECTRONIC MFG. INC.: INSTANT-WELD Alpha Cyanoacrylate Adhesives (Continued): Green Label (Ethyl): Bonds porous and nonporous materials. (Other grades of INSTANT-WELD bond nonporous materials - metals, plastics, glass, porcelain, hardwoods, rubber, etc.) This formula holds all of these materials plus leather, paper, soft woods, many fibrous substances, etc. Green Label No. 240: Viscosity: 2000-2400 cps Setting Time: 60-120 seconds Physical Properties: Type: Green Label Appearance: Colorless, Transparent, Viscous Liquid Viscosity (cps @ 2OC): 2,000-2,400 cps Refractive Index: 1.46 Flash Point: 181F Density: 1.05-1.08 Shelf-Life at 5C: 12 months Soluble In: Acetone, Nitromethane, Toluene Main Ingredients: Ethyl Cyanoacrylate Polymer (Solid State After Resinified): Appearance: Colorless, transparent, same as glass Softening Point: 284-293F Melting Point: 347-365F Yellow Label (Methyl): Use when metal is one or both of the bonded components, such as metal to plastic or metal to rubber, glass, etc. Yellow Label No. 747: Viscosity: 15-25 cps Setting Time: 30-45 seconds Physical Properties: Type: Yellow Label Appearance: Colorless, Transparent Liquid Viscosity (cps @ 2OC): 15-25 Refractive Index: 1.45 Flash Point: l75F Solubility Parameter: 11.0 Density: 1.08-1.10 Shelf-Life at 5C: 12 months Soluble in: Dimethyl-formamide and nitromethane, MEK, Toluene Main Ingredients: Methyl-Cyanoacrylate Polymer (Solid State After Resinated): Appearance: Colorless transparent solid Softening Point: 320-329F Melting Point: 392-401F

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ONEIDA ELECTRONIC MFG. CO.: INSTANT-WELD 847 Adhesive: The One Adhesive Cyanoacrylate for Many Applications High Bond Strength: Bond strength of up to 5,000 psi makes INSTANT-WELD 047 adhesives excellent for high-performance applications. In the case of some materials, such as most rubbers and plastics, the bond formed after 10 minutes is actually stronger than the substrate itself. Versatile: One adhesive for many applications: Forms strong, long-lasting bonds in just seconds with both similar and dissimilar materials. Outstanding for bonding metals, as well as most rubbers, plastics, hardwoods, and other non-porous materials with smooth, close-fitting surfaces. Because one adhesive can be used in many different applications, inventory requirements are greatly reduced. Economical: Under controlled conditions, as little as one drop (0.015 gram) of adhesive per square inch has been found to give optimum results. One pound of adhesive typically yields 30,000 drops. Viscosity: 75-125 cps * * * * * * * *

Fast-setting High strength Versatile Easy-to-use Solvent-free Colorless, transparent bond lines Meets MIL-A46050-C Type 1 Class 2 (methyl) Formulated for automatic dispensing


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ONEIDA ELECTRONIC MFG. INC.: INSTANT-WELD 850 Series: High Temperature Resistant Cyanoacrylate Adhesives The INSTANT-WELD #850 Series adhesives were developed to satisfy the need for quick setting adhesives with better heat resistance. A modification of the cyanoacrylate molecule, covered in U.S. Patent 3 254 111, allows the adhesive to crosslink and thereby enhance its resistance to temperature above IOOC (212F). INSTANT-WELD #850 Series cyanoacrylate adhesives are simple, one-part systems. They cure by reacting with the moisture absorbed on most surfaces under ambient conditions, as do regular cyanoacrylate adhesives. Thus, there is no need to store, handle or mix in special chemical additives which can shorten shelf life, require special storage conditions and higher skilled personnel. They can be handled and dispensed with the same equipment and personnel as is used with regular cyanoacrylates. INSTANT-WELD #850 Series adhesives react as standard cyanoacrylate adhesives but provide higher heat resistance. Thus, the adhesive provides: * Instant Setting * High Strength * Bonds to a great variety of materials * Ease of Application * One Part System * LOW Cost per Bond and, the special crosslinking of the #850 Series Adhesives extends its useful ranqe to above 1OOC (212F) as can be seen in the tables. INSTANT-WELD #850: Viscosity: l-5 cps Mil Spec: Type V, Class Use: Wicking, High Flow INSTANT-WELD #851: Viscosity: 75-125 cps Mil Spec: Type V, Class _. use: tienerai Purpose, controlled Flow INSTANT-WELD #852: Viscosity: 1800-2400 cps Mil Speck Type V, Class 3 Use: Large Gaps, Low Flow

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PACER TECHNOLOGY: Instant Adhesives: Standard Grade Cyanoacrylates: Ethyl Types: For bonding similar as well as dissimilar material; including ceramics, metal, plastic, rubber, and wood. Features include: good heat aging characteristics, moisture resistance, and weatherability. Excellent for adhering glass but bond will deteriorate with age. E-5: Instant Cure * Able to penetrate between parts * 5 cps viscosity allows up to .OOZ" gap fill capability * meets MIL-A-46050-C Type II Class 1 E-40: Fast Cure * General Purpose * 40 cps viscosity allows up to .004" gap fill capability * Meets MIL-A-46050-C Type II Class 1 E-100: Medium Cure * Broad use adhesive * 100 cps viscosity allows up to -005" gap fill capability * Meets MIL-A-46050-C Type II Class 2 E-1500: Slow Cure * Bridges gaps, allows work piece alignment * 1500 cps viscosity allows up to .OlO" gap fill capability * Meets MIL-A-46050-C Type II Class 3 E-2500: Very Slow Cure * ~110~s maximum time for positioning of parts. Use to bond fibrous and porous materials. * 2500 cps viscosity allows up to .020" gap fill capability * Meets MIL-A-46050-C Type II Class 3


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PACER TECHNOLOGY: Instant Adhesives: Standard Grade Cyanoacrylates (Continued): Methyl Types: Specifically formulated for metal to metal bonding. Features include solvent resistance and higher strength at specific temperatures. Better in fatigue cycling and repetitive stress loading. M-5: Instant Cure * Able to penetrate between parts * 5 cps viscosity allows up to -002" gap fill capability * Meets MIL-A-46050-C Type I Class 1 M-50: Fast Cure * Solvent resistant * 50 cps viscosity allows up to -004" gap fill capability * Meets MIL-A-46050-C Type I Class 1 M-100: Medium Cure * Solvent resistant, general assembly * 100 cps viscosity allows up to -005" fill capability * Meets MIL-A-46050-C Type I Class 2 E-5: Chemical Type: Ethyl Viscosity Range, cps: 2-10 Specific Gravity (25/4C): 1.05 Flashpoint (COC F): 185 Vapor Pressure (@7OC, mmHg): 8 Soluble in: PACER X Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 365 Softening Point (F): 311 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M75 Gap Filled, Typical, Inches: .002 Outgassing @ 10 -6 mm Hg (72F): 0 Elonuation (%): (2 Tensile strength, Steel/Steel (ASTM D-2095) (lbs/in 2): 4000 Impact Strength, Steel/Steel, ASTM 950 (lbs/in 2): 3-5 Soluble in: PACER X-7 Debonder, Acetone, DMF

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PACER TECHNOLOGY: Instant Adhesives: Standard Grade Cyanoacrylates (Continued): E-40: Chemical Tvoe: Ethvl 30-70 Viscosity Range, cps: _ Specific Gravity (25/4C): 1.06 Flashpoint (COC-F): 185 Vapor Pressure (@ 7OC, mmHg): 8 Soluble in: PACER X-7 Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Meltinu Point (F): 365 Softening Point (F): 307 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/Dt-.03): 1.45 Hardness - Rockwell: M75 Gap Filled, Typical, Inches: .004 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4700 E-100: Chemical Type: Ethyl Viscosity Range, cps: 80-120 Specific Gravity (25/4C): 1.08 Flashooint (COC F): 185 Vapor‘Pressure (@'7OC, mmHg): 8 Soluble in: PACER X-7 Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Meltina Point (F): 365 Softening Point (F): 306 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M74 Gap Filled, Typical, Inches: -005 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4000 E-1500: Chemical Type: Ethyl Viscosity Range, cps: 1300-1700 Specific Gravity (25/4C!): 1.10 Flash point (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 8 Soluble in: PACER X-7 Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 368 Softening Point (F): 301 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M72 Gap Filled, Typical, Inches: .OlO Outaassina B 10 -6 mm Ha (72F): 0 Elongation (%): (2 _ Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4000 Impact Strength, Steel/Steel, ASTM 950 (lbs/in 2): 4-6


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PACER TECHNOLOGY: Instant Adhesives: Standard Grade Cyanoacrylates (Continued): E-2500: Chemical Type: Ethyl Viscosity Range, cps: 2200-2700 Specific Gravity (25/4C): 1.11 Flashpoint (COC F): 185 Vapor Pressure (@7OC, mmHg): 8 Soluble in: PACER X-7 Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 368 Softenins Point (F): 301 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M72 Gap Filled, Typical, Inches: -020 Outgassing @ IO -6 mm Hg (72F): 0 Elongation (%): (2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4000 M-5: Chemical Type: Methyl Viscosity Range, cps: 2-10 Specific Gravity (25/4C): 1.10 Flashpoint (COC F): 167 Vapor Pressure (@ 7OC, mmHg): 10 Soluble in: PACER-X Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 401 Softening Point (F): 332 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M85 Gap Filled, Typical, Inches: .002 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): t2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000 M-50: Chemical Tvoe: Methvl Viscosity Range, cpS: 30-70 Specific Gravity (25/4C): 1.08 Flashpoint (COC-F): 167 Vapor Pressure (@7OC, mmHg): 10 Soluble in: PACER-X Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 388 Softening Point (F): 327 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M80 Gap Filled, Typical, Inches: .004 Outgassing @ ib -6 mm Hg (72F): 0 Elongation (%): t2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000

146


PACER TECHNOLOGY: Instant Adhesives: Standard Grade Cyanoacrylates (Continued): M-100: Chemical Type: Methyl Viscosity Range, cps: 80-120 Specific Gravity (25/4C): 1.08 Flashpoint (COC F): 167 Vapor Pressure (@ 7OC, mmHg): 10 Soluble in: PACER K-7 Debonder, MEK, Acetone, Nitromethane, Methylene Chloride Melting Point (F): 388 Softening Point (F): 325 Service Temperature Range: (-65F to 180F) (-54C to 82C) Refractive Index (n20C/D+-.03): 1.45 Hardness-Rockwell: M79 Gap Filled, Typical, Inches: .005 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000 Impact strength, Steel/Steel, ASTM 950 (lbs/in 2): 3-6 Soluble in: PACER K-7 Debonder. Acetone, DMF


147

PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series: PX Plastics-Extended Performance grades provide the maximum strengths for bonding various plastics and elastomerics together or in combination with metals and other materials. Select PX whenever organic materials are to be bonded. Service temperature range -65F to 200F, impact strengths, 4-8 lbs/in 2. The PX chemistry provides an intermediate grade between the RX and the HI type capabilities. Excellent performance on nylon, DELRIN, ABS, MYLAR, PVC, certain fluorocarbons, etc. Will not crack or craze ABS. PX-5: Instant Cure * Able to penetrate between parts * 5 cps viscosity allows up to -002" gap fill capability * Meets MIL-A-46050C, Type II, Class 1 PX-50: Fast Cure * General purpose * 50 cps viscosity allows up to .004" gap fill capability * Meets MIL-A-46050C, Type II, Class 1 PX-500: Slow Cure * Allows workpiece alignment * 500 cps viscosity allows up to .008" gap fill capability * Meets MIL-A-46050C, Type II, Class 3 TX Temperature Extended: Single component, high temperature cyanoacrylates for use at service temperatures up to 300F. Best for wire tacking and component bonding to printed circuit boards before and after wave soldering. TX chemistry is specially designed to permit rapid "wire tacking" to plain printed circuit boards; boards covered with solder masks; and provides the best performance for "tacking" when board processing includes water washing operations. These formulations work well on chromate conversion coatings and oily parts. Excellent impact strengths of IO-15 lbs/in 2 can be obtained. TX-5: Instant Cure * Able to penetrate between parts * 5 cps viscosity allows up to -002" fill capability * Meets MIL-A-46050C, Type II, Class 1 TX-100: Medium Cure * Broad use adhesive * 100 cps viscosity allows up to .004" gap capability * Meets MIL-A-46050C, Type II, Class 2 TX-750: Slow Cure * Allows workpiece alignment * 750 cps viscosity allows up to .OlO" gap fill capability * Meets MIL-A-46050C, Type II, Class 3 TX-2000: Very Slow Cure * Allows workpiece alignment * 2000 cps viscosity allows up to .015" gap filling capability * Meets MIL-A-46050C, Type II, Class 3

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PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Serie (Continued): PX-5: Chemical Type: Ethyl Propyl Viscosity Range, cps: 2-10 Specific Gravity (25/4C): 1.04 Flashpoint (COC F): 186 Vapor Pressure (@ 7OC, mmHg): 7 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 363 Softening Point (F): 303 Service Temperature Range: (-65 to +200F) (-54 to c94C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: -002 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4200 Impact Strength, Steel/Steel, ASTM 950 (lbs/in 2): 4-8 PX-50: Chemical Type: Ethyl Propyl Viscosity Range, cps: 30-80 Specific Gravity (25/4C): 1.04 Flashpoint (COC F): 186 Vapor Pressure (@ 7OC, mmHg): 7 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 363 Softenins Point (F): 303 Service Temperature Range: (-65 to +200F) (-54 to +94C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: -004 Outgassing @ 10 -6 mmHg (72F): 0 Elongation (%): t2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4400 Impact Strength, Steel/Steel, ASTM 950 (lbs/in 2): 4-8 PX-500: Chemical Type: Ethyl Propyl Viscosity Range, cps: 400-600 Specific Gravity (25/4C): 1.04 Flashooint (COC F): 186 Vapor-Pressure (@7OC, mmHg): 7 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 363 Softening Point (F): 302 Service Temperature Range: (-65 to +200F) (-54 to +94C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: -008 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4400 Impact Strength, Steel/Steel, ASTM 950 (lbs/in 2): 4-8


149

PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (Continued): TX-5: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 2-10 Specific Gravity (25/4C): 1.05 Flashpoint (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 8 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 369 Softening Point (F): 313 Service Temperature Range: (-65 to +300F) (-54 to c149C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M71 Gap Filled, Typical, Inches: -002 Outgassing @ 10 -6m Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 3000 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): IO-15 TX-100: Chemical Tvwe: Ethvl Hvbrid Viscosity Range, cps: SO-150 Specific Gravity (25/4C): 1.08 Flashpoint (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 8 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 369 Softenins Point (F): 312 Service Temperature Range: (-65 to +300F) (-54 to +149C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: -004 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 3500 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): IO-15 TX-750: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 650-850 Specific Gravity (25/4C): 1.09 Flashwoint (COC F): 185 Vapor-Pressure (@.7OC, mmHg): 8 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 368 Softening Point (F): 309 Service Temperature Range: (-65 to +300F) (-54 to +149C) Refractive Index (n20C/D+--03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: -010 Outgassing @ IO -6 mm Hg (72F): 0 Elongation (%): (2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 3500 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): IO-15

150


PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (continued): TX-2000: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 1800-2400 Specific Gravity (25/4C): 1.11 Flashpoint (COC F): 185 Vapor Pressure (8 7OC, mmHg): 8 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 368 Softening Point (F): 309 Service Temperature Range: (-65 to +300F) (-54 to +149C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M70 Gap Filled, Typical, Inches: .015 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): t2 Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4200 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): IO-15 Soluble in: PACER X-7 Debonder, Acetone, DMF Hi High contribute attainable and rubber

Impact: A structural instant adhesive formulated to toughness and impact resistance. Maximum impact values (15-25 lbs/ft 2). Also recommended for bonding plastic together or to metals, especially aluminum.

HI-50: Fast Cure * General purpose * 50 cps viscosity allows up to .004" gap fill capability * Meets MIL-A-46050C, Type II, class 1 HI-150: Medium Cure * Broad use adhesive * 150 cps viscosity allows up to .005" gap fill capability * Meets MIL-A-46050C, Type II, class 2 HI-500: Slow Cure * Allows workpiece alignment * 500 cps viscosity allows up'to .008" gap fill capability * Meets MIL-A-46050C, Type II, Class 3


151

PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (Continued): HI-5f-l:

__ _

Chemical Type: Ethyl Hybrid Viscositv Ranse. CDS: 30-70 Specific-Gravity (25/4(Z): 1.07 Flashpoint (COC F): 185 Vanor Pressure (0 7OC. mmHs): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 366 Softening Point (F): 309 Service Temperature Range: (-65 to +200F) (-54 to +94C) Refractive Index (n20C/D+-0.3): 1.45 Hardness - Rockwell: M75 Gap Filled, Typical, Inches: .004 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): (2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): IO-15 HI-150: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 100-200 Specific Gravity (25/4C): 1.07 Flashpoint (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 367 Softenins Point (F): 309 Service Temperature Range: (-65 to +200F) (-54 to +94C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M73 Gap Filled, Typical, Inches: .005 Outgassing @ 10 -6 mmHg (72F): 0 Elongation (%): t2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 15-20 HI:-500: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 400-600 Specific Gravity (25/4(Z): 1.09 Flashpoint (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 8 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 368 Softening Point (F): 315 Service Temperature Range: (-65 to +200F) (-54 to +94C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M73 Gap Filled, Typical, Inches: .008 Outgassing @ IO -6 mm Hg (72F): 0 Elongation (%): t2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 5000 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 20-25

152


PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (Continued): HC High Clarity: Adhesive is an isopropyl formulation that generates 75% less adhesive vapor during cure, resulting in dramatically reduced chlorisis (i.e., formation of white deposition of low molecular weight) in applications where cosmetics are important. High clarity grades have better moisture resistance than ethyl type cyanoacrylates. HC-5: Instant Cure * Able to penetrate between parts * 5 cps viscosity allows up to -002" gap capability HC-150: Medium Cure * Broad use adhesive * 150 cps viscosity allows up to .006" fill capability HP High Peel/High Performance. This newly developed chemistry exhibits characteristics unique to instant adhesives: high T-peel strength, impact strength (impact resistance), thermal shock resistance, excellent performance for metal to metal structural bonds. HP-IO: Fast Cure * Able to penetrate betwwen parts * 10 cps viscosity allows up to .002” gap fill capability * Meets MIL-A-46050C, Type II, class 1 HP-500: Slow Cure * Allows parts positioning time * 500 cps viscosity allows up to . 012" qap fill capability * Meets-MIL-A-4605tiC, Type II, class 3 _ HP-3000: Very Slow Cure * Allows workpiece alignment * 3000 cps viscosity allows up to .020" gap fill capability * Meets MIL-A-46050C, Type II, class 3 HP-5000: Slowest Cure Time * Large gap fill * 5000 cps viscosity allows up to .025" gap fill capability * Meets MIL-A-46050C, Type II, class 4


153

PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (Continued): HC-5: Chemical Type: Propyl Hybrid Viscosity Range, cps: 2-10 Specific Gravity (25/4C): 1.02 Flashpoint (COC F): 190 Vapor Pressure (@ 7OC, mmHg): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 343 Softening Point (F): 290 Service Temperature Range: (-65 to 175F) (-54 to 79C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M71 Gap Filled, Typical, Inches: 0.002 Outgassing @ 10 -6 mmHg (72F): 0 Elongation (%): t2 _ Tensile Strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 2800 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 3-5 HC-150: Chemical Type: Propyl Hybrid Viscosity Range, cps: 100-200 Specific Gravity (25/4C): 1.02 Flashooint (COC F): 190 Vapor-Pressure (@.7OC, mmHg): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 343 Softening Point (F): 290 Service Temperature Range: (-65 to 175F) (-54 to 79C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M71 Gap Filled, Typical, Inches: .006 Outgassing @ 10 -6 mm Hg (72F): 0 Elonaation (%I: t2 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 3000 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 3-5 HP-lo: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 5-15 Specific Gravity (25/4C): 1.05 Flashpoint (COC F): 185 Vapor Pressure (@ 7OC, mmHg): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Meltina Point (F): 366 Softening Point iF): 310 Service Temperature Range: (-65 to 180F) (-54 to 82C) Refractive Index (n20C/D+-.03): 1.45 Hardness - Rockwell: M73 Gap Filled, Typical, Inches: .002 Outgassing @ 10 -6 mmHg (72F): 0 Elongation (%): (3 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4500 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 12-25

154


PACER TECHNOLOGY: Instant Adhesives: Advanced Technology Series (Continued): HP-500: Chemical Tvoe: Ethvl Hvbrid Viscosity Range, cps: _ 400-600 Specific Gravity (25/4C): 1.05 Flashpoint (COC-F): 186 Vapor Pressure (0 7OC, mmHg): 6 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 361 Softenina Point (F): 300 Service Temperature Range: (-65 to +260F) (-54 to 127C) Refractive Index (n20C/D+--03): 1.408 Hardness - Rockwell: M60 Gap Filled, Typical, Inches: -012 Outgassing @ IO -6 mm Hg (72F): 0 Elongation (%): 7-10 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4500 T-peel strength, Steel/Steel, ASTM D-1876-83 (lbs/in 2): 13 Aluminum/Aluminum: 15.9 HP-3000: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 2500-4500 Specific Gravity (25/4C): 1.05 Flashpoint (COC F): 187 Vapor Pressure (0 7OC, mmHg): 5 Soluble in: Acetone, MEK, Nitromethane, Methylene Chloride Melting Point (F): 356 Softening Point (F): 296 Service Temperature Range: (-65 to +260F) (-54 to 127C) Refractive Index (n20C/D+-.03): 1.442 Hardness - Rockwell: M50 Gap Filled, Typical, Inches: .020 Outgassing @ 10 -6 mm Hg (72F): 0 Elongation (%): lo-15 Tensile strength, Steel/Steel, ASTM D-2095 (lbs/in 2): 4500 Impact Strength, Steel/Steel, ASTM-950 (lbs/in 2): 15-20 T-Peel strength, Steel/Steel ASTM D-1876-83 (lbs./in. 2): 15.4 Aluminum/aluminum: 17.6 HP-5000: Chemical Type: Ethyl Hybrid Viscosity Range, cps: 4000-6000 Specific Gravity (25/4C): 1.05 Flashpoint (COC F): 187 Vapor Pressure (0 7OC, mmHg):. 5 Soluble in: Acetone, MEK, Nitron, I' ,ne, Methylene Chloride Melting Point (F): 356 Softening Point (F): 296 Service Temperature Range: (-65 to +26OF) (-54 to 127C) Refractive Index (n20C/D+-.03): 1.444 Hardness - Rockwell: M50 Gap Filled, Typical, Inches: .025 Outgassing @ 10 -6 mmHg (72F): 0 Elongation (%): IO-15

Adhesives-Cyanoactyl&e

PERMABOND

INTERNATIONAL:

PERMABOND

Cyanoacrylates

(Instant

Adhesives): PERMABOND Cyanaoacrylate Adhesives are single component, solids adhesives which bond almost all close fitting surfaces in seconds. They cure at room temperature and bond metals, plastics, ceramics, elastomers and wood to each other and to themselves. The adhesives contain no solvents and are resistant to most chemicals and a broad range of temperature. Application may be directly from dispenser tipped bottles or from automatic dispensing equipment. They fixture in seconds and develop full cure strength of up to 4000 psi in hours. 100%

PERMABOND 910 Adhesive: Metal Bonding-General Purpose PERMABOND 910 bonds metals, plastics and rubber. It is especially well suited for metal bonding, providing superior strength. PERMABOND 910 resists long term exposure to temperatures up to 190F and short term peaks of up to 300F. Handling strength is reached as quickly as IO-30 seconds. Typical Application: * Wiper Blades & Other Rubber to Metal * Name Plates * Temporary Fixturing * Gear Shift Indicators * Meets MIL-A-46050C Type I Class 2 PERMABOND 910 FS Adhesive: Metal Bonding--Fast Cure, Post assembly applications PERMABOND 910 FS is a faster curing, low viscosity Version of PERMABOND 910. It is a penetrating adhesive that allows application to pre-assembled parts. Handling strength is reached in 5-15 seconds. 910 FS works best with gaps not exceeding .OOl". Typical Application: * Close fitting metal parts * Tamper proof adjustment screws * Lock set screws * Lock fasteners * Meets MIL-A-46050C Type I Class 1

155

156

Adhesives, Sealanfs and Coatings for the Electronics Industry

PERMABOND INTERNATIONAL: PERMABOND Cyanoacrylates PERMABOND 130 Adhesive: Metal Bonding--Intermediate

(Continued):

Gap Fill

PERMABOND 130 is an intermediate viscosity version of the 910 family. It provides excellent flow control for more uniform surface coverage, enhancing dispensing for automated assembly operations. Typical Application: * Bonding pressed metal parts * Bonding powdered metal parts * Bonding metal parts, where short term adjustment is required * Meets MIL-A-46050C Type I Class 3 PERMABOND 170 Adhesive: Metal Bonding--Maximum Gap Fill PERMABOND 170 is a slower curing, higher viscosity version of the 910 family. Because of the better gap filling capability it is well suited for production lines bonding molded parts, developing a strong bond rapidly on a wide variety of materials. Handling strength is achieved within seconds. Typical Application: * Potting * Fixturing * Bonding molded parts * Bonding porous metal parts PERMABOND 102 Adhesive: Plastic Bondina--General Puroose PERMABOND 102 is a medium viscosity, general purpose adhesive specifically formulated for plastics. PERMABOND 102 is fast setting, fixturing wihtin 5-30 seconds, achieving bond strengths up to 2500 psi after curing. Bonds material with small gaps. Typical Application: * Bonding Plastic Parts * High volume automatic applications requiring fast fixturing * Liquid Clamp * Meets MIL-A-46050C Type II Class 2


PEREABOND INTERNATIONAL: PERMABoND Cyanoacrylates PERMABOND 101 Adhesive: Plastic Bonding--Fastest

157

(Continued):

Fixturing--Post Application

PERMABOND 101 is a low viscosity adhesive, ideal for use with tight fitting parts. It is PERMABOND's fastest setting cyanoacrylate formulated for elastics and other substrates. PERMABOND 101 is a penetrating adhesive that may be applied to pre-assembled parts. It is also an excellent adhesive for rubber and metals, reaching bond strengths up to 2500 psi. Designed to bond materials with gaps not exceeding .OOl". Typical Application: * Bonding close fitting plastic parts * Bonding pre-assembled parts * Locks plastic fasteners * Tamper proofs adjustable fasteners * Meets MIL-A-46050C Type II Class 1 PERMABOND 105 Adhesive: Elastomer Bonding PERMABOND 105 is specifically formulated for natural and synthetic rubber. This product reaches high bond strength in 5-15 seconds on closely fitted parts. Typical Application: * Bonds natural and synthetic rubber * Bonds hard to bond plastics * Meets MIL-A-46050C Type II Class 1 PERMABOND 108 Adhesive: Plastic Bonding--Intermediate

gaps

PERMABOND 108 is an intermediate viscosity adhesive. It exhibits better flow control for more uniform surface coverage. PERMABOND 108 dispenses consistently for automated assembly. Typical Application: * Bonds molded parts * Bonds ceramics * Bonds parts with rough surfaces * Excellent for tacking wires on PC boards

158


PERMABOND INTERNATIONAL: PERMABOND Cyanoacrylates

(Continued):

PERMABOND 200 Adhesive: Wire Tacking Applications PERMABOND 200 is a higher viscosity adhesive providing greater gap filling capabilities. Perfectly formulated for wire tacking and other applications that require greater flow control, it fixtures in 15-40 seconds. Typical Application: * Wire Tacking * Component mounting * Potting * Encapsulating * Meets MIL-A-46050C Type II Class 3 PERMABOND 240 Adhesive: Plastic Bonding--Maximum Gap Fill PERMABOND 240 is the highest viscosity adhesive, providing maximum gap filling and maximum flow control. Typical Application: * Bonds molded parts with large gaps * Solvent resistant coating * Process aid, liquid clamp for large gaps * Can be used on porous substrates * Meets MIL-A-46050C Type II, Class 3 POWERBOND 920 Adhesive: High Temperature Metal Bonding--General Purpose POWERBOND 920 is a general purpose instant adhesive specifically formulated for high temperature metal bonding applications. 920 provides high strength and withstands heat aging temperatures of up to 500F on closely fitting metal parts. Typical Application: * Bonding closely fitted metal and ceramic parts for electronic and automotive applications


PERMABOND INTERNATIONAL: PERMABOND Cyanoacrylates

159

(Continued):

POWERBOND 919 Adhesive: High Temperature Metal Bonding--Fast Cure--Post Application POWERBOND 919 is a penetrating, high temperature instant adhesive specifically formulated for fast cure and post assembly applications. It develops high bond strength and resists heat aging temperatures up to 500F. Typical Application: * Bonding pre-assembled metal & ceramic parts for: * Electronic Applications * Automotive Applications POWERBOND 922 Adhesive: High Temperature Metal Bonding--Maximum Gap Fill POWERBOND 922 is a high temperature instant adhesive specifically formulated for maximum gap filling capabilities. 922's higher viscosity provides maximum flow control. It develops high bond strength and resists heat aging temperatures up to 500F. Typical Application: * Bonding parts with large gaps * Encapsulating * Bonds heat sinks

160


PERMABOND INTERNATIONAL: PERMABOND High Performance Cyanoacrylate Adhesives: * Maximum Purity * Maximum Cure Through Gap * Plastic and Elastomer Bonding The PERMABOND 260 Series of adhesives represents the ultimate in cyanoacrylate purity. This increased purity provides improved performance on difficult to bond materials. The 260 series will bond faster through a larger gap than standard cyanoacrylates. The PERMABOND 260 series is ideal for high speed production line applications. The fast cure of the 260 series reduces frosting on parts and odor problems in the work area. PERMABOND 260 Adhesive: PERMABOND 260 is a penetrating adhesive for application on pre-assembled parts. * Meets MIL-A-46050C Type II Class 1 PERMABOND 261 Adhesive: PERMABOND 261 is a low viscosity adhesive for closely fitted parts. * Meets MIL-A-46050C Type II Class 1 PERMABOND 262 Adhesive: PERMABOND 262 is a medium viscosity adhesive for general purpose applications. * Meets MIL-A-46050C Type II Class 2 PERMABOND 265 Adhesive: PERMABOND 265 is an intermediate viscosity adhesive for improved flow control for more uniform surface coverage. PERMABOND 268 Adhesive: PERMABOND 268 is a high viscosity adhesive for maximum gap filling capabilities and maximum flow control. * Meets MIL-A-46050C Type II Class 3 Typical Application: * EPDM rubber bonding * High speed automated & robqtic assembly lines * Speaker component bonding * Gasket and seal bonding

Section III Adhesives Epoxy

161

162

Adhesives,

ABATRON,

Sealants


Industry

INC.: One-Component Epoxy Systems:

Solventless Casting, Adhesive and Coating Compounds for Structural and Electric Uses. ABOCAST 8504-l: All-purpose - Clear - Good balance of properties. ABOCAST 8504-5: Plasticized - Clear - Very high strength and impact. ABOCAST 8103-13: Low-viscosity - Clear - Easy casting; deep impregnation. ABOCAST 8103-14: Lowest-viscosity - Clear - Maximum wetting and penetration. ABOCAST 8501-6: High-temperature - Clear - Very high temperature uses. ABOWELD 8504-a: 8504-l in putty form - Black - Adhesive paste; heat transfer ABOWELD 8504-g: 8501-6 in putty form - Black - Very high temp., heat transfer ABOWELD 8007-6: Flexible paste - Gray-tan - High thermocycling requirements. Suggested Uses: Casting, Potting, Enscapulating, Embedding Applications where 2-component systems can not be used. Electronic and structural components, patterns, medical equipment. Coating, Impregnation, Resurfacing, Insulation. Bonding metal, ceramics, glass, most rigid materials. Assembly, Patching, Filling. Comparative Parameters: ABOCAST 8504-l: Viscosity (approx.): 12,000 cps Pot life @ IOOC: 200 minutes Cure cycle: l-2 hours 8 150-160C Hardness, Rockwell M: 115 Deflection temperature: 168C Flexural strength, psi: 12,000 Compressive II , II : 31,200 1, , II : 4,200 Tensile Elongation: 1.1% Flexural modulus (xl0 5): 4.0 Thermal conductivity: 4-4.8 x 10 ABOCAST 8504-S: Viscosity (approx.): 1,500 cps Pot life 8 IOOC: 220 min. Cure cycle: l-2 hours 8 ISO-16OC Hardness, Rockwell M: 95 Deflection temperature: 72C Flexural strength, psi: 14,500 Compressive II , II : 40,500 II : 8,900 Tensile I *I II : 7.6% Elongation II Flexural modulus ix10 5): 4.4 Thermal conductivity: 4-4.8 x 10

+ optional l-4 hrs 8 160-18OC

-4 Cal/cm s C

+ optional l-4 hrs 8 160-18OC

-4 Cal/cm s C

Adhesives-Epoxy

163

ABATRON, INC.: One-Component Epoxy Systems(Continued1: Comparative Parameters(Continued): 8103-13: Viscosity (approx.): 600 cps Pot life 8 1OOC: 180 min. Cure cycle: l-2 hours 8 150-160C + optional l-4 hrs @ 160-180C Hardness, Rockwell M: 98 Deflection temperature: 104C Flexural strength, psi: 13,400 Compressive 11 , 11 : 13,100 II ' 11 : 6,400 Tensile Elongation: 3.3% Flexural modulus (x10 5): 3.9 Thermal conductivity: 4-4.8 x 10 -4 Cal/cm s C 8103-14: Viscosity (approx.): 200 cps Pot life @ 1OOC: 205 min. Cure cycle: l-2 hours @ 150-160C + optional l-4 hrs @ 160-180C Hardness, Rockwell M: 88 Deflection temperature: 79C Flexural strength, psi: 12,100 Compressive 11 , 11 : 10,900 I, Tensile I II : 8,400 Elongation: 5.1% Flexural modulus (x10 5): 3.3 Thermal conductivity: 4-4.8 x 10 -4 Cal/cm s C 8501-6: Viscosity (approx.): 17,000 cps Pot life 8 1OOC: 160 min. Cure cycle: l-2 hours 8 150-160C+optional l-4 hours 8 160-180C Hardness, Rockwell M: 121 Deflection temuerature: 255C Flexural strength, psi: 14,500 Compressive W , W : 35,400 Tensile II II : 3,800 Elongation: 0.7% ' Flexural modulus (x10 5): 5.0 Thermal conductivity: 4-4.8 x 10 -4 Cal/cm s C

164


ABATRON, INC.: 5 Variable-Ratio Epoxy Adhesives for Structural & Electric Applications: 2-component systems offering high strength and versatility ABOWELD/ABOCURE 48-8: High-viscosity, most versatile, fast hardening. ABOCAST/ABOCURE 45-10: Lower-viscosity, very versatile, faster then 48-8. ABOCAST/ABOCURE 37-10: Low-viscosity, easy to cast, slow, low exotherm. ABOCAST/ABOCURE 53-15: Variable-viscosity, easy to cast, fast-hardening. ABOWELD/ABOCURE 48-14: Thixotropic, for spreading & dipping, very slow. Suggested Uses: Bonding structural assemblies, like honey-comb sandwich doors and panels, aluminum or fiberglass panels on ships, trains, trucks and other carriers. Bonding, potting, encapsulating, dipping electric components like fuses, insulators, junction boxes, terminals, transformers, capacitors, diodes, switches, chips. Brushes, filters, laminates, furniture, mounts, repairs, patches. Comparative Parameters: ABOWELD 48-8: ABOCURE 48-8: Blend: Color: White: Black: Gray Viscosity: Poises 8 25-27C: 200 Pot Life 100 gm: 30-40 min Main Annlications: Assemblies/Panels/Reoairs/Mounts ABOCAST 45110: ABOCURE 45-10: Blend: Color: White: Black: Gray Viscosity: Poises @ 25-27C: 170 Pot Life 100 gm: 25-35 min Main Applications: Composites/Repair kits/Insulators/ Capacitors ABOCAST 37-10: ABOCURE 37-10: Blend: Color: White: Black: Gray Viscosity: Poises @ 25-27C: 100 Pot Life 100 gm: 2.5 hrs Main Applications: Loudspeakers/Magnets/Potting/Encapsulation ABOCAST 53-15: ABOCURE 53-15: Blend: Color: White: Black: Gray Viscosity: Poises 8 25-27C: 120-20 Pot Life 100 gm: 25-35 min Main Applications: Brushes/Potting/Impregnation/Injection ABOWELD 48-14: ABOCURE 48-14: Blend: Color: White: Black: Gray Viscosity: Poises 8 25-27C: Thixotropic Pot Life 100 gm: 8-11 hrs Main Applications: Fuses/Terminals/Dipping/Laminates

Adhesives-Epoxy

165

ABATRON, INC.: ABOWELD 8005-4/ABOCURE 8005-4: Heavy Duty Dielectric & Structural Adhesive Paste, Filler and Patching Compound for Underwater, Marine, Cold and General Applications 2-Component, Gray Flexibilized Epoxy System. Suggested Uses: Heavy-duty industrial, electrical, marine and construction maintenance. Underwater repairs and maintenance by divers. Bonding metals and porcelain in SF6-Gas-filled power circuit breakers. Dielectric encapsulation of electronic components, especially where high thermocycling and shock resistance are needed. Shrinkfree, weatherproof embedments of cables and conduits in floors, ceilings and walls. General purpose adhesion, patching and maintenance. Specifications: ABOWELD 8005-4: Resin: White Thixotropic Paste, about 13 Lbs/ Gallon (1.5 Kg/Liter) ABOCURE 8005-4: Converter: Black Thixotropic Paste, about 12 Lbs/Gallon (1.4 Kg/Liter) Mixing Ratios: Equal parts (by weight or volume) Pot Life: 30 minutes at room temperature; faster with heating. Cure: Full strength is reached in 2-7 days at room temperature Characteristics: Formulated for versatility, high impact and thermoshock resistance. Outstanding adhesion to wet as well as dry surfaces, both under water (for skin-diver applications) and above. This property is also used where a permanent bonding surface is needed to literally weld wet new-poured concrete to old concrete, metal and other construction surfaces. Usable for applications at very low temperatures that would be too cold for conventional epoxy compounds. Virtually unaffected by atmospheric conditions, soft and salt water, alkalis and diluted acids, several solvents, detergents, oils and greases. Visual control of mixing and ratios. Streaks in the blend show insufficient mixing. Too light or dark gray indicate, respectively, too much resin or too much converter. Tenacious adhesion to metals, ceramics, wood, fiberglass, masonry and most materials, to form permanent structural and dielectric bonds.

166


BACON INDUSTRIES INC.: ALLABOND TWENTY/TWENTY Adhesive: ALLABOND TWENTY/TWENTY is an epoxy adhesive that has an over twenty minute working life at room temperature and a twenty second cure at 250F. It therefore combines a relatively long pot life and yet a very fast cure. It may be mixed by hand or dispensed conveniently and rapidly from automatic or hand metering and mixing equipment. TWENTY/TWENTY is ideal for production applications now requiring soldering, welding or brazing. Also available is TWENTY/TWENTY NM which is similar but does not contain ingredients that are magnetic. It should be considered for applications requiring a non-magnetic adhesive. The cured properties of the "NM" grade are essentially identical. Also available is TWENTY/TWENTY Clear which contains no fillers and pigments. It is fluid and runny and, after cure, is not quite as strong or stiff. Also available is electrically conductive Conducting TWENTY/TWENTY. Mixing and Handling Parameters: TWENTY/TWENTY: Resin: TWENTY/TWENTY Activator: BA-66B Parts by weight of activator required per hundred parts by weight of resin*: 10 Viscositv of mixed adhesive at 77F. noise: 55 Work Life at 77F, minutes: 40 . _ Pot Life (Tack-Free Time) at 77F, minutes: 45 Recommended Cure: 1 hr/ZOOF Alternate Cure: 20 sec/250F or 24 hr/77F Properties of TWENTY/TWENTY After Recommended Cure: Color: Black Specific Gravity: 1.50 Hardness, Shore D: 88 Lap Shear Strength to Aluminum, psi: 1 hr/ZOOF: 3000 24 hr/77F: 2800 Flexural Strength, psi: 1 hr/200F: 12000 24 hr/77F: 6000 Flexural Modulus, psi x 10 6: 1 hr/2OOF: 0.9 24 hr/77F: 0.6 ASTM Heat Distortion Temperature (264 psi), F: 163 Coefficient of Linear Expansion between -5OF and +120F, (ASTM E831), 10 -6/F: 26 Glass Transition Temperature (TMA), F: 169 Moisture Absorption at 77F after 24 hr immersion, %: 0.17 * With TWENTY/TWENTY Clear, use 16.2 parts by weight of Activator BA-66B per hundred parts by weight of resin (phc) and with Conducting TWENTY/TWENTY use 5.5 phc of Activator BA-66B.

Adhesives-Epoxy

167

BOSTIK: Engineering Adhesives: BOSTIK 7575 Two Component Epoxy: BOSTIK 7575 is a two-component epoxy that cures in just five minutes to form strong bonds to metal, wood, ceramic, fabric, and some plastics. Convenient syringe dispenser pre-measures hardener and resin. Use 7575 for fast production, potting and maintenance applications. 7575: Designation: General purpose epoxy. Large gap filler. Cure Time: 5-10 min. Gap Fill: .050" Temperature Range: -65F to 250F Tensile Lbs/In: 3000 Impact Lbs/In: 25-30 Engineering Adhesives: M890 Acrylic Adhesive: M890 acrylic adhesive consists of a surface activator and adhesive that require no mixing and provide fast, permanent bonds even to plastics. M890 requires no special surface preparation. It forms tough, shock-resistant, water-resistant bonds with excellent shear and peel strengths. Recommended for use with all engineering materials including metal, rigid plastics, FRP's, hardwoods, rigid foams, ceramic and glass. M890: Designation: General purpose, high performance acrylic. Cure Time: 3-5 min. Gap Fill: .020" TemDeratUre Ranse: -65F to 250F Tensile Lbs/In:-3300 Impact Lbs/In: 40-50

168


CONAP, INC.: CONASTIC Dielectric Adhesive AD-20: Mix Ratio (Pbw) Part A/Part B: lOO/l7.5 Mixed Viscosity, cps @ 25C: 5500 Working Life @ 25C: (l/2 lb. mass) minutes: 15 Cure Schedule: Days @ 25C: 5-7 Hours @ 8OC: 4-6 Color: Opaque Amber Specific Gravity: 0.99 Shore A Hardness: 90 Tensile Strength, psi: 2000 Tear Strength, pli: 275 Elongation, %: 500 Water Absorption, %, 24 hr.130 days: 0.3/0.5 Linear Shrinkage, %: 1.00 Thermal Shock -70 to 130C (10 cycles): Passes Funaus Resistance: Non Nutrient Dieiectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds 8 25C: >120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.14 @ 1 MHz: 2.87 Dissipation Factor @ 100 Hz: .030 a 1 MHz: .Oll Volume Resistivity,-ohm-cm: 2.10x10 15 Insulation Resistance, ohms: ,2.5x 10 13 CONASTIC Dielectric Staking Adhesive ST-115: Mix Ratio (Pbw) Part A/Part B: 100/17.5 Mixed Viscosity, cps @ 25C: Thixotropic Paste Working Life 8 25C (l/2 lb. mass) minutes: 30 Cure Schedule: Days @ 25C: 5-7 Hours @ 8OC: 4-6 Color: Opaque Specific Gravity: 1.01 Shore A Hardness: 90 Tensile Strength, psi: 1900 Tear Strength, pli: 275 Elongation; %: 450 Water Absorption, %, 24 hr./30 days: 0.3-0.5 Linear Shrinkage, %: 1.00 Thermal Shock -70 to 130C (IO cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.14 @ 1 MHz: 2.87 Dissipation Factor @ 100 Hz: .030 @ 1 MHz: .Oll Volume Resistivity, ohm-cm: 2.10x10 15 Insulation Resistance, ohms: >2.5x 10 13

Adhesives-Epoxy

CONAP, INC.: CONATHANE EN-5: Mix Ratio (Pbw) Part A/Part B: 100117.5 Mixed Viscosity, cps @ 25C: 6000 Working Life 8 25C (l/2 lb. mass) minutes: 20 Cure Schedule: Days @ 25C: 5-7 Hours 8 80C: 4-6 Color: Opaque Amber Specific Gravity: 0.98 Shore A Hardness: 90 Tensile Strength, psi: 1950 Tear Strength, pli: 240 Elongation, %: 520 Water Absorption, %. 24 hr./30 davs: 0.4/0.5 Linear Shrinkage; %I 0.55 Thermal Shock -70 to 130C (IO cycles): Passes Funsus Resistance: Non NutrientDieiectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant 8 100 Hz: 3.14 @ 1 MHz: 2.87 Dissipation Factor 8 100 Hz: -030 8 1 MHz: .Oll Volume Resistivity,.ohm-cm: 2.10x10 15 Insulation Resistance, ohms: ,2.5x10 13 CONATHANE EN-6: Mix Ratio (Pbw) Part A/Part B: 100/17.5 Mixed Viscosity, cps 8 25C: 6000 Working Life 8 25C: (l/2 lb. mass) minutes: 120 Cure Schedule: Days @ 25C: N/A Hours 8 80C: 8 8 1OOC Color: Opaque Specific Gravity: 0.98 Shore A Hardness: 90 Tensile Strength, psi: 1950 Tear Strength, pli: 240 Elongation, %: 520 Water Absorption, %, 24 hr.130 days: O-4/0.5 Linear Shrinkage, %: 1.22 Thermal Shock -70 to 130C (10 cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" 8 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C Dielectric Constant @ 100 Hz: 3.14 @ 1 MHz: 2.87 Dissipation Factor @ 100 Hz: .030 @ 1 MHz: -011 Volume Resistivity, ohm-cm: 2.10x10 15 Insulation Resistance, ohms: >2.5x 10 13

169

170

Adhesives, Sealants and Coatings for the Electronics Zndmty

CONAP, INC.: CONATHANE EN-7: Mix Ratio fPbw) Part A/Part B: 100117.5 Mixed Viscosity, cps @-25C: 5500 Working Life @ 25C (l/2 lb. mass) minutes: 35 Cure Schedule: Days @ 25C: 7 Hours @ 80C: 16 Color: Opaque Amber Specific Gravity: 1.01 Shore A Hardness: 90 Tensile Strength, psi: 2300 Tear Strength, pli: 320 Elonsation. %: 450 Water Absorption, %, 24 hr.130 days: .2/.43 Linear Shrinkage, %: 1.15 Thermal Shock -70 to 130C (10 cvcles): Passes Fungus Resistance: Non NutrientDielectric Strength, VPM, l/16" @ 25C: 785 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.00 @ 1 MHz: 2.80 Dissipation Factor @ 100 Hz: .032 @ 1 MHz: .012 Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: ,2.5x10 13 CONATHANE EN-8: Mix Ratio (Pbw), Part A/Part B: 100/17.5 Mixed Viscosity, cps 8 25C: 5500 Working Life @ 25C (l/2 lb. mass) minutes: 10 Cure Schedule: Days @ 25C: 7 Hours @ 80C: 4-6 Color: Opaque Amber Soecific Gravitv: 1.01 Shore A Hardness: 90 Tensile Strength, psi: 2300 Tear Strength; plii 320 Elongation, %: 450 Water Absorption, %, 24 hr./30 days: .2-.43 Linear Shrinkage, %: 1.15 Thermal Shock -70 to 130C (10 cvcles): Passes Fungus Resistance: Non NutrientDielectric Strength, VPM, l/6" @ 25C: 785 Arc Resistance. seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.00 @ 1 MHz: 2.80 Dissipation Factor @ 100 Hz: .032 @ 1 MHz: .012 Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: ,2.5x10 13

Adhesives-Epoxy

CONAP, INC.: CONATHANE EN-g: Mix Ratio (Pbw) Part A/Part B: 100/17.5 Mixed Viscosity, cps 8 25C: 6800 Working Life @ 25CC(1/2 lb. mass) minutes: 70 Cure Schedule: Days @ 25C: 7-10 Hours @ 80C: 16 Color: Opaque Specific Gravity: 1.01 Shore A Hardness: 85 Tensile Strength, psi: 2000 Tear Strength, pli: 275 Elongation, %: 450 Water Absorption, %, 24 hr.130 days: 0.2/0.4 Linear Shrinkage, %: 1.15 Thermal Shock -70 to 130C (IO cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" @ 25C: 750 Arc Resistance, seconds 8 25C: >I20 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.00 @ 1 MHz: 2.80 Dissipation Factor 8 100 Hz: .032 @ 1 MHz: .012 Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: >2.5xlO 13 CONATNANE EN-9 (OZR): Mix Ratio (Pbw) Part A/Part B: 100/17.5 Mixed Viscosity, cps 8 25C: 6800 Working Life @ 25C (l/2 lb. mass) minutes: 70 Cure Schedule: Days @ 25C: 7-10 Hours 8 80C: 8 Color: Opaque Specific Gravity: 1.01 Shore A Hardness: 85 Tensile Strength, psi: 2500 Tear Strength, pli: 275 Elongation, %: 450 Water Absorption, %, 24 hr./30 days: 0.2/0.4 Linear Shrinkage, %: 1.00 Thermal Shock -70 to 130C (10 cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.03 @ 1 MHz: 2.81 Dissipation Factor @ 100 Hz: .031 8 1 MHz: .OlO Volume Resistivity, ohm-cm: 3.42x10 15 Insulation Resistance, ohms: >2.5xlO 13

I71

I72


CONAP, INC.: CONATHANE EN-lo: Mix Ratio (Pbw) Part A/Part B: 100/37 Mixed Viscosity, cps 8 25C: 5000 Working Life @ 25C (l/2 lb. mass) minutes: 60 Cure Schedule: Days 8 25C: 7-10 Hours @ 8OC: 16 Color: Opaque Amber Specific Gravity: 0.99 Shore A Hardness: 75 Tensile Strength, psi: 1200 Tear Strength, pli: 180 Elongation, %: 500 Water Absoration. %. 24 hr.130 davs: .24/.43 Linear Shrinkage; %I 1.19 * Thermal Shock -70 to 130C (IO cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" @ 25C: 710 Arc Resistance, seconds 8 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.10 @ 1 MHz: 2.70 Dissipation Factor 8 100 Hz: .027 8 1 MHz: .014 Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: ,2.5x10 13 CONATHANE EN-11: Mix Ratio (Pbw) Part A/Part B: 100/55 Mixed Viscosity, cps @ 25C: 5800 Working Life @ 25C (l/2 lb. mass) minutes: 50 Cure Schedule: Days 8 25C: 7-10 Hours @ 8OC: 16 Color: Opaque Amber Specific Gravity: 0.98 Shore A Hardness: 65 Tensile Strength, psi: 800 Tear Strength, pli: 140 Elongation, %: 400 Water Absorption, %, 24 hr.130 days: .23/.42 Linear Shrinkage, %: 1.15 Thermal Shock -70 to 130C (10 cycles): Passes Fungus Resistance: Non NutrientDielectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant 8 100 Hz: 3.30 @ 1 MHz: 2.90 Dissioation Factor B 100 Hz: .027 @ 1 MHz: .009 Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: ,2.5x10 13

Adhesives-Epoxy

CONAP, INC.: CONATHANE EN-12: Mix Ratio (Pbw) Part A/Part B: 100/95 Mixed Viscositv. CDS (a 25C: 6500 Working Life @-25C‘(lj2 lb. mass) minutes: 40 Cure Schedule: Days @ 25C: 7-10 Hours @ 8OC: 16 Color: Opaque Amber Specific Gravity: 0.99 Shore A Hardness: 55 Tensile Strength, psi: 300 Tear Strength, pli: 90 Elongation, %: 250 Water Absorption, %, 24 hr./30 days: .2/.31 Linear Shrinkage, %: 1.25 Thermal Shock - 70 to 130C (10 cycles): Passes Fungus Resistance: Non Nutrient Dieiectric Strength, VPM, l/16" @ 25C: 600 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.40 @ 1 MHz: 2.90 Dissipation Factor @ 100 Hz: .026 @ 1 MHz: .OlO Volume Resistivity, ohm-cm: 4.3x10 15 Insulation Resistance, ohms: ,2.5x10 13

173

174


COPPS INDUSTRIES, INC.: Solvent-Free, 100% Solids Hi Rel Epoxies: Rapid Gel: A-014BK/B-069: Mixed viscositv (CDS.) @ 77F: 2,500 Pot Life @ 77F: iO‘Min.Mixed Color: Black Gel Time @ 77F.: Mass: 15 Min. Film: 40 Min. Cure Time @ 77F. Initial: 2 Hrs. Resin:Hardener Mix Ratio: By Volume: 2:l By Weight: 3.5:l A-018/B-033: Mixed Viscosity (cps.) @ 77F.: 15,000 Pot Life 8 77F: 3-5 Min. Mixed Color: Clear Gel Time @ 77F.: Mass: 5 Min. Film: 7 Min. Cure Time 8 77F. Initial: 15 Min. Resin:Hardener Mix Ratio: By Volume: I:1 By Weight: 1:l A-083/B-086: Mixed Viscosity (cps.) 8 77F.: 6,000 Pot Life C 77F.: 5 Min. Mixed Color: Lt. Green Gel Time @ 77F.: Mass: 7 Min. Film: 10 Min. Cure Time @ 77F. Initial: 20 Min. Resin:Hardener Mix Ratio: By Volume: 1:1 By Weight: I:1 Applications: Switches, Relays, Appliances, Speakers, Sporting Goods, Safety Equipment Intermediate Gel: A-005BK/B-005: Mixed Viscosity (cps.) @ 77F.: 14,000 Pot Life @ 77F: 35 Min. Mixed Color: Black Gel Time @ 77F.: Mass: 50 Min. Film: 2 Hrs. Cure Time @ 77F.: Initial: 8 Hrs. Resin:Hardener Mix Ratio: By Volume: IO:1 By Weight: 20:1

Adhesives-Epoxy

17s

COPPS INDUSTRIES, INC.: Solvent-Free, 100% Solids Hi Rel Epoxies (Continued): Intermediate Gel(Continued): A-008/B-008: Mixed Viscosity (cps.) @ 77F: 600 Pot Life @ 77F: 45 Min. Mixed Color: Clear Gel Time @ 77F.: Mass: 60 Min. Film: 2-3 Hrs. Cure Time @ 77F. Initial: 16 Hrs. Resin:Hardener Mix Ratio: By Volume: I:1 By Weight: 1.2:1 A-036/B-011: Mixed Viscosity (cps.) @ 77F.: 5,000 Pot Life @ 77F.: 20 Min. Mixed Color: Tan Gel Time @ 77F.: Mass: 40 Min. Film: 2 Hrs. Cure Time @ 77F.: Initial: 8 Hrs. Resin:Hardener Mix Ratio: By Volume: 3:l By Weight: 6:l A-204BL/B-013: Mixed Viscosity (cps.) s 77F.: 4,000 Pot Life @ 77F.: 35 Min. Mixed Color: Blue Gel Time @ 77F.: Mass: 45 Min. Film: 3 Hrs. Cure Time @ 77F. Initial: IO Hrs. Resin:Hardener Mix Ratio: By Volume: 6.5:1 By Weight: 12:l A-254/B-456BK: Mixed Viscosity (cps.) @ 77F.: 2,300 Pot Life @ 77F: 40 Min. Mixed Color: Black Gel Time @ 77F.: Mass: 60 Min. Film: 3 Hrs. Cure Time @ 77F. Initial: 16 Hrs. Resin:Hardener Mix Ratio: By Volume: 1:l By Weight: 1.2:1 Applications: Potting or Encapsulation of Electrical/Electronic Subassemblies such as Voltage Regulators, Signal Systems, and Transformers.

176


COPPS INDUSTRIES, INC.: Solvent-Free, 100% Solids Hi Rel Epoxies (Continued): Extended Gel: A-009/B-009: Mixed Viscosity (cps.) @ 77F.: 1,500 Pot Life @ 77F.: 90 Min. Mixed Color: Clear Gel Time @ 77F.: Mass: 3 Hrs. Film: 8 Hrs. Cure Time @ 77F.3 Initial: 24 Hrs. Resin:Hardener Mix Ratio: Bv Volume: 1:l By Weight: 1:l A-014BK/B-014: Mixed Viscosity (cps.) @ 77F.: 7,000 Pot Life @ 77F.: 60 Min. Mixed Color: Black Gel Time @ 77F.: Mass: 2 Hrs. Film: 4 Hrs. Cure Time @ 77F. Initial: 24 Hrs. Resin:Hardener Mix Ratio: By Volume: 1:l By Weight: 1:l A-036BK/B-002: Mixed Viscosity (cps.) @ 77F.: 6,000 Pot Life @ 77F.: 2 Hrs. Mixed Color: Black Gel Time @ 77F.: Mass: 3-4 Hrs. Film: 6-8 Hrs. Cure Time @ 77F. Initial: 24 Hrs. Resin:Hardener Mix Ratio: By Volume: 3:1 By Weight: 6:l A-055/B-058: Mixed Viscosity (cps.) @ 77F.: 500 Pot Life @ 77F.: 4 Hrs. Mixed Color: Clear Gel Time @ 77F.: Mass: 8 Hrs. Film: 12 Hrs Cure Time @ 77F.: Initial: 24 Hrs. Resin:Hardener Mix Ratio: By Volume: 2:l By Weight: 2.2:1

Adhesives-Epoxy

177

COPPS INDUSTRIES, INC.: Solvent-Free, 100% Solids Hi Rel Epoxies (Continued): Extended Gel(Continued): A-085BK/B-085WH: Mixed Viscosity (cps.) 8 77F.: 80,000 Pot Life @ 77F.: 2 Hrs. Mixed Color: Grey Gel Time @ 77F.: Mass: 4 Hrs. Film: IO Hrs. Cure Time 8 77F. Initial: 24 Hrs. Resin:Hardener Mix Ratio: By Volume: I:1 By Weight: I:1 A-210/B-410: Mixed Viscosity (cps.) @ 77F.: 7,000 Pot Life @ 77F.: 4 Hrs. Mixed Color: Grey Gel Time 8 77F.: Mass: 8 Hrs. Film: 14 Hrs. Cure Time @ 77F.: 24 Hrs. Resin:Hardener Mix Ratio: By Volume: 2:1 By Weight: 2:l Applications: Products detailed provide both excellent Electrical Insulating Properties as well as High Compressive Strengths and Hardness Figures. Common uses include Electrical Brake and Clutch Manufacturing and Assembly, Electric Coils and Switches. Heat Cure Systems: A-018/B-029: Mixed Viscosity (cps.) 8 77F.: 600 Pot Life @ 77F.: 24 Hrs. Mixed Color: Clear Gel Time 8 200F: Mass: 40 Min. 8 250F: Film: 20 Min. Cure Time @ 200F: 4 Hrs. @ 250F: 2 Hrs. Resin:Hardener Mix Ratio: By Volume: l.l:l By Weight: I:1

178


COPPS INDUSTRIES, INC.: Solvent-Free, 100% Solids Hi Rel Epoxies (Continued): Heat Cure Systems (Continued): A-OZgBK/B-029: Mixed Viscosity (cps.) @ 77F: 3,000 Pot Life @ 77F: 16 Hrs. Mixed Color: Black Gel Time @ 200F: 45 Min. @ 250F: 25 Min. Cure Time @ 200F: 4 Hrs. @ 250F: 2 Hrs. Resin:Hardener Mix Ratio: By Volume: 2.6:1 By Weight: 3.3:1 A-036/B-036: Mixed Viscosity (cps.) @ 77F: 15,000 Pot Life @ 77F.: 24 Hrs. Mixed Color: Tan Gel Time @ 200F: 40 Min. @ 250F: 20 Min. Cure Time @ 200F: 4 Hrs. @ 250F: 2 Hrs. Resin:Hardener Mix Ratio: By Volume: 1:l By Weight: 1.3:1 D-105: Mixed Viscosity (cps.) 8 77F.: 300 Pot Life @ 77F.: 6 Months Mixed Color: Amber Gel Time @ 200F: 60 Min. @ 250F: 30 Min. Cure Time @ 200F: 6-8 Hrs. @ 250F: 3-5 Hrs. Resin:Hardener Mix Ratio: N.A. Applications: These Filled and Unfilled Systems have been used to Impregnate/Encapsulate High Voltage Coils, Transformers, Detectors and Resistors.

Adhesives-Epoxy

179

ITW DEVCON: DEVCON Epoxy Adhesives for Bonding All Durable Materials: 5 MINUTE Epoxy: A rapid cure, medium viscosity epoxy for general purpose use. It is designed for bonding, potting, sealing and encapsulating all delicate electronic and mechanical components. It bonds rigid, durable substrates such as metals, ceramics, glass, concrete and wood in all combinations. It forms a clear, hard rigid bona or coating when fully cured in 4 hours. Design Performance: * Rapid 7 minute fixture * Hard, durable bonds * Easy mixing 1:l ratio * Good dielectric strength * Good solvent resistance 5-MINUTE Epoxy Gel: A very high viscosity, non-sagging epoxy that has high tensile strength and good solvent resistance. It bonds rough textures like concrete as well as smooth glass-like surfaces. Rapid cure allows handling in 7 minutes and use within an hour. Design Performance: * Non-sag, stay in place form * Fills gaps * Rapid cure * High strength to 2500 psi * Color coded mixing * Easy to meter and mix * Bonds concrete, wood, metal and ceramics 2-TON Clear Epoxy: A medium viscosity, high strength epoxy especially formulated for c00a clarity and water resistance. The viscositv urovides easy-dispensing; mixing and good wetting of rigid bondable substrates. Slower cure time allows for longer pot life and parts alignment. Design Performance: * Non-shrinking clear coating * High tensile strength to 2200 psi * Water and solvent resistant * Fills gaps and voids * Good impact strength

I80

Adhesives,

Sealants


Industy

ITW DEVCON: DEVCON Epoxy Adhesives for Bonding all Durable Materials (Continued): High Performance Epoxy: A high viscosity toughened epoxy with high impact, peel, and fatigue strength for use with all metals, laminates and structural parts. It has high tensile and tensile shear strength. Will fill gaps and bond rough surfaces. Bonds thermoset plastics to metals and each other. Design Performance: * Easy mixing * High impact, peel and fatigue * Fills gaps * Slow cure for parts positioning * High strength to 2500 psi * High dielectric strength * Good solvent resistance Only High Performance Epoxy is recommended for use with plastics. 5-MINUTE Epoxy: Mixed Vise. cps: 8,000 cps Pot Life Min.: 3 to 5 Min. Shrinkage in-/in.: 0.0216 Hardness Shore D: 85 Impact ft. lbs.: 1.084 Cured Density: 1.10 Thermal Cod.: 0.93 Thermal Exvan. x 10 -6 in./in. F: 88.5 Adhesive Shear psi: 1379 Compression Strength psi: 10,674 Flexural Strength psi: 11,496 Tensile Strength psi: 6305 Elastic Modulus psi: 2.43 Dielectric Strength V/Mil.: 490 Max. Temperature Resistance: 200 Functional Cure (80%): 314 - 1 hour Color: Clear Mix Ratio: 1:l

Adhesives-Epoxy

ITN DEVCON: DEVCON Epoxy Adhesives for Bonding All Durable Materials (Continued): 5-MIN. Gel: Mixed Vise. cps: Gel Pot Life Min.: 3 to 6 Min. Shrinkase in./in.: 0.0240 Hardness Shore D: 80 Cured Density: 1.17 Adhesive Shear usi: 2500 Dielectric Strength V/Mil.: 440 Max. Temperature Resistance: 200 Functional Cure (80%): 3/4 - 1 Hour Color: Amber Mix Ratio: I:1 Z-TON

Clear: Mixed Vise. cps: 4,000 cps Pot Life Min.: 8/12 Min. Shrinkage in./in.: 0.0035 Hardness Shore D: 83 Imnact ft. lbs: 1.246 Cured Density: 1.10 Thermal Cond.: 0.83 Thermal Expan. x 10 -6 in-/in. F: 161.5 Adhesive Shear psi: 2250 Compression Strength psi: 11,248 Flexural Strength psi: 11,202 Tensile Strencth osi: 5709 Elastic Modulus psi.: 2.07 Dielectric Strength V/Mil.: 600 Max. Temperature-Resistance: 200 Functional Cure (80%): 8 to 16 Hours Color: Clear Mix Ratio: I:1

High Perf.: Mixed Vise. cps: 50,000 cps Pot Life Min.: 40/60 Min. Shrinkage in-/in.: 0.0009 Hardness Shore D: 83 Cured Density: 1.20 Adhesive Shear psi: 2500 Dielectric Strensth V/Mil.: 550 Max. Temperature-Resistance: 200 Functional Cure (80%): 4 to 48 Hours Color: Grey Mix Ratio: I:1

181

182


ITW DEVCON: DEVCON Epoxy Adhesives for Bonding All Durable Materials (Continued): Special F Epoxy: Mixed Vise. cps: Paste Pot Life Min.: 150 Min. Shrinkage in-/in.: 0.001 Hardness Shore D: 85 Impact ft. lbs: 0.559 Cured Density: 2.46 Thermal Cond.: 1.21 Thermal Exnan. x 10 -6 in./in. F: 111.4 Adhesive Shear psi: 2472 Compression Strength psi: 12,386 Flexural Strength psi: 8210 Tensile Strength psi: 4367 Elastic Modulus psi: 2.74 Dielectric Strength V/Mil.: 100 Max. Temperature Resistance: 250 Functional Cure (80%): 16 to 36 Hours Color: Aluminum Mix Ratio: I:1 Plastic S. S-5: Mixed Vise. cps: Putty Pot Life Min.: 90 Min. Shrinkage in./in.: 0.0006 Hardness Shore D: 84 Impact ft. lbs: 0.389 Cured Density: 1.70 Thermal Cond.: 1.21 Thermal Expan. x 10 -6 in-/in. F: 116.0 Adhesive Shear psi: 1985 Compression Strength psi: 10,752 Flexural Strength psi: 5522 Tensile Strength psi: 3148 Elastic Modulus psi: 2.64 Dielectric Strength V/Mil.: 50 Max. Temperature Resistance: 225 Functional Cure (80%): 12 to 16 Hours Color: Dark Grey Mix Ratio: I:1

Adhesives-Epoxy

ITW DEVCON: DEVCON Epoxy Adhesives for Bonding All Durable Materials (Continued): 2-TON White: Mixed Vise. cps: Paste Pot Life Min.: 150 Min. Shrinkage in-/in.: 0.0035 Hardness Shore D: 85 Imoact ft. lbs: 0.3675 Cured Density: 1.85 Thermal Cond.: 1.06 Thermal Expan. x 10 -6 in./in. F: 79.4 Adhesive Shear psi: 2651 Compression Strength psi: 8449 Flexural Strength psi: 5649 Tensile Strength psi: 2256 Elastic Modulus psi: 2.25 Dielectric Strength V/Mil.: 365 Max. Temperature Resistance: 225 Functional Cure (80%): 16 to 36 Hours Color: White Mix Ratio: 1:l

183

184

Adhesives,

DIMITER

Sealants

EMULSION


& CHEMICAL

CO.:

"F"

Industry

and "E" Series Epoxies:

Designed exclusively for Microelectronics Applications. "F" series electronically-conductive gold and silver Epoxies for bonding substrates, chip bonding, mounting Semiconductor chips in hybrid circuits. "F" and "E" series Epoxies represent the most complete selection of high technology, and uniquely qualified in solving most perplexing problems with standard or customformulated types. "Testing Program" available by request. F-17 E-21 E-22 PC-24 - "Photo-Cure" ~~-31 - "Photo-Polymer"

Adhesives-Epoxy

DOW CBEMICAL: Epoxy Products for Adhesives and Sealants: Bisphenol A Epoxy Resins: Liquid: D.E.R. 317: Epoxide Equivalent Weight: 192-203 Viscosity (cps): 16000-25000 Color: 5Density (lbs/gal): 9.7 Flash Point (F): 485 D.E.R. 330: Epoxide Equivalent Weight: 176-185 Viscositv (CDS): 7000-10000 Color: 125‘ c ’ Density (lbs/gal): 9.7 Flash Point (F): 485 D.E.R. 331: Epoxide Equivalent Weight: 182-192 Viscosity (cps): 11000-14000 Color: 125 Density (lbs/gal): 9.7 Flash Point (F): 485 D.E.R. 332: Epoxide Equivalent Weight: 172-176 Viscosity (cps): 4000-6000 Color: 75 Density (lbs/gal): 9.7 Flash Point (F): 485 D.E.R. 337: Epoxide Equivalent Weight: 230-250 Viscosity (cps): 400-800 Color: 3 Density (lbs/gal): 9.7 Flash Point (F): 485 D.E.R. 362: Epoxide Equivalent Weight: 185-205 Viscosity (cps): 4500-6500 Color: 1 Density (lbs/gal): 9.5 Flash Point (F): 485

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DOW CHEMICAL: Epoxy Products for Adhesives and Sealants (Continued): Diluted: D.E.R. 324: Epoxide Equivalent Weight: 197-206 Viscosity (cps): 600-800 Color: 3 Density (lbs/gal): 9.3 Flash Point (F): 350 D.E.R. 325: Epoxide Equivalent Weight: 185-201 Viscosity (cps): 1600-2800 Color: 2 Density (lbs/gal): 9.5 Flash Point (F): 375 Solid: D.E.R. 661: Epoxide Equivalent Weight: 500-560 Viscosity (cps): 400-800 Color: 1 Softening Point (C): 75-85 Cast Density (lbs/gal): 9.9 Specific Gravity: 1.18 D.E.R. 662: Epoxide Equivalent Weight: 575-685 Viscosity (cps): 900-2000 Color:

1

Softening Point (C!):84-94 Cast Density (lbs/gal): 9.9 Specific Gravity: 1.18 D.E.R. 664: Epoxide Equivalent Weight: 875-955 Viscosity (cps): 4000-8000 Color: 1 Softening Point (C): 98-108 Cast Density (lbs/gal): 9.9 Specific Gravity: 1.18

Adhesives-Epoxy

DOW CHEMICAL: Epoxy Products for Adhesives and Sealants (Continued): Polyglycol Resins: D.E.R. 732: Epoxide Equivalent Weight: 310-330 Viscosity (cps): 55-75 Color: 60 Density (lbs/gal): 8.9 Flash Point (F): 310 D.E.R. 736: Epoxide Equivalent Weight: 175-205 Viscosity (cps): 30-60 Color: 125 Density (lbs/gal): 9.5 Flash Point (F): 320 D.E.R. 755: Epoxide Equivalent Weight: 265-295 Viscosity (cps): 1000 Color: 2 Density (lbs/gal): 9.4 Flash Point (F): 310 Novolac Resins: D.E.N. 431: Epoxide Equivalent Weight: Viscosity (cps): 1100-1700 Color: 3 Density (lbs/gal): 10.1 Flash Point (F): 425

172-179

D.E.N. 438: Epoxide Equivalent Weight: 176-181 Viscosity (cps): 20000-50000 Color: 2 Density (lbs/gal): 10.2 Flash Point (F): 425

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DOW CHEMICAL: Epoxy Products for Adhesives and Sealants (Continued): TACTIX Resins: TACTIX 785: Epoxide Equivalent Weight: 165-195 Viscosity (cst): 400-1150 Color: N/A Softening Point (C): 66-85 Flash Point (F): N/A TACTIX 742: Epoxiae Equivalent Weight: 150-170 Viscosity (cst): 25-60 Color: 13 Softening Point (Cl: semi-solid Flash Point (F): N/A TACTIX 695: Epoxiae Equivalent Weight: 640-665 Viscosity: 2000-6000 (cps) Color: N/A Softening Point (C): semi-solid Flash Point (F): N/A

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FENWAL INC.: TRU-BOND Epoxy Adhesives: TRU-BOND 201: High Strength--Thermosetting (Epoxy Type--loo% Solids)

Structural Adhesive

TRU-BOND 201 - Structural adhesive for bonding dissimilar or like surfaces of metals, ceramics, concrete, abrasives, wood products, thermosetting plastics, etc. Easy to use with a SO/SO ratio by weight or volume. TRU-BOND 201 can be room temperature or heat cured to produce higher strengths. Cured assemblies have a degree of resilience making them resistant to shock loading. Suitable for use with temperatures of -1OOF to +250F, showing good retention of properties over the range. Properties: Color: Gray Pot Life (100 gms.): 2 hours @ 75F Consistency: Flowable Paste Shear Tensile (psi) @ -65F: 3200 75F: 4100 180~: 1200 Hardness, Shore D: 85/05 Specific Gravity (Cured System): 1.27 TRU-BOND 203: High Strength Thixotropic Adhesive (100% Solids) TRU-BOND 203 is a modified epoxy adhesive which had tenacious adhesion to most substrates. It has a buttery consistency and is supplied with a choice of three curing agents to cover a wide range of applications. TRU-BOND 203 may be used in the bonding of metals, rubber, ceramics, plastics, foams, wood, etc., to themselves and to each other. It is 100% solids and resistant to oil, gasoline, jet fuel, hydraulic fluid, acids, alkalis, salt, moisture, etc. It is a true insulator and is used in the prevention of corona and galvanic attack. TRU-BOND 203 handles easily, like spreading soft butter. It is generally applied with a spatula or trowel, and has excellent leveling properties in the filling of voids and non-uniform surfaces. Selection of Curing Agent: 901: Produces firm bonds with excellent physical properties 902: Produces firm bonds and withstands continuous temperatures up to 300F. 907: Produces structural bonds with most materials. 911: Produces structural bonds with most materials and is used for the bonding of rubber to itself and other substrates.

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FENWAL INC.: TRU-BOND Epoxy Adhesives

(Continued):

TRU-BOND 203/911: High strength thixotropic adhesive TRW-BOND 203 used in equal portions with Curing Agent 911 is a 100% solids, structural adhesive. It can be cured at room temoerature and develoos full strensth in 48 hours. It handles easily and having the consistency of soft butter, it is easily applied with a trowel or spatula. TRU-BOND 203 does not flow after aoolication. makins it easv to spread to the right thickness. It-is used for the-structural bonding of metals; glass, ceramics, rubber, cellulose products, thermosetting resins and foams, to themselves and to each other. TRU-BOND 203 is an excellent adhesive for the bonding of "sandwich" panels. Properties: Type: Epoxide Color: Opaque Shear Tensile, psi (Al to Al): 3,000 Consistency: Thixotrooic Dielectric-Strength, volts/mil: 400 Dielectric Constant 8 10 3 cps: 3.55 Volume Resistivitv: 10 15 Pot Life: 2 hrs. in 100 gram batches Time to Harden: 4 to 6 hrs. @ R.T. Cure Schedule: 48 hrs. @ 70F., or 1 hour @ 150F TRU-BOND 204: Flexible Adhesive TRU-BOND 204 is an excellent bonding agent where the resilient bonds and low temperature characteristics are required. It is particularly suitable for bonding materials having unlike coefficients of thermal expansion. Properties: Pot Life, minutes: 23 Hardness @ 5 days, Shore Tensile Shear Strength @ Tensile Shear Strength @ Tensile Shear Strength @ Cure Cycle: Curing Temperature 68. 104 158 212 266

(F)

D: 85 -4OF, psi: 2470 68F, psi: 3200 158F, psi: 750 Minimum Time 30 hours 10 hours 3 hours 45 minutes 15 minutes

Adhesives-Epoxy

FENWAL INC.: TRW-BOND Epoxy Adhesives

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(Continued):

TRU-BOND 205: Epoxide Adhesive (Casting - Laminating - Adhesive) TRU-BOND 205 is a two-part system, formulated for variable flexibility and hardness and is used as an adhesive, a casting resin and for laminating applications. Flexibility and hardness are changed by using different ratios of resin/hardener. The resin is extremely tough and impact resistant, having a high peel strength, long pot life, low shrinkage and low exotherm. TRU-BOND 205 has superior qualities for embedments, having a high dielectric strength and excellent electrical properties. Properties: Color: Amber, may be blended with fillers Adhesion: Tenacious to metals, ceramics & thermosetting elastics Pot Life (100 grams): 2 hours 82/78 Hardness, Shore D Ratio: (Parts by weight): 60/40 62/58 so/50 40/60 30170 Ratio of Resin to Hardener, 60/40 (Castins): Tensile, psi: 6,600 . Compressive Strength, psi: 12,000 Flexural Strength; psii 12,300 Specific Gravity: 1.06 Coef. Linear Expansion, in/in/C: 37x10 -6 Dielectric Strength, volts/mil: 430 Dielectric Constant, 10 3 cps: 3.32 Volume Resistivity (ohm-cm): 1.1 x IO 14 Arc Resistance (sec.): 82 Power Factor, 10 3 cps: 0.0108 Ratio of Resin to Hardener, 50/50 (Laminating): Flexural Strength, psi: 60,000 Flexural Modulus of Elasticity, psi: 2.5 x 10 -6 Tensile Strength, psi, 80F: 50,000 Cure schedule: 300F: 10 minutes 200F: 45 minutes 150F: 120 minutes

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FENNAL INC.: TRU-BOND Epoxy Adhesives

(Continued):

TRU-BOND 206: Conductive Adhesive Solder TRU-BOND 206 is a two-part, epoxide based compound used for bonding components requiring good electrical conductivity. It is used in manv aonlications where hot solder would damage or destroy the el&trical or electronic components. It may also be used in cases where hot solder will not bond to the types of metals or metal wires to be joined. The volume resistivity is less than 1 x 10 -3 ohm cm, and bond strengths range as high as 2500 lbs. per inch in shear. In using this conductive solder, the same care should be taken to clean the parts to be bonded as setup for standard epoxy adhesives. Parts should be free of paint, oil, dirt or other foreign materials when preparing so as to prevent weak boundary layers between the substrates. Application Data: Ratio, parts by weight, A/B: 100/6 Pot life: 25 minutes, approximate Time to harden: 45 to 60 minutes at 70F Cure: 48 hours at 70F or 1 hour at 130F TRU-BOND 208: Epoxide Adhesive: High Peel Strength TRU-BOND 208 is a two-part epoxide-based resin adhesive which is used in equal proportions by weight, Part A to Part B. It has good shear and peel strength and is used for bonding most substrates to themselves and to each other. TRU-BOND 208 has good dielectric strength and the cured adhesive has excellent resistance to oils, gasoline, JP4 jet fuel, salt spray, acids, alkalis and most solvents. TRU-BOND 208 is used in the construction of honeycomb panels and other types of core construction. Properties: Pot Life, hours: 2 Initial Mix Viscosity, cps: 8000 Color: Amber Dielectric Strength, volts/mil: 450 Tensile shear strength @ 75F. psi: 1000 Tensile shear strength @ 75F, cured 24 hours @ 75F, psi: 500 Chemical resistance - Tensile shear strength (psi) @ 75F after 7 days immersion in: Type 3 Hydrocarbon Fluid: 1000 JP4 Fuel: 1000 Distilled H20: 700 Cure Schedules: 75F: 7 days 160F: 1 hour 250F: 20 minutes

Adhesives-Epoxy

FENWAL INC.: TRW-BOND Epoxy Adhesives

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(Continued):

TRU-BOND 209: Structural Adhesive - High Shear Strength TRU-BOND 209 is a 100% solids modified epoxy adhesive used for the structural assembly of metals, ceramics, rigid plastics, rubber, foams, etc. TRU-BOND 209 is sufficiently flowable to give uniform surface wetting and coverage with application by brush, roller, knife or spatula. It is a two-component mixture consisting of equal parts by weight and may be metered visually for non-critical applications. Description: Type: two-component, modified epoxy Color: opaque Tensile shear strength, psi (Al to Al): 3,000 Consistency: Moderate Thixotrope Pot Life (100 grams), hours: 2 Time to Set (Hours at room temperature): 4 to 6 Time to Cure - Hours at 70F: 48 Hours at 15OF: 1 TRU-BOND 210: Epoxy Resin Base, High Shear Past Adhesive TRU-BOND 210 is a thixotropic, epoxy paste compound which meets all requirements of MMM-A-187a. TRU-BOND 210 is 100% solids, a two-part system and is used in an equal part ratio by volume or by weight. It does not run, drip or sag when used in sections up to l/16". With properly cleaned surfaces, TRU-BOND 210 bonds securely under contact only and at room temperatures or moderate elevated temperatures. Properties: Type: non sag paste Color: light gray Pot Life (100 grams @ 75F): 90 minutes Shear strength, Al to Al: -65~: 2,000 psi 75F: 4,000 psi 160F: 1,200 psi Ratio: equal parts by weight or volume

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FENWAL INC.: TRU-BOND Epoxy Adhesives

(Continued):

TRU-BOND 212: Conductive Adhesive solder TRU-BOND 212 is a two-part thixotropic epoxy which is filled with conductive silver powder. The system combines a convenient equal parts mix ratio with a long pot life and rapid cure under heat. TRU-BOND 212 is intended for use in demanding electronics applications. Volume resistivity is a low 0.0003 ohm-cm. As a 100% solids system it also has applications where low outgassing is required. In using this conductive solder, the same care should be taken to clean the parts to be bonded as set up for standard epoxy adhesives. Parts should be free of paint, oil, dirt or other foreign materials when preparing so as to prevent weak boundary layers between the substrates. Application Data: Ratio A/B: lOO/lOO PBW Pot Life: 4 days 8 77F Cure Schedule: 1 min. @ 345F or 5 min. @ 300F or 15 min. @ 250F or 1 l/2 hrs. @ 175F Tensile Shear Strength: 1450 psi Heat Deflection Temp.: 130F TRU-BOND 214: Silver-Filled Epoxy Adhesive Federal Specification MMM-A-1931 Types 1 & 2 TRU-BOND 214 is a two-part, room temperature curing, conauctive epoxy which meets Federal Specification MMM-A-1931 types l&2. It is suited for any application where hot soldering is impractical. The adhesive has proven successful in the preparation of conductive paths on circuit boards and in the preparation of electrodes for capacitance and loss measurement. Properties: Color: silver Percent solids: 100 Sag flow, at l/4": non-sag Pot life, minutes: 60 Volume resistivity, ohm/cm: 0.003 Hardness, Shore D: 80 Corrosivity (FED sta 175,4031): non-corrosive Tensile shear strength @ -67F, psi: 1200 Tensile shear strength @ 73F, psi: 1200 Tensile shear strength @ 140F, psi: 1200

Adhesives-Epoxy

H.B. FULLER CO.: Electrical/Electronic

Products: Epoxies:

FE-0004: Viscosity of Blend @ 25C, cps: 62,500 Mix Ratio by Weight(A/B): 100/111 Pot Life @ 25C: 60-120 Min. Max Exotherm C: 37 Typical Cure Schedule: 24 Hrs. @ 25C Color: Tan Specific Gravity: 1.31 Hardness: 90 Shore D Tensile Properties: Strength, PSI: 5,700 Elongation, %: 3.5 Maximum Operating Temperature, C: 130 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 62.5 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 158 Glass Transition Temperature (TG) C: 73 Dielectric Constant 8 23C: 60HZ: 3.75 Dielectric Constant @ 23C: 100KHZ: 3.62 Dissipation Factor 8 23C: 60HZ: 0.00642 Dissioation Factor B 23C: 100HZ: 0.0150 Volume Resistivity @ 23C (ohm-cm): 6.9x10 15 Offers low exotherm properties coupled with excellent heat resistance. This product is QPL'D against MMM-A-134, Type I. FE-0086: Viscosity of Blend @ 25C, cps: 55,000 Mix Ratio by Weight (A/B): 100/150 Pot Life @ 25C: 60-120 Min. Max Exotherm C: 93 Typical Cure Schedule: 48 Hrs. @ 25C Color: Gray Specific Gravity: 1.32 Hardness: 95 Shore A Tensile Properties: Strength, psi: 1,900 Elongation, %: 150 Maximum Operating Temperature C: 80 Thermal Conductivity CAL/CM-SEC-C: 9.4x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 75.3 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 177 Glass Transition Temperature (TG) C: 3 Dielectric Constant @ 23C: 60HZ: 6.53 Dielectric Constant @ 23C: 100HZ: 4.63 Dissipation Factor @ 23C: 60HZ: 0.164 Dissination Factor 8 23C: 100KHZ: 0.0736 Volume Resistivity @ 23C (ohm-cm): 8.8x10 11 Offers outstanding flexibility, good electrical properties and excellent adhesion to a variety of difficult-to-bond plastics.

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Adhesives, Sealants and Coatings for the Electronics Zndzuty

H.B. FULLER CO.: Electrical/Electronic (Continued):

Products: Epoxies

FE-0185: Viscosity of Blend 8 25C, cps: Thixotropic Mix Ratio By Weight (A/B): One Component Pot Life @ 25C: N/A Max Exotherm C: N/A Typical Cure Schedule: 4 Hrs. @ 15OC Color: Tan Specific Gravity: 1.15 Hardness: 86 Shore D Tensile Properties: Strength, PSI: 8,400 Tensile Properties: Elongation, %: 15.1 Maximum Operating Temperature C: I55 Thermal Conductivity CAL/CM-SEC-C: 6.4x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 76.5 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 160 Glass Transition Temoerature ITG) C: 91 Dielectric Constant @ 23C: 6OHZ:.3.97 Dielectric Constant 8 23C: IOOKHZ: 3.75 Dissipation Factor: 60HZ: 0.0106 Dissipation Factor: 100KHZ: 0.0252 Volume Resistivity @ 23C: (ohm-cm): 6.5x10 15 Exhibits thixotropy at room temperature, but is self leveling at cure temperature. Excellent heat resistance and toughness. FE-4066: Viscosity of Blend @ 25C, cps: 12,000 Mix Ratio By Weight (A/B): 100/67 Pot Life @ 25C: 90-160 Min. Max Exotherm C: 73 Typical Cure Schedule: 48 Hrs. @ 25C Color: Light Straw Specific Gravity: 1.07 Hardness: 75 Shore D Tensile Properties: Strength, PSI: 7,980 Tensile Properties: Elongation, %: IO.4 Maximum Operating Temperature, C: I30 Thermal Conductivity CAL/CM-SEC-C: 6.6x10 -4 Thermal Coefficient of Expansion: urn/m/C: Alpha I: 80.1 Thermal Coefficient of Expansion: urn/m/C: Alpha 2: 179 Glass Transition Temperature (TG) C: 83 Dielectric Constant 8 23C: 60HZ: 3.26 Dielectric Constant @ 23C: IOOKHZ: 3.14 Dissipation Factor @ 23C: 60HZ: 0.00719 Dissipation Factor @ 23C: 100KHZ: 0.0193 Volume Resistivity 8 23C (ohm-cm): 1.2x10 I6 Offers a long pot life in conjunction with excellent electrical properties. Meets MIL-A-81236 when blended at 5A/4B by volume. FDA 175.105 and 175.300 component approved.

Adhesives-Epoxy


Products: Epoxies

FE-7004: Viscosity of Blend 8 25C, cps: 7,500 Mix Ratio By Weight(A/B): 100/42 Pot Life @ 25C: 50-70 Min. Max. Exotherm C: 117 Typical Cure Schedule: 24 Hrs. @ 25C Color: Amber Specific Gravity: 1.09 Hardness: 85 Shore D Tensile Properties: Strength, PSI: 8,730 Tensile Properties: Elongation, %: 9.8 Maximum Operating Temperature, C: 105 Thermal Conductivity CAL/CM-SEC-C: 6.1x10 -4 Thermal Coefficient of EXDanSiOn urn/m/C: Aloha 1: 80.5 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 203 Glass Transition Temperature (TG) C: 49 Dielectric Constant @ 23C: 60HZ: 3.01 Dielectric Constant @ 23C: 10OKHZ: 2.88 Dissipation Factor @ 23C: 60 HZ: 0.0110 Dissipation Factor @ 23C: 100KHZ: 0.0186 Volume Resistivity @ 23C (ohm-cm): 6.7x10 15 Offers excellent electrical property performance coupled with outstanding versatilty within the product line. FE-7014: Viscosity of Blend @ 25C, cps: 1,500 Mix Ratio By Weight (A/B): 100/42.5 Pot Life @ 25C: 50-70 Min. Max. Exotherm C: 127 Typical Cure Schedule: 24 Hrs. @ 25C Color: Amber Specific Gravity: 1.06 Hardness: 80 Shore D Tensile Properties: Strength, PSI: 8,430 Tensile Properties: Elongation, %: 10.0 Maximum Operating Temperature, C: 105 Thermal Conductivity CAL/CM-SEC-C: 6.7x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 77.2 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 190 Glass Transition Temperature (TG) C: 67 Dielectric Constant @ 23C: 60HZ: 3.40 Dielectric Constant @ 23C: 100KHZ: 3.25 DiSSiDatiOn Factor P 23C: 60HZ: 0.0111 Dissipation Factor @ 23C: 100KHZ: 0.0192 Volume Resisivity @ 23C (ohm-cm): 1.3x10 16 Low-viscosity, general-purpose potting epoxy.

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Products: Epoxies

FE-7041: Viscosity of Blend 8 25C, cps: 1,750 Mix Ratio By Weight (A/B): 100/43 Pot Life @ 25C: 50-70 Min. Max Exotherm C: 125 Typical Cure Schedule: 24 Hrs. 8 25C Color: Amber Specific Gravity: 1.08 Hardness: 86 Shore D Tensile Properties: Strength, PSI: 9,900 Tensile Properties: Elongation, %: 10.9 Maximum Operating Temperature, C: 105 Thermal Conductivity CAL/CM-SEC-C: 6.0x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 86.1 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 261 Glass Transition Temperature (TG) C: 62 Dielectric Constant @ 23C: 60HZ: 3.31 Dielectric Constant @ 23C: 100KHZ: 3.16 Dissipation Factor @ 23C: 60HZ: 0.00894 Dissipation Factor 8 23C: 100KH.Z: 0.0194 Volume Resistivity 8 23C (ohm-cm): 1.2x10 16 Low-dermatetic version of FE-7014 FE-7074: Viscosity of Blend @ 25C, cps: 20,000 Mix Ratio By Weight (A/B): 100/42 Pot Life @ 25C: 60-100 Min. Max Exotherm C: 123 Typical Cure Schedule: 24 Hrs. @ 25C Color: Light Amber Specific Gravity: 1.08 Hardness: 80 Shore D Tensile Properties: Strength, PSI: 7,910 Tensile Properties: Elongation, %: 15.8 Maximum Operating Temperature, C: 105 Thermal Conductivity CAL/CM-SEC-C: 6.8x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 76.8 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 193 Glass Transition Temoerature(TG) C: 67 Dielectric Constant ‘@ 23C: 6iHZi 3.28 Dielectric Constant @ 23C: IOOKHZ: 3.12 Dissipation Factor @ 23C: 60HZ: 0.0129 Dissipation Factor @ 23C: 100KHZ: 0.0188 Volume Resistivity @ 23C (ohm-cm): 1.2x10 16 Low-dermatetic version of FE-7004

Adhesives-Epoxy


Products: Epoxies:

FE-7200: Viscosity of Blend @ 25C, cps: 180 60% Solids Mix Ratio By Weight (A/B): 100/45 Pot Life @ 25C: 18-60 Hrs Max Exotherm C: N/A Typical Cure Schedule: See Data Sheet Color: Amber Specific Gravity: 1.07 Hardness: 93 Shore A Tensile Properties: Strength, PSI: N/A Tensile Properties: Elongation, %: N/A Maximum Operating Temperature, C: 80 Thermal Conductivity CAL/CM-SEC-C: 6.6x10 -4 Thermal Coefficient of Expansion inn/m/C: Alpha 1: 116 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 274 Glass Transition Temperature (TG) C: 16 Dielectric Constant @ 23C: 60HZ: 4.42 Dielectric Constant @ 23C: 100KHZ: 3.47 Dissipation Factor @ 23C: 60HZ: 0.0788 Dissipation Factor @ 23C: 100KHZ: 0.0428 Volume Resistivity @ 23C (ohm-cm): 1.4x10 13 Excellent choice for conformal coating applications. This solvent-cut coating offers excellent electrical property performance. FE-7233: Viscosity of Blend @ 25C, cps: 750 98% Solids Mix Ratio By Weight (A/B): 100/46 Pot Life @ 25C: 35-65 Min. Max Exotherm C: 150 Typical Cure Schedule: 24 Hrs. @ 25C Color: Clear Specific Gravity: 1.11 Hardness: 86 Shore D Tensile Properties: Strength, PSI: 9,040 Tensile Properties: Elongation, %: 10.6 Maximum Operating Temperature C: 95 Thermal Conductivity CAL/CM-SEC-C: 6.1x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 66.5 Thermal Coefficient of ExDansion urn/m/C: Aloha 2: 193 Glass Transition Temperature (TG) C: 52 _ Dielectric Constant @ 23C: 60HZ: 3.80 Dielectric Constant @ 23C: 100KHZ: 3.55 Dissipation Factor @ 23C: 60HZ: 0.00857 Dissipation Factor @ 23C: IOOKHZ: 0.0251 Volume Resistivity @ 23C (ohm-cm): 6.0x10 15 Optically clear when blended void free at thicknesses less than 0.25 inches.

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Products: Epoxies

FE-7235: Viscosity of Blend 8 25C, cps: 3,000 Mix Ratio By Weight (A/B): 100/82 Pot Life @ 25C: 15-25 Min. Max Exotherm C: 137 Typical Cure Schedule: 24 Hrs. @ 25C Color: Transparent Amber Specific Gravity: 1.06 Hardness: 83 Shore D Tensile Properties: Strength, PSI: 8,110 Tensile Elongation, %: 8.7 Maximum Operating Temperature, C: 80 Thermal Conductivity CAL/CM-SEC-C: 5.7x10 -4 Thermal Coefficient of Expansion urn/m/C: Aloha 1: 66.9 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 199 Glass Transition Temperature (TG) C: 37 Dielectric Constant $ 23C: 60HZ: 3.40 Dielectric Constant 8 23C: 100KHZ: 2.99 Dissipation Factor @ 23C: 60HZ: 0.0122 Dissipation Factor @ 23C: 100KHZ: 0.0110 Volume Resistivity @ 23C (ohm-cm): 1.0x10 16 Fast-curing, clear, amber potting compound FE-7600: Viscosity of Blend @ 25C, cps: 100,000 Mix Ratio By Weight (A/B): 100/33.3 Pot Life @ 25C: 50-100 Min. Max Exotherm C: 63 Typical Cure Schedule: 48 Hrs. @ 25C Color: Black Specific Gravity: 1.36 Hardness: 89 Shore D Tensile Properties: Strength, PSI: 6,000 Tensile Properties: Elongation, %: 7.0 Maximum Operating Temperature C: 105 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 55.3 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 160 Glass Transition Temperature (TG) C: 64 Dielectric Constant @ 23C: 60HZ: 34.0 Dielectric Constant B 23C: IOOKHZ: 15.9 Dissipation Factor @-23C: 60HZ: 0.444 Dissipation Factor @ 23C: 10OKHZ: 0.180 Volume Resistivity @ 23C (ohm-cm): 3.2x10 9 Excellent coice where hardness, machineability, and electrical semi-conductivity properties are required.

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Products: Epoxies

FE-7610: Viscosity of Blend @ 2X, cps: Thixotropic Mix Ratio By Weight (A/B): 100/30 Pot Life @ 25C: 60-100 Min. Max Exothkm C: 60 Typical Cure Schedule: 48 Hrs. @ 25C Color: Metallic Grav Specific Gravity: 1137 Tensile Properties: Strength, PSI: 4,000 Tensile Properties: Elongation, %: 3.0 Maximum Operating Temperature, C: 105 Thermal Conductivity CAL/CM-SEC-C: 13.9x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 71.5 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 200 Glass Transition Temperature (TG) C: 69 Dielectric Constant @ 23C: 60H.Z: 7.73 Dielectric Constant B 23C: 100KHZ: 7.59 Dissipation Factor @-23C: 60HZ: 0.00801 Dissipation Factor @ 23C: IOOKHZ: 0.00940 Volume Resistivity @ 23C: (ohm-cm): 1.2x10 16 Thixotropic, non-electrically conductive version of FE-7600 FE-7800: Viscosity of Blend @ 25C, cps: 1,200 Mix Ratio BY Weisht(A/B): 100/43.5 Pot Life L 25C: SO-75 Min. Max Exothkm C: 98 Typical Cure Schedule: 24 Hrs. @ 25C Coior: Amber Specific Gravity: 1.06 Hardness: 82 Shore D Tensile Properties: Strength, PSI: 6,400 Tensile Properties: Elongation, %: 15.5 Maximum Operating Temperature C: 95 Thermal Conductivity CAL/CM-SEC-C: 6.3x10 -4 Thermal Coefficient of Expansion urn/m/C: Alpha 1: 87.7 Thermal Coefficient of Expansion urn/m/C: Alpha 2: 205 Dielectric Constant @ 23C: 60HZ: 3.27 Dielectric Constant P 23C: 100KHZ: 3.07 Dissipation Factor @-23C: 60HZ: 0.0183 Dissipation Factor @ 23C: 100KHZ: 0.0175 Volume Resitivity @ 23C (ohm-cm): 4.3x10 15 Offers excellent toughness and impact resistance coupled with excellent electrical properties.

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FURANE PRODUCTS: EPIBOND Die Attach Adhesives: Epoxy: EPIBOND 7002M: Color/Filler Type: silver Specific Gravity: 3.0 System Application Method: Stamping Pot Life 25C (days): 4 Gel Time 150C (minutes): l/165 or 1.5/150 Die Shear Strength (psi): >3000 Thermal Conductivity: 40 Weight Loss 300C (%): (0.3 Tg (C): 150 CTE (in/in/C)xlO -6: Alpha 1: 50 Alpha 2: 190 Volume Resistivity 25C (ohm-cm): 3000 Thermal Conductivity: 42 Weight Loss 300C (%): (0.2 Tg (C): 155 CTE (in/in/C)xlO -6: Alpha 1: 50 Alpha 2: 186 Volume Resistivity 25C (ohm-cm): 40 Weight Loss 300C (%): 0.6 Tg (C): 152 CTE (in/in/C)xlO -6: Alpha 1: 33 Alpha 2: 127 Volume Resistivity 25C (ohm-cm): .OOl Shelf Life (months/C): 12/-40 Materials meet MIL STD 883C Method 5011. BPIBOND 7015: Color/Filler Type: silver Specific Gravity: 3.0 System Application Method: Stamping/Styringe dispenser Pot Life 25C (davs): >7 Gel Time 15OC‘(minutes): 5 Cure Schedule (hours/C): l/l50 Die Shear Strength (psi): >2500 Thermal Conductivity: >40 Weight Loss 300C (%): 0.15 Tg (C): 105 CTE (in/in/C)xlO -6: Alpha 1: 67 Alpha 2: 160 Volume Resistivity 25C (ohm-cm): .OOOl Shelf Life (months/C): 6/O Long pot life, high purity, electrically conductive adhesives. Storable at 0-5C. EPIBOND 7200M: Color/Filler Type: mineral Soecific Gravitv: 2.5 System Application Method: Stamping Pot Life 25C (days): 4 Gel Time 150C (minutes): 5 Cure Schedule (hours/C): l/165 or 1.5/150 Die Shear Strength (psi): >2500 Thermal Conductivity: 16 Weight Loss 300C (%): 0.1 Tg (C): 155 CTE (in/in/C)xlO -6: Alpha 1: 30 Alpha 2: 110 Volume Resistivity 25C (ohm-cm): 7.9x10 15 Shelf Life (months/C): 12/-40 Ammonium: 7 Gel Time 150C (minutes): 5 Cure Schedule (hours/C): l/150 Die Shear Strength (psi): >2500 Thermal Conductivity: 16 Weight Loss 300C (%): >0.5 Tg (C): 80 CTE (in/in/C)xlO -6: Alpha 1: 32 Alpha 2: 84 Volume Resistivity 25C (ohm-cm): >lxlO 15 Shelf Life (months/C): 6/O Long pot life, high purity, thermally conductive adhesive. Storable at 0-5C.

Adhesives-Epoxy

FURANE PRODUCTS: EPIBOND Electrically Insulating Thermally Conductive Epoxy Adhesives: EPIBOND 7200M: Features/Benefits: * Low-bleed out, increased productivity capability * Meets MIL-STD 803C, Method 5011 requirements * 100% solids, very low outsassins * High purity; low-corrosion tendency * Less than 15 ppm each of Na, K, NH4, Fe, Cl, Br * Designed for stamping/pin transfer applications (other grades available) EPIBOND 7200-501: Features/Benefits: * Low bleed out, increased productivity capability * Meets MIL-STD 883C, Method 5011 requirements * High purity, low corrosion tendency * Less than 15 ppm each of Na, K, NH4, Fe, Cl, Br * 100% solids/low outgassing * Designed for syringe dispensing (other grades available) EPIBOND 7200-100M Features/Benefits: Low bleed out, increased productivity capability Meest MIL-STD 883C, Method 5011 requirements _ 100% solids, very low outgassing High purity, low corrosion tendency Less than 15 ppm each of Na, K, NH4, Fe, Cl, Br Designed for screen printing applications (other grades available) EPIBOND 7210: Features/Benefits: * Lona oat and shelf life * High purity * Excellent thermal conductivity * 100% solids * Designed for dispensing and pin transfer * Viscosity can be factory adjusted for alternative application techniques EPIBOND 7300 Electrically Conductive Polyimide Adhesive: Features: * Extremely high purity. * High continuous operating service temperatures. * Adaptable to screen printing.

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HARDMAN

INC.:

Adhesive Selector Guide:

EPOWELD 3243: Mix Ratio (Parts by Weight): A:B: 100:72 Viscosity Centipoise @ 25 C (Mixed): 15,000 Gel Time-(Gms./deg. C/Min): 227/25/180 Cure (Timeldeg. C): 7 days/25 Color: Ivory Sp. Gr. gms/cc: 1.17 Lap Shear Strength: (Al/Al--Pounds/Square Inch): -40 deg. F: 3037 77 deg. F: 3330 180 deg. F: 537 300 deg. F: 274 Peel Strength (Pounds/Linear Inch): -40 deg. F: 3.4 77 deg. F: 3.6 180 deg. F: 3.3 Hardness (Shore D): 85 EPOWELD 7897: Mix Ratio (Parts bv Weiuht): 100:50 Viscosity Centipoise @ 25 aeg. C (Mixed): 2,200 Gel Time (Gms./deq. C/Min): 454/25/75 Cure (Time/deg. Cj: 15 Min.1100 Color: Black Sp. Gr. gms/cc: 1.21 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3162 77 deg. F: 3410 180 deg. F: 389 300 deg. F: 212 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.2 77 deg. F: 5.5 180 deg. F: 1.9 Hardness (Shore D): 85 EPOWELD 7929: Mix Ratio (Parts By Weight): A:B: 100:63 Viscosity Centipoise @ 25 deg. C (Mixed): 2,500 Gel Time (Gms./deg. C/Min): 163/25/60 Cure (Time/deg. C): 7 days/25 Color: Black _ Sp. Gr. gms/cc: 1.09 Lap Shear Strength: (Al/Al--Pounds/Square Inch): -40 deg. F: 3012 77 deg. F: 4178 180 deg. F: 315 300 deg. F: 190 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.5 77 deg. F: 3.8 180 deg. F: 1.4 Hardness (Shore D): 83

Adhesives-Epoxy

HARDMAN INC.: Adhesive Selector Guide (Continued): EPOWELD 16331-A/8173-B: Mix Ratio (Parts by Weight): 1OO:lOO Viscosity Centipoise @ 25 deg. C (Mixed): 40,000 Gel Time (Gms./deg. C/Min): 4/25/5 Cure (Time/deg. C): 24 hrs/25 Color: Amber Sp. Gr. gms/cc: 1.13 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 1476 77 deg. F: 3000 180 deu. F: 175 300 deg. F: 122 Peel Strenqth (Pounds/Linear Inch): -40 deg; F: 3.4 77 deg. F: 3.6 180 deg. F: 1.1 Hardness (Shore D): 80 EPOWELD 13230: Mix Ratio (Parts By Weight): A:B: 100:140 Viscosity Centipoise @ 25 deg. C (Mixed): 50,000 Gel Time (Gms./deg. C/Min): 100/25/90 Cure (Time/deg. C): 7 days/25 Color: Grev Sp. Gr. gms/cc: 1.27 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3206 77 deg. F: 2800 180 deg. F: 970 300 deg. F: 237 Peel Strength (Pounds/Linear Inch): -40 deg. F: 3.8 77 deg. F: 24.0 180 deg. F: 2.0 Hardness (Shore D): 65 EALEX 15036: Mix Ratio (Parts by Weight): 100:100 Viscosity Centipoise @ 25 deg. C (Mixed): 11,000 Gel Time (Gms./deg. C/Min): 412515 Cure (Time/deg. C): 24 Hrs/25 Color: Off White Sp. Gr. gms/cc: 1.24 Lap Shear Strength (Al/Al - Pounds/Square Inch): -40 deg. F: 4105 77 deg. F: 4075 180 deg. F: 485 300 deg. F: 275 Peel Strength (Pounds/Linear Inch): -40 deg. F: 3.9 77 deg. F: 10.0 180 deg. F: 2.6 Hardness (Shore D): 85

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Adhesives,

Sealants


Industry

HARDMAN INC.: Adhesive Selector Guide (Continued): KALBX

15038: Mix Ratio (Parts by Weight): A:B: 1OO:lOO Viscosity Centipoises @-25 deg. C (Mixed): 12,000 Gel Time (Gms./deg. C/Min): 4/25/5 Cure (Time/deg. C): 24 Hrs/25 Color: Beige Sp. Gr. gms/cc: 1.25 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3966 77 deg. F: 3942 180 deg. F: 494 300 deg. F: 367 Peel Strength (Pounds/Linear Inch): -40 deg. F: 3.1 77 deg. F: 70.0 180 deg. F: 2.7 Hardness (Shore D): 70

EPOWELD 16469: Mix Ratio (Parts by Weight): A:B: 100:74 Viscosity Centipoise @ 25 deg. C (Mixed): 52,000 Gel Time (Gms./deg. C/Min): 100/25/12 Cure (Time/deg. C): 7 days/25 Color: Grey Sp. Gr. gms/cc: 1.52 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 2420 77 deg. F: 2765 180 deg. F: 520 300 deg. F: 395 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.3 77 deg. F: 2.5 180 deg. F: 1.8 Hardness (Shore D): 90 MONOPOXY 16365-O: Mix Ratio (Parts By Weight): ---Viscosity Centipoise @ 25 deg. C (Mixed): 80,000 Gel Time (Gms./deg. C/Min): 20/107/14 Cure (Time/deg. C): 1.5 Hrs/lO7 Color: Blue Sp. Gr. gms/cc: 1.38 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 2659 77 deg. F: 2400 180 deg. F: 4008 300 deg. F: 331 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.3 77 deg. F: 1.5 180 deg. F: 2.4 Hardness (Shore D): 85

Adhesives-Epoxy

HARDMAN INC.: Adhesive Selector Guide (Continued): MONOPOXY 16551-o: Viscosity Centipoise @ 25 deg. C (Mixed): 1,200,OOO Gel Time (Gms./deg. C/Min): 20/121/11 Cure (Time/deg. C): 40 Min/l21 Color: Grey Sp. Gr. gms/cc: 1.58 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3620 77 deg. F: 4310 180 deg. F: 4470 300 deg. F: 480 Peel Strength (Pounds/Linear Inch): -40 deg. F: 4.2 77 deg. F: 3.2 180 deg. F: 3.1 Hardness (Shore D): 90 EPONELD 16562: Mix Ratio (Parts By Weight): lOO:lOO Viscosity Centipoise @ 25 deg. C (Mixed): 126,000 Gel Time (Gms./deg. C/Min): 100/25/45 Cure (Time/deg. C): 3 Days/25 Color: Grey Sp. Gr. gms/cc: 1.38 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 4760 77 deg. F: 3215 180 deg. F: 905 300 deg. F: 485 Peel Strength (Pounds/Linear Inch): -40 deg. F: 35.8 77 deg. F: 44.3 180 deg. F: 4.3 Hardness (Shore D): 82 MONOPOXY 18512-O: Mix Ratio (Parts by Weight): ---Viscosity Centipoise @ 25 deg. C (Mixed): Paste Gel Time-(Gms./deg. C/Min): 20/121/12 Cure (Time/deg. C): 40 MinII Color: Grey Sp. Gr. gms/cc: 1.52 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3432 77 deg. F: 4100 180 dea. F: 4600 300 deg. F: 1100 Peel Strength (Pounds/Linear Inch): -40 des; F: 3.8 77 deg. F: 4.3 180 deg. F: 3.3 Hardness (Shore D): 85

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HARDMAN INC.: Adhesive Selector Chart (Continued): EPOWELD 19157: Mix Ratio (Parts by Weight): A:B: 100:40 Viscosity Centipoise 8 25 deg. C (Mixed): 8,000 Gel Time (Gms./deg. C/Min): 500/25/50 Cure (Time/deg. C): 20 Min/80 Color: Black Sp. Gr. gms/cc: 1.18 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 1926 77 deg. F: 4658 180 deg. F: 1500 300 deg. F: 244 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.8 77 deg. F: 3.8 180 deg. F: 4.6 Hardness (Shore D): 80 EPOWELD 20018: Mix Ratio (Parts By Weight): 100:30 Viscosity: Paste Gel Time (Gms./deg. C/Min): 100/25/32 Cure (Time/deg. C): 24 Hrs/25 Color: Grey Sp. Gr. gms/cc: 1.53 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 1258 77 deg. F: 4405 180 dea. F: 2943 300 deg. F: 1590 Peel Strenqth (Pounds/Linear Inch): -40 deg; F: 5.0 77 deg. F: 3.2 180 deg. F: 4.9 Hardness (Shore D): 95 EPOWELD 8173: Mix Ratio (Parts By Weight): 100:94 Viscosity Centipoise @ 25C (Mixed): 40,000 Gel Time (Gms./deg. C/Min): 4/25/5 Cure (Time/deg. C): 24 Hrs/25 Color: Amber Sp. Gr. gms/cc: 1.16 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 1695 77 deg. F: 3000 180 deg. F: 655 300 deg. F: 245 Peel Strength (Pounds/Linear Inch): -40 deg. F: 1.5 77 deg. F: 1.8 180 deg. F: 2.5 Hardness (Shore D): 80

Adhesives-Epoxy

HARDMAN INC.: Adhesive Selector Guide (Continued): EALEX 16308: Mix Ratio (Parts BY Weisht): 100:67 Viscosity Centipoise 8 25 deg. C (Mixed): 40,000 Gel Time (Gms./deg. C/Min): 4/25/7 Cure (Time/deg. CT: 7 days/25 Color: Black Sp. Gr. gms/cc: 1.22 Lao Shear Strensth (Al/Al--Pounds/Square Inch): -40 deg. F: 4310 77 deg. F: 950 180 deg. F: 390 300 deg. F: 175 Peel Strength (Pounds/Linear Inch): -40 deg. F: 83.0 77 deg. F: 24.0 180 deg. F: 15.0 Hardness (Shore D): 40 EPOCAP 16400: Mix Ratio (Parts by Weight): A:B: 100:7.5 Viscosity Centipoise 8 25 deg. C (Mixed): 4,600 Gel Time (Gms./deg. C/Min): 200/25/130 Cure (Time/deg. C): 7 Days/25 Color: Blue SP. Gr. gms/cc: 2.09 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 2590 77 deg. F: 3150 180 deg. F: 510 300 deg. F: 325 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.5 77 deg. F: 2.5 180 deg. F: 2.8 Hardness (Shore D): 85 EPOWELD 15217: Mix Ratio (Parts By Weight): A:B: 100:50 Viscosity Centipoise 8 25 deg. C (Mixed): Paste Gel Time (Gms./deg. C/Min): 100/25/130 Cure (Time/deg. C): 7 Days/25 Color: Beige SP. Gr. gms/cc: 1.19 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3152 77 deg. F: 2557 180 deg. F: 471 300 deg. F: 50 Peel Strength (Pounds/Linear Inch): -40 deg. F: 2.6 77 deg. F: 20.3 180 deg. F: 1.8 Hardness (Shore D): 65

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HARDMAN INC.: Adhesive Selector Guide (Continued): EPOWELD 16161: Mix Ratio (Parts By Weight): A:B: 100:35 Viscosity Centipoise @ 25 deg. C (Mixed): Paste Gel Time (Gms./deg. C/Min): 100/25/55 Cure (Time/deg. C): 7 Days/25 Color: Amber Sp. Gr. gmsfcc: 1.1 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 2220 77 deg. F: 3390 180 dea. F: 300 300 deg. F: 230 Peel Strenqth (Pounds/Linear Inch): -40 dec: F: 2.5 77 deg. F: 2.5 180 deg. F: 2.0 Hardness (Shore D): 80 EPOWELD 16535: Mix Ratio (Parts By Weight): 100:58 Viscosity Centipoise @ 25C deg. C (Mixed): 10,000 Gel Time (Gms./deg. C/Min): 100/25/42 Cure (Time/deg. C): 7 Days/25 Color: Amber Sp. Gr. gms/cc: 1.11 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 1764 77 deg. F: 2452 180 deg. F: 2018 300 deg. F: 701 Peel Strength (Pounds/Linear Inch): -40 deg. F: 1.5 77 deg. F: 1.0 180 deg. F: 2.1 Hardness (Shore D): 85 EPOWELD 18530: Mix Ratio (Parts By Weight): A:B: 100:37 Viscosity Centipoise @ 25 deg. C (Mixed): 16,000 Gel Time (Gms./deg. C/Min): 100/25/45 Cure (Time/deg. C): 7 Days/25 Color: Black SP. Gr. gms/cc: 1.14 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 5235 77 deg. F: 3618 180 deg. F: 614 300 deg. F: 371 Peel Strength (Pounds/Linear Inch): -40 deg. F: 40.4 77 deg. F: 37.3 180 deg. F: 2.1 Hardness (Shore D): 75

Adhesives-Epoxy

EARDMAE INC.: Adhesive Selector Guide (Continued): EPOWELD 18531: Mix Ratio (Parts By Weight): A:B: 100:37 Viscosity Centipoise 8 25 deg. C (Mixed): 14,000 Gel Time (Gms./deg. C/Min): 100/25/55 Cure (Time/deg. C): 7 days/25 Color: Black SP. Gr. gms/cc: 1.14 Lap Shear Strength (Al/Al--Pounds/Square Inch): -40 deg. F: 3105 77 deg. F: 3555 180 deg. F: 600 300 deg. F: 305 Peel Strength (Pounds/Linear Inch): -40 deg. F: 4.8 77 deg. F: 35.0 180 deg. F: 3.5 Hardness (Shore D): 75

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KEY POLYMER CORP.:

Epoxy Products: General Purpose:

C4-49A/B: Quick Set Epoxy Tvoe: Two Dart. room temo. cure Cure Schedule:. Handling strength after 1 hr. @ 25C Full strength after 4 hrs. @ 25C Consistencv: Low Viscositv Liquid Specific Gravity: 1.01 Comments: Very fast cure. Convenient equal volume mix ratio. Clear film when cured. C6-92A/B: Two component, unfilled epoxy adhesive Type: Two part, room temp. cure Cure Schedule: 7 days @ 25C for full properties, or 2 hrs. at 1OOC. Consistency: Low Viscosity Liquid Specific Gravity: 1.15 Comments: Excellent moisture resistance and hot strength. Clear film when cured. C6-183A/B: Two component, flexible, fast curing epoxy adhesive Type: Gray, two part, room temp. cure Cure Schedule: 24 hrs. @ 25C Consistency: Thixotropic Paste Specific Gravity: 1.49 Comments: Fast cure at ambient temperature. Excellent heat & chemical resistance C4-78AjB: Two component, thermally conductive, epoxy adhesive Type: Gray, two part, room temp. cure Cure Schedule: 24 hrs. @ 25C, or 1 hr. @ 65C. Consistency: High Viscosity Paste Specific Gravity: 2.30 Comments: High thermal conductivity for heat dissipation. Good adhesion to metals, ceramics, and most plastics. c4-104: Thermally conductive heat sink compound Type: White, one part, no cure necessary Cure Schedule: N/A Consistency: White Thixotropic Paste Specific Gravity: 2.45 Comments: Excellent thermal resistance. Will not harden, melt or dry out after 1000 hours @ 200C.

Adhesives-Epoxy

21.5

MERECO DIVISION: MERECO system No. CLN-662 Thixotropic, High Room Temperature Hardening Epoxy Operating Temperature,

system: MERECO System No. CLN-662 is a specially developed thixotropic two component epoxy system. Cured castings will withstand temperatures up to 200C. The combination makes a unique system because it is possible to accomplish this without baking. The working life of the mixture allows it to be used for potting, coating, encapsulating, laminating and sealing. Fully cured MERECO System No. CLN-662 exhibits excellent chemical resistance, good mechanical strength, adhesion and machinability. Outstanding Attributes: * Thixotropic * Low Exotherm * High Operating Temperature * Room Temperature Cure

* * * *

Minimal Shrinkage Non-settling Filler Easy Handling Chemical Resistance

Typical Properties of Uncured MERECO System No. CLN-662 Components: Base: Form: Pourable syrup Color: White, yellow or black Viscosity (2X), cps: 70,000 Specific Gravity, 25C/25C: 1.60 Weight per Gallon, lbs: 13.3 Non-volatile, %: 100 Curing Agent: Form: Thin paste Color: Clear Brown Viscosity (25C), cps: 60,000 Specific Gravity, 25C/25C: 1.13 Weight per Gallon, lbs: 9.4 Non-volatile, %: 100 Typical Properties of Resin/Activator Blend: Activator weight ratio, phr: 30 Viscosity (77F). cos: 40,000 Density j77F);iblgal: 12.3 Gel time (1OOg) minutes at 68F: 100 77F: 90 104F: 75 Peak exotherm (1OOg at 77F), F: 88 Cure time, hours at 68F: 96 104F: 8 Cured State Properties: Ultimate tensile, psi: 9,000 Tensile elongation, %: 5.0 Ultimate flexural strength, psi: 15,000 Weight gain, %: water: 24 hr: 0.12 Dielectric constant (1 meg) 77F: 3.9

216


MERECO DIVISION: METRE-GRIP 303 Series--Multi-Purpose Epoxy Adhesives: METRE-GRIP 303 series multi-purpose epoxy adhesives are availanle in four viscosity ranges. Each adhesive provides maximum bond strength and exceptional adhesion to all common materials such as wood, glass, rubbers, plastics, ceramics, metals and concrete. Additionally these adhesives have the outstanding ability to bond strongly to difficult substrates such as Teflon, Tedlar, Nylon, Polyethylene, Vinyl and many others. In-plant parts assembly and field repairs are simplified with the ease of non-critical mixing ratios coupled to room temperature setting. Curing times can be shortened by heating to suit a wide variety of individual production schedules. METRE-GRIP 303 adhesives meet the requirements of Military Specifications MIL-A-8623, MIL-A-14042 and MMM-A-134 and Naval Ordnance Number 2662718. 303: Paste Form* Viscosity Range (cps): 1,000,000 303 MV: Medium Cream Viscosity Range (cps): 100,000 303 Lv: Light Syrup** Viscosity Range (cps): 25,000 303 VLV: Very Light Syrup Viscosity Range (cps): 4,000 * Thixotropic, Anti-slump, Asbestos-free ** Non-outgassing Typical Characteristics: Specific Gravity (25C/25C): 1.23-1.35 Flexural Strenath (osi): 5.0 x 10 4 Tensile Strength (psi); 2.3 x 10 4 Linear Expansion Coefficient (/F): 4.8 x 10 -5 Thermal Shock: passes Operational Temperature (C): -65 to 145 Moisture Absorption (%): 0.8 Dielectric Strength (volts/mil): 440 Volume Resistivity (ohm-cm): 1.2 x 10 14 Dielectric Constant (10 3 Hz): 3.12 Dissipation Factor (10 3 Hz): 0.01

Adhesives-Epoxy

217

PERMABOND INTERNATIONAL: PERMABOND ESP308, ESP309, and ESP310: PERMABOND ESP--Single part toughened epoxy adhesive PERMABOND ESP toughened epoxies form a new class of adhesives. They combine the structural strength of standard epoxies with unparalleled peel, impact and cleavage resistance. Often metal deformation or metal fatigue results before the adhesive fails. These epoxies also have excellent adhesion to a wide range of other materials. PERMABOND ESP are pre-mixed and thus require less handling than two-component epoxies. They require a heat cure in the range of 300-400F. Cure through large volumes can easily be effected, thus making it also suitable for potting applications. ESP308: Silver grey Filler type: metallic Specific gravity (g/cc): 1.5 Viscosity at 25C/77F, cps: 200,000 Flow characteristics (at cure temp): free flow Electrical and Thermal Prooerties: Thermal expansion coefficient, in/in/C: below Tg: 53.4 x 10 -6 above Tq: 178 x 10 -6 Glass transition temperature--Tg: 118C Thermal conductivity: 0.41 Volume resistivity, ohm-cm: 1.5 x 10 6 ESP309: Cream Filler type: inorganic Specific gravity (g/cc): 1.6 Viscosity at 25C/77F, cps: 150,000 Flow characteristics (at cure temp): partial flow Electrical and Thermal Prooerties: Thermal expansion coefficient, in/in/C: below Tg: 58.6 x 10 -6 above Tg: 176 x 10 -6 Glass transition temperature--Tg: 113C Thermal conductivity: 0.32 Volume resistivity,-ohm-cm: 3 x 10 15 Dielectric strength, Volts/mil: 1400 ESP310: Silver grey Filler type: metallic Specific gravity (g/cc): 1.5 Viscosity at 25C/77F, cps: 400,000 Electrical and Thermal Properties: Thermal expansion coefficient, in/in/C: below Tg: 57.7 x 10 -6 above Tg: 173 x IO -6 Glass transition temperature--Tg: 118C Thermal Conductivity: 0.40 Volume resistivity, ohm-cm: 3.1 x 10 -6

218


PERMAGILE INDUSTRIES INC.: INSULCAST Epoxies: INSULCAST 136: Features great versatility and conforms to MIL. I-16923. INSULCAST 135: Is similar, but lower viscosity. INSULCAST 125 is low viscosity for fast impregnation and easy evacuation. INSULCAST 333: Is fire retardant. Conforms to U.L. 94 V.O. INSULCAST 100-M: Lowest cost. 1:l ratio by volume. INSULCASTS 140, 141: 141 features very high thermal conductivity and good thermal shock. 140 is a low viscosity version of 141. INSULCAST 166: Castable aluminum. Good flow. Machines like metal. INSULCAST 275: Thixotropic dip compound. Leaves component or board with uniform coating. INSULCAST 612: A "cold-solder" I high electrical conductivity. INSULGEL 30: R.T. Curing, repairable epoxy gel. No. 30 is softest in a series of four, with increasing Shore A hardness. INSULCAST 510: Water-white casting system for casting/encapsulating where clarity is important. INSULCAST 961: Low density syntactic foam, composed of rigid, hollow spheres, in an epoxy matrix. Used for flotation, and light weight. INSULCAST 174 (L-V.): Variable flexibility. Available in low viscosity version (L.V.) INSULCAST 981: Semi-rigid. Best thermal shock and high temperature I.R. INSULCAST 70-C.C.: Semi-flexible. Low shrinkage, low stress on components. Extremely low coefficient of expansion.

Adhesives-Epoxy

219

PERMAGILR INDUSTRIES INC.: INSULCAST Epoxies (Continued): New technology, low temperature curing, one component series 771, 772, 773 rigid epoxies; 781, 782, 783 flexible epoxies. These two Series can be blended for any degree of rigidity or flexibility. 771: Color: Clear Viscosity - cps: 700 Hardness - Shore D: 88 Elongation - %: 2.0 Tensile Strength: 8,700 Dielectric Strength: 420 Volume Resistivity: 4 x 10 14 772: Color: Black Viscosity - cps: 12,000 Hardness - Shore D: 93 Elongation - %: 1.5 Tensile Strength: 9,500 Dielectric Strength: 440 Volume Resistivity: 1 x 10 15 773: Color: Black Viscosity - cps: Thixotropic Hardness - Shore D: 92 Elongation - %: 1.5 Tensile Strength: 9,500 Dielectric Strength: 440 Volume Resistivity: 1 x 10 15 781 : Color: Clear Viscosity - cps: 1,350 Hardness - Shore D: 40 Elongation - %: 125 Tensile Strength: 5,500 Dielectric Strength: 410 Volume Resistivity: 3 x 10 14

220

Adhesives, Sealants nnd Coatings for the Electronics Zndusty

PERMAGILB INDUSTRIES INC.: INSULCAST Epoxies (Continued): 782: Color: Black Viscosity - cps: 25,000 Hardness - Shore D: 45 Elongation - %: 75 Tensile Strength: 6,500 Dielectric Strength: 420 Volume Resistivity: 10 15 783: Color: Black Viscosity - cps.: Thixotropic Hardness - Shore D: 45 Elonsation - %: 75 Tensile Strength: 6,500 Dielectric Strength: 420 Volume Resistivity: 10 15

Adhesives-Epoxy

PERMAGILE INDUSTRIES INC.: Curing Agents: 9: Cps. Vise.: 100 Avg. Pot Life Min.: 30-40 Cure Schedule: 12-24 hrs. Feature: Fast Cure 11:

cps. Vise.: 700 Avg. Pot Life Min.: 4-6 hrs. Cure Schedule: 16 hrs. @ 70C 3 hrs. @ 1OOC 1 hr. @ 125C Feature: Temperature Resistant - Rigid 12: Cps. Vise.: 500 Avg. Pot Life Min.: 45 Cure Schedule: 12-24 hrs. Feature: Safety Hardener 20: Cos. Vise.: 700 Avg. Pot Life Min.: 60 Cure Schedule: 12-36 hrs. Feature: Good Impact & Rapid Cure 22: Cps. Vise.: 10,000 Avg. Pot Life Min.: 90 Cure Schedule: 24-36 hrs. Feature: Variable Flexibility Large Castings 26: Cps. Vise.: 800 Avg. Pot Life Min.: 2 hrs. Cure Schedule: 24-36 hrs. or 3 hrs @ 65C Feature: Low Viscosity, Good Impact, Very Large Castings 30: Cos. Vise.: 50 Avg. Pot Life Min.: 18 hrs. Cure Schedule: 4 hrs. @ IOOC 2 hrs. @ 125C Feature: Lowest Viscosity Highest Temperature Resistance

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222

Adhesives, Sealantsand Coatingsfor the ElectronicsIndustry

SMOOTH-ON, INC.: EA-40: Inconspicuous glue line Good electrical properties EA-40 is an unfilled slightly thixotropic epoxy that can be spread readily in thin films that are almost transparent after curing. It sets slowly at room temperature, but cures in 24 hours to provide good electrical properties and water resistance. Heat resistance above 1OOC. is acheived by mixing 2 parts resin to 1 part hardener and providing a heat cure. EA-40 is a non-shrinking wood glue with excellent gap-filling capabilities. Typical Applications: - Bonding and insulating electrical and electronic components - Inconspicuous glue line for assembly of glass, ceramics, hard plastics and rigid foam parts - Jewelry for manufacturing and stone setting Color: Part-A: Translucent Part-B: Clear Amber Mixed: Clear Amber Mixing Ratio By Weight: 100/83 By Volume: lOO/lOO Specific Gravity: Part-A: 1.17 Part-B: 1.02 Mixed: 1.10 Viscosity Poise: Part-A: 1800 Part-B: 500 Resistance to Sag: 2.19 x 10 15 ohm/cm Dissipation Factor (ASTM D 150): 0.00106 at 100 Hz 0.00022 at 10 kHz Dielectric Constant (ASTM D 150): 2.71 at 100 Hz 2.71 at 10 KHz

Caulk

and Sealants

251

AMERICAN SEALANTS, INC.: AS1 388 Electronic Grade Sealant/ Adhesive: AS1 388 is a one-part, moisture-curing RTV (room temperature vulcanizing) silicone sealant/adhesive that is non-slump and cures to form a tough, permanently flexible rubber. The non-corrosive curing system of AS1 388 makes it ideally suited for protecting, sealing and insulating corrosion-sensitive electronic and electrical materials such as copper, brass, S ilver, etc. AS1 388 has been specifically formulated for use in electr ,ical/electronic production and assembly because it: * has good dielectric properties * has high surface resistivity * resists electrical tracking * repels water to protect electrical properties AS1 388 is a 100% silicone and has excellent resistance to: * ozone * uv * airborne chemicals * temperature changes from -60 to +2OOC (-70 to +390F) Typical Uses: AS1 388 is an excellent sealant/adhesive for many electrical and electronic applications where corrosion to metals, particularly copper, brass, silver, etc., is a problem. Characteristic: Shore A Hardness: 30+-2 Tensile @ Break: 250+-25 psi Elongation @ Break: 400+-25% Modulus @ 100% Elongation: 90+-10 psi Tear Strength: 30+-10 ppi Adhesion Strength (Peel): Glass: IO+-2 ppi Aluminum (Primed): 8+-2 ppi Mortar (Primed): 12+-2 ppi Sag, or Slump: Nil Shrinkage (Weight Loss): I000 Dielectric Constant: N.A. Dissipation Factor (1 MHZ @ 25C): N.A. Insulation Resistance Ohms-Cm: Initial (25C - 50% R.H.): 1.5x10 14 During 10th day Cycling (65C - 95% R.H.): 6.5x10 10 Recovery 24 hrs. after 10 day Cycling: 3.2x10 12

282


CONAP, INC.: CONAP Dielectric Conformal Coatings for Electronics (Continued): CONAP CE-1181: Silicone Viscosity 8 25C (77F) cps: 1200 Flashpoint, F (TCC): 68 % Solids Content: 60 Pot Life 8 25C: Indefinite Shelf Life @ 25C: 6 Months Tack Free Time @ 25C: 10 Seconds Recommended Cure Schedule at 25C/6OC: 24 hrs. @ 25C Cure Mechanism: UV and/or CO2 Operating Temperature Range: -80C to 150C Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibility (l/8" Bend Mandrel Test): Passes Chemical & Solvent Resistance: Good Dielectric Strength, vpm: 420 Dielectric Constant: 2.70 Dissipation Factor (1 MHZ 8 25C): .0003 Insulation Resistance Ohms-Cm: Initial (25C - 50% R.H.): 7.6x10 13 During 10th day Cycling (65C - 95% R.H.): 2.3x10 11 Recovery 24 hrs after 10 day Cycling: 6.2x10 13 CONATHANE CE-1155: Polyurethane Viscosity 8 25C (77F) cps: 75 Flashpoint, F (TCC): 55% Solids Content: 60 Pot Life @ 25C: 4-6 hr. Shelf Life @ 25C: 1 Year Tack Free Time I 25C: 4-5 hrs. Mix Ratio, Parts by Weight Part A/Part B: 100/70 Recommended Cure Schedule at 25C/6OC: 7 days/3 hrs. Cure Mechanism: Chemical Cure Operating Temperature Range: -55C to 130C Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibility: Passes Chemical & Solvent Resistance: Excellent Dielectric Strength, vpm: 3000 Dielectric Constant: 3.42 Dissipation Factor (1 MHZ 8 25C): .016 Insulation Resistance Ohms-Cm: Initial(25C - 50% R.H.): 2.5x10 13 During 10th day Cycling (65C - 95% R.H.): 6.1x10 10 Recovery 24 hrs. after 10th day Cycling: 6.0x10 12

Coatings

283

CONAP, INC.: CONAP Dielectric Conformal Coatings for Electronics (Continued): CONATHANE CE-1155-35: Polyurethane Viscosity @ 25C (77F) cps: 35 Flashpoint, F (TCC): 55 % Solids Content: 34 Pot Life @ 25C: E-10 hr. Shelf Life @ 25C: 1 Year Tack Free Time @ 25C: 4-5 hrs. Mix Ratio, Parts by Weight Part A/Part B: lOO/lOO Recommended Cure Schedule @ 25C/6OC: 5 days/3 hrs. Cure Mechanism: Chemical Cure Operating Temperature Range: -55 to 13OC Thermal Shock Test: Passes Fungus Resistance: Non Nutrient Flexibilitv (l/8" Bend Mandrel Test): Passes Chemical &-Solvent Resistance: Excellent Dielectric Strength, vpm: 3000 Dielectric Constant: 3.42 Dissiwation Factor (I MHZ @ 25C): -016 Insulation Resistance OhmslCm: Initial (25C - 50% R.H.): 2.5x10 13 During 10th day Cycling (65C - 95% R.H.): 6.1x10 10 Recovery 24 hrs. after 10 day Cycling: 6.0x10 12 CONATHANE CE-1165: Polyurethane Viscosity @ 25C (77F) cps: 100 Flashpoint, F (TCC): 65% Solids Content: 58 Pot Life @ 25C: 6-7 hr. Shelf Life @ 25C: 1 Year Mix Ratio, Parts by Weight Part A/Part B: 100/37 Recommended Cure Schedule at 25C/6OC: 7 days/5 hrs. Cure Machanism: Chemical Cure Operating Temperature Range: -55C to 13OC Thermal Shock Test: Passes Funsus Resistance: Non Nutrient Flexibility (118” Bend Mandrel Test): Passes Chemical & Shock Resistance: Excellent Dielectric Strength, vpm: 3000 Dielectric Constant: 3.10 Dissipation Factor (1 MHZ @ '25C): .020 Insulation Resistance Ohms-Cm: Initial (25C - 50% R.H.): 2.8x10 15 During 10th day Cycling (65C - 95% R.H.): 1.4x10" Recovery 24 hrs. after 10 day Cycling: 4.4x10 13

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DOCK RESINS CORP.: Conformal Coatings: L91-1: Acrylic, Thermoplastic % NV: 51 Solvents: Toluol General purpose acrylic solution; used in textile edge binding; conformal coating removable for repairs; nitrocellulose compatible; seals roofing tiles. L91-17: Acrylic, Thermoplastic % NV: 40 Solvents: Methyl ethyl ketone Hard resistant film; blended with VYHH to coat vinyls; conformal coating removable for repairs; used to coat backside of tracing film TA22-27: Acrylic, Thermosetting % NV: 38 Solvents: Isopropanol, Methyl ethyl ketone Low crosslink density, low temperature curing, self-crosslinking vehicle; solvent cleanable and-or removable conformal coating

Coatings

285

DYMAX CORP.: DYMAX Engineering Adhesives: MULTI-CURE 984-LVF UF Curing Conformal Coating: MULTI-CURE 984-LVF is a single component, 100% solids conformal coating specifically formulated for rapid room temperature cure when exposed to long wave (320-380 nanometer) UV light. Thin layer coatings cure almost instantly to a depth of 7 mils and fluoresce intensely upon exposure to "black" light. MULTI-CURE 984-LVF exhibits excellent adhesion to a variety of metal, ceramic and glass-filled epoxy surfaces. It is a moderately low viscosity coating which can be cured by exposure to UV light and secondarily with heat for shadowed areas on densely populated circuit boards. MULTI-CURE 984-LVF passes the on part UV-94V-0 test and is Mil Spec approved to Mil 46058-C (QPL#356-88). Properties: Appearance: Single Component Clear Liquid (Solventless) Soecific Gravitv: 1.05 Nominal Viscosity: 150 cps Dielectric Constant: 3.4 (23C, IMHZ) Dissipation Factor: 0.03 (23C, IHMZ) Dielectric Strength: 1800 Volts/Mil Volume Resistivity: 3.58 x 10 13 ohm-cm Surface Resistivity: 3.84 x 10 14 ohm-cm Shore D Hardness: 80 Elongation: 10% Cross Hatch Adhesion: Copper: 100% G-10: 100% Coefficient of Linear Thermal Expansion: 6.9 x 10 -5 in/in/C Pot life: 12 Months Cure Schedule: with 365 nm UV light: 100 milliwatts/cm 2 Intensity: 30 seconds 300 milliwatts/cm 2 Intensity: 5 seconds Application Method: Dip, Curtain, Coat or Spray Water Absorption: .06% Factors Affecting Curing: Dark surfaces lengthen cure time. Full range (UV-A, B & C) lamps provide faster cures than filtered sources. All UV sources degrade with use. Check output periodically with a radiometer. Thicker films require longer cure times. Light intensity decreases as distance from UV source increases. Method of application and topography of PCB may require secondary cure mechanism for shadow areas.

286


ELECTRO-SCIENCE LABORATORIES, INC.: High Temperature, PolyimideBased Coatings Conductive Gold and Silver Compositions: #A-25, #I-30, #A-25-G, #A-25_SD/Insulating Composition, #A-25-1: These silver, gold or mineral-filled polymeric adhesives have much higher service temperatures than most conductive organics and effectively bridge part of the temperature gap between ordinary epoxies and inorganic materials. #A-25: Filler: Ag Rheology: Thixotropic Service Temperature, C: continuous: 250-300 intermittent: 350-400 Volume Resistivity (ohm-cm): .OOl max. Sheet Resistivity ohms/sq: .05 max. #I-30: Filler: Ag Rheology: Thixotropic Service Temperature, C: continuous: 300-350 intermittent: 400-450 Volume Resistivity (ohm-cm): .OOl max. Sheet Resistivity ohms/sq: .05 max. #A-25-1: Filler: Mineral Rheology: Thixotropic Service Temperature, C: continuous: 250-300 intermittent: 350-400 Volume Resistivity (ohm-cm): 10 11 Sheet Resistivity ohmsjsq: Insulator

10

#A-25-G: Filler: Au Rheology: Thixotropic Service Temperature, C: continuous: 250-300 intermittent: 350-400 Volume Resistivity (ohm-cm): .OOl max. Sheet Resistivity ohmsfsq: -03 max. #A-25-SD: Filler: Ag Rheology: Thixotropic Service Temperature, C: continuous: 250-300 intermittent: 350-400 Volume Resistivity (ohm-cm): .OOl max. Sheet Resistivity ohms/sq: .05 max.

12 min.

Coatings

287

ELECTRO-SCIENCE LABORATORIES, INC.: Polymer Dielectric Coatings #500 Resin-Based Thick Film: ESL #500 is a white low temperature curing, filled thermoplastic dielectric thick film paste designed for application by screen printing. Its low curing temperature and flexibility allow #500 to be used on paper, low softening temperature plastics, plastic films and printed circuit board materials as well as ceramic and glass substrates. Printing and Curing: #500 may be screen printed using standard microcircuit thick film printers with 200 to 325 mesh stainless steel screens and a 38 micron (1.5 mil) emulsion thickness. Applications: ESL #500 may be used to make crossovers and double conductor level printed wiring in conjunction with ESL #1111-S, #1112-S or #1112-S-45 silver conductive paste. Multiple or thicker prints of #500 are also used as a spacer in membrane switches. #500 can be used as a protective coating over ESL polymer resistor and conductor systems. In conjunction with polymer conductors, low value capacitors can be constructed. Typical Properties: Viscosity, Kcps: 50+-IO Shelf Life, OC: 6 mos. Thinner: ESL #422 Cure: 125C, 30 min. or 6OC, 1 hr. Dielectric Constant, 1K Hz: 8-9 Dissipation factor, 1K Hz: 0.10% Breakdown voltage, volts/25 microns: 500 Insulation resistance, ohms: 2 x IO 10 Color: White Substrates: Paper, low temperature resistance plastics, polyimide (Kapton) and polyester (Mylar) films, printed circuit board materials, glass, ceramics.

288


ELECTRO-SCIENCE LABORATORIES, 242-S, 242~SB, 242-D:

INC.: Polymer Protective Coatings

Better protection with lower curing temperatures ESL #242-S is a screen printable, yellow, mineral-filled epoxy coating which is extremely solvent resistant even with harsh solvents and under high pressure when sufficiently cured. It is thermosetting, and curing in 10 to 30 minutes at 150C is possible although solvent resistance improves with longer curing times. Lower temperature cures are possible. This coating can be used to protect cermet circuits on alumina or porcelain enameled steel. It can also be used as a crossover or multilayer dielectric for additive polymer thick film circuits. It is compatible with ESL thermosetting polymer silvers such as 1109-S, 1110-S, etc., on PC boards. Due to its mineral filler, it is not recommended for repeated flexing actions or plastic film substrates. ESL #242-SB is the blue version, and ESL #242-D is the spraying/dipping (low viscosity) grade. Filled epoxy systems: For screening - 242-S (yellow), 242-SB (blue) For dipping - 242-D (yellow only) Screen: 200 mesh, 1.2 mil emulsion For cleaning screen, use Cellosolve Acetate or BCA followed by acetone. Thinner: 242-S, 242-SB: #402 thinner or butyl carbitol acetate 242-D: #421 thinner or cellosolve acetate Substrates: Alumina, porcelain steel, mylar, KAPTON #242-S: Viscosity, 25.5-26C: 85+-15 kcps Drying: 125C, 10 min. Curing schedules: 125C, 1 hr. or 15OC, 30 min. Dielectric constant K, 1 kHz: 8-12 #242-SB: Viscosity, 25.5-26C: 85+-15 kcps Drying: 125C, 10 min. Curing schedules: 125C, 1 hr. or 15OC, 30 min. Dielectric constant K, 1 kHz: 8-12 #242-D: Viscosity, 25.5-26C: 2+-0.5 kcps Drying: 125C, 10 min. Curing schedules: 125C, 30 min. or 15OC, 20 min. Dielectric constant K, 1 kHz: 8-12

Coatings

289

ELECTRO-SCIENCE LABORATORIES, INC.: Polymer Resistive Coatings #RS-15100, #RS-15100P, #RS-16000, #RS-16100 Series: ESL #RS-15100 and #RS-15100P resistor systems are thermosetting resin compounds which supplement the #RS-15000 Resistor Series. #RS-16000 and #RS-16100 are thermoplastic polymer systems. All except the #RS-16000 Series are applied by screen printing and produce carbon-based resistors with stability and tolerances suitable for many electronic applications. By proper choice among these series, any of a variety of substrates may be used including phenolic, glass-epoxy and other printed circuit board materials, ceramic, glass, paper and flexible plastic films such as polyester, polyimide and various lower softening temperature plastics. #RS-15100: Viscosity, cps: 70+-10K Shelf Life, OC: 6 mos. Resistivity Ranges, ohmslsq.: 100: RS-15112 IK: RS-15113 10K: RS-15114 100K: RS-15115 1M: RS-15116 #RS-15100P: Viscosity, cps: 70+-10K Shelf Life, OC: 6 mos. Resistivity Ranges, ohmsfsq.: 100: RS-15112P 1K: RS-15113P IOK: RS-15114P IOOK: RS-15115P IM: RS-15116P #RS-16000: Viscosity, cps: 1750+-500 Shelf Life, OC: 6 mos. Resistivity Ranges, ohmslsq.: 1K: RS-16013 1OK: RS-16014 #RS-16100: Viscosity, cps: 225+-50K Shelf Life, OC: 6 mos. Resistivity Ranges, ohmsjsq.: 10: RS-16111 100: RS-16112 IK: RS-16113 IOK: RS-16114 1OOK: RS-16115 IM: RS-16116 1OM: RS-16117

290


ELECTRO-SCIENCE LABORATORIES, INC.: Protective Coating #22H: Room Temperature, Aircure: Properties of #22H Polyurethane Type Films: Color: Transparent Build-up: (one-dip): l-2 mils Adhesion: Excellent to epoxy, phenolic metal, glass and ceramic substrates. Flexibility: Passes l/8" mandrel test Service Temperature: -55C to +15OC, continuous; up to 180C intermittent Temperature Shock: Passes ten cycles (15 min. each) -70C to c15oc Water Immersion: (48 Hrs.): No weight gain. Volume Resistivity 25C: 8 x 10 12 ohm-cm No change after one week exposure to 100% R.H. 80C Solvent Resistance: (1 hr immersion) Not affected by alcohols and chlorinated solvents. Characteristics of #22H as a Liquid Coating: Specific weight: 0.930 Viscosity: 28 ctp. Solids: 25% Shelf Life: 6 months Coverage (one dip): 350-450 sq. ft. per gal. Solvent: xylene Drying Time: (25C): Tack Free: IO-20 min. Thru Dry: 1 l/2 hrs. Hard: 3 hrs. Description: ELECTRO-SCIENCE's #22H protective coating has an exceptional combination of characteristics which make it ideal for many electronic uses. Features include: Easy application--spray or brush not for printing Fast air dry Protects metal surfaces from oxidation. Can be soldered through Continuous service temperature -55C to +15OC. Excellent adhesion to most surfaces. High flexibility Chemical resistance against flux removal solvents. Cures by absorption of water vapor from the atmosphere. These characteristics make #22H especially suitable for the protection of printed circuit boards. Numerous other applications, such as in process protection of solderable surfaces in the manufacture of electronic components or protection of component markings on the printed circuit board, will be found by the development engineer.

Coatings

291

ELECTRO-SCIENCE LABORATORIES, INC.: Protective Coatings #55H-D and #55H-S: High Temperature Application: #55H-D: Resin Tvne: Modified Imide Polvmer Solids Content: 15 to 20% _ Viscosity (25C): 8000 to 12000 cps. Adhesion- Good adhesion to all nblar surfaces like Glasses, Metals, Ceramics _ Service Temp.: -200C to c25OC continuous Weight loss at +25OC less than 1% (1000 hrs.) Cure: (Min. Time): 150C--over night (16 hrs.) (After initial pre-dry) or 2OOC--20 min. or 3OOC-- 5 min. Shelf Stability: 3-6 months (Closed container, refrigerated) Weight per Gallon: 8.5 lbs. Dielectric Strength: 3000V/mil dry Dielectric Constant: 3.6 to 4 (1 megacycle) Dissipation Factor: .003 (1 megacycle) #55H-S: Resin Type: Modified Amide Polymer Solids Content: 30 to 35% Viscosity (25C): 450 to 550 cps. Service Temp.: -80C to +22OC continuous Cure: (Min. Time) (After initial pre-dry): 4 hrs. at +2OOC or, 1 hr. at +25OC Shelf Stability: 3-6 months (Closed container, refrigerated) Weight per Gallon: 8.8 lbs. Dielectric Strength: 4000V/mil dry Dielectric Constant: 3.4 to 3.6 Dissipation Factor: .017 Description: Due to their very stable structure, ESL's #55H-D and #55H-S are useful over a very wide temperature span. #55H-D can be used at temperatures of 300C for limited periods of time. No embrittlement at low temperatures, combined with exceptional oxidation resistance, yield coating materials useful for the most stringent applications. While these characteristics have been optimized in #55H-D, #55H-S has somewhat better adhesion to glass surfaces, and also good for impregnation applications while giving almost equally good characteristics. Both have excellent resistance to solvent attack and moisture penetration. These coatings have been used successfully for the protection of various electronic components against corrosion, heat and cold shock, moisture, etc.

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ELECTRO-SCIENCE LABORATORIES,

INC.: Protective Coating #240-SB:

A screen printable, resin type mineral filled silicone protects thick film resistors, capacitors, and circuits ELECTRO-SCIENCE's #240-SB is a filled, modified silicone coating, specifically formulated for screen printing. It is useful as a protective coating for thick film conductors, resistors and capacitors on ceramic, porcelain enameled steel and printed circuit board substrates. It helps to prevent the effects of corrosion, moisture, oxidation, abrasion, and thermal shock. Polymer thick film systems may utilize #240-SB as a dielectric. It is thermosetting and cures by cross linking. No chemicals that are corrosive or harmful to electronic components are in this material. Standard #240-SB has an opaque blue color. It is also available in black, white, red, orange, yellow and green. Three rheologies are available for the standard blue and black colors: 1. Normal printing grade. 2. Fine line (for solder stop-offs, multilayer uses, etc.). 3. Low viscosity (for high speed printing). Typical Properties: Colors (opaque): Standard blue, black, white, red, orange, yellow and green Surface: Semigloss Viscosity: Kcps @ 25-26C #240-SB standard & colors: 150+-25 Fine line version: 225+-25 Low viscosity version: 80+-15 Adhesion: All ceramic substrates, plastic PC boards and porcelain enameled steel. Curing Temperature C: 150-200 Service Temperature C: -100 to t150 Breakdown Voltage: Greater than 500 volts/mil Dielectric Constant: 6 to 8 @ 1 KHz Dissipation Factor: Less than 0.1% Volume Resistivity: ohms/cm: Greater than 10 10 Insulation Resistance: at 500 V (ohms): Greater than IO 10 at 1000 V (ohms): Greater than 10 10 Solvent Resistance: When properly cured, #240-SB is resistant to most solvents. It may be softened by acetone or methylene chloride. When tested for solvent absorption after a 2 minute ultrasonic immersion in trichloroethylene, #240-SB will increase in weight by less than 3%.

Coatings

FURANE PRODUCTS: Conformal Coatings: ACRYLANE 5730 Acrylic Conformal Coating: Features/Benefits: * One component, no mixing required * Quick drying * Easy repairability * Mil-I-46058 REV C Type AR approved ACRYLANE 5731 Acrylic Conformal Coating: Features/Benefits: * One component. no mixins_ reauired _ * Quick drying * Easy repairability * Sprayable EPOCAST 8122-A/B Epoxy Circuit Board Coating: * Flexible - * 100% Solids * Long Pot Life SILFLEX SP6200 A/B Clear (RTV) Silicone Potting System: Benefits/Features: * Clear, repairable * Reversion resistant * Convenient ratio URALANE 5750-A/B (LV) Urethane Conformal Coating: Benefits/Features: * Low modulus * Repairable * Low outgassing * MIL-I-46058C, Type UR approved URALANE 5751-A/B Urethane Conformal Coating: Features/Benefits: * Low modulus * Easv reoairabilitv * Low-outgassing _ * MIL-I-46058C, Type UR approved URALANE 5780 Urethane Conformal Coating: Benefits/Features: * One component * Contains no TDI or MOCA * Room temperature cure * Meets rule 66 "SCQAMD"

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GC ELECTRONICS: Coatings: Silver Print (Conductive Paint): For PC repair or add-on circuit traces. Pure silver in lacquer based carrier may be brushed on for either conductors or shielding. Connections have equal or better conductivity than copper (0.1 ohms per square). Nickel Print (Conductive Paint): A quick drying lacquer-based coating, oigmented with powdered nickel. For repair and modification of printed circuits. Conductivity is 5 to 6 ohms per square. Red GLPT Insulating Varnish: Alkyd-based compound, especially resistant to environmental extremes includins oils, water and most acids and alkalis. Retains its high dielectric strength even if wet and is, therefore, especially adaptable to the insulation of electrical and electronic devices or components which may be operated in a very humid climate and up to 250F (121C). For general insulation of coils, transformers, motor windings and for all-around protection against oxidation and atmospheric attacks. PRINT KOTE Conformal Coating: The ultimate coating for PC boards . ..provides a protective shield to resist environmental contaminants. Prevents arcing and shorting. Air dry 15 to 30 minutes. May be baked at 200C for 30-60 minutes for extreme high temperature applications. CONKOAT - Conformal Coating: UV Traceable This is a tough, clear coating for the protection of PC boards and components; prevents exposure to moisture, contaminants in air, etc. UV Tracer permits easy visual inspection; any non-coated area will not fluoresce under W light and stands out very noticeably. Features: * Superior moisture resistance * Meets the rigid MIL-I-46058C specification. * Excellent adhesion, even to Teflon. * Solvent repairable. * Transoarent. * Silicone resin base, excellent dielectric properties. * Tack free 2-3 hours, full cure - 24 hours (may be heated to accelerate: 20-30 min. at 125C. degrees). _ Physical Properties: Durometer, Shore A: 60 Tensile, PSI: 220 Elongation, %: 200 Coefficient of Thermal Expansion cm/cm, C: 230 x 10 -6 Electrical Properties: Dielectric strensth. volts/nil: 560 Dielectric constant'(l0 5 Hz): 2.54 Dissipation factor, (10 5 Hz): Tan.002 Volume Resistivity, ohm/cm: 3.5 x 10 16

Coatings

295

GC ELECTRONICS: Coatings (Continued): RED-X Corona Dope: Thixotropic polyester-base red enamel that will not drip or sag, has excellent adhesion and is oil and waterproof. Temperature range: to 220F (IO&). An excellent inSulatOr and corona and spark preventive coating. For moisture-proofing and insulation of high voltage coils and other high voltage components, especially in high humidity problem areas. Also recommended for rotor and field coils in motors, to coat transformers, etc. Q DOPE: Solution of pure polystyrene in solvents. Dries fast and leaves a clear, protective coating on coils and transformers, with no or minimal effect on inductive values. May also be used as a cement for molded or fabricated items made of polystyrene. Liquid Tape: Heavy-bodied, black insulating coating which replaces insulating tape in applications where wrap-around tape could not readily be applied. This compound dries quickly to a strong pliable finish that will not crack, peel or chip. It is water and oil proof and may be used outdoors to insulate any electrical terminal, connection or wire splice. Excellent for providing insulation on handles? etc. Acrylic Plastic: Transparent (glass-like) lacquer. Seals, protects, insulates and tarnish-proofs any object to which it is applied. This coating has high dielectric strength and resists moisture, caustic solutions and alcohols. Used to coat electronic components and connections as well as metal or art objects (to protect against tarnish and corrosion). Meets Fed. Spec. TT-L-50-G Type II Corona Dope: Quick drying, black lacquer insulating coating based on cellulose resin. This lacquer has excellent dielectric, arc and corona resisting properties, and protects surfaces against moisture. Temperature range: to 325F (163C). This lacquer is used to coat flybacks, coils, transformers to improve the insulation and weather resistant properties of wires. EMI-RF1 SHIELD: An effective method for protecting circuitry from external interference or for keeping low level signals inside circuit housing. An extremely conductive graphite coating in a tough binder that requires no undercoat. Adheres well to most plastics and also glass. May be applied.in more than one coat for severe interference problems. Sheet resistance of properly-applied SHIELD is approximately 7.5 ohms/square @ 1 mil. Point-to-point 10 ohms @ 1 inch spacing @ 1 mil. Maximum service temperature 180F. Shielding ability may vary with your particular application but generally ranges from 35-50 dR at 2 mils in conventionally-used RF devices. Full R.F. spectrum tests have not been conducted and may be different in your application.

296


GC ELECTRONICS: Coatings (Continued): INSUL-VOLT: Base: Phenolic Resin Varnish Color: Black Flashpoint: 25F O.C. (Extremely Flammable) Specific Gravity: 1.05 Curing/Drying Time: 3-5 Hrs. Useful Temp. Range: To 105C (220F) STATIC HALT: Base: H20 & Proprietary Ingredients Color: Clear Flashpoint: None Specific Gravity: 0.98 Curing/Drying Time: 10 Mins. Q-DOPE: Base: Polystyrene in Aromatic Hydrocarbon Solvents Color: Clear Flashpoint: 45F Specific Gravity: 0.98 CurinsfDrvins Time: 30-60 Mins. Viscosity- WIX Gardner Scale CP @ 25C Useful Temp. Range: -65C to +71C (-70F to +160F) Suggested Solvent: GC #IO-4102 CORONA DOPE: Base: Cellulose Comuound Color: Black Flashpoint: -lC (30F) O.C. Specific Gravity: 0.90 Curing/Drying Time: 30-60 Mins. Viscosity: 220 cp @ 25C Useful Temp. Range: Up to 340F Suggested Solvent: GC #lo-312 Series or Lacquer Thinner EMI-RF1 SHIELD: Base: Lacquer & Graphite Color: Dark Grey Flash Point: -4C (2.5F) O.C. Specific Gravity:‘0.89. Curing/Drying Time: 3-9 Mins. Viscosity- 015-0.7 Brookfield @ 25C Useful Temp. Range: Max. 197F Constant Suggested Solvent: GC #lo-312 Series or Lacquer Thinner

Coatings

GC ELECTRONICS: Coatings (Continued): RED-X Corona Dope: Base: Thixotropic Polyester Enamel Color: Red Flashpoint: IOC (50F) O.C. Specific Gravity: 1.12 Curing/Drying Time: 2 Hrs. Viscosity: 6,000-10,000 (Brookfield) Useful Temp. Range: To 105C (220F) Suggested Solvent: GC #IO-6702 Naphtha or Xylol RED GLPT Insulating Varnish: Base: Alkyd Resin-Based Enamel Color: Red Flashpoint: 27C (8lF) C.C. Specific Gravity: 1.1 Curing/Drying Time: Dry to Touch 30 Min. Hard Dry 4-8 hrs. @ 77F Viscosity: #4 Ford Cup 65-85 Sec. @ 25C Useful Temp. Range: Up to 260F Suggested Solvent: Xylene LI:QUID TAPE: Base: Synthetic Resin in Solvent Color: Black Flashpoint: 7C (45F) C.C. Specific Gravity: 0.90 Curing/Drying Time: 12 Min. Tack Free Viscosity: 2000-3000 cp @ 25C Useful Temp. Range: 2 to 66C Suggested Solvent: GC #22-209 Acrylic Plastic: Base: Polymeric Acrylic Type Ester Color: Clear Flashooint: 4C (39F1 C.C. Specific Gravity: 1.0 Curing/Drying Time: Tack Free 10 Mins. Viscosity: 250 cp @ 25C Useful Temp. Range: To 19OC (375F) Suggested Solvent: GC #lo-4182 HIGH VOLTAGE PUTTY: Base: Silicone Rubber Compounds Color: Off White Flashpoint: None Specific Gravity: 1.13 Useful Temp. Range: 4 to 85C

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GE SILICONES: Silicone Conformal Coatings: ECC 440, ECC 443, ECC 450, ECC 453, SR 900: GE Silicones offers a choice of silicone conformal coatings designed to meet performance requirements of specific packages. These reliable conformal coatings are compatible with standard production equipment. Key Performance Properties: * Solventless or solvent-borne * Primerless adhesion * Heat-cure or room-temperature processing * Fast thermal cures increase productivity * MIL-I-46058C, type SR, QPL status * IPC CC-830A conformance * Dip, spray or flow-coat application ECC 440, ECC 443, ECC 450, ECC 453: A solventless conformal coating system specifically designed to provide atmospheric protection and preserve the dielectric integrity of extremely sensitive circuit assemblies. These silicone conformal coatings are blendable to adjust viscosity. Temperature range: -75 to 400F (-60 to 204C). * ECC 440 and 450 conformal coatings are clear * ECC 443 and 453 conformal coatings are black All products can be used separately, or blended together to achieve optimum coating viscosity and performance. SR 900: Easy-to-use, one-part coating with UV tracer to facilitate QC inspection. This product protects delicate components from environmental stress, contamination, humidity and moisture. Offers primerless adhesion to most printed circuit board substrates coupled with solvent removability and repairability. SR 900 silicone conformal coating withstands temperatures from -75 to 400F (-60 to 204C).

Coatings

GE SILICONES: Conformal (Continued): ECC 440: Fast Cure Solventless Typical Properties: Color: Clear Cure Conditions: Heat Silicone Content, %: 100 Viscosity, cps (0 25C, 77F): 3500 Specific Gravity: 1.02 Hardness, Shore A Durometer: 20 Tensile Strength, psi (kg/cm 2): 175 (12) Elongation, %: 150 Dielectric Strength, volts/mil (kV/mm): 450 (17.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 14 Useful Temperature Range, F (C): -75 to 400 (-60 to 204) ECC 443: Fast Cure Solventless Typical Properties: Color: Black Cure Conditions: Heat Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 3500 Specific Gravity: 1.03 Hardness, Shore A Durometer: 20 Tensile Strength, psi (kg/cm 2): 175 (12) Elongation, 8: 150 Dielectric Strength, volts/mil (kV/mm): 450 (17.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 14 Useful Temperature Range, F (C): -75 to 400 (-60 to 204) ECC 450: Fast Cure Solventless Typical Properties: Color: Clear Cure Conditions: Heat Silicone Content, 8: 100 Viscosity, cps (@ 25C, 77F):,40,000 Specific Gravity: 1.02 Hardness, Shore A Durometer: 25 Tensile Strength, psi (kg/cm 2): 300 (21) Elongation, 8: 200 Dielectric Strength, volts/mil (kV/mm): 450 (17.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 14 Useful Temperature Range, F (C): -75 to 400 (-60 to 204)

299

300


GE SILICONES: Conformal Coatings (Continued): ECC 453: Fast Cure Solventless Typical Properties: Color: Black Cure Conditions: Heat Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 40,000 Specific Gravity: 1.03 Hardness, Shore A Durometer: 25 Tensile Strength, psi (kg/cm 2): 300 (21) Elongation, %: 200 Dielectric Strength, volts/mil (kV/mm): 450 (17.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 14 Useful Temperature Range, F (C): -75 to 400 (-60 to 204) SR 900: Solvent Repairable Typical Properties: Color: Clear Cure Conditions: RT/Heat Silicone Content, %: 50 Solvent Type: Toluene Viscosity, cps (@ 25C, 77F): 500 Specific Gravity: 0.97 Hardness, Shore A Durometer: 60 Tensile Strength, psi (kg/cm 2): 220 (15) Elongation, %: 200 Dielectric Strength, volts/mil (kV/mm): 560 (22.0) Dielectric Constant (1000 Hz): 2.5 Dissipation Factor (1000 Hz): 0.002 Volume Resistivity, ohm-cm: 3.5 x 10 16 Useful Temperature Range, F (C): -75 to 400 (-60 to 204)

Coatings

301

MAGNOLIA PLASTICS, INC.: MAGNOLIA 3900 & 3901 and MAGNOLIA 3900 & 3901 uv: MAGNOLIA 3900 is a solvent-containing epoxy resin SySteItI designed for coating circuit boards, providing electrical insulation and environmental protection to 8X. This system will cure at room temperature and may be applied by brush, dip or spray techniques. MAGNOLIA 3901 is a more fluid system differing from 3900 only in solids content. It is easier to spray, produces a thinner film and has a different mix ratio. Special Features: MAGNOLIA 3900 and 3901 provide a long pot life, low viscosity system which can be consistently applied in film thicknesses of 3 mils with conventional spray equipment. This semi-rigid coating resists chipping and cracking while exhibiting superior adhesion to most substrates. Excellent humidity resistance and solvent resistance make these systems ideal for providing environmental protection to electronic hardware. Merely one application of this coating will prevent shorting and other contamination. Special versions of 3900 and 3901 are available containing an ultra violet light sensitive agent for inspection of cured boards. This agent will settle to the bottom of the container and must be thoroughly stirred in prior to use. The products containing this agent are called 3900 UV and 3901 UV. All other properties and handling characteristics are identical to 3900 and 3901. Typical Physical Properties: 3900 & 3900 uv: Mix specific gravity: 1.0 Mix viscosity (Ford Cup #4): 30 to 50 seconds Solids content (% by weight): 62 to 65 Coverage (3 mil cured film): 330 sq ft/gal (approx) Color: Clear (very light amber) Pot Life: 8 hrs., approx. Hardness, Pencil: 2 H Tensile Strength, psi: 5,000 Tensile Elongation (%): 8 Mix Ratio (parts by weight or by volume): Part A: I parts Part B: 3 ,oarts 3901 & 3901 uv: Mix specific gravity: 1.0 Mix viscosity (Ford Cup #4): 10 to 20 seconds Solids content (% by weight)': 30 to 35 Coverage (3 mil cured film): 165 Color: Clear Pot Life: 12 hrs., approx. Hardness, Pencil: 2 H Tensile Strength, psi: 5,000 Tensile Elongation (%): 8 Mix Ratio (parts by weight or by volume): Part A: 9 parts Part B: 4 parts

302


MAVIDON CORP.: Coatings: MAVIDON LS 315 Conformal Coating: MAVIDON LS 315 is a one component, solvent base, air dry acrylic conformal coating specifically formulated as a printed circuit board coating. Product Specification: Solids Content: 35% Viscosity at 25C: 450 cps Weight per gallon: 7.6 pounds Flash point: 30F Shelf Life (unopened): 12 months Cure Schedule: Tack free in 15 minutes at room temperature. Totally cured 24 hours at room temperature. Typical Cure Properties: Volume Resistivity: 2.6 x 10 14 ohm-cm Dielectric Constant (1 MHz): 2.5 Dissipation Factor (i MHz); 0.012 Dielectric Strength: 8000 volts/mil Thermal Conductivity: 5x10 -4 Cal/cm/set cm 2 C Coefficient of Thermal Expansion: 82 ppm/C Hardness: 40 Shore A Operating Range: -55C to +13OC Moisture Resistance: 4 x 70 10 ohm Insulation Resistance: 3 x 10 14 ohm T 720 Conformal Coating: MAVIDON T 720 is a one component, solvent base, moisture cure urethane specifically formulated as a printed circuit board. MAVIDON T 720 meets or exceeds all requirements of Mil-I-46058C, Type PUR. Product Specification: Solids Content: 50% Viscosity at 25C (77F): 300 cps Density (Lb/gal): 8.55 lbs. Flash Point: 80F Shelf Life (unopened) @ 25C (77F): 12 months Cure Schedule: Tack free in 1 hour at room temperature. Totally cured 7 days at room temperature.

Coatings

303

MAVIDON CORP.: Coatings (Continued): T-720 Conformal Coating (Continued): Typical Cure Properties: Volume Resistivity: 2.6 x 10 14 ohm-cm Dielectric Constant (120Hz): 4.4 Dissipation Factor (120 Hz): 0.012 Dielectric Strength: 800 volts/mil Thermal Conductivity: 5x10 -4 Callcmlsec cm 2 C Coefficient of Thermal Expansion: 82 ppm/C Hardness: 40 Shore A MAVIDON T 721 Conformal Coating: MAVIDON T 721 is a one component, moisture cure, urethane printed circuit board coating. MAVIDON T 721 has been formulated to provide flexibility, abrasion resistance, chemical and corrosion resistance. Product Specifications: Solids Content: 40% Viscosity at 25C (77F): 150 cps Density (Lb/gal): 8.0 lbs. Flash Point: 80F Shelf Life (unopened) @ 25C (77F): 1 year Cure Schedule: Tack free in 3 hours at room temperature. Totally cured 7 days at room temperature. Cure times may be shortened to 20 minutes by heating to 120F at 65% relative humidity. Typical Cure Properties: Volume Resistivity: 2.6 x 10 14 ohm-cm Dielectric Constant (120 Hz): 4.4 Dissioation Factor (120 Hz): 0.012 Dielectric Strength: 800 volts/mil Tensile Strength: 3500 psi Elongation: 150%

304


MAVIDON CORP.: Coatings (Continued): T-742 Conformal Coating: MAVIDON T-742 is a one component urethane conformal coating that cures at room temperature. (T-742 is not dependent upon ambient moisture). Applications include wire and printed circuit board coatings. Product Specifications: Solids Content: 35% Viscosity @ 25C (77F): 250 cps Density (Lb/gal): 8.8 Flash Point: 45F Shelf Life (unopened) 25C (77F): 6 months Cure Rate: After application, T-742 will be tack-free within 20 minutes at room temperature. Full cure in 24 hours. Typical Cured Characteristics: Tensile Strength: 4000 psi Dielectric Strength: 400 volts per mil Dielectric Constant: (10 2 Hz) 4.16 Dissipation Factor: (10 2 Hz) .OlO Volume Resistivity: (ohm-cm): 2.07 x 10 13 T-743 Conformal Coating: FAVIDON T 743 is a one component urethane conformal coating that cures at room temperature. (T-743 is not dependent upon ambient moisture). Applications include wire and printed circuit board coatings. Product Specifications: Solids Content: 35% Viscosity @ 25C (77F): 250 cps Density (Lb/gal): 8.1 Flash Point: IllF Shelf Life (unopened) @ 25C (77F): 6 months Cure Rate: After application, T 743 will be tack-free within 30 minutes at room temperature. Full cure in 24 hours. rpical Cured Characteristics: Tensile Strength: 4000 psi Dielectric Strength: 400 volts per mil Dielectric Constant: (IO 2 Hz) 4.16 Dissipation Factor: (10 2 Hz) .OlO Volume Resistivity: 2.07 x 10 13 Thermal Conductivity: 5 x 10 -4 Cal/cm/set cm 2 C Coef. of Thermal Expansion: 70 ppm/C Hardness: 75 Shore A

Coatings

305

MAVIDON CORP.: Coatings (Continued): 1110 Encapsulating Compound: MAVIDON System 1110 is a two component, green epoxy casting compound featuring low viscosity, rapid cure rate and excellent flexibility. MAVIDON 1110 has good thermal stability. Physical Characteristics: 1110-A: Appearance: Green Liquid Viscosity @ 25C (77F): 1,750 cps Density: 8.8 Shelf Life @ 25C (77F): 1 year 1110-B:

Appearance: Amber Liquid Viscosity @ 25C (77F): 3,000 cps Density: 8.0 Shelf Life @ 25C (77F): 1 year Mix Ratio: 100 parts 1110 A to 90 parts 1110 B by weight. 1 part 1110 A to 1 part 1110 B by volume. Pot Life: 25 minutes in a 50 gram mass @ 25C (77F) Cure Schedule: 1 hour at room temperature for handling strength, overnight for full cure. rpical Cured Characteristics: Hardness: 15 Shore D Volume Resistivity (ohm-cm): 2 x 14 Thermal Coefficient of Expansion: 65 x 10 -5 in/in/F Dielectric Constant: 4.0 Dielectric Strength (volts/Mil): 375 Operating Class: B (13OC)

306

Adhesives, Sealants and Coatings for the Elecfronics Zndusty

MAVIDON

CORP.:

Coatings (Continued):

1610 Casting Compound: MAVIDON system 1610 is a black, two component, room temperature curing epoxy system encapsulating compound featuring long pot life, convenient 1:l by volume mix ratio and good dielectric properties. Physical Characteristics: 1610 A: Appearance: Black Liquid Viscosity @ 25C (77F): 12,000 Filler Content: 0 Density (lb/gal): 9.0 Shelf life: 1 year

cps

1610 B: Appearance: Pale liquid Viscosity @ 25C (77F): 700 cps Filler Content: 0 Density (lb/gal): 8.7 Shelf Life: 1 year Mix Ratio: By weight: 100 parts 1610 A to 83 parts 1610 B By volume: 1 part 1610 A to 1 part 1610 B Pot Life: 1 hour in a 100 gram mass @ 25C (77F) Cure Schedule: Twenty-four hours at room temperature or 2 hours @ 140F Typical Cured Characteristics: Hardness: 77D Dielectric Strength: 390 volts/mil Volume Resistivity: 8.6 x 10 13 ohm-cm Thermal Expansion Coefficient: 6 x 10 -5 in/in/C Operating Class: A (105C)

Coatings

MAVIDON CORP.: Coatings (Continued): 1617 Casting Compound: MAVIDON system 1617 is a black, two component, room temperature curing epoxy encapsulating compound featuring long pot life, and good electrical properties. Physical Characteristics: 1617~: Appearance: Black Liquid Viscositv @ 25C (77F): 800 cps Filler Content: 0 Density (lb/gal): 9.0 Shelf Life: 1 year 1617B: Appearance: Pale Liquid Viscositv P 25C (77F): 700 Filler Content: 0 Density (lb/qal): 8.7 Shelf Life: 7 year

CDS

Mix Ratio: By Weight: 100 parts 1617 A to 83 parts 1617 B. By Volume: 1 part 1617 A to 1 part 1617 B. Pot Life: 1 hour in a 100 gram mass at 25C (77F) Cure Schedule: Twenty-four hours at room temperature or 2 hours at 140F. Typical Cured Characteristics: Hardness: 65 D Dielectric Strenath: 390 volts/mil Volume Resistivity: 8.6 x 10 13 ohm-cm Thermal Expansion Coefficient: 6 x 10 -5 in/in/C Operating Class: A (105C) 1617-I

: Modified to improve air release properties.

307

308


MAVIDON CORP.: Coatings (Continued): 1618 Epoxy Resin: MAVIDON casting system 1618 is a two component, filled epoxy resin which features fast cure, low viscosity, good dielectric properties and provides Class B insulating properties. Physical Characteristics: 1618 A: Appearance: Black Liquid Viscosity 8 25C (77F): 7850 cps Density (lb/gal): 13.8 Shelf Life 8 25C (77F): 6 months 1618 B: Appearance: Amber Liquid Viscosity 8 25C (77F): 500 cps Density (lb/gal): 8.30 Shelf Life @ 25C (77F): 1 year Mix Ratio: 100 parts 1618 A to 13 parts 1618 B by weight. Pot Life: 60 minutes in a 100 gram mass at 25C (77F). Cure Schedule: 2 hours at 60C (140F) or 24 hours at room temperature Typical Cured Characteristics: Shore D Hardness: 85 Tensile Strength: 2100 psi Thermal Conductivity: 3.0 (BTU/hr/ft 2 F) Heat Distortion Temperature: IOOC Flammability, UL 94: VO Dielectric Constant: 4.19 8 25C (I KH) Volume Resistivity: 2.8 x 10 16 ohm-cm Thermal Expansion Coeffiecient in/in/C: 3.0 x 10 -4 Dissipation Factor (I KHz at 25C): .02 Operating Class: B (13OC)

Coatings

MAVIDON CORP.: Coatings (Continued): 1619 Casting Compound: MAVIDON system 1619 is a black, two component epoxy encapsulating compound which features a convenient mix ratio, good dielectric properties, and cures to yield a very flexible casting. Physical Characteristics: 1619 A: Aooearance: Black Svruv Viscosity @ 25C (77%'):‘1,700 cps Density (Lb/gal): 8.7 Shelf Life @-25C (77F): 1 year 1619 B: Appearance: Amber Liquid Viscosity @ 25C (77F): 200 cps Density (Lb/gal): 8.2 Shelf Life @ 25C (77F): 1 year Mix Ratio: 2 parts 1619 A to 1 part 1619 B by volume. 100 parts 1619 A to 47 parts 1619 B by weight. Pot Life: 20 minutes in a 50 gram mass @ 25C (77F) Cure Schedule: Overnight at room temperature. Typical Cured Characteristics: Hardness: 25D Thermal Exuansion Coefficient (in/in/C): 6 x 10 -5 Dissipation Factor (IO 3 Hz): ;039 Thermal Conductivity (btu/hr ft 2 F/in): 1.5 Dielectric Constant (IO 3 Hz): 3.9 Operating Class: A (105C)

309

310


MAVIDON CORP.: Coatings (Continued): 1717-1 Casting Compound: MAVIDON system 1717-1 is a black, two component, room temperature curing epoxy encapsulating compound featuring long pot life, convenient mix ratio and good dielectric properties. Physical Characteristics: 1717-IA: Appearance: Black Syrup Viscosity @ 25C (77F): 13,000 cps Filler Content: 50% Density (g/cc): 1.5 Shelf Life: 6 months 1717-IB: Appearance: Amber Syrup Viscosity @ 25C (77F): 1000 cps Filler Content: 0% Density (g/cc): 1.0 Shelf Life: 6 months Mix Ratio: By weight: 100 parts 1717-1A to 42 parts 1717-IB By volume: 3 parts 1717-IA to 2 parts 1717-1B Pot Life: 1 hour in a 100 gram mass initially at 25C (77F) Cure Schedule: Twenty-four hours at room temperature or 2 hours at 140F. Tvnical Cured Characteristics: zAHardness: 72D Dielectric Strenqth: 390 volts/mil Volume Resistivity: 8.6 x 10 13 ohm-cm Thermal Expansion Coefficient: 5 x 10 -5 in/in/C Operating Class: A

Coatings

MAVIDON CORP.: Coatings (Continued): 4180 High Temperature Casting Compound: MAVIDON system 4180 is a two component, heat-cured epoxy encapsulating compound formulated for applications requiring good electrical insulating and high temperature capabilities. 4180 features low viscosity, long pot life and a convenient mix ratio by weight or volume. Phi rsical Characteristics: 41E 10 A: Appearance: Grey Liquid Viscosity @ 25C (77F): 10,000 cps Density (Lb/gal): 12 Shelf Life @ 25C (77F): 6 months B: Appearance: Tan Liquid Viscosity @ 25C (77F): 2,800 cps Density (lb/gal): 12 Shelf Life @ 25C (77F): 6 months

4180

Mix Ratio: 100 parts 4180 A to 100 parts 4180 B by weight 1 part 4180 A to 1 part 4180 B by volume Pot Life: Greater than 24 hours in a 100 gram mass at 25C. (Pot life is dependent upon mass and temperature) Cure Schedule: For optimum properties cure for 2 hours at 85C followed by a post cure of 3 hours at 150C. (In many applications wide variations from the optimum conditions yield acceptable results; e.g.: 4 hours at 120C or 1 hour at 1OOC followed by 1 hour at 15OC.) Typical Cured Characteristics: Tensile Strength: 10,000 psi Compressive Strength: 24,000 psi Thermal Expansion Coefficient C -1: 28 x 10 -6 Water Absorption (% gain): .l after 240 hrs at 20C Dielectric Constant (50 Hz at 2OC): 3.9 Volume Resistivity: 2.0 x IQ 15 Operating Class: F (155C)

31 I

312


MERECO

DIVISION:

MERECO

CN-785U

Circuit Board Coating:

Single component, repairable, flexible, rapid drying, moisture resistant urethane circuit board coating MERECO CN-785U is a single component, rapid room temperature drying, solvent based, moisture curing, oil free, polyurethane coating. It is specifically designed for printed circuits, electronic components and electronic devices requiring a high moisture resistance and environmental protection. MERECO CN-785U meets the requirements of MIL-I-46058C Type UR, and may be used wherever a high performance coating is required for maximum environmental protection. MERECO CN-785U is also used as an environmentally long lasting premium grade floor coating for industrial environments. Outstanding Features: * Sinsle comnonent, no soecial mixins or oreoaration. - * Fast drying, tack free‘3 hours. * High gloss, "walk hard" coatings (floor coatings). * Excellent moisture resistance. * Excellent abrasion resistance. * Excellent electrical insulating properties. * Repairable (after component exchange on P.C. boards). Typical Properties: Uncured Liquid (Bulk): Gardner Color: 1 Solids, %: 40 Viscosity, cps (25C): 120 NC0 Content, %: 2.9 Pounds/gallon: 8.1 Flash Point, F: 81 Wet Film (40% solids, 3 mil thickness): Set to touch, minutes: 10 Surface dry, minutes: 45 Hard dry, hours: 4 Full cure, hours: 12 Sward Hardness (1 day): 25 Cured Film: Color of Film: Clear Sward Hardness: 38 Taber Abrasion Loss, mq: 18 Tensile strength, psi:-5000 Elongation, %: (20 in/min. Instron): 85 Impact resistance, in pounds: Direct: 160 Reverse: 140 Thermal Shock (MIL-I-46058C, UR): Passes Dielectric Strength, volts/mil: 380 Dielectric Constant, (60 Hz): 4.1 Insulation Resistance, ohms: 1.5 x 10 12

Coatings

MERECO DIVISION: META-CLAD 1175 Clear Epoxy Protective Varnish: META-CLAD 1175 is a 100% reactive epoxy protective coating system which may be used as a lacquer, a clear varnish, or paint. It may be applied by any of the standard techniques, such as brush, roller, dip or spray. The material is supplied to a brush or dip coating consistency, but may be thinned with lacquer solvents, xylol or toluol to achieve the desired consistency for spray coating. META-CLAD 1175 provides the usual high level of chemical resistance, corrosion resistance, flexibility and outstanding adhesion properties associated with 100% reactive type epoxy paints. Its exceptional resistance to abrasion and convenient air curing properties suggest itself for use in industrial maintenance areas where corrosive fumes are a serious problem. Also, META-CLAD 1175 may be used as a coating for equipment to be used in such areas on which, because of size, a baking type coating cannot be used. Where faster drying is desired, a convenient baking schedule may be used. Cure Schedules: Room Temperature Cure: Dry to touch - 2 to 3 hours Light traffic - ,24 hours Full cure - 4 to 7 days Alternate Bake Schedule: Air dry or force dry to touch; then bake 15 mins. at 300F, or 25 mins. at 250F. METACLAD DP-537 Protective Coating: Single component, fast air-dry, solderable, all purpose protective coating, temp. Class B (13OC) Liquid Properties: Specific Weight (lbs/gal): 7.3 Solids Content (8 by weight): 25 Viscosity (Centistokes): 30 Flash Point (C): 45 Drying Time: 10 min. Complete Drying Time Room Temp.: 30 min. Thermal Properties: Maximum continuous use temp. (C): 140 Maximum Intermittent Use (C): 160 Maximum Low Temp. (C): -45 Thermal Shock Test: Passes Temperature Cycling Test: Passes Solderability: Good Physical Properties of Cured METACLAD DP-537: Color: Water Clear Specific Gravity: 0.88 Average Build per Dip (Mils): l/2 Humidity Resistance: Passes Salt Spray Test: Passes Moisture Resistance Test (Megohms): 30,000 Water Absorption (% Wt. Gain after 24 hrs. Immersion): 0. 17 Adhesion: Excellent

313

314


MERECO DIVISION: METACOTE 1031 Silicone Protective Coating: 250 Single Component Clear Silicone Protective Coating for Electronic Components METACOTE 1031 is a unique silicone resin system designed for protection of electronic components for 250C service. Cured films of METACOTE 1031 are thermally and mechanically stable--do not crack, chip or craze and provide a corrosion resistant barrier. METACOTE 1031 is particularly well suited to the protection of pyrolitically deposited films, and will stabilize resistance values against changes induced by subsequent encapsulation. METACOTE 1031 is also suitable as a "cushion coating", or impregnant, for wire wound resistors or coils to prevent open circuits due to broken wires during encapsulation. METACOTE 1031 is also supplied mica filled (1031-M) for specialized thixotropic coating applications. Outstanding Features: Impermeable to moisture vapor, chemical and corrosion resistant, non-crazing or cracking, tough yet resilient, optically clear, impact resistant, outstanding electrical properties, barrier to silver migration. Suggested Uses: Stabilization of Pyrolylic film resistors against changes due to encapsulation process, protective environmental varnish, undercoating for epoxy, phenolic, silicone-ester, and other coatings. Typical Properties: Uncured Liquid: Solids Content (8): 50 Specific Gravity @ 25C: 1.02 Color, Gardner: 2 Viscosity @ 25C: 150-200 Cured Films: Dielectric Constant @ 10 5 cycles: 3.0 Power Factor @ 10 5 cycles: 0.0008 Arc Resistance, seconds: 180 Dielectric Strength, Volts/mil: 300 Heat Resistance @ 500F: Excellent @ 600F: Good

Coatings

MERECO DIVISION: METAGEL 1870 Dip Coating Compound:

315

Series: Thixotropic Conformal

METAGEL 1870 is an epoxy dipping and sealing compound especially formulated to meet the most difficult requirements for encapsulating and conformally coating electronic components. * * * * *

Excellent mechanical properties Excellent electrical properties High chemical resistance Environmental protection Heat induced thixotropy

The thixotropic nature of METAGEL 1870 is adjusted for dipping applications. The coating thickness is controlled by the temperature of the units to be coated, by vibration of the bath and bv the speed with which the units enter and leave the bath. Curing produces an enamel-like finish. METAGEL 1870 is a two-component system. Pot life is about 4 hours, but is dependent on the volume and temperature of the mixture. Typical Product Properties: Activator: Color: Translucent straw Form: Soft gel Brookfield Viscosity: Thixotrooic Specific Gravity (25/25C): 1.0' Flash Point, F: 256 Base: Color: As specified Form: Pourable paste Brookfield Viscosity, P: 1500 Specific Gravity (25/25C): 1.5 Flash Point, F: 300 Product User Data: Mixing Ratio, phr: 20 Brookfield Viscositv. P: 850 Specific Gravity (25j25C): 1.2 Pot Life (100 g mass), hr: 4 Curing Schedules, C: 3 hrs.: 60 1 l/2 hrs.: 85 Typical Cured State Properties (after 90 minutes at 85C): Color: As specified Form: Enamel Soecific Gravitv (25/25C): 1.2 Ultimate Flexural‘strength, psi: 15000 Ultimate Compressive Strength, psi: 22000 Izod Impact, Strength, ft-lb/in of notch: 0.46

316


MILLER-STEPHENSON CHEMICAL CO., INC.: Conformal Coatings: MS-465 Acrylic Coating: Wet: Aerosol/Liquid Contains acrylic resin TWA ppm: 533 Initial Boiling Point C/F: 47.71118 Internal Pressure at 21C/70F: ~40 psia Flash Point F: None MS-475 Acrylic Coating (Mil Spec): Wet: Aerosol/Liquid MIL-I-46058 Type AR/MIL-T-l52B Contains acrvlic resin TWA ppm: 575Initial Boliinq Point C/F: 48/119 Internal Pressure at 21C/70F: ~40 psia MS-460 Silicone Resin Coatins: Wet: Aerosol/Liquid MIL-I-46058 Type SR/MIL-T-152B Contains silicone resin TWA ppm: >650 Initial Boiling Point C/F: 143.2/290 Internal Pressure at 21C/70F: ~40 psia Flash Point F: None MS-470 Urethane Coating: Wet: Aerosol/Liquid MIL-I-46058 Type UR/MIL-C-47175A/MIL-T-152B Contains urethane resin TWA ppm: 491 Initial Boiling Point C/F: 36.2197.2 Internal Pressure at 21C/70F: ~40 psia MS-450 Protective Varnish: Wet: Aerosol/Liquid MIL-V-173C/MIL-T-152B Contains paraphenyl phenol-formaldehyde TWA ppm: 360 _ _ Initial Boiling Point C/F: 110/230 Internal Pressure at 21C/70F:' ~40 psia Flash Point F: 104 (TOC)

resin

Coatings

MILLER-STEPHENSON CHEMICAL CO., INC.: Conformal Protective Coating: Aerosol Products: MS-450 Protective Varnish: Available in bulk as MS-452 Excellent protection for adverse environmental conditions. Dries in minutes to form a moisture- and fungus-resistant coating. Base Material: varnish Dielectric Constant: 2.00 @ 10 5 HZ Dielectric Strength: 850 Volts/Mil Conforms to Military Specification: Mil-V-173C Ultraviolet Indicator: No Ease of Repair: Fair Fungus Resistance: Yes Moisture Resistance: Yes Thermal Shock Resistance: -55C/-67F to 85Cfl85F Strippable with MS-114 Conformal Coating Stripper: Yes Drying Time @ 25C/77F: 30 min. Coverage @ 2 mil Thickness (16 oz. Aerosol): 11.7 sq. ft. MS-460 Silicone Resin Coating: Available in bulk as MS-462 Solderable coating for ease of repair and replacement of components. Offers good dielectric properties and excellent moisture resistance. Curing may be heat accelerated. Base Material: silicone resin Dielectric Constant: 2.58 @ 10 5 HZ Dielectric Strength: 1200 Volts/Mil Conforms to Military Specification: Mil-1-46058 (Type SR) Ultraviolet Indicator: Yes Ease of Repair: Excellent Fungus Resistance: Yes Moisture Resistance: Yes Thermal Shock Resistance: -55C/-67F to 150C/302F Strippable with MS-114 Conformal Coating Stripper: Yes Drying Time @ 25C/77F: 60 min. (Curing may be heat accelerated.) Coverage @ 2 mil Thickness (16 oz. Aerosol): 3.5 sq. ft.

317

318


MILLER-STEPHENSON CHEMICAL CO., INC.: Conformal Protective Coating: Aerosol Product (Continued): MS-465 Acrylic Coating: Available in bulk as MS-467 Provides insulation against high voltage arcing and corona shorts. Contains an ultraviolet indicator for quality control inspection. Fast drying. Base Material: acrylic resin Dielectric Constant: 1.57 @ IO 5 HZ Dielectric Strength: 2000 Volts/Mil Ultraviolet Indicator: Yes Ease of Repair: Good Funaus Resistance: Yes Moisture Resistance: Yes Thermal Shock Resistance: -5C/23F to 150C/302F Strippable with MS-114 Conformal Coating Stripper: Yes Drying Time @ 25C/77F: 10 min. Coverage @ 2 mil Thickness (16 oz. Aerosol): 8.1 sq. ft. MS-470 Urethane Coating: Available in bulk as MS-472 Solderable for ease of repair. A durable coating with excellent dielectric properties and chemical resistance. Contains an ultraviolet indicator for quality control inspections. Base Material: urethane resin Dielectric Constant: 1.45 @ 10 5 HZ Dielectric Strenqth: 1500 Volts/Mil Conforms to Military Specification: Mil-1-46058 (Type UR) Ultraviolet Indicator: Yes Ease of Repair: Excellent Funaus Resistance: Yes Moisture Resistance: Yes Thermal Shock Resistance: -55C/-67F to llOC/23OF Strippable with MS-114 Conformal Coating Stripper: Yes Drying Time @ 25C/77F: 30 min. Coverage @ 2 mil Thickness (16 oz. Aerosol): 9.5 sq. ft.

Coatings

319

MILLER-STEPHENSON CHEMICAL CO., INC.: Conformal Protective Coatings: Aerosol Products (Continued): MS-475 Acrylic Coating: Available in bulk as MS-477 Superior toughness and abrasion resistance. Provides excellent insulation and moisture resistance. Solderable for ease of repair. Easily removed by solvent systems. Base Material: acrylic resin Dielectric Constant: 3.0 @ 100 HZ Dielectric Strength: 2000 Volts/Mil Conforms to Military Specification: Mil-1-46058 (Type AR) Ultraviolet Indicator: Yes Ease of Repair: Excellent Fungus Resistance: Yes Moisture Resistance: Yes Thermal Shock Resistance: -65C/-85F to 125C/257F Strippable with MS-114 Conformal Coating Stripper: Yes Drying Time @ 25Cf77F: 60 min. (Curing may be-heat accelerated.) Coverage @ 2 Mil Thickness (16 oz. Aerosol): 7.0 sq. ft.

320


PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1568 Conformal Coating: Use: As a thin film, conformal coating on printed circuit assemblies, to protect against environmental stresses. Description: PR-1568 is a one-part urethane coating. It may be applied by brushing, dipping or spraying, to obtain a tough, void-free, clear amber film. Specifications: PR-1568 meets the requirements of MIL-I-46058C(6), Type UR. Application Properties: Color: Clear Amber Viscosity (Ford #4 cup at 75F): 20 seconds Nonvolatile Content: 40% Flash Point: 85F (PMCC) Tack-Free Time: 1 hour @ 75F, 50% RH Cure Time: 2 days @ 75F, 50% RH or 15 hrs. @ 120F or 3 hrs. @ 180F Recommended Thickness: 1.5 to 2 mils Approximate Coverage: 700 sq.ft./gal/mil Volatile Organic Compounds: 600 gms/liter Performance Properties: Color: Clear Q (resonance): Change before and after coating: At 1 MHz: t5.0% At 50 MHz: (4.0% Change before and after immersion in distilled water at 75F for 24 hours: At 1 MHz: (8% At 50 MHz: t6% Dielectric Withstanding Voltage: No leakage Insulation Resistance: Initial: 1x10 7 mesaohms After IO days condensing moisture and temperature cycling between 75F and 158F in accordance with MIL-STS-202, Method 106C: 1x10 6 megaohms Power Factor: 1 KHz: 0.013 2 MHz.: 0.016 Dielectric Constant: 1 KHz: 3.2 2 MHz: 2.9 Low Temperature Flexibility: -65F

Coatings

321

RANBAR TECHNOLOGY INC.: THERMELEC Electrical Insulating Varnishes: The extensive product line includes: - Air Dry Varnishes (clear, colors, and aerosol cans) - Baking Systems - Water Reducible Varnishes - Potting Compounds - High solids and 100% reactive materials - Vacuum pressure impregnating materials - Conformal Coatings - Magnet Core Coatings - Aqua Strip strippable coating for leads and connections The products are based upon modified alkyds, polyesters, and epoxy resins. A broad range of solids, viscosities, and dry times provide the customer with versatility and ease of application. Many products have received Underwriters Laboratory approva and meet Military Specification MIL-I-24092B. A partial listing of the product line is included below. Electrical Specialties: Solvent Baking Varnish, Clear: THERMELEC G-3726: Type: Polyester Non Volatile %: 48% Viscosity cps: 500-800 Flash Pt Seta. F: 104 Cure Hours (C): 2 @ [149Cl UL Class Recog.: 180 MIL. Spec.: MIL-I-24092B, Grade CB I, II General purpose varnish for stators, rotors, armatures, and coils THERMELEC G-4020: Type: Polyester Non Volatile %: 48% Viscosity cps: 250-450 Flash Pt. Seta. F: 139 Cure Hours (C): 2 @ [149C] UL Class Recog.: 180 MIL Spec.: MIL-I-24092B, Grade CB I, II General purpose varnish for coils, transformers, stators

322


RANBAR TECHNOLOGY, INC.: Electrical Specialties(Continued): Solvent Baking Varnish, Clear(Continued): THERMELEC G-4101: Type: Polyester Non Volatile %: 50% Viscosity cps: 250-450 Flash Pt. Seta. F: 114 Cure Hours (C): 2-4 @ [149Cl UL Class Recog.: 180 MIL. Spec.: MIL-I-24092B Grade CBH I, II General purpose varnish with high bond strength THERMELEC G-4130: Type: Epoxy Non Volatile %: 50% Viscosity cps: 900-1100 Flash Pt. Seta. F: 105 Cure Hours (C): 3 @ [16OCl UL Class Recog.: 180 Fast cure, chemically resistant, excellent for hermetic applications. Water Reducible Varnish: THERMELEC G-4173: Type: Polyester Non Volatile %: 35% Viscositv cos: 300-500 Flash Pt: Seta. F: 118 Cure Hours (C): 2 @ [149Cl UL Class Recog. 180 (DuPont #I61 General purpose varnish THERMELEC G-4221: Type: Polyester Non Volatile 8: 31% Viscositv cos: 300-400 Flash Pt: Seta. F: 123 Cure Hours (C): 1 @ [126Cl UL Class Recog.: 180 General purpose varnish low'temperature cure

Coatings

RANBAR TECHNOLOGY INC.: Electrical Specialties(Continued): Air Dry Clear Varnish: THERMELEC G-3575: Type: Uralkyd Non Volatile %: 50% Viscosity cps: 150-200 Flash Pt. Seta. F: 100 Cure Hours (C): 5 @ [25Cl Flexible, moisture and abrasion resistant conformal applications THERMELEC G-3879: Type: Modified Alkyd Non Volatile %: 42% Viscosity cps: 100-150 Flash Pt. Seta. F: 76 Cure Hours (C): l/2 @ 125Cl MIL Spec.: MIL-I-24092B Grade CA I, II Fast dry, excellent dielective properties THERMELEC G-4355: Type: Epoxy Ester Non Volatile %: 37% Viscosity cps: 300-500 Flash Pt. Seta. F: 80 Cure Hours (C): 3-4 @ [25Cl Excellent for high humidity THERMELEC G-4192: Type: Polyurethane Non Volatile %: 45% Viscosity cps: 270-370 Flash Pt. Seta. F: 82 Cure Hours (C): l/4 @ [25C] Conformal applications THERMELEC G-4039: Type: Acrylic Non Volatile %: 25% Viscosity cps: 40-75 Flash Pt. Seta. F: 61 Cure Hours (C): l/2 @ [25Cl MIL. Spec.: MIL-I-46058C Type AR Conformal applications

323

324


RANBAR TECHNOLOGY INC.: Electrical Specialties(Continued): 100% Reactive Varnish: THERMELEC G-2054: Tvoe: Polvester Gei Time:- 15-25/1OOC Viscosity CPS: 150-250 Flash Pt; S&a. F: 94 Cure Hours 8 [Cl: l/2-2 8 f149Cl UL Class Recog.: 155 Monomer: Styrene General purpose, excellent stability, low viscosity THERMELEC G-4103: Type: Polyester Gel Time: IO-20/100c Viscosity cps: 700-1100 Flash Pt. Seta. F: 165 Cure Hours (C): 1 8 [149C] UL Class Recog.: 155 MIL. Spec.: T-butyl Styrene V.P.I. high flash point THERMELEC G-4171: Type: Epoxy Gel Time: 15-20/15OC Viscosity cps: 1500-2500 Flash Pt. Seta. F: 200~ V.P.I. Epoxy can be used as potting compound THERMELEC G-426814269: Type: Epoxy Gel Time: lo-15/15oc Viscosity cps: 650-1050 Flash Pt. Seta. F: 200+ Trickle impregnation epoxy

Coatings

325

SYMPLASTICS INC.: SYMPOXY 1495 Dip Coating: Two component epoxy dip coating SYMPOXY 1495 is a two component heat or room temperature cure epoxy system used for dipping small ceramic chips, tubular or oval capacitors or any component where a true conformal coating is desired which covers sharp edges with an even coating. Coating build up of .050 may be made with this system. Very little air entrapment makes this system excellent for one coat dip, but to insure maximum moisture resistance two coats are suggested. A maximum drop in IR of 15-208 may be expected with proper application of this system. The adhesion of SYMPOXY 1495 is excellent and will adhere to most materials including ceramic, plastic, metals, etc. No induction time is required. Components: 2 Color: Black Pot life, I# mass, hours: 3 Perfect conformal coating life, l# mass. min. @ 78F: 60 I# mass, min. @ 60F: 120 Pencil Hardness (24 hrs. @ 25C): 4H Dielectric strength (volt/mil): 450 Dielectric constant to 10 6 cps: 3.20

326

Adhesives,

Sealants


Industry

TACC INTERNATIONAL CORP.: Conformal Coatings: CR-3117: Type: Epoxy Flexible circuit board coating, solvent based conformal protective coating. Fluorescent under black light for coverage and identification. Passes MIL-E5722 and MIL-STD-202 (106). Catalyst Number: CR-3117-B Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 50 Workable Pot Life 100 gm. Mass @ 25C: Days Mixed Viscosity 8 25C cps: 500 Recommended Cure Time: Room Temp - 24 hrs. or 3 hrs. at 50C Hardness Shore: 70-D Color: Amber CR-3200:

Type: Urethane One part polyurethane coating varnish which forms a resilient high gloss finish. Excellent salt spray resistance. Ideal moisture barrier for IC's and PCB's Catalyst Number: No catalyst required Workable Pot Life 100 gm. Mass @ 25C: 6 mos. Mixed Viscosity @ 25C cps: 100 Recommended Cure Time: Room Temp. 8 hrs. Hardness Shore: 75-D Color: Clear CR-3200

WS:

Type: Urethane Water borne urethane air dry coating. Excellent adhesion to a broad range of substrates, including: steel, aluminum, nickel, bronze, brass, copper, ceramics, etc. Catalyst Number: No catalyst required Workable Pot Life 100 gm. Mass @ 25C: 3 days Mixed Viscosity @ 25C cps: 200 Recommended Cure Time: Room Temp. 1 hr 20 min. Hardness Shore: 80-D Color: Amber 16-600: Type: Epoxy Conformal dip coating for foil, metalized film, ceramic, mica and tantalum capacitors. Meets UL 94 V-O requirements. Catalyst Number: 64 Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 15 Workable Pot Life 100 gm. Mass @ 25C: 90 min. Mixed Viscosity @ 25C cps: Thixotropic Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 86-D Color: Black or Green

Coatings

327

TACC INTERNATIONAL CORP.: Conformal Coatings (Continued): CR-3912: Type: Silicone High temperature resistant, excellent adhesion polymer for barrier, protective or conformal coating. Catalyst Number: CR-3912-B Mix Ratio Parts of Catalyst to 100 Parts Resin by Weight: 10 Workable Pot Life 100 cm. Mass a 25C: 24 hrs. Mixed Viscosity @ 25C cps: 200 Recommended Cure Time: Room Temp. 24 hrs. Hardness Shore: 70-D Color: Clear

Section VI Conductive Compounds

328

Conductive Compounds

ABATRON, INC.: Electrically Conductive Compounds: Basic conductive adhesives and coatings for industrial requirements. Silver Filled: ~Resin portion: 8401-IA Hardener portion: 8401-1B Vehicle type: epoxy Filler: silver Color: gray Solids, % by weight: 81.5 Metal % of vehicle: 95.7 Ohms/square: 20 mils.) Long pot life. Cured under pressure (6 psi). For quick bonding or conductive elastomers.

356


CHOMHRICS, INC.: CHO-BOND Conductive Adhesives(Continued): 1030: Binder: silicone Filler: Ag/Cu Mix Ratio (by wgt.): l-part Consistency: gritty paste Specific Gravity: 3.75~0.25 Minimum Lao Shear Strenath (osi): 200 Maximum DC‘Volume Resisfivity (ohm-cm): 0.05 Use Temperature: -67 to 392F (-55 to 2OOC) Room Temperature Cure: 1 wk. Working Life: 0.5 hr. Shelf Life (mos.): 6 Coverage (in2/lb): 1,300 Recommended Thickness (in.): 0.010 max. One-component. Cures at room temperature and moderate humjLdity. Highly conductive. No corrosive curing agents. 1085: Binder: primer for 1029 Mix Ratio (by wgt.): l-part Consistency: thin fluid Specific Gravity: 0.87iO.15 Use Temperature: -112 to 392F (-80 to 2OOC) Room Temperature Cure: 0.5 hr. Shelf Life (mos.): 6 Coverage (in2/lb): 14,400 Recommended Thickness (in.): 0.0002 max. Wipe on surface and let air dry 30-60 min. 1086: Binder: primer for 1030 Mix Ratio fbv wat.): 1-oart Consistency:&thin fluidSpecific Gravity: 0.78&0.10 Use Temperature: -112 to 392F (-80 to ZOOC) Room Temperature Cure: 0.5 hr. Shelf Life (mos.): 6 Coverage (in2/lb): 14,400 Recommended Thickness (in.): 0.0002 max. Wipe on surface and let air dry 30-60 min.


357

CHOMERICS, INC.: CHO-FLEX Conductive Coatings and Ink: CHO-FLEX materials are designed for EM1 shielding of flexible circuitry and composite structures, and for screenable applications such as membrane keyboards. One- and two-part urethane systems are available, as is a choice of pure silver or silver-nickel blend for silk-screening on flexible circuits. CHO-FLEX 602 is a two-part system designed as a room-temperature curable EM1 shielding coating for composite structure air-frame components. The polyester resin based.conductive PTF inks have been used extensively on membrane keyboards. 600: Binder: polyurethane Filler: Ag, Ni Consistency: Thixotropic paste Typical Density: 1.66 Maximum Surface Resistivity (ohm/sq): 0.1 Use Temperature: >225F (>107C) 601: Binder: polyurethane Filler: Ag Consistency: Thixotropic paste Typical Density: 1.67 Maximum Surface Resitivity (ohmlsq): 0.06 Use Temperature: >225F (>107C) 602: Binder: polyurethane Filler: Ag Consistency: Thixotropic paste Typical Density: 2.10 Maximum Surface Resistivity (ohm/sq): 0.06 Use Temperature: -65 to 2251 (-54 to 107C) 4430: Binder: polyester Filler: Ag Consistency: Thixotropic paste Typical Density: 3.80 Maximum Surface Resistivity (ohm/sq): 0.08 4432: Binder: polyester Filler: Ag, Sn Consistency: Thixotropic paste Typical Density: 3.80 Maximum Surface Ressitivity (ohm/sq): 0.25 Use Temperature: -65 to 185F (-54 to 85C)

358


COTRONICS CORP.: Hi Temp Conductive Adhesives: For Electronic and Industrial Applications: DURALCO Conductive Adhesives and Coatings combine unique high temp. resins and binders and electrically or thermally conductive pigments. Now applications requiring high conductivity at high temperatures can easily be satisfied with the DURALCO series. DURALCO Conductive Adhesives have withstood, in independent tests, over 1 year at 400F at room temp curing type 120, and over 6 months at 670F for type 124. Electrically Conductive: 118 Silver: Form: Paint Temperature Limit: 200F Volume Resistance: 0.01 Thermal Conductivity: 50 Viscosity - cps: 35 Cure Cycle @ R-T.: 1 Hr. Cure Cycle @ 200F: 5 Min. Components: 1 120 Silver: Form: Paste Temoerature Limit: 500F Volime Resistance: 0.002 Thermal Conductivity: 65 Viscosity - cps: 15;OOO Cure Cycle @ R-T.: 24 Hr. Cure Cycle @ 200F: 10 Min. Components: 2 122 Nickel: Form: Paste Temperature Limit: 500F Volume Resistance: 0.7 Thermal Conductivity: 15 Viscosity - cps: 25;OOO Cure Cycle @ R.T.: 24 Hr. Cure Cycle @ 200F: 10 Min. Components: 2 124 Silver: Form: Paste Temperature Limit: 700F Volume Resistance: 0.002 Thermal Conductivity: 65 Viscosity - cps: 20,000 Components: 2


359

COTRONICS CORP.: Hi Temp Conductive Adhesives: For Electronic and Industrial Applications (Continued): Thermally Conductive: 128 Ceramic: Form: Paste Temperature: 500F Volume Resistance: 10 15 Thermal Conductivity: 40 Viscosity - cps: 15,000 Cure Cycle 8 R.T.: 24 Hr. Cure Cycle @ 200F: 10 Min. Components: 2 132 Aluminum: Form: Paste Temperature Limit: 5OOF Volume Resistance: 10 6 Thermal Conductivitv: 60 Viscosity - cps: 22;OOO Cure Cycle @ R.T.: 24 Hr. Cure Cycle @ 200F: 10 Min. Components: 2 134 Ceramic: Form: Grease Temperature Limit: 500F Volume Resistance: 10 16 Thermal Conductivity: 50 Viscosity - cps: grease Components: 1 DURALCO 118, 120, 122 were developed to provide an electrically conductive adhesive for use to 500F with long term stability. Ultra HiTemp 700F Type 124 is now available. Hi-temp formulations, and easy to use - No mixing - single component (250F curing systems) are available on request. Thermally Conductive Bonders: DURALCO High Thermal Conductive Adhesives are based on COTRONICS unique high temperature epoxy resins and hardeners. DURALCO 132 has a metallic aluminum filler. DURALCO 128 has a high thermal conductive ceramic filler. DURALCO 134 is a nonhardening thermally conductive grease. These products provide a thermally conductive layer for bonding and dissipation of heat required in many electronic, electrical, instrumentation, heating, and cooling applications. Applications include bonding heating elements, cooling coils, semi conductors, heat sinks, solar cells, ceramic substitutes, etc. Now: Ultra High Temp. 700F formulations are available on request

360


DYMAX CORP.: DYMAX MULTI-CURE Thermally Conductive Adhesive 991: MULTI-CURE 991 is a filled, thermally conductive adhesive for mounting heat sinks and heat sensitive electronic components to boards or for use in any application where it is desirable to increase thermal conductivity between assembled parts. MULTI-CURE 991 may be cured by any one or a combination of different cure methods: Pre-application of Activator 535, UV light or with heat as low as 250F. Uncured Properties: Composition: Modified Urethane Co&: Off-white Viscosity: Thixotropic Paste Toxicity: Very Low Specific Gravity: 1.71 cured Properties: Tensile-Shear Strength: ner ASTM D-1002 (steel): 2,500 nsi Theimal Range: -65 to 35OF: Coefficient of Thermal Conductivity: 5-7 BTU-in/Hr-Ft-F Dielectric Strength: 1600 volt/milActivator 535: Fixture Time: 30-40 sec. UV Cure (between glass - 2 Mil Gap): 100 mw/cm: (365 nanometer W light): 5-10 sec. Heat Cure at 300F: IO-15 min. Alternative Curing Methods: - Activator 535 - UV Light - Heat Factors Affecting Curing: Dark surfaces mav lensthen W cure time. Heat from high intensity lamps shortens cure times. Full range UV-A, B & C lamps provide faster cures than filtered sources. All UV sources degrade with use. Check output with a radiometer. Thicker films require longer cures. Light intensity decreases as distance from W sources increases. Some clear plastics may contain W inhibitors. Thick bondlines require longer cures with activator.

Conductive Compoundr

ELECTRO-KINETIC

SYSTEMS,

INC.:

CONDUCT-X

361

Conductive Adhesives:

CONDUCT-X 5002: CONDUCT-X 5002 is a one-part, highly conductive epoxy copolymer containing pure copper filler. Its vsrsatility and stability suaaest its use as a reolacement for silver-filled systems in va;ious applications requiring high conductivity, including component termination bonding, RF shielding and printed circuit repair. Typical Properties: As Packaged: Shelf Life: Six months, under refrigeration Specific Gravity: 3.6 Curing Conditions: 20-60 minutes at 125C (260~) to 140C (285F) is preferred. Longer periods below 125C, down to a minimum of 85C (185F) are possible. Do not exceed 200C (390F) while curing. Fully Cured: Volume Resistivity: 0.00005-0.001 ohm-cm Tensile Strength: 5000 psi 180 Peel Strength: 3 to 10 lbs. per inch of width, depending upon substrate. Coefficient of Linear Thermal Expansion: 50 x 10 -6 cm/cm/C Thermal Conductivity: 50 BTU/hr/ft Z/F/in CONDUCT-X

5031:

Two-Part, Electrically Conductive, Copper-Filled Adhesive CONDUCT-X 5031 is a two part, highly conductive, epoxy containing pure copper filler. It adheres well to metals, plastics, and similar substrates, and in many applications serves as an excellent substitute for solder. CONDUCT-X 5031 may be cured at room temperature, which enhances its use in many applications where a high curing temperature cannot be tolerated; e.g., capacitor lead bonding, semiconductor chip bonding, and the like. Typical Properties: As Packaged: Shelf Life: One year, at room temperature Specific Gravity: 2 g/cc Curing Conditions: 45 min. @ 125C (260F) 1 hr. @ 1OOC (212F) 4 hrs. @ 50C (122F) 48 hrs. @ Room Temperature (75F) Pot Life (100 gm mass): 30 min.-l hr. (75F) Fully Cured: Volume Resistivitv: 0.0015 ohm-cm Tensile Strength:-5600 psi 180 Peel Strength: 4 to 12 lbs. per inch of width, depending upon substrate. Coefficient of Linear Thermal Expansion: 50x10 -6 cm/cm/C Thermal Conductivity: 25 BTU/hr./ft Z/F/in Maximum Operating Temperature: 150C (3OOF)

362


ELECTRO-KINETIC SYSTEMS, INC.: CONDUCT-X Conductive Adhesives (Continued): CONDUCT X-5003: Two-Part, Electrically Conductive, Copper-Filled Adhesive CONDUCT-X 5033 is a two-part, room temperature curing resin system with high electrical and thermal conductivity. It adheres well to metals, plastics and similar substrates, and, in many applications, serves as an excellent substitute for solder. The combinations of its high conductivity and low curing temperature suggests its use in many critical applications where a high curing temperature cannot be tolerated: e.g., in capacitor terminations; semiconductor chip bonding; and the like. The particle size of CONDUCT-X 5033 is sufficiently fine to enable its application by screen printing, or by spraying. Typical Properties: As Packaged: Shelf Life: Six months or more, under refrigeration Specific Gravity: 2.0 g/cc Curing Conditions: 16 to 24 hours at room temperature (70F) with less time required at higher temperatures. One hour at 140F (6OC) is suggested as a starting point. Catalyst must be thoroughly mixed before application. Note: CONDUCT-X 5033 can also be cured by application of electrical current in lieu of heat or room temperature curing by use of a special catalyst. Fully Cured: Volume Resistivity: 0.001 ohm-cm Tensile Strength: 4500 psi 180 Peel Strength: 2 to 7 lbs. per inch of width, depending upon substrate. Thermal Conductivity: ("K" Factor)-50 BTU/hr/ft a/F/in Coefficient of Linear Thermal Expansion: 50 x 10 -6 cm/cm/C


363

ELECTRO-KINETIC SYSTEMS, INC.: CONDUCT-X Conductive Adhesives (Continued): CONDUCT-X 4001: Two-part, room temperature curing, silver conductive epoxy system CONDUCT-X 4001 is a highly conductive, two-part, silverfilled epoxy system, which can be cured at room temperature. Its relative insensitivity to curing conditions, which allows it to cure at temperatures down to 40F, suggest.its use in field applications where a constant or reliable temperature source is not always available. Its high conductivity makes it ideal for such applications as printed circuit board repair, automotive backlite defogger repair, and delicate electronic circuit fabrication or repair. Typical Properties: As Mixed: Pot Life: 60-90 minutes at room temperature Solids: 100% Specific Gravity: 3.2 g/cc Curing Conditions: 24 hrs. at 70F. Allow longer times at lower temperatures (to 40F). Cure may be accelerated by heating (300F Max) Fully Cured: Volume Resistivity: 0.001 ohm-cm Thermal Conductivity: 48 BTU/hr/ft/F/in Maximum Service Temperature: 275F Chemical Resistance: Excellent to water, aliphatic solvents, alkalis and alcohols. Good to acids. CONDUCT-X 4003 Silver-Conductive Epoxy Adhesive: CONDUCT-X 4003 is a two-part, electrically conductive epoxy adhesive. Its excellent adhesion to smooth substrates such as glass, and its unusually long working life make it ideal for bonding problem surfaces. CONDUCT-X 4003 adheres well to metals, plastics, and ceramics, and in many applications serves as an excellent substitute for solder. It may be dispensed by such standard methods as trowelling, drawdown, syringe dispensing, etc., and is readily adapted to mechanized or automated systems. Typical Properties: As mixed: Pot Life: 24 hrs. at normal ambient temperatures Specific Gravity: 3.3 Curing Conditions: 1 hr. at 150C (300F) 2 hrs. at 12OC (255F) 3 hrs. at 75C (165F) Fully Cured: Volume Resistivity: 0.002 ohm-cm Tensile Strength: 3800 psi Peel Strength: 1.5 to 4.0 per inch of width, depending substrate. Coefficient of linear thermal expansion: 4.8x10 cm/cmC Thermal Conductivity: 50 BTU/hr/ft/F/in. Lap Shear Strength: 1000 psi (alumimum to aluminum)

364


ELECTRO-KINETIC SYSTEMS, INC.: CONDUCT-X Conductive Adhesives (Continued): CONDUCT-X 5001 Conductive Adhesive: CONDUCT-X 5001 is a one-part, highly conductive, epoxy copolymer containing pure copper filler. Its versatility and stability suggest its use as a replacement for silver-filled systems in various applications requiring high conductivity, particularly where superior long term temperature stability is required. Suggested applications include component termination and bonding, hybrid circuit chip bonding, electric warmers, and the like. Typical Properties: Shelf Life: One year at room temperature Specific Gravity: 3.3 Curing Conditions: 20 to 60 minutes at 18OC (355F) is optimal, but longer periods below 18OC, down to a minimum of 150C (300F) are possible ubder certain conditions. Do not exceed 200C (39OF) while curing. Fully Cured: Volume Resistivity: 0.0005-0.001 ohm-cm Tensile Strength: 5600 psi 180 Peel Strength: 4 to 12 lbs. per inch of width, depending upon substrate. Thermal Conductivity: 48 BTU/hr/ft Z/F/in Coefficient of Linear Thermal Expansion: 50x10 -6 cm/cm/C


365

ELECTRO-SCIENCE LABORATORIES, INC.: Conductive Adhesives and Coatings Silver Compositions: #1109, #1109-S, #1110-S, #2209/ Thermally Conducting, Electrically Insulating #1109-I For Use as Adhesive and for Chip Attachment: The 1109, 1109-S, 1110-S and 2209 adhesives are noble-metal filled thermosetting resin compounds, designed for use as electrical contacts, terminations and adhesives. #1109, Silver: Viscosity, CPS 26C: 40K - 1OOK Rheology_.One Component Thixotropic Paste Solids Content: 95% Minimum Pot Life: 3 months, replenish solvent losses Cure: 150C for 2-3 hours or 180-220C for 1-2 hours #1109-S, Silver Screen Printable: Viscosity, cps 26C: 125K - 175K Rheology: One Component Thixotropic Paste Solids Content: 85% Minimum Pot Life: 6 months Cure: 150C for 2-3 hours or 180-220C for l-2 hours #1110-S, Silver Screen Printable: Viscosity, cps 26C: 125K - 175K Rheology: One Component Thixotropic Paste Solids Content: 87% minimum Pot Life: 6 months Cure: 150C for 2-3 hours or 18OC-220C for 1-2 hours #2209, Silver: Viscosity, cps 26C: Parts A and B 28~ - 65 K Adjust as needed Rheology: Two Components Both A & B are viscous pastes Solids Content: 95% Minimum Pot Life: 2 to 3 hours Cure: 16 hrs at 75C or 5 hrs at 1OOC or 2 hrs at 15OC #1109-l Mineral-Filled Insulator Screen Printable: Viscosity, cps 26C: 300K - 350K Rheology: One Component Thixotropic Paste Solids Content: 80% Minimum Pot Life: 6 months Cure: 150C for 2-3 hours or 18OC-220C for 1-2 hours

366


ELECTRO-SCIENCE LABORATORIES, INC.: ESL #1107-S Conductive Polymer:

Silver-Filled

A smooth surface, phenolic base, Ag filled thermosetting conductive composition. Especially good where surface smoothness is essential. Metallic Phase: Ag Viscosity, Brookfield: 80+-20 Pa.s Substrate for Calibration: FR-4 Processing: A. Screen mesh/emulsion: 200 or 325 mesh/ 25 microns B. Level @ room temperature: 5-10 minutes C. Drying, ventilated box oven @ 125C: lo-15 minutes D. Firing (curing): 1) Ventilated box oven @ 15OC: 2 hrs. 2) YEfrared furnace @ 220C peak: 3-4 minutes at peak Resistivity: Measured from 10,000 sq. micron line 25 microns thick: max. 40 milliohm Thinner: ESL #402 Coverage: 15 microns thickness: 150 cm 2/gm Print Speed: 20 inchesfsec. max. Nickel Plating: ESL Ni-Clad-10 System Compatibility: Resistor: ESL #15100 Resistor Series Dielectric: ESL #1109-l ESL #240-SB and other ESL polymer materials Shelf Life: 0-5C refrigeration necessary: 6 months


367

ELECTRO-SCIENCE LABORATORIES, INC.: #1900 Silver-filled Solventless Epoxy/#1000 Insulative Epoxy/#610 Reactive Vehicle Thinner: ESL #1900 is a silver filled, medium viscosity, one part, solventless conductive epoxy adhesive. ESL #lOOO is a mineral filled, medium viscosity, one part, solventless insulative epoxy. It is intended for use in mounting and sealing applications where electrical conductivity is not required. #1900: Rheology, Brookfield: Thixotropic Paste IOOK +- 25 Color: Silver Service Temperature, Continuous Duty: 150C (cure 50C above max. expected service temp. for hermetic package sealing uses) Intermittent Duty: Up to 350C for short periods during TC wire bonding or package sealing operations. Shelf Life: 3-6 months under freezing or refrigeration Alternate Cure Cycles: 125C, 2 hours 15OC, 60-120 minutes lSOC, 30-60 minutes Volume Resistivity, ohm-cm: 0.0005-0.001 Sheet Resistivity, ohm per square, 25 microns thick: 0.03-0.10 Recommended Cured Thickness, microns: 20-40 Adhesion: Silicon Chip Bonding: Excellent; Chips cannot be removed without fracturing. Lab shear, Cu to Cu, kg. per sq. cm.: 70-140 lbs. per sq. in.: 1000-2000 #lOOO: Rheology, Brookfield: Thixotropic Paste 75K +-20 Color: Tan Continuous Duty: 150C (cure 50C above max. expected service temp. for hermetic package sealing uses) Intermittent Duty: up to 350C for short periods during TC wire bonding or package sealing operations. Alternate Cure Cycles: 125C, 2 hours 15OC, 30-60 minutes 1SOC. 15-30 minutes Volume Resistivity, ohm-cm:'Insulator Sheet Resistivity, ohm per square, 25 microns thick: Insulator Recommended Cured Thickness,-microns: 20-40 Adhesion: Silicon Chip Bonding: Excellent; Chips cannot be removed without fracturing. Lab shear, Cu to Cu: kg. per sq. cm.: 70-140 lbs. per sq. in.: 1000-2000

368


Electrically Conductive Epoxies TECHNOLOGY INC.: EPO-TEK Microelectronic Grade: Silver Filled Elevated Temp. Cure:

EPOXY

H20E: No. of Components: Two Shore D Hardness: 79 Cure Temperature: 175C-1 min. 15OC-5 min. Volume Resistivity (ohm-cm): 0.0001 to 0.0004 Thermal Conductivity (BTU in/ft 2 hrF): 11.5 approx. Tg 15OC/l hr Cure: 85C Max. Oper. Temp. Continuous C: 125 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 1500 Viscositv B 25C cos: 25.000-35.000 TGA Degradation Temp.: 425C . CTE Below Tg/Above Tg (in/in/C): 43 x 10 -6/150 x 10 -6 Pot Life (@-Room Temp.): 3-4 Days Shelf Life (0 Room Temp.): 1 yr. H20E-175: No. of Components: Two Shore D Hardness: 81 Cure Temperature (Typical): 15OC-1 hr. laoc-1 hr. Volume Resistivity (ohm-cm): 0.0001 to 0.0004 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 approx. Tg 15OC/l hr Cure: 16OC lSOc/lSOc/cure Max. Oper. Temp. Continuous C: 175 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 1500 400

@ 2ooc

Viscositv B 25C CDS: 25.000-35.000 TGA Degradation Temp.: h25C . CTE Below Tg/Above Tg (in/in/C): 43 x 10 -6/175 x 10 -6 Pot Life (@-Room Temp.): 3-4 days Shelf Life (0 Room Temp.): 1 yr.


369

EPOXY TECHNOLOGY INC.: EPO-TEK Electrically Conductive Epoxies Microelectronic Grade: Silver Filled Elevated Temp. Cure (Continued): H20F: No. of Components: Two Shore D Hardness: (50 Cure Temperature: 15OC-10 min. IOOC-60 min. Volume Resistivity (ohm-cm): 0.0002-0.0004 Thermal Conductivity (BTU in/ft 2 hrF): 10.0 Tg (Typical) 15OC/l hr Cure: Sub-Ambient Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength psi @ RT: N/A Viscosity @ 25C cps: 20,000 TGA Degradation Temp.: 400C Pot Life (8 Room Temp.): 3-4 days Shelf Life (8 Room Temp.): 1 yr. H20S: No. of Components: Two Shore D Hardness: 75 Cure Temperature: 15OC-5 min. IOOC-90 min. Volume Resistivity (ohm-cm): 0.0001-0.0005 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tg 15OC/l hr Cure: 80C Max. Oper. Temp. Continuous C: 150 Max. ODer. TemD. Intermittent C: 300 Lap Shear Strength psi @ RT: 1500 Viscosity @ 25C cps: 15,000-20,000 TGA Degradation Temp.: 425C CTE Below Tg/Above Tg (in/in/C): 75 x 10 -6/170 x 10 -6 Pot Life (@ Room Temp.): 3-4 days Shelf Life (@ Room Temp.): 1 yr. H31: No. of Components: One Shore D Hardness: 80 Cure Temperature: 15OC-30 min. 12OC-60 min. Volume Resistivity (ohm-cm): 0.0001-0.0005 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tq 15OC/l hr Cure: 80C Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent: 300-400 Lap Shear Strength psi @ RT: 1000 Viscosity @ 25C cps: 45,000-50,000 TGA Degradation Temp.: 400C CTE Below Tg/Above Tg (in/in/C): 61 x 10 -61152 x 10 -6 Shelf Life (8 Room Temp.): 6 mo.

370


EPOXY TECHNOLOGY INC.: EPO-TEK Electrically Conductive Epoxies - Microelectronic Grade: Silver Filled Elevated Temp. Cure (Continued): H31D: NO. of Components: One Shore D Hardness: 65 Cure Temperature: ISOC-30 min. 12OC-1 hr. Volume Resistivity (ohm-cm): 0.0001 to 0.0005 Thermal Conductivity (BTU in/ft 2 hrF): 11.5 Tg 15OC/l hr Cure: 95C Max. Oper. Temp. Continuous C: 150 Max. ODer. TenID. Intermittent C: 300-350 Lap Shear Strength psi @ RT: 1000 Viscosity 8 25C cps: 120,000-150,000 TGA Degradation Temp.: 400C CTE Below Tg/Above Tg (in/in/C): 41 x 10 -6/140 x 10 -6 Shelf Life (8 Room Temp.): 6 mo. H35-175MP: MIL-STD 883, 5011 No. of Components: One Shore D Hardness: 80 Cure Temperature: 18OC-1 hr. 165C-1.5 hr. Volume Resistivity (ohm-cm): 0.00007-0.0003 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tg 15OC/l hr Cure: 8OC 180C/l80C/cure Max. Oper. Temp. Continuous C: 175 Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength psi @ RT: 2000 450 @ 2ooc Viscosity 8 25C cps: 45,000 TGA Degradation Temp.: 350C CTE Below Tg/Above Tg (in/in/C): 40 x 10 -6/165 x 10 -6 Shelf Life (@ Room Temp.): >6 mo.

Conductive

Compounds

371

EPOXY TECHNOLOGY INC.: EPO-TEK Electrically Conductive Epoxies Microelectronic Grade: Silver Filled Room Temp. Cure: 410E: No. of Components: Two Shore D Hardness: 70 Cure Temperature: RT-2-3 days 15OC-30 min. Volume Resistivitv (ohm-cm): 0.0001-0.0005 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tg 15OC/l hr Cure: 75C Max. Oper. Temp. Continuous: C: 150-heat cure 125-RT cure Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength psi @ RT: 1000 150 @ 2ooc Viscosity @ 25C cps: 25,000 TGA Degradation Temp.: 380C CTE Below Tg/Above Tg (in/in/C): 59 x 10 -6/179 x 10 -6 Pot Life (@ Room Temp.): 8 hrs. Shelf Life (@ Room Temp.): 1 yr. 41oLv: No. of Components: Two Shore D Hardness: 60 Cure Temperature: RT-2-3 days 15OC-30 min. Volume Resistivitv (ohm-cm): 0.001 to 0.003 Thermal Conductivity (BTU in/ft 2 hrF): 6.0 Tg 15OC/l hr Cure: 70C Max. Oper. Temp. Continous C: 150-heat cure 125-RT cure Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength psi @ RT: 1000 Viscosity @ 25C cps: 15,000 TGA Degradation Temp.: 380C CTE Below Tg/Above Tg (in/in/C): 61 x 10 -6/180 x 10 -6 Pot Life (@ Room Temp.): 8 hrs. Shelf Life (@ Room Temp.): 6 mo.

372


EPOXY TECHNOLOGY INC.: EPO-TEK Electrically Conductive Epoxies Microelectronic Grade: Silver Filled Room Temp. Cure (Continued): 415G: No. of Components: Two Shore D Hardness: 70 Cure Temuerature: 3 hr. R RT Tack Free Volume Resistivity (ohm-cm): 24 hr. Rt cure: 0.0007 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tg lSOC/l hr Cure: 54C Max. Oper. Temp. Continuous C: 150-Heat cure 125-RT cure Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength psi @ RT: 1000 Viscosity @ 25C cps: >200,000 TGA Degradation Temp.: 350C CTE Below Tg/Above Tg (in/in/C): 60 x 10 -6/190 x 10 -6 Pot Life (a Room Temp.): 30 min. Shelf Life (@ Room Temp.): 6 mo. Gold Filled Elevated Temp. Cure: H43: No. of Components: One Shore D Hardness: 85 Cure Temperature: 15OC-1 hr. Volume Resistivity (ohm-cm): 0.0001 to 0.0005 Thermal Conductivity (BTU in/ft 2 hrF): 12.0 Tg 15OC/l hr Cure: 85C Max. Oper. Temp. Continuous C: 125 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 2000 Viscosity @ 25C cps: >200,000 TGA Degradation Temp.: 400C CTE Below Tg/Above Tg (in/in/C): 35 x 10 -61120 x 10 -6 Shelf Life (@ Room Temp.): 6 mo.


373

EPOXY TECHNOLOGY INC.: EPO-TEK Electically Conductive Epoxies Microelectronic Grade: Gold Filled Elevated Temp. Cure (Continued): H44: No. of Components: One Shore D Hardness: 86 Cure TemDeratUre: 15OC-1 hr. Volume Resistivity (ohm-cm): 0.0001 to 0.0005 Thermal Conductivity (BTU injft 2 hrF): 12.0 Tu 15OC/l hr Cure: 85C Max. Oper. Temp. Continuous C: 125 Max. Oper. Temp. Intermittent C: 300-350 Lap Shear Strength psi @ RT: 2000 Viscosity @ 25C cps: >200,000 TGA Degradation Temp.: 400C CTE Below Tg/Above Tg (in/in/C): 32 x 10 -6/125 x 10 -6 Shelf Life (8 Room Temp.): 6 mo. H81E: No. of Components: Two Shore D Hardness: A80 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 0.0004 to 0.0008 Thermal Conductivity (BTU in/ft 2 hrF): 11.0 Tg 15OC/l hr Cure: 1OOC Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 1300 Viscositv B 25C CDS: >200.000 TGA Degradation Temp.: 4lUC CTE Below Tg/Above Tg (in/in/C): 45 x 10 -6/140 x 10 -6 Pot Life (@-Room Temp.): 3 day Shelf Life (a Room Temp.): 1 yr.

374


Electrically Conductive Epoxies TECHNOLOGY INC.: EPO-TEK Microelectronic Grade: Pd:Ag Filled Elevated Temp. Cure:

EPOXY

H32C: (Black Opaque) No. of Components: One Shore D Hardness: 80 Cure Temperature: 15OC-30 min. Volume Resistivitv (ohm-cm): 0.002 to 0.004 Thermal Conductivity (BTU in/ft 2 hrF): 14.7 Tq 15OC/l hr Cure: 9OC Mix. ODer. TemD. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 2000 Viscosity @ 25C cps: 150,000 TGA Degradation Temp.: 400C CTE Below Tg/Above TG (in/in/C): 50 x 10 -6/135 x 10 -6 Shelf Life (8 Room Temp.): 6 mo. H32E: (Black Opaque) No. of Components: Two Shore D Hardness: 75 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 0.001 to 0.003 Thermal Conductivity (BTU in/ft 2 hrF): 12.0 Tg 15OC/l hr Cure: 55C Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength psi @ RT: 1500 Viscositv (a 25C CDS: 250.000 TGA Degradation Temp.: 4iOC CTE Below Tq/Above Tq (in/in/C): 45 x 10 -6/155 x 10 -6 Pot Life (@-Room Temp.): 2 days Shelf Life (@ Room Temp.): 1 yr.

Conductive

Compounds

EPOXY TECHNOLOGY INC.: EPO-TEK Epoxies Thermally Conductive/ Electrically Insulating - Microelectronic Grade: Alumina Filled Elevated Temp. Cure: H7OE: No. of Components: 2 Shore D Hardness: 88 Cure Temperature: ISOC-5 min. Volume Resistivity (ohm-cm): 1.5 x 10 13 Thermal Conductivity (BTU in/ft 2 hrF): 10.0 Tg lSOC/l hr Cure: 85C Max. Oper. Temp. Continuous C: 150 Max. Ooer. Temo. Intermittent C: 300-400 Lap Shiar Strength (psi): 1200 Viscosity @ 25C CPS: 20,000 TGA (Degradation Temp.)i 410C CTE Below Tg/Above Tg (in/in/C): 52 x 10 -6/175 x 10 -2 Pot Life @ Room Temp.: 4 days Shelf Life @ Room Temp.: 1 yr. H70E-2: No. of Components: 2 Shore D Hardness: 75 Cure Temperature: 15OC-5 min. Volume Resistivitv (ohm-cm): 1.0 x 10 14 Thermal Conductivity (BTU in/ft 2 hrF): 10.0 Tq 15OC/l hr Cure: 8OC Max. Oner. TemD. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength (psi): 1300 Viscosity @ 25C cps: 30,000 TGA (Degradation Temp.): 425C CTE Below Tg/Above Tg (in/in/C): 46 x 10 -6/170 x 10 -6 Pot Life @ Room Temp.: 4 days Shelf Life @ Room Temp.: 1 yr. H70E-4: No. of Components: 2 Shore D Hardness: 80 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 1.0 x 10 14 Thermal Conductivity (BTU in/ft 2 hrF): 10.0 Tg 15OC/l hr Cure: 70C Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 1150 Viscosity @ 25C cps: 115,000 TGA (Degradation Temp.): 415C CTE Below Tg/Above Tg (in/in/C): 55 x 10 -6/185 x 10 -6 Pot Life @ Room Temp.: 4 days Shelf Life @ Room Temp.: 1 yr.

375

376


EPOXY TECHNOLOGY INC.: EPO-TEK Epoxies Thermally Conductive/ Electrically Insulating - Microelectronic Grade (Continued): H70S: No. of Components: 2 Shore D Hardness: 85 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 1.5 x 10 13 Thermal Conductivity (BTU in/ft 2 hrF): 8.0 To 15OC/l hr Cure: 85C Max. Oper. Temp. Continuous C: 150 Max. Ooer. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 1200 Viscosity 8 25C cps: 15,000 TGA (Degradation Temp.): 410C CTE Below Tg/Above Tg (in/in/C): 50 x IO -6/170 x IO -6 Pot Life @ Room Temp.: 4 days Shelf Life 8 Room Temp.: 1 yr. H72: No. of Components: 2 Shore D Hardness: 81 Cure Temperature: 15OC-10 min. Volume Resistivity (ohm-cm): 2.5 x 10 15 Thermal Conductivity (BTU in/ft 2 hrF): 6.0 Tg 15OC/l hr Cure: 125C Max. Oper. Temp. Continuous C: 150 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 2500 Viscosity @ 25C cps: 40,000-60,000 TGA (Degradation Temp.): 420C CTE Below Tg/Above Tg (in/in/C): 42 x 10 -6/110 x 10 -6 Pot Life @ Room Temp.: 4 hrs. Shelf Life @ Room Temp.: 1 yr. H74: No. of Components: 2 Shore D Hardness: 94 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 2.5 x 10 15 Thermal Conductivity (BTU in/ft 2 hrF): 7.6 Tg 15OC/l hr Cure: 125C Max. Oper. Temp. Continuous C: 150 Max. Ooer. Temo. Intermittent C: 300-400 Lap Shear Strength (psi): 2500 Viscosity 8 25C cps: 70,000-100,000 TGA (Degradation Temp.); 400C CTE Below Tg/Above Tg (in/in/C): 30 x 10 -6/110 x 10 -6 Pot Life @ Room Temp.: 4 hrs. Shelf Life @ Room Temp.: 1 yr.


377

EPOXY TECHNOLOGY INC.: EPO-TEK Epoxies Thermally Conductive/ Electrically Insulating - Microelectronic Grade (Continued): Alumina Filled Elevated Temp. Cure (Continued): H77: No. of Components: 2 Shore D Hardness: 92 Cure Temperature: 15OC-30 min. Volume Resistivity (ohm-cm): 1 x 10 16 Thermal Conductivity (BTU in/ft 2 hrF): 6.0 Ts 15OC/l hr Cure: 95C Max. Oper. Temp. Continuous C: 200 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 2700 Viscositv (a 25C CDS: 15,000 TGA (De$adation ;femp.)I 430C CTE Below Tg/Above Tg (in/in/C)): 29.5 x 10 -6/100 x 10 -6 Pot Life @ Room Temp.: 24 hrs. Shelf Life @ Room Temp.: 1 yr. H61: No. of Components: 1 Shore D Hardness: 76 Cure Temnerature: 15OC-30 min. Volume Rkistivity (ohm-cm): 1 x 10 14 Thermal Conductivity (BTU in/ft 2 hrF): 7.0 Tg 15OC/l hr Cure: 35C Max. Oper. Temp. Continuous C: 160 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 1000 Viscosity @ 25C cps: 70,000 TGA (Degradation Temp.): 400C CTE Below Tg/Above Tg (in/in/C): 79 x 10 -6/171 x 10 -6 Shelf Life @ Room Temp.: 6 mo. H62: No. of Components: 1 Shore D Hardness: 76 Cure Temnerature: 15OC-30 min. Volume Resistivity (ohm-cm): 1 x 10 14 Thermal Conductivity (BTU in/ft 2 hrF): 7.0 Tg 15OC/l hr Cure: 7OC Max. Oper. Temp. Continuous C: 160 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 1000 Viscosity @ 25C cps: 30,000 TGA (Degradation Temp.): 400C CTE Below Tg/Above Tg (in/in/C): 50 x 10 -6/140 x 10 -6 Shelf Life @ Room Temp.: 6 mo.

378


EPOXY TECHNOLOGY INC.: EPO-TEK Epoxies Thermally Conductive/ Electrically Insulating-Microelectronic Grade (Continued): Alumina Filled Elevated Temp. Cure (Continued): H65-175MP: MIL-STD 883C, 5011 No. of Components: 1 Shore D Hardness: 85 Cure Temperature: 18OC-1 hr. Volume Resistivity (ohm-cm): 1 x 10 13 Thermal Conductivity (BTU in/ft 2 hrF): 10.0 Tg 15OC/l hr Cure: 9OC/155C Max. Oper. Temp. Continuous C: 175 Max. Oper. Temp. Intermittent C: 300 Lap Shear Strength (psi): 2000 Viscosity @ 25C cps: 50,000 CTE Below Tg/Above Tg (in/in/C): 55 x 10 -6/165 x 10 -6 Shelf Life @ Room Temp.: 6 mo. Insulating Elevated Temperature Cure: H54: No. of Comnonents: 2 Shore D Hardness: 70 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 5.0 x 10 15 Tg 15OC/l hr Cure: 9OC Max. Oper. Temp. Continuous C: 125 Max. Oper. Temp. Intermittent C: 300-400 Lap Shear Strength (psi): 2000 Viscosity @ 25C cps: 160,000 TGA (Degradation Temp.): 410C CTE Below Tg/Above Tg (in/in/C): 45 x 10 -6/145 x 10 -6 Pot Life @ Room Temp.: 4 hrs. Shelf Life @ Room Temp.: 1 yr. H55: No. of Components: 2 Shore D Hardness: 70 Cure Temperature: 15OC-5 min. Volume Resistivity (ohm-cm): 3.0 x 10 15 Ta 15OC/l hr Cure: 9OC Max. Oper. Temp. Continuous C: 125 Max. Oper. Temp. Intermittent C: 200-300 Lap Shear Strength (psi): 3000 Viscosity @ 25C cps: 250,000 TGA (Degradation Temp.): 410C CTE Below Tg/Above TG (in/in/C): 40 x 10 -6/135 x 10 -6 Pot Life @ Room Temp.: 4 hrs. Shelf Life @ Room Temp.: 1 yr.


FURANE

PRODUCTS:

379

EPIBOND Electrically Conductive Epoxy Adhesives:

EPIBOND 7002M: Features/Benefits: * Low bleed out, increased productivity capability * Meets MIL-STD-883C Method 5011 requirements * 100% solids system, very low outgassing * Extremely hish ouritv, low corrosion tendency * Less than 5 ppm‘each-of Na, K, NH4, Fe, Cl, Br * Designed for stamping/pin transfer applications (other grades available) EPIBOND 7002-50M: Features/Benefits: * Low bleed out, increased productivity capability * Meets MIL-STD-883C, Method 5011 requirements * Extremely high purity, very low corrosion tendency * Less than 10 ppm each of Na, K, NH4, Fe, Cl, Br * 100% solids/low outgassing * Designed for syringe dispensing (other grades available) EPIBOND 7002-100M: Features/Benefits: * Low bleed out, increased productivity capability * Meets MIL-STD-883C Method 5011 requirements * Extremely high purity, low corrosion tendency * Less than 10 ppm each of Na, K, NH4, Fe, Cl, Br * 100% solids system, very low outgassing * Designed for screen printing applications (other grades available) FLEXBOND 7007-50M: Features/Benefits: Low bleed out, increased productivity capability Gold filled High purity, low corrosion tendency Less than 15 ppm each of Na, K, NH4, Fe, Cl, Br 100% solids, low outgassing Viscosity can be factory adjusted for alternative application techniques EPIBOND 7015: Features/Benefits: * High purity * Long pot and shelf life * Silver filled * 100% solids * Viscosity can be factory adjusted for alternative application techniques

380


FURANE PRODUCTS: URALANE Thermal Transfer Adhesives: URALANE 7760: Features/Benefits: * Excellent thermal shock resistance giving improved reliability * High purity and very low outgassing (meets NASA requirements) * Easily reworkable * Excellent hydrolytic stability * High thixotropylnon slump capability offering excellent process control * Good thermal conductivity * Automatically dispensible offering reduced handling and improved production output URALANE 7762: Features/Benefits: Excellent thermal shock resistance giving improved reliability High purity and very low outgassing (meets NASA requirements) Easily reworkable Excellent hydrolytic stability High thixotropyfnon slump capability offering excellent process control Good thermal conductivity Controlled bondline thickness (5 mil) Automatically dispensible offering reduced handling and improved production output URALANE 7764: Features/Benefits: Excellent thermal shock resistance giving improved reliability High purity and very low outgassing (meets NASA requirements) Easily reworkable Excellent hydrolytic stability High thixotropy/non slump capability offering excellent process control in robotic and automatic dispense equipment Good thermal conductivity Excellent resistance to fungal growth


381

FURANE PRODUCTS: URALANE Thermal Transfer Adhesives (Continued): URALANE 7765: Features/Benefits: Excellent thermal shock resistance giving improved reliabilitv High purity Non-foaming, low outgassing (meets NASA requirements) Reduced iunction temperature of bonded devices Easily reworkable High surface tension which facilitates flow under components Resistant to l,l,l - trichloroethane and trichlorotrifluoroethane Excellent hydrolytic stability URALANE 7766: Features/Benefits: * Low dielectric constant * High thixotropy/non slump capability * Easily reworked * Excellent thermal shock resistance * High purity and very low outgassing * Good thermal conductivity * Resistant to PWB cleaning solvents URALANE 7768: Features/Benefits: Excellent thermal shock resistance giving improved reliability High purity Non-foaming, low outgassing (meets NASA requirements) Reduced junction temperature of bonded devices Easily reworkable High surface tension which facilitates flow under components Resistant to l,l,l - trichloroethane and trichlorotrifluoroethane Excellent hydrolytic stability

382


KEY POLYMER CORP.: Epoxy Products: Conductive Adhesives: C4-208A/B: Two component, 100% solids, silver filled epoxy adhesive Type: Silver, two part, room temp. cure Cure Schedule: 24 hrs. @ 25C, or 2 hrs. @ 65C, or 1 hr. @ 1ooc Consistency: Low Viscosity Paste Specific Gravity: 2.80 Storage Informnation: Store @ room temp. up to 1 year in sealed containers Comments: Volume resistivity: 0.001 ohm-cm. High strength. Good heat resistance. C4-214: One component silver filled epoxy adhesive Type: Silver, one part, heat cure Cure Schedule: 5 min. @ 18OC, or 15 min. @ IOOC, or 90 min. @ 125C Consistency: Viscous Paste Specific Gravity: 3.34 Storage Information: Store @ 0 for up to 6 months in sealed container Comments: Lower cost. Recommended when premium conductivity is not required. Good chemical resistance. Excellent adhesion. C6-234A/B: Silver Filled Sprayable Adhesive Type: Silver, two part, room temp. cure Cure Schedule: 24 hrs. @ 25C, or 1 hr. @ 65C Consistency: Sprayable Liquid Specific Gravity: 1.70 Storage Information: Store @ room temp. up to 6 months in sealed containers Comments: Volume Resistivity: 0.005 ohm-cm. Contains solvent EA1017: One component, silver filled, die attach adhesive Type: Silver, one part, heat cure Cure Schedule: 1 hr. @ 15OC. or l/2 hr. @ 175C Consistency: Thixotropic Paste Specific Gravity: 2.50 Storage Information: Store @ OC up to 6 months in sealed containers Comments: Low levels of extractable ionic impurities. Volume resitivity: 0.0001 ohm-cm


383

MAGNOLIA PLASTICS, INC.: Conductive Adhesives: MAGNOLIA 3870: Compound 3870 is a two part electrically conductive adhesive formulated to meet the requirements of MPD-9148B. Special Features: This unique, silver-filled, epoxy was formulated to give better tensile strength and lower resistance values than other traditional silver-filled systems. Properties: Color: A: Tan B: Amber Mix: Tan Viscosity: A: Paste B: Fluid Mix: Semi-Paste Specific Gravity: A: 1.7 B: 1.0 Mix: 1.6 SPI Classification: A: 4 Mix Ratio: Parts by ziiiht: 100/4 Cure Schedule: 24 hours at room temperature Pot Life: 60 minutes MAGNOBOND 8000: MAGNOBOND 8000 is a two part electrically conductive epoxy adhesive system. Special Features: 1. High silver loading assures high conductivity. 2. Low viscosity. Despite its high percentage of silver, 8000 has a smooth, fluid consistency for ease of application. Properties: Mix Ratio: 100 Parts by weight "A" 3 Parts by weight "B" Pot Life, 1OOcc at 25C: 30 minutes Flash Point: Part A: >lOOC Part B: >lOOC ANSI Classification: Part A: 4 Part B: 4 Silver Content, per cent: 80 Lap Shear Strength, psi, 23C: 1500 Cure Schedule: 1 to 2 davs at 25C or 1 to 2 hours at 7OC-9OC Volume Resistivity, ohm-cm, 25C: 4.32 x 10 -4 Volume Resistivity, ohm-cm, Condition 72 hours at 1OOC: 1.47 x 10 -4

384

Adhesives, Sealants and Coatings for the Electronics Industv

MAGNOLIA PLASTICS, INC.: Conductive Adhesives (Continued): MAGNOBOND 8001: MAGNOBOND 8001 is a single component silver-filled epoxy for chip bonding. Special Features: 1. This system will "B Stage" through solvent evaporation to form a solid adhesive casting for bonding at a later time. 2. 8001 has outstanding high purity characteristics. 3. The high electrical conductivity of 8001 remains essentially unchanged even after 200 hours at ZOOC. Special Note: Compound 8001 has excellent reflow properties from "B" stage and once cured has outstanding high temperature strength. In order to get the best hot strength it is important that the solvent be evaporated prior to bonding. Wet film thickness should be controlled to .005-.008 cm and "B" stage should be 30 minutes at 65C. This schedule gets the solvent out without advancing the resin to the point of poor reflow. Properties: Cure Schedule: "B Staqe" for 30 minutes at 65C. Cure - 15 to 30 seconds at 230C for, high soeed nroduction or 1 to 2 hours at 125-i5OC: . Volume Resistivity, ohm-cm: 9.7 x 10 -4 % Solids: 85 % Silver-Dry Film: 70 MAGNOBOND 8002: MAGNOBOND 8002 is a conductive epoxy adhesive system designed for applications requiring low ionic contamination and high electrical conductivity. Special Features: 1. This product is based upon 100% reactive epoxy resins and contains no solvents. 2. Compound 8002 is made from high epoxy resins __ purity___ and-silver flakes. 3. Low viscosity. Despite the high silver content, 8002 is very fluid. 4. Cure temperatures as low as 125C have been used where excessive heat can damage sensitive components. Properties: Cure Schedule: 1 to 2 hours at 125-175C Specific Gravity: 4.0 Viscosity: 35,000 cps Silver Content: 70% Volume Resistivity, ohm-cm: 1.0 x 10 -3 Weight Loss, %, 168 hours 8 180C: 0.07 1000 hours @ 180C: .28 Lap Strength, psi, ASTM D 1002, 23C: 2000


385

MAGNOLIA PLASTICS, INC.: Conductive Adhesives (Continued): MAGNOBOND 8003: MAGNOBOND 8003 is a single component epoxy adhesive system designed to have a high degree of electrical conductivity, outstanding thermal resistance and low levels of ionic contamination. Special Features: 1. Low ionic concentration. Each batch is checked using an ion chromatograph. 2. High Tg. MAGNOBOND 8003 is made from highly purified, temperature resistant epoxy resins and curing agents. Weight loss values are low even after 1000 hours at 18OC. 3. 100% Reactive. There is no solvent to evaporate from dispensing tanks and, therefore, no viscosity drift during application. With no volatiles released during cure, void density in the cured film is low. Properties of Uncured Material: Specific Gravity: 3.3 Viscosity at 23C: 80,000 cps SPI Classification: 2 Flash Point: >lOOC Suggested Cure Schedule: 1 to 3 hours at 15OC to 200C Properties of Cured Material: Volume Resistivity: 1.8 x 10 -4 ohms-cm Shear Strength, psi, ASTM D1002, 23C: 1900 Wt. Loss, Percent, ASTM D794: After 168 hours at 18OC: -0.24 After 1000 hours at 18OC: -0.59 MAGNOBOND 8004: MAGNOBOND 8004 is a two part epoxy adhesive designed to have a high degree of electrical conductivity. Special Features: 1. Adhesive strength exceeds 2000 psi with only a 24 hour room temperature cure. 2. Pot Life >4 hours at 25C 3. Volume Resistivity of 3.0 x 10 -3 ohm-cm Properties: Mix Ratio: 100 parts by weight "A" 92 parts by weight "B" Cure Schedule: 1 hour at 125C-175C or 24 hours at 23C Pot Life - 100 cc at 25C: >4 hours ANSI Classification: 4 Volume Resistivity, ohm-cm: 3.0 x IO -3 Lap Shear Strength, psi, ASTM D-1002, Cured 24 hours at 23C: 2100

386


MAGNOLIA PLASTICS, INC.: Conductive Adhesives (Continued): MAGNOLIA 8005: MAGNOLIA 8005, A and epoxy adhesive designed and good adhesion. This lined in Drawing Number

B is a two part 100% silver filled to have high electrical conductivity material meets the requirements outA3049246.

Properties: Mix Ratio: 100 parts by weight A to 57 parts by weight B Cure Schedule: 24 hours at 75F or 30 minutes at 210F Viscosity @ 77F: A: Compound - Paste B: Curing Agent - Paste Mix - Paste SPI Classification: A: 4 B: 4


387

MAVIDON CORP.: Adhesives: 1135 Heat Sink Adhesive: MAVIDON system 1135 is a two component, thermally conductive heat sink adhesive specifically formulated for the semi conductor industry. 1135 offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. Physical Characteristics: 1135 A: Appearance: Black Paste Specific Gravity: 2.28 Shelf Life: 1 year Viscosity @ 25C (77F): 700,000 cps 1135 B: Appearance: Amber Liquid Specific Gravity: 1.0 Shelf Life: 1 year Viscosity @ 25C (77F): 30 cps Mix Ratio: By weight: 100 parts 1135A to 7.5 parts of 1135B Cure Schedule: 24 hrs at room temperature or 2 hours at 60C (14OF) rpical Cured Characteristics: Thermal Coefficient of Expansion: 22 x 10 -6 in/in/C Tensile Strength: 8,500 psi Heat Distortion Temperature: 55C Linear Shrinkage (in/in): .0015 Hardness: 75 Shore D Volume Resistivity: 1 x 10 16 ohm-cm Dielectric Strength: 425 volts/mil Thermal Conductivity: 10 (BTU/Ft Z/hr/F/in) 1216 A/B Flameout Adhesive: MAVIDON system 1216 A/B is a dark grey, thixotropic, two component adhesive that cures at room temperature and will not sag or flow during cure. Cured 1216 meets the flame retardant properties of UL94VO.

388

Adhesives,

Sealants


Industry

MAVIDON CORP.: Electrically Conductive Products: C 368-l Conductive Adhesive: MAVIDON C 368-l A/B is a two component, carbon/silver filled room temperature curing epoxy adhesive. 368-l features improved electrical and thermal conductivity. Physical Characteristics: c 368-1A: Appearance: Black Paste Viscosity: Thixotropic Specific Gravity: 1.55 C 368-1B: Appearance: Amber Liquid Viscosity: 300 cps Specific Gravity: 1.04 Mix Ratio: 100 parts 368-1A to 11 parts 368-IB. Pot Life: 30 minutes in a 100 gram mass. Cure Schedule: Parts can be handled and shipped after room temperature cure for 10 hours. Ultimate properties are reached after 24 hours at room temperature. C 865 Conductive Ink: MAVIDON C 865 is a water based one component, carbon filled, screen printable polymer featuring long open time and excellent adhesion to mylar. Physical Characteristics: ADDearanCe: Black Paste Specific Gravity: 1.0 Viscosity at 25C (77F): 50,000 cps Shelf Life at 25C (77F): 1 year Cure Schedule: 1 hour at 65C or 10 minutes at 1OOC Typical Cured Characteristics: Volume Resistivity: 3 ohm-cm Sheet Resistivity: 1200 ohm/sq Coverage (1 mil): 60 in Z/gram


MAVIDON CORP.: Electrically Conductive Products (Continued): D 600 Dielectric: MAVIDON D 600 is a one component, silk screenable dielectric ink featuring a ready to use viscosity and a low temperature cure schedule. D 600 exhibits excellent adhesion to such substrates as mylar and offers good flexibility. Physical Characteristics: Appearance: Blue Liquid Viscosity (TB at 5 rpm): 10,000 cps Specific Gravity: 1.1 Shelf Life @ 25C (77F): 1 year Cure Schedule: 1 hour at 65C, or 10 minutes at 1OOC Typical Cured Characteristics: Volume Resistivity: 1 x 10 15 ohm-cm G 170 Resistive Ink: MAVIDON G 170 is a one component, carbon filled, screen printable polymer featuring long open time and excellent adhesion to mylar. G 170 was specificaly formulated for membrane switch circuitry. Physical Characteristics: Appearance: Black Liquid Specific Gravity: 1.0 Viscosity at 25C (77F): 25,000 cps Shelf Life at 25C (77F): 1 year Cure Schedule: 1 hour at 65C or 10 minutes at 100 C Typical Cured Characteristics: Volume Resistivity: 2 ohm-cm Sheet Resistivity: 800 ohm/sq Coverage: 25 in Z/gram, 1 mil thick

389

390


MAVIDON CORP.: Electrically Conductive Products (Continued): K 26 A/B Conductive Ink: MAVIDON system K 26 is a two component, heat cured, silver filled conductive ink specifically formulated for screen printed circuitry. K 26 features excellent abrasion resistance, very high electrical conductivity and good adhesion to a variety of substrates. Physical Characteristics: K 26 “A” : Appearance: Silver Syrup Viscosity: 17,000 cps Specific Gravity: 2.8 K 26 "B": Appearance: Amber Liquid Viscosity: 120 cps Specific Gravity: 1.0 Mix Ratio: 100 parts K 26 "A" to 1.5 parts K 26 "B" by weight. Pot Life: 48-72 hours in a 100 gram mass at 25C. Cure Schedule: The length of cure will vary with the curing temperature. System K 26 can be cured at any of the following temperatures: 8OC: 2 hours 1OOC: 1 hour 125C: 15 minutes 15oc: 5 minutes Typical Cured Characteristics: Sheet Resistivity: Less than .lO ohm/sq/mil Coverage: 148 cm Z/gm/mil (wet film thickness)


391

MAVIDON CORP.: Electrically Conductive Products (Continued): K 26-2/CA 3 Conductive Epoxy: MAVIDON System K 26-2/CA 3 is a two component, heat cured conductive epoxy with extremely long pot life. The cured system has excellent adhesion to mylar and other plastic substrates, good electrical conductivity, excellent abrasion resistance and is crease resistant. K 26-2/CA 3 is designed for thin (less than 2 mil) coatings for shielding and grounding applications. It is also used for conductive paths on matrix boards. Physical Characteristics: K 26-2: Aoaearance: Silver Liauid Viscosity @ 25C (77F)i 35,000 cps Specific Gravity @ 25C (77F): 2.8 Shelf Life @ 25C (77F): 6 months CA 3: Appearance: Amber Liquid Viscositv a 25C: 120 CDS Specific*Gravity @ 25C‘(77F): 1.0 Shelf Life @ 25C (77F): 6 months Mix Ratio: By weight: 100 parts K 26-2 to 1.5 parts CA 3 Mixed viscosity @ 25C (77F): 32,000 cps Pot Life: >48 hours in 200 gram mass @ 25C (77F) Can be extended to several days by refrigeration Cure Schedule: 2 hours a 80C (176F) or 1 hour @-1OOC (212F) or 15 minutes 8 125C (257F) Typical Cured Characteristics: Volume Resistivity ohm-cm: Less than .OOlO Note: Material may be used as supplied. If a lower vicosity is desired, thin with Butyl Cellosolve Acetate.

392


MAVIDON

cow.:

Electrically Conductive Products (Continued):

K 27 Conductive Adhesive: MAVIDON K 27 is a 100% solid, silver filled two component epoxy adhesive which can be cured at ambient or elevated temperatures. K 27 features aood electrical and thermal conductivity, high strength, and_ heat resistance after cure. Originally formulated for antennae bonding, K 27 has also been successfully used in lead attach and RF shielding applications. Physical Characteristics: K 27 A: Appearance: Silver Cream Viscosity @ 25C (77F): Soft Paste Specific Gravity: 3.49 Shelf Life @ 25C: 6 months K 27 B: Appearance: Water White Liquid Viscosity @ 25C (77F): 450 cps Specific Gravity: 1.01 Shelf Life @ 25C: 6 months Mix Ratio: 100 parts K 27 A to 6 parts K 27 B by weight. Pot Life: 1 hour in a 20 gram mass at 25C (77F). Cure Schedule: 24 hours at room temperature or

1

hour at 1OOC (212F)

Typical Cured Characteristics: Hardness: 82D Volume Resistivity (cured at 25C): 0.20 ohm-cm (after 2 hours at 65C): .02 ohm-cm Tensile Strength: 1,600 psi min Thermal Conductivity [cal x cm/ (set x cm 2 x Cl: 28 x 10 -4 K 29-2 Conductive Adhesive: MAVIDON K 29-2 is a two component, silver filled epoxy adhesive featuring room temperature cure and exceptional adhesive strength. MAVIDON K 29-2 exhibits good electrical and thermal conductivity. Physical Characteristics: K 29-2A: Appearance: Silver Paste Specific Gravity: 3.6 Viscosity @ 25C (77F): 500,000 cps Shelf Life @ 25C (77F): 1 year K 29-2B: Appearance: Amber Liquid Specific Gravity: 1.0 Viscosity @ 25C (77F): 14,000 cps Shelf Life @ 25C (77F): 1 year


393

MAVIDON CORP.: Electrically Conductive Products (Continued): K 29-2 Conductive Adhesive (Continued): Mix Ratio: 100 parts K 29-2A to 15 parts K 29-2B by weight. Pot Life: 40 minutes in a 100 gram mass @ 25C (77F). Cure Schedule: Cure at room temperature for 24 hours or 15 minutes @ 71C (160F). Typical Cured Characteristics: Volume Resistivitv: Less than .Ol ohm-cm Shore D Hardness;-79 Tensile Strenqth: 1,600 psi min (Al-Al) Shrinkage (5%i: 0.3 Thermal Conductivity [cal x cm/ : 25 x 10 -4 (set x cm 2 x Cl1 K 31 A/B Conductive Adhesive: MAVIDON K 31 is a two component silver filled epoxy adhesive featuring an easy 1:l mix ratio that cures at room temperature. Physical Characteristics: K 31 A: Appearance: Silver Paste Viscosity: Thixotropic Specific gravity: 3.6 Shelf Life @ 25C (77F): 6 months K 31 B: Appearance: Silver Paste Viscosity: Thixotropic Specific gravity: 3.2 Shelf Life @ 25C (77F): 6 months Mix Ratio: 100 parts K 31 A to 100 parts K 31 B by weight. Pot Life: 30 minutes in a 50 gram mass @ 25C (77F) Cure Schedule: Cure time is dependent upon mass of the mixed material as epoxy compounds must generate their own heat for cure. Typical Cures Characteristics: Hardness: 78 D Volume Resistivity: Less than .OOl ohm-cm Thermal Expansion Coefficient (in/in F): 1.7 x 10 -5 Thermal Strength (Al-Al): 1,800 psi

394


MAVIDON CORP.: Electrically Conductive Products (Continued): K 30 Conductive Adhesive: MAVIDON K 30 is a two component, room temperature cure epoxy adhesive featuring excellent electrical and thermal conductivity. K 30 provides good adhesion to a variety of substrates including glass and most plastics. Physical Characteristics: j8 A: Appearance: Silver cream Viscosity @ 25C (77F): 14,000 cps Specific Gravity: 3.1 Particle Size: .4 microns Shelf Life 8 25C (77F): 1 year 38 B: Aooearance: Clear Liquid Viscosity @ 25C (77Fj: 30 cps Specific Gravity: .96 Particle Size: 0 Shelf Life @ 25C (77F): 1 year Mix Ratio: 100 parts K 38 A to 2.7 parts K 38 B. Pot Life: 30 minutes at 25C (77F) in a 100 gram mass. Cure Schedule: 24 hours at room temperature or 1 hour at 65C (149F) Typical Cured Characteristics (1 hour at 65C): Volume Resistivity: Less than .OOl ohm-cm Tensile Strength (Al-Al): 1500 psi min. Operating Range: -50C to +15OC Thernal Expansion Coefficient: 42 x 10 -6/C K-134 Conductive Adhesive: MAVIDON K-134 is a one component, heat cured conductive adhesive. K-134 features high electrical and thermal conductivity and cures quickly at temperatures as low as 125C. Fully cured, K-134 is non-bleeding, non-corrosive, and contains no fluorides. Phvsical Characteristics: Appearance: Smooth Silver Paste Viscosity at 25C: 300,000 +- 30,000 cps Soecific Gravity: 3.3 Cure‘Schedule: At 125C: 60 minutes At 150C: 30 minutes At 200C: 2 minutes Typical Cured Characteristics: Volume Resistivity - at 25C: .OOl ohm-cm max at 155C: -001 ohm-cm max Tensile Strength: 1,300 psi min.


395

MAVIDON CORP.: Electrically Conductive Products (Continued): K 149-2 Conductive Adhesive: MAVIDON K 149-2 is a one component, heat-cured silver-filled conductive adhesive. K 149-2 features hiqh electrical and thermal conductivity and high shear strength, and high temperature resis both non-bleeding and non-corrosive. Applicaistance. K 149-2 tions include electronics assembly that requires high tensile strength and good impact. Physical Characteristics: Appearance: Smooth, Silver Paste Viscosity at 25C (77F): 150,000 cps Specific Gravity: 3.3 Thixotropic Index: 3.2 Shelf Life @ 25C (77F): 6 months @ OC (32F): 1 year Cure Schedule: At 150C (302F): 30 minutes * At 125C (257F): 90 minutes * Longer cure times, or post cures, will generally improve the glass transition temperature. Tvoical Cured Characteristics: --Volume Resistivity @ 25C (77F): lO 14 Refractive Index: 1.51 Water Absorption (24 hr/77F), percent: 2.1 Instructions For Use: To each 100 parts by weight of Compound 51, add 19.5 parts by weight of Activator BA-21 and mix thoroughly. Proceed with the casting operation. If the casting contains interstices, vacuum degassing for a few minutes will be required to obtain void-free castings.

434


BACON INDUSTRIES INC.: General Purpose Potting Compound C-84/ BA-63: Compound 04, when used with Activator BA-63, yields an easyto-handle-at-room-temperature epoxy potting compound that after curing has good properties at moderate temperatures. It is a reasonably priced system that is recommended for potting and casting applications of up to one pound mass. It has inherently a high degree of resistance to flame propagation without the use of noxious additives. Recommended Mixing and Handling Parameters: Resin Compound: 04 Activator: BA-63 Activator Required, parts by weight per hundred of compound: 7.3 Mixing and Potting Temperature, F: 70 to 80 Work Life at 77F, minutes: 300 grams: 30 100 grams: 120 Viscositv of Comoound at 77F. noise: 600 Viscosit; of Activated Compound at 77F, poise: 60 Recommended Cure, hr/F: 3/77 + 21250 Alternate Cure, hr/F: 24/77 Typical Properties After Cure: Cure, hr/F: 16/77: Color: Black Linear Shrinkage, %: 0.06 Specific Gravity: 1.68 Hardness, Shore D: 81 Flexural Strength, psi: 7500 Young's Modulus in Flexure, psi: 1.1 x 10 6 Heat Distortion Temperature (264 psi), F: 122 Water Resistance (24 hr at 77F), %: 0.05 3177 plus 21250: Color: Black Linear Shrinkage, %: 0.00 Specific Gravity: 1.68 Hardness, Shore D: 86 Flexural Strength, psi: 10,000 Young's Modulus in Flexure, psi: 1.1 x 10 6 Heat Distortion Temperature (264 psi), F: 154 Water Resistance (24 hr at 77F), %: 0.04 Coefficient of Linear Thermal Expansion, 10 -6/F: 200F to 75F: 34 75F to -65F: 19

Encapsulating, Potting, Casting, Impregnating Compounds

435

BACON INDUSTRIES INC.: Instrument Grade Potting Compounds P-8OC and P-80F: Potting Compounds P-8OC and P-80F are highly-filled high performance epoxy systems featuring relatively low viscosity along with very low coefficient of thermal expansion, high strength, high modulus of elasticity and low shrinkage upon cure. These materials are useful in applications requiring high dimensional stability to temperatures over 200F as well as low outgassing in applications such as gyro motor stators, electro-magnetic devices and precision electronic devices operating in extreme environments. Both systems have outstanding thermal shock resistance. The two potting compounds are interchangeable in most aaolications. Pottins Comoound P-80C contains a ceramic filler that is purchased from an-outside vendor. Potting Compound P-80F contains a similar ceramic filler known as LO-X that was developed and is manufactured by Bacon. Because these compounds contain ceramic fillers, carbide or diamond-tipped cutting tools are necessary for machining. P-80C: Resin Compound: 24C Activator: BA-42 Activator Required, phr: 6.0 Mixing Temperature, F: 160 Viscosity of Activated Compound at 160F, poise: 15 Work Life at 160F (3OOg), min.: 50 Tack Free Time at 160F (3OOg), minutes: 60 Typical Properties After Cure: Cure, hr/F: in mold: 8/160+ in oven post cure: 16/212 Color: Red Density, g/cm 3: 1.86 Hardness, Shore D: 93

P-80F: Resin Comnound: 24F Activator: BA-42 Activator Required, phr: 6.0 Mixing Temperature, F: 160 Viscosity of Activated Compound at 160F, poise: 12 Work Life at 160F (3OOg), min.: 60 Tack Free Time at 160F (3OOg), minutes: 70 Typical Properties After Cure: Cure, hr/F: in mold: 8/160+ In oven oost cure: 161212 Color: Red _ Density, g/cm 3: 1.86 Hardness, Shore D: 93

436


BACON INDUSTRIES INC.: Instrument Grade Potting Compounds P-82C and P-82F: Potting Compounds P-82C and P-82F are highly-filled high performance epoxy systems featuring relatively low viscosity along with practically no shrinkage stresses upon cure, low coefficient of thermal expansion, high strength and high modulus of elasticity. These materials are useful in applications requiring high dimensional stability to temperatures over 200F and for low outgassing in applications such as gyro motor stators, electromagnetic devices and precision electronic devices operating in extreme environments. Both systems have outstanding thermal shock resistance. The two potting compounds are interchangeable in most applications. Pottins Comoound P-82C contains a ceramic filler that is purchased-from-an outside vendor. Potting Compound P-82F contains a similar ceramic filler known as LO-X that was developed at Bacon's Watertown facility. Potting Compound P-82FXM is available also. This is the same as Potting Compound P-82F except that it contains no red pigment and the fillers, resins and activators have been specially processed to remove magnetic particles. It is used where magnetic contamination is detrimental to sophisticated sensitive electromagnetic devices. P-82C: Resin Compound: 24C Activator: BA-45 Activator Required, parts by weight per hundred of compound: 6.0 Viscosity of Activated Compound, poise at 135F: 49 at 160F: 15 Work Life (3OOg), minutes: at 135F: 65 at 160F: 55 Tack Free Time (3OOg), minutes: at 135F: 85 at 160F: 60 P-82F: Resin Compound: 24F Activator: BA-45 Activator Required, parts by weight per hundred of compound: 6.0 Viscosity of Activated Compound, poise at 135F: 47 at 160F: 9 Work Life (3OOg), minutes: at 135F: 80 at 160F: 55 Tack Free Time (3OOg), minutes: at 135F: 100 at 160F: 60

Encapsulating Potting, Casting, Impregnating Compounds

BACON INDUSTRIES INC.:

LOW

cost Potting Compound P-85:

Potting Compound P-85 is a highly filled heat-curing epoxy system designed for casting applications requiring ease of handling, long work life and short cure time. It has a low coefficient of thermal expansion, high heat distortion temperature and g00a electrical properties. Potting Compound P-85 is useful in electronic applications involving high voltages. Recommended Mixing and Handling Parameters: Resin Compound: C-85 Activator: BA-60 Activator Required, parts by weight per hundred of compound: 8.0 Mixinc and Pottins Temverature, F: 180 Viscosity of acti;ated‘compound at 180F, p: 22.5 Working Life at 180F, minutes: 45 Pot Life (tack-free time) at 180F, minutes: 90 Recommended Cure, hr/F: 4/180 Typical Properties After Cure: Cure, hr/F: 41180 Black Specific Gravity: 1.81 Linear Shrinkage on cure, %: 0.05 Flexural Strength, psi: 14,000 Glass Transition Temperature, F: By TMA: 207 By DSC: 218 ASTM Heat Distortion Temperature, F: 213 Hardness, Shore D: 91 Coefficient of Thermal Expansion, 10 -6/F: from -65~ to 80F: 15 from 80F to 200F: 19 Dielectric Constant at 1 kHz, 77F: 4.54 Dissipation Factor at 1 kHz, 77F: 0.0035 Volume Resistivity, ohm-cm: 77F: 4 x 10 16 Cure, hr/F: 21180 + 2/300: Black Specific Gravity: 1.81 Flexural Strength, psi: 11,500 Flexural Modulus, 10 6 psi: 1.2 Glass Transition Temperature, F: Bv TMA: 300 B; DSC: 324 ASTM Heat Distortion Temperature, F: 294 Hardness, Shore D: 91 Coefficient of Thermal Expansion, 10 -6/F: from -65~ to 80F: 15 from 80F to 200F: 19 Machineability: Fair

437

438


BACON INDUSTRIES INC.: Microcircuit Grade Potting Compound P-86: Potting Compound P-86 is a highly filled heat-curing system designed for use in electronic and microcircuit packaging. It is exceptionally fluid, can be handled easily at room temperature, cures in a relatively short time and has excellent electrical properties at high temperatures. Because Potting Compound P-86 uses a liquid anhydride curing agent, it usually can be used over semiconductor junctions without causing poisoning failure. The costly step of protecting chips with silicone rubber barrier coatings can be eliminated in many applications. Recommended Mixing and Handling Parameters: Resin Compound: C-85 Activator: BA-62 Activator Required, parts by weight per hundred of compound: 27.0 Viscosity of Activated Compound, poise: at 75F: 40 at 180F: 3.0 Working Life, hours: at 75F: ~16 at 180F: 1 Work Life at 180F, minutes: 80 Pot Life (tack-free time) at 180F, minutes: 100 Recommended Cure, hr/F: 4/180 Alternate Cure, hr/F: 2/185 plus 3/300 Typical Properties After Recommended Cure: Color: Black Specific Gravity: 1.72 Linear Shrinkase on Cure. %: 0.16 Flexural Strength, psi: i2100 Flexural Modulus, 10 6 psi: 1.6 Water Absorption (24 hours at 77F), %: 0.02 Heat Distortion Temperature (264 psi), F: 185 Glass Transition Temperature (Tg) by DSC, F: 165 Hardness, Shore D: 90 Coefficient of Thermal Expansion, 10 -6/F: 80 to 200F: 22 -65 to 80F: 18 Machineability: Fair Dielectric Constant at 1 kHz: 77F: 3.91 212F: 3.77 Dissipation Factor at 1 kHz: 77F: 0.0033 212F: 0.0033 Volume Resistivity, ohm-cm: 77F: 2 x 10 16 212F: 4 x 10 16


439

BACON INDUSTRIES INC.: Coil Impregnants: Unfilled, low viscosity, two-part compounds. Their prime application is the impregnation of electronic components containing a high percentage of fine wires where complete penetration and freedom from voids is important. These compounds are useful also for casting and coating applications where a low viscosity material is required. Coil Impregnants 2, 3 and 6 are pure epoxy compounds. Coil Impregnant 2 is the preferred material unless the shorter work life or cure cycle of Coil Impregnant 3, or the longer work life of Coil Impregnant 6 is desired. Adhesive FA-14 is a modified epoxy compound having very low viscosity and the best ability to penetrate cracks and crevices. CI-2 *: Activator: BA-1 Parts by weight of activator per hundred parts by weight of impregnant: 10.0 Viscosity of activated impregnant at 75F, poise: 5 Surface Tension of activated impregnant at 75F, dyne/cm: 49 Recommended Cure, hr/F: 81212 Pot Life at 75F, hr: 8 Cured Properties: Gyro Grade: yes Hardness, Shore D: 85 Coefficient of Linear Exp between -65F and 80F, 10 -6/F: 49 Moisture Absorption, 24 hr at 75F, %: 0.08 Young's Modulus in flexure, psi x 10 -6: 0.5 Yield Strength in flexure,.psi x 10 -6: 13 Specific Gravity: 1.18 Dielectric Constant at 1 kHz.: 3.5 Dissipation Factor at 1 kHz: 0.002 Volume Resistivity, ohm-cm: 5 x 10 16 * Coil Impregnant 1 is also available. It has the same cured properties as Coil Impregant 2 but has an activated viscosity of 15 poise at Room Temperature.

440


BACON INDUSTRIES INC.: Coil Impregnants (Continued): CI-3: Activator: BA-4 Parts by weight of activator per hundred parts by weight of impregnant: 5.0 Viscosity of activated impregnant at 75F, poise: 20 Surface tension of activated impregnant at 75F, dyne/cm: 43 Recommended Cure, hr/F: 21200 Pot Life at 75F, hr: 4 Cured Properties: Gyro Grade: yes Hardness, Shore D: 85 Coefficient of Linear Exp between -65F and 80F, IO -6/F: 42 Moisture Absorption, 24 hr at 75F, 3: 0.09 Young's Modulus in flexure, psi x 10 -6: 0.4 Yield Strength in flexure psi x 10 -3: 12 Specific Gravity: 1.18 Dielectric Constant at 1 kHz: 3.8 Dissipation Factor at 1 kHz: 0.003 Volume Resistivity, ohm-cm: 1 x 10 17 CI-6: Activator: BA-45 Parts by weight of activator per hundred parts by weight of impregnant: 23.0 Viscosity of activated impregnant at 75F, poise: 8.5 Surface Tension of activated impregnant at 75F, dyne/cm: 43 Recommended Cure, hr/F: 4/212 Pot Life at 75F, hr: 24 Cured Properties: Gyro Grade: yes Hardness, Shore D: 85 Coefficient of Linear Exp between -65F and 80F, 10 -6/F: 40 Moisture Absorption, 24 hr at 75F, 3: 0.10 Young's Modulus in flexure, psi x 10 -6: 0.3 Yield Strength in flexure psi x 10 -3: 12 Specific Gravity: 1.18 Dielectric Constant at 1 kHz: 3.7 Dissipation Factor at IkHz: 0.002 Volume Resistivity, ohm-cm: 1 x 10 16


BACON INDUSTRIES INC: Coil Impregnants (Continued): FA-14: Activator: BA-45 Parts bv weisht of activator ner hundred warts bv weisht of impregnant: 24.5 Viscosity of activated impregnant at 75F, poise: 3 Surface Tension of activated-impregnant at75F, dyne/cm: 37 Recommended Cure, hr/F: 81160 Pot Life at 75F, hr: 8 Cured Properties: Gyro Grade: yes Hardness, Shore D: 84 Coefficient of Linear Exw between -65F and 80F. 10 -6/F: 37 Moisture Absorption, 24 hr at 75F, %: 0.16 Young's Modulus in flexure, psi x 10 -6: 0.5 Yield Strength in flexure psi x 10 -3: 10 Specific Gravity: 1.12 Dielectric Constant at 1 kHz: 3.7 Dissipation Factor at 1 kHz: 0.007 Volume Resistivity, ohm-cm: 1 x 10 17

441

442


BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds: Highly-Filled Gyro-Grade Low Coefficient of Expansion: p-11: Compound: 1119 Activator: BA-1 Activator Required, PHC: 3.20 Potting Temperature, F: 212 Viscosity at Potting Temp, Poise: 25 Pot Life: Temperature, F: 212 Minutes: 90 Recommended Cure: In Mold, Hours: 4 Temperature, F: 212 Plus in Oven, Hours: 16 4 Temperature, F: 212 Typical Properties After Recommended Cure: Specific Gravity: 1.85 Color After Cure: Brown Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 23 80~ to -65~: 14 Linear Shrinkage on Cure, %: 0.3 Machinability: Excellent Tensile Strength, psi: 6800 Young's Modulus in Flexure, at 70F, 10 6 psi: 1.1 Creep at 200F mil/in (3000 psi load for 24 hr): 60 Moisture Absorption after 10 days at 96% RH, %: 0.2 Weisht Loss After 6 Months at 300F. %: 0.5 Crack Resistance Factor: 1040 Dissipation Factor at 1kHz: 0.002 Dielectric Constant at IkHz: 5.37 Volume Resistivity, ohm-cm: 6 x IO 16 Thermal Conductivity, BTU-in/hr-ft 2-F: 2.0 Flammability: SE Chief Advantages: Excellent machinability, general purpose


443

BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: p-14: Compound: Activator:'~~~~ Activator Reauired. PHC: 3.12 Potting Temperature, F: 212 Viscosity at Potting Temp, Poise: 25 Pot LifeTemperature, F: 212 Minutes: 60 Recommended Cure: In Mold, Hours: 4 Temperature, F: 212 Plus in Oven, Hours: 16 4 Temperature, F: 212 Typical Properties After Recommended Cure: Soecific Gravitv: 1.77 Color after Cure: Brown Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 2080~ to -65F: 11 Linear Shrinkage on Cure, %: 0.3 Machinability: Fair Tensile Strength, psi: 12200 Young's Modulus in Flexure, at 70F, 10 6 psi: 1.6 Creep at 200F mil/in (3000 psi load for 24 hr): 50 Moisture Absorption After 10 days at 96% RH, 8: 0.3 Weight Loss after 6 months at 300F, %: 0.4 Crack Resistance Factor: 1740 Dissioation Factor at 1 kHz: 0.030 Dielectric Constant at 1 kHz: 4.79 Volume Resistivity, ohm-cm: 2 x IO 14 Thermal Conductivity, Btu-in/hr-ft 2-F: 4.0 Flammability: SE Chief Advantages: Low coefficient High tensile strength

*

Compounds 1420A and 1420F are also available. These comoounds have a lonaer wot life than the warent comwound with 1420F being the iongest. 1420 and i42OA are tan in color, 1420F is grey-white to pink-white. The cured properties of the potting compounds are similar.

444

Adhesives, Sealants and Coatings for the Electronics Indasty

BACON

INDUSTRIES

INC.:

Epoxy Resin Potting compounds (Continued):

Highly-Filled Gyro-Grade Low Coefficient of Expansion: p-19: compound: 1119 Activator: BA-2A Activator Required, PHC: 35.2 Potting Temperature, F: 212 Viscosity at Potting Temp, Poise: 25 Pot Life: Temperature, F: 212 Minutes: 50 Recommended Cure: In Mold, Hours: 8 4 Temperature, F: 212 Plus in Oven, Hours: 40 8 Temperature, F: 300 Typical Properties After Recommended Cure: Specific Gravity: 1.87 Color after Cure: Blue Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 18 80F to -65F: 15 Linear Shrinkage on Cure, %: 0.2 Machinabilitv: Excellent Tensile Strekgth, psi: 6900 Younq's Modulus in Flexure, at 70F. 10 6 osi: 1.0 Creep at 200F mil/in (3000.psi load for 24 hr): 1 Moisture Absorption after 10 days at 96% RH, %: 0.2 Weight Loss after 6 Months at 300F, 8: 0.3 Crack Resistance Factor: 830 Dissipation Factor at 1 kHz: 0.002 Dielectric Constant at IKHz: 4.78 Volume Resistivity, ohm-cm: 3 x 10 16 Thermal Conductivity, Btu-in/hr-ft 2-F: 2.0 Flammability: NB Chief Advantages: Excellent machinability, low creep


445

BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: p-20: Compound: 1420 Activator: BA-3A Activator Required, PHC: 32.0 Potting Temperature, F: 212 Viscosity at Potting Temp, Poise: 25 Pot Life: Temperature, F: 212 Minutes: 25 Recommended Cure: In Mold, Hours: 8 4 Temperature, F: 212 Plus in Oven, Hours: 16 8 Temperature, F: 300 Typical Properties After Recommended Cure: Specific Gravity: 1.79 Color after Cure: Red Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 16 80~ to -65~: 13 Linear Shrinkage on Cure, %: 0.1 Machinability: Fair Tensile Strength, psi: 10100 Young's Modulus in Flexure, at 70F, 10 6 psi: 1.3 Creep at 200F mil/in (3000 psi load for 24 hr): 1 Moisture Absorption After 10 days at 96% RH, %: 0.2 Weisht Loss after 6 Months at 300F. F: 0.1 Crack Resistance Factor: 1290 Dissipation Factor at 1 kHz: 0.019 Dielectric Constant at 1 kHz: 4.35 Volume Resistivity, ohm-cm: 2 x 10 15 Thermal Conductivity, Btu-in/hr-ft 2-F: 4.0 Flammability: NB _ Chief Advantages: High tensile Low creep

446


BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: P-24: Compound: 24 * Activator: BA-2A Activator Required, PHC: 26.3 Potting Temperature, F: 250 Viscositv at Potting Temp, Poise: 35 Pot LifeTemperature, F: 250 Minutes: 20 Recommended Cure: In Mold, Hours: 84 Temperature, F: 212 Plus in Oven, Hours: 168 Temperature, F: 300 Typical Properties After Recommended Cure: Soecific Gravitv: 1.89 Color after Cure: Maroon Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 14. 80~ to -65~: 10 Linear Shrinkage on Cure, %: 0.1 Machinability: Fair Tensile Strenoth. osi: 12.900 _. young's Modulus in Flexure, at 70F, 10 6 psi: 1.8 Creep at 200F mil/in (3000 psi load for 24 hr): 1 Moisture Absorption after IO days at 96% RH, %: 0.1 Weight Loss after 6 Months at 300F, 8: 0.1 Crack Resistance Factor: 1930 Dissipation Factor at 1 kHz: 0.025 Dielectric Constant at 1 kHz: 4.44 Volume Resistivity, ohm-cm: 4 x 10 14 Thermal Conductivity, Btu-in/hr-ft 2-F: 4.0 Flammability: NE Chief Advantages: Low coefficient high tensile, low creep L

* Compound 24P is available also with a longer pot life than 24. Cured properties are similar.

Encapsulating, Potting Casting, Impregnating Compounds

447

BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: P-38: Compound: 38 Activator: BA-1 Activator Required, PHC: 2.12 Potting Temperature, F: 300 Viscosity at Potting Temp, Poise: 9 Pot Life: Temperature, F: 300 Minutes: 60 Recommended Cure: In Mold, Hours: 4 Temperature, F: 212 Plus in Oven, Hours: 16 4 Temperature, F: 212 Typical Properties After Recommended Cure: Specific Gravity: 1.92 Color after Cure: Brown Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 12 80F to -65F: 8 Linear Shrinkage on Cure, %: 0.1 Machinability: Fair Tensile Strength, psi: 13,600 Young's Modulus in Flexure, at 70F, 10 6 psi: 2.4 Creep at 200F mil/in (3000 psi load for 24 hr): 5 Moisture Absorption after 10 days at 96% RH, %: 0.1 Weight Loss After 6 Months at 300F, %: 0.3 Crack Resistance Factor: 2300 Dissipation Factor at 1 kHz: 0.034 Dielectric Constant at 1 kHz: 5.31 Volume Resistivity, ohm-cm: 2 x 10 14 Thermal Conductivity, Btu-in/hr-ft 2-F: 4.0 Flammability: SE Chief Advantages: Least tendency to crack, lowest coefficient

448


BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: p-70: Potting Compound: 24 * Activator: BA-1 Activator Required, PHC: 2.5 Potting Temperature, F: 250 Viscosity at Potting Temp, Poise: 40 Pot Life: Temperature, F: 212 Minutes: 60 Recommended Cure: In Mold, Hours: 4 Temperature, F: 212 Plus in Oven, Hours: 20 12 Temperature, F: 212 Typical Properties After Recommended Cure: Saecific Gravity: 1.87 Color After Cure: Red Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 14. 80F to -65~: 9 Linear Shrinkage on Cure, 8: 0.2 Machinability: Fair Tensile Strenath. osi: 13.000 Young's Modul& in&Flexure, at 70F, 10 6 psi: 2.0 Creep at 200F mil/in (3000 psi load for 24 hr): 40 Moisture Absorption after 10 days at 96% RH, %: 0.2 Weight Loss After 6 Months at 300F, %: 0.3 Crack Resistance Factor: 1950 Dissipation Factor at 1 kHz: 0.031 Dielectric Constant at 1 kHz: 5.0 Volume Resistivity, ohm-cm: ---Thermal Conductivity, Btu-in/hr-ft 2-F: 4.0 Flammability: SE Chief Advantages: Properties between P-41 & P-81 * Compound 24F is available also with a longer pot life than 24. Cured properties are similar.


449

BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Highly-Filled Gyro-Grade Low Coefficient of Expansion: P-82c: Compound: 24C * Activator: BA-45 Activator Reauired. PHC: 6.0 Potting Temperature, F: 160 Viscosity at Potting Temp, Poise: 20 Pot LifeTemperature, F: 160 Minutes: 45 Recommended Cure: In Mold, Hours: 24 Temperature, F: 135 Plus in Oven, Hours: 24~24 Temperature, F: 160 200 Typical Properties After Recommended Cure: Specific Gravity: 1.86 Color after Cure: Red Coef. of Linear Expansion, 10 -6/F: 200F to 80F: 13 80F to -65~: 11 Linear Shrinkage on Cure, %: -0.05 Machinability: Fair Tensile Strenath. nsi: ---Young's Modulus in*Flexure, at 70F, 10 6 psi: 2.2 Creep at 200F mil/in (3000 psi load for 24 hr): 8 Moisture Absorption after 10 days at 96% RH, %: 0.02 Weight Loss After 6 months at 300F, %: ---Crack Resistance Factor: 1500 Dissipation Factor at 1 kHz: 0.016 Dielectric Constant at 1 kHz: 4.87 Volume Resistivity, ohm-cm: 1 x 10 15 Thermal Conductivitv. Btu-infhr-ft 2-F: 5 Flammability: ---- ^. Chief Advantages: Easier to process than P-38 and P-81. Low-stress. * Compound 24F is available also to make P-82F. Cured properties are similar.

450


BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Light Weight - Glass Microballoon Filled: Potting Compound: P-75: Comoound: 75 Activator: BA-57 Activator Required, PHC: 15.5 Potting Temperature, F: 160 Viscosity at Potting Temp, Poise: 30 Pot Life: Temperature, F: 160 Minutes: 30 Recommended Cure: In Mold, Hours: 8 Temperature, F: 160 Plus in Oven, Hours: 16 Temperature, F: 250 Typical Properties After Recommended Cure: Specific Gravity: 0.75 Color after Cure: Black Coef. of Linear Expansion, 10 -6/F: 200F to 80F: ---80F to -65F: 16 Linear Shrinkage on Cure, %: 0.27 Machinability: Excellent Tensile Strength, psi: ---Young's Modulus in Flexure, at 70F, 10 6 psi: 0.37 Creep at 200F mil/in (3000 psi load for 24 hr): ---Moisture Absorption after 10 days at 96% RH, %: 0.15 Weisht Loss after 6 Months at 300F. %: ---Crack Resistance Factor: ---Dissipation Factor at 1 kHz: 0.010 Dielectric Constant at 1 kHz: 2.54 Volume Resistivity, ohm-cm: 3 x 10 14 Thermal Conductivity, Btu-in/hr-ft 2-F: 1.4 Flammability: SE Chief Advantages: Low density non-settling self-extinguishing


451

BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Thermally Conductive Potting Compounds: P-56: Comoound: 56 Activator: BA-22 Activator Required, PHC: 71 Potting Temperature, F: 160 Viscosity at Potting Temperature, poise: 16 Work Life: Temperature, F: 160 Minutes: 50 Recommended Cure: In Mold, Hours: 16 Temperature, F: 160 Plus in Oven, Hours: ---Temperature, F: ---Typical Properties After Recommended Cure: Specific Gravity: 2.5 Specific Heat, cal/gm: 0.3 Color after Cure: Brown Coefficient of Linear Expansion, 150F to 32F, IO -6/F: 18 Machinability: Good Moisture Absorption after IO days at 96% RH, %: 0.08 Dissipation Factor at 1 kHz: 0.003 Dielectric Constant at 1 kHz: 5.80 Thermal Conductivitv. Btu-in/hr-ft 2-F: IO Flammability: SE _' Chief Advantages: Settles but maximum thermal conductivity for settled portion P-56A: Compound: 56 Activator: BA-22A Activator Required, PHC: 71 Potting Temperature, F: 160 Viscosity at Potting Temperature, poise: 13 Work Life: Temperature, F: 160 Minutes: 40 Recommended Cure: In Mold, Hours: 3 Temperature, F: 160 Plus In Oven, Hours: 5 Temperature, F: 160

452


BACON INDUSTRIES INC.: Epoxy Resin Potting Compounds (Continued): Thermally Conductive Potting Compounds(Continued): P-56A (Continued): Typical Properties After Recommended Cure: Specific Gravity: 2.3 Snecific Heat. Cal/am: 0.3 Color after Cure: Brown Coefficient of Linear Expansion, 150F to 32F. 10 -6/F: 18 Machinability: Good _ Moisture Absorption after 10 days at 96% RH, %: 0.08 Dissipation Factor at 1 kHz: 0.003 Dielectric Constant at 1 kHz: 5.76 Thermal Conductivity, Btu-in/hr-ft 2-F: 7 Flammability: SE Chief Advantages: Like P-56 but almost non-settling P-178: Compound: 17% Activator: BA-47 Activator Required, PHC: 6.0 Potting Temperature, F: 160 Viscosity at Potting Temperature, poise: 14 Work Life: Temperature, F: 160 Minutes: 100 Recommended Cure: In Mold, Hours: 8 Temperature, F: 160 Plus In Oven, Hours: 0 Temperature, F: 160 Typical Properties After Recommended Cure: Specific Gravity: 2.32 Specific Heat, cal/gm: 0.3 Color after Cure: Black Coefficient of Linear Expansion, 150F to 32F, 10 -6/F: 19 Machinability: Poor Moisture Absorption after 10 days at 96% RH, %: 0.16 Dissipation Factor at 1 kHz: 0.006 Dielectric Constant at 1 kHz: 6.32 Thermal Conductivity, Btu-in/hr-ft 2-F: 7 Flammability: ---Chief Advantages: Non-Settling


453

BACON INDUSTRIES INC.: Non-Magnetic Potting Compounds: Several of Bacon Industries gyro grade epoxy potting compounds are avalable in non-magnetic (XM) versions. These potting compounds are the same as the regular gyro grades except that the fillers and resins used have been specially processed to remove para-magnetic particles. They are used where magnetic contamination is detrimental to sophisticated sensitive electromagmetic assemblies. The currently available gyro grade XM potting compounds* are: P-IIXM: Compound: 1119XM Activator: BA-IXM P-IICXM: Compound: 1420CXM Activator: BA-IXM P-14FXM: Compound: 1420FXM Activator: BA-IXM P-19XM: Compound: 1119XM Activator: BA-2AXM P-ZOCXM: Compound: 1420CX~ Activator: BA-3AXM P-ZOFXM: Compound: 1420FXM Activator: BA-3AXM P-24CXM: Compound: 24CXM Activator: BA-2AXM P-24FXM: Compound: 24FXM Activator: BA-2AXM P-82CXM: Compound: 24CXM Activator: BA-45XM P-82FXM: Compound: 24FXM Activator: BA-45XM * Other Bacon Industries potting compounds can be specially processed to meet specific applications.

454


BIWAX CORP.: Impregnating Compounds High Temperature: Compound E-715: Softening Point: 290-300F. Penetration: 12-17 Flash Point: Over 400F. Color: Lt. Yellow Impregnating Temperature: 310-360F. Suecial Prooerties and Applications: Condenser impregnating-compound for 125C. operation. Dielectric Constant: 2.20-2.40 Dissipation Factor: .0002-.0007 Volume Resistivity (ohm-cm): >l x 10 14 Dielectric Strength V/Mil: 440 Compound A-5999: Softening Point: 225-230F. Penetration: lo-12 Specific Gravity: .98 - .99 Flash Point: Over 400F. Viscosity: At 260F.: 19 cps. Color: Tan Impregnating Temperature: 260-265F. Special Properties and Applications: Rapid setting coil dipping and impregnating compound. Low moisture permeability. Dielectric Constant: 2.53-2.55 Dissipation Factor: .0048 - .0050 Dielectric Strength V/Mil: 561 Compound E-5923: Softening Point: 267-269F. Penetration: 8-10 Specific Gravity: .93 - .94 Flash Point: Over 400F. Viscosity: At 275F. IO-12 cps. Color: Lt. Amber Impregnating Temperature: 275-285F. Dipping Temperature: 265-275F. Special Properties and Applications: Impregnation of transformer coils requiring high drip point. Dielectric Constant: 2.24-2.26 Dissipation Factor: .0078-.0080 Volume resistivity (ohm-cm): >3.41 x 10 14


BIWAX CORP.: Impregnating Compounds High Temperature

455

(Continued):

Compound E-5983: Softening Point: 267-272F. Penetration: 8-10 Specific Gravity: .96 - -98 Flash Point: Over 400F. Viscosity: At 300F. 21 cps. Cold Flow: None at 250F. Color: Tan Impregnating Temperature: 280-310F. Dipping Temperature: 290-330F. Special Properties and Applications: Potting and dipping wax suitable for -40 to 235F. operating temperatures. Dielectric Constant: 2.90-3.10 Dissipation Factor: .0570-.0590 Dielectric Strength V/Mil: 500

456

Adhesives,

Sealants


Industry

BIWAX CORP.: Impregnating Compounds Low Temperature: Compound 745: Softening Point: 188-1931. Penetration: 11-15 Specific Gravity: .92 - .94 Flash Point: Over SOOF. Viscosity: At 210F. 15-16 cps Color: Amber Impregnating Temperature: 235-245F. Dipping Temperature: 210-2301. Pouring Temperature: 225-250F. Special Properties and Applications: Impregnation of fine wire coils, condensers, ceramic & wlastic warts. Dielectric Constant: 2.20-2.22 Dissipation Factor: .0004-.0006 Volume Resistivity (ohm-cm): >3.4 x 10 14 Comwound 796: Softening Point: 188-193F. Penetration: 11-15 Specific Gravity: -92 - .94 Flash Point: Over 500F. Viscosity: At ZIOF. 15-16 cps. Color: Amber Imwreonatins Temwerature: 215-220F. Dipping Temperature: ZOO-220F. Pouring Temperature: ZIO-230F. Special Properties and Applications: Impregnation of audio coils, chokes & paper tubes & forms Porous ceramics IF & RF coils. Dielectric Constant: 2.00-2.20 Dissipation Factor: .OOOl-.0005 Volume Resistivity (ohm-cm): >l x 10 14 Compound C-748: Softening Point: 195-ZOOF. Penetration: 7-9 Specific Gravity: .92 - -93 Flash Point: Over 450F. Viscosity: At ZIOF. 12-13 cps Cold Flow: None at 135F. Color: Amber Impregating Temperature: 220-235F. Special Properties and Applications: Transformer coil impregnation. Lt. color. Dielectric Constant: 2.00-2.20 Dissipation Factor: .OOOl - .0005 Volume Resistivity (ohm-cm): >I x 10 14


BIWAX CORP.: Impregnating Compounds Low Temperature

(Continued):

Compound D-726: Softening Point: 217-222F. Penetration: 13-14 Specific Gravity: .92 - .94 Flash Point: Over 450F. Viscosity: At 250F. 16-20 cps. Color: Ivory Impregnating Temperature: 250-270F. Special Properties and Applications: Condenser imvresnatins comnound. hish IR retention at 85C. Dielectric Constant: 2.24-2.26 . Dissipation Factor: .OOOl - .0002 Volume Resistivity (ohm-cm): >2.05 x 10 14 Dielectric Strength V/mil: 380 Compound M-262: Softening Point: 165-180F. Penetration: 15-20 Svecific Gravitv: -92 - -94 Flash Point: Over 500F. Viscosity: At 210F. 15-25 cps. Color: Amber Impregnating Temperature: 210-230F. Dipping Temperature: 200-220F. Pouring Temperature: 210-230F. Special Properties and Applications: Dipping and impregnating wax.

457

458


BIWAX CORP.: Potting

Compounds Heat Conductive:

Compound C-1314: Softenins Point: 285-295F. Specific-Gravity: 2.20-2.40 Flash Point: Over 475F. Cold Flow: None at 260F. Color: Black Pouring Temperature: 310-350F. Special Properties and Applications: Heat conductive potting compound for transformers. Compound C-1316: Softening Point: 280-290F. Specific Gravity: 1.88-1.94 Flash Point: Over 400F. Cold Flow: None at 260F. Color: Black Pouring Temperature: 320-350F. Special Properties and Applications: Heat conductive potting compound for transformers. Compound C-1325: Softening Point: 270-275F. Penetration: 20-25 Snecific Gravitv: l-45-1.50 Fiash Point: Over 475F. Cold Flow: None at 250F. Color: Black Pouring Temperature: 300-350F. Special Properties and Applications: Soft adhesive potting compound for transformers.

Encapsulating, Potting Casting, Impregnating Compounds

BIWAX CORP.: Potting, Dipping & Coating Compounds: Compound C-1334: Softening Point: 270-280F. Snecific Gravitv: 1.45-1.50 Flash Point: Over 500F. Cold Flow: None at 105C. Color: Black Pouring Temperature: 300-350F. Special Properties and Applications: Heat conductive potting compound for transformers. Compound B-1128: Softening Point: 170-180F. Penetration: 20-25 Specific Gravity: .99-1.01 Flash Point: Over 425F. Viscosity: At 300F: 100-150 cps. Cold Flow: None at 145F. Color: Black Pouring Temperature: 275-325F. Special Properties and Applications: Sealing condensers and special coils, small dry cell assemblies. adhesive and oliable seal for coils. No crack, low temperature. Dielectric Constant: 2.61-2.65 Dissipation Factor: .0145--0155 Volume Resistivity (ohm-cm): >l x 10 14 Compound F-1125: Softening Point: 260-270F. Penetration: lo-22 Specific Gravity: 1.00-1.01 Flash Point: Over 450F. Cold Flow: None at 105C. Color: Black Pouring Temperature: 320-370F. Special Properties and Applications: Soft potting compound for filters. Compound C-1152: Softening Point: 270-275F. Penetration: 23-26 Specific Gravity: -94 - .99 Flash Point: Over 500F. Viscosity: At 360F: 180-200 cps. Cold Flow: None at 250F. Color: Black Dipping Temperature: 285-310F. Pouring Temperature: 290-350F. Special Properties and Applications: Flyback coil tire compound for corona suppression. Dielectric Strength V/Mil: 364

459

460


BIWAX CORP.: Potting, Dipping & Coating Compounds (Continued): Compound C-1348: Softening Point: 265-275F. Penetration: 5-15 Specific Gravity: 2.05-2.10 Flash Point: Over 450F. Cold Flow: None at 105C. Celor: Black Pouring Temperature: 340-360F. Special Properties and Applications: Heat conductive potting compound for transformers and line filters. Compound C-1328: Softening Point: 224-234F. Penetration: 15-20 Specific Gravity: 1.45-1.50 Flash Point: Over 400F. Cold Flow: None at 170F. Color: Black Pouring Temperature: 250-280F. Special Properties and Applications: LOW pouring temperature heat conductive potting compound. Compound 1613: Softening Point: 260-265F. Penetration: 23-24 Specific Gravity: 1.00-1.02 Flash Point: Over 400F. Viscosity: At 325F. 70-90 cps. Cold Flow: 230-235F. Color: Black Pouring Temperature: 300-325F. Special Properties and Applications: Potting compound. High cold flow combined with low pour temperature. Dielectric Constant: 2.52-2.54 Dissipation Factor: .0090-.OlOO Volume Resistivity (ohm-cm): >2.31 x 10 14

Encapsulating, Potting Casting Impregnating Compounds

461

BIWAX CORP.: Potting, Dipping & Coating Compounds (Continued): Compound 1628: Softening Point: 235-240F. Penetration: 15-18 Specific Gravity: 1.01-1.02 Flash Point: Over 425F. Viscosity: At 350F. 75 cps. Cold Flow: 215-220F. Color: Black Pourins Temnerature: 325-350F. Special Properties and Applications: Low viscosity potting compound for small units. No flow in 24 hrs. at 212F. Excellent adhesion and sealing properties. Compound 1655: Softening Point: 235-240F. Penetration: 7-10 Specific Gravity: 1.34-1.36 Flash Point: Over 450F. Cold Flow: 210-215F. Color: Black Pourins Temnerature: 325-340F. Specia? Properties and Applications: Excellent for potting small units where heat dissipation important. Heat conductive, high cold flow, low pouring temperature. Compound 1697: Softening Point: 271-276F. Penetration: 12-16 Suecific Gravity: .96 - 1.01 Flash Point: Over 450F. Viscosity: At 360F. 90-110 cps. Cold Flow: None at 265F. Color: Black Dipping Temperature: 290-330F. Pouring Temperature: 290-350F. Special Properties and Applications: Reduces corona losses on high voltage coils. Dielectric Constant: 2.30-2.32 Dissipation Factor: .OlOO - .OllO Volume Resistivity (ohm-cm): =3.35 x 10 14 Dielectric Strength V/Mil: 470

462


BIWAX CORP.: Sealing Compounds: Compound B-6528: Softening Point: 345-355F. Penetration: 11-16 Specific Gravity: .97-.99 Flash Point: Over 500F. Cold Flow: None at 320F. Color: Black Pouring Temperature: 400-430F. Special Properties and Applications: Used for sealing high current circuit breakers. Compound B-6541: Softening Point: 325-335F. Specific Gravity: 1.45-1.50 Flash Point: Over 450F. Cold Flow: None at 270F. Color: Brown Pouring Temperature: 390-440F. Compound G-2043: Softening Point: 240-250F. Penetration: O-l Specific Gravity: 1.45-1.50 Flash Point: Over 450F. Cold Flow: None at 220F. Color: Black Pouring Temperature: 350-360F. Special Properties and Applications: Sealing compound having good adhesion. Compound A-6563: Softening Point: 270-2SOF. Penetration: 3-7 Specific Gravity: 1.43-1.45 Flash Point: Over 400F. Cold Flow: None at 240F. Color: Red Pouring Temperature: 310-360F. Special Properties and Applications: High melting with excellent adhesion for sealing recesses in sockets switchbases etc. Compound 2078: Softening Point: 185-195F. Penetration: O-l Specific Gravity: 1.45-1.50 Flash Point: Over 400F. Cold Flow: None at 140F. Color: Red Pouring Temperature: 275-3251 Special Properties and Application: General purpose sealing compound.


BIWAX CORP.: Special Compounds: Compound H-7088: Softening Point: 193-198F. Penetration: 2-7 Specific Gravity: .95 - .98 Flash Point: Over 375F. Color: Lt. yellow to tan Dipping Temperature: 275-335F. Pouring Temperature: 275-335F. Special Properties and Applications: Wafer mounting adhesive. Protective dip for small parts. Compound I-7004: Softening Point: 210-220F. Penetration: l-5 Specific Gravity: -96 - .99 Flash Point: Over 375F. Color: Lt. vellow to tan Dipping Temperature: 270-330F. Pouring Temperature: 300-340F. Special Properties and Application: Wafer mounting adhesive. Compound A-6575: Softening Point: 348-358F. Penetration: 11-16 Flash Point: Over 500F. Color: Amber brown Dipping Temperature: 400-425F. Screw & Fastener Coating: Compound A-6576: Softening Point: 340-350F. Penetration: 19-23 Specific Gravity: .97 - .99 Flash Point: Over 500F. Viscosity: At 420F 184 cps. Cold Flow: None at 270F. Color: Dk. Amber Dipping Temperature: 380-415F. Special Properties and Application: Plastic dip for screws used in the automotive industry.

463

464


BIWAX CORP.: Special Compounds (Continued): Wire Spotting: Compound A-6557: Softening Point: 335-345F. Penetration: 6-10 Specific Gravity: 1.18-1.21 Flash Point: Over 450F. Cold Flow: None at 265F. Color: Tan Dipping Temperature: 380-420F. Pouring Temperature: 370-430F. Special Properties and Applications: Excellent adhesion to paper, metal, glass, and ceramic. Dielectric Constant: 3.30-3.50 Dissipation Factor: -3500 - .3700 Compound B-6515: Softening Point: 215-225F. Penetration: 8-13 Specific Gravity: -97 - 1.00 Flash Point: Over 400F. Cold Flow: None at 200F. Color: Brown Dipping Temperature: 275-375F. Pouring Temperature: 300-375F. Potting Greases: Comnound 7048: Specific Gravity: .90 - .91 Flash Point: Over 475F. Viscosity: At 325F. 160-200 cps. Cold Flow: None at 185F. Color: Translucent Pouring Temperature: 275-300F. Special Properties and Applications: Soft adhesive potting compound. Excellent low temperature characteristics. Dielectric Constant: 2.21-2.27 Dissipation Factor: .OOOl - .0002 Volume Resistivity (ohm-cm): >3.5 x 10 15

Encapsulating,

Potting

Casting, Impregnating

Compounds

465

BIWAX CORP.: Special Compounds (Continued): Potting Greases (Continued): Compound 7022: Softening Point: 277-281F. Penetration: 169-172 Specific Gravity: .91 - -92 Flash Point: Over 450F. Viscosity: At 320F. 80 cps. Cold Flow: None at 225F. Color: Translucent Pouring Temperature: 320-370F. Special Properties and Applications: Very soft and adhesive. High drip point and cold flow -6OF. operating temperature.

466


BIWAX CORP.: Miscellaneous Impregnating, Potting, Dipping Compounds: Compound 6264: Softening Point: 170-180F. Penetration: 12-15 Suecific Gravitv: -98 - 1.00 Flash Point: Over 450F. Viscosity: At 250F. 22 cps Color: Tan Impregnating Temperature: 240-260F. Dipping Temperature: 220-240F. Special Properties and Applications: Impregnation of transformer coils. Low viscosity and good penetration into windings. Dielectric Constant: 2.38-2.40 Dissipation Factor: .0048 - .0050 Volume Resistivity (ohm-cm): >3.24 x 10 14 Compound D-6261: Softening Point: 227-232F. Penetration: 3-4 Specific Gravity: .97 - 1.00 Flash Point: Over 450F. Viscosity: At 260F. 20-24 cps Color: Tan Impregnating Temperature: 250-270F. Dipping Temperature: 250-2701. Pouring Temperature: 260-270~. Special Properties and Applications: Transformer impregnating compound. Low viscosity. Good penetration with high melting point. Dielectric Constant: 2.53-2.55 Dissipation Factor: .0023 - .0025 Volume Resistivity (ohm-cm): >2.95 x 10 14 Compound B-5913: Softening Point: 225-230F. Penetration: 14-18 Specific Gravity: .97 - .98 Flash Point: Over 400F. Viscosity: At 260F. 20 cps Color: Tan Impregnating Temperature: 2604280F. Dipping Temperature: 250-270F. Pouring Temperature: 250-280F. Special Properties and Applications: Rapid setting high melting point dipping wax. Dipping small coils, tubular condensers. Dielectric constant: 2.38-2.42 Dissipation Factor: .0074 - .0078 Volume Resistivity (ohm-cm): 1 x 10 14


BIWAX CORP.: Miscellaneous Impregnating Potting, Dipping Compounds (Continued): Compound H-7088: Softening Point: 193-198F. Penetration: 2-7 Specific Gravity: .95 - -98 Flash Point: Over 375F. Color: Lt. yellow to tan Dipping Temperature: 275-335F. Pouring Temperature: 275-335F. Special Properties and Applications: Wafer mounting adhesive. Protective dip for small parts. Compound A-7008: Softening Point: 275-285~. Pentration: 18-23 Specific Gravity: .93 - .99 Flash Point: Over 450F. Cold Flow: None at 260F. Color: Lt. yellow to tan Dipping Temperature: 340-370F. Pouring Temperature: 350-380F. Special Properties and Applications: Potting and dipping wax suitable for use at 13OC. Dielectric Constant: 2.42-2.46 Dissipation Factor: .0300 - .0500 Volume Resistivity (Ohm-cm): >1.5 x 10 13

467

468


BONDED PRODUCTS, INC.: EPI-SEAL Clear Epoxy PE-X001: Potting and Encapsulation Compound (Meets MIL Spec. I-16923B) Mixing Procedure: Add all of Part A to Part B and mix thoroughly. To minimize air entrapment, do not mix too vigorously. If a completely bubble-free casting is required, apply vacuum and heat gently. Properties: Pot Life, 1 lb mass--2 hrs at 75F (24C) Brookfield viscosity (mix)--10560 cps Cure Schedule: A. Gel at room temperature (approximately 3 hrs) plus 3 hrs at 248F (12OC) or B. 7 days at room temperature. 1. Slightly lower properties are obtained with cure schedule B. Typical Physical Properties: Ultimate Tensile Strength, psi: 6500 Ultimate Elongation, %: 5 Hardness, Shore D: 82 Compressive Strength, psi: 22600(9000) Flexural Strength, psi: 13700(12000) Gardner Impact, in/lb: 66 Moisture Vapor Permeability, g/hr/cm: 0.62 x 10 -5 Heat Resistance, wt loss, %: .03 Coefficient of linear expansion, in/in/F: 4.4 x 10 -5 Thermal Shock: Passed all cycles Mechanical Shock, in lbs: 227 Typical Electrical Properties: Volume Resistivity, ohms/CM: Initial: 1.8 x 10 14 After 24 hrs immersion in H20: 5.3 x 10 13 Dielectric Strength, volts per mil: 1860


469

BONDED PRODUCTS, INC.: EPI-SEAL Clear Epoxy PE-X002: Potting and Encapsulation Compound Mixing Procedures: Add all of Part A to Part B and mix thoroughly. To minimize air entrapment, do not mix too vigorously. If a completely bubble-free casting is required apply vacuum and heat gently. Properties: Pot Life, 1 lb mass--2 hrs at 75F (24C) Brookfield viscosity (mix)--17920 cps Cure Schedule: A. Gel at room temperature (approximately 3 hrs) plus 3 hrs at 248~ (12OC) B. 7 days at room temperature. 1. Slightly lower properties are obtained with Cure Schedule B. Typical Physical Properties: Ultimate Tensile Strength, psi: 7300(7000) Ultimate Elongation, %I 8 Hardness Shore D: 81 Compressive Strength, psi: 8100(6100) Flexural Strenqth, psi: 12000(10000) Gardner Impact-injlb: 42 1. Values in parenthesis obtained with Cure Schedule B. Tvoical Electrical Prooerties: "Volume Resistivity,-ohm-cm: 1.1 x 10 14 Dielectric Strength, step-by-step v/mil: 430 ARC resistance, sec.: 82 Power factor: 60 cycles: 0.0085 IO 3 cycles: 0.0108 10 6 cycles: 0.0213 Dielectric Constant: 60 cycles: 3.37 10 3 cycles: 3.32 IO 6 cycles: 3.08 Loss Factor: 60 cycles: 0.0285 10 3 cycles: 0.0359 10 6 cycles: 0.0656 1. Electrical properties measured on specimens cured with Schedule A 2. l/8 inch sample thickness

470

Adhesives,

Sealants


Industry

BONDED PRODUCTS, INC.: EPI-SEAL Clear Epoxy PE-X003: Potting and Encapsulation Compound Mixing Procedures: Add all of Part A to Part B and mix thoroughly. To minimize air entrapment, do not mix too vigorously. If a completely bubble-free casting is required, apply vacuum and heat gently. Properties: Pot Life, 1 lb. mass--3.5 hrs at 75F (24C) Brookfield Viscosity (mix)--97920 cps Cure Schedule: A. Gel at room temperature (approximately 3 hrs) plus 3 hrs at 248~ (120c) B. 7 days at room temperature 1. Slightly lower properties are obtained with Cure Schedule B. Tvoical Physical Prooerties: -‘Ultimate Tensile Strength, psi: 5800(4800) Ultimate Elongation, %: 8(4) Hardness Shore D: 80(75) Compressive Strength, psi: 5900(4700) Flexural Strength, psi: 7200(7700) Gardner Impact in/lb: >80 Values in parenthesis obtained with Cure Schedule B. Typical Electrical Properties: Volume Resistivity, ohm-cm: 1.5 x 10 14 Dielectric Strength, step-by-step v/mil: 470 ARC resistance, sec.: 76 Power factor: 60 cycles: 0.0090 10 3 cycles: 0.0108 10 6 cycles: 0.0170 Dielectric Constant: 60 cycles: 3.20 10 3 cycles: 3.14 10 6 cycles: 3.01 Loss Factor: 60 cycles: 0.0357 10 3 cycles: 0.0339 IO 6 cycles: 0.0572 Electrical properties measured on specimens cured with Schedule A


471

CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation: Excellent electrical properties Low temperature environment/low mechanical stress systems (at temperatures down to -70C) Flame retardant systems Low viscosity systems for penetration and bubble release High viscosity systems for regulated flow and penetration Low, medium and high hardness systems Non-freezing systems High strength systems Re-enterable systems - if required The following properties have been designed into every QURE system. - Low vapor hazard - Room temperature cure - Low exotherm - Good heat stability - Excellent hydrolytic stability - Low shrinkage - Low moisture sensitivity - Excellent wetting - Low stress Suggested applications in general potting, encapsulating and sealing. Aeronautical Electronics Dead Topping Encapsulant Amplifiers Defense Electronics Automotive Electronics Electronic Control Modules Ballasts Formed in Place Gaskets Cable Connections Ignition Systems Cable Plugging Inductors Cable Reclamation Integrated Circuits Cable Splice Encapsulatilon - Load Coil/Cases Cable Stubbing Marine Electronics Circuit Embedment Meters, Modules Computer Control Modules Reed Relays, Power Supplies Cryogenic, Ferrite Cores Shock Absorbers Seal Conduit Ends Sonar Buoys Sealant Bushings, Molds Transformers Selenium Rectifiers Voltage Regulators The QURE System Components: QURE polyurethane casting systems are based on two proprietary CASCHEM Chemicals: VORITE prepolymers and POLYCIN polyols. VORITE: These non-TDI based liquid prepolymers exhibit low vapor pressure (calculated to be less than 1x10 -3 mm Hg at 25C). This feature greatly reduces vapor hazard, allowing less complicated, more comfortable procedures. POLYCIN: The POLYCIN family of room temperature curing polyols are functionally terminated hydrogen donor derivatives. They react with VORITE to form the cured polyurethane solid elastomer, coating, adhesive or sealant.

472


CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Enscapulation(Continued): 86M-1: Components: VORITE 683-M2 POLYCIN 876-M4 Mix Ratio (PBW): 44:56 Viscosity (cps) @ 25C: Components: 2,280 530 Mix: 800 Hardness (Shore): 85A Tensile (psi): 1,800 Elongation (%): 120 Tear (PLI): 200 Gel Time (Minutes): 45 Density (g/cc): l-17/0.98 System 86~-1 is a medium hardness, low viscosity polyurethane casting compound. The VORITE prepolymer does not contain TDI and has a low vapor pressure, thereby minimizing the potential vapor hazard. This system has been recommended for potting audio transformers, inductors, and capacitors. 88: Components: VORITE 689-M2 POLYCIN 876-M4 Mix Ratio (PBW): 50:50 Viscosity (cps) @ 25C: Components: 13,000 500 Mix: 1,500 Hardness (Shore): 50D Tensile (psi): 2,700 Elongation (%): 220 Tear (PLI): 500 Gel Time (Minutes): 85 Density (g/cc): 1.168 0.973 System 88 is a relatively hard, low viscosity, non-TDI based polyurethane for potting and encapsulating applications which require good mechanical properties. It is recommended for a diversity of applications, including potting transformers, coils, and transducers.


473

CASCHEM, INC: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 90: Comoonents: VORITE 689-M2 POLYCIN 640-M2 Mix Ratio (PBW): 55:45 Viscosity (cps) @ 25C: Components: 13,000 560 Mix: 2,500 HardnesslShore): 70D Tensile iPSI):'3,000 Elongation (%): 130 Tear-(PLI): 900 Gel Time iMinutes): 95 Density (g/cc): 1.168 0.975 System 90 is a high hardness, low viscosity, non-TDI based polyurethane with excellent mechanical properties. It contains no fillers or plasticizers, and is recommended for applications requiring high strength and good elongation. 95:

Components: VORITE 719-Ml POLYCIN 935 Mix Ratio (PBW): 36:64 Viscosity (cps) @ 25C: Components: 5,000 800 Mix: 1,200 Hardness (Shore): 60A Tensile (PSI): 600 Elongation (%): 100 Tear (PLI): 110 Gel Time (Minutes): 40 Density (g/cc): 1.174 0.957 System 95 is a low hardness, low viscosity, non-TDI based polyurethane having outstanding hydrolytic stability and chemical resistance. It is designed to give 3% to 6% expansion upon curing thereby insuring an air and water tight seal. It is recommended for use in potting load coils, cable stubs, and terminal blocks.

474


CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 96#-2: Components: VORITE 727-M3 POLYCIN 974-M2 Mix Ratio (PBW): 44:56 Viscosity (cps) @ 25C: Components: 750 625 Mix: 700 Hardness (Shore): 60A Tensile (PSI): 540 Elongation (%): 115 Tear (PLI): 40 Gel Time (Minutes): 50 Density (g/cc): 1.130:0960 System 96M-2 is a low hardness, low viscosity, non-TDI based polyurethane system which exhibits excellent adhesion, chemical resistance, and hydrolytic stability. It is recommended for use in potting load coils, cable stubs, and terminal blocks. 97

Components: VORITE 729 POLYCIN 989-Ml Mix Ratio (PBW): 40:60 Viscosity (cps) @ 25C: Components: 550 700 Mix: 600 Hardness (Shore): 60A Tensile (PSI): 600 Elongation (%): 200 Tear-(PLI): 129 Gel Time (Minutes): 60 Density (g/cc): 1.170:0.940 System 97 is a soft, very low viscosity, non-TDI based polyurethane. Its excellent low temperature properties and low mix viscosity make it ideal for potting stress sensitive components such as reed relays and ferrod sensors.

Encapsulating,

Potting, Casting, Impregnating Compounds

475

CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 101:

Components: VORITE 762 POLYCIN 1538 Mix Ratio (PBW): 25:75 Viscosity (cps) @ 25C: Components: 210 1,325 Mix: 1,100 Hardness (Shore): 65A Tensile (PSI): 375 Elongation (%): 150 Tear (PLI): 70 Gel Time (Minutes): 60 Density (g/cc): 1.210:0.938 System 101 is a low hardness, low viscosity, non-TDI based polyurethane having excellent chemical resistance and hydrolytic stability. Its outstanding low temperature properties suggest its use in applications requiring low embedment stress and temperature cycling properties (-60F to 180F). 106M-1: Components: VORITE 719-Ml POLYCIN 1598-Ml Mix Ratio (PBW): 36:64 Viscosity (cps) @ 25C: Components: 5,000 700 Mix: 1,100 Hardness(Shore): 60A Tensile (PSI): 600 Elongation (%): 100 Tear (PLI): 110 Gel Time (Minutes): 20 Density (g/cc): 1.174:0.957 System 106M-1 is a low hardness, low viscosity, non-TDI based polyurethane having outstanding hydrolytic stability. It passes the Naval Avionics Test (28 days @ 95% R.H./lOOC) and is recommended for potting components requiring good outdoor weathering, such as in terminal blocks and pedestals.

476


CASCBEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 108M-1: Components: VORITE 787 POLYCIN 1631-Ml Mix Ratio (PBW): 32:68 Viscosity (cps) @ 25C: Components: 2,280 465 Mix: 975 Hardness (Shore): 50A Tensile (PSI): 180 Elongation (%): 70 Tear (PLI): 31 Gel Time (Minutes): 80 Density (g/cc): 1.130:0.980 System 108M-1 is a soft, low viscosity, non-TDI based polyurethane having outstanding low temperature properties. It is recommended for applications requiring low embedment stress and excellent temperature cycling properties (-40 to 180F). 115: Components: VORITE 1729 POLYCIN 1821 Mix Ratio (PBW): 55:45 Viscosity (cps) 8 25C: Components: 25,000 2,000 Mix: 5,600 Hardness (Shore): 80D Tensile (PSI): 5,800 Elongation (%): 15 Tear (PLI): 1,250 Gel Time (Minutes): 15 Density (g/cc): 1.240:1.00 System 115 is a high hardness, non-TDI based polyurethane having excellent hydrolytic stability and outdoor aging properties. It contains no fillers or plasticizers and is recommended for potting terminal blocks, transformers, and coils.


477

CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 120M-1: Components: VORITE 1722 POLYCIN 1808-Ml Mix Ratio (PBW): 61:39 Viscosity (cps) @ 2X: Components: 100 350 Mix: 200 Hardness (Shore): 40D Tensile (PSI): i,OOO Elongation (%): 100 Tear (PLI): 160 Gel Time (Minutes): 30 Density (g/cc): 1;280:1.050 System 120M-1 is a non-filled, fire retardant polyurethane which meets the UL94 test reauirements for VO rating. Its low mix viscosity, excellent hydrolytic stability and mechanical properties make it ideal for potting electrical and electronic components where fire retardancy, chemical resistance, and good aging properties are required. 125M-1: Components: VORITE 1735 POLYCIN 1844-Ml Mix Ratio (PBW): 15:85 Viscosity (cps) @ 25C: Components: 60 10,000 Mix: 2,600 Hardness (Shore): 42D Tensile (PSI): 500 Elongation (%): 45 Tear (PLI): 150 Gel Time (Minutes): 75 Density (g/cc): 1.220:1.480 125-1 is a filled fire retardant polyurethane having a UL94 rating of VI. It is non-TDI based and is recommended for potting transformers, terminal blocks, and coils.

478


CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 126 Reenterable Encapsulant: Components: VORITE 1744 POLYCIN 1863 Mix Ratio (PBW): 17~83 Viscosity (cps) @ 25C: Components: 300 850 Mix: 800 Hardness (Shore): 55 "00" Tensile (PSI): i6 Elongation (%): 135 Tear (PLI): 5 Gel Time (Minutes): 55 Density (g/cc): I.040 0.950 126 Reenterable Encapsulant is a low viscosity, non-TDI based polyurethane having good hydrolytic stability and chemical resistance. Its unique combination of low tear and tensile strength with relatively high elongation, coupled with its ability to absorb cable greases make it an ideal reenterable splice encapsulant for all types of grease filled cable. 132: Components: VORITE 683-M2 POLYCIN 159% Mix Ratio (PBW): 36:64 Viscosity (cps) @ 25C: Components: 2,280 700 Mix: 1,100 Hardness (Shore): 70A Tensile (PSI): kO0 Elongation (%): 100 Tear (PLI): 100 Gel Time iMinutes): 25 Density (g/cc): 1.17:0.96 System 132 is a medium hardness, non-TDI based polyurethane having excellent hydrolytic stability and chemical resistance, and adhesion. It is recommended for applications requiring g00a flexibility and temperature cycling properties such as in cable stubs, load coils, and terminal blocks.


479

CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 133: Components: VORITE 683-M.2 POLYCIN 1923 Mix Ratio (PBW): 44:56 Viscosity (cps) @ 25C: Components: 2,280 530 Mix: 800 Hardness (Shore): 85A Tensile (PSI): 1,800 Elongation (%): 120 Tear (PLI): 200 Gel Time (Minutes): 5 Density (g/cc): 1.17:0.98 System 133 is a medium hardness, low viscosity, non-TDI based polyurethane having excellent chemical resistance and hydrolytic stability. It was developed for use in field applications such as service wire repair kits and cable capping kits where a very fast cure time is required. 140: Components: VORITE 1770 POLYCIN 1915 Mix Ratio (PBW): 52:48 Viscosity (cps) @ 25C: Components: 85 1,100 Mix: 500 Hardness (Shore): 55 "00" Tensile (PSI): 25 Elongation (%): 175 Tear (PLI): 4.5 Gel Time (Minutes): 15 Density (g/cc): 0.97:0.95 System 140 is a very soft, reenterable, non-TDI based polyurethane having good chemical resistance and hydrolytic stability. It was designed for potting computer control modules where temperature cycling properties and easy reenterability are required.

480


CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): 142: Components: VORITE 1781 POLYCIN 1931 Mix Ratio (PBW): 52:48 Viscosity (cps) @ 25C: Components: 183 1,800 Mix: 600 Hardness (Shore): 75 "00" Tensile (PSI): 77 Elongation (%): 215 Tear (PLI): 16 Gel Time (Minutes): 60 Density (g/cc): 1.01 0.95 System 142 is a soft, low viscosity, non-TDI based polyurethane having good chemical resistance and hydrolytic stability. It was designed for potting computer control modules and automotive ignition coils where good penetration and temperature cycling properties are required. 144 Reenterable Encapsulant: Components: VORITE 1782 POLYCIN 1932 Mix Ratio (PBW): 17:83 Viscosity (cps) @ 25C: Components: 300 800 Mix: 700 Hardness (Shore): 52 "00" Tensile (PSI): i5 Elongation (%): 135 Tear (PLI): 2.2 Gel Time (Minutes): 55 Density (g/cc): 1.02:0.96 System 144 is a low viscosity, non-TDI based polyurethane having exceptionally good reenterability. It was developed for use in the very large cable splices where ease of reenterability and grease absorbency properties are required.


481

CASCHEM, INC.: QURE Polyurethane Systems for Electrical Applications in Potting and Encapsulation(Continued): "D" Reenterable Encapsulant: Components: VORITE 715-Ml POLYCIN 934-M3 Mix Ratio (PBW): 17:83 Viscosity (cps) @ 25C: Components: 130 315 Mix: 300 Hardness (Shore): 50 "00" Tensile (PSI): 35 Elongation (%I: 130 Tear (PLI): 4.9 Gel Time (Minutes): 30 Density (g/cc): 1.019:0.894 "D" Reenterable Encapsulant is a very low viscosity, non-TDI based polyurethane having a unique combinbation of low tear and tensile strength with relatively high elongation. This unique set of physical properties, together with its low viscosity make it an ideal reenterable cable splice encapsulant.

482


CONAP, INC.: CONATHANE High Technology Potting, Casting and Molding Compounds: CONATHANE EN-4 thru EN-12: Two component polybutadiene-based liquid urethane casting and potting systems. When reacted, these high technology systems produce tough, stable elastomers; superior in most respects to silicone elastomers. These CONATHANE elastomers have outstanding hydrolytic stability, outstanding electrical properties over a wide temperature range, excellent thermal shock resistance and low temperature elasticity, low exotherm with minimal shrinkage, and low toxicity. CONATHANE EN-4: Mix Ratio (Pbw) Part A/Part B: 100/17.5 Mixed Viscosity, cps @.25C: 6000 Workinq Life @ 25C (l/Z lb. mass) minutes: 30 Cure Schedule: Days @ 25C: 7 Hours @ 80C: 10 Color: Opaque Amber Swecific Gravitv: 0.98 Shore A Hardness: 90 Tensile Strength, psi: 1950 Tear Strength; plii 240 Elongation, %: 520 Water Absorption, %, 24 hr.130 days: 0.410.5 Linear Shrinkage, %: 1.22 Thermal Shock -70 to 130C (10 cycles): Passes Fungus Resistance: Non Nutrient Dielectric Strength, VPM, l/16" @ 25C: 610 Arc Resistance, seconds @ 25C: ,120 Test Temperature: 25C: Dielectric Constant @ 100 Hz: 3.14 @ 1 MHz: 2.87 Dissipation Factor @ 100 HZ: .030 @ 1 MHz: .Oll Volume Resistivity, ohm-cm: 2.10x10 15 Insulation Resistance, ohm: ,2.5x10 13 Test Temperature: 130C: Dielectric Constant @ 100 HZ: 3.86 @ 1 MHz: 3.14 Dissipation Factor @ 100 Hz: .030 @ 1 MHz: .047 Volume Resistivity,.ohm-cm: 4.05x10 11 Insulation Resistance, ohms: 2.3x10 10

Encapsulating Potting, Casting Impregnating Compounds

483

COTRONICS CORP.: DURAPOT Epoxies: High Performance Potting Compounds for Electronic Applications: DURAPOT 861 - Low Viscosity Impreqnant: A clear compound for use to 500F. 861's low viscosity and simple cure at room temp. provides excellent penetration and electrical properties. 861 has been used for many clear coating applications. DURAPOT 862 - High Temp - Low Viscosity: A clear compound for use to 600F. 862's low viscosity provides excellent penetration and electrical properties. Usable to temperatures in the 600F range after curing at 350F. DURAPOT 863 - Ultra Hish Temn Pottins: 863 is based on COTRONICS-unique cross-linked inorqanicorganic polymer system with excellent dielectric heat stability. moisture and solvent resistance. Usable to temperatures in the 600F range after curing at 350F. DURAPOT 864 - Flexible and Room Temp Cure: Similar in properties to type 863, usable to 450F range, but with the flexibility required for severe thermal shock applications. DURAPOT 865 - High Thermal Conductivity: Usable to 500F plus, for applications involving high heat flows and the need for thermal dissipation with a simple room temp cure. DURAPOT 866 - Thermally Insulating: A 500F Epoxy based compound, thermally and electrically insulating in a convenient two part room temperature curing system. A unique product for special applications requiring this unusual combination of properties.

484


COTRONICS CORP.: DURAPOT Epoxies: High Performance Potting Compounds For Electronic Applications (Continued): 861: 5OOF Low Vise. Impregnant Room Cure Base: Novalac Volume Resistivity: 10 14 Dielectric Strength: 525 Thermal Exp./F: 3.4x10 -5 Therm. Conductivity: 7.2 Dielectric Constant: 4.15 Dissipation Factor: .015 Hardness: 80-D Chemical Resistivity: Excellent Solvent Resistance: Excellent Viscosity, Mixed: 1000 Pot Life (hours): (l-2) Components: 2 Mix Ratio/Base: 100 Activator: 17 Cure Cycle Temp: RT* Time: 16 hours 862: 600F Low Vise. Hish Temn. Base: Novalac Volume Resistivity: 10 14 Dielectric Strenqth: 555 Thermal Exp./F: 3.4x10 -5 Therm. Conductivity: 7.2 Dielectric Constant: 4.15 Dissioation Factor: -015 Hardness: 80-D Chemical Resistivity: Excellent Solvent Resistance:-Excellent Viscosity, Mixed: 1500 Pot Life (hours): 4 hours Components: 2 Mix Ratio/Base: 100 Activator: 80 Cure Cycle Temp: 220 & 350F Time: 2 & 4 hours * or 30 min. @ 250F


COTRONICS CORP.: DURAPOT Epoxies: High Performance Potting Compounds For Electronic Applications (Continued): 863:

650~ Ultra High Temp. Base: Novalac Volume Resistivity: 10 14 Dielectric Strength: 555 Thermal Exp./F: 2.5x10 -5 Therm. Conductivity: 9.0 Dielectric Constant: 3.5 Dissipation Factor: -010 Hardness: 90-D Chemical Resistivity: Excellent Solvent Resistance: Excellent Viscosity, Mixed: 2000 Pot Life (hours): 8 hours Components: 2 Mix Ratio/Base: 100 Activator: 71 Cure Cycle Temp: 220 & 350F Time: 2 & 4 hours 864: 450F Flexible Thermal Shock Base: Novalac Volume Resistivity: 10 14 Dielectric Strength: 555 Thermal Exp./F: 3.4x10 -5 Therm. Conductivity: 7.0 Dielectric Constant: 3.5 Dissipation Factor: .OlO Hardness: 90-A Chemical Resistivity: Good Solvent Resistance: Good Viscosity, Mixed: 11200 Pot Life (hours): 1 hour Components: 2 Mix Ratio/Base: 100 Activator: 120 Cure Cycle Temp: RT* Time: 24 hours * or 30 min. a 250F

485

486


COTRONICS CORP.: DURAPOT Epoxies: High Performance Potting Compounds For Electronic Applications (Continued): 865: 500F High Thermal Conductive Base: Novalac Volume Resistivity: 10 15 Dielectric Strength: 700 Thermal Exp./F: 2.5x10 -5 Therm. Conductivity: 20.0 Dielectric Constant: 3.5 Dissioation Factor: .OlO Hardness: 95-D Chemical Resistivity: Excellent Solvent Resistance: Excellent Viscosity, Mixed: 10,000 Pot Life (hours): 1 hour Components: 2 Mix Ratio/Base: 100 Activator: 8 Cure Cycle Temp: RT* Time: 24 hours 866: 500F Thermal Insulating Machinable Base: Novalac Volume Resistivity: 10 15 Dielectric Strength: 500 Thermal Exp./F: 2.5x10 -5 Therm. Conductivity: 1.5 Dielectric Constant: 3.5 Dissipation Factor: .015 Hardness: 60-D Chemical Resistivity: Excellent Solvent Resistance: Excellent Viscosity, Mixed: 10,000 Pot Life (hours): 1 hour Components: 2 Mix Ratio/Base: 100 Activator: 11 Cure Cycle Temp: RT* Time: 24 hours * or 30 min. @ 250F


487

JOHN C. DOLPH CO.: DOLPHON Epoxy Resins: DoLPHON Epoxy Resins vary from very flexible to rigid compounds. They are available in a range from very low viscosity to paste like, thixotropic adhesives. A series of reactors is available to tailor each system to specific needs. One Package Impregnant: DOLPHON CC-1090: One package, low viscosity epoxy for impregnating coils, transformers and electronic components wound with fine wire. Reactor or Catalyst: One Package Clear Filled or Unfilled: Unfilled Temparature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 2,300 Hardness Shore 'D' @ 70F: 24 hr.: 80/l wk.: 85 Mixing Ratio (Parts by Weight): One Package Viscosity in Centipoises (Resin and Reactor): @ 80F: 1,200 cps @ F: 320 @ 120 Pot Life (100 Grams): 70F: 6 mos./Hrs. @ F.: 200 @ 120 Cure Time: 2 hrs. @ 300F. DOLPHON CC-1115: Excellent electrical properties and moisture resistance. Approved use on sealed units for MIL-M-17060E. Passes submergence tests. Reactor or Catalyst: One Package Clear Filled or Unfilled: Unfilled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 2,100 Hardness Shore 'D' @ 70F: 24 hr.: 80/l wk.: 80 Mixing Ratio: One Package Viscosity in Centipoises: 1 RPM: 9500-13000/10 RPM: 4500-5500 Pot Life (100 Grams): 70F.: 1 Yr./Hrs. @ F.: 200 @ 130 Cure Time: 3-5 hrs. @ 325F. DOLPHON CC-1118-LV: Excellent high temperature electrical properties and moisture resistance. Approved use on sealed units for MIL-M-17060E. Passes submergence tests. Reactor or Catalyst: One Package Clear Filled or Unfilled: Unfilled Temperature Class: 180 Dielectric Strength: Volts/Mil l/8" Section: 2,400 Hardness Shore 'D' @ 70F: 24 hr.: 85/l wk.: 85 Mixing Ratio: One Package Viscosity in Centipoises: 1 RPM: 6000-9000/10 RPM: 2000-4000 Pot Life (100 Grams): 70F: 1 yr. Cure Time: 3-5 hrs. @ 325F.

488


JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Dipping: DOLPHON CB-1067: One package, flexible, black, thixotropic epoxy dipping resin for transformers and conformal coating. Good thermal shock and noise reduction. Reactor or Catalyst: One Package Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/0" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 65 1 wk.: 65 Mixina Ratio: One Packaae Viscosity in Centipoises: @ 80F: 1 RPM: 4800 10 RPM: 17000 Pot Life (100 Grams): 70F: 1 yr. Cure Time: 4-5 hrs. @ 275F. DOLPHON CR-1098: Durable red epoxy dipping resin for conformal coatings. Can be used to replace coil taping. Suitable for conveyor processing. Reactor or Catalyst: One Package Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 350 Hardness Shore 'A' @ 70F: 24 hr.: 60 1 wk.: 60 Mixing Ratio: One Package Viscosity in Centipoises: @ 80F.: 5 RPM: 7,000-12,800 Pot Life (100 Grams): 70F: 6 mos. Cure Time: 30 min. @ 300F. Wet Winding: DOLPHON CN-1119: Especially recommended for wet winding, sealing and filling. Extraordinary bond strength and chemical resistance. Superior electrical properties. Reactor or Catalyst: One Package Color: Beige Filled or Unfilled: Filled Temperature Class: 180 Dielectric Strength: Volts/Mil l/8" Section: 420 Hardness Shore 'D' @ 70F: 24 hr.: 85 1 wk.: 85 Mixina Ratio: One Packaae Viscosity: Thixotropic Paste Pot Life (100 Grams): 70F.: 1 yr. Cure Time: 7-8 hrs. 8 300F.


489

JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Wet Winding(Continued): DOLPHON CG-1062-A: Thixotropic epoxy resin for wet winding and encapsulating coils, resistors and transformers. Also used to seal transformer margins. Reactor or Catalyst: CG-1062-B/RE-2000 Color: Gray/Gray Filled or Unfilled: Filled Temperature Class: 155/130 Dielectric Strength: Volts/Mil l/8" Section: 440/400 Hardness Shore 'D' @ 70F: 24 hr.: 80170 1 wk.: 80175 Mixing Ratio: 100:80/100:7 Viscosity in Centipoises: Thixotropic/Thixotropic Pot Life (100 Grams): 70F.: 7 days/30 min Cure Time: 4 hrs. @ 300F./2-4 hrs. @ 7OF./24 hrs. @ 70F. Impregnating, Casting and Potting: DOLPHON CC-1024-A: Clear, unfilled epoxy system where maximum penetration is desired. Low viscosity and flexibility permit use even on fine wires as a general purpose impregnant and encapsulant. Reactor or Catalyst: RE-2000 Color: Clear Filled or Unfilled: Unfilled Temoerature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 500 Hardness Shore D @ 70F: 24 hr.: 70/l wk.: 75 Shrinkage During Cure: 0.5 Mixing Ratio: Resin: lOO/Reactor: 10 Viscosity in Centipoises: @ 80F.: 1,500 Pot Life (100 Grams): 70F.: 30 min Cure Time: l-3 hrs. @ 70F./24 hrs @ 70F. Reactor or Catalyst: RE-2001 Color: Amber Filled or Unfilled: Unfilled Temperature Class: 130 Dielectric Strength: Volts/Mil 118" Section: 440 Hardness: Shore 'D' @ 70F: 24 hr.: 50/l wk.: 50 Shrinkage During Cure: 0.5 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 50 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 2,000 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 2-4 hrs. @ 70F/24 hrs. @ 70F.

490


JOHN C!. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CC-1024-A(Continued): Reactor or Catalyst: RE-2005 Color: Amber Filled or Unfilled: Unfilled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 500 Hardness Shore 'D' a 70F: 24 hr.: 75/l wk.: 75 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 16 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 1,600 cps @ F: 80 @ 150 Pot Life (100 Grams): 70F.: 5 hrs./Hrs. @ F.: 1 @ 150 Cure Time: 5-7 hrs. @ 2251. Reactor or Catalyst: RE-2009 Color: Amber Filled or Unfilled: Unfilled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 500 Hardness: Shore iD' @ 70F: 24 hr.: 75/l wk.: 75 Shrinkage During Cure: 0.5 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 20 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 1,800 Pot Life (100 Grams): 70F.: 20 min. Cure Time: l-2 hrs. @ 701/24 hrs. @ 70F Reactor or Catalyst: RE-2010 Color: Amber Filled or Unfilled: Unfilled Temuerature Class: 130 Dieiectric Strength: Volts/Mil l/8" Section: 440 Hardness Shore 'D' @ 70F: 24 hr.: 60/l wk.: 70 Shrinkage During Cure: 0.2 Mixing Ratio (Parts By Weight): Resin: IOOfReactor: 50 Viscosity in Centipoises (Resin and Reactor): @ 80F: 3,500 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 4-6 hrs. @ 701./24 hrs. @ 70F.


491

JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): DOLPHON CR-1050: Red, machineable epoxy system for potting and encapsulation of sensors, thermostats, coils, motors, transformers, electronic assemblies. Cures to a high gloss finish. Low viscosity allows easy mix and pour without voids. Reactor or Catalyst: RE-2000 Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil 118" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 70/l wk.: 75 Shrinkage During Cure: 0.4 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 7 Viscosity in Centipoises (Resin and Reactor): @ 80F: 3,300 Pot Life (100 Grams): 70F.: 1 hr. Cure Time: l-3 hrs @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2001 Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 430 Hardness Shore 'D' @ 70F: 24 hr.: 65/l wk.: 65 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 30 Viscosity in Centipoises (Resin and Reactor) @ 80F.: 3,680 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2005 Color: Red Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/S" Section: 450 Hardness Shore 'D' @ 70F: 24 hr.: 80/l wk.: 80 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 11 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 6,500 cps @ F.: 700 @ 150 Pot Life (100 Grams): 70F.: 5 hrs./Hrs. @ F.: 1 @ 150 Cure Time: 5-7 hrs. @ 225F. Reactor or Catalyst: RE-2009 Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 420 Hardness Shore 'D' @ 70F: 24 hr.: 70/l wk.: 75 Shrinkage During Cure: 0.4 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 15 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 6,000 Pot Life (100 Grams): 70F.: 30 min. Cure Time: l-2 hrs. @ 70F./24 hrs @ 70F.

492


JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CR-1050(Continued): Reactor or Catalyst: RE-2010 Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 430 Hardness Shore 'D' @ 70F.: 24 hr.: 60 1 wk.: 65 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: 100 Reactor: 30 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 11,000 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 4-6 hrs. @ 70F./24 hrs. @ 70F. DOLPHON CB-1054-A: Flexible, black, flame retardant epoxy system for all types of electronic and electrical assemblies, transformers, coils, and motors. Especially recommended for MIL-T-27 and other military uses. Meets MIL-I-16923-C. Reactor or Catalyst: CB-1054-B Color: Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil 1/B" Section: 430 Hardness Shore 'D' @ 70F: 24 hr.: 60/l wk.: 60 Shrinkage During Cure: 0.21 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 100 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 10,000 cps @ F.: 1760 @ 150 Pot Life (100 Grams): 70F.: 6 wks./Hrs. @ F.: 6 @ 150 Cure Time: 3-5 hrs @ 275F. Reactor or Catalyst: RE-2000 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 400 Hardness Shore 'D' @ 70F: 24 hr.: 65/l wk.: 70 Shrinkage During Cure: 0.4 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 7 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 3,200 Pot Life (100 Grams): 70F.: 1 hr. Cure Time: 2-3 hrs. @ 701./24 hrs. @ 70F.

Encapsulating Potting, Casting Impregnating Compounds

JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CB-1054-A(Continued): Reactor or Catalyst: RE-2001 Color: Black Filled or Unfilled: Filled Temoerature Class: 130 Dieiectric Strength: Volts/Mil l/8" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 45/l wk.: 60 Shrinkage During Cure: 0.3 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 25 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 3,500 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2005 Color: Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 65/l wk.: 65 Shrinkage During Cure: 0.2 Mixing Ratio (Parts By Weight): Resin: lOO/Reactor: 10 Viscosity in Centipoises (Resin and Reactor) @ 80F.: 5,500 cps @ F.: 1280 @ 150 Pot Life (100 Grams): 70F.: 5 hrs./Hrs. @ F.: 1 @ 150 Cure Time: 5-7 hrs. @ 225F. Reactor or Catalyst: RE-2009 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 400 Hardness Shore 'D' @ 70F: 24 hr.: 60/l wk.: 60 Shrinkage During Cure: 0.45 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 13 Viscositv in Centiooises (Resin and Reactor): a _ 80F.: 4.960 Pot Life-(100 Grams): 70F:: 30 min. Cure Time: l-2 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2010 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 40/l wk.: 55 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: loo/Reactor: 25 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 7,500 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 4-6 hrs @ 70F./24 hrs. @ 70F.

493

494


JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued1: DOLPHON CB-1069: Black, machineable epoxy system for all types of electronic and electrical assemblies. Excellent thermal conductivity. This medium viscosity, filled epoxy cures to a fine, glossy finish. Reactor or Catalyst: RE-2000 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/S" Section: 405 Hardness Shore 'D' @ 70F.: 24 hr.: 75/l wk.: 80 Shrinkage During Cure: 0.4 Mixing Ratio (Parts by Weight): Resin: loo/Reactor: 7 Viscosity in Centipoises (Resin and Reactor): @ SOF.: 5,500 Pot Life (100 Grams): 70F.: 30 min. Cure Time: l-3 hrs. @ 70F.124 hrs. @ 70F. Reactor or Catalyst: RE-2001 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/S" Section: 430 Hardness Shore 'D' @ 70F.: 24 hr.: 60/l wk.: 65 Shrinkage During Cure: 0.25 Mixing Ratio (Parts by Weight): Resin: loo/Reactor: 25 Viscosity in Centipoises (Resin and Reactor): @ SOF.: 2,880 Pot Life (100 Grams) @ 70F.: 1 l/2 hrs. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2005 Color: Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/S" Section: 415 Hardness Shore 'D' B 70F: 24 hr.: SO/l wk.: 80 Shrinkage During Cure: 0.15 Mixinq Ratio (Parts by Weight): Resin: loo/Reactor: 10 Viscosity in Centipoises (Resin and Reactor): @ SOF.: 6,880 cps @ F.: 1250 @ 150 Pot Life (100 Grams): 70F.: 5 hrs./Hrs. @ F.: 1 @ 150 Cure Time: 5-7 hrs. @ 225F.

Encapsulating

Potting Casting, Impregnating

Compounds

495

JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CB-1069(Continued): Reactor or Catalyst: RE-2009 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielecric Strength: Volts/Mil l/0" Section: 410 Hardness Shore 'D' @ 70F: 24 hr.: 80/l wk.: 80 Shrinkage During Cure: 0.4 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 13 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 5,120 Pot Life (100 Grams): 70F.: 15 min. Cure Time: l-2 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2010 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 435 Hardness Shore 'D' @ 70F: 24 hr.: 60/l wk.: 65 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 25 Viscosity in Centipoises (Resin and Reactor) @ 80F.: 12,500 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 4-6 hrs. @ 701./24 hrs. @ 70F. DOLPHON CB-1078: Versatile, black, epoxy system for potting and casting all varieties of coils, transformers, electronic modules, and power supplies. This very low cost compound offers low shrinkage, high thermal conductivity, plus excellent electrical and physical properties. Reactor or Catalyst: RE-2000 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strenqth: Volts/Mil l/8" Section: 400 Hardness Shore '6' @ 70F: 24 hr.: 75/l wk.: 80 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 5 Viscosity in Centipoises (Resin and Reactor) @ 80F.: 8,600 Pot Life (100 Grams): 70F.: 1 hr. Cure Time: l-3 hrs. @ 70F./24 hrs. @ 70F.

496


JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CB-1078(Continued): Reactor or Catalyst: RE-2001 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 420 Hardness Shore 'D' @ 70F: 24 hr.: 55/l wk.: 75 Shrinkage During Cure: 0.1 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 20 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 3,840 Pot Life (100 Grams): 70F.: 1 l/2 hrs. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F. Reactor or Catalyst: RE-2005 Color: Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 410 Hardness Shore 'D' @ 70F.: 24 hr.: 80/l wk.: 80 Shrinkage During Cure: 0.05 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 7 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 14,000 cps @ F.: 3360 @ 150 Pot Life (100 Grams): 70F.: 5 hrs./Hrs. @ F.: 1 @ 150 Cure Time: 5-7 hrs. @ 225F. Reactor or Catalyst: RE-2009 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 400 Hardness Shore 'D' (a 70F: 24 hr.: 75/l wk.: 80 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 8 Viscositv in Centiooises (Resin and Reactor): (a _ 80F.: 10,800 Pot Life-(100 Grams): 70F;: 30 min. Cure Time: l-2 hrs. @ 70F.124 hrs. @ 70F. Reactor or Cure: RE-2010 Color: Black Filled or Unfilled: Filled Temuerature Class: 130 Dieiectric Strength: Volts/Mil l/8" Section: 415 Hardness Shore 'D' @ 70F: 24 hr.: 40/l wk.: 75 Shrinkase Durins Cure: 0.1 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 19 Viscosity in Centipoises (Resin and Reactor): 11,520 Pot Life-(100 Grams): 70F.: 1 l/2 hrs. Cure Time: 4-6 hrs. @ 70F./24 hrs. @ 70F.


497

JOHN C. DOLPH CO.: DOLPHON Epoxy Resins (Continued): Impregnating, Casting and Potting(Continued): DOLPHON CB-1112-A: Flexible, black, flame retardant epoxy system for electrical and electronic parts in the office equipment, computer, appliance and home entertainment industries. Recognized under UL-94, V-O. Yellow cards available. Reactor or Catalyst: CB-1112-B Color: Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil q/8" Section: 430 Hardness Shore 'D' @ 70F: 24 hr.: 55/l wk.: 55 Shrinkage During Cure: 0.21 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 100 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 17,000 cps @ F.: 1,200 @ 150 Pot Life (100 Grams): 70F.: 3 days/Hrs @ F.: 5 @ 150 Cure Time: 3-5 hrs. @ 275F or 2-3 hrs. @ 300F. Reactor or Catalyst: RE-2000 Color: Black Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/Mil l/8" Section: 400 Hardness Shore 'D' @ 70F: 24 hr.: 65/l wk.: 70 Shrinkacre Durina Cure: 0.3 Mixing Ratio (Parts by Weight): Resin: loo/Reactor: 7 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 5,000 Pot Life (100 grams): 70F.: 1 hr. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F. Bonding: DOLPHON CR-1056-B: Epoxy adhesive for bonding applications - good thermal shock resistance - thixotropic paste. Reactor or Catalyst: CC-1056-A Color: Red Filled or Unfilled: Filled Temperature Class: 130 Dielectric Strength: Volts/nil l/8" Section: 390 Hardness Shore 'D' @ 70F: 24 hr.: 60/l wk.: 70 Shrinkage During Cure: ---Mixing Ratio (Parts by Weight): Resin: loo/Reactor: 100 Viscosity in Centipoises: Thixotropic paste Pot Life (100 Grams): 70F.: 2 hrs. Cure Time: 2-4 hrs. @ 70F./24 hrs. @ 70F.

498

Adhesives,

Sealants


Industry

JOHN C. DOLPH CO.: DOLPHON Polybutadiene Resins: Potting, Casting and Coating: DOLPHON Polybutadiene Resins are flexible and elastomeric compounds with Shore A Hardness ranging from 35-60. They are especially formulated for encapsulating electric and electronic devices. Polybutadienes have excellent hydrolytic stability, good thermal conductivity, low embedment stress, and thermal shock ranging from -70 to +2OOC. They have extraordinary resistance to moisture and chemicals and excellent adhesion to a wide variety of substrates. Easy to repair. Excellent replacement for silicones and epoxies. DOLPHON CB-1109: General purpose, black, filled potting and casting resin for all types of electrical and electronic devices. Excellent for automotive products. Recommended for potting connectors and cable splices. Reactor or Catalyst: RE-2018 Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 665 Hardness Shore 'A' @ 70F: 24 hr.: 25 1 wk.: 40 Shrinkage During Cure: 0.09 Mixing Ratio (Parts by Weight): Resin: 100 Reactor: 15 Viscosity in Centipoises: @ 80F.: 3,800 Pot Life (100 Grams): 70F.: 1 hr. Cure Time: 2-4 hrs. @ 701/24 hrs. @ 70F DOLPHON CC-1120-A: Low viscosity, clear amber compound for potting coils, transformers, printed circuit boards and electronics. Excellent for electromagnets. Easily repaired. Reactor or Catalyst: CC-1120-B Amber Filled or Unfilled: Unfilled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 620 Hardness Shore 'A' @ 70F: 24 hr.: 15 1 wk.: 35 Shrinkage During Cure: 0.2 Mixing Ratio (Parts by Weight): Resin: 100 Reactor: 25 Viscosity in Centipoises (Resin and Reactor): @ 80F.: 1,500 Pot Life (100 Grams): 70F.: 3 hrs. Cure Time: 3-5 hrs. @ 70F/24 hrs @ 70F


499

JOHN C. DOLPH CO.: DOLPHON Polybutadiene Resins: Potting, Casting and Coating (Continued): DOLPHON-CB-1128-A: Thixotriopic black filled compound for brushing, dipping and spraying where high build is required. Excellent adhesion to a wide variety of substrates. Its thixotropy makes it an excellent choice for "glob top". Reactor or Catalyst: CB-1128-B Black Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 665 Hardness Shore 'A' 8 70F: 24 hr.: 60/l wk.: 60 Mixing Ratio (Parts by Weight): Resin: lOO/Reactor: 6 Viscosity in Centipoises (Resin and Reactor) @ 80F.: Thixotropic Pot Life (100 Grams): 70F.: 45 min. Cure Time: 2-4 hrs. @ 70F.124 hrs. @ 70F. DOLPHON CN-1130-A: Flame retardant general purpose elastomeric compound for potting and casting electrical and electronic devices. Meets UL 94, v-o. Reactor or Catalyst: CN-1130-B Cream Filled or Unfilled: Filled Temperature Class: 155 Dielectric Strength: Volts/Mil l/8" Section: 1000 Hardness Shore 'A' @ 70F: 24 hr.: 40/l wk.: 55 Shrinkage During Cure: lOOO Ooeratins Temn (C) Continuous/Intermittent: 1751300 Thermal Conductivity: 18x10 -4 Weight Loss 300C (%): .04 Tg ITMA) (12): 155 CTE (in/in/C): Aloha 1: 15-18x10 -6 . Alpha 2: 62-10 -6 Volume Resistivity at 25C (ohm-cm): ,1x10 15 Shelf Life (months/C): 61-40 Flash Point (C): ,120 High Tg, low CTE and low flow material for wire bonded devices. EPOCAST 7704-3: Color: black Specific Gravity (system): 1.8 Svstem Viscositv (x 1000 cps): 100 Pot Life (hoursj: 24-48 _ Gel Time i5OC (minutes): 5 Cure Schedule (minutes/C): 60/165 Lao Shear Strength Al/Al at 25 (psi): >I000 Operating Temp TC) Continuous/Intermittent: 175/300 Thermal Conductivity: 16x10 -4 Weight Loss 300C (%): .07 Tg (TMA) (C): 160 CTE (in/in/C): Alpha 1: 15-18x10 -6 Alpha 2: 64x10 -6 Volume Resistivity at 25C (ohm-cm): 9.9x10 15 Shelf Life (months/C): 6/-40 Flash Point (C): >120 High Tg, low CTE material for applications requiring increased flow capability.

573

574


FURANE PRODUCTS: EPOCAST Glob Top Encapsulants

(Continued):

EPOCAST 7704-5: Color: black Specific Gravity (system): 1.7 System Viscosity (x 1000 cps): 70 Pot Life (hours): 24-48 Gel Time 150C (minutes): 5 Cure Schedule (minutesjO!): 601165 Lap Shear Strength Al/Al at 25 (psi): >lOOO Operating Temp (C) Continuous/Intermittent: 1751300 Thermal Conductivity: 16x10 -4 Weight Loss 300C (%): .03 Tg (TMA) (C!):160 CTE (in/in/C): Aloha 1: 15-18x10 -6 Alpha 2: 62x10 -6 Volume Resistivity at 25C (ohm-cm): 9.6x10 15 Shelf Life (months/C): 6/-40 Flash Point (C): ,120 High Tg, low CTE flowable system for use on flip chip or beam-leaded devices. EPOCAST X-89282: Color: black Specific Gravity (system): 1.7 System Viscosity (x 1000 cps): 50 Pot Life (hours): 24-48 Gel Time i5OC (minutes): 5 Cure Schedule (minutes/C): 60/165 Lap Shear Strength Al/Al at 25 (psi): >lOOO Operating Temp (C) Continuous/Intermittent: 175/300 Thermal Conductivity: 16x10 -4 Weight Loss 300C (%): 0.11 Tg (TMA) (c): 120 CTE (in/in/C): Alpha 1: 26x10 -6 Alpha 2: 78x10 -6 Volume Resistivity at 25C (ohm-cm): ,1x10 15 Shelf Life (months/C): 6/-40 Flash Point (C): >I20 Low stress, flowable encapsulant particularly designed for flip chip and beam-leaded devices.


FURANE PRODUCTS: EPOCAST Glob Top Encapsulants

(Continued):

EPOCAST X-89284: Color: black Specific Gravity (system): 1.6 System Viscosity (x 1000 cps): 150 Pot Life (hours): 24-48 Gel Time 150C (minutes): 5 Cure Schedule (minutes/C): 60/165 Lap Shear Strength Al/Al at 25C (psi): >lOOO Operating Temp (C) Continuous/Intermittent: 175/300 Thermal Conductivity: 16x10 -4 Weight Loss 300C (%): 0.11 Tg (TMA) (C): 135 CTE (in/in/C): Alpha 1: 27x10 -6 Alpha 2: 85x10 -6 Volume Resistivity at 25C (ohm-cm): ,1x10 15 Shelf Life (months/C): 6/-40 Flash Point (C): ,120 Low stress, higher Tg material for wire bonded devices.

EPOCAST X-89282 Glob Top Encapsulant: Features/Benefits: * Low thermal expansion * High purity * 100% solids * Very low viscosity * Suitable for machine dispensing * Less than 20 ppm each of Na, K, Fe, Cl, Br EPOCAST X-89284 Glob Top Encapsulant: Features/Benefits: * Low thermal expansion * High purity * 100% solids * High viscosity version of X-89258 * Suitable for machine dispensing

575

576

Adhesives, Sealants and Castings far the Electronics Industry

FURANE PRODUCTS: Potting, Encapsulating & Impregnating Products for Conformal Coatings: Resin: URALANE 5750-A: Hardener: URALANE 5750-B(LV): Mixed Cured Color: clear to milky Application Method: dip/spray/brush Solids %: 83 Mix Ratio pbw: 18/100 Specific Gravity: 0.96 Viscosity CDS at 25C: 550 Pot Life-106 gms at 25C hours: 2 Shelf Life at 25C months: 6 Cure Schedule hours C: 9165 or 2/100 Hardness Shore A or D: 50A Operating Temperature C: 125 Tack Free Time at 50% RH hours C: 4/65 Tensile Strenath osi: 350 Elongation %:*150Dielectric Strength Volts/Mil: >I500 Solvent Resistance: excellent Fungus Resistance: pass URALANE 8267: Mixed Cured Color: clear to amber Application Method: dip/spray/brush Solids %: 50 Mix Ratio pbw: l-camp Specific Gravity: 0.90 Viscositv CDS at 25C: 250 Pot Life-lob gms at 25C hours: 2 Shelf Life at 25C months: 6 Cure Schedule hours C: 2165 or 24125 Hardness Shore A or D: 53A Operating Temperature C: 105 Tack Free Time at 50% RH hours C: 1.5125 Tensile Strength psi: 320 Elongation %: 100 Dielectric Strength Volts/Mil: 2500 Solvent Resistance: excellent Fungus Resistance: pass


577

FURANE PRODUCTS: Potting, Encapsulating & Impregnating Products for Conformal Coatings (Continued): URALANE 5780: Mixed Cured Color: Clear to It. amber Application Method: dip/spray/brush Solids %: 50 Mix Ratio pbw: 1-camp Soecific Gravitv: 0.90 Viscosity cps at 25C: 250 Pot Life 100 qms at 25C hours: 1.5 Shelf Life at-25C months: 6 Cure Shedule hours C: 2/65 or 24/25 Hardness Shore A or D: 80A Ooeratins Temoerature C: 125 Tack Free Time at 50% RH hours C: l/25 Tensile Strength psi: 760 Elongation %: 12 Dielectric Strength Volts/Mil: 750 Solvent Resistance: good Fungus Resistance: pass ACRYLANE 5730: Mixed Cured Color: clear Application Method: dip/spray/brush Solids '8: 34 Mix Ratio pbw: 1-camp Specific Gravity: 0.90 Viscosity cps at 25C: 700 Pot Life 100 gms at 25C hours: 1.5 Shelf Life at 25C months: 12 Cure Schedule hours C: 24125 Hardness Shore A or D: 80A Operating Temperature C: 105 Tack Free Time at 50% RH hours C: 1.5125 Tensile Strength psi: 700 Elongation %: 255 Solvent Resistance: acids-good organic-poor Fungus Resistance: pass

578


FURANE PRODUCTS: Potting, Encapsulating & Impregnating Products for Conformal Coatings (Continued): EPOCAST 8122-A31: EPOCAST 8122-B: Mixed Cured Color: Clear to amber Application Method: dip/spray/brush Solids %: 100 Mix Ratio pbw: 100/50 Specific Gravity: 1.08 Viscosity cps at 25C: 6000 Pot Life 100 gms at 25C hours: 3 Shelf Life at 25C months: 12 Cure Schedule hours C: 4165 to 2/65+2/155 Hardness Shore A or D: 85D Operating Temperature C: 155 Tack Free Time at 50% RH hours C: 4125 Dielectric Strength Volts/Mil: >I500 Solvent Resistance: excellent Fungus Resistance: pass SILFLEX SP6200-A: SILFLEX SP6200-B: Mixed Cured Color: clear Application Method: dip/spray/brush Solids %: 100 Mix Ratio pbw: lOO/lOO Specific Gravity: 1.02 Viscosity cps at 25C: 850 Pot Life 100 gms at 25C hours: 3 Shelf Life at 25C months: 6 Cure Schedule hours C: 4165 or l/100 Hardness Shore A or D: 25A Operating Temperature C: 200 Tack Free Time at 50% RH hours C: 4/25 Tensile Strength psi: 475 Elongation %: >50 Dielectric Strength Volts/Mil: 500 Solvent Resistance: good Fungus Resistance: pass

Encapsulating Potting, Casting, Impregnating Compounds

579

GE SILICONES: Addition-Cure RTV Silicone Encapsulants: RTV 615, RTV 627, RTV 655: This product line consists of two-part RTV silicone rubber compounds in pre-packaged, pre-measured kits. This assures uniform quality and simplifies inventory control. All grades offer reliable deep-section cure, even in closed assemblies. Cure occurs at room temperature without exotherm or may be accelerated by heat for shorter cycle time. Primers are recommended to assure adhesion to non-silcone materials. Key Performance Properties: * Non-corrosive, deep-section cure of unlimited depth * Room-temperature or heat cure * No cure by-products * Low linear shrinkage RTV 615: Transparent, general purpose encapsulant flows freely around complex parts providing excellent electrical insulation and shock resistance. Offers easy visual inspection for identification and repair of parts and assemblies. Temperature range: -65 to 400F (-54 to 204C). RTV 627: General purpose compound for production-line potting applications, with flame-retardant properties. UL Recognized. Temperature range: -65 to 400F (-54 to 204C). Color: Black. RTV 655: Transparent, high-strength potting material offers easy visual inspection for repair of potted components. Excellent low-temperature performance to -175F (-11 SC) for protection and mechanical support required by low-temperature applications. Temperature range: -175 to 400F (-115 to 204C). Condensation-Cure RTV Silicone Encapsulants: These easy-to-use silicone compounds cure at room temperature for potting and encapsulating applications. Each product line consists of base compounds ranging from liquid to paste consistency. These compounds may be mixed with one of several curing agents, in varying proportions, by hand or machine, to achieve required cure time. They contain no flammable or toxic solvents, cure in deep sections with appropriate curing agent and are compatible with most electrical insulating materials. These products are recommended for applications that are not completely sealed prior to full cure, because moisture and an escape path for cure by-products are required to complete the cure. Key Performance Properties: * Outstanding electrical properties * High/low-temperature capabilities * Adjustable cure rates * Deep-section cure with appropriate curing agent

580


GE SILICONES: General Purpose Encapsulants: RTV 11, RTV 12, RTV 21, RTV 41: General purpose RTV silicone encapsulants cure, with the addition of a curing agent, to moderate-strength, durable silicone compounds capable of withstanding temperatures from -75F (-60F) to 400F (-204C) under continuous operation. Availble in a wide range of viscosities. RTV 11: Easily pourable, low viscosity, self-leveling product for general purpose electrical potting. Protects connectors, switches, components and coils from dust, moisture and shock. RTV 12: General purpose, primerless silicone encapsulant for protecting high- and low-voltage electronic assemblies and connectors. RTV 21: Pourable, low viscosity, general purpose product for thermal insulation in aerospace applications, thick section potting and as pour-in-place gaskets for appliances. RTV 41: Pourable, medium viscosity, general purpose encapsulant used as release coating on various substrates, metal panels, and fabrics. High-Temperature Encapsulants: RTV 31, RTV 60, RTV 88: Available in both pourable and paste consistencies, RTV high-temperature silicone encapsulants offer moderate strength for applications requiring continuous operating performance from -65 to 500F (-54 to 26OC) and intermittent performance up to 600F (316C). RTV 31: Pourable, low viscosity product for electrical potting and mechanical protection. RTV 60: Pourable, low viscosity product for aerospace applications requiring potting, encapsulating, coating or cushioning. RTV 88: Paste consistency aerospace sealant and gasket, especially effective on vertical surfaces for sealing, bonding and gasketing.


581

GE SILICONES: Low-Temperature Encapsulants: RTV 511, RTV 560, RTV 577: These two-component RTV silicone encapsulants offer moderate strength for extended low temperature applications to -175F (-115C). Some grades provide thermal insulation and offer excellent performance properties for cryogenic and aerospace applications. RTV 511: Pourable, self-leveling product for potting, encapsulating and coating circuit assemblies and components encountering temperatures between -175 and 400F (-115 and 204C). RTV 560: Medium viscosity product offers both high- and low-temperature performance, between -175 and 500F (-115 and 26OC) for continuous operation and up to 600F (316C) for short periods. Suitable for aerospace, mechanical and insulation applications. RTV 577: Paste-consistency product for aerospace sealing and insulation applications. Offers a wide temperature performance range, from -175 to 400F (-115 to 204C).

582


GE SILICONES: Encapsulants

(Room Temperature Cure):

RTV 11: General Purpose Typical Properties: Color: White Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, %: 100 Viscosity, cps (8 25C, 77F): 11,000 Specific Gravity: 1.19 Hardness, Shore A Durometer: 41 Tensile Strength, psi (kg/cm 2): 350 (25) Elongation, %: 150 Tear Resistance lb/in (kg/cm): 20 (3.5) Dielectric Strength, volts/mil: 500 (19.7) Dielectric Constant (1000 Hz): 3.4 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 9 x 10 14 Useful Temperature Range, F (C): -65 to 400 (-54 to 204) RTV 12: Soft General Purpose Typical Properties: Color: Clear Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2O:l Silicone Content, %: 99 Solvent Type: Min. Spirits Viscosity, cps (8 25C, 77F): 1500 Specific Gravity: 1.00 Hardness, Shore A Durometer: 18 Tensile Strength, psi (kg/cm 2): 100 (7) Elongation, %: 200 Tear Resistance lb/in (kg/cm): 10 (2.0) Dielectric Strength, volts/mil (kV/mm): 400 (15.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 13 Useful Temperature Range, F (C): -75 to 400 (-60 to 204)



583

(Room Temperature Cure) (Continued):

RTV 21: General Purpose Typical Properties: Color: Pink Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, 3: 100 Viscosity, cps (@ 25C, 77F): 26,000 Specific Gravity: 1.32 Hardness, Shore A Durometer: 45 Tensile Strength, psi (kg/cm 2): 400 (28) Elongation, 3: 180 Tear Resistance, lb/in (kg/cm): 25 (4.5) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 3.4 Dissipation Factor (1000 Hz): 0.01 Volume Resistivity, ohm-cm: 9.0 x 10 14 Useful Temperature Range, F (C): -65 to 400 (-54 to 204) RTV 31: High Temp Typical Properties: Color: Red Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, 3: 100 Viscosity, cps (@ 25C, 77F): 25,000 Specific Gravity: 1.42 Hardness, Shore A Durometer: 54 Tensile Strength, psi (kg/cm '2): 500 (35) Elongation, %: 100 Tear Resistance, lb/in (kg/cm): 30 (5.0) Dielectric Strength. volts/mil (kV/mm): 500 (19.7) Dielectric Constant'(1000 Hz): 3.6 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 2.9 x 10 15 Useful Temperature Range, F (Cl: -65 to 500 (-54 to 260)

584




RTV 41: General Purpose Typical Properties: Color: White Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, %: 100 Viscosity, cps (a 25C, 77F): 39,000 Specific Gravity: 1.31 Hardness, Shore A Durometer: 47 Tensile Strength, psi (kg/cm 2): 350 (25) Elongation, %: 150 Tear Resistance, lb/in (kg/cm): 25 (4.5) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 3.4 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 9.0 x 10 14 Useful Temperature Range, F (C): -65 to 400 (-54 to 204) RTV 60: High Temp Flowable Typical Properties: Color: Red Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 47,000 Specific Gravity: 1.48 Hardness, Shore A Durometer: 57 Tensile Strength, psi (kg/cm 2): 750 (53) Elongation, %: 120 Tear Resistance, lb/in (kg/cm): 40 (7.0) Dielectric Strength. volts/mil (kV/mm): 500 (19.7) Dielectric Constant.(lOOO Hz): 3.7 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 1.3 x 10 14 Useful Temperature Range, F(C): -65 to 500 (-54 to 260)



585


RTV 88: High Temp Paste Typical Properties: Color: Red Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, 8: 100 Viscosity, cps (8 25C, 77F): 880,000 Specific Gravity: 1.47 Hardness, Shore A Durometer: 58 Tensile Strength, psi (kg/cm 2): 850 (60) Elongation, %: 110 Tear Resistance, lb/in (kg/cm): 40 (7.0) Dielectric Strength. volts/mil (kV/mm): 500 (19.7) Dielectric Constant'(1000 Hz): 3.7 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 1 x 10 14 Useful Temperature Range, F (C): -65 to 500 (-54 to 260) RTV 511: Low Temp Flowable Typical Properties: Color: White Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, %: 100. _ Viscosity, cps (@ 25C, 77F): 16,000 Specific Gravity: 1.21 Hardness, Shore A Durometer: 42 Tensile Strength, psi (kg/cm 2): 380 (27) Elongation, %: 170 Tear Resistance, lb/in (kg/cm): 20 (3.5) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 4.1 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 2 x 10 14 Useful Temperature Range, F (C): -175 to 400 (-115 to 204)

586




RTV 560: High/Low Temp Flowable Typical Properties: Color: Red Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): ZOO:1 Silicone Content, 8: 100 Viscosity, cps (8 25C, 77F): 30,000 Specific Gravity: 1.42 Hardness, Shore A Durometer: 55 Tensile Strength, psi (kg/cm 2): 690 (48) Elongation, %: 120 Tear Resistance, lb/in (kg/cm): 20 (3.5) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 4.1 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 2 x 10 14 Useful Temperature Range, F (C): -175 to 500 (-115 to 260) RTV 577: Low Temp Paste Color: White Cure Conditions: RT Mix Ratio (Base to Curing Agent, by Weight): 2OO:l Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 700,000 Specific Gravity: 1.35 Hardness, Shore A Durometer: 48 Tensile Strength, psi (kg/cm 2): 440 (31) Elongation, %: 150 Tear Resistance, lb/in (kg/cm): 25 (4.5) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 4.1 Dissipation Factor (1000 Hz): 0.02 Volume Resistivity, ohm-cm: 2 x 10 14 Useful Temperature Range, F (C): -175 to 400 (-115 to 204)



(RT or Heat Cure):

RTV 615: High Strength Typical Properties: Color: Clear Cure Conditions: RT/Heat Mix Ratio (Base to Curing Agent, by Weight): 10:1 Silicone Content, %: 100 Viscosity, cps (8 25C, 77F): 4000 Specific Gravity: 1.02 Hardness, Shore A Durometer: 45 Tensile Strength, psi (kg/cm 2): 900 (63) Elongation. %: 150 Tear-Resistance, lb/in (kg/cm): 25 (4.0) Dielectric Strenqth, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 15 Useful Temperature Range, F (C): -65 to 400 (-54 to 204) RTV 627: Flame Retardant UL94 V-l/V-O General Purpose Typical Properties: Color: Black Cure Conditions: RTfHeat Mix Ratio (Base to Curing Agent, by Weight): 100 Silicone Content, %: 100 Viscosity, cps (@ 25C, 77F): 1270 Specific Gravity: 1.38 Hardness, Shore A Durometer: 62 Tensile Strength, psi (kg/cm 2): 500 (35) Elongation, 8: 100 Tear Resistance, lb/in (kg/cm): 15 (3.0) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.006 Volume Resistivity, ohm-cm: 5.7 x 10 14 Useful Temperature Range, F (C): -65 to 400 (-54 to 204)

587

588



(RT or Heat Cure) (Continued):

RTV 655: High Strength Low Temp Typical Properties: Color: Clear Cure Conditions: RT/Heat Mix Ratio (Base to Curing Agent, by Weight): 1O:l Silicone Content, %: 100 Viscosity, cps (a 2X, 77F): 5000 Specific Gravity: 1.06 Hardness, Shore A Durometer: 45 Tensile Strength, psi (kg/cm 2): 900 (63) Elongation, %: 150 Tear Resistance, lb/in (kg/cm): 25 (4.0) Dielectric Strength, volts/mil (kV/mm): 500 (19.7) Dielectric Constant (1000 Hz): 3.0 Dissipation Factor (1000 Hz): 0.001 Volume Resistivity, ohm-cm: 1 x 10 15 Useful Temperature Range, F (C): -175 to 400 (-115 to 204)


589

GENERAL POLYMERS CORP.: POLYCAST 25 Epoxy Resin Compound: POLYCAST 25 is a black, filled, epoxy resin compound that is specifically developed for potting and encapsulating electrical and electronic components. Its most distinguishing features include: ease of handling, ready cure at room temperature, minimum settling upon storage, and excellent physical and electrical properties. Constants: Color: Black Specific gravity @ 25C: 1.55 Viscosity, poises: 190 Cured Product: Typical properties of POLYCAST 25 as cured with tetraethylenepentamine are as follows: Dielectric Constant, 60 cycles: 4.64 1 megacycle: 4.10 Volume Resistivity, ohm-cm: 4.2 x 10 13 Dielectric Strength, S/T, V/M: 448.0 Dissipation Factor, 60 cycles: (1 % 1 megacycle: 2.329% Shrinkage upon cure: 0.29% Coefficient of linear thermal expansion, -30 to +3OC., in./in./C.: 3.8 x 10 -5 Flammability: non-burning POLYCAST 62 Epoxy Resin System: A two component, filled, room temperature curing epoxy resin system specifically developed for potting and encapsulating electrical and electronic components. POLYCAST 62A Resin: Color: Cream Viscosity, 25C. poises: Specific gravity: 1.56 Mix ratio, by weight: 6 by volume: 4

90

POLYCAST 62B Hardener: Color: Clear, Amber Viscosity, 25C. poises: 4.5 Specific gravity: 0.98 Mix ratio, by weight: 1 by volume: 1 Pot life, 100 gm. mass @ RT: 30 minutes Exotherm, C: 80 Cure: Room temperature Hardness, Shore D: 75

590


GENERAL POLYMERS CORP.: POLYCAST XP-242 Epoxy Resin System: POLYCAST XP-242 is a two component, quick room temperature curing, self extinguishing, filled epoxy resin system that has been specifically developed for potting and encapsulating electrical and electronic components. It consists of XP-242A Resin and XP-242B Hardener that are used at a resin to hardener ratio of 5:l by weight or 3:l by volume. Mixed at the above ratio, the system sets at room temperature into a hard self extinguishing plastic with excellent insulating qualities. Constants: XP-242A Resin: Color: Yellow, Black or Red Viscosity, 25C, poises: 100-140 Specific gravity, 25C.: 1.66 Mix Ratio, by weight: 5 by volume: 3 Pot Life, 100 gm. mass @ RT: 15-20 minutes XP-242B Hardener: Color: Clear, amber Viscosity, 25C, poises: 8-12 Specific gravity, 25C.: 0.98 Mix Ratio, by weight: 1 by volume: 1 Cured Product: Hardness, Shore D: 85 Tensile strength, psi: 6500 Elongation %: 1 Tensile Modulus, psi x 10 -5: 9.25 Dielectric Constant @ 60 cycles: 4.3 @ 1 megacycle: 3.8 Dissioation Factor: 0.037 Volume Resistivity, ohm-cm.: 3.27 x 10 14 Dielectric Strenqth, volts/mil: 475 Arc Resistance, seconds: 146 Flammability: Self Extinguishing


591

KEY POLYMER CORP.: Epoxy Products: Potting Compounds: C6-192A/B: Two component, flame retardant potting compound Type: Black, two part room temp. cure Cure Schedule: 7 days @ 22C or 2 hrs. @ IOOC Consistency: Low Viscosity Liquid Specific Gravity: 1.50 Storage Information: Store 25C or below for one year in sealed containers Comments: Good chemical resistance. Low shrinkage. Flame retardant. C4-228A/B: Two component, flexible, epoxy potting or casting compound Type: Two part heat cure Cure Schedule: 3 hrs. @ 121C plus 1 l/2 hrs. @ 15OC, plus 1 hr. @ 175C Consistency: Low Viscosity Liquid Specific Gravity: 1.06 Storage Information: Store 25C or below for up to one year in sealed containers Comments: Recommended for electrical coil and printed circuit board encapsulation. c4-177: One component, epoxy adhesive and potting compound Type: Black, one part heat cure Cure Schedule: 2 hrs. @ 121C, or 1 hr. @ 150~, or l/2 hour @ 176C Consistency: Low Viscosity Liquid Specific Gravity: 1.50 Storage Information: Store OC for up to one year in sealed containers Comments: Exceptional thermal shock properties. Class F service temperature rating. C4-243: One component, epoxy adhesive and potting compound Type: Black, one part, heat cure Cure Schedule: 4 hrs. @ 121C, or 2 hrs. @ 150~ Consistency: Medium Viscosity Liquid Specific Gravity: 1.49 Storage Inforamation: Store OC for up to one year in sealed containers Comments: Class F service temperature rating. High thermal conductivity C6-176: One component, low temperatuee cure adhesive and potting compound Type: Tan, one part, heat cure Cure Schedule: 1/2 hr. @ 121C, or 5 min. @ 16OC, or 2 min. @ 175c Consistency: Low Viscosity Liquid Specific Gravity: 1.49 Storage Information: Store OC for up to one year Comments: Fast cure at moderaate temperature. High heat & chemical resistance.

592


MAGNOLIA PLASTICS INC.: Electrical Systems: MAGNOLIA 3068 Potting and Casting Resin: MAGNOLIA 3068 is a two component epoxy resin based compound designed for potting and casting applications where a high degree of electrical insulation is required over a wide range of temperatures. Although this product will cure at temperatures as low as 95C, it gives good properties to temperatures in excess of 200C. Special Features: This inert-filled svstem is surorisinqlv fluid. When heated to only 54C, it can be-evacuated (29 inches of Mercury vacuum) to produce a bubble-free casting. It is suitable for use in Class H insulation areas. Physical Properties: Color: Black Specific Gravity (mix): 1.7 Mix Ratio: 100:8 by weight, A:B Viscosity @ 25C (mix): 40,000 Pot Life 8 25C (3 oz): Greater than 5 hours @ 54C (3 oz): 1 hour Cure Schedule: Gel @ 25C (30 hours) plus 1 hour @ 121C Alternate Cure Schedule: Gel @ 75C (l-l l/2 hours) plus 1 hour @ 121C MAGNOLIA 3071: MAGNOLIA 3071 is a two part room temperature curing epoxy compound designed for use on all types of film capacitors. This product does not attack polycarbonate film. Electrical properties are excellent even at temperatures in excess of 125C. Special Features: 1. Electrical properties hold up extremely well at high temperatures. The good properties of polycarbonate capacitors are matched by those of 3071. 2. MAGNOLIA 3071 does not contain 4'4 methylene dianiline. 3. MAGNOLIA 3071 can be made in a wide variety of colors. Properties of Uncured Material: Part A: Specific Gravity: 1.16 Viscosity @ 25C: 1,900 cps SPI Classification: 4 Flash Point: >lOOC Part B: Specific Gravity: 1.00 Viscosity @ 25C: 1,100 cps SPI Classification: 4 Flash Point: >lOOC


593

MAGNOLIA PLASTICS INC.: Electrical Systems (Continued): MAGNOLIA 3075: MAGNOLIA 3075 is a two component epoxy compound developed specifically for the electrical capacitor industry as an endseal. This system is also used widely for potting coils, circuitry involving a wide range of electrical components and other systems manufactured for the telecommunications industry. Special Features: 1. Low surface tension combined with low viscosity gives excellent "bubble breaking" properties, thus insuring a glossy surface free of imperfections. 2. 3075 is available in a wide range of colors. Some examples are light and medium yellow, green, black, white and blue. 3. MAGNOLIA 3075 can be used with several curing agents depending on the specific application. For example: 3075-B: Mix Ratio: 100114 Pot Life: 14 minutes Special Feature: Fast cure. 3085-B: Mix Ratio: 100/23 Pot Life: 30 minutes Special Feature: Longer pot life and lower viscosity 3087-B: Mix Ratio: 100/23 Pot Life: 20 minutes Special Feature: High impact strength. Good moisture resistance. 384-B: Mix Ratio: 100/36 Pot Life: 30 minutes Special Feature: For polycarbonate capacitors. Good color stability especially in light yellows. 3096-B: Mix Ratio: 100/30 Pot Life: 9 minutes Special Feature: Fast cure. Good thermal shock. 3094-B: Mix Ratio: 100/30 Pot Life: 48 minutes Special Feature: Does not attack polycarbonate film. Good color stability.

594


MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3106: MAGNOLIA 3106 is a two part epoxy compound used for sealing capacitors in automated production facilities. This product has excellent electrical properties, flame retardance, moisture resistance and a good combination of long pot life and fast cure. Special Features: 1. Fast cure. Five to ten minutes at IOOC does the job even in large box capacitors. 2. Does not hard settle. There is no caking or packing in lines and pumps of automatic dispensing equipment. 3. Low in skin irritation potential. Properties of Uncured Material: Viscosity: Part A: 4,000 cps Part B: 178 cps Mix: 1,300 cps Cure Schedule: 8-12 hr. at 25C or 5 to 10 minutes at IOOC or 10 to 20 minutes at 85C Pot Life @ 25C: 50 minutes SPI Classification: Part A: 4/Part B: 4 MAGNOLIA 3128: MAGNOLIA 3128 is a two part epoxy compound having low exotherm, outstanding electrical characteristics and flame retardancy. 3128 has been used for sealing capacitors, transformers, EM1 filters, RC networks, and ballasts. Special Features: 1. Flame retardancy meeting UL method 94V0. 2. Peak exotherm of 116C (100 grams in 3 oz. mass). 3. Volume resistivity exceeds 20,000,000,000 ohm-cm at 155C. Properties of Uncured Material: Color: Part A: Blue Part B: Clear Mix: Blue Viscosity 25C: Part A: 20,000 cps Part B: 100 cps Mix: 4,000 cps Specific Gravity: Part A: 1.5 Part B: .9 Mix: 1.4 SPI Classification: Part A: 2 Part B: 4 Mixing Instructions: Mix Ratio: Parts by weight A:B: 100/8 Parts by volume A:B: 100/14

Encapsulating, Potting, Casting Impregnating Compounds

595

MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOBOND 3227 A & B: MAGNOBOND 3227 is a two part epoxy resin compound used for potting of transformers and coils. Special Features: This reliable, low cost epoxy has been formulated as a low viscosity, non-abrasive potting compound to produce bubble-free castings. Properties of Uncured Material: Color: A: Black B: Clear Mix: Black Viscosity: A: 9,000 cps 200 cps B: Mix: 5,200 cps Specific Gravity: A: 1.61 B: -96 Mix: 1.58 SPI Classification: A: 2 B: 4 Mixing Instructions: Mix Ratio: Parts by Weight A & B: 100:5 Pot Life: 31 minutes Cure Schedule: 2-4 hours set 24-40 hours full cure Cured Properties: Shore D Hardness: 85

Compound 3241 Black: Compound 3241 is a single component epoxy material designed for the potting and encapsulation of solenoids and coils. Special Features: 1. Compound 3241 has a low viscosity for fast processing and good penetration of coils. 2. Compound 3241 cures quickly: 12 minutes at 300F. Properties of Uncured Material: Color: Black Viscosity: 7,000 cps Specific Gravity: 1.55 SPI Classification: 2 Flash Point: 200F Cure Schedule: 12 minutes @ 300F or l-2 hours @ 250F. Cured Properties: Dielectric Strength, volts per mil: Short time test: 655

596


MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): Epoxy Potting Compound 3265: Compound 3265 is an epoxy resin casting and potting compound. It is designed to protect electrical devices from extremes in humidity and temperatures. The convenient I:1 by volume mix ratio makes this product an excellent choice for automatic production. Its low shrinkage eliminates excessive stress on the encapsulated unit. Physical Properties: Part A: Color: Off-White Specific Gravity: 1.57+-.07 Mix Ratio (by weight): l.OO+--05 Mix Ratio (by volume): l.OO+-.05 Viscosity: 6500+-1500 cps Part B: Color: Black Soecific Gravitv: 1.64+-.07 Mix Ratio (by weight): 1.05+--05 Mix Ratio (by volume): l.OO+--05 Viscosity: 3000+-1000 cps Mix: Color: Black Specific Gravity: 1.63+-.07 Viscosity: 3500+-1500 cps Cure Schedule (700 Grams @ 77 deg F): 3-5 Days Gel Time (3 fluid oz. @ 150 deg F): 28+-5 Minutes Compound 3292-3 A & B: Compound 3292-3 is a lightweight, electrical potting compound. Special Features: Compound 3292-3 gives a minimum separation of the glass beads during cure. The cured mass is uniform in density. Properties of Uncured Material: Color: Mix: Off-White Viscosity: A: 10,000 i3: 4,000 Mix: 10,000 SPI Classification: A: 4 B: 4 Mixing Instructions: Mix Ratio: Parts by weight A/B: 713 Pot Life: 1 hour Cure Schedule: 24 hours @ 77F: Set 7 days: Full Cure


597

MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3347: MAGNOLIA 3347 is a single component, low ViSCOSity, epoxy material with excellent electrical properties at elevated temperatures. Special Features: MAGNOLIA 3347 is especially formulated for the impregnation of electrical and electronic units such as coils, capacitors, transformers, and solenoids. Properties of Uncured Material: Color: Amber Viscosity: 500 cps Specific Gravity: 1.15 SPI Classification: 2 Flash Point: >lOOC Mixing Instructions: Pot Life: 22 minutes @ 125C Cure Schedule: 2 to 4 hours @ 125-135C MAGNOLIA 3360, A & B: MAGNOLIA 3360, Parts A & B, is an unfilled epoxy system for encapsulating electronic circuitry in a sand-filled aluminum container. At 85C, this system is extremely fluid and will replace the air from the unit. For 6 to 8 minutes at 85C, this fluid condition will prevail, wetting the walls of the housing and allowing trapped air to migrate to the surface. The low surface tension of MAGNOLIA 3360 promotes easy bubble breaking and generally provides a slick appearance to the top surface of the fully cured unit. Special Features: This system will stretch under thermal or mechanical stress so that repeated thermal shocks (from +125C to -40C) do no harm to either the electrical functionality or the mechanical integrity of properly potted products. Properties: Specific Gravity: Part A: 1.1 Part B: 1.0 Mix: I, .1 Color: Part A: Clear Amber Part B: Clear Orange Mix: Clear Orange Mix Ratio, A:B by weight: 100:86 A:B by volume: I:1 Viscosity @ 25C: Part A: 6000 cps Part B: 500 cps Mix: 1700 cps Viscosity @ 85C: Mix: 70 cps

598


MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3376, A & B: MAGNOLIA 3376 is a special black epoxy material that meets or exceeds the requirements of MIL-I-16923. Special Features: 1. MAGNOLIA 3376 is QPL .isted to MIL-I-16923G. 2. MAGNOLIA 3376 has a long pot life for ease of handling, but it will set over night and cure fully in seven days at room temperature. 3. MAGNOLIA 3376 can be heat cured as follows: 2-4 hours @ 25C Set; followed by 2 hours @ 80C plus 2 hours @ 130-150C. 4. MAGNOLIA 3376 has a heat deflection temperature (ASTM D648) of 13oc. 5. MAGNOLIA 3376 has excellent thermal cycling resistance from -55C to +13OC. 6. MAGNOLIA 3376 is available in pre-measured 5 gallon kit form or in regular packaging. Uncured Properties: Specific Gravity: Part A: 1.65 Part B: 1.09 Mix: 1.54 Viscosity @ 25C: Part A: 16,800 cps Part B: 2,300 cps Mix: 16,000 cps Mix Ratio: A:B by weight: 100:14 A:B by volume: 5:l Pot Life @ 25C 3 oz. mass: 2-I/2-3 hrs Compound 3377: Compound 3377 is a general purpose potting compound which exhibits excellent electrical and hydrolytic stability characteristics. It meets or exceeds the requirements of MIL-I-16923G and does not contain MDA. Physical Properties: Part A: Color: White Specific Gravity: 1.55 Mix Ratio: (parts by weight): Viscosity: 10,080 cps Part B: Color: Amber Specific Gravity: 1.03 Mix Ratio: (parts by weight): Viscosity: 2,230 cps Mix: Color: Light Tan Specific Gravity: 1.47 Viscosity: 5,740 cps

100

11

Encapsulating,

Potting, Casting, Impregnating

Compounds

599

MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3378, A & B: MAGNOLIA 3378 is a two part epoxy potting system having good physical, electrical, and thermal properties. Special Features: 1. This system is designed to be compatible with automatic mixing and dispensing equipment. 2. Low coefficient of linear thermal expansion. 3. Safe system - No MDA or VCHD Uncured Properties: Part A: Specific Gravity: 1.5 Viscosity: 10,000 Part B: Specific Gravity: 1.6 Viscosity: 8,000 Mix: Specific Gravity: 1.5 Viscosity: 14,000 Mix Ratio: 100:38 parts by weight or 2.75:1 by volume Cure Schedule: Overnight at R.T. followed by 2 hours @ 150-200F MAGNOLIA 3390: MAGNOLIA 3390 is a two part dielectric gel designed to protect electronic circuits from moisture. This two part epoxy compound features good resistance to moisture and a high degree of flexibility. 3390 is very soft yet tough. Special Features: 1. Very good adhesion to both metal and plastic cases. 2. Reoairs are easilv made to electronics bv cutting throush 3390 then retaping 3. Even after 100 hours in a pressure cooker at 122C and 15 pounds per square inch pressure, there is no evidence of reversion. Properties: Part A: Specific Gravity: 1.1 Viscosity: 400 cps SPI Classification: 4 Flash Point: >lOOC Part B: Specific Gravity: 1.0 Viscosity: 400 cps SPI Classification: 4 Flash Point: >lOOC Mix: Specific Gravity: 1.1 Viscosity: 400 cps

600


MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3445: MAGNOLIA 3445 is a two part oven curing semi-rigid epoxy resin system used for encapsulating and potting electronic and electrical components of all kinds. MAGNOLIA 3445 resists temperatures to 16OC, offers resistance to thermal shock and has low shrinkage and thermal expansion. Special Features: 1. This system is tough. Stress caused by extremes of hot and cold, potted inserts and shrinkage are withstood without cracking. 2. Class F insulation. Electrical properties are maintained to temperatures of 180C. 3. A lower viscosity version (unfilled) is available called MAGNOLIA 3035. Physical Properties: Specific Gravity: Part A: 1.6 Part B: 1.6 Mix: 1.6 Viscosity @ 25C: Part A: 56,000 cps Part B: 21,000 cps Mix: 42,000 cps SPI Class: Part A: 2 Part B: 2 MAGNOLIA 3481: MAGNOLIA 3481 is a two component self extinguishing epoxy potting compound for box capacitors. This product has low viscosity for ease of application in small size cases and excellent bubble breaking characteristics. Special Features: 1. Good moisture resistance. 2. Extra long oat life vet cures at 80-9OC. 3. Flame retardant to pass UL 94 VO and UL 1414. 4. 3481 contains fine particle fillers which go through small orifices without clogging. 5. A thinner version called MAGNOLIA 3482 is available. Physical Properties: Specific Gravity: Part A: 1.5 Part B: I.'0 Mix: 1.4 Color: Part A: Blue Part B: Green Mix: Blue Gel Time 15 gram: 70C: 120 min. 80C: 50 min. 85C: 40 min. SPI Class: Part A: 4 Part B: 4

Encapsulating,

Potting,

Casting, Impregnating

Compounds

601

MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3500: MAGNOLIA 3500 is a two part cycloaliphatic epoxy system featuring low viscosity for good penetration, good thermal cycling properties and outstanding electricals especially after outdoor exposure. Properties of Uncured Material: Part A: Specific Gravity: 1.36 Viscosity @ 25C: 1,500 cps SPI Classification: 4 Flash Point: >lOOC Part B: Specific Gravity: 1.17 Viscosity @ 25C: 100 cps SPI Classification: 4 Flash Point: >lOOC Mix: Specific Gravity: 1.29 Viscosity @ 25C: 580 cps Mixing Instructions: Mix Ratio, parts by weight, A:B: 100:45 Pot Life @ 25C: >8 hours Cure Schedule: 2 hours @ 120C MAGNOLIA 3503: MAGNOLIA 3503 is a two part cycloaliphatic epoxy resin casting compound designed for encapsulating high performance electrical products. Special Features: 1. Thermal shock properties on 3503 are outstanding, especially for a rigid epoxy. Large capacitors encapsulated with 3503 have passed thermal cycling tests to -60C. Compressive strength and rigidity are high enough to support structural loading. 2. Electrical properties with 3503 are excellent over an extremely wide temperature range. 3. Working life after mixing A & B is very long. Even when preheated to 6OC, material can be used for several hours. Properties: Specific Gravity: Compound (Part A): 1.8 Curina Asent (Part B): 1.5 Mix (A &-B): i.6 Viscosity: Mix (A & B): 40,000 cps Mix Ratio: 100 parts by weight Part A 102 parts by weight Part B Pot Life: >6 hours at 25C Cure Schedule: Gel at 125C for 2 to 3 hours followed by 3 to 5 hours at 150C for full cure.

602

Adhesives,

Sealants


Industry

MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3913: MAGNOLIA 3913 is a two part epoxy system specially formulated as a dip coating for toroidal transformers and other electrical components requiring a tough, semi-flexible insulating material. Special Features: This two component epoxy has a 3 to 3-l/2 hour pot life in a one pound mass and produces a coating thickness of 15 to 20 mils per dip with agitation or vibration. It will cure to a tough semi-flexible coating providing good electrical insulation when the optimum cure schedule is used. Properties of Uncured Material: Part A: Color: Black Viscosity: 22,000 cps Specific Gravity: 1.1 SPI Classification: 4 Part B: Color: Tan Viscosity: 16,000 cps Specific Gravity: 1.0 SPI Classification: 4 Mix: Color: Black Viscosity: 15,000 cps Specific Gravity: 1.1 MAGNOLIA 3974: MAGNOLIA 3974 is a two part epoxy dip coat for capacitors. Special Features: MAGNOLIA 3974 is a 100% solids system possessing a pot life of 6-8 hours when used in dipping trays of approximately 1 inch depth. Part. A:

Color: Green Viscosity: 164,000 Specific Gravity: 1.24 SPI Classification: 2 Part B: Color: Natural Viscosity: 17,500 Specific Gravity: 1.03 SPI Classification: 4 Mix: Color: Green Viscosity: 33,000 Specific Gravity: 1.20 Thixotropic Index: 4.5


603

MAGNOLIA PLASTICS, INC.: Electrical Systems (Continued): MAGNOLIA 3997: MAGNOLIA 3997 is a two part epoxy compound designed for use in a wide variety of electrical potting, encapsulating and impregnating applications. MAGNOLIA 3997 will provide a broad range of temperature extremes. Special Features: 1. The good thermal shock resistance of MAGNOLIA 3997 is demonstrated by its ability to pass 10 cycles using the difficult Olyphant washer test. 2. The combination of good tensile strength and high elongation demonstrates the toughness of 3997. 3. For large castings, the unit can be filled with coarse particle size sand prior to adding the epoxy mixture. Because 3997 remains fluid prior to gelling, it will penetrate completely through the sand. This procedure is helpful in reducing overall part cost without hurting physical and electrical properties. Properties of Uncured Material: Part A: Specific Gravity: 1.1 Viscosity @ 20C: 4,300 cps SPI Classification: 4 Flash Point: >lOOC Part B: Specific Gravity: 1.0 Viscosity @ 20C: 2,200 cps SPI Classification: 4 Flash Point: >lOOC Mix: Specific Gravity: 1.1 Viscosity @ 25C: 2,400 cps Mixing Instructions: Pot Life: >a hours @ 25c Gel Time: ia minutes @ 120C Cure Schedule: IS hours @ 75C or 2-4 hours @ 125C Mix Ratio: 1:l parts by volume

604


MAGNOLIA

PLASTICS,

INC.:

Electrical Systems (Continued):

MAGNOLIA 9001: MAGNOLIA 9001 is a two part urethane potting compound designed to protect delicate electronic components over a wide range of temperatures. Special Features: 1. Good chemical resistance. MAGNOLIA 9001 keeps harsh chemicals away from extremely sensitive electronics assemblies. 2. MAGNOLIA 9001 is easily removed from the potted unit for repair of defective components. After the-repair is complete, the 9001 patch will bond fully to the rest of the potting compound. 3. MAGNOLIA 9001 will withstand extremes in temperature. It will not stress components even at very low temperatures. Extended periods at 140C show no tendency toward age hardening or embrittlement. Properties: Specific Gravity: Resin - .99 Curing Agent - .91 Mix - .95 Viscosity, cps: Resin - 100 Curing Agent - 1000 Mix - 480 Mix Ratio: 1 to 1 by weight Pot Life, minutes at 7lF: 15 MAGNOLIA 9002: MAGNOLIA 9002

is a two part urethane compound having a Shore A hardness of 90. The product is used to encapsulate electronic components having a service temperature range of -40C to +125C.

Properties: Specific Gravity: A: 1.2 B:’

1.0

Mix: 1.1 Viscosity: A: 60 cps B: 450 cps Mix: 265 cps Mix Ratio: 48 parts by weight A 100 parts by weight B 3 oz. Pot Life: >2 hours Cure Schedule: 2-4 hours at 65C-85C


MAVIDON CORP.: Encapsulants: 6135 Semiconductor Encapsulant: MAVIDON 6135 is a thixotropic, high purity, two-part epoxy glob top encapsulant. 6135 is heavily filled to reduce the shrinkaae _ durina cure and to reduce the coefficient of expansion of the cured resin. Since 6135 is an epoxy, it has _ excellent solvent resistance to chlorinated and fluorinated defluxing systems normally used by the electronic industry. Physical Characteristics: 6135 A: Aonearance: Black Paste Viscosity @ 25C (77F): 200,000 Shelf Life @ 25C (77F): 6 nos. Specific Gravity: 1.6 Density (Lb/gal): 13.3 6135 B: Appearance: Beige Liquid Viscosity @ 25C (77F): 50,000 cps Shelf Life @ 25C (77F): 6 mos. Specific Gravity: 1.6 Density (Lb/gal): 13.3 Mix Ratio: 100 parts 6135 A to 90 parts 6135 B by weight. Cure Schedule: Gel: 1 hour at 1OOC Cure: 1 hour at 150C Cured Properties: Appearance: Black Coefficient of Thermal Expansion: 20-30 ppm/C Heat Distortion Temperature: 15OC Hardness (Shore D): 93 Hydrolyzable Chloride: t25 ppm Dielectric Constant (1 kHz): 3.5 Dissipation Factor (1 kHz): 0.005 Opearating Class: F (155C)

605

606


MAVIDON CORP.: Encapsulants

(Continued):

9213-I Epoxy Casting Compound: MAVIDON LS 9213-1 is a one component epoxy coating and impregnating compound featuring low viscosity, good moisture resistance and excellent dielectric properties. Typical applications include transformer impregnation and casting and electrical laminations. Physical Characteristics: Appearance: Black Liquid Viscosity @ 25C (77F): 1200 cps Snecific Gravitv: 1 .I Solids Content:-100% Shelf Life @ 25C (77F): 4 months @ OC (32F): 1 year Cure Schedule: Cure schedules are dependent upon mass and temperature. Typical cure schedules when used as a coating compound are as follows: 1 hour at 121C (250F) 4 hours at 105C (22lF) 8 hours at 93C (200F) Tvoical Cured Characteristics: *-AIEE Operating Class: 155C Class F Dielectric Constant (IO 3 Hz): 340 Dissination Factor (IO Hz): .022 Dielectric Strength (VoltjMil): 480 Volume Resistivity (ohm-cm): 2 x 10 15 Shore Hardness: 70D Percent Elongation: 5% 619-4 Casting Compound: MAVIDON System LD 619-4 is a low viscosity, two component casting compound. LD 619-4 meets the requirements for UL94VO.

LD

Physical Characteristics: A: LD 619-4 Appearance: Grey Liquid Viscosity @ 25C (77F): 3500 cps Density (lb/gal): 11.0 Shelf Life @ 25C (77F): 6 months LD 619-4 B: Appearance: Clear Liquid Viscositv @ 25C (77F): 40 cus Density ilb/gal)I 8.6 L Shelf Life @ 25C (77F): 6 months

Encapsulating, Potting, Carting, Impregnating Compounds


(Continued):

LD 619-4 Casting Compound (Continued): Mix Ratio: By Weight: 100 parts LD 619-4 A to 14 parts LD 619-4 B By Volume: 10 parts LD 619-4 A to 1 part LD 619-4 B Pot Life: 90 minutes in a 100 gram mass @ 25C (77F) Cure Schedule: 8 hours at room temperature for handling strength, 24 hours at room temperature for full cure. Cure can be accelerated by allowing system to gel at room temperature followed by a post cure of 1 hour at 60C (140F). Typical Cured Characteristics: Hardness: 72D Flexural Strength: 12,000 psi Compressive Strength: 15,000 psi Dielectric Strength: 430 volts Flammability Index: VO Service Temp: 250F continuous LV 7836 Potting Compound: MAVIDON LV 7836 is a one part potting compound featuring very low viscosity, long pot life, low temperature cure, and good thermal stability upon curing. Physical Characteristics: Color: Black % Filler: 0 Snecific Gravitv @ 25C (77F): 1.1 Viscosity @ 25C-(77F): 500-700 cps Flash Point, C (F): 73C Weight per Gal.: 9.5 Shelf Life @ 25C (77F): 3 months at OC Pot Life: 5 days at 25C (771")in a 50 gram mass. Cure Schedule: 2 hours at 80C or 1 l/2 hours at 9OC Typical Cured Characteristics: Volume Resistivity @ 25C (77F): 26 x 10 15 ohm-cm Dielectric Constant @ 25C (77F): 3.9 Dissipation Factor @ 25C (77F): 0.009 Dielectric Strength: 580 V/mil Hardness, Shore: D84 Heat Deflection Temperature: IOOC Linear Shrinkage, %: 0.76

607

608



(Continued):

LV 1832 A/B Potting Compound: MAVIDON LV 1832 is a two part, unfilled potting compound featuring very low viscosity, low cure temperature, and good thermal stability upon curing. Physical Characteristics: LV 1832 A: Color: Black % Filler: 0 Specific Gravity @ 25C (77F): 1.1 Viscosity 8 25C (77F): 500-700 cps Weight per Gal.: 9.5 Shelf Life @ 25C (77F): 12 months LV 1832 B: Color: Yellow % Filler: 0 Specific Gravity @ 25C (77F): 1.0 Viscosity @ 25C (77F): waxy solid t25C Weight per Gal.: 8.0 Shelf Life @ 25C (77F): 12 months Mix Ratio: 100 parts LV 1832 A to 4 parts LV 1832 B by weight. Pot Life: 1 day at 25C (77F) in a 50 gram mass. Cure Schedule: 1 l/2 hours at 75C or l/2 hour at IOOC Typical Cured Characteristics: Volume Resistivity @ 25C (77F): 2.6 x 10 15 Dielectric Constant @ 25C (77F): 3.7 Dissipation Factor @ 25C (77F): 0.008 Dielectric Breakdown: 500 V/mil Hardness, Shore: D84 Heat Deflection Temperature: 1OOC Linear Shrinkage, %: 0.76



(Continued):

LE 626 Casting Compound: MAVIDON LE 626 is an economical, low viscosity, black, two component epoxy encapsulating compound which-features a convenient mix ratio by volume. LE 626 cures to yield a very flexible casting. Physical Characteristics: LE 626 A: Appearance: Black Liquid Viscosity @ 25C (77F): 900 cps Density (lb/gal): 8.7 Shelf Life @ 25C (77F): 1 year LE 626 B: Appearance: Amber Liquid Viscosity @ 25C (77F): 500 cps Density (lb/gal): 8.2 Shelf Life @ 25C (77F): 1 year Mix Ratio: By volume: 1 part LE 626 A to 1 part LE 626 B. By weight: 100 parts LE 626 A to 83 parts LE 626 B. Pot Life: 45 minutes in a 50 gram mass @ 25C (77F) Cure Schedule: Overnight at room temperature of 1 hour at 60C (140F) Tvaical Cured Characteristics: -*Hardness: 25D Thermal Expansion Coefficient (in/in F): 60 x 10 -6 Dissipation Factor (10 3 Hz): .039 Thermal Conductivity (BTU/hr Ft 2 f/in): 1.5 Dielectric Constant (IO 3 Hz): 3.9 KE 62602L: Softer, longer potlife modification of LE 626

609

610


PERMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds: For: Potting, Casting, Encapasulating, Adhering. 135: Features: Low Cost Good Flow Machineable Cat & Ratio: INSULCURE 9 or 11 6-7 PHR 8-9 Mixed Vise. Cps.: 6,000 Pot Life Min.: 30 Shrinkage Cm/Cm: 0.002 SP- Gr.: 1.55 Hardness - Shore D: 88 Compressive Strength psi: 16,500 Service Temp. C: 175 Thermal Conductivity: 4.25 Thermal Expansion Cm/Cm/C: 40x10 -6 Vol. Resistivity Ohm. Cm.: 10 15 Dielectric Constant: 60 HZ: 4.5 1 KHZ: 4.4 1 MHZ: 3.7 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.02 Dielectric Strength Volts/Mil: 450 136: Feature: Low cost Versatile Cat & Ratio: INSULCURE 9 or 11 6-7 PHR 8-9 Mixed Vise. Cps.: 23,000 Pot Life Min.: 30 Shrinkage Cm/Cm: 0.002 SP. Gr.: 1.55 Hardness - Shore D: 88 Comwressive Strength wsi: 16,500 Service Temp. C: 175 _ Thermal Conductivity: 4.7 Thermal Expansion Cm/Cm/C: 40x10 -6 Vol. Resistivity Ohm. Cm.: IO 15 Dielectric Constant: 60 HZ: 4.8 1 KHZ: 4.5 1 MHZ: 3.9 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.02 Dielectric Strength Volts/Mil: 450

Impregnating, Dipping,


PBRMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 100-M: Feature: Lowest Cost 1 to 1 Ratio Cat & Ratio: Part B 1 to 1 (Vol.) Mixed Vise. Cps.: 17,000 Pot Life Min.; 80 Shrinkage Cm/Cm: 0.002 Se. Gr.: 1.55 Hardness - Shore D: 75 Compressive Strength psi: 6,800 Service Temp. C: 125 Thermal Conductivity: 3.5 Thermal Expansion Cm/Cm/C: 50x10 -6 Vol. Resistivity Ohm. Cm.: 10 14 Dielectric Constant: 60 HZ: 4.7 1 KHZ: 4.5 1 MHz: 4.4 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.02 Dielectric Strength Volts/Mil: 400 125: Feature: Lowest Viscosity LOW cost Cat & Ratio: INSULCURE 9 & 11 6-7 PHR 8-9 Mixed Vise. CDS.: 1.000 Pot Life Min.; 30 ’ Shrinkage Cm/Cm: 0.002 SD. Gr.f 1.55 Hardness - Shore D: 88 Compressive Strength psi: 12,000 Service Temp. C: 155 Thermal Conductivity: 4.0 Thermal Expansion Cm/Cm/C: 40 x 10 -6 Vol. Resistivitv Ohm. Cm.: IO 14 Dielectric Constant: 60 HZ: 4.4 1 KHZ: 4.2 1 MHZ: 3.9 Dissipation Factor: 60 HZ: 0.01 1 KHZ: 0.02 1 MHZ: 0.04 Dielectric Strength Volts/Mil: 435

611

612


Epoxy Selector Guide INDUSTRIES INC.: INSULCAST for Electrical and Electronic Compounds (Continued):

PERMAGILE

141: Feature: High Thermal Conductivity Good Thermal Shock Cat & Ratio: INSULCURE 9 or 11 3-4 PHR 4-5 Mixed Vise. Cps.: 90,000 Pot Life Min.: 5 hr. Shrinkase Cm/Cm: 0.001 Sp. Gr.; 2.3. Hardness - Shore D: 95 Compresssive Strength psi: 17,000 Service Temo. C: 180 Thermal Conductivity: 10.4 Thermal Expansion Cm/Cm/C: 24 X 10 -6 Vol. Resistivitv Ohm. Cm.: 10 16 Dielectric Constant: 60 HZ: 6.4 1 KHZ: 6.2 1 MHZ: 5.9 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.02 Dielectric Strength Volts/Mil: 500 70-C.C.: Feature: Semi Flexible Low Stress Cat & Ratio: Part B Mixed Vise. Cps.: 7,000 Pot Life Min.: 40 Shrinkage Cm/Cm: 0.001 SD. Gr.: 1.45 Hardness - Shore D: 65 Compressive Strength psi: 5,000 Service Temp. C: i3OC. Thermal Conductivity: 6.0 Thermal Expansion Cm/Cm/C: 7 x 10 -6 Vol. Resistivity Ohm. Cm.: 10 12 Dielectric Constant: 60 HZ: 4.3 1 KHZ: 4.2 1 MHZ: 3.9 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.01 Dielectric Strength Volts/Mil: 390


PERMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 70-C.C.: Feature: Semi Flexible Low Stress Cat & Ratio: Part B Mixed Vise. Cps.: 7,000 Pot Life Min.: 40 Shrinkage Cm/Cm: 0.001 SP- Gr.: 1.45 Hardness - Shore D: 65 Compressive Strength psi: 5,000 Service Temp. C: 13OC Thermal Conductivity: 6.0 Thermal Expansion Cm/Cm/C: 7x10 -6 Vol. Resistivity Ohm. Cm.: 10 12 Dielectric Constant: 60 HZ: 4.3 1 KHZ: 4.2 1 KHZ: 3.9 Dissipation Factor: 60 HZ: 0.02 1 KHZ: 0.01 1 MHZ: 0.01 Dielectric Strength Volts/Mil: 390 333: Feature: Fire Retardant Conforms to U.L. 94V0 Cat & Ratio: INSULCURE 9 or 11 5-6 PHR 7-8 Mixed Vise. Cps.: 2,000 Pot Life Min.: 45 Shrinkage Cm/Cm: 0.002 Sp. Gr.: 1.50 Hardness - Shore D: 85 Compressive Strength psi: 14,000 Service Temp. C: 155 Thermal Conductivity: 4.5 Thermal Expansion Cm/Cm/C: 40x10 -6 Vol. Resistivity Ohm. Cm.: 10 15 Dielectric Constant: 60HZ: 4.5 IKHZ:

4.4

IMHZ: 3.8 Dissipation Factor: 60HZ: 0.02 ~KHZ: 0.01 IMHZ: 0.02 Dielectric Strength Volts/Mil: 430

613

614


PERMAGILE INDUSTRIES INC.: Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 981: Feature: Semi Flexible Superior Hot I.R. Cat & Ratio: Mix A & B 1:l Mixed Vise. Cps.: 40,000 Pot Life Min.: 8 hr. Shrinkage Cm/Cm: 0.003 Sp. Gr.: 1.45 Hardness - Shore D: 65 Compressive Strength psi: N.A. Service Temp. C: 180 Thermal Conductivity: 4.0 Thermal Expansion Cm/Cm/C: 50x10 -6 Vol. Resistivity Ohm. Cm.: 10 14 Dielectric Constant: 60HZ: 4.6 IKHZ: 4.5 1MHZ: 4.4 Dissipation Factor: 60HZ: 0.05 ~KHZ: 0.04 1MHZ: 0.05 Dielectric Strength Volts/Mil: 420 612: Feature: Electra-Conductive Cat & Ratio: INSULCURE 9 2 l/2% Mixed Vise. Cps.: Smooth Paste Pot Life Min.: 60 Shrinkage Cm/Cm: 0.001 Se. Gr.: 3.0 Hardness - Shore D: 95 Compressive Strength psi: Tensile 7,000 Service Temp. C: 175 Thermal Conductivity: 60 Thermal Expansion Cm/Cm/C: 15x10 -6 Vol. Resistivity Ohm. Cm.: 2x10 -4


PERMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 166: Feature: Castable Aluminum Cat & Ratio: INSULCURE 9 or 11 4-5 PHR 7-8 Mixed Vise. CPS.: 15,000 Pot Life Min.; 45 Shrinkage Cm/Cm: 0.002 Sp. Gr.: 1.6 Hardness - Shore D: 85 Compressive Strength psi: 13,000 Service Temp. C: 155 Thermal Conductivity: 8.0 Thermal Expansion Cm/Cm/C: 40x10 -6 174: Feature: Adjustable Flexibility Cat & Ratio: INSULCURE 22 Variable Mixed Vise. Cps.: 40,000 Pot Life Min.: 60 Shrinkage Cm/Cm: 0.002 Sp. Gr.: 1.4 Hardness - Shore D: Adjustable Comoressive Strensth usi: 600 to 8,000 Se&ice Temp. C: i25 _ Thermal Conductivity: 2.4 Thermal Expansion Cm/Cm/C: 50x10 -6 Vol. Resistivity Ohm. Cm.: 10 13 Dielectric Constant: 60HZ: 4.5 1KHZ: 4.1 IMHZ: 3.5 Dissipation Factor: 60HZ: 0.05 ~KHZ: 0.04 IMHZ: 0.03 Dielectric Strength Volts/Mil: 400

61.5

616


PERMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 30: Feature: Soft Gel Repairable R.T. Cure Cat & Ratio: Mix A & B 100-25 Mixed Vise. Cps.: 750 Pot Life Min.: 40 Shrinkage Cm/Cm: 0.007 SP. Gr.: 1.15 Hardness - Shore D: 30 (A) Compressive Strength psi: N.A. Service Temp. C: 130 Thermal Conductivity: 1.9 Thermal Expansion Cm/Cm/C: 200x10 -6 Vol. Resistivity Ohm. Cm.: 10 13 Dielectric Constant: 60H.Z: 3.8 IKHZ: 3.6 IMHZ: 3.3 Dissipation Factor: 60HZ: 0.03 IKHz: 0.02 IMHZ: 0.02 Dielectric Strength Volts/Mil: 385 275: Feature: Thixotropic Dip No Run Off Cat. & Ratio: INSULCURE 9 or 11 6-7 PHR 8-9 Mixed Vise. Cps. Thixotropic Pot Life Min.: 30 Shrinkage Cm/Cm: 0.002 Sp. Gr.: 1.55 Hardness - Shore D: 88 Compressive Strength psi: 16,000 Service Temp. C: 175 Thermal Conductivity: 4.3 Thermal Exvansion Cm/Cm/C: 40x10 -6 Vol. Resistivity Ohm; Cm.: 10 15 Dielectric Constant: 60HZ: 4.5 ~KHZ: 4.4 IMHZ: 3.7 Dissipation Factor: 60HZ: 0.02 IKHZ: 0.01 IMHZ: 0.02 Dielectric Strength Volts/Mil: 450


PERMAGILE INDUSTRIES INC.: INSULCAST Epoxy Selector Guide for Electrical and Electronic Compounds (Continued): 510: Feature: Water White Cat & Ratio: Mix A & B 100-20 Mixed Vise. Cps.: 2,000 Pot Life Min.: 90 Shrinkage Cm/Cm: 0.007 Sp. Gr.: 1.20 Hardness - Shore D: 80 Compressive Strength psi: 15,000 Service Temp. C: 180 Thermal Conductivity: 1.8 Thermal Expansion Cm/Cm/C: 150x10 -6 Vol. Resistivity Ohm. Cm: 10 16 Dielectric Constant: 60HZ: 3.7 IKHZ: 3.7 IMHZ: 3.3 Dissipation Factor: 60HZ: 0.007 1KHZ: 0.005 IMHZ: 0.005 Dielectric Strength Volts/Mil: 475 961:

Feature: Low Density Cat & Ratio: INSULCURE 14 23-24 PHR Mixed Vise. Cvs.: 2,500 Pot Life Min.: 40 . Shrinkage Cm/Cm: 0.003 Sv. Gr.: 0.80 Hardness - Shore D: 80 Compressive Strength psi: 10,000 Service Temp. C: 125 Thermal Conductivity: 1.2 Thermal Expansion Cm/Cm/C: 50x10 -6 Vol. Resistivity Ohm. Cm.: 10 13 Dielectric Constant: 60HZ: 3.7 IKHZ: 3.2 1MHZ: 3.0 Dissipation Factor: 60HZ: 0.02 ~KHZ: 0.01 IMHZ: 0.01 Dielectric Strength Volts/Mil: 385

617

618

Adhesives,

Sealants


Industry

PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1201-Q Potting and Molding Compound: Use: Especially formulated for use in potting and sealing of electrical connectors and components. Description: PR-1201-Q is a two-part, polysulfide, liquid polymer compound. Upon the mixing of the accelerator with the base compound, the material cures at room temperature, without the addition of heat, to a firm, solid rubber. The cure of PR-1201-Q is entirely chemical in nature and does not depend on exposure to air. This feature permits its application in any desired thickness. PR-1201-Q is designed to flow around wires and connections in electrical connectors to provide complete insulation. This method of sealing the terminals and wires by completely filling the receptacle end bell is called potting and results in the followina advantaaes: 1. Positive sealing against dirt, foreign matter and moisture. 2. Prevention of wire fatigue under extreme vibration. 3. Improved electrical characteristics. 4. Weight saved by elimination of end bell and cable clamp. 5. Space saving due to shorter overall length. 6. Better production handling characteristics. 7. Reduction of lateral fatigue at the solder cup. Specifications: Meets the requirements of MIL-S-8516E(2), 1, 2 and 3

Type II, Class

Application Properties: Color: Base: White Accelerator: Red-Brown Nonvolatile Content: 94% Mixing Ratio: 10:1 by weight (base compound: accelerator) Viscosity: Brookfield Spindle #7 @ 4 rpm: 550 poises Performance Properties: Color: Light Brown Specific Gravity: 1.68 Hardness, Shore A (Cure B): 40 Adhesion, Peel, lbs./in. of width (Cure B): Adhesion Alloy: 20 Cadmium Plate: 20 El.ectrical Properties: Resistance to Arc, seconds: Cure A: 50 Cure B: 100 Dielectric Constant: Cure A 1 kilocycle at 77F 9.5 Power Factor: 1 kilocycle at 77F .005 Resistivity: Volume at 77F, ohm-cm 1.9x10 11

Cure B 9.5 .005 7.1x10

11


619

PRODUCTS RESEARCH & CHEMICAL CORP.: PR-I201-RLS Potting and Sealing: Use: Especially formulated for use in potting and sealing of electrical connectors and components where a viscosity lower than that of PR-1201-Q is desired. Description: PR-1201-RLS is a two-part, polysulfide, liquid polymer compound. Upon the mixing of the accelerator with the base compound, the material cures at room temperature, without the addition of heat, to a firm, solid rubber. The cure of PR-12OI-RLS is entirely chemical in nature and does not depend on exposure to air. This feature permits its application in any desired thickness. PR-1201-RLS is designed to flow around wires and connections in electrical connectors to provide complete insulation. This method of sealing the terminals and wires by completely filling the receptacle end bell is called potting and results in the following advantages: I. Positive sealing against dirt, foreign matter, and moisture. 2. Prevention of wire fatigue under extreme vibration. 3. Improved electrical characteristics. 4. Weight saved by elimination of end bell and cable clamp. 5. Space saving due to shorter overall length. 6. Better production handling characteristics. 7. Reduction of lateral fatigue at the solder cup. Specifications: Meets the requirements of MIL-S-8516E(2), 2, and 3.

Type I, Class 1,

Application Properties: Color: Base: White Accelerator: Red-brown Nonvolatile Content, Minimum: 96% Mixing Ratio: IO:1 by weight (base compound: accelerator) Viscosity: Brookfield: 220 poise Performance Properties: Color: Light Brown Hardness, Shore A (Cure B): 35 Specific Gravity: I.63 Electrical Properties: Resistance to Arc, seconds Dielectric Strength, volts/mil Dielectric Constant: I kilocycle at 77F Power Factor: I kilocycle at 77F

Cure A 65 230

Cure B 75 270

8.1

8.5

0.008

0.007

620


PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1520 Potting and Molding Compound: Use: Especially formulated for use as an electrical cable molding compound where flexibility, excellent resistance to cold flow, and exposure to temperatures as high as 300F for prolonged periods are required. Description: PR-1520 is a chemically curing compound which is available premixed and frozen in plastic cartridges only. It cures rapidly at high temperatures. Properly cured PR-1520 is designed to withstand temperatures as high as 300F for prolonged periods without blowing, deterioration or loss in electrical properties. PR-1520 is readily applied by extrusion gun and provides a firm, resilient, and vibration resistant material. PR-1520 must be used with a primer on most surfaces. Application Properties: Color: Black Nonvolatile Content: 99% Viscosity (Brookfield Spindle #5 @ 10 rpm): Thawed at 75F: 1700 poises Thawed in a 100F water bath: 650 poises Application Life: 1 l/2 hrs. @ 75F Mold Release Time: 72 hrs. a 75F or 3 hrs. @ 180F or 2 hrs. @ 200F or 1 l/2 hrs. @ 220F Cure Time (To 40 Shore A Hardness): 120 hrs. @ 75F or 6 hrs. @ 180F Ultimate Cure: 16 hrs @ 180F Performance Properties: (Cured 16 hours at 180F) Color: Black Specific Gravity: 1.7 Hardness, Shore A: 68 Tensile Strength: 750 psi Ultimate Elongation: 200% Modulus at 100% Elongation: 500 psi Volume Shrinkage: 2.5% Compression Set: 9% @ 77F 32% @ 158F Temperature Range: -65F to +300F Fungus Resistance: Non-nutrient Adhesion, lbs./in. of width: Aluminum Alloy: 28 Cadmium Plate: 28 Neoprene: 20 Polyvinyl Chloride: 18


621

PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1527 Potting and Molding Compound: Use: Especially formulated as a molding compound for electrical cables and/or as a potting compound for electrical connectors where resistance to cold flow, high tensile strength, and exposure from -80 to 300F for prolonged periods are required. Description: PR-1527 is a chemically curing polyurethane which may be supplied in two-part quantities or premixed and frozen in plastic cartridges. PR-1527 cures at room temperature to a firm, flexible, cold flow-resistant rubber with a high tensile strength. The cure may be accelerated by the application of heat. Properly cured PR-1527 is designed to withstand temperatures as high as 300F for prolonged periods without blowing, deterioration or loss in electrical properties and has excellent flexibility at -8OF. It will also withstand 400F for short periods. PR-1527 is readily applied by extrusion or injection gun. PR-1527 must be used with a primer on most surfaces. Application Properties: Color Part A: Amber or Black Part B: Straw Mixing Ratio: Part A:Part B Weight or Volume: 26:lOO Nonvolatile Content: 99% Viscosity (Brookfield Spindle #3 @ 10 rpm) Two-Part Unit: 250 poises Premixed, frozen: 600 poises ADDliCatiOn Life: Time to 2500 noises: *LTwo-Part Unit: 4 hrs @ 75F _ Premixed, frozen: 3 hrs @ 75F Tack Free Time: 18 hrs. @ 75F or 1 hr. @ 180F Mold Release Time: 24 hrs. @ 75F or 4 hrs. @ 180F Cure Time: To 80 Shore A hardness: 5 days @ 75F or 6 hrs @ 180F Performance Properties (Cured 16 hours at 180F): Color: Amber or Black Specific Gravity: 1.06 Hardness. Shore A: 80 Volume Shrinkage: 4% Tensile Strength: 2500 psi El.ectrical Properties (Cured 16 hours at 180F): Dielectric Constant: IKHz @ 75F: 8.3 IMHz @ 75F: 6.2 Power Factor: 1KHz @ 75F: 0.02 IMHz @ 75F: 1.0

622


PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1535 Potting and Molding Compound: Especially formulated for use as a potting or molding compound for applications where high abrasion resistance, extra high tensile strength, and excellent electrical properties are required over a temperature range of -80 to 300F. PR-1535 is a chemically curing polyurethane which may be supplied in two-part quantities or premixed and frozen in plastic cartridges. PR-1535 cures at room temperature to a tough, semiflexible, cold flow-resistant rubber with a high Shore A hardness, extra high tensile strength, and excellent electrical properties. The cure may be accelerated by the application of heat. Properly cured PR-1535 is designed to withstand temperatures as high as 300F for prolonged periods and has flexibility at -8OF. It will also withstand 400F for short periods. PR-1535 is also resistant to contact with water, oils, and fuels. PR-1535 must be used with a primer on most surfaces. Application Properties: Color Part A: Amber or Black Part B: Straw Mixing Ratio: Part A: Part B: Weight or volume: 32:lOO Nonvolatile Content: 99% Viscosity (Brookfield Spindle #7 @ 10 rpm): Two-part unit: 250 poises Premixed, frozen: 750 poises Application Life: Time to 2500 poises: Two-Part unit: 2 hrs. @ 75F Premixed, frozen: 1 hr. @ 75F Performance Properties (Cured 16 hours at 180F): Color: Amber or Black Specific Gravity: 1.07 Hardness, Shore A: 90 Volume Shrinkage: 2% Tensile Strength: 4500 psi Ultimate Elongation: 500% Tear Strength (Die C): 375 lbs./in. Compression Set: 32% Temperature Range: -8OF to 300F Fungus Resistance: Non-Nutrient Electrical Properties (Cured 16 hours at 180F): Dielectric Constant: 1 KHz @ 75F: 6.4 Power Factor: 1 KHz @ 75F: 0.03 Volume Resistivity: At 75F: 3x10 12 ohm-cm Surface Resistivity: At 75F: 4x10 12 ohms Insulation Resistance: At 75F: 500,000 megohms


623

PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1538 Potting and Molding Compound: Use: As a potting compound for electrical connectors, as a molding compound for electrical cables and mechanical parts, as a circuit board coating and/or as an electrical embedding compound. Description: PR-1538 is a low viscosity, chemically curing polyurethane compound which may be supplied in two-part units or premixed and frozen in plastic cartridges. PR-1538 cures at room temperature to a tough, flexible, and cold flow-resistant rubber. The cure may be accelerated by the application of heat. Properly cured PR-1538 is designed to withstand temperatures up to 300F without deterioration or loss in electrical properties. The low viscosity of PR-1538 allows the material to be degassed easily when supplied in two-part units and provides for excellent flow characteristics in encapsulating, molding and potting applications. PR-1538 Amber can be seen through easily so that inspection of connections and components coated, encapsulated, embedded or potted in the material can be made readily. PR-1538 has very good electrical properties, especially dielectric strength in thin films and volume resistivity. PR-1538 must be used with a primer on metal, neoprene and polyvinyl chloride surfaces. Application Properties: Color: Part A: Amber or Black Part B: Straw Mixing Ratio: Part A:Part B: weight or volume: 32:lOO Nonvolatile Content: 99% Viscosity(Brookfield Spindle #3 8 10 rpm): Two-part unit: 100 poises Premixed, frozen: 300 poises Performance Properties (Cured 16 hours at 180F): Color: Amber or Black Specific Gravity: 1.05 Hardness, Shore A: 80 Volume Shrinkage: 1.4% Tensile Strength: 3000 psi Ultimate Elongation: 600% Electrical Properties (Tested in accordance with MIL-S-8516C): Dielectric Constant: 1KHz 8 75F: 6.8 Power Factor: 1~~2 8 75~: 0.05 Volume Resistivity: At 75F: 1x10 13 ohm-cm Surface Resistivity: At 75F: 5 x 12 12 ohms

624


PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1546 Potting, Embedding and Encapsulating Compound: Use: Especially formulated as a reenterable urethane for use as a potting, embedding and encapsulating compound for applications where ease of repairing components and excellent electrical properties are essential. Description: PR-1546 is a chemically curing, polyurethane compound which is supplied in a two-part unit package. PR-1546 is a clear liquid that flows easily around intricate components and cures at room temperature to form a flexible rubber with a Shore A hardness of 50. Cured PR-1546 is transparent so that potted, embedded, or encapsulated components can be inspected readily. When it is necessary to remove or replace components, PR-1546, because of its specially formulated physical properties, can be removed easily, the component replaced, and freshly mixed PR-1546 applied in the repair area to reform a complete seal. PR-1546 and hydrolytic stability also has excellent electrical properties over the temperature range of -65F to 300F. Application Properties: Color: Part A: Straw Part B: Colorless Mixing Ratio: Part A:Part B 2O:lOO by weight Nonvolatile Content: 99% Viscosity: 150 poises Application Life: Time to 2500 poises: 2 hrs. @ 75F Tack Free Time: 24 hrs. @ 75F Mold Release Time: 2 hrs. @ 75F Cure Time: To 50 Shore A hardness: 5 days @ 75F Performance Properties(Cured 16 hours at 180~): Color: Transparent-Light Straw Specific Gravity: 1.04 Hardness, Shore A: 50 Tensile Strength: 100 psi Ultimate Elongation: 100% Tear Strength, Die C: 15 lbs./inch Hydrolytic Stability: Conforms Temperature Range: -65F to +300F Electrical Properties(Cured 16 hrs. @ 180F): Insulation Resistance At 75F: 150,000 megohms Volume Resistivity: At 75F: 1 x 10 12 ohm-cm At 300F: 1 x 10 10 ohm-cm Surface Resistivity At 75F: 1 x 10 13 ohms Dielectric Constant: 1 KHz @ 75F: 7.0 Power Factor: 1 KHz @ 75F: 0.03 Dielectric Strength: 330 volts/mil


625

PRODUCTS RESEARCH & CHEMICAL CORP.: PRC-1547 Potting and Molding Compound: Use: Especially formulated as a molding compound for electrical cables and/or as a potting compound for electrical connectors where resistance to cold flow, flexibility, high tensile strength, and exposure from -7OF to +300F for prolonged periods are required. Description: PR-1547 is a chemically curing polyurethane compound which may be supplied in two-part quantities or premixed and frozen in plastic cartridges. PR-1547 cures at 180F to a tough, flexible, cold flow-resistant, high tensile strength rubber with a Shore A hardness of 80. PR-1547 will cure at 75F, but the resultant physical properties will be lower than when heat cured. Properly cured PR-1547 is designed to withstand temperatures as high as 300F for prolonged periods without blowing, deterioration or loss in electrical orooerties and has excellent flexibility at -7OF. The viscosity of PR-1547 allows the material to be degassed easily when supplied in two-part units and provides for excellent flow characteristics in encapsulating, molding and potting applications. PR-1547 must be used with a primer on metal, neoprene, and polyvinyl chloride surfaces. Specifications: PR-1547 meets the requirements of MIL-M-24041C Category A. Application Properties: Color: Part A: Amber or Black Part B: Straw Mixing Ratio: Part A: Part B 32:lOO by weight or volume Nonvolatile Content: 89% Viscosity (Brookfield Spindle #3 @ 10 rpm): Two-part unit: 250 poises Premixed, frozen: 450 poises Performance Properties(Cured 16 hours at 180F): Color: Amber or Black Specific Gravity: 1.05 Hardness, Shore A: 80 Volume Shrinkage: 2.5% Tensile Strength: 3000 psi Ultimate Elongation: 600% Electrical Properties(Cured 16 hours at 180F): Dielectric Constant: 1 KHz @ 75F: 5.8 Power Factor: 1 MHz @ 75F: 0.065 Volume Resistivity: At 75F: 1 x 10 13 ohm-cm Surface Resistivity: At 75F: 1 x 10 13 ohms Insulation Resistance: At 75F: 200,000 megohms

626

Adhesives,

Sealants


Industry

PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1564 Molding Compound: Use: Formulated as a low viscosity molding compound for electrical cables and/or as a potting compound for electrical connectors where moderate Shore A hardness, resistance to cold flow, extra flexibility, and exposure from -8OF to 275F for prolonged periods are required. Description: PR-1564 is a chemically curing polyurethane compound which is supplied in two-part quantities or premixed and frozen in plastic cartridges. PR-1564 cures at room temperature to a flexible, cold flow-resistant rubber. Properly cured PR-1564 is designed to withstand temperatures as high as 2751 for prolonged periods without blowing, deterioration or loss in electrical properties and has excellent flexibility at -80~. PR-1564 is readily applied by extrusion or injection gun. PR-1564 must be used with a primer on metal. However, on neoprene and poly vinyl chloride surfaces, only certain formulations may require the use of a primer. Application Properties: Color: Part A: Light straw or black Part B: Colorless Mixing Ratio: Part A:Part B 7.7:100 by weight 7.7:100 by volume Nonvolatile Content: 99% Viscosity: Brookfield Spindle #7 @ 10 rpm: 80 poises Application Life: Time to 1000 poises: 1 l/2 hr. @ 75F Time to 2500 poises: 2 hrs. 8 75F Tack Free Time: 12 hrs. @ 75F Mold Release Time: 1 l/2 hrs. 8 180F Cure Time: To 30 Shore A hardness: 1 day 8 75F or 1 hr. 8 180F Performance Properties(Cured 7 days at 75F or 16 hours at 180F): Color: Amber or black Specific Gravity: 1.06 Hardness, Shore A: 65 Volume Shrinkage: 4% Tensile Strenath: 1000 osi Ultimate Elongation: 30'0% Tear Strength (Die C): 80 lbs./in. Moisture Absorption: 3.3% weight gain Fungus Resistance: Non-nutrient Electrical Properties(Cured for 16 hours at 180F): Dielectric Constant: 1 megacycle @ 75F: 4.3 Power Factor: 1 megacycle @ 75F: 0.08 Volume Resistivity: At 75F: 1 x 10 12 ohm-cm Surface Resistivity: At 75F: 3 x 10 13 ohms Insulation Resistance: 250,000 megohms Dielectric Strength: 335 volts/mil


627

PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1570 Potting and Molding Compound: Use: Formulated as a low-viscosity medium hardness potting and/or molding compound where high retention of electrical properties after exposure to high humidity and temperature is desired. Description: PR-1570 is a non-crystallized, low viscosity, chemically curing polyurethane compound which may be supplied in Amber or Black and in two-part units or premixed frozen in cartridges. PR-1570 cures to a tough, flexible, cold flow-resistant elastomer with outstanding retention of electrical properties after subjection to high humidity and temperature. PR-1570 must be used with a primer on metal and polyvinyl chloride surfaces. However, on neoprene, the use of a primer may be necessary only with some formulations of neoprene. Application Properties: Color: Part A: Colorless or Black Part B: Straw Mixing Ratio: Part A: Part B weight or volume: 25:lOO Nonvolatile Content: 99% Viscosity (Brookfield Spindle #7 @ 10 rpm): Two-part unit: 120 poises Premixed, frozen: 400 poises Application Life: Time to 2500 poise: Two-part unit: 75 minutes @ 75F Premixed, frozen: 30 minutes @ 75F Mold Release Time: 4 hrs. @ 180F Cure Time: To 70 Shore A: 8 hrs. @ 180F Performance Properties(Cured 16 hours at 180F): Specific Gravity: 0.98 Hardness, Shore A: 75 Volume Shrinkase: 4% Tensile Strength: 1000 psi Ultimate Elongation: 350% Tear Strength-(Die C): 100 lbs./in. Compression Set: 28% Adhesion, peel, lbs./in. of width: Aluminum: 50 Stainless Steel: 50 Neoprene: 20 Polyvinyl Chloride: 20 Electrical Properties(Cured 16 hours at 180F): Dielectric Constant: 1 KHz: 3.2 Power Factor: IKHz: 0.02 Volume Resistivity: At 75F: 1 x 10 15 ohm-cm Surface Resistivity: At 75F: 1 x IO 16 ohms Insulation Resistance: 1 x 10 8 megohms Dielectric Strength: 335 volts/mil

628


PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1574 Potting and Molding Compound: Use: Formulated as a low-viscosity high-hardness potting and/or molding compound where high retention of electrical properties after exposure to high humidity and temperature is desired. Description: PR-1574 is a low-viscosity chemically curing polyurethane compound which is supplied in Amber or Black and in two-part units or premixed and frozen in cartridges. PR-1574 cures to a tough, flexible, cold flow-resistant elastomer with outstanding retention of electrical properties after subjection to high humidity and temperature. PR-1574 requires elevated temperature for cure to obtain optimum performance properties. PR-1574 must be used with a primer on metal and polyvinyl chloride surfaces. However, on neoprene, the use of a primer may be necessary only with some formulations of neoprene. Specifications: PR-1574 meets the requirements of MIL-M-24041C Category B. Application Properties: Color Part A: Colorless or black Part B: Straw Mixing Ratio: Part A: Part B Weight or volume: 18:lOO Nonvolatile Content: 99% Viscosity (Brookfield Spindle #7 @ 10 rpm): Two-part unit: 120 poises Premixed, frozen: 400 poises Application Life: Time to 2500 poise: Two part unit: 75 minutes Premixed, frozen: 30 minutes Mold Release Time: 5 hrs. @ 180F Cure Time To 70 Shore A: 8 hrs. @ 180F Performance Properties(Cured 16 hours at 180F): Specific Gravity: 0.98 Volume Shrinkage: 3.5% Hardness, Shore A: 90 Tensile Strength: 2,500 psi Ultimate Elongation: 425% Tear Strength (Die Cl: 300 lbs./in. Adhesion, peel, lbs./in. of width: Aluminum: 50 Electrical Properties(Cured 16 hours at 18OF): Dielectric Constant: 1KHz @ 75F: 2.8 Power Factor: 1 KHZ @ 75F: 0.02 Volume Resistivity: At 75F: 1x10 15 ohm-cm Surface Resistivity: At 75F: 1x10 16 ohms Insulation Resistance: 1x10 8 megohms Dielectric Strength: 330 volts/mil


629

PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1590 Molding Compound: Use: Especially formulated as a medium hardness, molding compound for electrical cables and/or as a potting compound for electrical connectors where resistance to cold flow, flexibility, and exposure from -7OF to 300F for extended periods are required. Description: PR-1590 is a non-cracking, chemically curing, polyurethane compound which may be supplied in two-part quantities or premixed and frozen in elastic cartridaes. PR-1590 cures at 180F to a tough, flexible', cold flow-resistant, medium tensile strength rubber with a Shore A hardness of 75. PR-1590 will cure at 75F, but the resultant physical properties will be lower than when heat cured. Properly cured PR-1590 is designed to withstand temperatures as high as 300F for extended periods without blowina. deterioration or loss in electrical properties _ _ and has excellent flexibility at -70. The viscosity of PR-1590 allows the material to be degassed easily when supplied in two-part units and provides for excellent flow characteristics in encapsulating, molding, and potting applications. PR-1590 must be used with a primer on metal, neoprene, and polyvinyl chloride surfaces. Application Properties: Color: Part A: Dark amber or Black Part B: Straw Mixing Ratio: Part A: Part B: 47:lOO by weight Nonvolatile Content: 99% Viscosity (Brookfield Spindle #3 @ 10 rpm): Two-part unit: 120 poises Premixed, frozen: 400 poises Performance Properties(Cured 16 hours at 180F): Color: Dark amber or Black Specific Gravity: 1.08 Hardness, Shore A: 75 Volume Shrinkage: 4% Tensile Strength: 2200 psi Electrical Properties(Cured 16 hrs. @ 180F): Arc Resistance: 150 seconds. Dielectric Strength: 300 volts/mil Dielectric Constant: At 1 KHz @ 75F: 7.4 Power Factor: At 1 KHz @ 75F: 0.08 Insulation Resistance: At 75F: 5 x 10 5 megohms Resistivity: At 75F: At 250F Volume, ohm-cm: 1 x 10 12 1x10 9 Surface, ohms: 1 x 10 13 9 x 10 10

630


PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1592 Potting and Molding Compound: Use: Especially formulated as a high hardness molding compound for electrical cables and/or as a potting compound for electrical connectors where resistance to cold flow, flexibility, high tensile strength, and exposure from -7OF to 275F for extended periods are required. Description: PR-1592 is a noncracking, chemically curing, polyurethane compound which is supplied in Amber or Black and in two-part quantities or premixed and frozen in plastic cartridges. PR-1592 cures at 180F to a tough, flexible, cold flow-resistant, high tensile strength rubber with a Shore A hardness of 85. PR-1592 will cure at 75F, but the resultant physical properties will be lower than when heat cured. Properly cured PR-1592 is designed to withstand temperatures as high as 275F for extended periods without blowing, deterioration or loss in electrical properties, and has excellent flexibility at -7OF. The viscosity of PR-1592 allows the material to be degassed easily when supplied in two part units and provides for excellent flow of characteristics in encapsulating, molding and potting applications. PR-1592 must be used with a primer on metal, neoprene and polyvinyl chloride surfaces. Specifications: PR-1592 meets the requirements of MIL-M-24041C Category B Application Properties: Color: Part A: Dark Amber or Black Part B: Straw Mixing Ratio: Part A:Part B 53:lOO by weight Nonvolatile Content: 99% Viscosity (Brookfield Spindle #3 @ 10 rpm): Two-part unit: 200 poises Premixed, frozen: 700 poises Performance Properties(Cured 16 hours at 180F): Color: Dark Amber or Black Specific Gravity: 1.08 Hardness, Shore A: 85 Volume Shrinkage: 4% Tensile Strength: 6000 psi Ultimate Elongation: 425% Electrical Properties(Cured 16 hrs. @ 180F): Arc Resistance: 150 seconds Dielectric Strength: 300 volts/mil Dielectric Constant: At 1 KHz @ 75F: 6.5 Power Factor: At 1 KHz @ 75F: 0.08 Insulation Resistance: At 75F: 5 x 10 5 megohms


PRODUCTS RESEARCH & CHEMICAL CORP.: PR-1660 Compound:

631

Potting and Molding

PR-1660 is a two-part, TDI free, non-cracking polyurethane potting and molding compound. The product is especially formulated to provide a flexible elastomer, possessing high hardness and tensile strength with good moisture and ozone resistance. Application Properties: Amber Black Tan solid Tan solid Color: Part A Clear liquid Clear liquid Part B ----Black paste Part C Part A: Part B: Part C Mixing Ratio: Part A: Part B 11.5: 100: 0.56 11.5:100 Viscosity (Mixed): At IZOF - 140F: lo-80 poise Nonvolatile Content: 99% Application Life: To 2500 poise: At 120F: 30 min. At 140F: 30 min. Tack Free Time: At 75F: 3 hrs. Mold Release Time: 2 hrs. @ 180F or 3 hrs. @ 160F or 8 hrs. @ 75F Cure Time: To 90 Shore A: 3 hrs. @ 212F or 12 hrs. @ 180F or 16 hrs. @ 160F or 14 days @ 75F Physical Properties: Color: Light amber Specific Gravity: 1.03 Hardness, Shore A: 90 Tensile Strength: 4000 psi Volume shrinkage: 3.3% Ultimate Elongation: 400% Ozone Resistance: Non-cracking Tear Strensth: 400 lbs./in. Adhesion, Peel Strength: Aluminum (Primed with PR-420): 40 piw Neoprene (Primed with PR-1523-M): 25 piw PVC (MEK tackified): 27 piw Hydrolytic Stability, Hardness Change after 120 days: -12% Abrasion Resistance: 3 mg. loss Flame Resistance: Self extinguishing Fungus Resistance: Non-nutrient El ectrical Properties: Dielectric Strength: 400 volts/mil Insulation Resistance: At 75F: 3 x 10 7 megohms Volume Resistivity: At 75F: 8 x 10 13 ohm-cm Surface Resistivity: At 75F: 1 x 10 15 ohms Dielectric Constant: 1 KHz @ 75F: 5.3 Power Factor: 1 KHz @ 75F: 0.04

632


PRODUCTS RESEARCH & CHEMICAL CORP.: P/S 727 Potting and Sealing Compound: Use: P/S 727 is especially formulated for use in potting and sealing of electrical connectors and components for service use from -65F to +200F. Description: P/S 727 is a two-part, polysulfide, liquid polymer compound. Upon the mixing of the accelerator with the base compound, the material cures at room temperature, without the addition of heat, to a firm, solid rubber. The cure of P/S 727 is entirely chemical in nature and does not depend on exposure to air. This feature permits its application to any desired thickness. P/S 727 is designed to flow around wires and connections in electrical connectors to provide complete insulation. This method of sealing the terminals and wires by completely filling the receptacle end bell is called potting and results in the following advantages: 1. Positive sealing against dirt, foreign matter, and moisture 2. Preventuion of wire fatigue under extreme vibration. 3. Improved electrical characteristics. 4. Weight saved by elimination of end bell and cable clamp. 5. Space saving due to shorter overall length. 6. Better production handling characretistics. 7. Reduction of lateral fatigue at the solder cup. Specifications: Meets the requirements of and is qualified to MIL-S-8516E(2), Type II, Class 1, 2, and 3. Application Properties: Color: Base: White Accelerator: Red-brown Nonvolatile Content: 94% Mixing Ratio: 1OO:lO by weight (base compound: accelerator) Viscosity: Brookfield: 550 poises Performance Properties: Color: Light Brown Specific gravity: 1.8 Hardness, Shore A (Cure B): 40 Electrical Properties: Resistance to Arc, seconds Dielectric Strength, volts/mil Dielectric Constant: 1 kilocycle at 77F Power Factor: 1 kilocycle at 77F Resistivity: Volume at 77F, ohm-cm

Cure A 25 min 220

Cure B 50 min 230

9.5 .Ol

9.5 .Ol

1.0x10 11

2x10 11


633

PRODUCTS RESEARCH & CHEMICAL CORP.: P/S 799 Potting and Molding Compound: Use: Formulated as a high-hardness molding compound for electrical cables and/or as a potting compound for electrical connectors. The product is intended for applications requiring flexibility and high tensile strength, resistance to cold flow, and exposure to temperatures from -7OF to 275F for extended periods. Description: P/S 799 is a chemically-curing, polyurethane compound which is supplied in Amber or Black and in two-part units. P/S 799 cures at 180F to a tough, flexible, cold flow-resistant, medium tensile strength elastomer. Properly cured P/S 799 is designed to withstand temperatures as high as 275F for extended periods without blowing, deterioration or loss in electrical properties, and has excellent flexibility at -7OF. The viscosity of P/S 799 allows the material to be degassed easily and provides for excellent flow characteristics in encapsulating, molding and potting applications. Specification: P/S 799 meets the requirements of MIL-M-24041C Category B. Application Properties: Color: Part A: Amber or Black Part B: Straw Mixing Ratio: Part A:Part B 41:lOO bv weisht Nonvolatile Content: 99% Viscosity Brookfield: 160 poise Application Life: Time to 2500 poises: 1 hr. @ 75F Mold Release Time: 2 hrs. @ 180F Performance Pronerties(Cured 16 hours at 180F): Color: Amber-or Black Specific Gravity: 1.07 Hardness, Shore A: 80 Volume Shrinkage: 3% Tensile Strength: 2500 psi Ultimate Elongation: 450% Tear Strength: (Die C) 300 lbs./in. 100% Modulus: 600 psi Compression Set: 25% Ozone Resistance: Conforms Electrical Properties(Cured 16 hrs. @ 180F): Dielectric Strensth: 300 volts/mil Dielectric Constant At IOKHz @ 75F: 4.8 Power Factor: At 10KHz @ 75F: 0.04 Insulation Resistance @ 75F: 5x10 5 megohms Resistivity @ 75F: Volume: 1x10 12 ohm-cm Surface: 1x10 13 ohms

634


QUADRANT

CHEMICAL

CORP.:

A-2191F/B-2912F Encapsulating Resin:

This two component system cures to an electrically stable, tough, impact resistant epoxy for vacuum potting high energy ignition coils. This material exhibits good heat resistance without cracking or excess shrinkage. This system has proven its use for automotive applications. Cure Schedule: 4-6 Hours at 85'C plus 2 Hours at 120°C or equal Typical Physical Properties: Reaction ratio (by weight): 100:30 Resin to Hardener Reaction ratio (by volume): 100:39 Resin Color: Grey/Brown Hardener Color: Amber Resin Wt/Gal @ 25'C: 13.2+-.2 Hardener Wt/Gal @ 25'C: IO-l+-.2 Resin Viscosity @ 25'C Cps.: lO,OOO-30,000 Hardener Viscosity @ 25'C Cps.: 80-180 Resin percent inorganic: 50 Hardener percent inorganic: 0 Working Life @ 80°C: 20-30 Minutes Sunshine Gel Time @ 12O'C: 24-32 Minutes Service Temperature: 155'C Weight Loss @ 155'C: t0.5% Shore D @ 25'C: >90 Tensile Strength: 690 kg/cm2 Dielectric Strength @ 25'C: More than 16,000 volts/mm Volume Resistivity @ 25'C: 1 x El5 ohm cm Arch Resistance: More than 100 seconds Thermal Conductivity: .OOll cal/(sec)(sqcm)('C)(cm) Elongation: 2.5% Elastic Modulus: 0.8 x E6 Coefficient of Thermal Expansion: 40 x E-6 in/in/'C Dielectric Constant @ 1: 5O'C: 3.50/75'C: 4.00/100'c: 4.40/ 125'C: 4.75 Dissipation Factor @ Khz: 5O'C: O.O120/75'C: 0.0300/ 100°C: O.O650/125'C: 0.0600


635

QUADRANT CHEMICAL CORP.: A-2238 VO/B-2250 Enscapulating Resin: This two component system cures to an electrically stable, tough, impact resistant Epoxy for potting Television components. This material exhibits good heat resistance without cracking or excess shrinkage. A-2238/B-2250 is supplied as a vacuum stable grade. (UL E 69407 94 V-O @ .25") Cure Schedule: Cures to rigid dielectric in 30-50 Minutes at 85'C. Cure will depend on air circulation and mass. Other cure schedules may be developed for your needs. Typical Physical Properties: Reaction ratio (by weight): 100:9.4 Resin to Hardener Reaction ratio (by volume): 100:17 Resin % Solids: 100 Hardener % Solids: 100 Resin Color: Grey Hardener Color: Blue Resin Wt/Gal @ 25'C: 14.6t.2 Hardener Wt/Gal @ 25'C: 8.02.2 Resin Viscosity @ 25'C: Cps: 150,000-400,000 Hardener Viscosity @ 25'C Cps: 20-50 Resin percent inorganic: 60 Hardener percent inorganic: 0 Working Life @ 25'C: lo-15 Minutes Sunshine Gel Time @ 75'C: 9-13 Minutes Service Temperature: 155'C Weight Loss @ 155'C: (0.5% Mixed viscosity @ 45'C Cps.: (3,500

636


QUADRANT

CHEMICAL

CORP.:

A-2249

VO/B-2250 Encapsulating Resin:

This two component system cures to an electricaly stable, tough, impact resistant epoxy for potting Television components. This material exhibits good heat resistance without cracking or excess shrinkage. A-2249/B-2250 is supplied as a vacuum stable grade. (UL E 69407 94 V-O @ -1875") Cure Schedule: Cures to rigid dielectric in 30-50 Minutes at 85'C. Cure will depend on air circulation and mass. Other cure schedules may be developed for your needs. Typical Physical Properties: Reaction ratio (by weight): 100:12.5 Resin to Hardener Reaction ratio (by volume): 100:20 Resin % Solids: 100 Hardener % Solids: 100 Resin Color: Cream Hardener Color: Blue Resin Wt/Gal @ 25'C: 13.2+-.2 Hardener Wt/Gal 8 25'C: 8.0+-.2 Resin Viscosity @ 25°C Cps: 30,000-60,000 Hardener Viscosity @ 25'C Cps: 20-50 Resin oercent inorsanic: 50 Hardener percent inorganic: 0 Working Life @ 45'C: 12-16 Minutes Sunshine Gel Time @ 75'C: 12-16 Minutes Service Temperature: 13O'C Weight Loss @ 13O'C: ~0.5% Mixed viscosity @ 45°C: SF-40 > SF-30 > SF-20 > SF-15 > SF-10

988


TRANSENE

CO.,

INC.:

Solder Creams: For Microelectronic Soldering:

Solder-flux creams for use in microelectonic thick and thin film applications to provide uniformity and reliability of bonded discrete components, leads, and cover seals. Standard Solder Compositions

(Non-Corrosive):

Solder Cream - 1090: 10% Sn/90% Pb Solder Cream - 2575: 25% Sn/75% Pb Solder Cream - 6040: 60% Sn/40% Pb Solder Cream - 62362: 62% Sn/36% Pb/2% Ag Solder Cream - 955: 95% Sn/5% Ag Solder Cream - 7525: 75% Pb/25% In Other Solder Compositions Available TRANSENE solder creams are compositions containing solder alloy powders of controlled particle size dispersed in a flux vehicle for good wetting and soldering. The basic flux system used in these solder creams have an optimized rheology for screen-printing applications. Good soldering performance is obtained on thick and thin film metallizations--Pd, Ag, Au, Pt, as well as brass and copper. TRANSENE solder creams are used to solder minute parts in high-density electronic packages, particularly discrete components, leads and cover seals in hybrid circuits. By screen printing, the amount of solder can be rigidly controlled to avoid solder bridging. Many other solder problems can be avoided by the use of solder creams.

Properties: -1090: Melting Point -2575: Melting Point -6040: Melting Point 62362: Melting Point -955: Melting Point -7525: Melting Point

or Liquidus (C): 300 or Liquidus (C): 283 or Liquidus (C): 193 or Liquidus (C): 189 or Liquidus (C): 235 or Liquidus (C)i 264

Miscellaneous

ZIEGLER CHEMICAL & MINERAL CORP.: Specialty Asphalt Products: Electronics Industry: IMPREG WAX: These products are generally asphalts with the addition of wax to raise its softening point to between 220F and 300F. Impreg waxes are asphalt and wax blends and are used in ballasts of fluorescent lights to reduce noise and hold the components in place, protecting them from moisture damage. Potting Compounds: Potting compounds are asphalts filled with l-70% silica to increase their softening point (raise approx. 0.4F/l% silica added).

989

Suppliers' Addresses

990

Suppliers'

Abatron, Inc. 33 Center Drive Gilberts, IL 60136 (708)-426-2200/(800)-445-1754

Ashland Chemical, Inc. 1745 Cottage St. Ashland, OH 44805 (419)-289-9588/(800)-848-7485

Ablestik 833 West 182nd St. Gardena, CA 90248 (213)-532-9341

Bacon Industries, Inc. 192 Pleasant St. Watertown, MA 02172 (617)-926-2550

Adhesives Research, P.O. Box 100 Glen Rock, PA 17327 (717)-235-7979

Inc.

A.I. Technology, Inc. 1425 Lower Ferry Rd. Trenton, NJ 08618 (609)-882-2332

Addresses

Biwax Corp. 45 E. Bradrock Drive Des Plaines, IL 60016 (312)-824-0137 Bonded Products, Inc. 439 South Bolmar St. Box 39 West Chester, PA 19381 (215)-696-9220

American Biltrite Inc. Ideal Tape Co. 1400 Middlesex St. Lowell, MA 01851 (617)-458-6833

Bostik Emhart Boston St. Middleton, MA 01949 (508)-777-0100/(800)-726-7845

American Sealants, Inc. 3912 Option Pass P.O. Box 80307 Fort Wayne, IN 46898 (219)-489-0728/(219)-489-0825

CasChem, Inc. 40 Avenue A Bayonne, NJ 07002 (800)-CASCHEM

Apple Adhesives, Inc. 184-08 Jamaica Ave. Hollis, NY 11423 (718)-454-7375

Castall, Inc. Weymouth Industrial Park East Weymouth, MA 02189 (617)-337-6075

Aremco Products, Inc. P.O. Box 429 Ossining, NY 10562 (914)-762-0685

Chomerics Inc. 77 Dragon Court Woburn, MA 01888 (617)-935-4850/(800)-225-1936

Arlon 199 Amaral St. P.O. Box 14305 East Providence, (401)-434-2340

CHR Industries, Inc. 407 East St. New Haven, CT 06509 (203)-777-3631

RI

02914

991

992

Adhesives, Sealants and Coatings for the Electronics IndILStry

Conap, Inc. 1405 Buffalo St. Olean, NY 14760 (716)-372-9650

Ducey Chemical, Inc. P.O. Box 776 Princeton Junction, (609)-799-3191

Copps Industries, Inc. N90 W14683 Commerce Dr. P.O. Box 844 Menomonee Falls, WI 53052 (414)-251-3825

Dymax Corp. 51 Greenwoods Rd. Torrington, CT 06790 (203)-482-1010 Dynaloy, Inc. 7 Great Meadow Lane Hanover, NJ 07936 (201)-887-9270

Cotronics Corp. 3379 Shore Parkway Brooklyn, NY 11235 (718)-646-7996

Dynamold, Inc. P.O. Box 9617 Fort Worth, TX 76147 (817)-335-0862

Custom Coating & Laminating 717 Plantation St. Worcester, MA 01605 (508)-852-3072 Dielectric Polymers 218 Race St. Holyoke, MA 01040 (413)-532-3288

John C. Dolph Co. West New Road Monmouth Junction, (201 )-329-2923

Ave.

NJ 08852

Dow Chemical USA Midland, MI 48674 (800)-258-CHEM/(800)-232-CHEM Dow Corning Midland, MI (517)-496-6000

Corp. 48686

Electro-Kinetic Systems, 701 Chestnut St. Trainer, PA 19103 (215)-497-4660

Inc.

Dimiter Emulsion & Chemical P.O. Box 341 Poughkeepsie, NY 12602 (914)-452-4071 Dock Resins Corp. 1512 West Elizabeth Linden, NJ 07036 (908)-862-2351

NJ 08550

Co.

Electro-Science Laboratories 416 East Church Road P.O. Box 1533 King of Prussia, PA 19406 (215)-272-8000/(800)-257-8340 Emerson & Cuming, Inc. 77 Dragon Court Woburn, MA 01888 (617)-938-8630/(800)-TECHWAY Epoxy Technology, Inc. 14 Fortune Drive Billerica, MA 01821 (508)-667-3805/(800)-227-2201 Fel-Pro Chemical Products 7450 North McCormick Blvd. P. 0. Box 1205 Skokie, IL 60076 (312)-761-4500 and 674-7700

Inc.

Suppliers'

Fenwal Inc. 50 Main St. Ashland, MA 01721 (508)-881-2000

Hexcel Chemical Products 20701 Nordhoff St. Chatsworth, CA 91311 (818)-882-3022

Finite Industries Inc. 746 Gotham Parkway Carlstadt, NJ 07072 (201 )-939-0565

IPS Corp. 17109 So. Main St. Gardena, CA 90248 (213)-321-6515/(800)-421-2677

Flexbar Machine 250 Gibbs Road Central Islip, (516)-582-8440

ITW Devcon 30 Endicott St. Danvers, MA 01923 (508)-777-1100

Corp. NY 11722

H.B. Fuller Co. 3530 Lexington Ave. North St. Paul, MN 55126 (800)-468-6358/(800)-446-8788 Furane Products 5121 San Fernando Road Los Angeles, CA 90039 (818)-247-6210 GC Electronics 1801 Morgan St. Rockford, IL 61102 (815)-968-9661 GE Silicones General Electric Co. 260 Hudson River Road Waterford, NY 12188 (518)-237-3330 General Polymers 2 Sherman St. Linden, NJ 07036 (201)-925-6776

Park

West Loctite Corp. 705 North Mountain Road Newington, CT 06111 (203)-278-1280/(800)-LOC-TITE Magnolia Plastics, Inc. 5547 Peachtree Industrial Chamblee, GA 30341 (404)-451-2777

Blvd.

Mavidon Corp. 3953 Bryner Terrace Palm City, FL 34990 (407)-286-8951

Corp.

The P.D. George Co. 5200 N. 2 St. st. Louis, MO 63147 (314)-621-5700 Hardman Inc. 600 Cortlandt Belleville, (201)-751-3000

Key Polymer Corp. Jacob's Way Lawrence Industrial P.O. Box 1529 Lawrence, MA 01842 (508)-683-9411

993

Addresses

St. NJ 07109

Mereco Division Metachem Resins Corp. 1505 Main St. West Warwick, RI 02893 (401)-822-9300/(800)-556-7164 Miller-Stephenson George Washington Danbury, CT 06810 (203)-743-4447

Chemical Highway

Co.

994


National Starch and Chemical P. 0. Box 6500 Finderne Ave. Bridgewater, NJ 08807 (201 )-685-5000/(800)-532-1115

Sauereisen Cements 160 Gamma Drive Pittsburgh, PA 15238 (412)-963-0303

Norland Products Inc. 695 Joyce Kilmer Ave. New Brunswick, NJ 08902 (201)-545-7828 Oneida Electronic Mfg. P.O. Box 678 Meadville, PA 16335 (814)-336-2125

Inc.

Pacer Technology 9420 Santa Anita Ave. Rancho Cucamonga, CA 91730 (714)-987-0550/(800)-538-3091 Permabond International 480 South Dean St. Englewood, NJ 07631 (201 )-567-9494 Permagile Industries Inc. 101 Commercial St. Plainview, NY 11803 (516)-349-1100/(800)-645-7546 Pierce & Stevens Industrial Group Pierce & Stevens Corp. Box 1092 Buffalo, NY 14240 (716)-856-4910 Products Research & Chemical 5426 San Fernando Road P.O. Box 1800 Glendale, CA 91209 (818)-240-2710/(800)-331-5865 Quadrant Chemical Corp. 200 Industrial Blvd. McKinney, TX 75069 (214)-542-0072

Ranbar Technology Inc. 1114 William Flinn Highway Glenshaw, PA 15116 (412)-486-1111

Sheldahl P.O. Box 170 Northfield, MN 55057 (507)-663-8000 Smooth-On, Inc. 1000 Valley Rd. Gillette, NJ 07933 (201)-647-5800 Symplastics Inc. 3718 Clifton Place Montrose, CA 91020 (818)-249-7810 3M Co. 3M Center St. Paul, MN 55144 (612)-733-2194 TACC International Corp. Air Station Industrial Park P.O. Box 535 Rockland, MA 02370 (617)-878-7015 Tecknit 129 Dermody St. Cranford, NJ 07016 (201)-272-5500 Tesa Tuck Inc. 1 LeFevre Lane New Rochelle, NY 10801 (914)-235-1000/(800)-426-2181 Thermoset Plastics, 5101 East 65 St. P.O. Box 20902 Indianapolis, IN (317)-259-4161

Inc.

46220

Suppliers'Addresses 995

Tra-Con, Inc. 55 North st. Medford, MA 02'55 (6'7)-39'-5550/(800)-872-266' Transene Co., Inc. Route One Rowley, MA 0'969 (508)-948-250'/948-28" J. H. Young Co., Inc. 8 Symington Place Rochester, NY '46" (7'6)-235-7698 Ziegler Chemical & Mineral Allied Asphalt '00 Jericho Quadrangle Jericho, NY "753 (5'6)-68'-9600/(20')-752-4"'

Corp.

Trade Name Index

996

Trade Name Index

Trade Name

Supplier

ABLEBOND ABLEFILM ABLESTIK ABOCAST ABOCOAT ABOCURE ABOWELD ACRYLANE ALLABOND TWENTY ALUSEAL AMICON ANA-LOK

Able&k Ablestik Ablestik Abatron Abatron Abatron Abatron Furane Products Bacon Industries

TWENTY/

997

AQUAHYDE AQUA-THERM ARALDITE ARCLAD AREMCO AREMCO-BOND AREMCO-COAT AREMCO-SHIELD ARLON AS1 AUTOCRETE

Sauereisen Cements Emerson & Cuming Pacer Technology Pacer Technology Dock Resin John C. Dolph Ciba-Geigy Corp./(Symplastics Inc.)* Adhesives Research Aremco Products Aremco Products Aremco Products Aremco Products Arlon American Sealants Flexbar Machine

BACON BLACK MAX BOSTIK BOSTIK BOSS

Bacon Industries Loctite Bostik Bostik

CASCHEM CASTALL CASTALL QUICK CURE CERAMACOAT CERAMA-DIP CHIPBONDER CHO-BOND CHO-FLEX CHO-SHIELD

CasChem Castall Castall Aremco Products Aremco Products Loctite Chomerics Chomerics Chomerics

*Parentheses

indicate that the company listed is a distributor.

998


Trade Name

Supplier

CONASTIC CONATHANE CONDUCTINE TWENTY/ TWENTY CONDUCT-X CONKOAT CON/RTV CORONA DOPE COTRONICS

Conap Conap Bacon Industries

DEBONDER DECAP D.E.N. DEPEND D.E.R. DEVCON DOLPHON DOLPH SPRAY DOW CORNING DRI-LOC DURALCO DURAPOT DUSIL DYMAX DYNAMOLD DYNASOLVE

Pacer Technology

ECCOSIL ELECTRO-SCIENCE ELECTROTEMP EMCA-REMEX EMFLOW EMI-RF1 SHIELD EPIBOND EPI-SEAL EPOCAP EPOCAST EPOLITE EPO-TEK EPOTHERM EPOWELD EPOXIT ESL

Emerson & Cuming Electra-Science Laboratories Sauereisen Cements Ablestik Laboratories (GC Electronics) Furane Products Bonded Products HaIdrmUl Furane Products Hexcel Chemical Products Epoxy Technology Transene Hardmall Abatron Electra-Science Laboratories

Electra-Kinetic Systems (GC Electronics) Tecknit (GC Electronics) Cotronics

Dyna’oy Dow Chemical Loctite Dow Chemical ITW Devcon John C. Dolph John C. Dolph Dow Corning Loctite Cotronics Cotronics Ducey Chemical Dyn== Dynamold Dyndoy

Trade Name Index Trade Name

Supplier

5-MINUTE FARADEX FINITE FLEXBOND FLEXCONNECT FLEXSEAL FURANE

ITW Devcon Transene Finite Industries Furane Products Sheldahl Loctite Furane Products

GC BOND GE GEL-WELD GR-R-RIP

(GC Electronics) General Electric (GC Electronics) (GC Electronics)

HC HEAT-AWAY HI HI-THERM HIGH VOLTAGE HP HYBRISIL

Pacer Technology Aremco Products Pacer Technology John C. Dolph (GC Electronics) Pacer Technology Transene

PUTTY

IDEAL IMPREG WAX IMPRUV INSA-LUTE INSTANT-WELD INSUL-BOND INSULCAST INSULCURE INSUL-VOLT

American Biltrite Ziegler Chemical & Mineral Loctite Sauereisen Cements Oneida Electronic Transene Permagile Industries Permagile Industries (GC Electronics)

JET-MELT

3M

KALEX KAPTON

HaNlnlall DuPont/(American B&rite) DuPont/(CHR Industries)

LIGHT-WELD LIQUID-TAPE LIS LITE-TAJS LOCQUIC LOCTITE

Dym=

(GC Electronics) Loctite Loctite Loctite Loctite

999

1000


Trade Name

Supplier

MAGNOBOND MAGNOLIA MAVIDON MBS MERECO META-CLAD METACOTE METADUCT META-GEL METALSET META-SHIELD METASIL METRE-GRIP METRE-SET MONOPOXY MULTI-CURE

Magnolia Plastics Magnolia Plastics Mavidon Transene Mereco Mereco Mereco Mereco Mereco Smooth-On Mereco Mereco Mereco Mereco Division Hardman Dym=

NEA NELTAPE NEUTRAFLUX NICKEL-BOND NOMEX NORLAND NORYL NUVA-SIL

Norland Products Dielectric Polymers Transene Transene Dtiont/(Arlon) Norland Products General Electric Corp. Loctite

OHMEX-AG OHM-RESIST OUTPUT

Transene Transene Loctite

PACER-X PEDIGREE PERMABOND PERMABOND PLIOBOND POLY CAST POLYCIN POWERBOND PRIMA SOLDER PRINT KOTE PRISM PRO GRIP PRO-LOCK

Pacer Technology P.D. George Co. Permabond International (GC Electronics) Ashland Chemical General Polymers CasChem Permabond International A.I. Technology (GC Electronics) Loctite Fel-Pro Chemical Products Fel-Pro

Trade Name Index Trade Name

Supplier

PRONTO PRO-TECH P&S PX PYRO-DUCT PYRO-PAINT PYRO-TAPE

3M Pacer Technology Pierce & Stevens Pacer Technology Aremco Products Aremco Products Aremco Products

Q DOPE QUICKBOND QUICK STIK QURE

(GC Electronics) Mavidon Permabond International (GC Electronics) CasChem

RED GLPT RED-X RTM RTV

(GC Electronics) (GC Electronics) Transene GE Silicones

SAUEREISEN SCOTCH-WELD SHADOWCURE SHELDAHL SILFLEX SILITE SILVER-BOND SPEEDBONDER STATIC HALT STRIP-N-STICK STYCAST SUPERBONDER SUPER GLUE SUPER INSTANT SUPERSET SUPERTHERM SYMPOXY SYNTHITE

Sauereisen Cements 3M Loctite Sheldahl Furane Products ITW Devcon Transene Loctite (GC Electronics) CHR Industries Emerson & Cuming Loctite (GC Electronics) Smooth-On Apple Adhesives Tra-Con Symplastics John C. Dolph

2-TON TACK FILM TACTIX TAK PAK T-BOND

ITW Devcon A.I. Technology Dow Chemical Loctite Permagile Industries

Q-MAX

1001

1002


Trade Name

Supplier

TECK-BOND TECKNIT TEMP-R-TAPE TESABELT TESAFILM THERMELEC THERMID THERMOSET THERM-X TRA-BOND TRA-CAST TRA-DUCT TRANSENE TRANSEPOXY TRANSISTOR TRA-SHIELD TRU-BOND TRU-CAST TX

Tecknit Tecknit CHR Industries Tesa Tuck Tesa Tuck Ranbar Technology National Starch and Chemica Thermoset Plastics American Biltrite Tra-Con Tra-Con Tra-Con Transene Transene Transene Tra-Con Fenwal Fenwal Pacer Technology

EPOXY

Loctite Furane Products

ULTRA TAK PAK URALANE URESOLVE URESOLVE PLUS

Dyndoy Dyndoy

VORITE

CasChem

WELD-ON

IPS Corp.

x-NMS

Loctite

ZIP GRIP

ITW Devcon

Adhesives, Sealants and Coatings for the Electronics Industry

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