SECOND EDITION
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE D. Sangeeta John R. LaGraff
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SECOND EDITION
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE D. Sangeeta John R. LaGraff
CRC PR E S S Boca Raton London New York Washington, D.C.
© 2005 by CRC Press
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Library of Congress Cataloging-in-Publication Data Sangeeta, D. Inorganic materials chemistry desk reference.—2nd ed. / D. Sangeeta and John R. LaGraff. p. cm. Includes bibliographical references and index. ISBN 0-8493-0910-7 (alk. paper) 1. Inorganic compounds—Industrial applications—Handbooks, manuals, etc. I. LaGraff, John R. II. Title TP200.S26 2004 661—dc22 2004051930
This book contains information obtained from authentic and highly regarded sources. Reprinted material is quoted with permission, and sources are indicated. A wide variety of references are listed. Reasonable efforts have been made to publish reliable data and information, but the author and the publisher cannot assume responsibility for the validity of all materials or for the consequences of their use. Neither this book nor any part may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying, microfilming, and recording, or by any information storage or retrieval system, without prior permission in writing from the publisher. The consent of CRC Press does not extend to copying for general distribution, for promotion, for creating new works, or for resale. Specific permission must be obtained in writing from CRC Press for such copying. Direct all inquiries to CRC Press, 2000 N.W. Corporate Blvd., Boca Raton, Florida 33431. Trademark Notice: Product or corporate names may be trademarks or registered trademarks, and are used only for identification and explanation, without intent to infringe.
Visit the CRC Press Web site at www.crcpress.com © 2005 by CRC Press No claim to original U.S. Government works International Standard Book Number 0-8493-0910-7 Library of Congress Card Number 2004051930 Printed in the United States of America 1 2 3 4 5 6 7 8 9 0
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About the Authors Dr. D. Sangeeta* is a maintenance cost risk manager for GE Aircraft Engines. Prior to that she worked in GEAE’s Quality & Marketing organizations. She moved to GEAE from General Electric Global Research Center, where she worked as a materials scientist in the ceramics laboratory conducting a variety of inorganic materials chemistry-related projects on gas turbine repair technology. Prior to joining General Electric in March 1994, she was a research scientist at Battelle in Columbus, Ohio. There, she conducted research and development in the areas of sol-gel processing, metal organic chemical vapor deposition, and supercritical drying to produce ceramic films, powders, and monolithic composites. She currently holds 26 patents in the area of materials science. Dr. Sangeeta was a research associate in the materials science department at the University of Illinois, Urbana, in 1989. As a research associate she conducted research relating to sol-gel processing of ferroelectric thin films and zirconia powders. She completed her Ph.D. in chemistry with Professor W. G. Klemperer at the School of Chemical Sciences, University of Illinois, UrbanaChampaign. Her thesis work involved understanding the molecular growth pathways in silica solgel processing. She obtained her master’s degree in chemistry from the Indian Institute of Technology, Kanpur, in 1984 and her bachelor’s degree in science from Christ Church College, Kanpur, India, in 1982. John R. LaGraff is currently a lecturer in both the Physics and Chemistry Departments at Rensselaer Polytechnic Institute in Troy, New York, where he teaches general physics and chemical principles for engineers. John is also a research scientist at the New York State Department of Health’s Wadsworth Research Center in Albany, New York, where he conducts research in proteinsubstrate interactions and their application to nanobiotechnology. John LaGraff has also taught courses in physical chemistry, general chemistry, inorganic chemistry, nanoscience and materials science at Union College and Hamilton College. John LaGraff’s academic training includes a National Science Foundation Postdoctoral Fellowship in Chemistry at the University of Illinois, Urbana Champaign, where his research focused on in situ scanning probe microscopy (SPM) of nanoscale electrochemical processes on single crystal metal surfaces. This work included some of the first studies using oxide and self-assembled monolayers as nanoscale resists for SPM based electrochemical nanolithography. He received his Ph.D and M.S. degrees in ceramic science, respectively, from the University of Illinois and the New York State College of Ceramics at Alfred University, Alfred, New York. His thesis work was in the area of single crystal growth, fluorine doping and characterization of superconducting oxides. John has a B.S. degree in chemical engineering from Syracuse University. Dr. LaGraff has published approximately 30 papers, made over 60 invited or contributed presentations, and holds 8 patents.
* Formerly Sangeeta D. Ramamurthi.
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Preface to Second Edition The primary purpose of this second edition of Inorganic Materials Chemistry Desk Reference remains its value as a resource to assist in the preparation of solid state inorganic materials by chemical processing techniques. The idea for a second edition was conceived several years ago in an effort to both add new chemical precursors available to the Materials Scientists and to include existing or emerging topics where materials chemistry plays an important role, such as microelectronics, surface science, and nanotechnology. Additions to Chapter 1 include discussion of the role of materials chemistry in micro- and nano-fabrication, surface materials chemistry, self-assembly, scanning probe microscopy, and carbon fullerenes. The glossary in Chapter 2 contains over 200 new definitions related to the aforementioned topics. Chapter 3 has been greatly expanded to include 50% more new chemical precursors and their properties. The reader is referred to the preface of the first edition (following page) for more information regarding this book. JRL would like to acknowledge D. Sangeeta for inviting him to assist in the preparation of the second edition. JRL acknowledges helpful discussions with Professors Gwo-Ching Wang and Quynh Chu-LaGraff, and Dr. James N. Turner. Some of this material is based upon work supported by the National Science Foundation under Grant No. DBI-0304415. Any opinions, findings and conclusions or recommendations expressed in this material are those of the authors and do not necessarily reflect the views of the National Science Foundation (NSF). JRL would like to thank his wife, Quynh Chu-LaGraff, and their three sons, Luc, Giac, and Thai, for their patience and support. D. Sangeeta J.R. LaGraff
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Preface to First Edition This Inorganic Materials Chemistry Desk Reference is meant to be a resource to assist in the preparation of solid state inorganic materials by chemical processing techniques. Ceramic materials can be prepared by a variety of chemical routes and this handbook provides a brief introduction to inorganic materials chemistry and these processing routes, along with definitions of most commonly used terms in the field. The focus of the desk reference is a compilation of property data on inorganic precursors and on inorganic solids to assist in the selection of candidate precursors and materials for a variety of applications. The idea for such a resource for inorganic materials chemistry was conceived from my personal experience with initiating new materials chemistry-related projects, all of which began by necessity with the painstaking effort required to collect relevant information from a multitude of sources, including textbooks, handbooks, journals, proceedings, and magazines. Beginning with my thesis and postdoctoral work on sol-gel processing at the University of Illinois with Professors W. G. Klemperer and D. A. Payne, I found myself devoting a considerable fraction of my efforts to collecting relevant information in the area of materials chemistry. During my work at Battelle in Columbus, Ohio, and subsequently following my move to the General Electric Corporate Research and Development Center, it was clear to my colleagues and to me that there is a pressing need for a resource that not only explains the terms frequently used in the inorganic materials chemistry field, but also provides data on the physical properties of the precursors available for use in chemical processing techniques. Such questions as “What precursor can I select to prepare this inorganic solid?” and “Which precursor (from the processing point of view) is suitable or viable for this process?” are the types of questions that scientists and engineers need quick answers to in order to initiate a successful materials chemistry project. This resource provides a rapid reference to help answer these and other such questions. In addition, it provides physical property data on inorganic solids to answer questions such as “What kind of properties should I expect from this or similar materials?” The desk reference begins with a general introduction to the area of inorganic materials chemistry with an emphasis on chemical processing routes. Several sources of additional information are provided for newcomers to the field and for the experienced practitioners as well. The second chapter provides a quick reference to many commonly used terms in the field of inorganic materials chemistry. The primary purpose of the desk reference, that of providing data on inorganic precursors and ceramic materials, is served in Chapter 3 and Chapter 4. The third chapter is a compilation of physical property data on various organometallic, metal organic, and inorganic salt precursors used in the processes described in Chapter 1. The fourth chapter consists of seven sections detailing physical property data on inorganic solids, including oxides, carbides, nitrides, borides, selenides, tellurides, and sulfides, among others. As with any new idea, this resource is a start at compiling and organizing the information currently available. A concerted effort has been made to include all of the relevant information referenced in the multitude of published sources. However, in an emerging area such as this, new processes and products are being invented and discovered every day making it impossible to include every piece of information. With time, as more relevant information is published, this desk reference will be expanded and revised. Suggestions and input from readers are welcome and will be acknowledged gratefully. I would like to acknowledge CRC Press for inviting me to write this book and Prof. Edwin Boyer for encouraging me to take on this project. I would also like to acknowledge the contributions of the technical reviewers in their reviews of various sections of this book. Helpful discussions with Drs. William McDonald, S. Venkataramani, and James Ruud are gratefully acknowledged. I would like to thank my husband, Dr. R. Mukund, for providing key suggestions and for providing editorial and moral support throughout the project. Finally, I would like to thank my daughter, Dipali, for going to sleep on time so I could get to work at night. D. Sangeeta
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Reviewers of Second Edition Prof. Leslie A. Hull Union College Department of Chemistry Schenectady, New York
Prof. Jay J. Senkevich Rensselaer Polytechnic Institute Department of Physics, Applied Physics, and Astronomy Troy, New York
Prof. Sheo K. Dikshit Indian Institute of Technology Department of Chemistry Kanpur, India
Reviewers of First Edition Dr. Scott L. Swartz NexTech Materials, Ltd. Worthington, Ohio Prof. Sheo K. Dikshit Indian Institute of Technology Department of Chemistry Kanpur, India Prof. Leonard V. Interrante Rensselaer Polytechnic Institute Department of Chemistry Troy, New York
© 2005 by CRC Press
Dr. Van E. Wood (Retired) Battelle Memorial Institute Columbus, Ohio Prof. Walter G. Klemperer University of Illinois School of Chemical Sciences Urbana, Illinois Dr. Barry Arkles Gelest Inc. Tullytown, Pennsylvania
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Contents Chapter 1 Introduction to Inorganic Materials Chemistry I. Introduction II. Preparation and Processing of Inorganic Materials A. Sol-Gel Process B. Hydrothermal Process C. Supercritical Drying Process D. Freeze-Drying Process E. Metal Organic Decomposition F. Metal Organic Chemical Vapor Deposition G. Aerosol Processes III. Microfabrication A. Microelectronics B. Microelectromechanical Systems (MEMS) Fabrication IV. Precursors A. Inorganic Salts B. Metal Organic Compounds C. Organometallic Compounds D. Polymeric Precursors E. Colloidal Suspension V. Additives VI. Surface Materials Chemistry VII. Nanotechnology A. Nanofabrication B. Self-Assembly C. Microcontact Printing. D. Nanotechnology Materials: Carbon Fullerenes VIII. Characterization Techniques A. Scanning Probe Microscopy B. Techniques 1. Elemental Analysis 2. Molecular and Solid State Analysis 3. Surface Characterization Techniques IX. Selected Sources of Information in Materials Chemistry A. Books B. Monographs/Proceedings C. Journals References Chapter 2 Definitions of Terms Used in Inorganic Materials Chemistry General References Selected References Chapter 3 References
Physical Properties of Inorganic Materials Precursors
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Chapter 4 Properties of Solid-State Inorganic Materials I. General Properties II. Electrical Properties References III. Magnetic Properties References IV. Optical Properties References V. Structural Properties References VI. Superconducting Compounds Sources VII. Thermal Properties References
© 2005 by CRC Press
CHAPTER 1 Introduction to Inorganic Materials Chemistry I. INTRODUCTION Inorganic materials chemistry encompasses technologies that have traditionally existed in both inorganic chemistry and ceramics. Inorganic materials chemistry applies the expertise developed in inorganic chemistry to developing ceramic and glassy materials with improved properties and relative ease of processing. Growing acceptance in recent years of the importance of chemistry to materials preparation and processing has resulted in the recognition of materials chemistry as a distinct subdiscipline of chemistry. Materials chemistry in general can be defined as the chemical science that deals with the preparation, processing, and analysis of solid state materials. Inorganic materials chemistry, in particular, relates to the preparation, processing, and properties of inorganic materials, such as metal carbides, borides, nitrides, oxides, sulfides, selenides, tellurides, and their combinations.1 In contrast to conventional ceramic and glass processing, which require high temperatures and high pressures, inorganic materials chemistry involves preparation and processing of inorganic materials under relatively milder temperature and pressure conditions. The chemical route to ceramic materials can provide not only a milder route to ceramic and glassy materials, but also an opportunity to prepare unusual forms of existing materials such as epitaxial films, transparent films of otherwise opaque material, stable colloidal suspensions, submicron powders, and microporous membranes. Inorganic materials chemistry can also provide the opportunity to prepare novel multicomponent systems that are otherwise difficult to prepare by conventional techniques. Multicomponent systems such as Y, Ba, and Cu (1-2-3) oxide superconductors, for example, can be prepared in various forms, including films and powders prepared using novel chemical routes such as sol-gel and colloidal processing. Also, some materials, such as crystalline lead zirconate titanate [Pb(Zr,Ti)O3], which could previously be prepared only in a monolithic form or as single crystals, can now be fabricated using chemical processing techniques as polycrystalline films with properties similar to single crystals. The preparation and characterization of novel materials are currently the most popular research topics among the many areas of research in materials chemistry. Topics of interest include the development of precursors for glass, ceramic, metal, and semiconductor materials, wet chemical processing, gas phase film deposition and powder preparation, molecular, and micro- and macroscopic characterization of the resultant solid-state materials. The processing aspects of materials chemistry present the greatest opportunity for research and may deal with a variety of individual techniques, such as sol-gel processing, surface science, metal organic decomposition (MOD), metal organic chemical vapor deposition (MOCVD), colloidal processing, and nanoscale materials synthesis.
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Another important area of materials chemistry that is gaining interest is the study of the interaction between materials and their environment. These types of interactions can be characterized as corrosion, adhesion, oxidation, mechanical or chemical abrasion, thermal expansion, and chemical sensing processes. A complete understanding of such topics requires expertise in surface science, analytical chemistry, chemical kinetics, thermodynamics, and modeling of chemical processes. A common focus of such studies is the application of chemical methodologies to provide a molecular level understanding as well as improved control over the properties of the resultant materials and the interaction of these materials with the environment. Materials chemistry is also finding widespread application in areas with a strong surface science component including microelectronic processing of thin films, nanotechnology, and biotechnology. For example, new etching and cleaning solvents are being developed to assist in fabricating high aspect ratio microelectromechanical systems (MEMS), which may consist of micron-scale (and smaller) moving parts or channels to direct fluid flow across a substrate.
II. PREPARATION AND PROCESSING OF INORGANIC MATERIALS In this section, a variety of materials preparation and processing approaches to solid-state materials in various forms are described briefly. The types of processes discussed include the solgel process, colloidal processing, hydrothermal processing, freeze-drying, supercritical drying, MOD, MOCVD or CVD, and flame hydrolysis. Of these processes, sol-gel, colloidal, and hydrothermal processing are often referred to as wet chemical processing. A. Sol-Gel Process The sol-gel process is a wet chemical route to a variety of glass and ceramic compositions. It has been mainly used for compositions and forms such as certain multicomponent systems and films of specific compositions that are not easily available or possible by conventional ceramic processing methods. In the sol-gel process, the precursors are mixed to form sols (clear to cloudy) that undergo polymerization, forming a gel. By controlling reaction conditions such as solution pH, type of precursors and solvents, reaction temperature, and additives, a variety of physical forms can be produced including films, fibers, microspheres, and monoliths. For fabricating films or fibers, the viscous liquid is used for coating films or drawing fibers. The viscosity of the liquid is carefully controlled to provide the desired physical characteristics of the film or fiber. Fine ceramic powders are produced by the sol-gel process, sometimes referred as the gel precipitation process, by varying the reaction conditions, such as the solution pH and the type of solvent media used. Monoliths are normally prepared by drying the gel in a mold. The sol-gel process has advantages and disadvantages over conventional processes. Advantages include the ability to precisely control the stoichiometry, the possibility of producing multicomponent materials not previously available, and the ability to produce high-purity materials for electronics and optics without much investment in equipment. However, drawbacks of the sol-gel process include solvent waste, large-volume shrinkage during drying, and high precursor costs. For each application, the advantages and disadvantages of the sol-gel process must be considered in comparison with other processes. The use of sol-gel techniques for producing films has, in particular, generated considerable commercial interest because of the versatility of the process in producing multicomponent homogeneous compositions with ease and cost-effectiveness. Among ceramic compositions, oxides are the most common composition prepared by the solgel process, where the precursors are hydrolyzed in water and are air dried. A general sol-gel reaction to yield oxide systems with a single component where metal alkoxides are used as precursors is given below:
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→ M x Oy/2 + yROH M x ( OR ) y + y/ 2 H2 O ROH
where R is an alkyl or aryl. The above reaction results from two intermediate reactions called hydrolysis and condensation, which can be represented by the following equations: M x ( OR ) y + H2 O → M x ( OR ) y−1 ( OH ) + ROH
hydrolysis:
condensation: M x ( OR ) y + M x ( OR ) y−1 ( OH ) → ( OR ) y−1 M x OM x ( OR ) y−1 + ROH or M x ( OR ) y−1 ( OH ) + M x ( OR ) y−1 ( OH ) → ( OR ) y−1 M x OM x ( OR ) y−1 + H2 O The above condensed species undergo further condensation during drying and heat-treatment processes, which results in the formation of oxides. Examples of such single-component oxide systems are 3 Si ( OCH3 )4 + 2 H2 O → SiO2 + 4 CH3 OH
CH OH
The hydrolysis and condensation reactions can be represented by Si ( OCH3 )4 + H2 O → Si ( OCH3 )3 ( OH ) + CH3 OH Si ( OCH3 )4 + Si ( OCH3 )3 ( OH ) → ( OCH3 )3 SiOSi ( OCH3 )3 + CH3 OH Si ( OCH3 )3 ( OH ) + Si ( OCH3 )3 ( OH ) → ( OCH3 )3 SiOSi ( OCH3 )3 + H2 O Other materials such as sulfides and other chalcogenides can also be prepared by the above process, with H2S or thiols normally used as sulfidating agents to form the sulfides. Carbides and nitrides can be prepared by carefully selecting appropriate alkoxide and other precursors that decompose after polymerization into carbides and nitrides with minimal oxide impurities, under reducing or nitridating (ammonia) atmospheres. The preparation process for carbides, nitrides, and borides can also be classified as an MOD process, as described later in this section. A variety of precursors have been used in the sol-gel process, and their relevant physical properties are tabulated in Chapter 3. The properties of the end products, a variety of different glass or ceramic compositions, are categorized and listed in Chapter 4. Colloidal processing is a sol-gel process in which the starting material is a colloidal suspension instead of molecular precursors. This wet chemical method is used for preparing solid-state inorganic materials from a colloidal system with the size of the dispersed phase particles ranging between 1 nm and 1 µm in at least one dimension. In order to produce a stable colloidal suspension, dispersing agents are employed or the pH of the suspension is adjusted to finely disperse the colloidal particles. A number of materials have been prepared by the above method, including UO2–PuO2 nuclear fuel spheres produced from a stable suspension of uranyl nitrate, plutonium nitrate, a modifying agent, and a gelling agent. In this example, the suspension was gelled with ammonia, washed with water, and dried prior to sintering. This route is sometimes also referred to as a gel-precipitation route.
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Other examples of colloidal processing include the preparation of monodispersed alumina and silica spheres or polydispersed titania and ceria powders from colloidal suspensions of their precursors. Fine ceramic particles can also be prepared by a sol-emulsion-gel process, in which the reactants are suspended as micelle2 in a nonmiscible solvent with the aid of a surfactant, and the droplets are then gelled to form ceramic particles. The particles are then isolated by conventional processing routes. The sol-emulsion-gel process can also be classified as a colloidal processing route. Fine zirconia particles in the range of 4 to 6 nm have been prepared by this process with ZrO(NO3)2 and NH3 reactants in xylene solvent. The zirconyl nitrate precursor was dissolved in water and dispersed in xylene using a surfactant, Tween 80. The droplets were then gelled with ammonia gas, and the resultant fine zirconia powder was separated by distillation and multiple solvent washing.3 B. Hydrothermal Process The hydrothermal process is a method of forming ceramic powders by heating and pressurizing solutions or suspensions of metal salts, oxides, hydroxides, or metal powders in water and, on occasion, in other solvents. The process is conducted in a pressure vessel called an autoclave. Normally, as the mixture is heated in this closed system, the pressure rises and these conditions result in the formation of submicron particles with controlled size and shapes.6 This route has been used to prepare a variety of monodispersed powders, materials with specific crystalline phases, and particles with controlled size and shapes, frequently at temperatures lower than those required in normal processing procedures. The hydrothermal process promotes the formation of monodispersed spheres by providing the appropriate conditions needed for homogenous nucleation. For example, monodispersed metal oxide powders are formed by homogeneous nucleation of metal hydroxide particles, which are produced by forced hydrolysis of metal alkoxides using heat and pressure in an autoclave. Forced hydrolysis is normally achieved by controlling the release of the precipitating ion. A route to yttrium-stabilized zirconia powder illustrates this concept. The reactants, yttrium chloride, zirconium oxychloride, and urea, CO(NH2)2, are mixed in an autoclave, in which the urea decomposes at temperatures between 160 and 220ºC under 5 to 7 MPa, releasing ammonia. The ammonia then reacts with the metal salts in water to form hydroxides. These hydroxides are then washed, dried, sintered, and crushed to form fine yttrium-stabilized zirconia powder.4 In other cases, the hydrothermal process can promote phase transformation. For example, tetragonal zirconia for structural applications can be prepared by such a process. Amorphous zirconia precipitated from ZrCl4 and NH4OH can be aged in an autoclave between 513 and 1093 K at 100 MPa pressure in water to form a tetragonal phase of zirconia in addition to the normal monoclinic phase.5 Metal oxides that cannot be prepared by normal oxidation of metals in an oxidizing atmosphere can also be prepared by hydrothermal processes. For example, hafnium (Hf) particles were only surface oxidized to HfO2 in water between 300 and 400ºC as a result of the formation of an oxide layer that protected the interior of the metal chips.6 However, under 50 to 150 MPa and between 300 and 700ºC in an autoclave, Hf was completely oxidized to HfO2. Complete oxidation occurs in the autoclave because the hydrides of hafnium are formed under the elevated temperature and pressure conditions, which then quickly convert to the hafnium oxide. C. Supercritical Drying Process The supercritical drying process is used for producing fine ceramic powders or monolithic materials with extremely high porosity. The supercritical drying process normally involves preparing a gel containing a large volume fraction of liquid, following which the liquid is removed above its
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critical point (hence, no surface tension) without collapsing the solid state structure in the gel. As a result, a highly porous structure called an aerogel is formed that has intricate porosity. An extensive body of information on supercritical drying exists in the area of aerogels.7 As the term indicates, aerogels are solid-state structures when the pores are filled with air and are formed by replacing the liquid in a gel with air. Much of the research in this area has focused on silicatype aerogels in both monolithic and powder forms. Some silica aerogels have been prepared with porosities up to 99.99%.8 Silica gels are normally prepared using alkoxides: Si ( OR )4 + H2 O + ROH → SiO2 + ROH where R is an alkyl (CH3, C2H5, etc.). In the above sol-gel reaction, the only by-product is a liquid, an alcohol. The gel thus formed contains alcohol trapped in the silica solid-state network. If the liquid is removed by evaporating the alcohol, the solid-state structure would collapse from the capillary pressure developed as a result of the surface tension of the liquid. However, at or above the critical point of the liquid the surface tension of the liquid disappears. Hence, under supercritical conditions the liquid can be removed without collapsing the solid-state structure, thus forming a highly porous silica material with fine particles. The solid-state network is built up of these interconnected primary particles. Certain ceramic powders have been prepared by a supercritical method called rapid expansion of supercritical solutions. In this method,9 solute nucleation and condensation occur within an expanding supercritical jet. For example, SiO2 particles with diameters less than 5 µm were prepared by rapidly expanding a solution containing 3000 ppm of SiO2 soluble species at 743 K under 60 MPa through a 60-µm diameter stainless steel nozzle with flow rates of 0.7 cm3 s−1. The experimental conditions can be varied to change the resultant particle size. D. Freeze-Drying Process The freeze-drying process is used for preparing porous monolithic materials or unagglomerated powders. This process is similar to the supercritical drying process since the process also involves liquid removal from a mixture at zero surface tension without collapsing the structure. The liquid in the gel or a slurry is first frozen, then removed by the sublimation process without collapsing the structure. In the sublimation process, the frozen liquid converts to vapor without going through the liquid stage, thus avoiding surface tension–related capillary pressure. During the freezing process, however, some liquids undergo volume change, and the freezing process can therefore potentially damage the structure. As a result, this process is limited to preparing unagglomerated powders. A variety of oxide powders with narrow particle size ranges have been prepared by this method.9a E. Metal Organic Decomposition MOD is a material synthesis method in which metal organic compounds are decomposed to form a film, fiber, or powder without the use of vacuum or gel powder techniques. The precursors, metal organic compounds, used in the MOD process are coordinated covalent molecules with a metal atom bonded to an organic ligand via bridging oxygen, sulfur, phosphorus, or nitrogen atoms. For example, carboxylates, alkoxides, and thiolates are metal organic compounds that are frequently used as precursors to oxides and sulfides. Some of these precursors can be used to produce metal coatings by decomposing or heat-treating the precursor or its solution in a reducing environment (e.g., H2, N2, Ar, etc.). Nitride coatings can also be produced from precursors where the organic ligand is bonded to the metal atom via a nitrogen atom. Nitride coatings produced by this process contain carbon impurities that can be minimized by heat-treating the material under an ammonia or nitrogen atmosphere.
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A similar process is used to prepare metal films or metal carbide films from organometallic precursors where the organic ligand is bonded to the metal directly via a carbon atom. The compounds with aryl or alkyl ligands bonded to the metal atom are suitable precursors for metal carbide–type coatings. For example, a carbosilane oligomer mixture (e.g., [–(R)2Si–CH2–Si(R)2–CH2–]n) with an Si–C backbone, dissolved in a solvent is deposited on a substrate and heat-treated from 600 to 800ºC under argon to form an SiC film. When polymers are used in this process instead of compounds or molecules, it is referred to as polymer pyrolysis. For example, polysilanes, polycarbosilanes, and polysilazanes can be pyrolyzed to form fibers or coatings of silicon carbide or silicon carbonitride.10 Metal coatings (e.g., platinum) can be prepared from organometallic precursors in reducing atmospheres by MOD. The precursors normally selected for this process should decompose without evaporating, melting, or leaving a carbon residue. To minimize volume change, precursors must also have a high metal content and a high char yield. Solid precursors require high solubility in the chosen solvent. The compounds must be stable under ambient conditions, with minimum sensitivity to air or moisture. Compatibility between the decomposition temperatures of precursors in a multicomponent system is also desirable. From a processing perspective, it is also desirable that the decomposition of the precursors not result in the formation of toxic gases. Considering the above requirements, precursors with carboxylate ligands with or without alkoxide or amide ligands are typically suitable.11 MOD should not be confused with the MOCVD method of depositing film from gases or vaporized liquid precursors under vacuum conditions.12 The techniques used for depositing and curing the films in MOD are similar to the techniques used for photoresist coating or screen printing in the electronics industry. Factors critical to achieving uniform continuous films include substrate wettability, solution or liquid viscosity, solvent type, and the curing mechanisms needed to convert an amorphous film to a crystalline film. The solutions are normally filtered to remove any particles that may cause defects in the film. The curing or pyrolysis methods used in the process can alter the crystalline phase, the grain size, and the resultant properties of the film. Nonconventional curing techniques, such as rapid thermal annealing, electron beam annealing, and lasers, have been used to alter the physical properties of the film. Compositions such as BaTiO3, SrTiO3, PbTiO3, ITO (indium-tin oxide), SnOx, YBa2Cu3O7, Pt, Au, Ag, and Pd have been deposited as films on a variety of substrates using the MOD method. Coating compositions containing dopants have also been prepared by this method. MOD has been successfully used in composite preparation. For example, SiC composites are prepared by impregnating the preforms with carbosilane polymers, which are then decomposed to yield silicon carbide. F.
Metal Organic Chemical Vapor Deposition
The MOCVD process is a type of CVD technique in which metal organic compounds, often in combination with hydrides or other reactants, are used as volatile precursors to deposit coatings on substrates. The CVD process is a method used to fabricate films or to coat particles in a fluidized bed, where the chemical constituents react near or on the heated surface. CVD utilizes volatile precursors capable of evaporating without decomposition. In contrast to the established CVD precursors, the MOCVD precursors typically vaporize at much lower temperatures. In most cases, MOCVD reactions occur in the 500 to 1000ºC temperature range and at pressures ranging from 1 torr to atmospheric pressure, whereas the conventional precursors for CVD require at least 900ºC temperatures.13 Recently, research has shown that some metal organic precursors can be decomposed at even lower temperatures.13a The precursors used in MOCVD can also be activated by plasma by using electromagnetic radiation, which is particularly useful in systems with heat-sensitive substrates or surfaces. The thermal activation process, however, is the most commonly used method of activating precursors. The chemical reactions occurring during the MOCVD process may include thermal decomposition
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(pyrolysis), reduction, hydrolysis, disproportionation, oxidation, carburization, nitridation, or their combinations. MOCVD has been most commonly used for fabricating thin films of III-V semiconductor compounds, such as gallium arsenide (GaAs), indium arsenide (InAs), indium phosphide (InP), and gallium aluminum phosphide (GaAlP), particularly in epitaxial form. To prepare the above compositions, metal alkyls or aryls [e.g., In(CH3)3, As(CH3)3] and hydrides (e.g., PH3, AsH3) are commonly used as volatile precursors. For example, fabrication of GaAs film involves a reaction between trimethyl gallium and arsine that can be represented by the following equation: Ga( CH3 )3 + AsH3 → GaAs + 3CH3 MOCVD precursors and processing equipment are relatively expensive, thus limiting the use of the technology to applications where cost is not a barrier and high quality is desired. Owing to this limitation, MOCVD is currently used extensively only in the electronics industry14 and for producing advanced lasers and infrared detector–type applications. Chemical vapor infiltration (CVI) is a type of CVD technique used for porous structures such as foam or fibrous mats or weaves. As the hot gases infiltrate through the porous media, they react and deposit on the hot surfaces, and in some cases continuous deposition eventually fills up the pores to make a composite.6 CVI is frequently used for fabricating composites at lower temperature and pressure conditions than traditional composite-forming processes such as hot pressing and hot isostatic pressing. The milder conditions help retain the mechanical and chemical integrity of the substrate. However, a major limitation of CVI is the length of time it takes to fill up the preform pores and to prepare a composite. Because of the tortuous paths in the substrate samples, films must be deposited at lower temperatures and at a slower rate compared with CVD to avoid choking the channels. However, recent developments have improved the commercial viability of CVI. Forced CVI is a technique where the gas flow is restricted to the sample, hence forcing all of the gases through the channels in the sample and filling them up at a faster rate. Temperature gradients across the sample have also been used to speed up the CVI process. CVI has been extensively used in fabricating SiC composites, where SiC preforms are filled with SiC material by chemical vapor infiltration of hydrocarbon and silane vapors. Fluidized-bed CVD is a technique where the substrate is a powder particle and the powder is suspended in a flowing gas. In order to achieve the desired coating on the particles, the density and size of the particles and the velocity, density, and viscosity of the fluidizing gas are balanced so that the particles do not settle and clog the gas inlet. The oldest application of the fluidized-bed CVD technique is for coating nuclear fuel particles (uranium–thorium carbide) with pyrolytic carbon and silicon carbide. Propane and other hydrocarbon gases are normally used as the volatile precursors for pyrolytic carbon, and methyltrichlorosilane is the preferred precursor for SiC. Similarly, a zirconium carbide coating has been deposited by fluidized-bed CVD from zirconium tetrachloride and a hydrocarbon.6,15 G. Aerosol Processes Aerosol processes can be classified as material synthesis via gas-to-particle or droplet-to-particle conversion. In a gas-to-particle conversion, gases or vapors react forming primary particles that grow further by coagulation or surface reactions. Powders produced by this process have a narrow size distribution, and the process can yield nonporous spherical particles. Materials such as carbon black, silica, and titania are produced by the gas-to-particle conversion process in flame reactors. Flame hydrolysis, which is commonly used for producing fine silica powder, can be classified as a gas-to-particle conversion process. Fine ceramic powders can be prepared by the flame hydrolysis
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method in which the precursors are oxidized in a flame to form oxides in a wide range of particle sizes. For example, SiO2 powders have been prepared by flame hydrolysis from SiCl4 oxidation in an H2/O2 stationary flame. After formation of the primary SiO2 particles in the flame, the tiny droplets of SiO2 coalesce as they move away from the flame and form larger particles from aggregates to agglomerates of SiO2. The particles can then be separated by size. In the droplet-to-particle conversion process, solution or slurry droplets are suspended in a gaseous medium by liquid atomization, where the droplets react with gases or pyrolyze at high temperatures to form powders. The particle size distribution is determined by the droplet size or processing conditions such as particle breakup during pyrolysis or drying. The particles are mostly monodispersed and porous. Spray drying and spray pyrolysis are the most common industrial methods of producing powders by the droplet-to-powder conversion process.16 Freeze-drying of droplets is another technique in which powders are produced by droplet-to-particle conversion.
III. MICROFABRICATION A. Microelectronics Microelectronic fabrication requires the ability to deposit thin films and then pattern them into functioning devices which can include transistors, capacitors, resistors, memory devices, microelectromechanical systems (MEMS), light emitting diodes (LED), etc. Understanding and control of surface chemistries of various thin-film materials and the use of lithography techniques are very important in achieving reproducible high quality devices. In order to fabricate a solid state device, for example microchips, sensors, or biological hybrid electronic devices, one or more inorganic thin films are deposited and patterned by what are commonly known as “top-down” processes. “Bottom-up” fabrication is an alternative approach that will be discussed later in the chapter. In one common top-down scheme, a film of one material is first deposited onto a starting substrate (or wafer) and then patterned by etching or removing the film in select well-defined areas. Complex three-dimensional architectures are built up by repeating the process of film deposition and patterning as often as neccessary. Often these films are made up of alternating conductive and insulating layers in order to facilitate electrical isolation of each circuit element, for example, transistors, capacitors, and resistors. Next, in the metallization step, all of the chip’s circuit elements are electrically interconnected and individual dies (or chips) are diced from the wafer and wired to the macroscopic world. Finally, the chip is enclosed or packaged in a protective material that can provide some combination of chemical, environmental, mechanical, thermal, or electrical stability. This type of top-down process is the industry standard for making memory and other microelectronic devices. It is also still commonly used and adapted for fabrication of MEMS devices and in nanofabrication, which will be discussed later in the chapter. Standard microelectronic fabrication consists of a series of techniques that allow for relatively rapid and simultaneous (or parallel) manufacture of billions of devices, with lateral feature sizes as small as 65 nm, on a single chip and many chips on a single wafer up to 300 mm in diameter. However, as demand for further decreases in feature size continues, not only do materials properties often begin to change, but new materials are identified and new fabrication and processing techniques must be developed that are more efficient and reproducible. A major initial step in the top-down fabrication of solid-state devices is the deposition and growth of a thin film. This is typically achieved by two broad classes of processing techniques: physical vapor deposition and chemical vapor deposition (CVD). Wet chemical techniques such as spin-coating of sol-gel precursors or electrodeposition are also used in some applications. In physical vapor deposition, material is transferred from a solid source or target to a substrate using techniques such as sputtering via plasma, thermal evaporation, electron beam evaporation, or laser ablation. However, as described in Section II. F, CVD involves a surface chemical reaction in a vacuum environment from sources that can be transformed to a gas. The result of the chemical
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reaction is the deposition of a thin film that is angstroms to microns thick. CVD techniques include plasma enhanced CVD, low pressure CVD, metallorganic CVD (or MOCVD), atmospheric pressure CVD, and photo-assisted CVD. The most common top-down patterning method used to make microelectronic circuits is photolithography. First, a shadow mask — essentially an optical stencil — is made as a negative of the desired chip pattern (or blueprint), with regions that either block or transmit the wavelength of the developing light. This mask is placed between the light source and a substrate, the latter which has been coated with a thin layer of photosensitive polymeric photoresist. The mask’s pattern is optically transferred to the photoresist by exposing it to light. Only light that strikes a transparent part of a mask is transmitted to the photoresist, where it either crosslinks the polymer, making it insoluble (a negative photoresist) or, conversely, photodegrades the polymer, rendering it soluble (a positive photoresist). While most resists are polymeric and used for patterning features on films, some are multilayered and consist of both metal and polymeric photoresist. Inorganic materials are also used as masks, including metals, nitrides, and oxides (e.g., Cr, Si3N4, and SiO2). The three main types of mask-substrate configurations used in photolithography are (a) contact lithography, in which the mask is placed in intimate contact with the wafer, (b) proximity lithography, in which the mask is placed very close to the substrate without touching it, and (c) projection lithography, in which a focusing lens is placed between the mask and the substrate. Contact masks are the least expensive and simplest form of optical lithography, but the mask does not have longevity owing to repeated contact with photoresist during patterning. Proximity masks alleviate mask degredation, but diffraction of light reduces the pattern resolution. Projection lithography is the workhorse of the microelectronics industry, because it has better resolution than contact lithography and the mask is not damaged by repeated contact with the substrate; however, it is expensive because of stringent light focusing requirements. After development of the photoresist, the pattern that remains in the photoresist functions as a mask by protecting regions of the substrate from being etched during subsequent patterning of the thin film. The thin film regions left bare by the patterned photoresist can be subsequently removed by a variety of chemical or physical etching techniques. These etching techniques include ion beams (dry etch), chemically assisted dry etches such as reactive ion etches (RIE), the most common technique, chemically assisted ion beam etches, and wet chemical etches. The choice of chemicals used in these techniques strongly depends on a material’s chemical stability. The remaining photoresist protects the rest of the substrate during the etching process and is subsequently removed either chemically with a solvent or with an oxygen plasma cleaner often called a photoresist asher. The patterned substrate is then cleaned, and another film (or series of films) is deposited and patterned by photolithography. This step is repeated until all the circuit elements have been patterned on the chip. One primary strength of photolithography, or the topdown approach, is that it is a batch or massively parallel process, allowing billions of circuit elements to be simultaneously patterned on individual chips across a wafer. Many selective anisotropic wet etches have been developed in the microelectronics industry. For example, hydrofluoric acid (HF) strongly etches quartz (SiO2) and is used to remove oxide from silicon without etching the silicon. Potassium hydroxide solution (KOH) is an example of an anisotropic wet etch that is often used to make MEMS and photonic devices. KOH allows the formation of high aspect ratio trenches in silicon, as it etches the (100) direction a hundred times faster than the (111) direction. Wet etching, while generally inexpensive, often suffers from feature rounding and undercutting of the resist and is used primarily for large feature-size definition. For finer feature resolution, dry etching techniques such as plasma sputtering, RIE, and chemically assisted ion beam etching are commonly used. If focusing lenses and photoresist behave perfectly, the smallest feature size that current photolithography can fabricate without significant edge blurring is limited to approximately half the wavelength of the light source. For example, older mercury lamp sources with a wavelength of 436 nm (g-line) can pattern features on the order of 0.25 µm. Currently, sources that emit at extreme
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ultraviolet energies or use x-rays with wavelengths of ~10 to 250 nm can define much smaller features. However, at these high energies, additional care must go into the design of the photoresist and lenses. Finally, electron beam technology can pattern elements with feature sizes on the order of 10 nm. Another benefit of electron beam patterning is that masks and resists can be eliminated. However, electron beam lithography has two primary limitations: (a) It has slow throughput owing to serial patterning, where the beam must be rastered across the surface to pattern each device, and (b) the instrumentation is expensive. Parallel electron beam systems have recently become available, but they are still slower and less reliable than traditional optical lithography. Etch-stopping is also an important aspect of patterning a film. If the etch is stopped too soon, the film is considered underetched, which results in electrical shorts. However, if underlying films are overetched, then the previously patterned elements can be damaged. Hence, suitable etch-stop techniques are an extremely important consideration when developing etching techniques for a new thinfilm material. Ideally, the etch technique used will automatically stop when it perforates the thin film and reaches the underlying material. Such selective wet or dry chemical etches make use of the different chemical reactivities of materials or etch anisotropies for a given material. Other common etch-stop techniques include thermal oxidation to form chemically resistant layers, ion implantation to make a material either more or less reactive to a given etch, electrochemical monitoring, mass spectroscopy to detect chemically distinct species from underlying films, and simply timing the etch. Aside from growth conditions such as temperature and stoichiometry, a number of factors are important for growing thin films with minimal lattice defects, including surface cleanliness and roughness at the atomic scale, surface flatness across the entire wafer, lattice-matching of the thin film with the underlying substrate, and coefficient of thermal expansion matching. If these factors are not carefully controlled, the thin film can develop excessive interface strain and other defects that impair the film’s mechanical and electrical quality. Surface cleanliness and atomic-scale smoothness are often simultaneously obtained by the application of one or more techniques including wet chemical etches, mechanical polishing, plasma etches, sputtering, and thermal annealing. The process by which macroscopic smoothness or flatness across a wafer or chip is achieved is often called planarization. Planar films are obtained by two primary methods: ion implantation and chemical mechanical polishing. Etching, which involves the removal of film material, can lead to macroscopically uneven deposition of subsequent films including nonplanar crossovers. To avoid this complication, researchers often replace etch patterning techniques with ion implantation. Ion implantation involves taking a high energy plasma of charged ions and accelerating them at a masked substrate. Unprotected regions of a substrate are ballistically bombarded with high-energy charged ions (tens to hundreds of keV) that embed themselves in the film, resulting in a Gaussian depth profile normal to the surface. The higher the ion energy is, the deeper the average penetration. Ion implantation is often used to dope semiconductors, thus changing their electrical properties. At low implant doses, a material can be given a range of electrical properties from conducting to semiconducting; thus, ion implantation can be used to make components of devices such as resistors, transistors, and tunnel junctions. At higher doping doses, implanted regions of a film can be made highly resistive, to make integrated resistors or even insulating for device isolation and patterning. Since no film material is removed during ion implantation, the implanted film can remain planar. Subsequent films are deposited over a flat surface, reducing defects that occur when the film is deposited over etched features. Ion implantation requires understanding how a material behaves as it is implanted by high energy ions, how the implanted ions rearrange upon subsequent annealing procedures, and how to design photoresists that block energetic ions without degrading or hardening. For example, the atomic masses of constituent ions in the thin film and the material’s density determine the average depth of penetration of implanted ions. It is more difficult to penetrate a dense close-packed metal film than many oxide films, which have more open and hence less dense structures. Ion implantation can cause standard polymeric photoresists to swell, distort, and bond to the substrate. These issues can result in patterned features that do not meet design specifications and difficultly in removing resist without damaging the substrate.
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Another much more common method for planarizing a film, commonly used after metallization of a wafer, is chemical mechanical polishing. This technique makes use of a polishing pad and a chemically reactive abrasive slurry where a surface composed of two or more chemically and physically different materials (e.g., copper interconnects on silicon devices) is planarized. Features that stick out from the film tend to polish faster than low uniform features, resulting in nearly atomically flat planar surfaces. Other materials considerations required during microelectronic fabrication include lattice matching between the substrate material’s crystal structure and the film to be deposited, matching of the coefficients of themal expansion over all temperatures encountered during fabrication and subsequent device usage, and how a material’s properties respond to various dopants and doping methods. Lattice matching requires that both the substrate and the film to be deposited have some interplanar distances that are nearly identical, or else the thin film may develop excessive dislocations or eventually become excessively granular and rough. The relative coefficients of thermal expansion of the substrate and the film should also be as similar as possible, or film cracking or delamination may occur during the repeated temperature cycling that happens during thin-film deposition and other thermal processes during microfabrication. Doping of thin films is often required to change their electrical characteristics to make circuit elements such as resistors, diodes, and transistors or to help enhance (or impede) selective etching. For example, Group V elements such as phosphorous and arsenic are used as donor dopants in silicon to create n-type material, where electrons are the dominant charge carrier. Group III elements such as boron are used as acceptor dopants to make silicon a p-type material where conduction is dominated by holes. The three most common thinfilm doping techniques are diffusion from a gaseous source, diffusion from a solid source, and ion implantation. Masks are used to control the lateral position on a substrate where the dopant will penetrate. A subsequent backend anneal is often required to finish distributing the dopants within the film and to electrically activate dopant ions. Unfortunately, most of the top-down techniques discussed here are reaching their limitations with respect to even smaller device fabrication. In order to effectively reduce feature sizes much below 100 nm, investigators are not only pursuing some novel top-down approaches, but developing so-called bottom-up strategies, as discussed in Section VII. B. Microelectromechanical Systems (MEMS) Fabrication MEMS are devices that integrate electrical and mechanical elements on a chip along with the technologies associated with fabricating and packaging them. MEMS are already finding applications as pressure sensors, accelerometers in automobile airbags, optical switches, and inkjet printer heads and in biotechnology and chemical analysis. MEMS components can include moving parts, microfluidic channels, positionally controlled mirrors, and microreactors. MEMS fabrication techniques differ from standard solid-state microelectronic processing because the films to be patterned are usually orders of magnitude greater in thickness, and many of the patterned parts must be able to freely move past each other or, in the case of microfluidic channels, remain open for fluid flow. For example, using sacrificial layers and deep RIE (DRIE), one can make moving parts such as gears out of patterned thin films. Sacrificial layers such as SiO2 are often used to release silicon MEMS components patterned on top of the SiO2. DRIE forms high aspect ratio structures on silicon and makes use of sidewall passivation to avoid lateral etching. For example, alternating the RIE gases SF6 and C4F8 will, respectively, etch and passivate the trench repeatedly until the required etch depth is obtained, which is often defined by an underlying SiO2 layer. This SiO2 layer acts as a release in that a selective chemical etch such as HF will remove it and undercut the patterned Si structure. If the Si structure is not anchored to the substrate below the SiO2 layer, then it is free to move. This general etching strategy may also be applied to other materials systems once their surface and bulk interactions with various etching solutions are better understood.
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MEMS devices are also being constructed from nonsilicon materials such as plastics, elastomers, amorphous diamond, and piezoelectrics, which require the development of new etch chemistries for fabrication. MEMS also has potential uses in biotechnology, especially in microfluidics, and has uses in drug delivery, in-vivo monitoring, cell manipulation, biosensors, gene or protein chips, neural probes, microsurgery, and retinal or cochlear implants. A problem called stiction is sometimes encountered during both MEMS fabrication and subsequent device operation. Stiction is the attractive electrostatic or van der Waal’s interactions between two initially free surfaces in extremely close proximity that keeps the pieces from moving past one another. To avoid stiction, the surface chemistries must be carefully controlled by either cleaning or coating with a molecular-level lubricant. For example, supercritical CO2 is often used to clean MEMS devices, while free surfaces can be chemically modifed with self-assembled monolayers or other molecular-level coatings. In recent years, supercritical CO2 has been more widely applied in MEMS fabrication, microfabrication, and nanofabrication as a wafer cleaner, a resist developer and stripper, and as a polishing solvent. Using water and other solvents for cleaning small or delicate features commonly found in MEMS fabrication or nanotechnology is often impractical because of high surface energy effects and limitations in the solubility of the solvent. Even if water, for example, is forced with pressure to penetrate nanoscale features, the high surface tension and resultant large capillary forces can cause features to collapse. Above 31°C and 75 atm, CO2 becomes supercritical, which means its liquid and gaseous states are indistinguishable. Supercritical CO2 has an extremely low viscosity and zero surface tension and thus easily wets most surfaces while penetrating small trenches in photoresist and etched substrate features. Nanoscale interconnects of copper have also recently been fabricated by using supercritical CO2 as a carrier fluid for incorporating copper into holes and trenches smaller than 100 nm. Supercritical CO2 may be an enabling technology in achieving the smaller feature sizes encountered in MEMS devices and nanotechnology. IV. PRECURSORS In this section, the precursors used for the processes described in preceding sections are classified by groups. The precursors can be molecular or polymeric or a colloidal suspension of particles. Information on the properties of individual precursor properties is provided in Chapter 3. A. Inorganic Salts Inorganic salts are often used as molecular precursors in wet chemical processes such as solgel, colloidal, and hydrothermal processes. Inorganic salts are ionic compounds; examples are listed in Table 1.1. B. Metal Organic Compounds Metal organic compounds are covalent or inorganic coordinate compounds in which the metal center is bonded to the ligand via a noncarbon atom such as oxygen, sulfur, phosphorus, or nitrogen. Table 1.1 Inorganic Salt Precursors Inorganic Salts
Examples
Metal halides Metal carbonates Metal sulfates Metal nitrates Metal hydroxides Salts with mixed ligands
MgCl2, LiF, KCl, SiCl4, TiCl4, CuCl2, KBr, ZrOCl2 MgCO3, CaCO3, Na2CO3, SrCO3 MgSO4, BaSO4, K2SO4, PbSO4 LiNO3, KNO3, Fe(NO3)2 Ca(OH)2, Mg(OH)2, Al(OH)3, Fe(OH)3, Zr(OH)4 (CH3)3SnNO3, (C2H5)3SiCl, (CH3)2Si(OH)2
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Table 1.2 Metal Organic Compounds Metal Organic Compounds
General Formula
Selected Examples
Metal alkoxides Metal carboxylates
–M(–OR), where R is an alkyl –M(–OC(O)R)x, where R is an alkyl
Metal ketonates
–M(–OC(R)CH(R′)CO–)x, where R is an alkyl or aryl —
Al(OC3H7)3, Si(OCH3)4, Ti(OC3H7)4, Zr(OC4H9)4 Al(OC(O)CH3)3, Pb(OC(O)(CH3)2, – acetates Pb(OC(O)CH2CH3)4, – propionate Al(OC(O)C6H5)3, – benzoate Ca(OC(CH3)CH(CH3)CO)2, – pentanedionate Al(OC(C(CH3)3)CH(C(CH3)3)CO)2 – heptanedionate (CH3)2AlNH2, (C2H5)2AlN(CH3)2, (CH3)BeN(CH3)2, (iC3H7)3GeNH2, (C3H7)3PbN(C2H5)2
Metal amides (sometimes also referred to as amines) Metal thiolates Metal azides Metal thiocyanides Metal organic compounds with mixed functional group
–M(–SR)x, where R is an alkyl or an aryl –MN3 –M(–NCS)x —
(CH3)2Ge(SC2H5), Hg(C4H3S)2, (SCH3)Ti(C5H5)2, (CH3)Zn(SC6H5) (CH3)3SnN3, CH3HgN3 (C2H5)3Sn(NCS) (C4H9)Sn(OC(O)CH3)3, (C5H5)2TiCl2, (C5H5)Ti(OC(O)CH3)3
Table 1.3 Organometallic Presursors Organometallic Compounds
Selected Examples
Metal alkyls Metal aryls Metal alkenyls Metal alkynyls Metal carbonyls Mixed organometallic ligands
As(CH3)3, Ca(CH3)2, Sn(CH3)4, – methyl Ca(C6H5)2, – phenyl Al(CH=CH2)3, Ca(CH=CHCH3)2, – vinyl, propenyl Al(CCH)3, Ca(CCH)2, – acetylnyl Co2(CO)8, Mn2(CO)12, W(CO)6, – carbonyl Ca(CCC6H5)2 – phenylacetylnyl (C5H5)3U(CCH) – cyclopentadienyl/ethynyl
In the literature, the organometallic compounds described in the next section are also referred to as metal organic compounds. Metal organic compounds are used as precursors for both wet chemical– and dry vapor–related processes. Examples of metal organic compounds are provided in Table 1.2. C. Organometallic Compounds Organometallic compounds are covalent or coordinate compounds in which the ligand is bonded to the metal center via a carbon atom. Like metal organic compounds, organometallic compounds are used as precursors for both wet chemical– and dry vapor–related processes. Commonly used organometallic precursors are listed in Table 1.3. D. Polymeric Precursors In some processes, such as MOD and sol-gel processing, polymeric precursors can be used as starting materials for producing glassy or ceramic compositions. These polymers are sometimes referred to as preceramic polymers. Selected examples of such polymers are given in Table 1.4. E. Colloidal Suspension Suspensions of molecular precursors or a suspension of oxide, hydroxide, sulfide, and other such powders in a given solvent can also be used as a starting material for preparing ceramic or
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Table 1.4 Polymeric Precursors Polymer
Formula
Miscellaneous
Polycarbosilane
–[(RR′)Si–CH2–]x
Polysilazane
Borazines
–[(RR′)Si–NR–]x, where R is an organic unit or H 1. –[Si(RR′)O–]x: linear, where R is an alkyl or aryl 2. Sesquisiloxane: ladder 3. –[Si(CH3)2OSi(CH3)2(C6H4)m–] siloxanesilarylene 4. Random and block copolymers of the above –[Si(RR′)–]n, where R is an alkyl or aryl –[Si(CH)(CH)–] – Silalkylene –[BRNR′–]n: cyclic or chain repeat units
Precursor to SiC in MOD and sol-gel–type processes where R is an active functional group such as an olefin, acetylene, H Precursor to Si3N4 or silicon carbonitride in a manner similar to polycarbosilanes Used in sol-gel processing and in situ multiphase systems used as precursors to SiO2 or silicon oxycarbide
Carboranes
Cage compounds of B and C
Phophasphazenes
–[N = P(R2)–]n, where R is an organic, organometallic, or inorganic unit
Polystannoxanes
–[Sn(R)2–O–R′–O–Sn(R)2–O–]n: chain, where R is an organic unit. Drum- or ladder-type structures also possible –[Ge(RR′)–]n
Polysiloxanes
Polysilane
Polygermanes
Precursors to SiC, as photoresist and photoinitiators Precursors to BN in CVD/MOCVD-type process or sol-gel-type process Precursors to B4C in MOCVD- or MOD-type processes Most common types of functional groups include alkoxy, aryloxy, arylamide, carboxylate, and halide —
Can be used in microlithographic applications such as polysilanes
glassy materials. A widely used silica colloidal suspension, Stober spheres, with monodispersed particles can produce a variety of glassy products.17
V. ADDITIVES Additives are chemicals normally employed in wet chemical processes to change physical or chemical properties of the system. Additives used in wet chemical processing of inorganic materials can be classified as catalysts, dispersants (detergents and other surfactants), and binders. Catalysts are materials that increase the efficiency of the reaction or the rate of reaction and are regenerated at the end of the reaction. The most commonly used catalytic additives in systems are organic and inorganic acids and bases. For example, silicone polymers with functional groups such as alkoxy can be polymerized to form cross-linked silicones or silicates using a tin octaoate catalyst. Similarly, inorganic acids and bases are employed to catalyze the hydrolysis and condensation reactions in the sol-gel process involving metal alkoxides. Dispersants (detergents and other surfactants) are composed of varying proportions of polar and nonpolar groups used in two-phase systems to provide a homogeneous dispersion or emulsion. Although dispersants are present in small quantities, they exert a marked effect on the surface behavior of the system. Surfactants form interfaces between solid–solid, solid–liquid, solid–gas, liquid–liquid, and liquid–gas phases, whereas dispersants form interfaces between solid and liquid only. Dispersants are applicable to slurry systems (solid–liquid) in ceramic processing, whereas emulsion-type processing requires surfactants suitable for liquid–liquid systems. In many systems containing oil and water (water-in-oil or oil-in-water) or systems containing insoluble solids in a liquid medium, surfactants are used to form homogeneous emulsions. Depending upon the system under consideration, the type of surfactant used in producing a homogeneous emulsion can change drastically. There are two types of surfactants: ionic and nonionic. Nonionic surfactants are characterized by their HLB (hydrophobic-lipophilic balance) number to indicate the polarity in the © 2005 by CRC Press
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compound. A higher HLB number indicates a higher polarity of the surfactant, whereas a lower HLB number indicates the lipophilic (nonpolar) nature of the surfactant. For example, an ethylene glycol fatty acid ester has an HLB number of 2.6, suitable for a water-in-oil-type emulsion, whereas polyoxoethylene fatty alcohol has an HLB number of 15.4, suitable for an oil-in-water-type emulsion. However, ionic surfactants such as sodium oleate (NaOOCC15H31) ionize in an aqueous medium to provide low-energy interfaces, forming a solution or an emulsion. Detergents can be classified into three groups: anionic, cationic, and nonionic surfactants. Anionic detergents such as sodium toluene sulfonate have a large anion, which can be used to stabilize suspensions containing negatively charged particles or particles that adsorb the anionic surfactants via charge repulsion. Similarly, cationic detergents such as quaternary ammonium acetate have large cations that can be used for stabilizing suspensions containing positively charged particles via charge repulsion. Nonionic detergents such as alkyl polyethoxy benzene, with long steric groups, are used for stabilizing suspensions by steric hinderance. In practice, both the charge repulsion and the steric hindrance play an important role for all surfactants. Inorganic surfactants or detergents such as nitric acid, silicic acid, ammonium hydroxide, and sulfuric acid are also used to stabilize suspensions in aqueous media.18 Binders are polymers and colloidal particles that are adsorbed on particle surfaces to bridge between ceramic particles for interparticle flocculation. In ceramic processing, binders improve the wetting and change the viscosity and sedimentation characteristics of the slurry for ease of processing. Binders are used in slurries or tapes during ceramic processing to glue the ceramic particles in the green state and to obtain higher densities after sintering. Soluble silicates and polyalkyl glycols are common binders used in ceramic processing. Polyvinyl alcohol is one of the most common binders used in an aqueous medium. Polyvinyl pyrrolidone is another binder frequently used in both aqueous and organic media. Sodium silicate, an inorganic binder, is also frequently employed for binding purposes in ceramic processing.
VI. SURFACE MATERIALS CHEMISTRY Atoms at surfaces often deform or structurally rearrange in order to reduce their free energy. Consequently, surface properties often vary significantly from bulk materials properties. This may not have a significant impact when the surface area to volume ratio is quite small, as is seen in micron-scale particles; however, as particle size drops into submicron dimensions, the properties of the surface atoms may dominate the measured properties. Surface science is mostly concerned with the understanding and control of the physical and chemical properties of surface and near surface atoms. This requires not only developing models for surface thermodynamics, kinetics, and quantum size effects, but also the development of techniques that are capable of characterizing surfaces at or near the atomic level. The understanding developed in surface science can also have practical benefits such as improving fabrication methods for thin-film devices, including atomic layer deposition, designing corrosion-resistant surfaces, and developing better catalysts. In this section the discussion is limited to solid-liquid interfaces that not only benefit from an understanding of inorganic materials chemistry but are important in the subsequent discussion of nanotechnology fabrication methods. In addition to the need to control the chemistry of surfaces in standard ultra-high vacuum–based microelectronic processing techniques, it is important to control solid–liquid interfaces encountered in wet etching, flocculation-deflocculation of powders, colloidal suspensions, electrochemistry, and emerging areas in nanotechnology including self-assembly, some forms of soft lithography, and microfluidics. Rendering a materials surface hydrophobic or hydrophilic (i.e., nonpolar vs. polar) is one way to precisely control interaction forces between the surface and other materials, organic molecules, or biomolecules. Until the past 10 to 15 years, modern surface science experiments have been carried out primarily in ultra-high vacuum environments (~10−9 torr). Such a high vacuum
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was required for two main reasons: (a) Many surface characterization techniques require a vacuum for the analysis beam to operate in, and (b) a high vacuum maintains a pristine and uncontaminated surface, which is important in microelectronic fabrication, including thin film deposition. However, with the advent of scanning probe microscopy techniques and certain surface spectroscopies that can both detect monolayer adsorbates and operate in liquids, the nanoscale structural and chemical properties of the solid–liquid interface have become accessible. Surface forces, electrochemical phenomena, molecular self-assembly, and biomolecule patterning can now be explored with the resolution previously only afforded to vacuum-based surface science.
VII. NANOTECHNOLOGY The prefix nano often refers to 10−9, or 1/1,000,000,000, of a unit of measurement. One nanometer (1 nm) is 10−9 meters, or one billionth of a meter. Atoms have diameters on the order of 0.1 nm; DNA strands have widths of a few nanometers, a white blood cell 10,000 nm, a human hair about 100,000 nm, and a grain of sand 1,000,000 nm. The ability to make and fabricate structures in which at least one dimension of the material is between 1 and 100 nm and then assemble them into larger arrays has led to the term nanotechnology.19 While molecular biologists, chemists, physicists, and materials scientists have been working at the nanoscale in one form of another for decades, only recently have the tools become available to truly observe and fabricate structures at the nanoscale. The discovery of the scanning tunneling microscope (STM) in the early 1980s, and soon thereafter, the scanning force microscope (SFM), for the first time clearly revealed the nanoscale world of individual atoms and molecules on surfaces. These scanning probe microscopy (SPM) techniques are considered the primary enabling technologies in the development of the nanotechnology field and will be discussed in detail in Section IX. Nanotechnology has also benefited tremendously from the discovery of two new nanoscale forms (or allotropes) of carbon called buckyballs and nanotubes. In addition, advances in the rational design of materials, including biomimetics, the science of molecular self-assembly, especially as it occurs on solid substrates, and developments of new soft lithographic techniques such as microcontact printing, have further spurred the development of nanotechnology. As device and feature sizes on chips are reduced significantly below micron dimensions, the surface area to volume ratio can exceed 10%. Consequently, surface effects can dominate material bulk physical and chemical properties. Also, at the nanoscale, materials properties no longer strictly obey bulk continuum laws (e.g., fermi-dirac statistics, etc.) but can instead enter the realm between atomic and molecular quantum mechanics and bulk material, where a small cluster of atoms may exhibit size-dependent quantum effects. This promise of improved or even unique electrical, mechanical, magnetic, and optical properties at the nanoscale is generating excitement in the scientific community. Real nanotechnology examples already exist in everyday life. For example, some sunscreens make use of nanosized zinc oxide particles suspended in a clear lotion to block the sun’s damaging ultraviolet (UV) rays. These zinc oxide particles have sizes that effectively block UV wavelengths (100 to 400 nm) yet are too small to block longer wavelength visible light (~400 to 700 nm); hence the lotion remains transparent. Another example is found in the data storage industry, where data density has increased significantly with the development of magnetoresistive devices formed by alternating layers of magnetic and electrically conducting materials only a few nanometers thick. The electron conductivity in one layer is coupled to the magnetic dipoles in neighboring layers. As these dipoles are ordered and their orientations switched, stepwise changes in conductivity up to several orders of magnitude can occur. Giant magnetoresistive devices are made from alternating nanoscale films of Ni-Fe or Au-Co alloys with nanoscale films of a metallic conductor such as Cu. While this book focuses on inorganic materials, it is worth briefly mentioning that microfabrication and nanofabrication techniques are increasingly being integrated with biomolecules such as
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DNA to form hybrid biological devices such as prosthetics, implants, sensors, and “lab-on-a-chip” type diagnostics and microarrays. For example, DNA microarrays are fabricated using ink-jet technology that applies thousands of micron-scale regions to an inorganic substrate, each with different short segments of DNA. Microfluidics requires fabrication of micro- and nano-scale channels on a chip that can be used to transport fluids around a surface. This technology has been used to make devices that can integrate various functions on a chip such as miniature chemical reactors, sorting cells and DNA by size, and the analysis of biofluids. Quantum dots are beginning to be used in labeling biomolecules and cells. Quantum dots are nanoparticles (2 to 10 nm in diameter) that may be supported on a solid substrate or freely suspended in a liquid. Their optical and electrical properties are often a function of their size. For example, CdSe and CdS particles fluoresce at different colors depending on the particle size. Of course, nature has been working at the nanoscale for millions of years in the areas of self-assembly (e.g., cell membranes) and molecular-scale data storage within strands of DNA. A. Nanofabrication In addition to some of the top-down fabrication methods discussed previously, nanotechnologists are pursuing bottom-up fabrication strategies using a variety of methods including SPM manipulation and self-assembly. A bottom-up approach to device fabrication places circuit elements and wiring only where needed. For example, if one needs a wire on a substrate, then only a wire is fabricated on the surface. There is no need for masking, patterning, and removal of excess material found in most microelectronic fabrication techniques. There are now many examples of successful demonstrations of the bottom-up approach, including nanoscale wires and transistors fabricated from individual carbon nanotubes, self-assembly of gold particles using single stranded DNA, and inorganic-biological hybrid devices fabricated by a number of techniques including microcontact printing. SPMs were probably the first instruments used for rudimentary bottom-up nanolithography by manipulating matter at the nano- and atomic-scales. For example, individual xenon atoms were rearranged on a Ni surface with a low-temperature STM to spell out “IBM,”20 nanoscale copper clusters have been grown electrochemically with an SFM tip on both oxide-passivated copper surfaces,21 and gold surfaces have been passivated with nanoresists made from self-assembled alkanethiol monolayers,22 and more recently, the SFM tip has been used as a nano-pen to write alkanethiol features on gold surfaces with line widths on the order of 10 nm.23 Nanolithography with a scanning tip is an extremely slow serial process compared with standard top-down photolithographic methods. However, the ability to create nanoscale structures or devices and the ability to characterize them quickly makes SPM an extremely powerful tool in developing a fundamental understanding of nanoscale devices and in preparing practical devices that require only a small number of devices, such as sensor components. B. Self-Assembly Self-assembly commonly occurs in nature during the formation of seashells, cell walls, membranes, and myelin, and in nanotechnology it is used mostly as a bottom-up technique. Biological membranes are composed of lipid and bilipid layers. These elongated lipid biomolecules have hydrophilic head groups, hydrophobic tail groups, and strong attractive van der Waals intermolecular interactions between the long chain groups. In bilipid membranes, the hydrophilic head groups point out into the aqueous environment, while the hydrophobic tail groups bury themselves in the interior of the membrane away from water. Self-assembly on an inorganic substrate occurs in a similar fashion but often involves a chemical bond or strong intermolecular interaction of the head group with the substrate and a corresponding ordering in two dimensions of the molecules across the surface. Alkanethiols are one primary example of molecules that self-assemble on noble metal
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surfaces such as gold, silver, and copper to form self-assembled monolayers. The thiol head group forms a chemical bond with the substrate, and the long chain hydrocarbon tails order owing to van der Waal’s attractive interactions. These self-assembled monolayers are used as nanoscale resists, building blocks for nanoscale devices, and templates for biomolecule adhesion. Controlling the chemistry of the inorganic substrate, in addition to the chemistry of the molecule to be adsorbed, is critical in the formation of self-assembled monolayers. Self-assembled monolayers of alkanethiols are considered nanoscale structures, as the film thickness normal to the substrate is only the length of a single molecule (~1 to 3 nm). C. Microcontact Printing Microcontact printing is a soft lithography technique that makes use of the surface chemistry of inorganic substrates to control the transfer of a molecular species such as organic solutions of thiols or biomolecules from an elastomeric stamp, usually polydimethylsiloxane (PDMS), to the substrate. The stamps are first fabricated with features ranging from the nanoscale to microns in size. Next, an ink containing the molecule to be patterned is applied to the PDMS stamp and the inked stamp brought in contact with the substrate. For effective transfer to occur to the substrate, the molecule must have a higher chemical affinity for the substrate than the stamp. Features with lateral dimensions as low as 40 nm have been fabricated with microcontact printing. Microcontact printing still suffers from distortion and registration, particulary in multilevel patterning requiring two or more stamping or lithography steps. D. Nanotechnology Materials: Carbon Fullerenes Two forms of carbon are often used as building blocks for bottom-up nanofabrication: buckyballs and carbon nanotubes. These two new forms of carbon bring the number of carbon allotropes to four, each with crystal structures of different dimensionality, including three-, two-, one-, and zero-dimensional, with markedly different properties. Diamond has a three-dimensional facecentered cubic structure, with four of the eight tetrahedral sites occupied. This highly symmetric cubic structure and sp3 coordinated covalent bonding makes diamond the hardest substance known. Diamond’s extremely high thermal conductivity has also generated considerable interest in using it as a substrate to manage the heat generated by microelectronic devices. The two-dimensional form of carbon is graphite, which consists of sheets with three-fold sp2 coordinated atoms arranged in hexagonal benzene-like rings. The weak van der Waal’s intermolecular attractions between sheets of graphite make it cleave easily along these planes and gives it its slippery feeling. Since it is easily cleavable with the well-known carbon–carbon bond length of 1.41 Å, it is a commonly used as a calibration standard for SPMs. The third, zero-dimensional, allotrope of carbon was discovered by accident in 1985 and consists of 60 atoms arranged in pentagons and hexagons to form a soccer ball–like sphere called a buckminster fullerene, or more commonly, a buckyball. Since buckyballs are essentially carbon sheets wrapped around points, they are considered zero-dimensional materials. The fourth form of carbon is the one-dimensional nanotube, which is essentially a hollow cylinder formed by rolling up a sheet of graphite and capping it at one or both ends with a buckyball hemisphere. Nanotubes come in single- and multiwalled varieties respectively called single-walled nanotubes, which are typically conductive, and multiwalled nanotubes, whose electrical properties can range from insulating to semiconducting. Nanotubes are only a few nanometers in diameter but can be many microns in length and can have electrical properties ranging from insulating to semiconducting to conducting, depending on doping levels. C60 is the most common type of buckyball and can be formed into monomolecular layers on surfaces with potential applications as electronic or sensor components. It can also be doped (e.g., CHBr3) and made to to exhibit superconductivity. Compared to buckyballs, carbon nanotubes have © 2005 by CRC Press
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seen a wider array of potential practical applications. They have been arranged on substrates using bottom-up methods to form nanoscale wires and functioning transistors. When mounted on larger SFM tips, nanotube tips’ low radii of curvature and high strength have made for superior imaging. Carbon nanotubes have also been incorporated into polymer matrices to form nanocomposites that electrostatically interact with automobile paints or for thermal management of electronic devices on satellites. High surface area, dense grass-like arrays of nanotubes have also been grown out of substrates and have potential application as sensors or supports for catalysts, biomolecules, and cells.
VIII. CHARACTERIZATION TECHNIQUES A. Scanning Probe Microscopy The STM and SFM are the two primary types of a class of characterization instruments called SPMs, whose common feature is a small tip, or probe, that is rastered across a surface while measuring a specific tip–sample interaction parameter, for example, tunneling current or tip–substrate intermolecular forces. Depending on SPM design and choice of tip materials, these SPMs can create nanoscale topological surface maps by using other tip–sample interaction parameters such as magnetic, electrostatic, chemical, thermal, electrochemical, frictional, and superconducting properties. The STM operates by applying a voltage bias between an atomically sharp tip and an electrically conducting surface. Electrons flow from the occupied electronic states near the Fermi level of one electrode to the unoccupied states in the other electrode, yielding a small tunneling current. This tunneling current depends exponentially on the tip–sample separation. In order to measure the surface topography of a conductive material, the tip must be moved or rastered incrementally across the surface. This is accomplished by mounting the tip on a piezoelectric actuator that controls the tip’s position across the surface along the x and y coordinates and the height normal to the surface in the z-direction. The STM is operated in two common imaging modes: constant height and constant current. In the constant height mode (z constant), the tip is scanned across the surface at constant height while monitoring the tunneling current. As tip–sample separation varies, the tunneling current will vary, yielding a real space topographic image of the surface that has enough resolution to resolve individual atoms and vacancies. In constant current mode, a feedback mechanism is used so that as the tip is rastered across the surface, the tip–sample separation is varied to maintain a constant tunneling current. Mapping out this tip–sample separation in x and y coordinates generates a topographical surface map. The SFM, also called the atomic force microscope, behaves like an old fashioned phonograph stylus except that the SFM stylus, or tip, is much smaller, with radii of curvature between 1 and 100 nm. Instead of the tunneling current of an STM, the SFM tip–sample interaction parameters are surface forces such as van der Waal’s and electrostatic intermolecular interactions. SFM tips are mounted to the end of cantilevers that have different effective spring constants depending on the material and geometry. One can vary the applied force on the surface by controlling the position of the tip normal to the surface. As the force exerted between the tip and surface varies, the cantilever will deflect a small amount. There are also two primary imaging modes for SFM, contact mode, which includes constant height and constant force methods, and tapping mode. In constant height mode, the SFM tip is rastered across the surface with a piezoelectric actuator, while the cantilever deflection, or tip–sample interaction force, is monitored with a laser system. Any variations in force correspond to variations in surface topography, which creates a three-dimensional topographic image of the surface. In constant force mode, the tip–sample force is maintained constant by using a feedback loop as the tip is rastered across the surface. This feedback loop maintains a constant deflection (or force) on the tip by raising and lowering the tip as it traces surface features. In tapping mode
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SFM, an oscillating tip is kept near its resonance frequency while the tip is either in contact or extremely close to the surface. This oscillating tip is extremely sensitive to small tip–sample interaction forces, including long-range van der Waal’s interactions and medium to short range polar interactions. The primary benefit of tapping mode SFM is that it significantly reduces tip–sample interaction forces that can destroy delicate surfaces. Tapping mode’s major drawback is that if desired, it is difficult, if not impossible, to achieve lattice-scale resolution. The resolution of the SFM is often limited by the radius of curvature of the tip. A smaller radius of curvature results in better resolution of nanoscale features and fewer imaging artifacts. Carbon nanotubes with radii of curvature on the order of 10 nm or less are currently being adhered to SFM cantilevers and offer the best resolution to date. While the resolution of an SFM is typically not as good as the STM, it has the advantages of being able to image insulating materials and biomolecules and is generally simpler to use than the STM. B. Techniques Many other techniques can be used to characterize the inorganic precursors, process intermediates, solid state products, and surfaces described in this book. The discussions of the various characterization techniques available are given in Chapter 2 along with their applicability. The characterization techniques can be classified under elemental, molecular and surface analyses. Some techniques listed below can provide both elemental and molecular analyses of materials. 1. Elemental Analysis Atomic absorption spectroscopy Auger electron spectroscopy Electron probe microanalysis (EPMA) Electron spectroscopy for chemical analysis (ESCA) Energy dispersive spectroscopy (EDS) Flame photometry Wavelength dispersive spectroscopy (WDS) X-ray fluorescence
2. Molecular and Solid State Analysis Chromatography [gas chromatography (GC), size exclusion chromatography (SEC)] Electron diffraction Electron microscopy [scanning electron microscopy (SEM), transmission electron microscopy (TEM), scanning TEM (STEM)] Electron spin resonance (ESR) Infrared spectroscopy (IR) Mass spectrometry Mercury porosimetry Mossbauer spectroscopy Nuclear magnetic resonance (NMR) Neutron diffraction Optical microscopy Optical rotatory dispersion (ORD) Raman spectroscopy Rutherford back scattering (RBS) Small angle x-ray scattering (SAXS) Thermal analysis [differential scanning calorimetry (DSC), thermal gravimetric analysis (TGA), differential thermal analysis (DTA) temperature desorption spectroscopy (TDS), thermomechanical analysis (TMA)]
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UV spectroscopy X-ray techniques [x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), x-ray emission, x-ray absorption]
3. Surface Characterization Techniques Electron energy loss spectroscopy (EELS) Ellipsometry Extended x-ray adsorption fine structure (EXAFS) Helium (or atom) diffraction Lateral (or frictional) force microscopy (LFM) Low-energy electron diffraction (LEED) Magnetic force microscopy (MFM) Near-edge x-ray adsorption fine structure (NEXAFS) Near field scanning Reflection high-energy electron diffraction (RHEED) Scanning tunneling microscopy (STM) Scanning force microscopy (SFM) Secondary ion mass spectroscopy (SIMS) Surface enhanced raman spectroscopy (SERS) Surface extended x-ray adsorption fine structure (SEXAFS) Surface force apparatus
IX. SELECTED SOURCES OF INFORMATION IN MATERIALS CHEMISTRY A. Books Ball, P., Made to Measure, Princeton University Press, Princeton, NJ, 1997. Brinker, C.J. and Scherer, G.W., Sol-Gel Science: The Physics and Chemistry of Sol-Gel Science, Academic Press, San Diego, CA, 1990. Campbell, S.A., The Science and Engineering of Microelectronic Fabrication, Oxford University Press, New York, 1996. Hubbard, A.T., Ed., Surface Imaging and Visualization, CRC Press, Boca Raton, FL, 1995. Interrante, L.V., Casper, L.A., and Ellis, A.B., Eds., Materials Chemistry: An Emerging Discipline, American Chemical Society, Washington, DC, 1995. Israelachvili, J., Intermolecular and Surface Forces, Academic Press, New York, 1992. Jones, R.W., Fundamentals of Sol-Gel Technology, Institute of Metals, North American Publication Center, Brookfield, VT, 1989. Klein, L.C., Ed., Sol-Gel Technology for Thin Films, Fibers, Preforms, Electronics, and Specialty Shapes, Noyes, Park Ridge, NJ, 1988. Lee, B.L. and Pope, E.J.A., Eds., Chemical Processing of Ceramics, Marcel Dekker, New York, 1994. Madou, M., Fundamentals of Microfabrication, CRC Press, Boca Raton, FL, 1997. Mark, J.E., Allcock, H.R., and West, R., Inorganic Polymers, Prentice Hall Polymer Science and Engineering Series, Englewood Cliffs, NJ, 1992. Narula, C.K., Ceramic Precursor Technology and Its Applications, Marcel Dekker, New York, 1995. Poole, C.P. and Owens, F.J., Introduction to Nanotechnology, John Wiley and Sons, New York, 2003. Rao, C.N.R., Ed., Chemistry of Advanced Materials, Blackwell Scientific, Oxford, 1993. Ring, T.A., Fundamentals of Ceramic Powder Processing and Synthesis, Academic Press, New York, 1996. Segal, D., Chemical Synthesis of Advanced Ceramic Materials, Cambridge University Press, London, 1989. Shanefield, D.J., Organic Additives and Ceramic Processing, Kluwer Academic, Boston, 1995. Somorjai, G.A. Introduction to Surface Chemistry and Catalysis, John Wiley & Sons, New York, 1994.
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B. Monographs/Proceedings Better Ceramics through Chemistry, several volumes (symposium proceedings), published by Materials Research Society, Pittsburgh, PA. Critical Reviews in Solid State and Materials Science, CRC Press, Boca Raton, FL. Innovations in Materials Processing, edited by F.M. Doyle et al., TMS Publication, Warrendale, PA, 1989. Inorganic Synthesis, John Wiley & Sons, New York. Nanofabrication and Biosystems: Integrating Materials Science, Engineering, and Biology, edited by H.C. Hoch, L.W. Jelinski, H.G. Craighead, Cambridge University Press, New York, 1996. Sol-Gel Optics, edited by J.D. Mackenzie, SPIE, Bellingham, PA, 1990. Sol-Gel Science and Technology, edited by M.A. Aegerter et al., World Scientific, Teaneck, NJ, 1989. Ultrastructure Processing (or Chemical Processing or Advanced Materials), several volumes, published by John Wiley & Sons, New York.
C. Journals Advanced Materials, published by VCH, Cambridge, U.K. Chemistry of Materials, published by American Chemical Society, Washington, DC. Journal of Materials Chemistry, published by The Royal Society of Chemistry, Cambridge, U.K. Journal of Sol-Gel Science and Technology, published by Kluwer Academic Publishers, Norwell, MA.
Additional articles also appear in: Journal of Materials Research, published by Materials Research Society, Pittsburgh, PA. Journal of Nanoscience and Nanotechnology, published by American Scientific Publishers, Stevenson Ranch, CA. Journal of Non-Crystalline Solids, published by Elsevier Scientific Publishers, Amsterdam, The Netherlands. Journal of the American Ceramic Society, published by American Ceramic Society, Westerville, OH. Journal of the American Chemical Society, published by American Chemical Society, Washington, DC. Langmuir, published by American Chemical Society, Washington, DC. Materials Letters, published by Elsevier Scientific Publishers, Amsterdam, The Netherlands. Nanoletters, published by American Chemical Society, Washington, D.C.
REFERENCES 1. Interrante, L.V., Chemistry of materials: The newest ACS Journal, Chem. Mater., 1(1), 1, 1989. 2. Shinoda, K. and Friberg, S., Emulsion and Solubilization, John Wiley & Sons, New York, 1986. 3. Ramamurthi, S.D. et al., Nanometer-sized particles prepared by a sol-emulsion-gel method, J. Am. Ceram. Soc., 73(9), 2760, 1990. 4. Matijevic, E., Monodispersed metal (hydrous) oxides: a fascinating field of colloid science, Acc. Mater. Res., 14, 22, 1981. 5. Tani, E. et al., Formation of ultrafine zirconia under hydrothermal conditions, J. Am. Ceram. Soc., 66(1), 11, 1983. 6. Toroya, H. et al., Hydrothermal oxidation of Hf metal chips in the preparation of monoclinic HfO powders, J. Am. Ceram. Soc., 66, 148, 1983. 7. Aerogels: Proceedings of the First International Symposium, Wurzburg, Germany, Springer-Verlag, New York, 1985. 8. LeMay, J.D. et al., Low density microcellular materials, MRS Bull., 15, 19, 1990. 9. Matson, D.W. et al., Formation of silica powder from the rapid expansion of supercritical solutions, Mater. Lett., 4, 429, 1986. 9a. Real, M.W., Freeze drying alumina powders, Proc. Br. Ceram. Soc., 38, 59, 1986. 10. Fischer, H.E. et al., Fiber coatings derived from molecular precursors, MRS Bull., 59, April 1991.
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11. Mantese, J.V. et al., Metal organic decomposition (MOD): A nonvacuum spin-on liquid-based, thin film method, MRS Bull., October, 48, 1989 (and references therein). 12. Vest, R.W. and Vest, G.M., Metallo-Organic Decomposition for Dielectric Films, Report to the Office of Naval Research, November 30, 1990. 13. Pierson, H.D., Handbook of Chemical Vapor Deposition: Principles, Technology, and Applications, Noyes, Park Ridge, NJ, 1992. 13a. Ferroelectric Thin Films Symposium Proceedings, Published by the Materials Research Society, Pittsburgh, PA, 1990–1996. 14. Proceedings of the 3rd International Conference on Metallo-Organic Vapor Phase Epitaxy, American Association of Crystal Growth, Universal City, CA, 1986. 15. Kaae, J.L., Codeposition of compounds by chemical vapor deposition in fluidized bed of particles, Ceram. Eng. Sci. Proc., 9(9–10), 1159, 1988. 16. Willeke, K. et al., Eds., Aerosol Measurements, Principles, Techniques, and Applications, Van Nostrand Reinhold, New York, 1993, chap. 33. 17. Iler, R.K., The Chemistry of Silica, A Wiley-Interscience Publication, John Wiley & Sons, New York, 1979. 18. Shinoda, K. and Friberg, S., Emulsion and Solubilization, John Wiley & Sons, New York, 1986, pp. 70–80. 19. See for example, Scientific American, 285, 32, 2001 and articles within. 20. Eigler, D.M. and Schweizer, E.K., Positioning single atoms with a scanning tunnelling microscope, Nature, 344, 524, 1990. 21. LaGraff, J.R. and Gewirth, A., Enhanced electrochemical deposition with an atomic force microscope, J. Phys. Chem., 98, 11246, 1994. 22. LaGraff, J.R. and Gewirth, A., Nanometer-scale mechanism for the constructive modification of Cu single crystals and alkanethiol passivated Au(111) with an atomic force microscope, J. Phys. Chem., 99, 10009, 1995. 23. Piner, D., Zhu, J., Xu, F., Hong, S., and Mirkin, C.A., “Dip-pen” nanolithography, Science, 283, 661, 1999.
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CHAPTER 2 Definitions of Terms Used in Inorganic Materials Chemistry
A Abrasives Materials with high hardness values of 2 to 25 GPa used for grinding, cutting, and polishing metals and other ceramic or glass materials. Aluminum oxide, silicon carbide, silicon nitride, and titanium nitride are common abrasive materials. Absorption Edge Fine Structure (AEFS) An absorption technique that uses a synchrotron radiation source to study the local structure of a compound. The local structure is associated with inner shell transitions in the atomic structure of a compound where the x-rays are absorbed in the absorption edge (8.95 to 9.03 KeV in the CuCl spectrum). The absorption edges in the spectrum represent abrupt changes in x-ray absorption peak intensities. In many cases, this spectroscopy technique helps determine the oxidation state of the element in a compound. For example, the AEFS spectra of CuCl and CuCl2 · H2O exhibit peaks corresponding to transitions from 1s orbital to higher orbitals, and the entire spectrum in CuCl2 · H2O is displaced to higher energies, reflecting the higher oxidation state of copper (+2). Also, an additional peak owing to a 1s q three-dimensional transition is observed in the CuCl2 · H2O spectrum. Acceptor A dopant (e.g., an impurity species such as boron added to a silicon crystal) that accepts electrons from the valence band of the host crystal forming electron holes in the valence band yielding a p-type material. See also, donor, dope, n-type, p-type. Acetate An organic ligand [CH3C(=O)O] normally bonded to a metal center via an oxygen atom in a metal organic compound. Other common acetate-type ligands include amylacetate [CH3(CH2)2CH2-OC(O)O], crotyl acetate [CH3CH=CHC(O)O], and benzoate [C6H5C(O)O].
O O C CH3 Acetate ligand
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Acetylacetonate A chelating ligand [OC(CH3)CH(CH3)CO] bonded with two oxygens to the metal center in a metal organic compound. See also chelates. CH3 O C CH O C CH3 Acetylacetonate ligand (acac)
Acoustooptic Material Materials that change their refractive indexes as a result of induced strain. A plane elastic wave in such a material produces a periodic strain pattern with spacing equal to the acoustic wavelength; this strain in turn produces an acoustooptic variation in the refractive index. Examples of acoustooptic material include LiNbO3, LiTaTiO3, PbMoO4, and PbMoO5. Actinide Fourteen elements from thorium to lawrencium following actinium in the periodic table. These elements are uniquely characterized by partially or fully filled 5f orbitals. Actinoid See actinide. Actinon See actinide. Activated Carbon A highly reactive form of carbon with surface area in the range of 300 to 2000 m2/g produced by chemical or gas activation of sawdust, peat, and other raw organic forms. Applications of activated carbon include decolorization and purification of materials in addition to its use as an adsorption media and as a support in oxidation catalysis. Adatom An atom that has been chemisorbed or physisorbed onto a materials surface. A surface point defect that, along with surface vacancies, participates in atom transport across a surface. Adhesion The joining of two surfaces at an interface. The work of adhesion to separate two phases, A and B, is given by Wad = LA + LB LAB, where LA and LB are the interfacial energies (surface tensions or surface energies in ergs per square centimeter) of the freshly separated surfaces, and LAB is the interfacial energy of the joined A–B phases. Adlayer The monolayer (or molecular monolayer) formed by the adsorption of atoms (or molecules) onto a materials surface (or substrate). Adsorbate An adsorbed atomic or molecular monolayer on a materials surface. For a strongly bonded monolayer to form, substrate-adsorbate bonds must typically be stronger than adsorbateadsorbate bonds, or the adsorbate atoms or molecules will coarsen into either islands or multilayers. Adsorption The trapping or attractive interaction of molecules or atoms onto a surface or substrate. See also chemisorption and physisorption. Adsorption Site Sites on a surface where adsorption is favorable, including monatomic step edges, multiple atomic height step edges, and kink sites along step edges. AEFS See absorption edge fine structure. AEM See analytical electron microscopy. Aerogel Solid-state material characterized by high porosity (>90%), small pore size (2 to 100 nm), small particle size (2 to 10 nm), and low density (0.004 to 0.2 g/cm3). The term aerogel was coined by the inventor, Kistler, who prepared inorganic (oxides of Si, Al, W, Sn, Fe, etc.) and organic (cellulose, gelatin, agar, etc.) hydrogels and replaced the liquid in the gel with air. When the liquid is merely evaporated from the gel, the surface tension of the liquid usually causes dramatic volume shrinkage. However, in aerogels, when the liquid is removed at or above the critical point (at zero surface tension) of the liquid, the structure does not collapse, resulting in a highly porous aerogel material.1 © 2005 by CRC Press
Aerosil Tradename (Degussa) of fumed silica produced by the flame-oxidation process. Aerosil is a silica powder with a high surface area (150 to 200 m2/g), small particle sizes (10 to 15 nm), and a high affinity to absorb moisture. See also fumed silica. Aerosol A colloidal suspension of liquid (also called hydrosol) or solid particles in gas. Fog is a suspension of liquid droplets in air, whereas smoke is a suspension of solid particles in air. AES See auger electron spectroscopy. Agglomeration A process in which two or more particles or clusters are held together by weak cohesive forces. In many samples, cohesive forces result from electrostatic surface charges generated during handling or processing of ceramic powders. Aggregate A particle or an assembly of particles held together by strong inter- or intramolecular or atomic cohesive forces. Aggregates are normally stable to handling and ordinary dispersive techniques such as high-speed mixing and ultrasonics. Aggregates can be arranged in coacervate (spherical), tactoid (elliptical), crystalloid (cylindrical), or flock (haphazard) forms, with rod-, plate-, or spherical-shaped particles. Aging Process of restructuring and change in materials properties with time. Examples include condensation reactions, dissolution, reprecipitation, and phase transformation after gelation in the sol-gel process. See also syneresis. Physical aging (or structural relaxation) refers to changes in the properties of an amorphous material during annealing, as its structure relaxes toward that of the equilibrium liquid. The term aging is also used in electronic, magnetic, or structural materials that are hysteretic in nature. Aging results when the properties of the material deteriorate as a consequence of repeated cycling through the hysteresis loop. See also hysteresis. Albite A clay mineral, soda feldspar, NaAlSi3O8, used in producing refractory materials. Alcoholysis A reaction between an alcohol and a metal oxide oligomer resulting in metal–alkoxy bond formation. This reaction can be represented by M O M + ROH q M OR + HO M
where M is the metal and R is the alkyl group. Alcoxolation A condensation reaction between metalhydroxy and metalalkoxy bonds on two different reactants/compounds in the sol-gel process in which an alcohol is released as a byproduct. The alcoxolation reaction can be represented by M OH + RO M q M O M + ROH
where M is the metal and R is the alkyl group. Alite Tricalcium silicate (with the acronym C3S), a polymorph of calcium silicate. Alite is a stable phase of calcium silicate between its melting temperature of 2070°C down to 1250°C. Alite is a component in the clinker composition. Alkali Metals Elements from lithium to francium in group IA of the periodic table, with one electron in the outer s shell. Alkaline Earth Metals Elements from beryllium to radium in group IIA of the periodic table, with two electrons in the outer s shell. Alkanethiol Long chain hydrocarbons with a thiol head group that can chemisorb onto noble metals such as gold and silver and tend to order via attractive van der Waal’s interactions between the carbon chains. Chain length and tail group chemistry can be tailored to precisely control surface chemical and physical properties. Alkanethiols are often used as model surfaces, nanoscale resists, and templates for biomolecule adhesion. See also self-assembled monolayer. Alkene Ligands Organic ligands characterized by double bonds, with the general formula RHC = CHR, where R = H or an alkyl group. Alkene acts as a ligand to a variety of metals in © 2005 by CRC Press
organometallic compounds by bonding through the U-bonds. Butadienyl (CH2 = CH CH = CH) is an example. Alkoxide A class of metal organic compounds with the general formula M(OR)x, where M is the metal and R is the alkyl group, and the alkoxy ligand is attached to the metal via the oxygen atom. Silicon alkoxides commonly used in the sol-gel process include Si(OCH3)4, Si(OC2H5)4, and Si(OiC3H4). Metal Alkoxides M OR Examples H CH3 C O CH3 CH3 H C O Ti O C H CH3 CH3 O C CH3 CH3 H CH3
OCH3 OCH3
Al OCH3
Aluminum (III) methoxide
Titanium (IV) isopropoxide
Alkyl Organic ligands with the general formula CnH2n+1. Alkyl ligands are formed as a result of removing one hydrogen atom from the carbon atom in an alkane and are commonly bonded to metal centers in an organometallic compound via carbon. Alkyl ligands are frequently used in organometallic precursors. For example, methane (CH4) produces a methyl ligand/group, CH3. Other such ligands include ethyl (C2H5), propyl (C3H7), and butyl (C4H9). Compound containing alkyl ligands H 5C 2 Al C2H5 H5C2 Triethyl aluminum
Alkyne Ligands Organic ligands characterized by a triple bond with the general formula RC } CR , where R = H or an alkyl group. Like alkene, alkynes act as ligands to a variety of metals in organometallic compounds by bonding through the U-bonds. Compound containing alkyne ligand H5C2 Al C CCH3 H5C2 Diethyl(methylacetylenyl) aluminum
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Allotelluric Acid A chemical compound with the formula H6TeO6. Allotelluric acids are weak acids with the successive dissociation constants K1 ~ 2 × 10–8, K2 ~ 10–11, and K3 ~ 3 × 10–15. Allotropes Different structural arrangements of a crystalline element. Allotropes may differ in the coordination environment (short-range) of the element or the long-range order (layers and stacking) of the crystal. For example, diamond and graphite are allotropes of carbon differing in the long-range order. Alloys Intermetallic phases or solid solutions of two or more metals. Copper and gold form a variety of alloys. Allyl Group An organic ligand with the molecular formula CH2 = CH CH2, normally bonded to metal centers via the carbon on the CH2 group or through U-bonds. See alkene ligands for a general description. Alumina Crystalline forms of Al2O3: ␣-Alumina One of the two forms of anhydrous alumina in which the oxide ions form a hexagonal closed-packed (hcp) array and the aluminum ions are distributed symmetrically among the octahedral sites. This form of alumina is hard and resistant to hydration and attack by acids and is stable at high temperatures. -Alumina Family of compounds with the general formula M2O · nAl2O3, where n is 5 to 11, M is monovalent cation, Alkali+, Cu+, Ag+, Ga+, In+, Tl+, H3O+. The most common member of this family is sodium G-alumina, which is a by-product of the glassmaking process. ␦-Alumina Anhydrous alumina produced at 850°C from L-alumina. ␥-Alumina One of the two forms of anhydrous alumina in which the crystal structure is regarded as a defect spinel structure with a cation deficiency. L-Alumina is readily hydrated and dissolves in acids. -Alumina Anhydrous alumina produced from Al(OH)3 at 400°C. -Alumina A form of alumina produced from I-alumina at 1100 to 1150°C. Aluminous Cement Cement consisting of lime (CaCO3) and alumina in equal parts with small amounts of iron oxide, silica, magnesia, alkali oxides, and titania. Alunite An iron mineral with the formula Fe3(SO4)2(OH)5 · 2H2O. Amethyst An impure form of quartz silica that is violet or purple in color. The uneven color in the crystals can be uniformly distributed by heating the crystals to elevated temperatures. Heating changes the color to yellow or green and further heating removes all color, leaving the crystals transparent. Aminoboranes Boron compounds with one or more amino group substituents on boron represented by the formula (R2N)xBRy, where R is alkyl, aryl, or H. (CH3)2N–B(CH3)2 is one such example. Some studies indicate U interactions between B and N in aminoboranes. Ammonolysis The process in which a metal nitrogen bond is formed as a result of a reaction between amines (ammonia, organic amines) and compounds containing a metal oxygen bond. Amorphous Compounds or materials with only a short-range order and no long-range order in their structures. Amorphous materials include glassy (e.g., fused silica) and noncrystalline (e.g., gel) materials. Amorphous materials can be prepared by quenching the melt, neutron bombardment, sol-gel, interdiffusion, and other methods. Amorphous Semiconductors Unlike crystalline Si and Ge semiconductors, amorphous semiconductors are noncrystalline/amorphous glass-type materials. Various chalcogenides are examples of amorphous semiconductors, and amorphous silicon can be semiconducting. See also chalcogenide glasses. Amosite A rock-forming gray-brown mineral that belongs to the class of amphibole minerals. The chemical formula of amosite is [(Mg,Fe)7Si8O22(OH)2]. Asbestos is derived from this mineral. Amphiboles A type of rock-forming mineral used for producing asbestos, which contains double6 stranded, cross-linked chains or bands with the composition (Si 4O11 )n. Amphiboles include a © 2005 by CRC Press
blue asbestos mineral (crocidolite) and a gray-brown asbestos mineral (amosite). Other examples include actinolite [Ca2(Mg,Fe)5Si8O22(OH,F)2], anthophyllite [(Mg,Fe)2Si8O22(OH,F)2], and tremolite [Ca2Mg3Si8O22(OH)]. Amphiphilic Amphiphilic molecules such as lipids, copolymers, and surfactants generally consist of a hydrophilic head group and a hydrophobic tail group (often a long chain hydrocarbon), for example, alkanethiols. See also self-assembly. Amphoteric Behavior The behavior pertaining to self-ionization, in which a chemical species consists of both an acidic and a basic site and hence can act as an acid and a base, respectively, toward other reactants. Examples of compounds exhibiting amphoteric behavior include water (H+, OH–), aluminum hydroxide, and zinc hydroxide. Amphoteric Cations Cations that are neither strong basic cations nor cations in complex anions. The amphoteric cationic radius for a given oxidation state falls between the two types of cations. Examples of amphoteric cations include Be, Ga, Cr, Mn, Fe, Al, Th, U, Pb, Hf, Sn,Ti, and Bi. Examples of strong basic cations include Ba, Sr, Na, Mg, Mn, and examples of cations in complex anions include B, C, Si, V, W, Mo, Se. Analytical Electron Microscopy (AEM) Technique used for elemental analysis of samples during scanning or transmission electron microscopy (SEM and TEM). Analytical electron microscopy includes energy dispersive spectroscopy (EDS) and wavelength dispersive spectroscopy (WDS) techniques for determining the elemental composition of a sample. See electron microscopy with microanalysis and wavelength dispersive spectroscopy. Anatase One of the forms of crystalline titania in which titanium is octahedrally coordinated to oxygen atoms. Andradite Specific types of ferrimagnetic (garnets) complex oxides with the general formula A3B2X3O12, where A = Ca, NaCa; B = Fe, Te, CaZr, Ti, Zn; X = Si, Ge, Zn, Ge, V. Anelasticity The departure from linear (Hookean) elasticity in viscoelastic or plastic materials. Unlike elastic materials, in anelastic materials, as the stress is removed, the deformation is recovered slowly, not instantaneously. Examples of materials exhibiting anelasticity include glass materials at their transition temperature and polycrystalline materials at high temperatures. See also viscoelasticity. Anisotropic Noncentrosymmetric materials with net directionality in physical properties. Directionally solidified crystals, ferroelectrics, graphite, and one- or two-dimensional fiber-reinforced composites are examples of anisotropic materials. See also isotropic. Anisotropic Magnetoresistance (AMR) A change in a materials resistance when a current flowing through a sample changes from being parallel to internal magnetic moments to perpendicular. Examples include Ni-Fe alloys and iron filings. See also magnetoresistance, giant magnetoresistance, and colossal magnetoresistance. Annealing A process in which the material is thermally treated to release stresses produced during the ceramic-forming process. In glasses, annealing stabilizes the glass structure to produce homogenous material and to avoid property variation from region to region. Anode An electrode at which oxidation occurs in an electrochemical cell (e.g., copper dissolution: Cu(s) q Cu2+(aq) + 2e–). See also cathode. Anodic Oxidation An electrolyte method used for growing oxide films on metals (Al, Ta, Nb, Ti, Zr). The metal anode is dipped into the salt or acid solution (electrolyte), and during the electrolysis process the oxide ions are attracted to the anode, resulting in film growth at the anode. Anorthite A clay mineral, lime feldspar, Ca(Al2Si2)O8, used in producing refractory materials. Antiferroelectric Dielectric materials that spontaneously polarize as a result of an applied external field. However, the individual dipoles in the material are arranged such that the adjacent © 2005 by CRC Press
dipoles are antiparallel, which results in a net polarization of zero. Examples of antiferroelectric materials include PbZrO3, NaNbO3, and NH4H2PO4. Antiferromagnetism A condition in which the magnetic moments in a material are strongly coupled in an antiparallel fashion, resulting in zero net magnetization. Several transition metal monoxides (such as MnO, FeO, NiO, and CoO) are antiferromagnetic. Antifluorite Structures A cubic close-packed structure in which the tetrahedral sites are occupied completely and octahedral sites are vacant such as in the K2O structure. Antiknock Additives Organolead compounds used as additives in gasoline for antiknock properties during fuel combustion. Antiphase Boundaries Subgrain boundaries that involve relative lateral displacement of two parts within the same crystal. Antireflective (AR) Films Films that provide reduced reflectance and increased transmittance. The antireflective properties are provided by multiple layers or by graded-refractive index (GRIN) coatings in which the refractive index changes gradually through the thickness of the film or by a sequence of quarter-wave layers. Silica and titania coatings have been developed for AR applications. Antistatic Films A type of coating that reduces the charge buildup on a material substrate. Antistatic coatings are normally composed of electrically conductive materials. Indium-tin oxide (ITO) films are frequently used for their antistatic properties. Apatite A crystalline phosphorus mineral with an idealized general formula of 3Ca3(PO4)2; CaX2 [i.e., Ca10(PO4)3X2]. Common members of the apatite group include fluoroapatite [Ca5(PO4)3F], chloroapatite [Ca5(PO4)3Cl], and hydroxyapatite [Ca5(PO4)3OH]. Aprotic Solvent A solvent consisting of no labile protons, such as dioxane, tetrahydrofuran, and dimethylformamide. Aprotic Solvents
O
O
CH3 H C N CH3 O
Tetrahydrofuran (THF)
Dimethylformamide
O Dioxane
Aqua Regia A mixture of 25 vol% HCl (37 wt%) and 75 vol% HNO3 (70 wt%) used for dissolving metal ceramic surface layers during chemical etching or surface cleaning processes. Aragonite A mineral found in temperate seas that is used for producing CaCO3. Arene or Aryl Ligands Cyclic unsaturated organic ligands consisting of alternate double bonds. Benzyl and phenyl are examples of two such ligands. Compound containing aryl ligands
Al
Triphenyl aluminum
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AR Films See antireflective films. Argentite A silver sulfide (Ag2S, silver glance) mineral used for producing silver. Aryl Ligands See arene or aryl ligands. Asbestos A fibrous silicate mineral collectively known as asbestos derived from rock-forming minerals such as hydrous magnesium silicate chrysotile, Mg3Si2O5(OH)4, with a fibrous structure. Athermal Phase Transition A transformation between crystalline phases that is independent of temperature. However, the transition may be affected by applied stress and strain. Atomic Absorption Analysis A spectrometric method used for quantitative measurements of metals in a sample by comparing the optical absorbance of the elements in the sample with a reference containing known amounts of elements. Atomic Emission Analysis See inductively coupled plasma (ICP) spectroscopy. Atomic Force Microscope (AFM) See scanning force microscope (SFM). Auger Electrons Electrons emitted as a result of the decay of an excited state of an atom to a lower energy level. See also auger electron spectroscopy. Auger Electron Spectroscopy (AES) An electron spectroscopy technique in which the kinetic energy of an emitted electron (secondary) is measured to identify the elemental composition of the sample. The electrons are emitted as a result of the decay of an excited species during a secondary process. First, the atom is excited or ionized by the bombarding radiation, and then the excited species decays to the lower energy level, emitting an electron. The elemental species is characterized by the kinetic energy of the emitted electron. A+* q A++ e
This technique is useful in identifying the presence or absence of elements on the surface of the sample. Auger Spectroscopy See auger electron spectroscopy and auger electrons. Austenite A solid solution of carbon (less than 1 wt%) in L-Fe that forms as the iron melt is cooled down to temperatures in the range of 800 to 1400°C. Autoclave A pressure vessel used for performing reactions at elevated pressures and temperatures. The vessels are tubular in structure to withstand high pressures (a few to several thousand psi) at high temperatures (as high as 500°C). The autoclaves are used for hydrothermal processing to crystallize a variety of materials at high pressures without going to high temperatures and for supercritical drying of gels and precipitates. Autoclaves are also used for leaching and separation of materials. See also hydrothermal processing and supercritical drying. Azeotrope Solutions of multiple-liquid components that produce vapors of the same composition as the liquid when these solutions are boiled, for example, a solution of 4.5 wt% water in ethanol with evaporate with no change in composition (i.e., the compositions of the liquid and vapor are the same). See also zeotrope. Azides Nitride compounds with the formula M(N3)x, where M is a metal.
B Baddeleyite A zirconium oxide (ZrO2), which is the main mineral of zirconium metal. In the baddeleyite structure Zr4+ is seven-coordinated with three oxygen atoms in the upper plane and four oxygen atoms in the lower plane. Baking Powder A mixture of Ca(H2PO4)2 · H2O and NaHCO3 with 40% starch coating. The mixture tends to produce CO2 very quickly when it is mixed with water. For this reason, a slowacting acid, NaAl(SO4)2, is incorporated in the mixture to reduce the excessive effervescence of CO2. © 2005 by CRC Press
Ballistic Aggregation In cluster growth or formation of aggregates, the process in which a monomer or a particle travels in a straight line to its point of attachment on the aggregate. Ballistic aggregation is more appropriate to particle growth in the vapor phase, whereas Brownian diffusion (where aggregating species follow a random path) is more applicable to gelation. Ball Milling A ceramic process for mixing and comminution of precursor oxides in dry or slurry forms. In ball milling, powders are mixed and the agglomerates are broken into smaller particles in a rotating mill with ceramic pieces such as balls or cylinders (usually composed of a hard oxide, such as zirconia) of various sizes. The fine powder or particles thus produced compact and sinter efficiently with increased sintering rates to fabricate dense ceramic parts. Band Gap The energy difference between the highest occupied band (the valence band) and the lowest vacant band in the electronic structure of metals, semiconductors, and insulators. Band gaps in ceramic oxides normally range from 2 to 10 eV. Band Theory The theory that describes electronic structures of metals, semiconductors, insulators, and other solids. The difference between these solids can be explained by occupancy of the valence bands and the band gap in their electronic structure. For example, lead (Pb) is a metal since it has a partially filled valence band (4f145d106s26p2; completely delocalized outer shell electrons) with a band gap of 0 eV. Silicon (Si), however, is a semiconductor with (3s23p2; partially delocalized sp3 orbitals) a band gap of only 1.1 eV; hence, the electrons in the valence band can be thermally excited to the conduction band. Diamond (C) is an insulator (2s22p2; localized sp3 orbitals) with a completely forbidden band gap of 6 eV. The band gap increases from metals to insulators. Barium Magnetoplumbite (BaM) A hard oxide composed of barium, iron, and lead oxides, used widely as a permanent magnet in a variety of applications. In addition to the abrasive properties, BaM is also lightweight and inexpensive. For magnetic properties of BaM refer to Chapter 4. Bastnaesite A lanthanide mineral with the formula MIIICO3F. Battery Electrochemical cells that convert chemical energy into electrical energy. One of the most important types of batteries is a sodium–sulfur cell, which consists of a molten sodium anode and a molten sulfur cathode separated by a G-alumina solid electrolyte. This is a highdensity cell (i.e., with high energy/power-to-mass ratio) normally used for applications such as in electric cars and power station load leveling. The other types of batteries are miniature cells used for longer life rather than high power output. These are the lithium-iodine or silveriodine type of batteries normally used for pacemakers and watches. Bauxite An alumina ore (aluminum hydroxides and aluminum oxohydroxides) used as a source for aluminum. Bauxite is most commonly used for manufacturing refractory bricks. Bayerite An aluminum mineral composed of aluminum hydroxide, F-Al(OH)3, with a hexagonal close packing of OH ions consisting of Al in two thirds of the octahedral sites. BCF Crystal Growth Theory See Burton, Cabrera, Frank (BCF) Crystal Growth Theory. Beer’s Law Law used for characterizing the optical absorption properties of a material. The absorption of light in a medium depends on the concentration of the absorbing ion and is expressed as follows: I / I0 = e( J cx )
where I is the transmitted intensity, I0 is the initial intensity, J is the extinction coefficient or absorption observed per unit concentration per unit length, c is the concentration of the absorbing ion, and x is the optical path length. Beer’s law is also described as the BeerLambert equation. Beevers–Ross Sites One of three possible sites for sodium ions in the conduction plane of Galumina (modified spinel structure). The three possible sites for the sodium ions are (a) a midoxygen position, m, (b) the BeeversRoss site, br, and (c) the anti-Beever–Ross site, abr. © 2005 by CRC Press
The sodium ion in the br site is coordinated to three oxygens in the oxide plane A (below), three in the plane C (above), and three in the conduction plane (plane B). Bentoite A silicate salt with an Si:O ratio of 1:3 that contains two bridging oxygens, two nonbridging oxygens, and the silicate anion in the ring/cyclic form (e.g., Si3O6 9 ). Beryl A silicate salt, Be3Al2Si6O18, with a composition similar to bentoite, except that the formula 6 of the silicate ion is Si6O12 18 instead of Si 3O 9 . Bethe Lattice The polymerization of a monomer that results in branching without forming any rings. Since the lattice contains no loops, the density increases without limit as the polymerization process proceeds. Also known as Cayley tree. BET Method See Brunauer, Emmett, and Teller method. Biaxial Crystal An anisotropic, low-symmetry crystal in which the index ellipsoid has three unequal axes and two directions along which the wave velocity is independent of the polarization direction. In convergent light between polarizers, biaxial crystals show a pattern that is different from uniaxial crystals. Rhombohedral crystals are biaxial in nature. See also uniaxial crystals. Bidendate Ligand Bifunctional ligands that bond with the metal through two functional groups. Ketonates are common examples of bidendate ligands that bond with metals through the two ester oxygens in the ligands. Benzoate is one such ligand. O CH3 C O Benzoate ligand
Bifunctional Monomers with a functionality of 2, which is the number of bonds that monomers can form. For example, (H3C)2Si(OCH3)2 is bifunctional because of the ability of two OCH3 groups to react and bond with other species. Bimodal Size Distribution Size distribution (bimodal pore size distribution or bimodal particle size distribution) composed of two average sizes of small and large pores or particles. For example, a system containing monomers and polymers with no oligomers has a bimodal particle size distribution. Binary Systems A two-component system with three independent variables: pressure, temperature, and composition. In solid-state compounds, the vapor pressure usually does not vary substantially with the temperature; hence, the vertical axis in the phase diagram is used as a temperature axis, and the horizontal axis is used for composition in binary phase diagrams. See also condensed phase rule. Binders Polymers and colloidal particles that are adsorbed on particle surfaces to bridge between ceramic particles for interparticle flocculation. In ceramic processing, binders improve the wetting and change the viscosity and sedimentation characteristics of the slurry for ease of processing. Soluble silicates and polyalkyl glycols are common binders used in ceramic processing. Biochip The integration of biomolecules with inorganic substrates, in particular, microelectronic substrates used for drug discovery, diagnostics, sequencing, and biosensing. For example, DNA chips (microarrays), protein arrays, lab-on-a-chip, microfluidics, etc. Biomaterials Biocompatible inorganic or polymeric materials for prolonged use as medical devices implanted within the human body (e.g., prosthetics, microelectronic blood monitors, timed internal drug delivery, etc.). Biomimetic materials chemistry Human-made devices, systems, and materials that imitate or copy nature in design, fabrication, or function (e.g., self-assembly, neural networks, organicinorganic composites, etc.). © 2005 by CRC Press
Birefringence A condition in an anisotropic optical material in which an incident beam is split into two transmitted beams with opposite polarization and with different velocities and hence different refractive indices. Calcite, for example, exhibits birefringence. These types of optical crystals find applications in polarizers, analyzers, compensators, and phase contrast microscopes. Centrosymmetric crystals, however, do not exhibit birefringence. Biuret Test An analytical test used for determining the presence of a peptide linkage in a compound. The alkaline solution of biuret HN(CONH2)2 reacts with CuSO4 to produce a characteristic violet color that indicates the presence of a peptide linkage in the compound. This forms the basis of the biuret test, in which excess NaOH and small amounts of CuSO4 are added to the unknown material. Bivariant System A system in which two variables are required to describe the system. In a binary phase diagram of refractories, the phase rule P + F = C + 2 is modified to P + F = C + 1 owing to the absence of vapor pressure of the solid phases in the system. In the condensed phase rule P + F = C + 1, P is the number of phases, F is the number of degrees of freedom, and C is the number of components needed to describe the system. For example, in the Al2O3 Cr2O3 system, C = 2 and P = 1; hence, F = 2 (i.e., temperature and composition are the only two variables required to describe this system). See also binary systems and condensed phase rule. Body-Centered Lattice A cubic lattice that contains an atom or an ion in the center of the cube in addition to the corner lattice points. F-Iron is an example of a body-centered lattice. See also lattice. Boehmite Aluminum oxohydroxide L-AlO(OH) with cubic close packing of O and (OH) anions and aluminum cation occupancy in octahedral sites. Boltzmann Constant See magnetic susceptibility and magnetic moment. Bond Order See valence sum rule. Bond Percolation The percolation model used to describe the polycondensation process in solgel systems in which bonds are formed at random between-lattice sites resulting in cyclic species in addition to linear and branched species. The percolation threshold in bond percolation is different from that in site percolation, because each bond joins only two sites, whereas one site can link with several bonds depending upon the geometry of the lattice. Bonds Any one of five types of chemical bonds: covalent, ionic, a combination of these two types, intermediate, or van der Waals. Covalent bonds are formed by overlapping orbitals of the elements (or sharing of their electrons). Covalent bonds are highly directional bonds formed between elements of the same or similar electronegativities. For example, CH bonds in CH4 are covalent bonds. Ionic bonds are formed by complete transfer of electrons from the orbital on one element to the other. Ionic bonds are formed between elements with a large difference in electronegativities. For example, KCI exhibits ionic bonding in which potassium is the electron donor and chlorine is an electron acceptor. Although KCI can be regarded as an almost completely ionic structure and CH4 can be regarded as a completely covalent structure, many compounds exhibit an intermediate structure with both ionic and covalent bond characters. Intermediate bonding can be characterized by an ionic electron configuration associated with an increased electron concentration along the line between atom centers (i.e., consisting of some orbital overlapping with more directionality). van der Waals bonds are weak attractive forces between atoms or molecules resulting from fluctuating dipole moments that arise owing to the changing positions of the electrons in neighboring atoms or molecules. See also van der Waals forces. Borate Glasses Amorphous glassy materials with MO · xB2O3 composition, in which M is an alkali metal. The structure of borate glasses contains a mixture of BO3 triangles and BO4 tetrahedra, depending on the composition. Borate glasses are of little commercial importance owing to their high water solubility. © 2005 by CRC Press
Borax The borate composition Na2B4O7 · 4H2O used as a fluxing agent in manufacturing refractories. Borazine A boronnitrogen compound (B3N3H6) that has a regular-plane hexagonal ring structure with alternate boron and nitrogen atoms. The physical properties of borazine closely resemble those of the isoelectronic compound benzene; however, the chemical properties of borazine are distinctively nonaromatic. Bordeaux Copper sulfate pentahydrate (blue vitrol) compound (CuSO4 · 5H2O) that is used as a fungicide to protect crops and in electroplating processes. Borosilicate Glasses Glasses composed of SiO2 and B2O3 oxides. The structure is a combination of borate (BO3 triangles) and silicate (SiO4 tetrahedra) glasses. Boundary Stresses Stresses generated between the grain boundaries of each component in a multicomponent system or between different crystallographic orientations in a single-component system. When two powder components are mixed, heated, and then cooled to produce a ceramic part, stresses are generated by the differential thermal expansion coefficient of the two materials. The grain boundary stresses cause cracking and separation at the boundaries. The boundary stresses in an anisotropic single-component system are caused by heating and cooling cycles. This technique of heating and cooling is used in crushing quartzite rock to obtain oriented quartz crystals. Bragg’s Law The law that describes the diffraction phenomenon in which a crystal is regarded as a multiple-layer system, with each layer acting as a semitransparent mirror. Incident x-rays are either reflected by the top layer or transmitted to the lower layers and subsequently reflected. Bragg’s law determines the conditions under which the two reflected beams are in phase. The extra distance traveled by the incident beam to the lower layers is equal to the multiple of the wavelength of light and can be expressed by nQ = 2d sin V,
where d is the spacing between the planes (d-spacing) and V is the incidence angle. Brass An alloy of copper and zinc (CuZn), with a superstructure in which Cu occupies the bodycentered position in the cube and Zn occupies the corners of the cube. Bravais Lattice A lattice system that is a combination of a crystal system (cubic, tetragonal, trigonal, hexagonal, monoclinic, orthorhombic, triclinic, etc.) and a lattice-type [rhombohedral (R), body-centered (I), primitive (P), face-centered (F), etc.] system. For example, NaCl is a face-centered cubic crystal. See also individual crystal systems. Bridgman Method A method used for preparing oriented single crystals from melts by flowing the melt in a gradient furnace where solidification occurs at the cool end of the furnace. This method is also known as directional solidification. Brookite A titanium oxide polymorph. Brown-Ring Complex A nitrosyl complex of iron [Fe(H2O)5NO]2+ formed during the qualitative analysis of nitrates. Brucite Magnesium hydroxide, Mg(OH)2, a source for producing MgO used in brick manufacturing. In the brucite structure, magnesium is hexa-coordinated in a CdI2 structure with OH bonds perpendicular to the layers and strong hydrogen bonding (OH …. O) between them. Brunauer, Emmett, and Teller (BET) method A nitrogen adsorption technique for measuring surface area, pore size, and pore size distribution in the solid state material (powder or monolithic samples). In this method, the sample is first evacuated to remove any gases in the pores. Then nitrogen gas is slowly adsorbed into the pores, and the weight gain in the sample measured as a function of increasing nitrogen pressure. Based on this information, other data such as surface area, types of pores ( meso- or micropores), and pore size distribution are derived. The BET equation is © 2005 by CRC Press
1/ W ( P0 / P) 1 = 1/ WmC + C 1/ WmC ( P / P0 )
where W is the weight of the gas adsorbed at a relative pressure P/P0 and Wm is the weight of the monolayer of surface coverage. C is the BET constant and is related to the energy of adsorption in the first adsorbed layer. See also surface area. Buckminsterfullerene A spherical caged C60 molecule arranged in a soccer ball shape with 20 hexagons and 12 pentagons, also called a buckyball. At 30°K, rubidium-doped buckyballs (Rb3C60) are superconducting. Buckyballs have been proposed as drug delivery molecules owing to their small size (1 nm diameter) and low toxicity. See also fullerene and nanotechnology. Buffer Solution A solution that contains a moderately weak acid (e.g., HC2H3O2) and its conjugate base (e.g., C2 H 3O 2 ) to neutralize any added acid or base to the solution, maintaining the pH of the solution close to the desired solution pH. In the absence of the weak acid or its conjugate base, addition of small amounts of acid or base dramatically changes the pH of the solution. The solution retains its buffering action as long as the quantities of added acid or base are much less than the quantities of weak acid and its conjugate base. Bulk Modulus The ratio of isotropic pressure, P, applied on the sample to the relative volume change, )V/V, in the sample as expressed below: K = P / )V / V
where K is bulk modulus. K can also be expressed as K = E / 3(1 2S)
where E is Young’s modulus and S is Poisson’s ratio (ratio of the decrease in thickness to the increase in length). When S is equal to half, the material is incompressible. Burger Vectors The vector, b, that characterizes the dislocation in a crystal lattice. For example, in an edge dislocation, b is perpendicular to the line of dislocation and is parallel to the direction of the dislocation motion and the direction of the shear. Burton, Cabrera, Frank (BCF) Crystal Growth Theory The theory of crystal growth based on the motion of step edges across a surface. Mobile surface adatoms are incorporated at step edges, typically at kink sites, causing the step edge to propagate laterally across the surface. See also terrace-step-kink model. Butoxy An alkoxy ligand with the formula –OR, where R is butyl, C4H9. There are four types of butoxy ligands: n-butoxy (OCH2CH2CH2CH3), sec-butoxy (H3COCHCH2CH3), isobutoxy [OCH2CH(CH3)2], and tert-butoxy [OC(CH3)3]. O CH2 CH2 CH2 CH3 n-Butoxy
CH3 O CH2 CH CH3 iso-Butoxy
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O CH CH2 CH3 CH3 sec-Butoxy
CH3 O C CH3 CH3 tert-Butoxy
C Cab-o-Sil Trade name for fumed silica powder produced by Cabot. See also aerosil. Cacodylic Acid A dimethylarsenic acid, (CH3)2ASO(OH), used in agriculture as an herbicide. Cadmium Iodide Structure See CdI2 structure. Calamine A zinc ore, also known as Smithsonite, with the chemical formula ZnCO3. Calcination A ceramic process that involves converting metal salt precursors, such as carbonates, oxalates, alkoxides, sulfates, nitrates, and acetates or oxides, into desired crystalline oxides or other nonoxide single or multicomponent compounds. The variables involved in this process include temperature, pressure, gaseous atmosphere, and calcination time. The variables determine the crystallinity, grain, size, and other physical properties of the final material. For example, when basic magnesium carbonate (MgCO3) is calcined at 550°C, a pseudomorphed MgO is formed, whereas when calcination is performed at 900°C, crystalline MgO (approaching cubic) is produced. In another example, BaCO3 and TiO2 are calcined at 1100°C to form perovskite BaTiO3. Calcite A sedimentary deposit of CaCO3. Capillary Pressure The pore pressure that develops during the drying and densification of ceramic and glassy materials. When the liquid phase wets the solid particles or phase, each interparticle space becomes a capillary in which substantial pressure develops owing to the surface tension of the liquid. Capillary pressure (P) can be represented by P = L(1/ r1 + 1/ r2 )
For circular pores, capillary pressure is given by P = 2L cos V / r
where L is the surface tension of the liquid, V is the wetting angle, and r is the pore radius for circular pores, with r1 and r2 the principle radii of curvature of meniscus. Carbides Ceramic composition composed of a metal cation and a carbide anion, commonly used for refractory and structural applications. There are three classes of carbides: ionic, covalent, and interstitial. Ionic carbides include metal cations from group IA, IIA, and IIIA in the periodic table and are extremely unstable under atmospheric conditions. Silicon carbide (SiC) and boron carbide (B4C) are the only two covalent carbides known. Interstitial carbides are normally composed of transition metal cations, such as Ti, Zr, Nb, Ta, Cr, Mo, and W. Among the above carbides, SiC, B4C, and WC are the most widely used. Carbon Nanotubes A form of carbon structurally obtained by rolling a graphitic sheet of carbon into a tube (~1–2 nm diameter), which can be several microns long. Nanotubes are formed using either cathodic or across carbon electrodes, pulsed laser evaporation of a carbon target, or chemical vapor deposition methods. The chirality of the tube determines whether the electrical properties are metallic or semiconducting. Nanotubes come in single wall nanotube (SWNT) or multiwalled nanotube (MWNT) forms whose ends are often capped with half a buckyball. Carbon nanotubes have been formed into nanoscale transistor and wire components. They have also been used in nanocomposites when mixed with a polymer matrix. See also buckminsterfullerene, fullerene. Carbonates Metal salts used as precursors for ceramics, glasses, and metallic materials. Some examples of carbonate precursors include MgCO3, CaCO3, and PbCO3. Carnegieite Sodium aluminum silicate, NaAlSiO4, with a less open framework structure than pure silica. © 2005 by CRC Press
Cassiterite Crystals produced by hydrothermally treating silica with 10% SnO2 at 300°C. This material reduces the coarsening effect and helps produce silica material with high surface area. Catalysts Materials that increase the efficiency of the reaction or the rate of reaction and that are regenerated at the end of the reaction. Several ceramic materials such as inorganic oxides are used for catalyzing organic and inorganic reactions. For higher catalytic efficiency, large catalytic surface area is required. The catalysts are produced and used in a variety of forms including powder, membrane, sheet, and wire. TiO2 is one of the most common catalysts used in the petroleum industry. Cathode An electrode in which reduction occurs in an electrochemical cell [e.g., copper deposition: Cu2+(aq) + 2e– q Cu(s)]. See also anode. Cathodic Sputtering A standard method of electroplating the metal substrate in which two metal electrodes are dipped in an electrolyte solution and an external field is applied across the electrodes, resulting in film deposition caused by the migration of metal ions to the cathode. Cathodoluminesence The emission of light by a material as a result of absorbing energy from cathode rays or electrons. Cayley Tree A growing polymer that branches without forming any rings. It is also referred to as the Bethe lattice. The Cayley tree has been used to explain the gelation process in certain sol-gel systems. CdI2 Structure A structure similar to the rutile structure in which iodide ions are arranged in a hexagonal close-packed structure and half of the octahedral sites are filled by Cd2+ ions. However, this structure differs from the rutile structure in the three-dimensional arrangement. The CdI2 structure is layered, with octahedral sites filled by cations on alternate layers, whereas the rutile structure has a more rigid three-dimensional structure. Celsian Barium aluminosilicate, composition containing BaO · Al2O3 · 2SiO2. Cement Silicate material that solidifies (sets or hardens) owing to a chemical reaction with water. Although cements have been used since ancient times, many types of cement such as Portland cement are commonly used today. Portland cement is composed of strong cementitious materials such as Ca2SiO4 and Ca3SiO5 that are produced by mixing and heating (~1500°C) a variety of clay, lime sand, and oxides together. The oxide contents of Portland cement include 63% CaO, 20% SiO2, 6% Al2O3, 3% Fe2O3, 2% SO3, 2% MgO, 1% K2O + Na2O, and 3% others. Cement Clinker In cement production, partially fused lumps produced as a result of raw materials mixing and oxidation at ~1500°C, which are then crushed and mixed with gypsum to form powder. Cementite The iron-carbide phase, Fe3C (cementite), which is thermodynamically unstable and decomposes to iron and graphite. However, the kinetic decomposition of cementite is slow. Center of Symmetry The point at which any part of a molecule can be reflected through its center to produce an identical arrangement present on the other side. For example, an AlO6 octahedron is centrosymmetric. Ceramer The combination or hybrid of ceramic (inorganic) and polymeric (organic) materials. They can be prepared by reacting the monomeric precursors at a molecular level to yield a highly homogeneous material with chemical bonding between organic and inorganic components. Sometimes materials prepared by physically mixing the raw materials are also referred to as ceramers. Ceramers may have improved properties over their ceramic or polymer counterparts alone. For example, glass polymer composites are more flexible than glass and can withstand higher temperatures than organic polymers. Ceramics The art and science of preparing inorganic solid articles including monoliths, powders, films, fibers, and composites from inorganic raw materials or precursors and studying the structure and properties relationships. Ceramic materials are inorganic and can be classified into oxides, borides, carbides, nitrides, other chalcogenides, and their composites in crystalline and amorphous forms. They do not exhibit metallic properties and are brittle in nature. Ceramic products are used as refractory, electronic, optical, abrasive, structural, and magnetic materials. © 2005 by CRC Press
Ceria A dioxide of cerium CeO2. Cermet The combination of ceramic and metal materials that is generally used as refractories. The resultant material possesses properties of both metal and ceramic components. NiTiC, for example, is a refractory cermet used in high-temperature abrasive applications. Cesium Chloride Structure See CsCl structure. Chalcogenide Glasses Glasses composed of amorphous sulfur, selenium, and tellurium by themselves or in combination with other elements such as silicon and germanium. Selenium in an amorphous thin film form is a chalcogenide glass used in the photocopying industry. Si and Ge chalcogens are widely used in the semiconductor industry. Charge Density Wave Normally uniform distribution of conduction electrons is coupled with phonon variations to result in the periodic variation of charge density in one dimension. Electron motion is cooperative in this direction, giving rise to unusual properties such as highly nonlinear electrical behavior. Charge-Determining Ions Adsorbed ions that control the charge of the surface of a particle in a suspension and provide a repulsive electrostatic barrier between the particles. Charge Transfer Spectrum An absorption spectrum that results from the promotion of an electron from a localized orbital of one atom to a higher energy localized orbital on an adjacent atom. For example, the intense yellow color of chromates results from an electron transfer from an oxygen atom in a (CrO4)2– in a tetrahedral environment to the central chromium ion in an octahedral environment. Chelate In metal organic compounds, the ligand that can bond to the metal through two or more sites. In sol-gel science, acetylacetonates are frequently used as chelating ligands to substitute alkoxy ligands in metal alkoxides. The acetylacetonates are bonded to the metal via two ester oxygen atoms. By using chelating ligands in place of alkoxy ligands, the hydrolysis and condensation reactions in the sol-gel process are slowed down. Examples of Chelates R R = Alkyls, aryls
O M O R
CH3 CH3
CH3 HC C CH3 C O O C O Al CH O O C C O CH3 HC C CH3
Aluminum (III) pentanedionate
H3C H7C3iO H3C
CH3 O O Ti OiC3H7 O O CH3
Titanium (IV) diisopropoxy bis pentanedionate
Chemical Diffusion The diffusive motion of an atom under a chemical concentration gradient (i.e., a gradient in the chemical potential of the species) typically occurring in a solid. See also self-diffusion, surface diffusion. Chemical Etching A process of removing a thin surface layer by dissolving the film in a chemically active solution. The chemical etching of the sample surface can be achieved by reactive solvents (e.g., hydrocarbons and halogenated hydrocarbons) or aqueous solutions (acids, © 2005 by CRC Press
bases, and neutral solutions). Chemical etching is performed in scanning electron microscopy (SEM) for exposing the microstructure of the bulk sample (for revealing features such as grain boundaries), and in the semiconductor industry chemical etching is used for several purposes, such as film bonding and adhesion and photolithographic pattern formation. It is also used for cleaning surfaces prior to film deposition. Chemical Mechanical Polishing (CMP) A form of wet etching commonly employed in the microelectronics industry to planarize a surface. The polishing slurry is a combination of abrasive media and a chemical etchant, which are added to a polishing cloth under an applied load. Chemical Shifts The position of a peak in a molecular spectrum relative to the internal and external standard to obtain local structural information on the molecule under consideration. The positions of the peaks are referred to as chemical shifts in nuclear magnetic resonance (NMR) spectroscopy, Mossbauer spectroscopy, and electron spectroscopy for chemical analysis (ESCA). Chemical Vapor Deposition (CVD) A vapor transport method used to deposit films on a variety of substrates. Vapors of various sources (reactants) are transported in a controlled manner (for stoichiometry) to react in the CVD chamber and deposit films on the heated substrates. The precursors may react in the gas phase or react or decompose on the heated substrate to form the desired film compositions. The decomposition or reaction may be achieved by pyrolysis, photolysis, or chemical reactions. In many cases, the film growth from vapor deposition results in epitaxial films (highly oriented along the substrate crystalline lattice). See also metallorganic chemical vapor deposition, sputtering, evaporation, electron beam evaporation, and vapor phase epitaxy. Chemisorption Adsorption of an atom or molecule on a surface through formation of a chemical bond between the adatom and the solid surface. They typically possess energies on the order of 100 to 400 kJ/mol. The adsorbate–adsorbate interactions are often small compared to the adsorbate–substrate interactions, resulting in an adlayer structure partially determined by the underlying substrate lattice. The long-range ordering of the adlayer is usually determined by adsorbate–adsorbate interactions. See also physisorption. Chemorheology Viscoelastic behavior induced in cross-linked polymeric systems in a reactive environment. For example, stress relaxation and flow result when crosslinks are oxidized or hydrolyzed by the atmosphere. See also viscoelasticity. Chimie Douce French term for a chemical method used for preparing metastable phases from chemical precursors mixed at a molecular level instead of a solid-state reaction route. The crystal structure of the new metastable phase closely resembles that of the precursors. For example, TiO2(B), a new polymorph of titania prepared by hydrolysis and subsequent heat-treatment of the K2Ti4O9 precursor, has a structure composed of TiO6 octahedra; however, they are linked to each other in a manner different from rutile, anatase, and brookite phases but similar to the K2Ti4O9 phase. China Clay Pure kaolin with an approximate formula Al2O3 · 2SiO2 · 2H2O. This clay begins to melt at 1595°C and is converted into a complete melt at 1800°C. Chip An unpackaged semiconductor device or die cut from a wafer, which contains the integrated circuit elements such as transistors and resistors. Chiral Molecule An optically active molecule that is not superimposable on its mirror image. A molecule’s chiral counterpart often possesses different chemical activity and function, and each will rotate plane-polarized light in a different direction. Chrome Refractory Chrome, Cr2O3, is a refractory oxide that melts at 2275°C. Cr2O3 is also referred to as chromium sesquioxide. Chromophore A combination of ions that cause absorption in the visible region (whereas ions themselves do not) and, hence, impart color. CdS chromophore is yellow; however, neither Cd2+ nor S2 alone causes visible absorption. © 2005 by CRC Press
Clausius–Claypeyron Equation The quantitative statement of le Chatelier’s principle in reference to the pressure dependence of phase transition as a function of temperature, which is given by dP / dT = )H / T )V
where dP/dT is a change in pressure with temperature, )H is the change in enthalpy, and )V is the change in volume as a function to temperature T. For example, KCl changes from rock salt structure to CsCl structure at 19.6 kbar and at room temperature with )H of 8.03 kJ/mol and )V of 4.11 cm2. In another example, the melting point of water decreases or the boiling point of water increases for each mega pascal of applied pressure. Clay A sheetlike mineral composed of aluminum silicate hydrate, aluminum-sodium silicate hydrate, and aluminum-potassium-magnesium silicate hydrate. Hence, the major components in the clay are aluminosilicates. Clinoenstatite A mineral, magnesium silicate, MgSiO3. Close-Packed Structures The structures resulting from the most efficient approach to pack spheres in three dimensions by stacking close-packed layers on top of each other. These layers consist of spheres that are surrounded by and are in contact with six other spheres. There are two types of structures: hexagonal and cubic close packed. In hexagonal and cubic close-packed structures, the void volume is only 26%, compared with 48% in a simple cubic structure. See also cubic close packing. Cluster–Cluster Growth Model A model used to describe the cluster growth process that results from aggregation of clusters with one another rather than addition of monomers to clusters. The fractal objects thus produced are more porous than those resulting from monomer–cluster-type aggregation. The kinetics of aggregation may be limited by the rate of condensation or diffusion, and this affects the fractal dimensions of the aggregate. See also fractal. Clusters Nanoscale particles typically containing tens to a few thousand atoms, which exhibit size-dependent electrical and optical properties owing to their large surface area to volume ratio and quantum size effects. Clusters are often studied on materials substrates. See also quantum dots. Coacervates In colloidal suspensions, the concentrated regions of particles that are not bound to one another. The surface tension associated with coacervates may help these regions of particles adopt a spheroidal shape. Coadsorption The simultaneous adsorption of two or more different types of atoms or molecules onto a substrate. Coating Typically a thick film added to the surface of another material for mechanical, chemical, or thermal protection; as a cosmetic finish; or as a reflective or light adsorbing layer. Coatings are typically on the order of several microns to millimeters in thickness. Coatings can be formed naturally via oxidation or corrosion or synthetically applied via chemical and physical deposition methods, the latter including dip coating, vapor deposition, laser ablation, sputtering, plasma spray, electrodeposition, etc. Coagulation See flocculation. Coarsening A process of dissolution and reprecipitation driven by differences in solubility between the particle surfaces with different radii of curvature, sometimes also referred to as Ostwald ripening. Because of the difference in solubility, the smaller particles dissolve more easily and the solute precipitates in regions of lower curvature (necks and crevices with lower solubility), filling small pores with larger particles growing at the expense of smaller ones. Coercive Field The electric or magnetic field required to polarize the electric or magnetic dipoles in a material. These materials normally possess electric or magnetic hysteresis; i.e., when the field is removed, the materials retain a certain percentage of the polarization or magnetization. © 2005 by CRC Press
Coercivity The magnitude of the reverse field required to achieve demagnetization or depolarization. The magnitude of the applied field in electrical and magnetic materials is denoted by Ec and Hc, respectively. Magnetically soft materials possess low coercivity. Coesite A polymorph of SiO2 with a density of 2.90 g/cm3 that forms at 30 to 40 kbar of pressure. Colossal Magnetoresistance (CMR) Similar to giant magnetoresistance, but the resistance of a multilayer composite drops even more sharply under the application of an externally applied magnetic field. CMR has been predominantly observed in manganese-based perovskite oxides, lanthanum-strontium-manganite (LSMO), lanthanum-calcium-manganite (LCMO), and the double perovskite strontium-iron-molybdate (SFMO). The CMR effect arises because of strong mutual coupling of spin, charge, and lattice degrees of freedom. See also anisotropic magnetoresistance, magnetoresistance, and giant magnetoresistance. Cole–Cole Plots Plots of the imaginary part of the dielectric permittivity versus the real part as a function of frequency forms a semicircular arc that provides information relating to dielectric relaxation phenomenon occurring within a dielectric material. The permittivity measurements are collected over a range of frequencies, including radio, audio, and microwave frequencies. Colloid A suspension with the dispersed phase characterized by large surface area and a size range of 1 to 1000 nm, such that the gravitational forces are negligible and the interactions between particles are dominated by short-range forces (van der Waals forces) and surface charges. The fine, dispersed phase in colloids normally exhibits Brownian motion. The dispersed and the continuous phase combination in a colloid may include solid-in-gas (e.g., sprays), gas-in-liquid (e.g., beer), liquid-in-liquid (e.g., milk), solid-in-liquid (e.g., paints), and solid-in-solid. Colloidal processing is used in preparing a variety of slurries for tape casting processes employed in ceramics and for producing monodispersed or polydispersed ceramic particles via nucleation, growth, and ultracentrifugation or spray drying steps. A variety of gels, films, and fibers have also been produced by colloidal processing. Color The coloring constituents in most ceramic materials consist of transition elements with incomplete d shells, such as V, Cr, Mn, Fe, Co, Ni, Cu, and some rare earth elements with incomplete f shells. The colors commonly produced by various metals are listed in Table 2.1. In addition to the individual ions and oxidation states, the color of a compound can be affected by the ionic environment. See also color center. Table 2.1
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Element
Color
Titanium Vanadium Chromium Manganese Iron Cobalt Nickel Copper Cerium Praseodymium Neodymium Samarium Europium Terbium Dysprosium Holmium Erbium Thulium
Yellow Green Green Purple Yellow, green/blue, green Blue Yellow/brown/purple Green/blue Yellow/brown Green Purple, red/blue Pale yellow Dark yellow Very pale yellow Yellow Peach Pink Green
Color Center Color spots arising from defects in the crystal lattice. There are a variety of color centers, including F-center, H-center, and V-center. An F-center is an example of a color center in alkali halide crystals produced as a result of a trapped electron in an anion vacancy. A greenish yellow F-center can be produced by heating sodium chloride in sodium metal vapors. This process involves absorption of sodium atoms that subsequently ionize the crystal surface. Na+ stays at the surface, and Cl ions tend to move to the surface to neutralize the sodium ions. In the meantime, electrons diffuse into the lattice to fill the anion vacancies. The energy required for the electron to transfer from one energy level to another falls in the visible region of the electromagnetic spectrum, thus producing the characteristic color. The color results from the host crystal, not the source of the electron. For example, NaCl heated in K vapors still produces yellow color centers, whereas KCl heated in Na vapors produces violet color centers. An H– center is produced, for example, when an anion site in NaCl is replaced by Cl 2 , whereas a V– center is produced when two anion sites are filled by Cl 2 . Colorimetry See spectrophotometric analysis. Combinatorial Chemistry Combinatorial chemistry is often called high throughput chemistry, as it uses efficient parallel synthesis. Large sets of chemically similar reagents (such as amino acids, peptides, oligomers, etc.) are mixed in minute amounts in binary chemical reactions to produce hundreds to thousands of products that are then screened for relevant properties such as biological activity; chemical reactivity; and electrical, magnetic, or optical properties. The fundamentals of combinatorial chemistry tend to apply regardless of the application, including synthesis of the compound library, mixture of solutions or solids, the running of a large number of screens, and a rapid and reliable analysis technique. Robotics are often used to automate many of the steps, including mixture of the compounds and rapid analysis. The largest impacts of combinatorial chemistry to date have been in drug discovery, materials development, and biology. Screening for new materials with improved properties has also benefited from combinatorial chemistry techniques. Compatible Phases The phases of the material that are stable in each others’ presence. Complexation The process of forming an associated species from positively charged molecules or particles in the solute and a variety of anions from the solution. Composite A combination of different types of materials to obtain synergetic properties unattainable by one material alone. Ceramic processing and sol-gel processing have been used to prepare ceramic–ceramic, ceramic–metal (cermet), and ceramic–polymer (ceramer) composite materials. Composites normally include two phases: matrix and reinforcements. In composites, the two phases are typically physically bonded by conventional ceramic processing or can be chemically bonded at the molecular level by chemical processes such as sol-gel. Compound Semiconductor Inorganic and organic compounds that possess semiconducting properties. For example, GaAs, InSb, and GaP (III-V compounds) are compound semiconductors. Compressive Strength The applied compressive load (stress) on a material at failure. Concrete Composition formed when cement is mixed with water and other components that quickly set. See also cement. Condensation In the polymerization process, the reaction in which the reactants bond and as a result liberate a small molecule in addition to the products. In the sol-gel process, when metal alkoxides are hydrolyzed, the OH group on the metal organic species thus produced condenses with another OH group or alkoxy (OR) group on another metal organic species, and a condensed product is formed, releasing a water or an alcohol molecule. This is a common example of a condensation reaction in sol-gel processing. Condensed Phase Rule A Gibb’s phase rule defined by the following equation: P+F =C+2
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where P is the number of phases in equilibrium, C is the number of components needed to describe a system, and F is the number of degrees of freedom (number of variables such as pressure, temperature, and composition). However, in refractory systems with high melting temperatures, the vapor pressure of solid and liquid phases is negligible in comparison with atmospheric pressure, and the phase rule equation is modified to a condensed phase rule: P + F = C +1
In the Al2O3Cr2O3 system, C = 2 and P = 1; therefore, F = 2. That is, the two variables temperature and composition are required to describe the system. See also bivariant system. Conditional Glass Formers Oxides that do not form glass when their melt is cooled rapidly; however, glass can be formed when these oxides are combined with another non-glass–forming oxide. The liquid composition of CaOAl2O3 forms glass, whereas CaO and Al2O3 independently do not form glass. Conductance (Conductivity) The ease at which an electric current passes through a material (or liquid); the inverse of resistance. Conductivity is related to an electron’s or hole’s mobility under an applied electric field. Conduction Band The energy band in a semiconducting or insulating material that contains the conduction electrons involved in electron transport. In an intrinsic semiconductor, electrons must be thermally or optically excited from filled states in the valence band to empty states in the conduction band in order for electrical conductivity to be possible. Conduction Electrons Electrons in the conduction band that are involved in electron transport. Conductor (Electronic) A material with partially filled valence (hole doping) or conduction (electron doping) bands (i.e., a semiconductor) or with delocalized electrons such as metals. See also band theory and insulator. Consolute Temperature The temperature at which a liquid melts or crystalline solution cools and separates into two phases. Constructive Interference In optical experiments, the process of combining two or more light beams (waves) with the same frequency or wavelength that are in phase to form a wave whose amplitude is the sum of the amplitudes of the incident waves. Contact Angle The angle between the solid surface and the tangent to the liquid surface at the contact point in which a liquid is wetting the solid surface (also called wetting angle). The contact angle might vary between 0 and 180° for various liquids on solid surfaces. Water is the most commonly used liquid to determine the contact angle of the solid surface to evaluate the hydrophobicity or hydrophilicity of the surface. If the contact angle is closer to 0 or 180°, the surface is characterized as sticky (hydrophilic) or slick (hydrophobic), respectively. Contrast Ratio In optics, a factor that determines the opacifying power of a material. Hence, high opacity results in high reflectance, and a high scattering coefficient results in a high contrast ratio. Controlled Valency Semiconductors Transition metal compounds that normally conduct electricity because of multiple oxidation states that have only one valency or one oxidation state of the element stabilized, resulting in semiconducting properties. For example, pale green NiO (Ni2+) is an intrinsic semiconductor owing to internal d–d transitions. However, when the semiconductor is oxidized at 1000°C, some Ni2+ sites are oxidized to Ni3+ (black). The conduction occurs through electron transfer from Ni2+ to Ni3+. Coordination Compound Compound or complex formed when a ligand (Lewis base) is attached to a metal (Lewis acid) by means of a lone pair of electrons. For example, [Co(NH3)6]Cl3 and K3[Cr(CN)6] are coordination compounds with NH3 and CN as ligands (Lewis bases) to Co and K metal cations, respectively. Coordination Number The maximum number of neighbors with opposite charge that an ion can achieve. For example, in TiO2 the coordination number of Ti4+ is six (i.e., it has six O2 neighbors). © 2005 by CRC Press
In colloidal chemistry, for a particle in a suspension, the coordination number is the average number of nearest neighbors/particles. Coprecipitation Methods An alternative chemical method to ceramic batching and milling for producing preceramic powder. In this method, the metal salt precursors are mixed at a molecular level in a solution to precipitate a fine powder that is calcined (solid state reaction) at relatively lower temperatures to yield ceramic products. See also calcination. Cord and Striae Inclusions present in amorphous materials. Cords are attenuated amorphous inclusions in the glass (resulting from an inhomogeneous melt) that have properties (such as index of refraction) different from the material surrounding the glass. Striae are low-intensity cords that are especially deleterious in optical glasses. Cordierite A mineral composition with magnesia, alumina, and silica (2MgO · 2Al2O3 · 5SiO2) commonly used as an electrical insulator. It can be synthesized as a glass-ceramic material. Coring In a multicomponent system, a condition in which the central part of the crystal has a specific composition, but in areas radially surrounding this central part, the crystal becomes rich in another composition. This occurs in natural minerals and rocks and in manufactured steel parts. Coring can be deleterious to the mechanical properties of the metal and is preferably removed by reheating the metal below the solidus temperature. Corrosion The chemical degradation or deterioration of a material generally in the presence of a reactive liquid or gas. Aqueous electrochemical reactions are the most common causes of corrosion in aqueous or humid environments; however, high temperature gases can also degrade a surface. The atomic and molecular mechanisms of corrosion are quite complex and are still actively being studied. The corrosion of a material can also be carefully controlled to shape, pattern, or clean a material, as in electrochemical machining of metal parts and wet chemical etching of semiconductors. See also chemical mechanical polishing, etching. Corundum A single crystal of alumina, Al2O3. Counter Electrode (or Auxiliary Electrode) An electrode in a three-electrode configuration that is used only to complete the electrochemical circuit so that current can be applied to the working electrode. The counter electrode must be inert under the voltage and electrolyte conditions, must pass sufficient current to the solution, and must not create nonuniform current distributions at the working electrode. Typical counter electrodes are made from gold, platinum, or graphite. See also cyclic voltammetry, reference electrode. Counterions Ions of opposite charge. In colloidal chemistry, the charge-determining ions in the double layer are on the surface, and the counterions are in the solution in the vicinity of the particle and contribute to the repulsive barrier between the particles. Coupling Agents Chemicals that provide a means of chemically modifying the film or particle surfaces. The coupling agents normally contain two or three types of ligands and groups. At least one of the groups reacts with surface groups, bonding the coupling agent to the surface, and the other groups and ligands provide surface functionality not previously available. Coupling agents may be applied to improve adherence of the film to the surface or may be applied in cases in which the film and the substrate are not chemically compatible. The same approach can be applied to solid particles in suspension to produce stable emulsions. In this fashion, desired surface properties can be easily modified by applying coupling agents. Some examples for commonly used coupling agents that couple polymeric and silica surfaces are vinyltrimethoxysilane, phenyl-trimethoxysilane, and epoxytrimethoxysilane. OCH3 CH2 CH Si OCH3 OCH3 Vinyltrimethoxysilane
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Covalent Crystals Crystals with a repetitious structure consistent with the strong directional nature of the covalent bond. For example, CH4 is not a covalent crystal; however, diamond is a covalent crystal with a three-dimensional network created by covalent bonds. Crack See fracture. Crazing A common glaze defect produced when the thermal expansion coefficients of the underlying materials and the glaze are mismatched. As a result, during heating or cooling, the tensile forces produce defects, such as fissures. Creep A deformation produced in crystalline materials as a result of applied stress. Creep is one of the important properties studied to evaluate the mechanical properties of structural and refractory materials. Creep Fracture A macroscopic fracture that begins with a local microscopic creep, which then produces considerable grain boundary stress, resulting in propagation of deformation. Creep fracture normally occurs at high temperatures; the rate of crack growth increases with temperature. Cristobalite A crystalline silica (SiO2) polymorph (with a density of 2.334 g/cm3) produced by heating tridymite to 1470°C. Critical Concentration In the growth of particles from solution, a concentration at which nucleation is extremely rapid. The supersaturation in suspension is normally increased via change in temperature of pH until a critical concentration is reached in which the nucleation rate rises abruptly. The precipitation of particles reduces the supersaturation below the critical concentration. Under these conditions, nucleation is unlikely, and the particle grows until the concentration is reduced to the equilibrium solubility. Critical Cooling Rate The minimum cooling rate needed to quench the melt to produce a glassy material. Critical Flaw The size of a flaw that continues to grow uncontrollably under the applied load and causes fracture. Critical Point During the drying process, the point at which shrinkage stops. The liquid surface tension creates capillary stress in the pores that causes the gel to collapse and shrink; however, the solid network (gel or particle packing) stiffens during shrinkage and eventually can withstand the capillary pressure. Critical Point Gelation See gel point. Critical Pressure and Temperature The pressure and temperature at which the liquid converts into the vapor phase without undergoing density change. At and above the critical temperature and pressure of the liquid, the surface tension of the liquid is zero. In the case of drying gellike materials, pressure and temperature are increased in such a way that the phase boundary is not crossed. See also supercritical drying. Critical Radius The minimum radius of a seed particle in a suspension or a melt required to begin the crystallization process. See also nucleation and growth. Crosslinks Links that join chains to form a three-dimensional network when a polyfunctional unit with two or more reactive groups (with a functionality of two or more) is present. For example, Si(OH)4 has a functionality of four and can lead to complex branching of the polymer via crosslinking. Crown Ethers See macrocyclic polyethers. Crystal Chemistry Chemistry that includes the description and classification of crystal structures, basis of crystallizing a particular phase, and relationships between the crystalline phase and their chemical and physical properties. Crystallography differs from crystal chemistry in that it involves approaches to solve crystal structures. Crystal Defects Defects that originate from imperfect placement of atoms or ions in various lattice positions. Since perfect placement of atoms is only possible at absolute zero temperature, many defects are produced in crystals at practical temperatures. Examples of low-defect ( 102 ohm1cm1). Examples of FIC materials include Y-doped ZrO2 and Na+-doped G-alumina. Unlike ionic conductors whose defect concentrations, and hence charge carrier concentrations, are strongly temperature dependent, FIC materials often have temperature independent carrier concentrations owing to large numbers of structurally inherent defect sites such as vacancies. See also ionic conduction. Fatigue Fractures In ceramics, fractures resulting from repeated cyclic stresses caused by nucleation or extensions of cracks within an intensely cold-worked area at the specimen surface. However, static fatigue is caused by preferential stress corrosion at the tip of a crack under a static applied stress. See also fracture. Faujasite A sodium calcium aluminosilicate zeolite with a cavity framework and the chemical formula [NaCa0.5(Al2SiO5O14)] · 10H2O. Fayalite An iron silicate with the formula Fe2SiO4 and a melting point of approximately 1200°C. F-Center See color centers. Feldspar An aluminosilicate mineral with a framework structure that can be chemically classified as a member of the ternary system, NaAlSi3O8KAlSi3O8CaAl2Si2O8. See also orthoclase. Fermi Energy For a metal at absolute zero, the Fermi energy corresponds to the highest filled electronic state in the valence band. For an intrinsic semiconductor at 0K, it falls midway between the valence and conduction bands. The Fermi energy’s temperature dependence controls the statistical distribution of electrons and holes in a semiconductor. Ferrielectric Materials Materials that are antiferroelectric in one direction, but in another direction the electric dipoles are not completely canceled and there is a net dipole moment in the absence of an electric field. Lithium ammonium tartate monohydrate and Bi4Ti3O12 are examples of ferrielectric materials. Ferrimagnetic Materials Materials that possess a residual magnetic moment in the absence of a magnetic field. This results from unequal moments of two sublattices close to each other in a material in which the antiferromagnetically arranged spins do not completely cancel out. Ferrites Mixed metal oxides containing Fe2O3 and other metal oxides. Most ferrites are magnetic in nature. Many ferrites can be described by the general formula M II Fe 2IIIO 4 , with spinel or inverse spinel structures. Barium ferrite, BaFe12O19, with the magnetoplumbite structure is an example of a magnetic ferrite. Ferrocene A dicyclopentadienyliron, [Fe(M5C5H5)2], with a sandwich-type structure. This organometallic compound forms orange crystals that melt at 174°C and are thermally stable up to 500°C.
Fe
Ferrocene
Ferroelastic Materials Ferroelastics are strain analogues of ferroelectric materials in which strain spontaneously develops into different orientation domains. Some ferroelectrics (e.g., BaTiO3) can be simultaneously ferroelastic and ferroelectric. Ferroelectric Materials Crystalline materials that possess a permanent spontaneous electric polarization (electric dipole moment per cubic centimeter) that can be reversed by an external electric field. Owing to the distortion of a perfect cubic structure, ferroelectric materials exhibit an electric dipole moment, and the applied electric field causes polarization of the material. © 2005 by CRC Press
After the removal of the electric field, the materials still possess remanent polarization. This type of behavior is referred to as ferroelectric hysteresis. Ferroelectric materials normally have large permittivities. For example, barium titanate (BaTiO3), lead titanate (PbTiO3), and lead zirconate titanate Pb(Zr,Ti)O3 are ferroelectric in nature. Ferroic Materials The broad class of materials that order into domains of different orientations of either spontaneous strain, polarization, magnetization, or combinations thereof, hence ferroelastics, ferroelectrics, and ferromagnetics. Ferromagnetic Materials Materials that possess magnetic moment owing to complete ordering of magnetic spins in the absence of a magnetic field. In some ferromagnetic materials, individual ions are strongly coupled and aligned parallel, resulting in a net magnetic moment. The typical magnetic susceptibility, H, of ferromagnetic materials ranges from 10–2 to 10–6 and decreases with increasing temperature. Ferromagnetic property is exhibited by certain metals, alloys, transition metal compounds, and rare earth and actinide elements. Fiber Drawing In a sol-gel solution, as polymerization proceeds, the solution viscosity increases, and in a certain range of viscosities, fibers can be drawn directly from the viscous liquid system. Similarly, fibers can be drawn from a glass melt at a given viscosity and temperature. The fibers thus produced can be further processed into short fibers, mats, etc. and are commonly used as filtration media, insulation, reinforcements in refractory and structural materials and as fiberoptic devices. Fiber-Optic Devices Devices that use an optical waveguiding mode for transmitting information, for illumination, and other purposes. A glass rod can transmit light around corners as a result of total internal reflection. If an image is incident on one end of the rod, it is seen at the other end as an area of approximately uniform intensity (an average of incident light). If the rod is replaced by a bundle of fibers, each fiber transmits (with a resolution equal to the individual fiber diameters) only a part of the image incident on it. Hence, a bundle of fiber can transmit a full image. A simple fiber-optic communication system has a modulated light source, which feeds into a fiber, which delivers into a receiver that decodes the optical signal and converts it to electronic form for use by equipment at the receiving end. Fiber-optic technology has widespread applications in the communications area (telephones, cable, and computer links) because of the high rate of data transmission. Fick’s Law An empirical law used to study an atom’s mobility in a condensed phase during microstructural changes and chemical reactions that states that diffusive flux, JD (mol/cm2 · s), is proportional to the concentration gradient, Ic/Ix: JD = DcIc / Ix
where Dc is the chemical diffusion coefficient (cm2/s), c is the concentration in mol/cm3, and x is the direction of diffusion. Film A thin layer form of a material. Thin and thick films can be coated on a variety of substrates by numerous processes including sol-gel, chemical vapor deposition (CVD), sputtering, ionimplantation, laser ablation, electrophoresis, and electroplating. These films are used for optical (colored, antireflective, optical memory), electronic (ferroelectric, conductive, superconductors), protective (corrosion and scratch resistant, passive), and foam-type (membranes) applications. During the sintering process in cermics, films can also form at the grain boundaries and interfaces. Filtration Medium Inert materials with controlled porosity and pore sizes. Polymers and glass fibers are the most frequently used materials for filtration purposes. However, porous ceramic materials can also be prepared in membrane form by conventional ceramic processes (fibers and foams) and by the sol-gel process (membranes with fine porosity). These separation media are © 2005 by CRC Press
usually composed of metal oxides such as titania, alumina, and silica. Ceramic membranes are normally used for higher temperature applications. Fischer (Karl) Reagent See KarlFischer reagent. Fish Scaling The poor coating condition on metal, ceramics, or glass relating to breakout or peeling actions of films upon cooling the surface. Fixed Bed Reactor A common catalytic reactor that consists of tube and parallel arrays of tubes filled with solid catalyst particles. The fixed bed reactors are used for a variety of oxidation reactions and synthesis of new compounds. One of the drawbacks associated with the fixed bed reactor is that the fixed solid phase in the reactor exhibits variable temperatures at different locations because of limited mixing of reactants resulting in lower yield reactions. See also fluid bed reactor. Flame Hydrolysis A commercially used process of producing fine oxide powders by oxidizing metal halides in the flame. Although metal halides react vigorously with water, oxidation occurs faster than hydrolysis at flame temperatures. For example, titania is prepared from TiCl4 in H2/O2 or CH4/O2 flames and can be represented by the following equation: TiCl4 + O2 q TiO2 + 2Cl2
This method has also been used for fabricating high-purity glass preforms used in producing optical fibers for telecommunications. Flame Oxidation See flame hydrolysis. Flame Photometry An elemental analysis technique that measures the emission spectra produced when solutions containing metals are introduced into a flame. This technique is particularly useful for analyzing alkali and alkaline earth metals. However, the sensitivity of the technique for transition metals is low. The spectra obtained from this method are much less complicated than those generated by emission spectrography. Flocculation The process of aggregating finely dispersed particles into larger units called flocs or coagula. In suspension, flocculation is achieved by collapsing the repulsive double layers of particles by using flocculent additives such as electrolytes or surfactants. For example, a suspension of quartz particles at pH 4 can be flocculated by a variety of high-molecular-weight cationic binders. See also deflocculation. Flory–Stockmayer Theory The theory that predicts the gel point and the molecular size distributions of polymers constructed from monomers, each of which may be connected to f other monomers, where f is the functionality of the monomer or oligomer. This theory assumes that no cyclic species are formed and that the polymerization process proceeds in a statistically random fashion.5 Fluid Bed Reactor A reactor in which the fluid passes through a bed of fine solid particles and the velocity of the fluid and the gas bubbles in the fluid agitate the bed continuously like a boiling liquid. Unlike the fixed bed reactor, because of the continuous mixing in this reactor, the heat is uniformly distributed throughout the reactor. Fluid bed reactors are used for a variety of organic and inorganic reactions. If the mobile phase in the reactor is replaced by gas, it can be used as a dryer in addition to a reactor. In the two modes, where the mobile phase is liquid or gas, the reactions occur between solid and liquid or solid and gas phases. This technique has been used for converting metals into metal oxides, sulfides, and nitrides by heating the fine metal particles to high temperatures under the appropriate gaseous environment. Fluoroapatite See apatite. Fluorescent Materials The photoluminescence materials that emit light owing to the decay of electrons from an excited state (as a result of absorbing photons or light, often ultraviolet) to the ground state over a short period of time. (The elapsed time between excitation and emission processes is on the order of BrF3 > IF7 > ClF > BrF3 > IF5. Other hard oxidizing fluorinating agents include AgF2, CoF3, MnF3, PbF4, CeF4, BiF5, and UF6. Moderate fluorinating agents include HgF2, SbF5, SbF3/SbCl5, AsF3, CaF2, and KSO2F. Mild fluorinating agents are the monofluorides of H, Li, K, Na, Rb, Cs, Ag, and Tl and compounds such as SF4, SeF4, CoF2, SiF4, and NaSiF6. Fluorite Crystal Structure The crystal structure of CaF2 is a generic fluorite structure assigned to many crystals. The face-centered cubic structure is similar to CsCl structure; however, only half of the cation sites are filled, and it consists of a void in the center of the unit cell. See also CsCl structure. Fluorspar Calcium fluoride, CaF2, that emits light when it is heated. See also fluorescent materials. Flux Growth of Crystals Method of growing crystals that involves adding noncrystallizing components (fluxing agents) to reduce the melting temperature of the source (solid reactants). Addition of salt (NaCl) to ice, for example, lowers the melting point of ice below 0°C, resulting in a low temperature eutactic at 21°C. Foams Materials with high porosity in which the pores can be closed or open. Several polymeric materials (polystyrene, polyurethane, phenols, etc.) can be prepared as foams. Inorganic and organic aerogels are sometimes referred to as foams. Formamide A protic solvent with the formula HCHONH, used in many sol-gel reactions as a drying control chemical additive (DCCA). Forsterite A magnesia-silica mineral with the formula 2MgO, SiO2, or Mg2SiO4. This mineral is frequently used as a dielectric material. Fractal A fractal object is self-similar in that subsections of the object are similar in some sense to the whole object and the subsection contains no less detail than the whole. Fractal growth theory has been applied to study the growth processes in the sol-gel and other colloidal processes used for fabricating solid state materials.6 Fracture A process of crack growth. Most ceramics and glasses fail in a brittle manner in which fracture occurs with little or no plastic deformation. Most glasses below the softening temperature are brittle, and the appearance of the fracture surface is called conchoidal. However, in crystalline ceramic materials, brittle fracture generally occurs by cleavage over particular crystallographic planes. At high temperatures when the grain boundaries in crystalline materials shear, they might fail intergranularly. In ductile ceramics, when a section is continuously thinned, cup- or conetype fractures result. Free Energy Free energy is the measure of a system’s ability to do useful work. The Gibb’s free energy, G, combines the enthalpy, H, and entropy, S, of a system into one thermodynamic function: )G = )H T)S, where T is temperature. The sign of )G describes whether a system is in equilibrium ()G = 0) or whether a physical or chemical change is spontaneous or favorable ()G < 0) or nonspontaneous and unfavorable ()G > 0). Freeze-Drying The process of removing liquid from a system by freezing the liquid followed by subliming the frozen liquid. By removing the liquid through this approach, the solid–liquid interface is avoided and a solid state material with high porosity, fine pores, and intricate structure is formed under vacuum. Freeze-drying is a commonly used process in the food industry and has also been used in preparing fine ceramic powders. Frenkel Defect A stoichiometric defect (structural imperfection) in a crystal in which the atoms or ions move from normal sites to interstitial sites such that the number of vacant sites is equal to the interstitial atoms. For example, AgCl commonly has a Frenkel defect that causes Ag+ ions to move to interstitial sites surrounded by four Cl– ions and four Ag+ ions. © 2005 by CRC Press
Fuel Cell Solid state electrochemical cells that convert chemical energy (i.e., fuels) directly into electrical energy and no energy is expended to produce heat before producing power. In a fuel cell, the electrochemical reaction between two chemicals, a fuel and an oxidant, produces a flow of current when power is demanded by an external load. By eliminating moving parts and the heat stage, fuel cells can be a more efficient energy system than other systems. For example, a hydrogen–oxygen fuel cell produces electricity and water when hydrogen gas and oxygen gas react electrochemically in the cell containing two porous electrodes and an electrolyte.7 Fuller’s Earth Any natural clay-type material that decolorizes minerals. Fuller’s earth is normally composed of clay materials such as montmorillonite and kaolinite. See also kaolin. Fullerene A closed, convex caged carbon molecule containing both hexagonal and pentagonal faces. The most common carbon fullerene is spherical C60 and is called a buckminsterfullerene or buckyball. Spherical carbon structures can theoretically form at even numbers of carbon above 32 and include the common C60 and C70 forms (see Table 2.2). Carbon nanotubes, a fourth allotrope of carbon, are essentially giant linear fullerenes whose ends are closed with hemispherical caps or half a bucky ball. Proposed uses of fullerenes include medical drug delivery and electronic, catalytic and optical applications. See also buckminster fullerene, carbon nanotubes. Table 2.2 Dimensionality of Carbon Allotropes Carbon Allotrope
Crystalline Dimensionality
Diamond
Three
Graphite
Two
Nanotube (fullerene) Buckyball (fullerene)
One Zero
Comments fcc structure with four of eight tetrahedral sites also filled; an insulator with high thermal conductivity Hexagonal array of sheets; bonds within the planes are strong directional covalent bonds. Coupling between the sheets is due to weaker van der Waal’s forces. Covalent bonding of carbon in hexagonal arrays, but sheets are wrapped into a tubular form Covalently bonded carbon in hexagonal and pentagonal coordination with the sheet wrapped around a point
Fumed Silica See aerosil or cab-o-sil. Functionality The number of bonds that a monomer can form. Functionality is normally represented as f. For example, Si(OCH3)4 has four reactive groups; hence, the functionality is 4. Funicular State During drying, the pore liquid state in which the liquid is continuous along the pore walls but does not fill the pore space; i.e., the liquid and vapor phase are continuous. See also pendular state. Fused Silica Amorphous silicon dioxide (SiO2) formed from a melt by the quenching process.
G Galena Lead sulfide mineral with the formula PbS. Galena is also called lead glance. Galvanic Cell A two- or three-electrode cell in which the oxidation–reduction reactions occur spontaneously, thus generating an electrical current. Batteries and fuel cells are examples of galvanic cells. See also electrolytic cell. Garnets A large family of complex oxides with the general formula A3B2X3O12, where A is the large ion with a radius of ~1 Å and a coordination number of 8 in a distorted cubic environment and B and X are smaller ions that occupy octahedral and tetrahedral sites, respectively. Many garnets are important ferrimagnetic materials. Some examples of garnets include Ca3Al2Si3O12, Ca3Fe2Si3O12, Y3Fe5O12, and Mg3Al2Si3O12. Garnierite A nickel ore in the form of a silicate, with the formula (Ni,Mg)6Si4O10(OH)8. © 2005 by CRC Press
Gas Chromatography (GC) A chromatographic technique that identifies and separates various volatile components in a sample using a porous solid phase column as an adsorbent and a mobile gas phase to carry the components through the column. The results are plotted with the detector response as a function of time. The two most common detection techniques are FID (flame ionization detection) and TCD (thermal conductivity detection). The FID and TCD detectors involve measurement of change in the thermal conductivity of hydrogen flame by the organic vapors and direct thermal conductivity measurement of the eluted components, respectively. GC can be used for both qualitative and quantitative analysis of samples. Lower-molecular-weight compounds with compact structures and lower boiling points normally elute first, depending upon the affinity of the packing used in the chromatographic column. For example, in a nonpolar capillary column, methanol elutes before methoxyethanol. The quantitative analysis is based on the area under the peak and comparison with standards.8 Gehlenite A lime-rich aluminosilicate phase with the formula Ca2Al2SiO7. Gel A solid-state network with liquid trapped in the pores. As monomer polymerization proceeds, the viscosity of the solution increases, and after a point the liquid stops flowing, forming a gel. There are various ways to prepare inorganic gels; the two most common methods are the solgel process and the hydrothermal process. Most gels can be classified as particulate- (colloidal) or polymeric-type gels. Although the gel formation process can be reversible in a particulate system, it can be irreversible, as in the case of polymeric systems. Several oxide gels, such as silica, titania, and alumina, have a large organic component in the solid-state network with an aqueous or nonaqueous solvent filled in the pores. Gel Permeation Chromatography (GPC) See size exclusion chromatography (SEC). Gel Point The degree of reaction at which the viscosity of the sol, owing to polymerization or connectivity, increases drastically such that the liquid stops flowing. For example, in the sol-gel process, during sol-to-gel transition the liquid stops flowing and it forms a gel at the gel point. Getter A material used to remove a trace gas molecule, often oxygen, from a high temperature furnace or vacuum chamber. For example, materials such as carbon and zirconium are often used as oxygen getters to remove trace oxygen from high temperature processes. Certain high pressure, high temperature lamps also use getters to remove trace corrosive gases that form during operation from inside the lightbulb. Giant Magnetoresistance (GMR) The change in the electrical resistance of a material in response to an applied magnetic field. GMR devices are often made from multilayers of alternating ferromagnetic and conducting layers, 4 to 6 nm and 3 to 5 nm thick, respectively (e.g., NiFe or Au-Co alloys with a metallic conductor such as Cu), with the magnetic moments antiferromagnetically ordered, which leads to a high resistance state as the electron spins are anti-parallel to the magnetic dipoles. When a magnetic field is applied, the magnetic dipoles align with the field and the electron spins are also aligned parallel to these magnetic dipoles, leading to less scatter and a corresponding sharp drop in the resistance. Applications of GMR include magnetic field sensors and read-write heads for computer disks. See also anisotropic magnetoresistance, magnetoresistance, colossal magnetoresistance. Gibbsite An aluminum hydroxide with the formula Al(OH)3. The structure consists of a cubic close-packed (ccp) arrangement of (OH) ions within layers of edge-shared Al(OH)6 octahedra that are vertically stacked via H bonds. Glass An amorphous solid with a short-range order (local elemental environment) and without a long-range order or periodicity in the arrangement of the atoms. Glasses can be formed by supercooling the liquid melt or raw materials (powders) at a rapid rate to avoid crystallization or they can be prepared by polymerizing the monomeric precursors at room temperature via the sol-gel process. These glasses can be colored by adding the appropriate transition metals in the precursor solution or melt. The glasses can be made photosensitive and photochromic by adding optical sensitizers (e.g., cerium ions) or organic or inorganic compounds (e.g., Zn, Cd, Hg, Cu, Ag), respectively. Photosensitive glasses change color when they are exposed to light (ultra© 2005 by CRC Press
violet or x-ray) by reducing metal ion in the glass. Photochromic glasses change color when they are exposed to light but return to their original color when light is removed (e.g., sunglasses that automatically adjust to different light intensities). Glass-Ceramic Materials Crystalline materials with long-range order that are produced by the controlled crystallization (using nucleating agents) of appropriate glass compositions. These materials consist of 95 to 98% small crystals by volume and very small amounts of amorphous glass; as a result, they are much stronger than glass and can withstand pressures of as much as 30,000 psi in comparison to only 10,000 psi for glass compositions. For example, Li2OAl2O3 SiO2 is a glass ceramic with higher mechanical strength than SiO2 glass. Glycerate Metal salts derived from glyceric acid (HOOCCH(OH)COOH) that contains two carboxylic acid groups and one alcohol group. O C OH H C OH C O O Glycerate
Goethite An iron hydroxide with the formula F-FeOOH. Gouy Layer The outer diffused layer of opposite charge beyond the tightly bound layer surrounding the positively or negatively charged suspended particles in a dispersion or in a colloid. Also referred to as diffused double layer. Graded Refractive Index (GRIN) Glass Glasses composed of layers with increasing refractive indexes toward the center to minimize reflection at the surface. These glasses are also referred to as antireflective glasses. In these materials, the refractive index toward the surface of the glass is close to air, and the refractive index toward the center is close to that of dense glass. Grain Boundaries The interface or the plane of contact between two crystals of the same material resulting from the sintering process in which the fine particles neck and coalesce to form microscopic crystals. Grain Growth The process by which the grain size of a strain-free material increases continuously as a result of the attachment of smaller grains to larger grains or, in some cases, attachment of two or more larger grains. The grain growth is normally driven by the difference in the energy between large- and small-grain-size products. Materials produced from small-grain–large-grain attachment are denser compared with materials produced from attachment of large grains, which are porous. Graphite An intercalate solid with a layer structure composed of carbon only. Owing to the layer structure, graphite can be used as a solid lubricant or as an intercalating host for species such as alkali cations, halide anions, ammonia, and oxysalts. Green Density The density (mass/total volume) of the compacted ceramic powder before sintering. Grignard Reagents Organomagnesium halides with the general formula RMgX, where R is an organic group and X is a halide ion. Grignard reagents have been used in synthesizing numerous alcohols, acids, hydrocarbons, amides, and other exotic compounds. Group 0 to VIII Elements Group 0 Elements Elements in a group of the periodic table, consisting of inert gas elements with the outer shell electron configuration of ns2np6. Examples of Group 0 elements include He, Ar, Xe, and Kr. These elements are also referred to as Group VIIIA elements. © 2005 by CRC Press
Group 1A Elements Elements in a group of the periodic table consisting of extremely reactive alkali metals from lithium (Li) to francium (Fr) with the outer shell electron configuration of ns1. See also alkali metals. Group IB Elements Elements in a group of the periodic table consisting of transition metals including copper, silver, and gold with the outer shell electron configuration of nd10(n + 1)s1. These elements are also called coinage metals because they were used for currency. Group IIA Elements Elements in a group of the periodic table consisting of alkaline earth metals from beryllium (Be) to radium (Ra), with the outer shell electron configuration of ns2. See also alkaline earth metals. Group IIB Elements Elements in a group of the periodic table consisting of transition metals, including zinc, cadmium, and mercury, with the outer shell electron configuration of nd10(n + 1)s2. Group IIIA Elements Column of elements in the periodic table including boron (B) to thallium (Tl), with the outer shell electron configuration of ns2np1. Group IIIB Elements Elements in a group of the periodic table consisting of transition metals, including Sc, Y, La, and Ac, with the outer shell electron configuration of nd1(n + 1)s2. Group IVA Elements Column of elements in the periodic table including C to Pb, with the outer shell electron configuration of ns2np2. Group IVB Elements Elements in a group of the periodic table consisting of transition elements, including Ti, Zr, and Hf, with the outer shell electron configuration of nd2(n + 1)s2. Group VA Elements Column of elements in the periodic table beginning with nitrogen and ending with bismuth, with the outer shell electron configuration of ns2np3. Group VB Elements Elements in a group of the periodic table consisting of transition metals, including V, Nb, and Ta, with the outer shell electron configuration of nd3(n + 1)s2, except for Nb (4d45s1). Group VIA Elements Column of elements in the periodic table beginning with oxygen and ending with polonium, with the outer shell electron configuration of ns2np4. Group VIB Elements Transition metals including Cr, Mo, and W of the periodic table, with the outer shell electron configuration of nd5(n + 1)s1, except for W (5d46s2). Group VIIA Elements Elements in a group of the periodic table consisting of halogens, including F, Cl, Br, I, and At, with the outer shell electron configuration of ns2np5. Group VIIB Elements Elements in a group of the periodic table consisting of transition metals, including Mn, Tc, and Re, with the outer shell electron configuration of nd5(n + 1)s2, except for Tc (4d65s1). Group VIII Elements Elements in a group of the periodic table consisting of transition metals, including Fe, Ru, Os; Co, Rh, Ir; Ni, Pb, and Pt, with the outer shell electron configurations of nd6(n + 1)s2; nd7(n + 1)s2; and nd8(n + 1)s2, respectively, except for Ru(4d75s1), Rh(4d85s2), Pd(4d10), and Pt (5d96s7). Gypsum Calcium sulfate (CaSO4 · 2H2O) mineral used by ancient Egyptians to produce concrete.
H Haematite An iron oxide with the formula Fe2O3. Halates Two-element anions with the formula XO3 , where X is a halogen. Some examples of halates include ClO3 and IO3 . In addition, the formula for halites is XO 2 and the formula for hypohalates is OX–. Half-Cell Reactions The separate oxidation and reduction reactions that take place at the two electrodes (anode and cathode) in an electrochemical cell. One can measure the electrode potential of individual half cells with reference to the standard hydrogen electrode, thus allowing © 2005 by CRC Press
the potential difference between any two half cells to be readily calculated. See also, anode, cathode, electrode potential. Halide Ion Conductors Halides with a fluorite (CaF2) structure that can be classified as solid electrolytes at high temperatures owing to their high anion (halide) conductivity. For example, PbF2 has low conductivity at room temperature; however, above 500°C, its ionic conductivity sharply increases to ~5 250 21
—
l/none
—
142.88
105.6
4.5
—
l/none
1.985
294.68
—
115
—
s/—
266.62
—
174
—
205.64
84/21
83
Decomposes at >190
—
Soluble in toluene, chloroform — )Hform = 15.2kcal/mole
1, p. 79 1, p. 79 1, p. 79
II. Diorganocadmium Compounds Bis(pentafluorophenyl)cadmium (C6F5)2Cd Diallylcadmium Cd(CH2CH = CH2)2 Di-n-butylcadmium Cd(n-C4H9)2 Dicyclopentadienylcadmium Cd(C5H5)2 Diethylcadmium Cd(C2H5)2 Dimethylcadmium Cd(CH3)2 Di-2-methylphenylcadmium Cd(C6H4CH3)2 Diphenylcadmium Cd(C6H5)2 Di-n-propylcadmium Cd(n-C3H7)2
Monomeric, light sensitive; explodes at >180°C —
2, p. 853
2, p. 853
—
Monomeric, light sensitive, explodes at >180°C Pyrophoric, monomeric, vapor phase: 28/20°C; light sensitive; explodes at >180°C —
2, p. 853
s/—
—
—
2, p. 853
—
l/none
—
Monomeric, light sensitive, explodes at >180°C
2, p. 853
—
—/—
—
Degree of association: (2)
2, p. 857
2, p. 853
2, p. 853
III. Organocadmium Alkoxides/Aryloxides and Thioalkoxides Methyl-t-butoxycadmium (CH3)Cd(O-tC4H9)
200.56
—
© 2005 by CRC Press
Methylethoxycadmium (CH3)Cd(OC2H5) Methylmethoxycadmium (CH3)Cd(OCH3) Methylisopropoxycadmium (CH3)Cd(O–iC3H7) Methylthio-t-butoxylcadmium (CH3)Cd(S-tC4H9) Methylthiophenyloxy cadmium (CH3)Cd(SC6H5) Methylthioisopropoxyl cadmium (CH3)Cd(S-iC3H7)
172.51
—
158.48
—
186.53
—
316.34
—
400.22
—
269.37
Decomposes at >90 Decomposes at >70 —
—
—/—
—
Degree of association: (4)
—
—/—
—
—
—/—
—
Degree of association: (4)
2, p. 857
—
2, p. 857 2, p. 857
—
—/—
—
Degree of association: (4)
2, p. 857
—
—/—
—
Degree of association: (4)
2, p. 857
—
Decomposes at >100 Decomposes at >35 —
—
—/—
—
Degree of association: (5)
2, p. 857
230.49
—
254–256
—
s/—
2.01
Soluble in water
1, p. 79
202.45
—
—
—
s/—
—
Soluble in water
1, p. 79
Soluble in hot ethanol
1, p. 80
IV. Cadmium Salts Cadmium acetate (CH3COO)2Cd Cadmium formate (HCOO)2Cd
Calcium Compounds I. Calcium Alkoxides and Ketonates Calcium ethoxide Ca(OC2H5)2 Calcium 6,6,7,7,8,8,8—heptafluoro—2,2—Dim ethyl—3,5—octanedionate Ca(OC(CF3CF2CF2)CHC(C(CH3)3)O)2 Calcium hexafluoropentanedionate Ca(OC(CF3)CH(CF3)CO)2 Calcium methoxide Ca(OCH3)2 Calcium methoxyethoxide Ca(OC2H4OCH3)2 Calcium 2,4-pentanedionate Ca(OC(CH3)CH(CH3)CO)2.2H2O Calcium 2,2,6,6-tetramethyl-3,5heptanedionate Ca(OC(C(CH3)3)CH(C(CH3)3)CO)2
130.2
—
—
—
—/—
—
630.43
205/0.1
90–95
—
s/—
—
—
1, p. 81
454.18
180/0.07
135–140
—
s/—
—
—
1, p. 81
102.15
—
—
s/—
—
—
1, p. 81
190.25
—
Decomposes at >170 —
—
l/—
—
238.30/ 274.33 406.63
—
Decomposes at 175 221–224
—
s/white
—
d = 1.0 g/cc; 20% in methoxyethanol Dihydrate, 95%
—
s/—
—
Soluble in ethanol, toluene
—
1, p. 81 1, p. 81; 3, p. 75 1, p. 81
© 2005 by CRC Press
Compound
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
98.20
—
—
—
—/—
—
70.15
—
—
—
—/—
—
194.29
—
—
—
—/—
—
—
—/—
—
—
2, p. 231
—
2, p. 231; 8, p. 454
Formula Weight
State/Color
Densitya (g/cc)
Miscellaneous
Reference
II. Dialkyl and Diaryl Calcium Compounds Diethylcalcium Ca(C2H5)2 Dimethylcalcium Ca(CH3)2 Diphenylcalcium Ca(C6H5)2
Unstable in solution at room temperature Reacts with pyridine; unstable in solution at room temperature Stable in solution at room temperature; soluble in tetrahydrofuran and ether; decomposes at >80°C
2, p. 230 2, p. 230 2, p. 231; 8, p. 454
III. Dialkenyl, Dialkynyl and Di-F-arylalkyl Calcium Compounds Diacetylcalcium Ca(C CH)2 Bis(phenylacetylyl)calcium Ca(C } CC6H5)2 Dipropenylcalcium Ca(CH = CHCH3)2 Divinyl calcium Ca(CH = CH2)2
90.14
—
—
242.34
—
—
123.23
—
—
—
s/clear
—
94.17
—
—
—
—/—
—
Decomposes at 320°C, white microcrystal powder; insoluble in C6H6; soluble in tetrahydrofuran and liquid NH3 Soluble in tetrahydrofuran, pyrophoric, powder form Soluble in tetrahydrofuran
170.27
—
—
265
s/colorless to faintly yellow
—
Glows in air
2, p. 233; 8, p. 453
158.17
160
—
—
—/—
1.5
Soluble in water and methanol
1, p. 80
182.18
—
—
—
—/—
1.442
326.48
—
—
—
—/—
—
Decomposition s/white at ~320
2, p. 231; 8, p. 453 8, p. 453
IV. Dicyclopentadienyl Calcium Compounds Dicyclopentadienylcalcium Ca(C5H5)2
V. Calcium Salts Calcium acetate Ca(CH3COO)2 Calcium acrylate Ca(CH2CHCOO)2 Calcium 2—ethylhexanoate Ca(C4H9CH(C2H5)COO)2
—
1, p. 80
Soluble in xylene
1, p. 80
© 2005 by CRC Press
Calcium formate Ca(HCOO)2 Calcium D—gluconate Ca(CH2OH(CHOH)4COO)2 Calcium lactate Ca(CH3CH(OH)COO)2 Calcium methacrylate Ca(CH2C(CH3)COO)2
130.12
—
—
—
—/—
2.02
—
430.38
—
—
—
—/—
—
218.22
—
—
—
s/white
—
—
1, p. 81
210.24
>160
—
—
—/—
—
—
1, p. 81
Soluble in water
1, p. 80 1, p. 80
Cerium Compounds I. Cerium Alkoxides and Ketonates Cerium ter-butoxide Ce(OC(CH3)3)4 Cerium IV ethylthioethoxide Ce(OC2H4SC2H5)4 Cerium ethoxide Ce(OC2H5)4 Cerium III 6,6,7,7,8,8,8—heptafluoro— 2,2—dimethyl—3,5—octanedionate (—OC(C3F7)CHC(C(CH3)3)O—)3Ce Cerium tert-heptaoxide Ce(OC(CH3)(C2H5C3H7n))4 Cerium tert-heptaoxide Ce(OC(C2H5)3)4 Cerium tert-hexoxide Ce(OCCH3(C2H5)2)4 Cerium methoxide Ce(OCH3)4 Cerium IV methoxyethoxide Ce(OC2H4OCH3)4 Cerium octyloxide Ce(OC8H17)4 Cerium III 2,4-pentanedionate Ce(OC(CH3)CH(CH3)CO)3 Cerium tert-pentoxide Ce(OC(CH3)2C2H5)4 Cerium IV isopropoxide solution Ce(O–iC3H7)4.C3H7OH
432.58
140–150/0.1
—
—
l/—
—
560.82
—
—
—
—/—
—
—
1, p. 161
320.36
>200 (in vacuo)
—
l/—
—
—
—
4, p. 73
1025.64
—
142
—
s/—
—
—
1, p. 160
600.90
150/0.05
—
—
l/—
—
Molecular complexity: 1.0
4, p. 70
600.90
154/0.05
—
—
l/—
—
Molecular complexity: 1.1
4, p. 70
544.79
140/0.06
—
—
l/—
—
264.26
>2000 (in vacuo)
>280
—
s/yellolw
—
440.46
—
—
—
—/—
657.01
—
—
—
l/orange-red
—
437.45
—
131–132
—
—
488.69
240/0.1
—
—
s/light yellow l/—
—
Molecular complexity: 2.4
4, p. 70
376.47/ 436.57
—
>200 (decomposes)
—
s/yellow
—
Soluble in pyridine
1, p. 161
1.02
Molecular complexity: 2.5
— Hydrolyzed in air; insoluble in methanol — Decomposes at 240–260°C —
4, p. 70
4, p. 70 4, p. 73; eight, Vol. 3, p. 53 1, p. 161 8, Vol. 3, p. 53 1, p. 161
© 2005 by CRC Press
Compound Cerium isopropoxide Ce(OCH(CH3)2)4 Cerium n-propoxide Ce(O-nC3H7)4 Cerium IV 2,2,6,6—tetramethyl— heptanedionate Ce(OC(C(CH3) 3)CHC(C(CH3) 3)O)4 Cerium IV thenoyltrifluoroacetonate Ce(OC(SC4H3)CH(CF3)CO)4
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
376.47
160–170/0.5
—
—
l/—
—
376.47
—
—
l/—
—
—
4, p. 73
873.2
>200 (in vacuo) —
250(d)
140/0.05
s/red
—
—
1, p. 161
1024.84
—
—
—
—
—
Soluble in toluene, methanol
1, p. 161
Extremely moisture sensitive
2, p. 193; 8, p. 466
State/Color
Densitya (g/cc)
Miscellaneous Molecular complexity: 3.1
Reference 4, p. 70
II. Cycloaryl Cerium Compounds Bis(M8-1,3,5,7-cyclooctatetraene) cerate (1-) or dicyclooctatetraenecerate (1-) Ce(C8H8)2 Cerium III tris(bis(trimethylsilylamide)) Ce(N(Si(CH3)3)2)3 Dicerium, triscyclooctatetraene Ce2(C8H8)3
348.422
—
>345 (C16H16CeK)
—
s/pale green
—
621.28
95–9/104
—
—
l/—
—
529.69
—
—
—
—
Stable to 250°C; highly oxygen sensitive; soluble in tetrahydrofuran
2, p. 189; 8, p. 467
Tetraindenyl cerium Ce(C9H7)4 Triyclopentadienyl cerium Ce(C5H5)3 Tricyclopentadienyl cerium chloride (C5H5)3CeCl
600.74
—
—
—
Microcrystal line powder/ green —/—
—
Stable in aqueous solution
2, p. 189
335.40
—
435
—
Hydrolyzed by water
370.86
—
—
s/orange crystals s/dark brown
317.26
—
308
—
s/—
—
Soluble in water and methanol
1, p. 160
569.74
—
>275
—
s/—
—
Soluble in THF, toluene
1, p. 160
544.29
—
—
—
—/—
—
—
1, p. 161
736.36
—
—
—
—/—
—
—
1, p. 161
200–250 (in vacuo) Decomposes at 176
—
—
1, p.161
2, p. 189; 8, p. 466 Insoluble in aromatic HC; soluble 2, p. 189; in most other organic solvents 8, p. 466
III. Cerium Salts Cerium III acetate Ce(CH3COO)3 Cerium III 2—ethylhexanoate (C4H9CH(C2H5)COO)3Ce Cerium III oxalate Ce(—O2CCO2—)3Ce Cerium IV trifluoromethanesulfonate (CF3SO3)4Ce
© 2005 by CRC Press
Cesium Compounds I. Cesium Alkoxides and Ketonates Cesium methoxide CH3OCs Cesium pentanedionate Cs(-OC(CH3)CHC(CH3)O-)
163.94
—
—
—
—/—
0.85
—
1, p. 82
232.02
—
—
—
—/—
—
Soluble in water
1, p. 82
191.95
—
190–196
—
—/—
—
Soluble in water
1, p. 82
177.92
—
45
—
s/—
—
Soluble in water
1, p. 82
Crystalline solid/ brownblack 1/brownblack Crystalline solid/ red-brown Crystalline solid/black s/none
—
)Hform = 142 kJ/mol
2, pp. 980–988
—
)Hform = 66 kJ/mol
—
)Hform = 302 kJ/mol
2, pp. 980–988 2, pp. 980–988
—
)Hform = –41 kJ/mol
II. Cesium Salts Cesium acetate CH3COOCs Cesium formate HCOOCs
Chromium Compounds I. Chromium Alkoxides and Ketonates Miscellaneous Organochromium Compounds Bis(M6–benzene)chromium (0) Cr(M6–C6H6)2
208.22
—
280–281
—
Bis(M6–hexaethylbenzene) chromium Cr(M6–(C2H5)6C6)2 Bis(M6–napthalene)2 chromium Cr(M6–C10H8)2
544.87
—
—
—
308.34
—
160 (decomposition)
—
Bis(M6–trimethylbenzene) chromium (0) Cr(M6–1,3,5–(CH3)3C6H3)2 Chromium hexacarbonyl Cr(CO)6
244.34
—
114–116
—
220.06
—
130 (with decomposition) 150/2
25/0.1
AlkoxidesChromium III benzoyacetonate (-OC(CH3)CHC(C6H5)O-)3Cr
535.54
—
—
—
—/—
1.77
—
2, pp. 980–988 2, p. 785
1.63 torr vapor phase at 50°C, 58.9 torr vapor phase at 100°C; low solubility in polar and nonpolar solvents; insoluble in H2O — 1, p. 83
© 2005 by CRC Press
Compound Chromium III hexafluoropentanedionatetetrahydrofuran (-OC(CF3)CH(CF3)CO-)3Cr Chromium III isopropoxide 10–12% solution in isopropanol/tetrahydrofuran Cr(O–iC3H7)3 Chromium III 2,4-pentanedionate Cr(OC(CH3)CH(CH3)CO)3 Chromium III 2,2,6,6-tetramethylheptanedionate Cr(OC(C(CH3)3)CH((CH3)3C)CO)3 Chromium III trifluoropentanedionate Cr(-OC(CH3)CH(CF3)CO-)3
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
673.17
—
—
—
—/—
229.26
—
—
—
349.36
340
214
601.82
180/0.1
511.24
Densitya (g/cc)
Miscellaneous
—
—
1, p. 83
-/green
0.80
—
1, p. 83
—
s/violet
1.35
216–219
—
—
150–152
—
Crystalline solid/dark purple s/red-violet
340.17
—
—
—
—/—
603.32
—
—
—
s/blue—
481.62
—
—
—
State/Color
Reference
Soluble in H2O and toluene; )Hform = 353.7 kcal/mol Soluble in hot ethanol
1, p. 84; 3, p. 75 1, p. 84
—
Soluble in toluene, acetone, hot ethanol
1, p. 84
1.79
—
1, p. 82
—
—
1, p. 83
—/—
1.01
—
1, p. 83
0.84
—
II. Chromium Salts Chromium II acetate (CH3COO)2Cr Chromium III acetate hydroxide (CH3COO)2CrOH —/GreenChromium III 2—ethylhexanoate (C4H9CH(C2H5)COO)3Cr
Cobalt Compounds I. Cobalt Alkoxides and Ketonates Cobalt carbonyl methoxide 10% in methanol Co(CH3OH)6[Co(CO4)]2 Cobalt II 2,4-pentanedionate Co(OC(CH3)CH(CH3)CO)2
593.13
—
—
—
l/rose
257.18
—
166–169
—
Cobalt III 2,4-pentanedionate Co(OC(CH3CH(CH3)CO)3
356.24
340
216
—
s/blueviolet, pink with water s/dark green
—
1.43
Stored in CO
27, p. 22
)Hsub = 15kcal/mol; soluble in H2O, toluene
1, p. 84
Soluble in H2O, toluene
1, p. 85; 3, p. 75
© 2005 by CRC Press
II. Dinuclear Cobalt Carbonyls Sublimes with decomposition at 90 —
—
s/blue
—
)Hsub = 1749 kJ/mol
2, p. 7
801.77
Melts with decomposition at 60 —
—
s/blue
—
Decomposes slowly in air
2, p. 9
171.98
47 ± 3
—
Solid-liquid/ white to pale yellow
—
Ebarrier = 28kJ/mol; )Hform = 611 kJ/mol
2, p. 10
341.95
—
26.2 to 33 (starts decomposing as it melts) 51
—
s/orange
—
172.97
48.6–50
0.5–0
—
l/dark red
—
Hform° (g) = 117 kJ/mol; )Hsub = 2, p. 4 653.3 kJ/mol 2, p. 25 Decomposes slowly in air; insoluble in and decomposed by H2O; soluble in most organic solvents
598.55
—
79–81
—
s/orange
—
340.00
—
—
—
l/light amber
—
189.99
110
30
—
l/light amber
—
—
2, p. 63
239.98
—
10–13
—
l/light amber
—
—
2, p. 63
177
—
—
—
—/—
—
—
1, p. 84
s/—
1.882
Dodecacarbonyltetracobalt Co4(CO)12
571.86
Hexadecacarbonylhexacobalt Co6(CO)16 Hydridotetracarbonylcobalt CoH(CO)4 Octacarbonyldicobalt Co2(CO)8 Tricarbonylnitrotosylcobalt (NO)Co(OC)3
III. Fluorocarbon–Cobalt (I) Compounds Diphenylphospinemethylcobalt (I) [Co(CH3)(P(C6H5)3)2] Tetracarbonylheptafluoropropylcobalt (I) Co(C3F7)(CO)4 Tetracarbonylpentafluoroethyl cobalt Co(C2F5)(CO)4 Tetracarbonyltrifluoromethyl cobalt (I) Co(CF3)(CO)4
—
2, p. 68 2, p. 63
Oil
V. Cobalt Salt Cobalt (II) acetate (CH3COO)2Co
Copper Compounds I. Copper Alkoxides and Ketonates Copper II acetate (CH3COO)4Cu2(OH2)2
181.63
—
115
—
Soluble in water, methanol
1, p. 89
© 2005 by CRC Press
Compound Copper II allyoxyethoxytrifluoroacetoacetate Cu(OC(CF3)CHCOOC2H4OCH2 CHCH2) Copper II benzoylacetonate (cupric phenylbutanedionate) Cu(OC(C6H5)CH(CH3)CO)2 Copper II benzoyltrifluoroacetonate Cu(OC(C6H5)CH(CF3)CO)2 Copper II dimethylaminoethoxide Cu(OCH2CH2N(CH3)2)2 Copper 1,3-diphenyl-1,3propanedionate Cu(-OC(C6H5)CHC(C6H5)O-)2 Copper II ethoxide Cu(OC2H5)2 Copper II ethylacetoacetate Cu(-OC(OC2H5)CH(CH3)CO-)2 Copper II 6,6,7,7,8,8,8-heptafluoro-2,2dimethyl-3,5-octanedionate Cu(-OC(OCF2CF2CF3)CH ((CH3)3C)CO-)2 Copper I hexafluoropentante dionate-2butyne complex (OC(CF3)CH(CF3)CO)Cu (CH3CCCH3) Copper I hexafluoropentantedionatecyclooctadiene complex (-OC(CF3)CH(CF3)CO-) Cu-cycloC8H12 Copper I hexafluoropentantedionatevinyltrimethylsilane complexcopper II hexafluoropentanedionate (OC(CF3)CH(CF3)CO)Cu(Si(CH3)3 CHCH2)
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
541.89
—
72–74
—
s/—
385.91
—
195–196
—
s/blue
493.85
—
241–244
—
239.80
—
512.07
—
184–185 (decomposes) 310–320(d)
153.67
—
321.81
State/Color
Densitya (g/cc) 1.882
Miscellaneous
Reference
Soluble in methanol, toluene, THF
1, p. 89
—
Soluble in xylene
1, p. 89
s/—
—
—
1, p. 89
—
s/—
—
—
s/—
—
—
s/blue
—
—
120 (decomposes) 192–193
—
s/blue green
—
653.90
100/0.1
70
—
s/blue purple
—
324.68
40/0.1
68–73
—
s/—
—
378.77
—
82–83
>60/0.1
s/whitegreen
—
385.87
50/50
—
—
l/—
—
1 mm vapor phase at 90°C; precursor for superconductor Soluble in THF, toluene
Decomposes during melting; precursor for superconductor Soluble in ethanol and warm methanol —
—
Decomposes at >150°C; precursor for Cu2O
—
1, p. 89 1, p. 89
1, p. 89 1, p. 90 1, p. 90
1, p. 90
1, p. 90
1, p. 90
© 2005 by CRC Press
Copper II hexafluoropentanedionatedihydrate Cu(-OC(CF3)CH(CF3)CO-)2 Copper II 8—hydroxyquinolinate Cu(-OC9H8N-)2 Copper II methacryloxyethyl acetoacetate (-OC(OC2H4OCOC(CH3)CH2) CHC(CH3)CO-)2Cu Copper II methoxide Cu(OCH3)2 Copper II methoxyethoxyethoxide Cu(OC2H4OC2H4OCH3)2 Copper II 2,4-pentanedionate Cu(-OC(CH3)CH(CH3)CO-)2 Copper II 2,2,6,6-tetramethyl-3,5heptanedionate Cu(-OC(C(CH3)3)CH(C(CH3)3)CO-)2 Copper II trifluoropentanedionate Cu(-OC(CF3)CH(CH3)CO-)2 Copper II 2,2,6-trimethyl-3,5heptanedionate Cu(-OC(C(CH3)3)CH(CH(CH3)2)CO-)2
477.64
—
130
100/0.5
s/blue-green
—
0.003 mm vapor phase at 25°C
1, p. 91
351.85
—
270
—
s/—
1.68
Soluble in warm acetic acid; slightly soluble in chloroform Soluble in methanol
1, p. 91
483.90
—
106–107
—
s/—
—
125.61
—
206
—
s/—
—
—
1, p. 91
301.83
—
—
—
—/—
1.042
—
1, p. 91
261.76
—
238–240; 230
78/0.05
s/pale blue
—
430.09
—
198 (decomposes)
—
s/—
—
369.70
140/0.1
198–199
—
s/purple
—
428.06
—
166–7
—
s/purple
—
Soluble in H2O, toluene, dimethylsulfoxide; decomposes while melting Decomposes while melting; precursor for CuO in MOCVD process )Hsub = 12.1 kcal/mol; soluble in ethanol, toluene Soluble in hexane
102.60
—
—
—
—
—
164.67
—
—
—
130.66
—
—
—
Powder/ orange s/bright yellow s/canary yellow
303.98
—
260
—
s/—
1.75
Soluble in acetone, toluene
1, p. 89
349.96
—
252(d)
—
s/—
—
Slightly soluble in acetone
1, p. 90
1, p. 91
1, p. 92; 3, p. 75 1, p. 92
1, p. 92 27, p. 25
II. Copper Acetylides (Castro Reax) Copper methylacetylide Cu–C } C–CH3 Copper phenyl acetylide Cu–C } C–C6H5 Copper propylacetylide Cu–C } C–C3H7
— —
Soluble in pyridine —
1, p. 691; 8, p. 573 1, p. 691; 8, p. 576 1, p. 691; 8, p. 574
III. Copper Alkyl Thiol Copper II dimethyldithiocarbamate Cu(S2CN(CH3)2)2 IV. Copper Salts Copper II 2—ethylhexanoate C4H9CH(C2H5)COO)2Cu
© 2005 by CRC Press
Compound Copper II formate (HCOO)2Cu Copper II methacrylate (CH2C(CH3)COO)2Cu Copper II trifluoroacetate (CF3COO)2Cu Copper II trifluoromethanesulfonate (CF3SO3)2Cu
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
153.58
—
130(d)
—
s/—
1.81
Soluble in water
1, p. 90
233.71
—
208
—
s/—
1.81
Soluble in acetone
1, p. 91
289.57
—
—
—
—/—
—
—
1, p. 92
361.68
—
—
—
—/—
—
—
1, p. 93
1, p. 25
State/Color
Densitya (g/cc)
Miscellaneous
Reference
Dysprosium Compounds I. Dysprosium Alkoxides Dysprosium 2,4-pentanedionate Dy(–OC(CH3)CH(CH3)CO–)2 Dysprosium 2,2,6,6-tetramethyl-3,5Heptanedionate Dy(-OC(C(CH3)3)CHC(C(CH3)3)O-)3
459.83
—
134–137
—
s/—
—
—
712.31
—
182–185
—
s/—
—
)Hsub = 31.9 kcal
1, p. 162
357.78
—
302
220 (in vacuo)
Crystalline solid/ yellow
—
Soluble in tetrahydrofuran; hydrolyzed by water
1, p. 584
339.64
—
120(d)
—
s/—
2.47
Soluble in water
1, p. 162
609.71
—
—
—
s/—
—
s/pale pink
—
II. Dysprosium Alkyl Tricyclopentadienyl dysprosium Dy(C5H5)3
III. Dysprosium Salts Dysprosium acetate (CH3COO)3Dy Dysprosium trifluoromethane sulfonate (CF3SO3)3Dy
—
1, p. 162
Erbium Compounds I. Erbium Alkoxides and Ketonates Erbium III 6,6,7,7,8,8,8- heptafluoro2,2-dimethyl-3,5-octanedionate Er(-OC(C3F7)CH((CH3C)CO-)3
1052.79
—
157–163
130/0.01
)Hsub = 37 kcal/mol
1, p. 163
© 2005 by CRC Press
Erbium hexafluoropentanedionate Er(-OC(CF3)CH(CF3)CO-)3 Erbium 2,4-pentanedioante Er(–OC(CH3)CH(CH3)CO–)3 Tricyclopentadienyl erbium Er(C5H5)3 Erbium 8-hydroxyquinolinate Er(OC9H8N)3 Erbium methoxyethoxide Er(OC2H4OCH3)3 Erbium 2,2,6,6-tetramethyl-3,5heptanedionate Er(-OC(C(CH3)3)CH(C(CH3)3)CO-)3
788.42
—
110–120
—
s/—
—
—
1, p. 163
464.59
—
125–132
—
—
—
1, p. 163
362.54
—
285
200
—
600.22
—
—
280(d)
Hydrolyzed by water; soluble in tetrahydrofuran Soluble in THF, CH2Cl2
2, p. 186; 8, p. 587 1, p. 163
392.52
—
—
—
s/off-white to light pink Crystalline solid/pink s/bright yellow —/—
15% in methoxyethanol
1, p. 163
717.08
—
168–169
160/0.1
s/pink
—
)Hsub = 35.7 kcal/mol
1, p. 163
648.43
165/0.04
173
—
s/pink
—
Soluble in hexane, toluene THF, dimethoxyethane
1, p. 163
344.38
—
>330
—
s/—
2.11
—
1, p. 162
— 1.02
II. Erbium Alkylamide Erbium tris(bis(trimethylsilylamide)) Er(N(Si(CH3)3)2)3 III. Erbium Salt Erbium acetate (CH3COO)3Dy
Europium Compounds I. Europium Alkoxides and Ketonates Europium (III) 6,6,7,7,8,8,8-heptafluoro- 1037.49 2,2-dimethyl-3,5-octanedionate Eu(–OC(CF2CF2CF3)CH(C(CH3)3) CO–)3 701.77 Europium 2,4-pentanedionate Eu(–OC(CH3)CH(CH3)CO–)3 701.77 Europium 2,2,6,6-tetramethyl-3,5heptanedioante Eu(–OC(C(CH3)3)CH(C(CH3)3)CO–)3 818.51 Europium (III) thenoyltrifluroacetonate 869.52 Eu(-OC(C4H3S)CH(CF3)CO-)3.3H2O Europium 1,3-diphenyl-1,3propanedionate Eu(-OC(C6H5)CHC(C6H5)O-)2
821.72
—
209–213
—
s/—
—
—
1, p.164
—
187–189
—
s/—
—
—
1, p. 165
—
187–189
—
s/—
—
)Hsub = 39.5 kcal/mol
1, p. 165
—
134–140
—
—
Soluble toluene, methanol
1, p. 165
—
—
210–220(d)
s/red; turns yellow on hydration s/—
—
—
1, p. 164
© 2005 by CRC Press
Compound Europium 1,3-Diphenyl-1,3propanedionate-1,10-phenanthroline (-NC12H8N-)Eu(-OC(C6H5) CHC(C6H5)O-)2
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
1001.92
—
172–173
—
s/—
—
282.15
—
—
s/—
—
—
2, p. 187
633.13
82–84/10-4
159–162
400–420 (in vacuo) —
s/orange
—
—
1, p. 165
329.1
—
—
—
s/white
—
—
1, p. 164
377.20
—
—
—
—/—
—
—
1, p. 164
State/Color
Densitya (g/cc)
Miscellaneous Soluble in toluene
Reference 1, p. 164
II. Alkyleuropium Compounds Bis(cyclopentadienyl) europium Eu(C5H5)2 Europium tris(bis(trimethylsilylamide)) Eu(N(Si(CH3)3)2)3 III. Europium Salts Europium acetate (CH3COO)3Eu Europium III methacrylate (CH2C(CH3)COO)3Eu
Ferric/Ferrous Compounds (see section on iron compounds) Gadolinium Compounds I. Gadolinium Alkoxides and Ketonates Gadolinium 6,6,7,7,8,8,8 heptafluoro2,2-dimethyl-3,5-octanedionate Gd(OC((C3F7)2CF3CHCO(C(CH3)3)3 Gadolinium 2,4-pentanedionate trihydrate Gd(–OC(CH3)CH(CH3)CO–)3.3H2O Gadolinium (III) 2,2,6,6tetramethylheptanedionate Gd(–OC(C(CH3)3)CH(C(CH3)3)CO–)3
1042.79
—
138
—
—/—
—
—
1, p. 166
454.58 508.63
—
135–143
—
s/—
—
—
1, p. 166
707.07
—
167–70
—
Crystalline solid/offwhite
—
)Hsub = 38.6 kcal/mmol
1, p. 166
352.53
—
—
200–205
s/—
—
Air and moisture sensitive, isolated as a tetrahydrofuran adduct
2, p. 180; 8, p. 964
II. Alkyl Gadolinium Compounds Tricyclopentadienyl gadolinium Gd(C5H5)3
© 2005 by CRC Press
III. Gadolinium Salts Gadolinium acetate (CH3COO)3Gd Gadolinium III diethylenetriamine pentaacetic acid Gd(OCOCH2N((CH2)2NCH2COO)CH2 COOH)2
406.45
—
—
—
s/white
1.611
547.58
—
129
—
s/—
—
— Soluble in water
1, p. 165 1, p. 166
Gallium Compounds I. Gallium Alkoxides and Ketonates Gallium (III) ethoxide Ga(OC2H5)3 Gallium 2,2,6,6,Tetramethyl 3,5-Heptanedionate Ga(-OC(C(CH3)3)CH(C(CH3)3)CO-)3
204.90
—
144–145
180–190/0.5
s/—
—
—
1, p. 97
619.54
—
219–220
170/0.2
s/—
—
—
1, p. 97
201.95
125/0.01
91
—
s/—
—
—
1, p. 98
551.59
—
—
—
—/—
—
—
1, p. 98
367.05
—
194–195
140/10
s/—
1.42
158.83
—
162–162.3
—
s/—
192.94
—
36–37
—
164.88
—
68–69
261.65
—
—
II. Gallium Alkyl Amides Tris(dimethylamino)gallium Ga(N(CH3)2)3 Gallium tris(bis(trimethylsilylamide)) Ce(N(Si(CH3)3)2)3 Gallium (III) 2,4-pentanedionate Ga(–OC(CH3)CH(CH3)CO–)3
)Hform = 352.8 kcal/mol; )Hcomb = 1903 kcal/mol
1, p. 97
—
Dimeric or polymeric in solution
2, p. 717
s/—
—
—
—
s/—
—
—
Crystalline solid/—
—
Degree of association (1.3–1.7) in benzene or cyclohexane Dimeric in vapor phase; formulated as an oxobridge molecule
2, p. 686; 8, p. 958 2, p. 686; 8, p. 955 2, p. 713
III. Alkylcyclopentadienyl Compounds Acetoxydimethyl gallium (CH3)2Ga(OOCCH3) Diethylcyclopentadienyl gallium (C2H5)2Ga(C5H5) Dimethylcyclopentadienyl gallium (CH3)2Ga(C5H5) Dimethylmethoxygallium [(CH3)2Ga(OCH3)]2
© 2005 by CRC Press
Compound Tri-i-butyl gallium (iC4H9)3Ga Triethylgallium (C2H3)3Ga Trimethylgallium (CH3)3Ga Trimethylgallium-trimethyl arsenic adduct (CH3)3Ga.As(CH3)3
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
241.07
—
—
—
l/—
—
Pyrophoric
6, p. 77
156.91
143
82.3
—
l/—
1.0576
Pyrophoric
6, p. 77
114.83
55.7
15.8
—
l/—
1.10
234.86
121
24
—
l/—
—
163.29
60–62
—
—
—/—
1.135
—
1, p. 97
502.18
—
—
—
s/—
—
—
1, p. 97
State/Color
Densitya (g/cc)
Miscellaneous
Reference
)Hform = 79.8 6.3 kJ/mol (l); 2, p. 691; )Hform = 46.8 6.7 kJ/mol (g); 6, p. 77 )Hvap = 32.6 kJ/mol, pyrophoric Pyrophoric 6, p. 77
IV. Gallium Alkyl Halide Diethylgallium chloride (CH3CH2)2GaCl V. Gallium Salt Gallium 8-hydroxyquinolinate Ga(-OC9H6N-)3
Germanium Compounds I. Germanium Alkoxides and Ketonates Di-n-butyldiacetoxygermane (nC4H9)2Ge(OOCCH3)2 Degree of polymerization = 1.0Diethyldiethoxygermane (C2H5)2Ge(OCCH2CH3)2 Ethyltriethoxygermane CH3CH2Ge(OCH2CH3)3 Germanium (IV) n-butoxide (tetra-nbutoxygermane) Ge(O–nC4H9)4 Germanium (IV) ethoxide (tetraethoxygermane) Ge(O–nC2H5)4
n20 = 1.4452
304.90
127/5
—
—
l/—
1.444
1, p. 103
220.85
72–73/13
—
—
l/—
1.4250
236.83
180
—
—
l/—
1.1105
n20 = 1.4178
365.05
143/8
—
—
l/—
1.017
252.84
185–186
72
—
l/—
1.134
n20 1, p. 107 0 = 1.4255; viscosity = 0.2 cSt; flash point: 112°C; surface tension: 24 dyn/cm n20 = 1.4049; viscosity at 20°C: 1, p. 108; 0.2 cSt; flash point: 62°C; 4, p. 45 degree of polymerization: 1.0
—
1, p. 104
1, p. 105
© 2005 by CRC Press
1, p. 109
—
n20 = 1.4015; flash point: 34°C; surface tension: 22.5 dyn/cm; reacts with H2S to form GeS2 n20 = 1.4141; viscosity: 1.3 cSt; surface tension: 20.8 dyn/cm; flash point: 68°C Soluble in water
l/—
—
—
1, p. 109
—
l/—
1.068
—
—
l/—
—
85/85
—
—
l/—
1.4805
228.81
79/0.01
—
—
l/—
—
256.87
145/10
—
—
l/—
1.180
282.91
147–150/2.2
91–92
—
s/—
—
—
1, p. 105
76.62
88
165
—
Gas/—
65–66/0.01
60
—
—/—
Ignites in air; )Hvap = 3.36 kcal/ mol; )Hform = 21.6 kcal/mol n20 = 1.4960
1, p. 115
319.55
1.53 (142) —
335.55
88–90/2
—
—
l/—
1.147
n20 = 1.4612
1, p. 105
235.39
137–138
40
—
—/—
—
n20 = 1.4564; flash point: 14°C
1, p. 105
607.82
—
340
271/1
s/—
—
623.82
—
182–183
—
s/—
—
216.80
64–67/7
—
—
l/—
1.13
196.73
145–146
18
—
l/—
1.325
308.94
109/30
—
—
l/—
1.025
187.76
—
156–157
—
s/—
429.35
104–110/2
62 to 59
—
190.81
163
—
t-Butylgermane H3Ge(tC4H9) Cyclopentadienyltrimethylgermane C5H5Ge(CH3) 3 Diphenylgermane (C6H5)2GeH2
132.73
45–46
182.79
Diphenyldimethylgermane (C6H5)2Ge(CH3)2 Fluorenyltrimethylgermane (C12H8)CGe(CH3)3 Germane GeH4 Hexaethyldigermane (C2H5)3Ge2(C2H5)3 Hexaethyldigermoxane (C2H5)3GeOGe(C2H5)3 Hexamethyldigermane (CH3)3Ge2(CH3)3 Hexaphenyldigermane (C6H5)3Ge2(C6H5)3 Hexaphenyldigermoxane (C6H5)3GeOGe(C6H5)3 Methacryloxymethyltrimethylgermane CH2C(CH3)COOGe(CH3)3
Germanium (IV)methoxide (tetramethoxygermane) Ge(O–CH3)4 Germanium (IV) isoproroxide (tetraisopropoxygermane) ((CH3)2CO-)4Ge Hydroxygermatrane N(CH2CH2)3GeOH Tetrakis(trimethylsiloxy)germane ((CH3)3SiO)4Ge Triethylmethoxygermane (C2H5)3GeOCH3
1, p. 108
1, p. 106
n20 = 1.436
1, p. 112
Source for Ge
1, p. 102; 3, p. 186 1, p. 103
II. Alkylgermanium Compounds
—
n25 = 1.5921; slowly decomposes 1, at room temperature p. 66105; 3, p. 988 n20 = 1.5730 1, p. 105
—
1, p. 105
1, p. 106
Soluble in THF
1, p. 106
n20 = 1.4469 Flash point: 63°C Soluble in acetonitrile
1, p. 106
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Phenylgermane C6H5GeH2 Phenyltrimethylgermane (C6H5)Ge(CH3)3 Tetra-n-butylgermane Ge(nC4H9)4
151.71
40/22
—
—
l/—
1.2371
n20 = 1.5353
2, p. 500
194.80
183
—
—
l/—
1.117
1, p. 107
301.05
274
—
—
l/—
0.929
Tetraethylgermane Ge(C2H5)4
188.84
163–164
93
—
l/—
1.134 (72°C)
Tetramethylgermane Ge(CH3)4
132.73
43.5
88
—
l/—
0.975 1.006
Tetra-n-pentylgermane Ge(nC5H11)4
357.15
173/4
—
—
l/—
0.927
Tetraphenylgermane Ge(C6H5)4
381.02
—
231–34
210/1
s/—
—
Tetra-n-propylgermane Ge(nC3H7)4
244.95
86–87/5
73
—
l/—
0.954
Tetra-4-tolylgermane Ge(4–C6H4CH3)4 Tri-n-butylgermane HGe(nC4H9)3
437.12
—
224–227
—
s/—
—
n20 = 1.5045 Flash point: 53°C n20 = 1.4561; flash point: 90°C; viscosity: 3 cSt; surface tension: 26 dyn/cm; dielectric constant: 2.33 n20 = 1.4428; viscosity: 0.9 cSt; )Hvap = 9 kcal/mol; surface tension: 24 dyn/cm; )Hform = 45.3 kcal/mol; dielectric constant: 1.97 n20 =1.3882, )Hvap = 6.3 kcal/mol; viscosity: 0.3 cSt; surface tension: 24 dyn/cm; critical temprature and pressure: 493 K and 27.7 atm; flammable; liquid n20 = 1.4592; viscosity: 0.4 cSt; surface tension: 27 dyn/cm; dieletric constant: 2.30 N20 = 1.58 Soluble in acetone, benzene, hot toluene )Hform = 208.6 kcal/mol )Hsub = 37.5 kcal/mol N20 = 1.4510; toxic )Hform = 69.6 kcal/mol )Hform = -2144.5 kcal/mol Dielectric constant: 1.92 Viscosity: 1.1 cSt; surface tension: 25 dyne/cm —
244.94
123/20
—
—
l/—
0.916
Compound
State/Color
Densitya (g/cc)
Miscellaneous
N20 = 1.4508
Reference
1, p. 108
1, p. 108
2, p. 499; 1, p. 109; 6, p. 79
1, p. 109
2, p. 499 1, p. 109
2, p. 499 1, p. 110
2, p. 499; 1, p. 110 1, p. 110
© 2005 by CRC Press
Triethylgermane HGe(C2H5)3 Trimethylgermane HGe(CH3)3 Trimethylphenylgermane Ge(CH3)3(C6H5) Triphenylgermane HGe(C6H5)3
1.004 –1.0075 1.013
n20 = 1.4382–1.4330; flash point: 1, p. 112; 5°C 2, p. 500 n20 = 1.3890; )Hvap = 6.10 kcal/ 1, p. 113 mol N20 = 1.5045 27, p. 77
160.78
122
—
—
l/—
118.70
26–27
123
—
—/—
194.80
183
—
—
l/—
1.17
304.92
128–136/102
41–41.5
—
s/—
—
200.85
181–182
—
—
l/—
1.000
N20 = 1.4594
1, p. 101
158.77
101
—
—
l/—
0.995
N20 = 1.4333; flash point: 16°C
1, p. 101
276.86
—
49
—
s/—
—
236.88
105/10
—
—
l/—
1.105
n20 = 1.482; tends to polymerize 1, p. 107
144.74
70.6/735
—
—
l/—
0.9970
n20 = 1.4153
2, p. 499
186.82
152
—
—
l/—
1.005
n20 = 1.4501
1, p. 114
170.78
88–89/38
—
—
l/—
1.2043
n20 = 1.5185
2, p. 499
327.09
135/0.045
—
—
l/—
1.0104
n20 = 1.4918
2, p. 499
200.85
75/13
—
—
l/—
1.0401
n20 = 1.4720
2, p. 499
220.02
154–157
—
—
l/—
1.5274
1, p. 101
272.12
111–118
35–37
—
s/—
—
n20 = 1.4928 Flash point: 55°C —
201.62
174–175
—
—
l/—
1.382
1, p. 102
406.23
78–79/4
35–37
—
l/—
—
n20 = 1.4810 Flash point: 51°C —
—
2, p. 500; 8, p. 995
III. Alkenyl Germanium Compounds Allyltriethylgermane (C2H5)3Ge(CH2CH = CH2) Allyltrimethylgermane (CH3)3Ge(CH2CH = CH2) Diphenyldiacetylgermane (C6H5)2Ge(C } CH)2 Tetraallylgermane Ge(CH2CH = CH2)4 Trimethylallylgermane (CH3)3Ge(CH = CH2) Vinyltriethylgermane (CH2 = CH)Ge(C2H5)3
—
2, p. 499
IV. Cycloalkylgermanium Compounds Cylclopropylcyclobutylgermane (–CH2CH2CH2–)Ge(–CH2(CH2)2CH2-) Diethylcyclo(tetradecyl)germane (C2H5)2Ge(–CH2(CH2)12CH2-) Ethylbutylcyclopropylgermane (C2H5)(C4H9)Ge(–CH2CH2CH2–) V. Germanium Alkyl Halides Allyltrichlorogermane Cl3Ge(CH2CHCH2) Benzyltrichlorogermane C6H5CH2GeCl3 Bis(chloromethyl)dimethylgermane (ClCH2)2Ge(CH3)2 Bromomethyltribromogermane BrCH2GeBr3
1, p. 101
1, p. 102
© 2005 by CRC Press
Compound n-Butyltrichlorogermane (CH3(CH2)3)GeCl3 t-Butyldimethylchlorogermane (CH3)3CGe(CH3)2Cl tert-butyltrichlorogermane (tC4H9)GeCl3 Carboxyethyltrichlorogermane HOOC(CH2)2GeCl3 Choromethyltrimethylgermane (CH3)3Ge(CH2Cl) 3-Chloropropyltrichlorogermane (Cl(CH2)3)GeCl3 Di-n-butyldichlorogermane (nC4H9)2GeCl2 (Dichloromethyl)trimethylgermane (Cl2CH)Ge(CH3)3 Diethylchorogermane (C2H5)2Ge(Cl)H Diethyldichlorogermane (C2H5)2GeCl2 Dimethyldichlorogermane (CH3)2GeCl2 Diphenyldichlorogermane (C6H5)2GeCl2 Ethyliodogermane (C2H5)Ge(I)H2 Ethyltribromogermane (C2H5)GeBr3 Ethyltrichlorogermane (C2H5)GeCl3 Methyltrichlorogermane (CH3)GeCl3 Phenyldifluorogermane (C6H5)Ge(F2)H Phenyldimethylchlorogermane (C6H5)Ge(CH3)2Cl
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
236.07
184
—
—
l/—
1.451
n20 = 1.4760
1, p. 102
195.24
147–154
93–94
—
l/—
2.9706
n20 = 1.6327
1, p. 102
236.07
169–170
94.5
—
s/—
—
—
1, p. 102
252.06
—
83–85
—
s/—
—
—
1, p. 103
167.17
113–114
—
—
l/—
256.50
78–79/8
—
—
l/—
257.73
242
—
—
l/—
1.208
n20 = 1.4724
1, p. 103
201.62
149–150
—
—
l/—
1.334
n20 = 1.4653
1, p. 104
179.19
137/760
—
—
l/—
1.2409
n20 = 1.4572
2, p. 500
201.64
175
39
—
l/—
1.374
1, p. 104
173.57
124
22
—
l/—
1.493
297.71
223/12
9
—
l/—
1.41
230.57
138
—
—
l/—
2.0277
n20 = 1.4700 Flash point: 52°C n20 = 1.4600 Flash point: 21°C n20 = 1.5975 Flash point = 160°C n20 = 1.5612
341.36
200
—
—
l/—
—
208.03
144
33
—
l/—
1.604
n20 = 1.4745; flash point: 51°C
1, p. 105
193.98
110–111
—
—
l/—
1.706
n20 = 1.4685; flash point: 10°C
1, p. 106
188.70
—
38
—
s/—
—
—
2, p. 500
215.23
80/5
—
—
l/—
1.41
—
1, p. 107
State/Color
Densitya (g/cc)
Miscellaneous
1.189–1. n20 = 1.4389–1.4419 21 1.664 n20 = 1.5070
—
Reference
2, p. 499; 1, p. 103 1, p. 103
1, p. 104 2, p. 500 1, p. 104 2, p. 500 2, p. 500
© 2005 by CRC Press
Phenyltrichlorogermane (C6H5)GeCl3 Phenyltriiodogermane (C6H5)GeI3 Tri-n-butylbromogermane (nC4H9)3GeBr Tri-n-butylchlorogermane ((nC4H9)3GeCl Trichlorogermane Cl3GeH Decomposesat >140°3(Trichlorogermyl)propionylchloride OC(Cl)CH2CH2GeCl3 Triethylbromogermane (C2H5)3GeBr Triethylchlorogermane (C2H5)3GeCl Trifluoromethyltriiodogermane CF3GeI3 Trimethylbromogermane (CH3)3GeBr Trimethylchlorogermane (CH3)3GeCl Trimethyliodogermane (CH3)3GeI Light sensitiveTri-n-butylchlorogermane ((nC4H9)3GeCl Trichlorogermane Cl3GeH Decomposes at >140°3(Trichlorogermyl)propionylchloride OC(Cl)CH2CH2GeCl3 Triethylbromogermane (C2H5)3GeBr Triethylchlorogermane (C2H5)3GeCl Trifluoromethyltriiodogermane CF3GeI3 Trimethylbromogermane (CH3)3GeBr Trimethylchlorogermane (CH3)3GeCl
n20 = 1.5536
256.06
226–228
—
—
l/—
1.584
1, p. 107
530.41
—
55–56
—
s/—
—
323.84
143–4/10
—
—
l/—
1.195
n20 = 1.4809
1, p. 110
279.38
269–270
—
—
l/—
1.054
1, p. 110
179.97
75
71
—
l/—
1.930
n20 = 1.4652 Flash point: 94°C Flash point: 12°C
270.48
89–91/7
—
—
l/—
1.751
n20 = 1.5115
1, p. 111
239.68
190–191
32
—
l/—
1.412
n20 = 1.4829
1, p. 111
195.23
176
—
—
l/—
1.175
1, p. 111
522.31
42/0.001
—
—
l/—
—
n20 = 1.4643 Flash point: 38°C n20 = 1.6571
197.60
113–114
25
—
l/—
1.549
1, p. 112
153.15
102
14
—
l/—
1.249
244.60
133–135
—
—
l/—
1.796
n20 = 1.4713 Flash point: 37°C n20 = 1.4337 Flash point = 1°C n20 = 1.5189
279.38
269–270
—
—
l/—
1.054
1, p. 110
179.97
75
71
—
l/—
1.930
n20 = 1.4652 Flash point: 94°C Flash point: 12°C
270.48
89–91/7
—
—
l/—
1.751
n20 = 1.5115
1, p. 111
239.68
190–191
32
—
l/—
1.412
n20 = 1.4829
1, p. 111
195.23
176
—
—
l/—
1.175
1, p. 111
522.31
42/0.001
—
—
l/—
—
n20 = 1.4643 Flash point: 38°C n20 = 1.6571
197.60
113–114
25
—
l/—
1.549
1, p. 112
153.15
102
14
—
l/—
1.249
n20 = 1.4713 Flash point: 37°C n20 = 1.4337 Flash point = 1°C
—
2, p. 500
1, p. 111
1, p. 112
1, p. 113 1, p. 113
1, p. 111
1, p. 112
1, p. 113
© 2005 by CRC Press
Compound Trimethylfluorogermane (CH3)3GeF Trimethyliodogermane (CH3)3GeI Light sensitiveTriphenylbromogermane (C6H5)3GeBr Triphenylchlorogermane (C6H5)3GeCl Triphenylgermane (C6H5)3GeH Tris(trifluoromethyl)iodogermane (CF3)3GeI Tris(trimethylsilyl)germane ((CH3)3Si)3GeH Vinyltrichlorogermane CH2CHGeCl3
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
136.69
76/746
—
—
l/—
1.2300
n20 = 1.3863
2, p. 500
244.60
133–135
—
—
l/—
1.796
n20 = 1.5189
1, p. 113
383.81
—
138-9
—
s/—
—
339.36
285/12
117
—
s/—
—
304.91
128–129/0.03
41–43
—
s/—
406.51
72
40
—
293.17
80/5
—
205.99
128
188.84
State/Color
Densitya (g/cc)
Miscellaneous
—
Reference
1, p. 113 1, p. 113
1.6187
Soluble in methylene chloride, hot toluene —
l/—
2.074
n20 = 1.3580
1, p. 114
—
l/—
0.937
n20 = 1.4974
1, p. 114
—
—
l/—
1.652
n20 = 1.4815
1, p. 114
70–75/15
—
—
l/—
0.9782
n20 = 1.4428
1, p. 104
132.73
74
—
—
l/—
1.039
n20 = 1.4208
1, p. 104
90.65
34.1
154
—
g/—
—
302.04
105–109/0.2
—
—
l/—
0.982
222.66
—
—
380
s/—
2.56
217.88
35–37/0.2
—
—
l/—
—
—
2, p. 500
372.73
—
—
—
—/—
—
—
27, p. 63
1, p. 113
VI. Germanium Alkyl Hydride Compounds Di-n-Butylgermane (n-C4H9)2GeH2 Diethylgermane (C2H5)2GeH2 Methylgermane CH3GeH3
—
1, p. 106
VII. Miscellaneous Organogermanium Compounds 3-Aminopropyltributylgermane (NH2(CH2)3)Ge(nC4H9)3 Ammoniumhexafluorogermanate (NH4)2GeF6 Amino triisopropylgermane (iC3H7)3GeNH2 Bisammoniumtris(oxalato)germanate (NH4)2Ge(C2O4)3
n20 = 1.4700 flash point: >100°C n20 = 1.425
1, p. 101 27, p. 63
© 2005 by CRC Press
Bis[Bis(Trimethylsilyl)amino] germanium II Ge(N(Si(CH3)3)2)2 Carboxyethylgermanium sesquioxide HOOCCH2CH2GeO1.5 Carboxytriphenylgermane (C6H5)3Ge(COOH) Dibutyl germanium 2,3-butanedionate (C4H9)2Ge(–OC(CH3)C(CH3)O–) Diethyl(cyclothiopropyl)germane (C2H5)2Ge(–C(CH2)2S–) Dimethylamino triethylgermane (C2H5)3Ge(N(CH3)2) Dimethylamino trimethylgermane (CH3)3Ge(N(CH3)2) Ethyltrimethoxy germane (C2H5)Ge(OCH3)3 Methacryloxytriethylgermane (CH2 = CH(CH3)COO)Ge(C2H5)3 Methyltriethoxygermane (CH3)Ge(OC2H5)3 Tri-n-butylacetoxygermane (nC4H9)3Ge(OOCCH3) Tris(dimethyl)amino ethylgermanium (C2H5)Ge(N(CH3)2)3 Triethyl(diethyl)phosphinogermane (C2H5)3Ge(P(C2H5)2) Trimethyl(ethyl)thiogermane (CH3)3Ge(SC2H5)
393.36
60/0.4
32–33
—
s/orangeyellow
—
—
339.32
—
—
—
s/—
—
348.92
—
187–190
—
s/—
—
272.91
90–94/1.5
—
—
l/—
—
n20 = 1.4555
2, p. 500
202.84
107/23
—
—
l/—
1.2102
n20 = 1.5241
2, p. 500
217.86
176
—
—
l/—
1.0235
n20 = 1.4498
2, p. 500
161.71
102–104
—
—
l/—
—
n20 = 1.4246; Flash point: 10°C
1, p. 104
194.75
154
—
—
l/—
1.2446
n20 = 1.4178
2, p. 500
244.85
69–70/5
—
—
l/—
1.144
n20 = 1.4564
1, p. 106
222.80
166–167
—
—
l/—
1.128
n20 = 1.4128
1, p. 107
302.97
146–149/15
—
—
l/—
1.051
n20 = 1.4538
1, p. 110
233.88
191
46
—
l/—
248.87
120/15
—
—
l/—
1.049 (22) —
n20 = 1.4845
2, p. 500
178.82
148
—
—
l/—
1.10
n20 = 1.4779
2, p. 500
Decomposes at 320°C —
—
1, p. 102
1, p. 103 2, p. 499
2, p. 500
Gold Compounds I. Gold Alkoxides and Ketonates Gold(diethyl)2,4-pentanedionate (C2H5)2Au(–OC(CH3)CHC(CH3)O–)
354.20
—
9–10
—
s/—
—
—
27, p. 27
530.36
—
124–125
—
s/—
—
—
2, p. 768
II. Acetoalkylgold (I) Complexes Acetoethylgold triphenylphosphine Au(CH2COC2H5)(P(C6H5)3)
© 2005 by CRC Press
Compound Acetomethylgold triphenylphosphine (Au(CH2COCH3)(P(C6H5)3)) Acetophenylgold triphenylphosphine Au(CH2COC6H5)(P(C6H5)3)
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
516.33
—
144–145
—
578.40
—
125–126
486.30
—
392.23
Densitya (g/cc)
Miscellaneous
s/—
—
—
2, p. 768
—
s/—
—
—
2, p. 768
123–125
—
s/—
—
—
2, p. 768
—
68
—
s/—
—
—
2, p. 770
536.36
—
164
—
s/—
—
—
2, p. 770
550.39
—
161–162
—
s/—
—
—
2, p. 770
524.35
—
100 (d)
—
s/—
—
—
2, p. 773
622.90
—
99–100
—
s/—
—
—
2, p. 784
829.33
—
87
—
s/—
—
—
2, p. 784
897.25
—
78–79
—
s/—
—
—
2, p. 784
360.23
—
5
—
s/—
—
—
2, p. 784
318.15
—
23–26
—
s/—
—
—
2, p. 784
State/Color
Reference
III. Vinyl Gold (I) Complexes Gold vinyltriphenylphosphine Au(CH = CH2)(P(C6H5)3) IV. Aryl Gold (I) Complexes Gold phenyltriethylphosphine C6H5Au(P(C2H5)3) Gold phenyltriphenylphosphine C6H5AuP(C6H5)3 Gold 4–xyleneyltriphenylphosphine 4–CH3C6H4AuP(C6H5)3 V. Cyclopentadienylgold (I) Complexes Gold cyclopentadienyltriphenylphosphine Au(M1–C5H5)(P(C6H5)3) VI. Arylgold (III) Complexes Gold trichlorophenyl, tetrabutylamine ((C4H9)4N)(AuCl3(C6H5)) Gold tribromophenyl, tetrabutylamine ((C4H9)4N))(AuBr3(C6H(C6H5)) Gold triiodophenyl, tetrabutylamine ((C4H9)4N)(AuI3(C6H5)) VII. Trialkylgold (III) Complexes Gold trimethyl, triethylphosphine Au(CH3)3(P(C2H5)3) Gold trimethyl, trimethylphosphine Au(CH3)3(P(CH3)3)
© 2005 by CRC Press
VIII. Miscellaneous Complexes of Gold Cycloheptenylgoldchloride (C7H10)AuCl Cyclohexenylgoldchloride (C6H8)AuCl cis-Cyclooctaenegoldchloride (cis-C8H12)AuCl Cyclopentadienylgoldchloride (C5H5)AuCl trans-Cyclodecenegoldchloride (trans-C10H16)AuCl trans-Cyclooctenegoldchloride (trans-C8H12)AuCl Triethylphosphinegold I chloride (C2H5)3PAuCl
326.58
—
—
—
—/—
—
Decomposes at 93–80°C
2, p. 813
312.55
—
—
—
—/—
—
Decomposes at 60°C
2, p. 813
340.60
—
—
—
—/—
—
Decomposes at 93–96°C
2, p. 813
297.51
—
—
—
s/—
—
368.66
—
—
—
—/—
—
Decomposes at 55–60°C; 2, p. 813; soluble in organic polar solvents 8, p. 194 Decomposes at 93–96°C 2, p. 813
340.60
—
—
—
—/—
—
Decomposes at 115°C
2, p. 813
350.57
—
85–87
—
s/—
—
Soluble in methylene chloride
2 p. 118
Hafnium Compounds I. Hafnium Alkoxides and Ketonates Hafnium n-butoxide Hf(O-nC4H9)4 Hafnium tert-butoxide Hf(O-tC4H9)4 n20 = 1.4240Hafnium di-n-butoxide (bis-2,2-pentanedionate) (-OC(CH3)CH(CH3)CO-)2Hf (O-nC4H9)2 Hafnium ethoxide Hf(OC2H5)4 Hafnium 2-ethylhexoxide tetraoctylhafnate Hf((OCH2CH(C2H5)C4H9)4 Hafnium 2,4–pentanedionate Hf(–OC(CH3)CH(CH3)CO–)4 Hafnium tetramethylheptanedionate Hf(-OC(C(CH3)3)CH(C(CH3)3)CO-)4 Hafnium trifluoropentanedionate Hf(-OC(CF3)CH(CH3)CO-)4
470.95
280–285/0.01
—
—
l/—
1.32
—
470.65
90/5
—
—
l/—
1.16
522.58
—
—
—
—/—
—
358.73
180–200/13
178–180
—
s/—
—
678.40
—
—
—
—/—
—
—
1, p. 28; 4, p. 45 2. p. 119
574.91
—
193
82/0.001
s/—
—
—
1, p. 119
911.57
—
315
180/0.1
s/—
—
Soluble in toluene, hexane
790.82
—
128–129
115/0.05
s/—
—
Soluble in acetone, cyclohexane 1, p. 119
)Hvap = 16.3 kcal/mol —
Degree of polymerization: 3.6
1, p. 118 1, p. 118 1, p. 119
2. p. 119
© 2005 by CRC Press
Compound Hafnium trifluoropentanedionate Hf(–OC(CF3)CH(CH3)CO–)4
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
790.82
—
128–129
—
s/—
—
Soluble in acetone
1, p. 119
478.84
—
—
—
—/—
—
Pentagonal, bipyramid
2, p. 562
851.27
—
—
—
—/—
—
—
2, p. 562
731.33
—
—
—
—/—
—
—
2, p. 562
809.12
—
—
—
—/—
—
—
2, p. 562
438.868
—
120
~120 (in vacuo)
s/pale yellow
—
—
2, p. 562
354.80
—
—
—
—
—
2, p. 584
379.59
—
230–233
—
s/pale yellow s/—
—
—
1, p. 119
420.08
—
—
—
s/—
—
—
1, p. 120
State/Color
Densitya (g/cc)
Miscellaneous
Reference
II. Monocyclopentadienyl Hafnium (IV) Compounds Hafniumacetylacetonate (Hf(Hacac)3) Hf(–OC(CH3)CH2C(CH3)O–)3 Hafniumbenzoylacetonate Hf(Hbzac)3 Hf(–OC(C6H5)CH2C(C6H5)O–)3 Hafniumdipivalylmethane Hf(Hdpm)3 Hf(–OC(C(CH3)3)CH2C(CCH3)3O–)3 Hafniumbenzoylbenzoate Hf(Hbzbz)3 Hf(OC(C6H5)C(C6H5)O)3 Tetracyclopentadienylhafnium Hf(C5H5)4 III. Miscellaneous Hafnium Compounds Hafnium dimethylamide Hf(N(CH3)2)4 Hafnocene dichloride (C5H5)2HfCl2 Pentamethylcyclopentadienyl-hafnium trichloride (CH3)5C5HfCl3
Holmium Compounds I. Holmium Alkoxides and Ketonates Holium acetate (CH3COO)3Ho orangeHolmium II 6,6,7,7,8,8,8 heptafluoro-2,2-dimethyl-3, 5-octanedionate Ho(-OC(C3F7)3CHC(C(CH3)3O-)3 Holmium 2,4-pentanedionate Ho(–OC(CH3)CH(CH3)CO–)4
342.07
—
—
—
s/pink-
—
—
1, p. 166
1050.45
—
103–111
—
s/pale yellow
—
—
1, p. 166
462.26
—
—
—
—/—
—
—
1, p. 166
© 2005 by CRC Press
Holmium 2,2,6,6,Tetramethyl 3,5-Heptanedionate, hydrated Ho(OC(C(CH3)3)CH(C(CH3)3)CO)3 Tricyclopentadienyl holmium Ho(C5H5)3
714.75
—
179–181
—
—/—
—
360.21
—
295
230
Yellow
—
—
Soluble in tetrahydrofuran; hydrolyzed by water
1, p. 167
8, p. 1137
Indium Compounds I. Indium Alkoxides and Ketonates Indium hexafluoropentanedionate (-OC(CF3)CH(CF3)CO-)2In Indium methoxyethoxide 15–18% in methoxyethanol In(–OC2H4OCH3)3 Indium methyl(trimethyl)acetylacetate In(–OC(OC(CH3)3)CH(CH3)CO–)4 Indium Trifluoropentanedionate In(-OC(CF3)CH(CH3)CO-)2 Indium 2,4–pentanedionate In(–OC(CH3)CH(CH3)CO–)3
735.97
—
—
—
—/—
—
340.08
—
—
—
—/—
1.02
586.37
—
—
—
574.06
—
118–119
—
Resinous solid/— s/—
412.15
—
186
260–280
s/—
1.41
180.34
—
218–219
—
s/—
—
—
1, p. 120
159.92
—
88
—
s/—
1.568
—
1, p. 121
179.91
—
—
150
s/—
—
Attacked by air; polymeric
310.10
—
—
—
Yellow
—
Thermal decomposition to CpIn in vacuo above 150°C
187.98
—
—
—
l/—
—
Pyrophoric
— —
—
1, p. 121
Isolated as solution
1, p. 121
Soluble in acetone, methanol, warm toluene, ethylacetate Soluble in xylene, hot methoxyethanol )Hform = 335.8 kcal/mol; soluble in water; )Hcomb = 1903 kcal/ mol
1, p. 121 1, p. 121 1, p. 121
II. Indium Alkyls Dimethylindium chloride (CH3)2InCl Trimethylindium (CH3)3In III. Cyclopentadienyl Indium Compounds Cyclopentadienylindium (C5H5)In Triscyclopentadienylindium (C5H5)3In
2, p. 685; 8, p. 1146 2, p. 685
IV. Trialkyl/aryl Indium Compounds Diethylmethylindium CH3(C2H5)2In
6, p. 80
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Dimethylcyclopentadienylindium (CH3)2In(C5H5)
209.98
—
195
—
s/white
—
Dimethylethylindium (CH3)2(C2H5)In Triethylindium (C2H5)3In Trimethylindium (CH3)3In
173.96
—
—
—
l/—
—
202.01
184
32
—
l/—
159.93
134 (70/72)
88
—
361.26
—
208
244.09
178
236.01
Compound
Triphenylindium (C6H5)3In Tripropylindium (C3H7)3In Trimethylindium-trimethylphosphine adduct (CH3)3In.P(CH3)3
State/Color
Densitya (g/cc)
Miscellaneous
Reference
Polymeric in solid state; air stable; insoluble in organic solvents; soluble in dimethylformamide Pyrophoric
2, p. 687; 8, p. 1148
1.260
Pyrophoric
6, p. 80
s/—
1.568
—
s/—
1.501
)Hform = 122.0 5.9 kJ/mol; )Hform (g) = 170.5 6.3 kJ/mol; )Hvap = 48.5 kJ/mol; H2O reactive —
2, p. 693; 5, p. 139; 6, p. 80 5, p. 139
51
—
l/—
1.501
—
—
44.5
—
s/—
—
Flammable
6, p. 80
—
—
—
s/—
—
Polymeric (linear)
2, p. 717; 8, p. 1144
s/copperbrownIridium s/yelloworange
—
—
s/yellow
—
6, p. 80
5, p. 139
V. Organometallic Carboxylates of Indium Dimethylindiumacetate (CH3)2In(OOCCH3)
203.93
Iridium Compounds I. Iridium Alkoxides and Ketonates Iridium I dicarbonyl pentanedionate (-OC(CH3)CH(CH3)CO-)Ir(CO)2
347.35
—
—
100/0.05
(III) 2,4-pentanedionate Ir(-OC(CH3)CH(CH3)CO-)3
489.53
—
—
260/1
258–280
Decomposes at 290–319
—
Soluble in methanol, ethyl acetate
1, p. 122
2 p. 122
II. Mononuclear Iridium Compounds (Vaska Compounds) (Bistriphenylphosphine)iridium bromocarbonyl IrBr(CO)(P(C6H5)3)2
821.72
—
—
2, p. 543; 8, p. 1183
© 2005 by CRC Press
(Bistriphenylphosphine)iridium chlorocarbonyl IrCl(CO)(P(C6H5)3)2 (Bistriphenylphosphine)iridium fluorocarbonyl IrF(CO)(P(C6H5)3)2 (Bistriphenylphosphine)iridium iodocarbonyl IrI(CO)(P(C6H5)3)2
780.26
—
327–328
—
s/lemon yellow
—
Stable in air; takes up O2 in solution
2, p. 543; 8, p. 1184
763.81
—
208–211
—
s/yellow
—
Air sensitive
2, p. 543; 8, p. 1185
871.72
—
270–296.5, >300
—
s/yellow
—
—
2, p. 543; 8, p. 1185
511.124
—
—
—
—/brown
—
—
452.67
—
242
—
s/yellow
—
—
2, p. 604; 8, p. 1162 2, p. 604; 19
679.41
—
275
—
s/orange
—
—
590.51
—
290
—
—
773.41
—
290–310
—
Crystalline solid/ yellow s/red
—
—
2, p. 606; 8, p. 1163
2, p. 606; 8, p. 1179
III. Cyclopentadienyl Iridium Compounds Cyclopentadienyliridiumdiodide Ir(C5H5)I2 Cyclopentadienyl, methylbis(dithian) iridium (C5H5)Ir(CH3)(SC2H2S)2 Triphenylphosphine,cyclopentadienyl iridiumdibromide Ir(C5H5)Br2(P(C6H5)3) Triphenylphosphine,cyclopentadienyliridiumdichloride Ir(C5H5)Cl2(P(C6H5)3) Triphenylphosphine,cyclopentadienyliridiumdiiodide Ir(C5H5)I2(P(C6H5)3)
Insoluble
2, p. 604
2, p. 604; 8, p. 1178 2, p. 604
IV. Cyclopentadienyl, C1 Carbonyl Iridium Compounds Cyclopentadienyldicarbonyl iridium Ir(C5H5)(CO)2
313.335
—
—
—
–/yellow
—
Cyclopentadienylmethyl iridiumdicarbonyl Ir(C5H5)(CH3)(CO)2 Triphenylphosphine,cyclopentadienyl, iridiumcarbonyl Ir(C5H5)(CO)(P(C6H5)3)
328.37
—
—
—
–/yellow
—
Volatile in vacuum; stable in air for short time; very soluble in organic solvents; insoluble in H2O; µ = 3.45 D Volatile in vacuum
547.615
—
160, 180–183
—
s/bright orange
—
Strongly nucleophilic
—
79–84
—
s/white
—
2, p. 606
V. Cyclopentadienyl, C2 Alkene Iridium Compounds Cyclopentadienyl,diethylenemethyl iridium Ir(C5H5)(CH3)(C2H4)2
328.46
—
2, p. 608
© 2005 by CRC Press
Compound Cyclopentadienyl, methylcyclohexadiene iridium IrC5H5CH3(1,3–C6H8) Cyclopentadienyl, methylcyclooctadiene iridium IrC5H5CH3(1,5–C8H12) Cyclopentadienyl, octadiene iridium Ir(C5H5)(1,5–C8H12) Cyclopentadienyl, octatriene iridium Ir(C5H5)(1,3,5–C8H10) Cyclopentadienyl, octatetraene iridium Ir(C5H5)(1,3,5,7–C8H8) ((1,2,3,4-M)-1,3,5,7-Cyclohexadiene) (M5–2,4–cyclopentadien–yl)iridium IrC5H5(1,3–C6H8)
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
352.48
—
65–67
—
380.53
—
170–171
365.497
—
363.482
Densitya (g/cc)
Miscellaneous
s/white
—
—
2, p. 608
—
s/white
—
—
2, p. 608
122–127
—
s/white
—
—
—
80
s/pale green
—
361.466
—
114–166
—
s/white
—
—
337.44
—
—
—
s/white
—
—
State/Color
Soluble in organic solvents; volatile —
Reference
2, p. 608; 8, p. 1167 2, p. 608; 8, p. 1167 2, p.608; 8, p. 1167 2, p. 608; 8, p. 1165
Iron Compounds I. Iron Alkoxides and Ketonates Iron (III) benzoylacetonate Ferric phenylbutanedionate Fe(–OC(C6H5)CH(CH3)CO–)3 Iron (III) ethoxide Fe(OC2H5)3 Iron (III) 2,4-pentanedionate Ferric Acetylacetonate Fe(–OC(CH3)CH(CH3)CO–)3
539.39
—
216
—
s/—
—
Soluble in xylene
1, p. 125
191.03
155/0.1
120
—
s/—
—
Soluble in benzene, hot ethanol
1, p. 125
353.18
—
176–179
—
s/red brown
Iron (III) trifluoropentanedionate Fe(–OC(CF3)CH(CH3)CO–)3
515.09
—
110–112
—
s/—
—
186.04
249
171
100
Crystalline solid/ orangeyellow
—
1.33
Soluble in water (1.5g/l), toluene 1, p. 126 (204 g/l), ethanol (32 g/l); )Hform = 355.2 kcal/mol; )Hsub = 4.67 kcal/mol )Hsub = 20.8 kcal/mol 1, p. 126
II. Alkyl Iron Compounds Bis(cyclopentadienyl)iron (ferrocene) (C5H5)2Fe
Nonhazardous; soluble in ether, 6, p. 82 benzene, methanol, and most HC; monomeric; thermally stable; does not react with water
© 2005 by CRC Press
Iron III dimethyldithiocarbamate Fe(S2CN(CH3)2)3 Iron III diphenylpropanedionate tris(Dibenzoylmethanato) iron Fe(-OC(C6H5)CH(C6H5)CO-)3 Iron III tetramethylheptane-dionate Fe(-OC(C(CH3)3)CH(C(CH3)3)CO-)3
416.51
—
180
—
s/—
—
—
725.61
—
260–265
—
s/—
—
515.09
—
110–112
—
s/—
—
—
1, p. 126
173.94
—
—
—
—/—
—
—
1, p. 125
269.01
—
—
—
s/—
—
311.10
—
—
—
s/—
—
Soluble in acetone, THF
1, p. 125 1, p. 125
III. Iron Salts Iron II acetate (CH3COO)2Fe Iron III acrylate (CH2CHCOO)3Fe Iron III methacrylate (CH2C(CH3)COO)3Fe
Decomposes 190–200°C; soluble in warm ethanol Decomposes 215–220°C; soluble in methylmethacrylate
1, p. 125
1, p. 167
1, p. 125
Lanthanum Compounds I. Lanthanum Alkoxides and Ketonates Lanthanum (III) isopropoxide La(O–iC3H7)3 Lanthanum 6,6,7,7,8,8,8 heptafluoro2,2-dimethyl-3, 5-octanedionate La(OC((CF2)2CF3CHCO(C(CH3)3)3 Lanthanum methoxyethoxide La(-OC2H4OCH3)3 Lanthanum 2,4-pentanedionate La(–OC(CH3)CH(CH3)CO–)3 Lanthanum 2,2,6,6-tetramethyl-3,5heptanedionate La(–OC(C(CH3)3)CH(C(CH3)3)CO–)3
316.18
170/0.04
120–128
—
—/—
—
Soluble in isopropanol (60 g/l)
1024.44
—
—
—
—/—
—
)Hsub = 34.7 kcal/mole; soluble in 1, p. 167 acetonitrile, chloroform
364.17
—
—
—
—/—
1.01
436.24
—
140–143
—
s/—
—
Soluble in toluene (0.4 g/l)
1, p. 168
688.72
210/0.2
230–234
—
s/—
—
Hsub = 34.3 kcal/mol
1, p. 168
316.04
—
120(d)
—
s/—
1.64
Soluble in water
1, p. 167
620.07
—
145–149
100–102/10—4 l/—
0.937
n20 = 1.4974
1, p. 167
—
1, p. 167
II. Miscellaneous Lanthanum Compounds Lanthanum acetate (CH3COO)3La Lanthanum tris(bis-(trimethylsilyl)amide) La(N((Si(CH3)3)2)3
© 2005 by CRC Press
Compound
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
State/Color
Densitya (g/cc)
Miscellaneous
Reference
Lead Compound I. Lead Alkoxides and Ketonates 379.33
—
75
797.55
—
75–80
621.29
—
135–140
—
269.27
—
—
—
s/pale yellow s/white
549.69
—
—
—
—/—
1.11
405.41
—
—
120/0.01
s/—
499.49
—
132
—
s/—
373.91/ 409.91 443.37
—
—
—
—
573.75
130/0.1
126–128
Hexamethyldilead (CH3)6Pb2
504.61
—
38
—
Hexaphenyldilead (C6H5)6Pb2 Tetra-n-butyllead 95% (nC4H9)4Pb
877.03
—
225
435.65
140/1
—
Lead (II) acetate (CH3CO2)2Pb Lead II 6,6,7,7,8,8,8 heptafluoro-2,2dimethyl-3, 5-octanedionate Pb(-OC3F7CH(C(CH3)3)O-)2 Lead (II) hexafluoropentanedionate Pb(–OC(CF3)CH(CF3)CO–)2 Lead methoxide [Pb(OCH3)2]n Lead (II) neodecanoate, 60% in naptha Pb(–OOCC(CH3)2C6H13)4 Lead (II) 2,4-pentanedionate Pb(–OC(CH3)CH(CH3)CO–)2 Lead (IV) propionate, 90% Pb(–OOCCH2CH3)4 Lead stannate, dihydrate Pb(–OOCCH3)4 Lead tetraacetate Pb(–OOCCH3)4 Lead (II) 2,2,6,6-tetramethyl,3,5heptanedionate Pb(–OC(C(CH3)3)CH(C(CH3)3)CO–)2
280 s/— (decomposes) — s/—
>950 —/— (decomposes) 175 —/— (decomposes) — s/—
2.55
Soluble in H2O; 20°C: 356 g/l
1, p. 131
—
)Hvap = 20.5 kcal/mol
1, p. 131
—
Soluble in methanol, toluene, acetone Polymeric; air sensitive
1, p. 132
—
Flash point: 40°C
9(suppl.), p. 45 1, p. 132
—
Soluble in hot toluene
1, p. 132
—
Contains Pb II propionate
1, p. 132
—
Photosensitive
27, p. 97
2.28
—
1, p. 132
—
Soluble in toluene; )Hvap = 17.9 kcal/mol
1, p. 132
Crystalline solid/ yellow
—
2, p. 634; 8, p. 1466
—
s/—
—
—
l/—
1.324
Soluble in benzene; )Hform = 161.8163.0 kJ/mol; decomposes slowly at room temperature Does not decompose below 200°C n20 = 1.5119; decomposes at >145°
II. Organolead Compound
2, p. 667; 8, p. 1481 1, p. 133
© 2005 by CRC Press
Soluble in toluene; )Hform = 52.7 2, p. 634; kJ/mol; nD20 = 1.5198; 8, p. 1468 decomposes at 233–267°C Soluble in toluene; )Hform = 136.3 2, p. 634 kJ/mol; nD20 = 1.5120; decomposes at 240–371°C, 25 mmHg )Hform = 515 kJ/mol, highly toxic; 2, p. 635, soluble in chloroform, dioxane 654; 8, p. 1479; 1, p. 133 )Hform = 28.9 kJ/mol 2, p. 635
Tetraethyllead (C2H5)4Pb
323.45
198–202
130.2
—
l/—
1.650
Tetramethyllead (CH3)4Pb
267.34
110
30.2
—
—/—
1.995
Tetraphenyllead (C6H5)4Pb
515.62
240
227.7
Trimethyl-tert-butyllead (CH3)3Pb(tC4H9)
309.42
—
—
—
—/—
—
1,1-Diphenyl-1-plumbacyclohexane (C6H5)2Pb(C2H4(C6H5)2)
336.48
—
—
—
l/—
—
Decomposes on exposure to light and air to resinous solid; discolors on standing
2, p. 642
1-Plumbacycopentane Pb(CH2(C6H5)2)
375.44
145–165/0.5
—
—
—/—
—
Distills unchanged at 145–165°C/0.5 torr
2, p. 642
483.22
—
—
—
l/clear
—
270 —/— (decomposes)
—
III. Heterocyclic Lead Compounds
IV. Perfluorinated Lead Compounds Trifluoromethyllead Pb(CF3)4
—
2, p. 643; eight(sup pl.), p. 47
V. Miscellaneous Functionally Substituted Lead Compounds Triphenyl,lead(dimethyl)acetamide (C6H5)3Pb(OCN(CH3)2 Triphenyl,leadethylacetate (C6H5)3Pb(OOCC2H5)
510.60
—
—
—
—/—
—
Can be stored indefinitely
2, p. 646
511.59
—
—
—
—/—
—
Decomposes slowly at room 2, p. 646 temperature and rapidly at 100°C to (Ph4)Pb, CO, and (Et)2 carbonate
—
—
Decomposes at 20 to 50
—/—
—
Disproportionates explosively at room temperature; air and light sensitive
VI. Compounds with Lead Bonding to Hydrogen Dimethyllead dihydride (CH3)2PbH2
239.29
2, p. 648; 8, p. 1460
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Tributyllead hydride (C4H9)3PbH
379.55
—
—
—
—/—
—
Trimethyllead hydride (CH3)3PbH
253.31
—
~106
Decomposes at 20 to 50
—/—
—
Compound
State/Color
Densitya (g/cc)
Miscellaneous
Reference
May be stored for few days in the 2, p. 648; dark at 0°C; air and light 8, p. 1473 sensitive Decomposes at 37°C to H2 and 2, p. 648; hexamethyl-dilead; at higher 8, p. 1461 temperature, products are tetramethyllead and Pb; low thermal stability; air and light sensitive
VII. Compounds with Lead Bonding to Oxygen Diethyllead dihydroxide (C2H5)2Pb(OH)2
299.338
—
—
—
s/none
—
Triethyllead hydroxide (C2H5)3PbOH
310.384
—
—
—
s/white (in ethanol)
—
Triethyllead-tert-butylperoxide (C2H5)3PbOO–tC4H9
383.50
—
—
—
s/—
—
Trimethyllead-tert(CH3)3PbOO–tC4H9
341.418
—
81–83
—
s/white
—
Triphenyllead hydroxide (C6H5)3PbOH
455.52
—
—
Decomposes at 300
s/white
—
Triphenyllead-tert-butylperoxide (C6H5)3PbOO–tC4H9
527.630
—
99–101
—
s/white
—
Soluble in H2O; forms hexahydrate, which effloresces to Et2PbO Decomposes at ~50°C in vacuo to Et4Pb and Et2Pb(OH)2; disproportionates on heating Decomposes at ~50°C in vacuo to Et4Pb and Et2Pb(OH)2; disproportionates on heating Thermally unstable, can be stored at low temperature without decomposition Thermally stable; decomposes without melting at 300°C; polymeric chain structure Thermally stable; decomposes without melting at 300°C; polymeric chain structure
2, p. 654; 8, p. 1466 2, p. 648; 8, p. 1465 2, p. 656
2, p. 656; 8, p. 1466 2, p. 654; 8, p. 1476 2, p. 656; 8, p. 1478
VIII. Compounds with Lead Bonding to Nitrogen Tri-n-butyllead,diethylamide (nC4H9)3PbN(C2H5)2
450.68
—
—
—
s/—
—
Triisobutyllead,diethylamide (iC4H9)3PbN(C2H5)2
450.68
—
—
—
s/—
—
Very moisture sensitive; monomeric; freely soluble in aprotic solvents Very moisture sensitive; monomeric; freely soluble in aprotic solvents
2, p. 663
2, p. 663
© 2005 by CRC Press
Triethyllead,diethylamide (diethyl(triethylplumbyl)amine) (C2H5)3PbN(C2H5)2 Triphenyllead,diethylamide (C6H5)3PbN(C2H5)2
366.514
—
—
—
s/—
—
Very moisture sensitive; monomeric; freely soluble in aprotic solvents Very moisture sensitive; monomeric; freely soluble in aprotic solvents Very moisture sensitive; monomeric; freely soluble in aprotic solvents
2, p. 663; 8, p. 1470
510.65
—
—
—
s/—
—
Tripropyllead,diethylamide (C3H7)3PbN(C2H5)2
408.60
—
—
—
s/—
—
379.33
—
75
280(d)
s/—
2.55
349.34
—
—
—
s/—
—
493.60
—
—
—
—/—
1.56
377.36
—
62
—
s/—
—
397.38
—
—
—
—/—
1.700
499.49
—
132
—
s/—
—
443.37
—
—
175(d)
—/—
2.28
433.22
—
72–76
—
s/—
—
Soluble in THF, acetone trifluoroacetic acid
1, p. 133
1, p. 136
1, p. 136 4, p. 47
2, p. 663
2, p. 663
IX. Lead Salts Lead (II) acetate (CH3CO2)2Pb Lead II acrylate (CH2CHCOO)2Pb Soluble in warm ethanol, methanol, waterLead II 2-ethylhexanoate Pb(C4H9CH(C2H5)COO)2 Lead II methacrylate Pb(CH2C(CH3)COO)2 Lead (II) methanesulfonate (CH3SO3)2Pb Lead (IV) propionate, 90% Pb(-OOCCH2CH3)4 Soluble in propionic acidLead (IV) tetraacetate Pb(-OOCCH3)4 Lead (II) trifluoroacetate (CF3COO)2Pb
Soluble in H2O (625g/l), 1, p. 131 methanol (60g/l), ethanol (33g/l) Decomposes at 190-200° 1, p. 131 Soluble in toluene
1, p. 131
Soluble in methanol acetone, THF N20 = 1.4320
1, p. 132 1, p. 132
Contains Pb II propionate
1, p. 132
—
1, p. 132
Lithium Compounds I. Lithium Alkoxides and Diketonates Lithium t-butoxide (CH3)3COLi Lithium ethoxide LiO-C2H5 Lithium isopropoxide LiO-CH(CH3)2
80.05
—
—
110/0.01
s/—
—
52.00
—
—
—
—/—
0.82
Sublimes as hexamer; hexamer in benzene Soluble in ethanol
66.03
—
—
—
—/—
—
—
1, p. 136
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
37.97
—
500 (d)
—
106.05
—
250
192.24
—
Allylithium CH2CHCH2Li
48.01
Butyllithium nC4H9Li
Cyclopentadienyllithium C5H5Li
Compound Lithium methoxide CH3OLi Lithium 2,4-pentanedionate Li(OC(CH3)CH(CH3)CO) Lithium tetramethylheptanedionate Li(-OC(C(CH3)3)CH(C(CH3)3)CO-)
Densitya (g/cc)
Miscellaneous
s/—
—
—
—
s/—
—
Soluble in methanol
1, p. 136
265–268
—
s/—
—
Soluble in methanol, acetone
1, p. 136
—
—
—
s/clear
—
2, p. 47, 99; 8, p. 1211
64.06
80–90/104
76
—
l/—
72.04
—
—
—
s/white
—
174.17
—
—
—
Yellow to red in solution
—
21.98
—
—
—
s/—
—
84.05
—
—
—
s/—
—
Electrochemical oxidation potential: 1.40 V at 62°; air sensitive and may ignite in air; soluble in ether; sp soluble in HC Electrochemical oxidation potential: 1.41 V at 62°C; air sensitive and may ignite in air; stable at room temperature; tetrameric in ether; hexameric in HC Electrochemical oxidation potential: 0.37 V at 62°C; air sensitive and may ignite in air; soluble in tetra-hydrofuran; sparingly soluble in ether Electrochemical oxidation potential: 1.37 V at 62°C; air sensitive and may ignite in air Electrochemical oxidation potential: 0.72 V at 62°C; air sensitive; spontaneous ignition in air; tetrameric in ether and tetrahydrofuran Electrochemical oxidation potential: 0.34 V at 62°C; air sensitive and may ignite in air; soluble in ether; insoluble in HC; dimeric in ether
State/Color
Reference 1, p. 136
II. Alkyl and Aryl Lithium
Diphenylmethyl lithium(lithiodiphenylmethane) (C6H5)2CHLi Methyllithium (CH3)Li
Phenyl lithium (C6H5)Li
0.765
2, p. 47; 8, p. 1213
2, p. 47; 8, p. 1214
2, p. 47; 8, p. 1226 2, p. 47; 8, p. 1207
2, p. 47; 8, p. 1217
© 2005 by CRC Press
Phenylmethl lithium (benzyl lithium) (C6H5)CH2Li
98.07
—
—
—
Crystalline solid/clear (in ether)
—
Electrochemical oxidation potential: 1.33 V at 62°C; air sensitive and may ignite in air; insoluble in hexane; soluble in ether Electrochemical oxidation potential: 1.33 V at 62°C; air sensitive and may ignite in air Electrochemical oxidation potential: 1.57 V at 62°C; air sensitive and may ignite in air
2, p. 47; 8, p. 1219
Tri(phenylmethyl) lithium (C6H5)3CLi
96.06
—
—
—
Crystalline solid/red
—
Vinyl lithium H2C = CHLi
33.99
—
—
—
s/—
—
167.33
114–116/1
—
—
l/—
—
—
1, p. 135
107.13
—
—
—
—/—
—
—
1, p. 136
78.00
—
—
—
—/—
—
—
1, p. 135
92.03
—
—
—
—/—
—
—
1, p. 136
156.01
—
—
—
—/—
—
104.15
—
—
—
—/—
0.829
—
1, p. 137
—/—
—
—
1, p. 168
Crystalline solid/clear
—
—
8, p. 1232
2, p. 47; 8, p. 1227 2, p. 47; 8, p. 1208
III. Alkyl Amide Lithium Compounds Lithium bis(trimethylsilyl)amide LiN(Si(CH3)3)2 Lithium diisopropylamide LiN(CH(CH3)2)2 IV. Lithium Salts Lithium acrylate CH2CHCOOLi Lithium methacrylate CH2C(CH3)COOLi Lithium trifluoromethanesulfonate CF3SO3Li Lithium (trimethylsilyl)acetylide LiCCSi(CH3)3)
Hygroscopic
1, p. 137
Lutetium Compounds I. Lutetium Alkoxides and Diketonates Lutetium 2,4-pentanedionate Lu[OC(CH3)CH(CH3)CO]2 Tricyclopentadienyl lutetium Lu(C5H5)3
472.30
—
—
—
370.25
—
295
260 (in vacuo)
© 2005 by CRC Press
Compound
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
State/Color
Densitya (g/cc)
Miscellaneous
Reference
Magnesium Compounds I. Magnesium Alkoxides and Diketonates 98.43
—
—
Sublimes
—
Trimeric in ether; soluble in ether, 8, p. 1244 sp soluble in benzene
—
Crystalline solid (in ether)/— s/—
Magnesium ethoxide Mg(OC2H5)2 Magnesium hexafluoropentanedionate Mg(-OC(CF3)CH(CF3)CO-)2 Magnesium methoxide Mg(OCH3)2 Magnesium methoxyethoxide Mg(-OC2H4OCH3)2 Magnesium methyl carbonate CH3OCO2MgOCH3.xCO2
114.44
—
270
—
—
—
—/—
—
Soluble in ethanol: 0.9 g/l; soluble in methanol: 31 g/l —
438.41
—
1, p. 138
86.38
—
—
—
l/—
0.815
N20 = 1.3380; flash point: 7°C
1, p. 139
174.47
—
—
—
—/—
1.03
—
1, p. 139
130.39
—
—
—
—/—
1.103
1, p. 139
222.53/ 258.56
—
259
—
s/ivory white
—
142.47
—
—
—
s/—
—
330.47
—
—
—
—/—
—
Flash point: 57°C, soluble form; CO2 removed at high temperature Solubility: in H2O = 11 g/1, in ethanol = 5 g/l, in toluene = 01 g/l Solubility: propanol = 0.3 g/l, in methanol = 4 g/l —
Magnesium 2,4-pentanedionate, dihydrate Mg(OC(CH3)CH(CH3)CO)2 Magnesium n-propoxide Mg(OCH2CH2CH3)2 Magnesium trifluoropentanedionate Mg(-OC(CH3)CH(CF3)CO-)2
Bis(cyclopentadienyl)magnesium (C5H5)2Mg
154.49
—
176
—
s/amber brown
—
Bis(methylcyclopentadienyl)magnesium (C5H4CH3)2Mg Diethyl magnesium (C2H5)2Mg
182.55
—
29
—
s/—
—
82.43
—
—
—
s/—
—
Ethylmagnesiumethoxide C2H5MgOCH3
1, p. 138
1, p. 139
1, p. 139 1, p. 140
II. Alkyl Magnesium Compounds H2O reactive; pyrophoric; 6, p. 83; 5, sp. soluble in CS2, CCl4, CHCl3; p. 241 moderately soluble in benzene, ether, C6H12; very soluble in pyridine, tetrahydrofuran H2O reactive; soluble 6, p. 83 Polymeric; pyrophoric; decomposes at 176°C
3, p. 72; 8, p. 1224
© 2005 by CRC Press
Dimethyl magnesium (CH3)2Mg
54.37
—
—
Sublimes
—
Trimeric in ether; soluble in ether; 8, p. 1244 sp soluble in benzene
—
Crystalline solid (in ether)/— s/—
Diphenyl magnesium (C6H5)2Mg
178.52
—
—
—
—
—
—/—
—
Decomposes at 280°C; pyrophoric; reacts violently with water Soluble in ether
Diisopropyl magnesium ((CH3)2CH)2Mg
110.48
—
166.43
—
>220(d)
—
s/—
—
202.46
—
41
—
s/white
—
Soluble in warm methanol, water, 1, p. 138 toluene Soluble in water 1, p. 138
194.48
—
250–252
—
s/—
—
Soluble in warm toluene
1, p. 139
322.45
—
—
—
—/—
—
Hygroscopic
1, p. 140
27, p. 32; 4, p. 111 1, p. 142
8, p. 1253
8, p. 1248
III. Magnesium Salts Magnesium acrylate (CH2CHCOO)2Mg Magnesium lactate (CH3CH(OH)COO)2Mg Magnesium methacrylate Mg(CH2C(CH3)COO)2 Magnesium trifluoromethanesulfonate (CF3SO3) 2Mg
Manganese Compounds I. Manganese Alkoxides and Diketonates Manganese II methoxide 95% Mn(OCH3)2 Manganese II 2,4-pentanedionate 95% Mn(–OC(CH3)CH(CH3)CO–)2
117.01
—
—
—
-/purple
—
Soluble in methanol
253.16
—
>180
—
s/beige
1.6
Manganese III 2,4-pentanedionate Mn(–OC(CH3)CH(CH3)CO–)3
352.27
—
172
—
s/—
—
Solubility: in H2O = 12 g/l, in ethanol = 22 g/l; hydrolyzes in H2O; trimeric Soluble in benzene, ethyl 1, p. 142 acetate; )Hform = 325 kcal/mol
389.98
—
154–155
—
s/yellow
—
446.00
—
152
—
s/—
196.00
—
24.6
—
l/none
II. Managanese Carbonyls Dimanganesedecacarbonyl Mn2(CO)10 Dimanganesedodecacarbonyl Mn2(CO)12 Manganesehydridepentacarbonyl MnH(CO)5
—
Decomposition in an open system occurs at 110°C —
2, p. 7 3, p. 63
—
Volatile
2, p. 67
© 2005 by CRC Press
Compound Tricarbonyl(methylcyclopentadienyl) maganese (CO)3CH3C5H4Mn
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
218.09
232.22
1.5
—
l/—
198.15
—
—
—
Crystalline solid/deep red
—
173.02
—
—
—
s/pale pink
—
266.31
—
131
—
s/yellow
—
218.09
233
—
—
l/—
State/Color
Densitya (g/cc) 1.38
Miscellaneous Flammable; poisonous
Reference 6, p. 84
III. Manganese Aryl Compounds (M6-Benzene)( M5-cyclopentadienyl) manganese (C6H6)Mn(C5H5)
—
8, p. 1268
IV. Miscellaneous Manganese Compounds Manganese II acetate (CH3COO)2Mg Manganese II ethylenebis(dithiocarbamate) -(NHCS2MnS2CNHC2H4)nMethylcyclopentadienylmanganese tricarbonyl C5H4(CH3)Mn(CO)3
1.38
N20 = 1.589
1, p. 141 —
N20 = 1.5840; flash point: 96°C
1, p. 142
1, p. 142
Mercury Compounds I. Mercury Carboxylates and Alkoxides Ethyl mercury acetate C2H5HgOOCCH3
288.70
—
69–69.8
—
Crystalline solid (in CCl4)— s/—
—
Mercury II acetate (CH3COO)2Hg Methyl mercury acetate CH3HgOOCCH3)
318.70
—
178–180
—
274.67
—
125.5–127.5
—
Crystalline solid/—
—
Methyl mercury ethoxide CH3HgOC2H5 Phenylmercuric acetate C6H5HgOOCCH3
260.69
—
24.25
—
—/—
—
Soluble in water, ethanol, ethyl 1, p. 142 acetate Very soluble in water, ethanol, 8, p. 1040 acetic acid; soluble in ethylacetate, pyridine, benzene, CCl4, CS2; moderately soluble in ether Strong desiccant 8, p. 1042
336.75
—
150
—
s/—
2.4
Soluble in benzene, acetic acid
3.29
—
8, p. 1050
1, p. 142
© 2005 by CRC Press
Phenyl mercury methoxide C6H6HgOCH3
308.73
—
144–145
—
—/—
—
Dimeric in benzene
8, p. 1078
Bisdodecene mercury (n-C12H25)2Hg Bistetrafluorophenyl mercury (C6HF4)2Hg Bis(2-thienyl)mercury (C4H3S)2Hg
539.25
—
44.5–45
—
s/—
—
Soluble in benzene
2, p. 901
498.73
—
—
300/vacuum
s/—
—
—
366.85
—
202
—
—
—
Bistolyl mercury (CH3C6H4)2Hg
382.86
—
—
—
—
2, p. 902; 16
Bistrifluoromethylmercury (CF3)2Hg
338.60
—
—
—
—
2, p. 902; 16
Cyclopentadienylmercury (C5H5)2Hg
330.78
—
—
—
3, p. 73; 8, p. 1100
Diethylmercury (C2H5)2Hg Dimethylmercury (CH3)2Hg
258.71
159
—
—
l/—
—
230.66
92.5
—
—
l/—
3.069
Di(1-naphthyl)mercury (1-C10H8)2Hg Diphenylmercury (C6H5)2Hg Methyl mercury azide CH3HgN3
456.94
—
243
—
s/—
—
354.80
—
125
—
s/—
—
257.64
—
130
—
s/—
—
295.53
—
172
—
s/—
—
251.08
—
170
—
s/—
—
241.64
—
—
—
Needle shaped crystal
—
Soluble in benzene; sensitive to light, moisture, and heat; turns gray on storage; decomposes at 83–84°C Slowly deposits Hg; toxic; soluble in benzene Flammable; toxic; stable at room temperature; nD = 1.5413; soluble in benzene Thermally stable; soluble in benzene Thermally stable; soluble in benzene Leaflets in ethanol; soluble in MeOH, hot EtOH, Me2CO, CCl4; detonates by shock with difficulty Plates in ethanol, dipole moment: 3.16 D Plates in ethanol, dipole moment: 3.16 D Monoclinic in solid shape
II. Alkyl Mercury Compounds
Methyl mercury bromide CH3HgBr Methyl mercury chloride CH3HgCl Methyl mercury cyanide CH3HgCN
Crystalline solid (in benzene)/ — — Solid monoclinic crystals Purified by Crystalline sublimation in solid/— vacuo — Crystalline solid/ yellow
2, p. 902; 14 2, p. 902; 8, p. 1084
2, p. 901 2, p. 901; 6, p. 85; 8, p. 1036 2, p. 901 2, p. 901 2, p. 904; 8, p. 1031
2, p. 904; 8, p. 1030 2, p. 904; 8, p. 1084 2, p. 904; 15
© 2005 by CRC Press
Compound Methyl mercury iodide CH3HgI
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
342.53
—
145
—
State/Color
Densitya (g/cc)
s/none
—
Miscellaneous Rectangular plate crystals
Reference 2, p. 904
Molybdenum Compounds I. Molybdenum Alkoxides and Diketonates Molybdenum V ethoxide Mn(OC2H5)5 Molybdenum VI oxide bis(2,4pentanedionate); Molybdenyl acetylacetonate OMo(OC(CH3)CH(CH3)CO)2
321.25
—
—
—
—/—
—
—
1, p. 143
326.17
—
181
—
s/yelloworange
—
—
1, p. 143
264.00
—
150
258.08
—
—
276.19
—
—
60–100/high vacuum ~100/103
321.06
—
—
~100/103
II. Molybdenum Carbonyls Molybdenum hexacarbonyl Mo(CO)6
Decomposes at 180
Solid/white Crystalline solid/ colorless
1.96
s/yellow or orange —/green
—
3, p. 63; 2, Octahedral; volatile; air stable; p. 1081 hydrophobic; decomposes without melting at 150°C yet melts reversibly under vacuum at 146°C; very slightly soluble in nonpolar solvents and polar organic solvents; insoluble in water; odorless; diamagnetic; )Hsub = 68.2–73.6; )Hcomb = –2116 to –2123; )Hform = –960 to –991; )H° = 297–326; )Hm = 26.8
III. Molybdenum Arene Compounds Benzenetricarbonyl molybdenum M6-C6H6Mo(CO)3 Bis(trimethylbenzene) molybdenum Mo(M-1,3,5-Me3C6H3)2 Bis(chlorobenzene) molybdenum Mo(M-ClC6H5)2
—/light green
2, p. 1214
—
Air stable in solid state; air sensitive in solution Air sensitive
—
Air sensitive; pyrophobic
2, p. 1205
2, p. 1205
© 2005 by CRC Press
Dibenzyl molybdenum Mo(M-CH2-C6H6)2
252.17
—
—
~100/103
—
103
—
—/green
—
Air sensitive
2, p. 1205
s/—
—
—
1, p. 143
IV. Miscellaneous Molybdenum Compound Molybdenyl II diethyldithiocarbamate Mn(S2CNH(C2H5) 2)2
424.48
Neodymium Compounds I. Neodymium Alkoxides and Diketonates Neodymium 6,6,7,7,8,8,8-heptafluoro2,2-dimethyl-3,5-octanedionate (OC(C3F7)CHC(C(CH3)3)O)3Nd Neodymium hexafluoropentanedionate Nd(OC(CF3)CH(CF3)CO)3 Neodymium methoxyethoxide Nd(-OC2H4OCH3)3 Neodymium III 2,4-pentanedionate Nd(OC(CH3)CH(CH3)CO)3 Neodymium 2,2,6,6-tetramethyl-3,5heptanedionate Nd(OC(C(CH3)3)CH(C(CH3)3)CO)3 )Hsub = 37.9 kcal/molNeodymium III trifluoropentanedionate Nd(OC(CF3)CH(CH3)CO)3
1029.77
—
82-3
—
s/—
—
—
1, p. 169
765.39
—
—
—
—/—
—
—
1, p. 169
369.50
—
—
—
l/pale blue
—
—
1, p. 169
441.57
—
150–152
—
s/—
1.618
—
1, p. 170
694.06
—
209-212
150/0.1
s/—
—
603.48
—
140–142
—
s/—
—
—
1, p.170
321.38
—
—
—
—
—
1, p. 169
369.48
—
>200(d)
—
657.97
—
—
—
—/light purple —/pale purple —/—
—
380
200–250 (in vacuo)
Crystalline solid/pale blue
—
Decomposes > 270°C
1, p. 170
II. Neodymium Salts Neodymium acetate (CH3COO)3Nd Neodymium methacrylate (CH2C(CH3)COO)3Nd Neodymium neodecanoate (C6H13C(CH3)2COO)3Nd
— —
Slightly soluble in THF —
1, p. 169 1, p. 170
III. Miscellaneous Neodymium Compounds Tricyclopentadienylneodymium (C5H5)3Nd
339.52
Soluble in tetrahydrofuran; hydrolyzed in water
8, p. 1318
© 2005 by CRC Press
Compound
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
State/Color
Densitya (g/cc)
Miscellaneous
Reference
Nickel Compounds I. Nickel Alkoxides and Diketonates Nickel hexafluoropentanedionate Ni(OC(CF3)CH(CF3)CO)2 Nickel II methoxide Ni(OCH3)2 Nickel II 2,4-pentanedionate Ni(OC(CH3)CH(CH3)CO)2
472.82
—
213
—
s/green
—
—
1, p. 145
120.76
—
—
—
—
—
4, p. 111
256.88
—
208
—
—/pale green s/green (turns turquoise on absorption of 3 mol H2O)
Nickel II 2,2,6,6-tetramethyl-3,5heptanedionate Ni(OC(C(CH3)3)CH(C(CH3)3)CO)2
425.23
—
223–225
90–110/0.1
279.09
—
—
—
542.05
—
210–220
303.59
—
153.59
1.455
n20 = 1.57–164; trimeric compound; solubility: H2O = 11.0 g/l, toluene = 85 g/l, ethanol = 27 g/l; )Hsub = 16.5 kcal/mol
1, p. 145
s/—
—
—
1, p. 145
—
—
2, p. 110
—
s/yelloworange s/red
—
—
1, p. 144
—
—
s/purple
—
60/30
—
—
l/red
—
176.78
—
—
—
—/—
—
467.43
—
86
—
s/green
1.26
299.12
—
>290
—
—/—
1.77
II. Organonickel Compounds Bis(cyclooctadiene)nickel Ni(C8H14)2 1,3-Bis(diphenylphosphino)propanenickel II chloride ((C6H5)2P(-C3H6-)P(C6H5)2)NiCl2 Cyclopentadienylnickle carbonyl (NiCO(M-C5H5))2 Cyclopentadienylnickel nitrosyl ONNi(M-C5H5) Nickel diacetate Ni(OOCCH3)2 Nikel di-n-butyldithiocarbamate Ni(S2CNH(C4H9) 2)2 Nickel dimethyldithiocarbamate Ni(S2CNH(CH3) 2)2
Diamagnetic; decomposes at >115°C Stable; distilled at ~60°C at 30 mmHg without decomposition —
2, p. 199
Soluble in toluene, CHCl3, warm acetone —
1, p. 144
2, p. 209 2, p. 110
1, p. 144
© 2005 by CRC Press
Nickel tetracarbonyl Ni(CO)4 Nickelocene (Ni(M-C5H5))2
170.73
43
25, 17.2
188.88
—
173–174
Decomposes >35°C 50/0.1
Tolyl(pentafluorobenzyl) nickle Ni(C6F5)2(M-CH3C6H5)
484.95
—
137–140
—
s/red
176.78
—
—
—
—/green
1.744
184.77
—
180–200(d)
—
s/—
2.15
—
l/colorless
1.32
Very toxic
s/dark green
1.47
Paramagnetic; )Hform = 262; soluble in most organic solvents; magnetic susceptibility —
—
2, p. 4; 3, p. 63 2, p. 189–191
2, p. 229
III. Nickel Salts Nickel II acetate Ni(OOCCH3)2 Nickel formate (HCOO)2Ni
— Soluble in water
2, p. 110 1, p. 144 1, p. 79
Niobium Compounds I. Niobium Alkoxides and Diketonates Niobium V n-butoxide Nb(O-nC4H9)5
458.48
197/0.15
—
—
l/—
4, p. 71, 72
—
Molecular complexity: 2.01 (in benzene), 1.74 (toulene), 1.13 (ROH) n20 = 1.5160; flash point: 74°C; molecular complexity: 2.02 (in benzene), 1.89 (toluene), 1.34 (ROH) Molecular complexity: 2.11 (in benzene), 1.90 (in toluene), 1.34 (in ROH) Molecular complexity: 2.00 (in benzene) Molecular complexity: 1.16
Niobium V ethoxide Nb(OC2H5)5
318.22
142/0.1 156/0.05
5–6
—
—/pale yellow
Niobium V methoxide Nb(OCH3)5
248.08
153/0.1
—
—
l/—
—
Niobium V n-pentoxide Nb(O-n-C5H11)5 Niobium V sec-pentoxide Nb(OCH(C2H5)2)5 Niobium V sec-pentoxide Nb(OCH(nC3H7)CH3)5 Niobium V pentaoxide Nb(OCH2CH2CH(CH3)2)5 Niobium V n-propoxide Nb(O-n-C3H7)5
528.62
223/0.15
—
—
l/—
—
528.62
138/0.1
—
—
l/—
528.62
137.5/0.1
—
—
l/—
—
Molecular complexity: 1.03
4, p. 71
528.62
199/0.1
—
—
l/—
—
Molecular complexity: 1.81
4, p. 71
374.24
166/0.05
—
—
l/—
—
4, p. 71, 72
—
—
l/—
—
Molecular complexity: 1.02 (in benzene), 1.79 (toluene), 1.29 (ROH) Molecular complexity: 1.00
Niobium V isopropoxide Nb(OCH(CH3)2)5
374.24
60–70/0.1
1.258
1, p. 146; 4, p. 72
4, p. 71, 72
4, p. 71, 72 4, p. 71
4, p. 71
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
374.24
110–120/0.3
—
—
Bis(M2-benzene)niobium (C6H6)2Nb
249.13
—
—
Bis-cyclopentadienyl dimethyl niobium IV (C5H5)2Nb(CH3)2 Biscyclopentadienyltribromo niobium (C5H5)2NbBr3
253.17
—
—
462.81
—
—
Biscyclopentadienyltrihrydrido niobium (C5H5)2NbH3
226.12
—
—
Cyclopentadienyltetrachloro niobium (C5H5)NbCl4 Dimethyltrichloroniobium NbCl3(CH3)2 Methyltetrabromoniobium NbBr4CH3
299.81
—
—
229.34
—
—
—
427.56
—
—
—
Methyltetrachloroniobium NbCl4CH3
249.75
—
—
—
273.58
—
—
—
Compound Niobium V tert-propoxide Nb(OC(CH3)3)5
State/Color l/—
Densitya (g/cc) —
Miscellaneous Molecular complexity: 1.00
Reference 4, p. 71
II. Niobium Alkyl Compounds 80 Crystalline (decomposes) solid/redpurple 80/10-4 Crystalline solid/redbrown — Crystalline solid/redbrown (in CHCl3) — Crystalline solid/ yellow (in toluene) — s/—
—
—
8, p. 1312
—
Explodes at 128°
2, p. 737; 21
—
Decomposes at 260°C; stable in 2, p. 766; dry air; soluble in polar solvents; 8, p. 1311 hydrolyzed by water
—
Soluble in aromatic solvents; 2, p. 774; decomposes at 80°C in solution 8, p. 1311
—
s/yelloworange Crystalline solid/ orangebrown Crystalline solid/ orangebrown
—
Decomposes at 180°C; slightly soluble in organic solvents —
—
Air and moisture sensitive
Crystalline solid/ brown (in toluene)
—
—
—
2, p. 763; 8, p. 1310 2, p. 733; 21 2, p. 733; 20
2, p. 733; 15
III. Niobium Alkyls and Derivatives (IV) Biscyclopentadienyl chloromethyl niobium IV (C5H5)2NbClCH3
Soluble in toluene
2, p. 736; 8, p. 1312; 18
© 2005 by CRC Press
Biscyclopentadienyl dibenzothiolato niobium IV (C5H5)2Nb(C6H4S)2
441.43
—
135–140
—
Biscyclopentadienyl dibenzyl niobium IV (C5H5)2Nb(CH2C6H5)2
405.36
—
140–142
—
Bis(methylcyclopentadienyl) dimethylniobium IV (CH3C5H4)2Nb(CH3)2 Biscyclopentadienyl dineopentyl niobium IV (C5H5)2Nb(CH2C(CH3)3)2 Biscyclopentadienyl diphenyl niobium IV (C5H5)2Nb(C6H5)2
281.22
—
—
—
Crystalline solid/green (in CH2Cl2 and petroleum ether) Crystalline solid/blackred —/—
—
—
2, p. 736; 8, p. 1315
—
—
2, p. 735; 17
—
—
2, p. 735; 17
365.38
—
—
—
—/—
—
—
2, p. 735
377.31
—
—
—
—/—
—
—
2, p. 736
327.25
—
—
—
—
—
2, p. 751; 23
—
—
—
—
—
20
238.13
—
—
—
Crystalline solid/redbrown Crystalline sold/purple —/—
405.36
—
—
2, p. 736
266.18
—
—
—
—/—
—
—
2, p. 736
249.13
—
—
120/0.01
s/—
—
—
8, p. 1313
813.97
—
—
—
l/yellow
—
—
1, p. 147
538.05
—
—
—
—/—
—
IV. Niobium Alkyls and Derivatives (III) Biscyclopentadiene,cyclooctatetraene(c ot) niobium (C5H5)2Nb(h2-C8H8) Biscyclopentadienyl dibenzyl niobium (C5H5)2Nb(CH2C6H5)2 Biscyclopentadienyl methyl niobium III (C5H5)2NbCH3 Biscyclopentadienyl methylethylene niobium III (C5H5)2NbCH3C2H4 (Cycloheptatrienyl)(cyclopentadienyl) niobium (C7H7)Nb(C5H5) V. Niobium Salts Niobium 2-ethylhexanoate (C4H9CH(C2H5)COO)5Nb Niobium oxalate Nb(OOCCOOH)5
Soluble in water, methanol
1, p. 147
© 2005 by CRC Press
Compound
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
342.24
—
90/103
—
266.14
—
75/103
328.21
—
120/103
Formula Weight
Densitya (g/cc)
Miscellaneous
s/green
—
—
20
—
s/green
—
—
18; 20
—
s/green
—
—
20
l/colorless
—
Very volatile
s/yellow
—
s/pale yellow
—
Air stable; slightly soluble in organic solvents Air stable, readily sublimes
s/—
—
s/yelloworange
—
State/Color
Reference
VI. Miscellaneous Niobium Carbonyl Compounds Biscyclopentadienyl benzylcarbonyl niobium (C5H5)2(CH2C6H5)Nb(CO) Biscyclopentadienyl methylcarbonyl niobium (C5H5)2Nb(CH3)(CO) Biscyclopentadienyl phenylcarbonyl niobium (C5H5)2(C6H5)Nb(CO)
Osmium Compounds I. Osmium Carbonyl Compounds Osmium pentacarbonyl Os(CO)5 Trinuclear-osmiumtetracarbonyl (Os(CO)4)3 Trinuclear-osmiumtetracarbonyldihydride (CO)4HOs–(CO)4Os–Os(CO)4H
330.25
—
15
—
906.72
—
—
908.74
—
95–98
403 K in vacuo —
2, p. 968; 3, p. 63 2, p. 971 2, p. 972
Palladium Compounds I. Palladium Alkoxides and Diketonates Palladium 1,1,1,5,5,5-hexafluoro-2,4pentanedionate Pd(OC(CF3)CH(CF3)CO)2 Palladium 2,4-pentanedionate Pd(OC(CH3)CH(CH3)CO)2
520.51
—
100
70/70
304.92
—
>205
—
Soluble in methylene chloride, 1, p. 147 methanol, toluene, acetone, ethylacetate; )Hfus = 10.2 cal/g Solubility: toluene = 6.5 g/l, 2, p. 240; pentanedionate = 8 g/l 1, p. 148
© 2005 by CRC Press
II. Miscellaneous Palladium Compounds Palladium II acetate Pd(OOCH3)2 Palladium acetate Pd3(OOCH3)6
224.49
—
—
—
673.53
—
—
—
Palladium trifluoroacetate Pd(OOCF3)2 Tetrakis(triphenylphosphine)-palladium [(C6H5)3P]4Pd
332.43
—
—
—
1155.58
—
—
—
—/orangebrown Crystalline solid/ orange-red —/—.
—
—
—
1, p. 148
—/yellowbrown
—
—
1, p. 148
Flash point: 70°C n20 = 1.4216 Pyrophoric
1, p. 148
Flash point: 90°C n20 = 1.4080 Flash point: 44°C n20 = 1.43
1, p. 149
Flash point: 38°C
1, p. 149
—
—
1, p. 147
Trinuclear in solution and soluble 2, p. 239 1, in organic solvents p. 147
Phosphorus Compounds I. Alkyl Phosphorus Compounds Diethylphosphatoethyltriethoxysilane (C2H5O)2P(O)CH2CH2Si(OC2H5)3 Diethylphosphorushydride (C2H5)2PH Diethylphosphite (C2H5O)2P(O)H Diethyl(trimethylsiloxycarbonyl)methyl)phosphonate (C2H5O)2P(O)CH2C(O)OSi(CH3)3 Dimethyl(trimethylsilyl)phosphite (CH3O)2P(O)Si(CH3)3 tert-Butyl phosphine PH2(t-C4H9) Triethylphosphate (C2H5O)3PO Triethylphosphorus (C2H5)3P Trimethylphosphorus (CH3)3P Triphenylphosphine oxide (C6H5)3PO Tris(trimethylsilyl)phosphate ((CH3)3SiO)3PO Tris(trimethylsilyl)phosphite ((CH3)3SiO)2P
328.41
141/2
—
—
l/—
1.031
90.11
85
—
—
l/—
—
138.11
50–51/2
—
—
l/—
1.072
268.33
93/0.0005
—
—
l/—
1.059
182.23
73–77/56
—
—
l/—
0.954
90.11
—
—
—
—/—
182.16
215
57
—
l/—
1.072
118.16
127
88
—
l/—
0.801
76.08
37.8
85
—
l/—
—
278.28
—
151–154
—
s/—
—
314.54
85–87/4
2–4
—
l/—
0.959
298.55
90–92/20
—
—
l/—
0.893
—
— Flash point: 116°C n20 = 1.4050 Pyrophoric, vapor pressure of 108 mm at 20°C Pyrophoric —
6, p. 86
1, p. 149
3, p. 72 1, p. 150 3, p. 72; 6, p. 86 6, p. 86 1, p. 151
n20 = 1.4090; flash point: >110°C; 1, p. 151 )Hvap = 9.7 kcal/mol N20 = 1.4090 1, p. 151 Flash point: 66°C )Hvap = 9.7 kcal/mol
© 2005 by CRC Press
Compound
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
284.18
—
>340(d)
—
—/—
1.396
Soluble in THF, CH2Cl2, methanol
1, p. 148
186.20
280
—
—
l/—
1.070
n20 = 1.6250
1, p. 149
316.46
160/1
—
—
l/—
—
376.50
182/1.3
—
—
l/—
1.05
232.31
—
—
—
—/—
1.14
276.45
—
—
—
—/—
0.989
298.45
—
—
—
—/—
—
Formula Weight
State/Color
Densitya (g/cc)
Miscellaneous
Reference
II. Miscellaneous Alkyl Phorphous Compounds 1-Butyl-3-methyllimidazolium hexafluorophosphate (CH3)(C3H3N2)C4H9)PF6 Diphenylphosphine (C6H5)2PH 2-(Diphenylphosphino)ethyldimethylethoxysilane (C6H5)2PC2H4Si(CH3)2OC2H5 2-(Diphenylphosphino)ethyltriethoxysilane (C6H5)2PC2H4Si(OC2H5)3 Sodium di(isobutyl)dithiophosphinate ((CH3)2CHCH2)2PS2Na Tetrabutylphosphinium hydroxide (nC4H9)4POH Vinyl(diphenylphosphinoethyl)dimethylsilane (C6H5)2PCH2CH2Si(CH3)2(CHCH2)
—
Flash point: 134°C
— n20 = 1.4120
1, p. 149
1, p. 149
1, p. 150 3, p. 150
—
1, p. 151
Platinum Compounds I. Platinum Alkoxides and Diketonates 393.31
—
250–252
—
s/pale yellow
—
Soluble in methylene chloride
1, p. 153
Bis[(1,2,5,6–M)-1,5-cyclooctadiene platinum Pt(C8H12)2
411.47
—
—
—
—
Can be handled in air but solutions are oxygen sensitive
2, p. 425; 8, p. 1584
Bis(dibenzylideneacetone)platinum Pt(C6H5CH = CHCOCH = CHC6H5)2
663.68
—
—
—
Crystalline solid (in petroleum ether)/— —/deep purple
—
Air stable
2, p. 622
Platinum 2,4-pentanedionate Pt(OC(CH3)CH(CH3)CO)2 II. Organoplatinum Compounds
© 2005 by CRC Press
Bispentanedionate,trimethyl platinum ((CH3)3Pt(OC(CH3)CHC(CH3)O))2 Dimethylplatinum II cyclooctadiene C8H12Pt(CH3)2 Tetra(triphenylphosphine)platinum Pt(P(C6H5)3)4 Trisdibenzylideneacetone platinum Pt(C6H5CH = CHCOCH = CHC6H5)3 Triethyleneplatinum Pt(C2H4)3
438.40
—
—
—
—/—
—
333.34
—
103–105
—
s/—
—
1244.24
—
—
s/yellow
—
897.97
—
159–160 (in vacuo) —
—
–/yellow
—
279.24
—
—
—
Crystalline solid (in pentane/—
—
2, p. 588
Soluble in acetone, CO2, toluene, pentane Air sensitive; dissociates in benzene —
1, p. 152 2, p. 627; 8, p. 1628 2, p. 622
—
Volatile; can be stored in ethane at 20°C
2, p. 620; 8, p. 1564
—
Plutonium Compounds Bisbutylcyclooctatetraene plutonium Pu(BunC8H7)2 Biscyclooctatriene plutonium Pu(C8H8)2
564.52
—
—
—
—/—
—
452.30
—
—
—
s/cherry red
—
Bisethylcyclooctatetrane plutonium Pu(C2H5C8H7)2 Tricyclopentadienyl plutonium (C5H5)3Pu
508.41
—
—
—
—/—
—
439.284
—
—
140–165 (in vacuo)
s/moss green
2, p. 235
Soluble in tetrahydrofuran, toluene, benzene, CCl4; air sensitive; diamagneitc —
2, p. 232; 8, p. 1631
—
Soluble in tetrahydrofuran; decomposes at >195°C; extremely air sensitive
8, p. 1631
Solubility: hexane = 1.8 g/l, t-butanol = 140 g/l, tetrahydrofuran = 220 g/l; bulk density = 500 g/l; hygroscopic Soluble in ethanol, ether; bulk density: 0.65 g/ml Soluble in methanol
1, p. 154
2, p. 235
Potassium Compounds I. Potassium Alkoxides and Diketonates Potassium t-butoxide KO-t-C4H9 Potassium ethoxide 95% KOC2H5 Potassium methoxide CH3OK Potassium 2-methyl-2-butoxide KOC(CH3)2CH2CH3 Potassium 2,4-pentanedionate, hemihydrate K(OC(CH3)CH(CH3)CO)
112.21
275
220
—
—/—
—
84.16
—
250
—
s/—
—
70.14
—
—
—
s/—
—
126.24
—
—
—
s/—
0.80
138.21/ 147.22
—
250
—
s/—
—
1, p. 154 1, p. 155
Flash point: 18°C
1, p. 155
Soluble in water, methanol
1, p. 155
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
222.37
—
—
—
Solid powder/ light brown
—
Soluble in ethanol; ionic
Butylpotassium C4H9K
96.21
—
—
—
s/—
—
Methylpotassium CH3K Potassium bis(trimethylsilyl)amide K(N(Si(CH3)3)2)
54.13
—
—
—
—
199.49
—
—
—
Crystalline solid/— l/—
Amorphous solid; decomposes 2, p. 55; 8, below melting point; insoluble in p. 1199 and unreactive toward all solvents Ionic crystal; insoluble 2, p. 55
0.877
Flash point: 7°C; soluble in toluene
1, p. 155
98.15
—
292
—
s/—
1.57
1, p. 153
110.15
—
194
—
s/—
—
Soluble in water (725g/l), methanol (200g/l) —
1, p. 154
160.22
—
—
—
—/—
—
Soluble in water, methanol
1, p. 154
84.12
—
167.5
—
s/—
1.91
Soluble in water, ethanol
1, p. 154
124.18
—
—
—
—/—
—
246.32
—
>300(d)
—
—/—
—
114.21
—
173–176
—
s/—
—
—
1, p. 156
152.12
—
143–145
—
s/—
—
—
1, p. 156
188.17
—
—
—
—/—
—
128.29
—
134–138
—
s/—
—
140.30
—
—
—
s/—
—
Compound Potassium 2,2,6,6-tetramethylheptanedionate K(OC(C(CH3)3)CH((C(CH3)3)CO)
State/Color
Densitya (g/cc)
Miscellaneous
Reference 1, p. 155
II. Alkyl Potassium
III. Potassium Salts Potassium acetate CH3COOK Potassium acrylate CH2CHCOOK Potassium benzoate C6H5COOK Potassium formate HCOOK Potassium methacrylate CH2C(CH3)COOK Potassium sulfopropylmethacrylate CH2C(CH3)COOC3H6SO3K Potassium thioacetate CH3C(S)OK Potassium trifluoroacetate CF3COOK Potassium trifluoromethanesulfonate CF3SO3K Potassium trimethylsilanolate (CH3)3SiOK Potassium vinyldimethylsilanolate CH2CHSi(CH3)2OK
— Soluble in water (700g/l)
Hygroscopic
1, p. 155
1, p. 156 —
Soluble in THF
1, p. 154
1, p. 156 1, p. 156
© 2005 by CRC Press
Praseodymium Compounds I. Praseodymium Alkoxides and Diketonates Praseodymium III 6,6,7,7,8,8,8heptafluoro-2,2-dimethyl-3,5octanedionate Pr(OC(CF2CF2CF3)CH(C(CH3)3)CO)3 Praseodymium 2,4-pentanedionate Pr(OC(CH3)CH(CH3)CO)3 Praseodymium hexafluoropentanedionate (OC(CF3)CH(CF3)CO)3Pr Praseodymium methoxyethoxide Pr(-OC2H4OCH3)3 Praseodymium 2,2,6,6,tetramethyl 3,5heptanedionate Pr(OC(C(CH3)3)CH(C(CH3)3)CO)3 Tricyclopentadienyl praseodymium (C5H5)3Pr
1026.45
—
215–219
—
s/—
—
—
1, p. 171
438.24
—
143–146
—
s/—
—
—
1, p. 171
762.06
—
—
—
s/light green
—
—
1, p. 171
366.17
—
—
—
l/pale green
1.01
—
1, p. 171
690.72
—
212–214
150/1
336.19
—
420
200–250 (in vacuo)
s/—
—
)Hsub = 39.5 kcal/mol
1, p. 171
Crystalline solid/pale green
—
Soluble in tetrahydrofuran; hydrolyzes in water
8, p. 1548
s/yelloworange
—
Air and moisture sensitive; soluble in tetrahydrofuran; hydrolyzes in water
2, p. 180; 8, p. 1546
—
Volatile; cubic
3, p. 64; 2, p. 163
Promethium Compounds I. Promethium Cyclopentadienyls Triscyclopentadienyl promethium Pm(C5H5)3
342.28
—
—
200–250 140–260 (in vacuo)
Rhenium Compounds I. Carbonyl Compounds Dirhenium decacarbonyl Re2(CO)10
652.52
—
170
250 s/colorless (decomposes)
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Biscyclopentadienyl hydrodorhenium ReH(M-C5H5)2
317.40
—
161–162
80/0.01
Cyclopentadienyl tricarbonyl rhenium Re(CO)3(M-C5H5)
335.33
—
112
Hexamethyl rhenium Rh(CH3)6 Methyltrioxorhenium VII CH3RhO3 Pentamethyl cyclopentadienyl tricarbonyl rhenium Re(CO)3(M-C5(CH3)5) Propylenyl rhenium tetracarbonyl Re(M-C3H5)(CO)4
276.42
—
—
249.23
—
111
405.47
—
151
—
339.32
—
32–35
—
323.39
—
79–81
65–75/1
Compound
State/Color
Densitya (g/cc)
Miscellaneous
Reference
—
Air sensitive; soluble in organic solvents, insoluble in water
2, p. 206; 8, p. 1642
—
Can be sublimed in vacuum
2, p. 207; 8, p. 1641
—
Soluble in hexane
8, p. 1638
—
—
1, p. 179
Crystalline solid/white (in hexane) Crystalline solid/ yellow (in hydrocarbons) s/—
—
—
2, p. 207; 8, p. 1644
—
—
2, p. 231; 8, p. 1040
—
Soluble in hydrocarbons, chloroform, THF
1, p. 179
II. Miscellaneous Rhenium Compounds
Trimethylsilylperrhenate O3RhOSi(CH3)3
Crystalline solid/ yellow — Crystalline solid (in hexane)/— 10–12 Crystalline (decomposes) solid/green 65/0.001 —/—
Rhodium Compounds I. Rhodium Alkoxides and Diketonates Rhodium II acetate (CH3COO)2Rh2(CH3COO)2 Rhodium dicarbonyl 2,4-pentanedionate (CO)2Rh(OC(CH3))CH((CH3)CO) Rhodium III 2,4-pentanedionate Rh(OC(CH3)CH(CH3)CO)3 Soluble in chloroform, ether, pentane, acetoneRhodium trifluoropentanedionate Rh(-OC(CF3)CH(CH3)CO-)3
441.99
—
—
—
—/—
—
Soluble in water
1, p. 180
258.04
—
90/0.1
s/—
—
400.24
—
144–147 (155) 263–264
240/1
s/yellow
—
Exhibits semiconducting properties Decomposes at >280°C
1, p. 180; 8, p. 1668 1, p. 180
562.14
—
185–186
—
s/yellow
—
Soluble in methanol, chloroform
1, p. 181
© 2005 by CRC Press
II. Alkyl Complexes of Rhodium Tris(dibutylsulfide)rhodium trichloride ((C4H9)2S)3RhCl3 Tris(triphenylphosphine)rhodium I ((C6H5)3P)3RhCl3
648.16
—
—
—
—/—
0.91
Soluble in toluene
1, p. 180
925.23
—
>170(d)
—
s/—
—
Soluble in warm acetone, chloroform, ethanol
1, p. 180
Cyclopentadienyl cyclooctadiene rhodium (C5H5)Rh(C8H12)
276.18
—
108
—
Crystalline solid/ orangeyellow (in CH2Cl2) Platelets/ yellow Solid (prism)/ yellow
—
Soluble in ether
8, p. 1681
Diethylenerhodiumacetylacetonate Rh(OC(CH3)CHC(CH3)O)C2H4)2 Tri(U-allyl)rhodium Rh(C3H4)3
258.12
—
144–146
—
—
Best stored at 0°C
—
Decomposes at 130°C
2, p. 438; 8, p. 1677 8, p. 1671
226.12
—
80–85
40/0.01
Hygroscopic
1, p. 181
III. Alkylene Complexes of Rhodium
Rubidium Compounds Rubidium acetate CH3COORb Rubidium 2,4-pentanedionate RuOC(CH3)CH(CH3)CO
144.52
—
246(d)
—
s/—
—
184.58
—
200
—
s/—
—
—
1, p. 181
Ruthenium Compounds I. Ruthenium Alkoxides and Diketonates Ruthenium III 2,4-pentanedionate Ru(OC(CH3)CH(CH3)CO)3
398.40
—
226
—
s/red-brown
—
Ruthenium III oxoacetate (Ru3O(OOCCH3)6(H2O)3)OOCCH3
786.57
—
>200(d)
—
s/green
—
Soluble in acetone, methanol, 2, p. 652; cyclohexane, methylene 1, p. 182 chloride 2, p. 652 Soluble in water, methanol, THF 1, p. 182
231.26
—
199–200
—
Crystalline solid/light yellow (in CCl4)
—
Sublimes under vacuum
II. Ruthenium Alkyls and Aryls Biscyclopentadienyl ruthenium Ru(M-C5H5)2
2, p. 652; 8, p. 1780
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Cyclooctatetraene ruthenium tricarbonyl Ru(CO)3(h4-C8H8)
289.25
—
75–76
47/0.05
Propylenyl ruthenium dicarbonyl Ru(CO)2(M-C3H5)2
239.24
—
250
200–250 (under vacuum) —
s/dark brown
—
Pyrophoric in air; soluble in tetrahydrofuran
2, p. 197; 8, p. 1906
492.16
—
—
—
—/—
—
Compound
State/Color
Densitya (g/cc)
Miscellaneous
Reference
IV. Scandium Hydrocarbyls
V. Scandium Salt Scandium trifluoromethanesulfonate (CF3SO3) 3Sc
—
1, p. 173
Selenium Compounds I. Selenium (II) Alkyl and Aryls Diethylselenide (C2H5)2Se Dimethylselenide (CH3)2Se Diphenylselenide (C6H5)2Se Di-n-propylselenide (n-C3H7)2Se Ethyl seleniumhydride (C2H5)SeH Phenyl selenium bromide C6H5SeBr Phenyl seleniumhydride (C6H5)SeH Propylseleniumhydride (C3H7)SeH
137.08
108
—
—
l/—
1.230
Poison
109.03
57–58
—
—
l/—
1.4077
Poison
233.17
301
2.5
—
l/none
1.1427
Unpleasant odor
5, p. 227; 6, p. 88 5, p. 227; 6, p. 88 5, p. 227
165.14
159
—
—
l/none
1.1427
Unpleasant odor
5, p. 227
109.03
53.2
—
—
l/none
1.3594
Unpleasant odor
5, p. 227
235.97
134/35
62
—
s/none
—
157.07
183.6
—
—
l/none
1.4865
Unpleasant odor
5, p. 227
123.06
84
—
—
l/none
1.302
Unpleasant odor
5, p. 227
—
5, p. 227
© 2005 by CRC Press
II. Selenium (IV) Alkyl/Aryl Halides Diethyl selenium dibromide (C2H5)2SeBr2 Dimethyl selenium dibromide (CH3)2SeBr2 Dimethyl selenium dichloride (CH3)2SeCl2 Diphenyl selenium dichloride (C6H5)SeCl2 Methyl selenium tribromide CH3SeBr3 Phenyl selenium tribromide C6H5SeBr3
296.89
—
37
—
s/none
—
—
5, p. 227
268.84
—
82
—
s/none
—
—
5, p. 227
179.94
—
59.5
—
s/none
—
—
5, p. 227
304.08
—
180
—
s/none
—
—
5, p. 227
333.71
—
75
—
s/none
—
—
5, p. 227
395.78
—
105
—
s/none
—
—
5, p. 227
Silicon Compounds I. Silicon Alkoxides and Diketonates Hydroxyethoxysilatrane HOCH2CH2OSi(-OCH2CH2)3NPolydimethylsiloxane polymers (SiC2H60)x Silicon di-t-butoxide diacetate (t-C4H9O)2Si(OOCCH3)2 Tetraacetoxysilane Si(OOCCH3)4 Tetra-n-butoxysilane (n-C4H9O)4Si
235.32 —
>205(d)
1.05
—
—
—
l/clear
—
292.40
102/5
4
—
—/—
1.0196
264.26
148/6
111–115
—
s/—
—
320.54
115/3
110°C
1, p. 226
n20 = 1.4128; flash point: 78°C; viscosity: 2.33 cSt; )Hvap = 14.8 kcal/mol; surface tension = 22.8 dyn/cm n20 = 1.3818; toxic; flash point: 46°C; )Hvap = 11.0 kcal/mol; viscosity: 0.8 cSt Flash point: 58°C; )Hvap = 11,700 kcal/mol n20 = 1.430; flash point: 116°C; viscosity (38°): 4.35 cSt; surface tension: 22.8 dyn/cm
13, p. 194; 1, p. 226
13, p. 195; 1, p. 227 1, p. 227 1, p. 228
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Tetrakis(2-ethylhexoxy)silane Si(OCH2CH(CH2CH3)C4H9)4
544.97
194/1
94°C
1, p. 216
Compound
State/Color
Densitya (g/cc)
Miscellaneous
Reference 13, p. 156
—
1, p. 211
© 2005 by CRC Press
Methoxyethoxyundecyltrichlorosilane CH3OCH2CH2O(CH2)11SiCl3 Methyldichlorosilane CH3SiHCl2
363.83
—
—
—
—/—
—
—
1, p. 217
115.03
4142
93
—
—/—
1.105
Methyldiiodosilane CH3SiHI2 Methyldodecyldichlorosilane CH3(CH2)11Si(CH3)Cl2 Methyl-n-octadecyldichlorosilane CH3(CH2)17Si(CH3)Cl2 Methyl-n-octyldichlorosilane CH3(CH2)7Si(CH3)SiCl2 Methylphenyldichlorosilane C6H5Si(CH3)Cl2 (2-Methyl-2-phenylethyl)methyldichlorosilane C6H5CH(CH3)CH2Si(CH3)Cl2 Methyl-n-propyldichlorosilane CH3CH2CH2Si(CH3)Cl2 Methyltrichlorosilane CH3SiCl3
312.97
—
—
—
—/—
—
283.36
124127/3
—
—
l/—
0.955
367.52
185/2.5
—
—
l/—
0.930
227.25
94/6
—
—
l/—
0.976
N20 = 1.444
13, p. 174
191.13
205206
—
—
l/—
1.187
13, p. 174
233.21
104–105/9
—
—
l/—
1.1165
N20 = 1.5180; toxic; )Hvap = 11.5 kcal/mol; flash point: 82°C N20 = 1.5152
157.11
125
—
—
l/—
N20 = 1.425 (at 25°C)
13, p. 175
149.48
66.4
78
—
—/—
1.04 (25°C) 1.275
Methyltrifluorosilane CH3SiF3 p-Nonylphenoxypropyldimethylchlorosilane p-CH3(CH2)8C6H4OCH2CH2CH2Si (CH3)2Cl n-Nonyltrichlorosilane n-C9H19SiCl3 n-Octadecylmethoxydichlorosilane CH3(CH2)17Si(OCH3)Cl2 n-Octadecyltrichlorosilane CH3(CH2)17SiCl3 7-Octenyltrichlorosilane CH2CH(CH2)6SiCl3 n-Octyldimethylchlorosilane n-C8H17Si(CH3)2Cl n-Octyltrichlorosilane n-C8H17SiCl3
100.11
30
73
—
—/—
—
355.04
181/0.75
—
—
l/—
0.963
261.69
116/10
—
—
l/—
1.064
383.51
144–147/1.5
—
—
l/—
—
—
387.93
160162/3
22
—
—/—
n20 = 1.4602; flash point: 189°C
245.65
223–224
—
—
l/—
0.950 (22°C) 1.07
206.83
222225
—
—
1/
0.794
247.67
224226
—
—
l/—
1.074
n20 = 1.422; toxic; flash point: 2, p. 11; 32°C; viscosity: 0.60 cSt; )Hvap 13, p. 172 = 7.0 kcal/mol; )Hcomb = 39 kcal/mol — 2, p. 11 n20 = 1.453
13, p. 173 —
13, p. 173
1, p. 218
n20 = 1.4110; toxic; flash point: 13, p. 175; 15°C; viscosity: 0.37 cSt; )Hvap 1, p. 219 = 7.4 kcal/mol — 13, p. 176 —
N20 = 1.450
1, p. 220
13, p. 178 1, p. 221
n20 = 1.4578; flash point: 94°C
13, p. 179; 1, p. 221 1, p. 222
n20 = 1.4328 (at 25°C); flash point: 97°C n20 = 1.447; flash point: 96°C
13, p. 181; 1, p. 222 13, p. 181
© 2005 by CRC Press
Compound Pentafluorophenylpropylmethyldichlorosilane C6F5(CH2)3Si(CH3)Cl2 Phenethyltrichlorosilane C6H5CH2CH2SiCl3 Phenylallyldichlorosilane C6H5Si(CH2CHCH2)Cl2 4-Phenylbutyldimethylchlorosilane C6H5(CH2)4Si(CH3)2Cl 4-Phenylbutylmethyldichlorosilane C6H5(CH2)4Si(CH3)Cl2 4-Phenylbutyltrichlorosilane C6H5(CH2)4SiCl3 Phenyldichlorosilane C6H5SiHCl2 Phenyldimethylchlorosilane C6H5Si(CH3)2Cl Phenylethyldichlorosilane C6H5Si(C2H5)Cl2 Phenylmethylchlorosilane C6H5SiHCH3Cl Phenylmethylvinylchlorosilane C6H5Si(HCCH2)(CH3)Cl Phenyltrichlorosilane C6H5SiCl3 Phenyltrifluorosilane C6H5SF3 Phenylvinyldichlorosilane C6H5Si(CHCH2)Cl2 Isopropylchlorosilane (i-C3H7)2SiHCl n-Propyldimethylchlorosilane CH3CH2CH2Si(CH3)2Cl n-Propyltrichlorosilane CH3CH2CH2SiCl3
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
323.16
128–129/20
—
—
239.60
93–96
—
217.17
100102/8
226.83
Densitya (g/cc)
Miscellaneous
1/
1.378
—
—
l/—
1.240
n20 = 1.5185; flash point: 91°C
1, p. 224
—
—
—/—
N20 = 1.535 (at 25°C)
13, p. 183
85–87/0.6
—
—
l/—
1.168 (25°C) 0.964
247.24
105–109/1.5
—
—
l/—
1.09
Flash point: >110°C
1, p. 224
268.66
—
—
—
l/—
—
Flash point: >110°C
1, p. 224
177.10
6566/10
—
—
l/—
1.212
N20 = 1.526
13, p. 183
170.71
192193
—
—
l/—
1.032
13, p. 184
205.16
225226
—
—
l/—
1.184
156.69
113/100
—
—
l/—
1.054
n20 = 1.5082; viscosity: 1.4 cSt; )Hvap = 11.4 kcal/mol; flash point: 61°C n20 = 1.5321; )Hvap = 11.9 kcal/ mol N20 = 1.571
13, p. 185
182.72
7980/34
—
—
l/—
1.034
n20 = 1.5197
13, p. 185
211.55
201
—
—
l/—
1.329
13, p. 186
162.19
101102
—
—
l/—
203.14
8487/1.5
—
—
l/—
n20 = 1.534 (at 25°C)
13, p. 187
150.72
137; 5455/45
—
—
l/—
1.201 (26.5°C) 1.196 (25°C) 0.872
n20 = 1.525 (at 25°C); toxic; flash point: 91°C; viscosity: 1.08 cSt; )Hvap = 11.4 kcal/mol n20 = 1.4110
136.70
113114
—
—
l/—
0.873
n20 = 1.414
177.53
123125
—
—
l/—
1.1851
n20 = 1.429; flash point: 2°C; )Hvap = 8.7 kcal/mol
State/Color
Reference 1, p. 223
n20 = 1.4979; flash point: >110°C 1, p. 224
—
13, p. 185
13, p. 186
2, p. 11; 8, p. 1982 13, p. 188 13, p. 188
© 2005 by CRC Press
Tetraethylsilane (C2H5)4Si
144.33
153155
82
—
—/—
Thexyltrichlorosilane (CH3)2CHC(CH3)2SiCl3 p-Tolylmethyldichlorosilane p-CH3C6H5Si(CH3)Cl2 p-Tolyltrichlorosilane p-CH3C6H5SiCl3 Tri-t-butoxychlorosilane (95%) (t-C4H9O)3SiCl Tri-n-butylchlorosilane (90%) (n-C4H9)3SiCl Trichlorosilane HSiCl3
219.61
70-2/15
—
—
l/—
—
205.16
161165/7
—
—
l/—
1.1609
225.58
218220
—
—
l/—
1.28
282.88
97/12
—
—
l/—
—
234.88
9394/4
—
—
l/—
0.879
n20 = 1.4472
13, p. 202
135.45
31.9
128
—
—/—
1.342
13, p. 203
240.59
—
—
—
l/—
0.93
n20 = 1.402; toxic; )Hvap = 6.7 kcal/mol; )Hform = 115.2 kcal/ mol; flash point: 13°C; surface tension: 14.3 dyn/cm Flash point: 4°C; hazy liquid
1, p. 231
198.72
156157
—
—
l/—
n20 = 1.388 (at 25°C)
13, p. 204
440.70
189–191
—
—
l/—
1.012 (25°C) 1.473
n20 = 1.3453; flash point: 52°C
1, p. 231
461.12
189–190
—
—
l/—
1.550
n20 = 1.3500; flash point: 51°C
1, p. 231
481.55
84–85/17
—
—
l/—
1.639
n20 = 1.3521; flash point: 54°C
1, p. 232
182.27
133–134
—
—
l/—
0.94
195.17
6667/24
50
—
—/—
1.140
n20 = 1.4561
13, p. 205
150.72
144–145
—
—
l/—
0.896
134.27
110111
—
—
l/—
—
n20 = 1.4313; flash point: 30°C; )Hvap = 9.8 kcal/mol nD = 1.39
319.04
154155/5
—
—
l/—
0.871
2, p. 11; 13, p. 206 2, p. 11; 8, p. 1983 13, p. 207
4-[2-(Trichlorosilyl)ethylpyridine 4-(C5H4N)CH2CH2SiCl3 Triethoxychlorosilane (95%) (C2H5O)3SiCl (Tridecafluoro-1,1,2,2-tetrahydrooctyl)dimethylchlorosilane CF3(CF2)5CH2CH2Si(CH3)2Cl (Tridecafluoro-1,1,2,2-tetrahydrooctyl)methyldichlorosilane CF3(CF2)5CH2CH2Si(CH3)Cl2 (Tridecafluoro-1,1,2,2-tetrahydrooctyl)trichlorosilane CF3(CF2)5CH2CH2SiCl3 Triethoxyfluorosilane FSi(OC2H5)3 Triethylbromosilane (C2H5)3SiBr Triethylchlorosilane (C2H5)3SiCl Triethylfluorosilane (C2H5)3SiF Tri-n-hexylchlorosilane (n-C6H13)3SiCl
0.762
n20 = 1.4246; flash point: 32°; viscosity: 0.9 cSt; )Hvap = 9.9 kcal/mol; )Hform = 41 kcal/mol; )Hcomb = 1597 kcal/mol —
13, p. 195; 1, p. 227
n20 = 1.5330
13, p. 202
n20 = 1.5224 (at 25°C)
13, p. 202
—
—
n20 = 1.456
1, p. 231
13, p. 202
1, p. 232
© 2005 by CRC Press
Compound Trimethylbromosilane (CH3)3SiBr Trimethylchlorosilane (99.9%) (CH3)3SiCl Trimethylfluorosilane (CH3)3SiF Trimethylsilyliodide (95%) (CH3)3SiI Triphenylbromosilane (C6H5)3SiBr Triphenylchlorosilane (C6H5)3SiCl Triphenylfluorosilane (C6H5)3SiF (Triphenylmethyl)methyl-dichlorosilane (C6H5)3CSi(CH3)Cl2 Triisopropylchlorosilane ((CH3)2CH)3SiCl Tri-n-propylchlorosilane (CH3CH2CH2)3SiCl 10-Undecenyldimethylchlorosilane CH2CH(CH2)9Si(CH3)2Cl 10-Undecenyltrichlorosilane CH2CH(CH2)9SiCl3 Undecyltrichlorosilane CH3(CH2)10SiCl3 Vinyl(chloromethyl)dimethylsilane CH2CHSi(CH3)2(CH2Cl) Vinyldimethylchlorosilane CH2CHSi(CH3)2Cl Vinylethyldichlorosilane CH2CHSi(CH3CH2)Cl2 Vinylmethyldichlorosilane CH2CHSi(CH3)Cl2
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
153.09
80
44
—
—/—
1.173
108.64
57.6
57.7
—
l/—
0.8580
92.19
1618
74
—
—/—
200.09
106107
—
—
l/—
0.793 (0°C) 1.470
195.17
6667/24
50
—
l/—
1.140
294.85
207210/12
9192
—
—
278.40
207210/12
6162
—
Solid crystal/ white —/—
—
—
13, p. 221
357.35
—
196–197
—
s/—
—
—
1, p. 236
192.80
80/10
—
—
l/—
0.9027
192.80
199201
—
—
l/—
0.882
246.90
100/2
—
—
—/—
0.871
287.74
100–102/0.8
—
—
l/—
1.04
Flash point: 105°C
1, p. 238
289.75
155160/15
—
—
l/—
1.019
Flash point: 107°C
1, p. 238
134.68
121–122
—
—
l/—
0.893
Flash point: 14°C
13, p. 238
120.65
8282.5
—
—
l/—
n20 = 1.414 (at 15°C)
13, p. 225
155.10
118120
—
—
l/—
0.884 (25°C) 1.07
n20 = 1.439; flash point: 6°C
13, p. 225
141.1
9293
—
—
l/—
1.087
n20 = 1.4270; toxic; flash point: 4°C; viscosity: 0.70 cSt
13, p. 225
State/Color
Densitya (g/cc)
Miscellaneous
Reference
n20 = 1.4211; )Hform = 70.3 kcal/ 13, p. 210 mol; flash point: 32°C n20 = 1.3885; viscosity: 0.47 cSt; 13, p. 210; )Hvap = 6.6 kcal/mol; flash point: 1, p. 235 27°C; )Hcomb = 714 kcal/mol; )Hform = 84.5 kcal/mol — 13, p. 210 n20 = 1.474; flash point = 2°C; )Hform = 52.2 kcal/mol nD = 1.4561 Toxic
n20 = 1.4515 (at 25°C); flash point: 62°C n20 = 1.440; flash point: 70°C —
13, p. 216 2, p. 11; 13, p. 205 13, p. 220
13, p. 207 13, p. 221 1, p. 238
© 2005 by CRC Press
III. Alkyl Silanes Allyldimethylsilane (90%) CH2CHCH2Si(CH3)2H Allyltrimethylsilane CH2CHCH2Si(CH3)3 Bis(dimethylamino)diethylsilane ((CH3)2N)2Si(C2H5)2 Bis(dimethylamino)dimethylsilane ((CH3)2N)2Si(CH3)2 Bis(dimethylamino)methylsilane ((CH3)2N)2Si(CH3)H Bis(dimethylamino)vinylmethylsilane ((CH3)2N)2Si(CH3)(CHCH2) Di(t-butylamino)silane ((CH3)3CNH)2SiH2 Di-t-butylsilane ((CH3)3C)2SiH2 Ethynyltrimethylsilane HCCSi(CH3)3 Methyltri-n-octylsilane (CH3(CH2)6CH2)3SiCH3 n-Octyldimethyl(dimethylamino)silane CH3(CH2)6CH2Si(CH3)2N(CH3)2 Tetraallylsilane (CH2CHCH2)4Si Tetravinylsilane (95%) (CH2CH)4Si 3-Trimethylsilylpropynal HCOCCSi(CH3)3 1-Trimethylsilylpropyne CH3CCSi(CH3)3 Tris(dimethylamino)methylsilane CH3Si(N(CH3)2)3 Tris(dimethylamino)silane HSi(N(CH3)2)3 Vinyldimethylsilane CH2CHSi(CH3)2H Vinyl(trifluoromethyl)dimethylsilane CH2CHSi(CH3)2CF3
100.24
69–70
—
—
l/—
0.705
114.26
85–86
—
—
l/—
0.7193
n20 = 1.4029; toxic; flash point: 1, p. 189 20°C n20 = 1.4074; flash point: 7°C 1, p. 190
174.36
62–63/15
—
—
l/—
0.837
n20 = 1.4362; flash point: 30°C
1, p. 193
146.31
128–129
98
—
l/—
0.810
n20 = 1.4169; flash point: 7°C
1, p. 193
132.28
112–113
—
—
l/—
0.798
n20 = 1.414; flash point: 3°C
1, p. 193
158.32
146–147
—
—
l/—
—
Flash point: 4°C
1, p. 193
174.36
167
—
—
l/—
0.816
Flash point: 30°C
1, p. 203
144.33
128
38
—
l/—
0.74
—
1, p. 203
98.22
52
—
—
l/—
0.709
n20 = 1.3880; flash point: 34°C
1, p. 210
382.79
210/5
—
—
l/—
0.813
215.45
94–96/10
—
—
l/—
0.80
n20 = 1.4520; flash point: >110°C; 1, p. 220 viscosity (54°C) = 1500 cSt Flash point: 69°C 1, p. 223
192.37
91/10
—
—
l/—
0.8345
n20 = 1.4864; flash point: 77°C
1, p. 226
136.27
130–131
—
—
l/—
0.815
1, p. 226
128.14
52/30
—
—
l/—
0.86
n20 = 1.4610; flash point: 18°C; viscosity: 0.6cSt; )Hcomb = 1293 kcal/mol; )Hform = 5.2 kcal/mol —
112.25
99–100
69
—
l/—
0.758
n20 = 1.4091; flash point: 3°C
1, p. 236
175.35
55–56/17
11
—
l/—
0.850
n20 = 1.432; flash point: 30°C
1, p. 237
161.32
145–148
—
—
l/—
0.838
Flash point: 25°C
1, p. 237
86.20
36–37
—
—
l/—
0.6744
n20 = 1.3885
1, p. 238
154.21
80
—
—
l/—
0.978
n20 = 1.3549; flash point: –10°C
1, p. 240
1, p. 236
© 2005 by CRC Press
Compound
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
213.31
110–114/0.6
—
—
l/—
1.19
Flash point: 180°C
1, p. 191
150.30
72/15
—
—
l/—
0.949
n20 = 1.5040
13, p. 108
164.32
190191
—
—
l/—
0.893
n20 = 1.4941
13, p. 108
274.39
195–199/0.5
64
—
s/—
1.19
Flash point: >110°C
1, p. 192
202.41
8182/17
—
—
l/—
0.826
n20 = 1.432 (at 25°C)
13, p. 112
146.31
128129
98
—
—/—
356.50
210/1
13
—
l/—
0.810 (22°C) 1.13
n20 = 1.417 (at 22°C); flash point: 13, p. 112 7°C Flash point: 150°C 1, p. 194
260.41
180/4
78–81
—
s/—
—
116.28
8183
—
—
l/—
0.701
234.41
80/0.075
—
—
l/—
—
158.36
155
—
—
l/—
—
102.25
7778
—
—
l/—
88.22
56
–132
—
290.78
—
181
348.93
—
174.31
101/15
State/Color
Densitya (g/cc)
Miscellaneous
Reference
IV. Aryl Silanes Aminophenyltrimethoxysilane NH2C6H6Si(OCH3)3 Benzyldimethylsilane C6H5CH2Si(CH3)2H Benzyltrimethylsilane C6H5CH2Si(CH3)3 Bis(p-aminophenoxy)dimethylsilane (p-NH2C6H4O)2Si(CH3)2 Bis(diethylamino)dimethylsilane (CH3)2Si(N(C2H5)2)2 Bis(dimethylamino)dimethylsilane (CH3)2Si(N(CH3)2)2 Bis(n-methylbenzamido)ethoxymethylsilane (C6H5CON(CH3))2Si(CH3))C2H5 Bis(phenylethynyl)dimethylsilane (C6H5CC)2Si(CH3)2 tert-Butyldimethylsilane tC4H9Si(CH3)2H p(t-Butyldimethylsiloxy)styrene pCH2CHC6H4OSi(CH3)2C(CH2)3 Di-tert-butylmethylsilane (tC4H9)2Si(CH3)H Diethylmethylsilane (C2H5)2Si(CH3)H Diethylsilane (C2H5)2SiH2 Dimethylcyclopentasilane ((CH3)2Si)5 Dimethylcyclohexasilane ((CH3)2Si)6 Dimethyldiisothiocyanatosilane (CH3)2Si (NCS)2
— n20 = 1.4005
1, p. 195 13, p. 124
—
1, p. 198
n20 = 1.4293 (at 25°C)
13, p. 140
0.700
n20 = 1.398
13, p. 143
l/—
0.6837
13, p. 143; 1, p. 204
—
s/—
—
253
—
s/—
—
—
—
l/—
1.14
n20 = 1.3921; flash point: 20°; viscosity: 0.4 cSt; )Hvap = 7.18 kcal/mol; )Hcomb = 951 kcal/ mol; )Hform = 37 kcal/mol Transitions from brittle to plastic crystalline phase at 39°C Transitions from brittle to plastic crystalline phase at 77°C —
2, p. 385 2, p. 385 13, p. 147
© 2005 by CRC Press
60.17
20
150
—
Gas/—
3-(2,4-Dinitrophenylamino)propyltriethoxysilane (NO2)2C6H5NH(CH2)3Si(OC2H5)3 Diphenylmethylsilane (C6H5)2Si(CH3)H Diphenylphosphinoethyldimethylethoxysilane (C6H5)2P(CH2)2Si(CH3)2OC2H5 2-(Diphenylphosphino)ethyltriethoxysilane (C6H5)2P(CH2)2Si(OC2H5)3 Diphenylsilane (C6H5)2SiH2 Diphenylsilanediol (C6H5)2Si(OH)2
387.46
—
2730
—
l/—
—
198.34
266267
—
—
l/—
0.997
316.46
160/1
—
—
l/—
1.004
n20 = 1.569; flash point: >112°C; 13, p. 151 )Hvap = 15.4 kcal/mol n20 = 1.5630 1, p. 207
376.50
182/1.3
—
—
l/—
1.05
Flash point: 134°C
1, p. 207
184.31
9597/13
—
—
1/colorless
0.9969
n20 = 1.5795; flash point: 98°C
216.32
—
138–142(d)
—
s/—
—
Divinyldimethylsilane (CH3)2Si(CHCH2)2 Ethyldimethylsilane (CH3)2Si(C2H5)H Hexamethyldisilane (CH3)6Si2 Methylsilane CH3SiH3
112.25
82
—
—
l/—
0.7337
Flash point: 53°C; )Hform = 250 kcal/mol; )Hcomb = 1500 kcal/ mol n20 = 1.4176; flash point: 8°
13, p. 151; 1, p. 207 1, p. 207
88.22
4546
—
—
l/—
0.668
n20 = 1.3783
13, p. 153 1, p. 207 13, p. 155
146.38
112113
12.514
—
—/—
0.729
Flammable
6, p. 89
46.14
57
157
—
Gas/—
0.628 (58)
13, p. 175; 1, p. 219
Methylphenylsilane C6H5Si(CH3)H2 Methyltri-n-decylsilane (nC10H21)3SiCH3 n-Octadecylsilane CH3(CH2)17SiH3 n-Octylsilane nC8H17SiH3 n-Octyltris(trimethylsiloxy)silane CH3(CH2)7Si(OSi(CH3)3)3 Pentafluorophenyltriethoxysilane C6F5Si(OC2H5)3 Phenyldimethylsilane C6H5Si(CH3)2H
122.24
139140
—
—
l/—
0.889
flash point: 110°C
144.33
162163
—
—
1/—
0.746
399.81
7980/0.12
—
—
l/—
—
n20 = 1.4100 (at 25°)
13, p. 179; 1, p. 221 13, p. 181; 1, p. 223 13, p. 181
330.33
130/10
—
—
1/
1.24
n20 = 1.4180
1, p. 223
136.27
156157
—
—
l/—
0.8891
n20 = 1.4995; flash point: 35°
13, p. 184
Dimethylsilane (CH3)2SiH2
0.68 (80°C)
)Hvap = 5.5 kcal/mol; )Hcomb = 13, p. 148; 624 kcal/mol; )Hform = 23 kcal/ 1, p. 206 mol; flash point 110°C 1, p. 206
n20 = 1.425; flash point: 36°
13, p. 174
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
162.31
80/20
—
—
l/—
0.892
n20 = 1.5048
13, p. 184
148.28
5657/7
—
—
l/—
0.891
n20 = 1.5115
13, p. 185
108.21
120
64 to 68
—
l/—
0.8681
1, p. 224
196.37
88/15
—
—
l/—
—
n20 = 1.5125; flash point: 8°; )Hvap = 8.31 kcal/mol Flash point: 39°C
150.30
169170
—
—
l/—
0.872
269.43
105/0.9
—
—
l/amber
252.38
98/0.1
—
—
256.55
230232
—
144.33
153155
88.22
Tetraphenylsilane (C6H5)4Si p-Tolyltrimethoxysilane (95%) pCH3C6H4Si(OCH3)3 Triethylazidosilane (C2H5)3SiN3 Triethylsilane (C2H5)3SiH Tri-n-hexylsilane (nC6H13)3SiH
Compound Phenyldimethylvinylsilane C6H5Si(CH3)2CHCH2 Phenylmethylvinylsilane C6H5Si(CH3)(CHCH2)H Phenylsilane C6H5SiH3 Phenylthiomethyltrimethylsilane (CH3)3SiCH2SC6H5 Phenyltrimethylsilane C6H5Si(CH3)3 2-(4-Pyridylethyl)triethoxysilane (4-C5H4N)CH2CH2Si(OC2H5)3 Styrylethyltrimethoxysilane (95%) CH2CHC6H5CH2CH2Si(OCH3)3 Tetra-n-butylsilane (nC4H9)4Si Tetraethylsilane (C2H5)4Si
Tetramethylsilane (CH3)4Si
State/Color
Densitya (g/cc)
Miscellaneous
Reference
13, p. 186 13, p. 187
1.00
n20 = 1.4908; viscosity: 1.1 cSt; flash point: 44°C n20 = 1.4624
l/—
1.02
n20 = 1.505; flash point: 97°C
1, p. 225
—
l/—
0.799
n20 = 1.4465
13, p. 194
82
—
1/clear
0.762
2, p. 10; 13, p. 195
26.626.7
99
—
1/clear
0.6411
336.51
228/3
236237
—
—/—
1.078
212.32
75–8/8
—
—
l/—
1.033
nD = 1.4246; )Hvap = 9.9 kcal/mol; viscosity: 0.40/9 cSt; flash point = 28°C; )Hfus = 1.6 k/mol; )Hform = 55.4 k/mol; )Hcomb = 920 kcal/mol nD = 1.3588; )Hvap = 6.4 kcal/mol; )Hfus = 1.6 kcal/mol; )Hform = 55.4 kcal/mol; flash point: 27°C; viscosity: 0.4 cSt )Hform = 58.7 kcal/mol; )Hcomb = 3215.5 kcal/mol n20 = 1.4726; flash point: 94°C
157.29
104/95
—
—
l/—
—
116.28
107108
157
—
—/—
0.731
284.60
160161/5
—
—
l/—
0.799
1, p. 225
13, p. 200; 1, p. 230
13, p. 200 1, p. 231 13, p. 205
n20 = 1.4123; viscosity: 4.9 cSt; flash point: 3°C; surface tension: 20.7 dyn/cm; )Hform = 41 kcal/mol n20 = 1.4480
6, p. 89; 13, p. 206
13, p. 207
© 2005 by CRC Press
227.33
105/0.3
—
—
l/—
74.20
6.7
135.9
—
—/—
Trimethylethylsilane (CH3)3SiC2H5 Trimethyl (m-neopentylphenyl) silane m-C5H12C6H4Si(CH3)3 Trimethyl (p-neopentylphenyl) silane p-C5H12C6H4Si(CH3)3 Trimethylsilylazide (CH3)3SiN3 Tri-n-octylsilane (nC8H17)3SiH Triphenylsilane (C6H5)3SiH Triphenylvinylsilane (C6H5)3SiCHCH2 Triisopropylsilane ((CH3)2CH)3SiH Tri-n-propylsilane (CH2CH2CH2)3SiH (m,p-Vinylbenzyloxy)trimethylsilane CH2CHC6H5CH2OSi(CH3)3 Vinyldiethylmethylsilane CH2CHSi(C2H5)2CH3 Vinylphenyldimethylsilane C6H5Si(CHCH2)(CH3)2 Vinyltrichlorosilane CH2CHSiCl3
102.25
62
—
—
l/—
0.68
221.44
80/2
—
—
l/—
—
Flash point: 110°C 1, p. 234
2-(Trimethoxysilylethyl)pyridine (2-CH3C5H4N)CH2CH2Si(OCH3)3 Trimethylsilane (CH3)3SiH
0.638 (6.7°C)
V. Alkoxysilanes Acetoxyethyltriethoxysilane CH3COOCH2CH2Si(OC2H5)3
n20 = 1.410
1, p. 188
© 2005 by CRC Press
Compound Acetoxymethyltriethoxysilane CH3COOCH2Si(OC2H5)3 Acetoxypropyltrimethoxysilane CH3COOCH2CH2CH2Si(OCH3)3 (3-Acryloxypropyl)methyldimethoxysilane CH2CHCOOCH2CH2CH2Si(CH3) (OCH3)2 (3-Acryloxypropyl)trimethoxysilane CH2CHCOOCH2CH2CH2Si(OCH3)3 Acryloxytrimethylsilane CH2CHCOOSi(CH3)3 3-(N-Allyamino)propyltrimethoxysilane CH2CHCH2NHCH2CH2CH2Si(OCH3)3 Allydimethoxysilane CH2CHCH2SiH(OCH3)2 O-Allyoxy(polyethyleneoxy)trimethylsilane CH2CHCH2(OCH2CH2)nOSi(CH3)3 Allyoxyundecyltrimethoxysilane CH2CHCH2O(CH2)11Si(OCH3)3 Allytrimethoxysilane CH2CHCH2Si(OCH3)3 (Aminoethylaminomethyl)phenethyltrimethoxysilane H2NCH2CH2NHCH2C6H4CH2CH2Si (OCH3)3 N-(2-aminoethyl)-3-aminopropylmethyldimethoxysilane H2NCH2CH2NHCH2CH2CH2Si(CH3) (OCH3)2 N-(2-aminoethyl)-3-aminopropyltrimethoxysilane H2NCH2CH2NHCH2CH2CH2Si(OCH3)3 N-(6-aminohexyl)aminopropyltrimethoxysilane H2N(CH2)6NHCH2CH2CH2Si(OCH3)3
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
236.34
106/15
—
—
l/—
1.042
n20 = 1.4092
1, p. 188
222.31
92/2
—
—
l/—
1.062
n20 = 1.4146; flash point: 93°C
1, p. 188
218.33
65/0.35
—
—
l/—
1.0
n20 = 1.431
1, p. 188
234.32
68/0.4
—
—
l/—
1.0
n20 = 1.4112; flash point: 26°C
1, p. 188
144.25
64–65/100
—
—
l/—
0.8939
n20 = 1.4155; flash point: 123°C
1, p. 188
219.36
106–109/25
—
—
l/—
0.989
—
1, p. 188
132.23
107–109
—
—
l/—
—
470–560
107–109
—
—
l/—
1.040
332.56
175–179/5
—
—
l/—
—
162.26
146–148
—
—
l/—
0.963
n20 = 1.4036; flash point: 46°C
298.46
126–130/0.2
—
—
l/—
1.02
n20 = 1.5083; flash point: >110°C 1, p. 190
206.36
265
—
—
l/—
0.975
n20 = 1.4447; flash point: 90°C
1, p. 190
226.36
140/15
—
—
l/—
1.019
n20 = 1.450; flash point: 150°C; viscosity: 6.5 cSt
1, p. 190
278.47
160–163/0.15
—
—
l/—
1.11
n20 = 1.4501; flash point: >110°C 1, p. 190
State/Color
Densitya (g/cc)
Miscellaneous
Reference
n20 = 1.4450
1, p. 189
Viscosity: 20–25 cSt
1, p. 189
—
1, p. 189 1, p. 189
© 2005 by CRC Press
N-(2-aminoethyl)-11-aminoundecyltrimethoxysilane H2NCH2CH2NH(CH2)11Si(OCH3)3 N-3-[(amino(polypropylenoxy)]aminopropyltrimethoxysilane H2N(CH2CH(CH3)O)2CH(CH3)NHCH2 CH2CH2Si(OCH3)3 3-Aminopropyldimethylmethoxysilane H2NCH2CH2CH2Si(CH3)2OCH3 3-Aminopropylmethyldiethoxysilane H2NCH2CH2CH2Si(OC2H5)2CH3 Aminopropylsilanetriol H2NCH2CH2CH2Si(OH)3 3Aminopropyltriethoxysilane H2NCH2CH2CH2Si(OC2H5)3 3Aminopropyltrimethoxysilane H2NCH2CH2CH2Si(OCH3)3 Benzyltriethoxysilane C6H5CH2Si(OC2H5)3 Bis(2-hydroxyethyl)-3-aminopropyltriethoxysilane (HOCH2CH2)2NCH2CH2CH2Si(OC2H5)3 tert-Butoxytrimethylsilane (CH3)3SiOC(CH3)3 n-Butylaminopropyltrimethoxysilane C4H9NHCH2CH2CH2Si(OCH3)3 tert-Butyldiphenylmethoxysilane (t-C4H9)(C6H5)2SiOCH3 n-Butyltrimethoxysilane CH3CH2CH2CH2Si(OCH3) 3 2-Cyanoethylmethyldimethoxysilane NCCH2CH2S(OCH3)2CH3 2-Cyanoethyltriethoxysilane NCCH2CH2Si(OC2H5)3 2-Cyanoethyltrimethoxysilane NCCH2CH2Si(OCH3)3 3-Cyanopropyltriethoxysilane NCCH2CH2CH2Si(OC2H5)3 3-Cyanopropyltrimethoxysilane NCCH2CH2CH2Si(OCH3)3
334.57
—
—
—
—/—
—
337–435
—
—
—
—/—
—
161.32
78–79/24
—
—
l/—
191.34
85–88/8
—
—
137.21
—
—
221.37
122123/30
179.29
—
1, p. 190
3–4 propyleneoxy units
1, p. 191
0.857
n20 = 1.427; flash point: 73°C
1, p. 191
l/—
0.916
n20 = 1.4272; flash point: 68°C
1, p. 191
—
l/—
1.06
Flash point: >110°C
1, p. 191
—
—
l/—
0.951
13, p. 106; 1, p. 191
80/8
—
—
l/—
1.027
n20 = 1.4225; )Hvap = 11.8 kcal/ mol; viscosity: 1.6 cSt; flash point: 104°C n20 = 1.4240; flash point: 83°C
254.40
170175/70
—
—
l/—
0.986
—
13, p. 108
309.48
—
—
—
l/—
0.92
n20 = 1.409; flash point: 24°C
1, p. 194
146.30
104
—
—
l/—
0.761
N20 = 1.3913
13, p. 124
235.40
238
—
—
l/—
0.947
Flash point: 110°C
1, p. 198
270.45
—
4951
—
s/—
—
Flash point: >110°C
13, p. 125
178.30
1645
—
—
l/—
0.9312
n20 = 1.3979; flash point: 49°C
13, p. 126
159.26
89–90/8
—
—
l/—
0.9862
n20 = 1.4192
1, p. 201
217.34
224–225
—
—
l/—
0.9792
n20 = 1.4140; flash point: 86°C
1, p. 201
175.26
112/15
—
—
l/—
1.079
n20 = 1.4126; flash point: 88°C
1, p. 201
231.37
79–80/0.6
—
—
l/—
0.961
1, p. 201
189.29
90–92/7
—
—
l/—
1.026
n20 = 1.4174; flash point: 74°C; viscosity: 2.3 cSt —
1, p. 191
1, p. 201
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
11-Cyanoundecyltrimethoxysilane NC(CH2)11Si(OCH3)3 [2-(3-Cyclohexenyl)ethyl]trimethoxysilane (C6H9)CH2CH2Si(OCH3)3 Di-n-butyldimethoxysilane (nC4H9)2Si(OCH3)2 Diethylaminomethyltriethoxysilane (C2H5)2NCH2Si(OC2H5)3 Diethylphosphatoethyltriethoxysilane (C2H5O)2POCH2CH2Si(OC2H5)3 Diethyldiethoxysilane (C2H5)2Si(OC2H5)2 Diisobutyldimethoxysilane ((CH3)2CHCH2)2Si(OCH3)2 Diisopropyldimethoxysilane ((CH3)2CH)2Si(OCH3)2 (N,N-dimethylaminopropyl) trimethoxysilane (CH3)2NCH2CH2CH2Si(OCH3)3 Dimethyldiethoxysilane (CH3)2Si(OC2H5)2
301.59
160/1
—
—
230.38
109/6
—
204.39
125/50
249.43
Densitya (g/cc)
Miscellaneous
l/—
0.933
—
1, p. 201
—
l/—
1.02
Flash point: 80°C
1, p. 201
—
—
l/—
0.861
Flash point: 103°C
1, p. 203
74–76/3
—
—
l/—
0.9336
n20 = 1.4142
1, p. 204
328.41
141/2
—
—
l/—
1.031
n20 = 1.4216; flash point: 70°C
1, p. 204
176.33
157
—
—
l/—
0.862
n20 = 1.402
13, p. 143
204.39
120/6
—
—
l/—
0.87
Flash point: 102°C
1, p. 204
176.33
85–87/50
—
—
l/—
0.875
n20 = 1.4178; flash point: 43°C
1, p. 204
207.34
106/30
—
—
—/—
0.948
n20 = 1.4150; flash point: 99°
1, p. 204
148.28
114115
97
—
—/—
0.8395
13, p. 147; 1, p. 205
Dimethyldimethoxysilane (CH3)2Si(OCH3)2
120.22
82
–80
—
l/—
0.8646
Dimethylethoxysilane (CH3)2Si(OC2H5)H (2,2-Dimethyl-1-methylenepropoxy)trimethylsilane (CH3)3CC(CH2)OSi(CH3)3 Diphenyldiethoxysilane (C6H5)2Si(OC2H5)2 Diphenyldimethoxysilane (C6H5)2Si(OCH3)2
104.22
54–55
—
—
l/—
0.757
172.35
140–142
—
—
l/—
0.798
n20 = 1.3805; flash point: 11°; toxic; )Hvap = 9.8 kcal/mol; )Hform = 200 k/mol; )Hcomb = 1119 kcal/mol; viscosity: 0.53 cSt n20 = 1.3708; )Hform = 171 kcal/ mol; )Hcomb = 832 kcal/mol; viscosity: 0.44cSt n20 = 1.3683; flash point: 15°; toxic n20 = 1.4090; flash point: 24°
272.42
167/15
—
—
l/—
1.0329
244.36
161/15
—
—
l/—
1.0771
Compound
State/Color
Reference
13, p. 147 1, p. 205 13, p. 147 1, p. 206 1, p. 206
n20 = 1.5269s; flash point: 175˚C 13, p. 150 1, p. 207 n20 = 1.5447; flash point: 13, p. 150 >110˚C; viscosity: (25˚) 8.4 cSt
© 2005 by CRC Press
Diphenylmethylethoxysilane (C6H5)2SiCH3(OC2H5) Docosenyltriethoxysilane CH2CH(CH2)20Si(OC2H5)3 Dodecyltriethoxysilane CH3(CH2)10CH2Si(OC2H5)3 2-(3,4-Epoxycyclohexyl)ethyltriethoxysilane (3,4-OC6H9)CH2CH2Si(OC2H5)3 2-(3,4-Epoxycyclohexyl)ethyltrimethoxysilane (3,4-OC6H9)CH2CH2Si(OCH3)3 Epoxyhexyltriethoxysilane H2C(O-)CHCH2CH2CH2CH2Si (OC2H5)3 N-ethylaminoisobutyltrimethoxysilane CH3CH2NHCH2CH(CH3)CH2Si(OCH3)3 m,p-Ethylphenethyltrimethoxysilane CH3CH2C6H5CH2CH2Si(OCH3)3 Ethyltriacetoxysilane CH3CH2Si(OOCCH3)3 Ethyltrimethoxysilane CH3CH2Si(OCH3)3 (3-Glycidoxypropyl)methyldiethoxysilane H2C(O)CHCH2O(CH2)3Si(OC2H5)2CH3 (3-Glycidoxypropyl)methyldimethoxysilane H2C(O)CHCH2O(CH2)3Si(OCH3)2CH3 (Heptadecafluoro-1,1,2,2tetrahydrodecyl)-triethoxysilane CF3(CF2)7CH2CH2Si(OC2H5)3 n-Hexadecyltriethoxysilane n-C16H33Si(OC2H5)3 n-Hexyltrimethoxysilane CH3(CH2)5Si(OCH3)3 N-(hydroxyethyl)-Nmethylaminopropyltrimethoxysilane HOCH2CH2N(CH3)(CH2)3Si(OCH3)3 Isobutylisopropyldimethoxysilane (CH3)2CHCH2Si(OCH3)2CH(CH3)2
n20 = 1.544; flash point: 165˚C; viscosity: (25˚) 4.9 cSt —
13, p. 151
n20 = 1.4330; flash point: >110°C; n20 = 1.449; flash point: 146°C;
1, p. 208
1.065
n20 = 1.4455; flash point: 104°C; viscosity: 5.2 cSt
1, p. 208
l/—
0.960
n20 = 1.4254; flash point: 99°C;
1, p. 209
—
l/—
0.952
Flash point: 91°C
1, p. 209
—
—
l/—
0.996
n20 = 1.4776
1, p. 209
107–108/8
7–9
—
l/—
1.143
n20 = 1.4123; flash point: 106°C; 1, p. 209
150.25
124–125
—
—
l/—
0.9488
1, p. 209
248.39
122–126/5
—
—
l/—
0.978
n20 = 1.3838; flash point: 27°C; viscosity: 0.5 cSt n20 = 1.431; flash point: 122°C; viscosity: 3.0 cSt
220.34
100/4
—
—
l/—
1.02
n20 = 1.431; flash point: 105°C; viscosity: 3.0 cSt
1, p. 210
610.38
103–106/3
—
—
l/—
1.407
n20 = 1.3419
1, p. 211
388.70
159161/1
—
—
l/—
n20 = 1.4370
13, p. 161
206.35
202203
—
—
l/—
0.8870 (14°C) —
237.37
—
—
—
l/—
0.99
n20 = 1.417; flash point: 16°C
1, p. 214
190.36
93/37
—
—
l/—
0.867
Flash point: 50°C
1, p. 214
242.39
100–102/0.3
—
—
l/—
1.018
470.88
187–195/0.05
—
—
l/—
—
332.60
152–153/3
—
—
l/—
0.8842
288.46
114–117/0.4
—
—
l/—
1.015
246.38
95–97/0.25
—
—
l/—
262.42
115–119/1.5
—
—
221.37
95/10
—
254.40
93–96/4
243.28
—
1, p. 208
1, p. 208
1, p. 210
13, p. 164
© 2005 by CRC Press
Compound Isobutyltrimethoxysilane (CH3)2CHCH2Si(OCH3)3 3-Isocyanatopropyltriethoxysilane OCN(CH2)3Si (OC2H5)3 3-Isocyanatopropyltrimethoxysilane OCN(CH2)3Si (OCH3)3 3-Isooctyltrimethoxysilane (CH3)3CCH2CH(CH3)CH2Si (OCH3)3 3-Mercaptopropyltrimethoxysilane HSCH2CH2CH2Si(OCH3)3 3-Mercaptopropylmethyldimethoxysilane HSCH2CH2CH2Si(OCH3)2CH3 3-Mercaptopropyltriethoxysilane HSCH2CH2CH2Si(OC2H5)3 O-(methacryloxyethyl)-N(triethoxysilylpropyl)urethane H2CC(CH3)COOCH2CH2OOCNH (CH2)3Si(OC2H5)3 Methacryloxyethoxytrimethylsilane H2CC(CH3)COOCH2CH2OSi(CH3)3 Methacryloxymethyltriethoxysilane H2CC(CH3)COOCH2Si(OC2H5)3 Methacryloxymethyltrimethoxysilane H2CC(CH3)COOCH2Si(OCH3)3 Methacryloxypropylsilatrane H2CC(CH3)COOCH2CH2CH2Si (-OCH2CH2)3N Methacryloxypropyltrimethoxysilane H2CC(CH3)COO(CH2)3Si(OCH3)3 Methacryloxytrimethylsilane H2CC(CH3)COOSi(CH3)3 2-[Methoxy(polyethyleneoxy)propyl]trimethoxysilane CH3O(CH2CH2O)6-9(CH2)3Si(OCH3)3 3-Methoxypropyltrimethoxysilane CH3OCH2CH2CH2Si(OCH3)3
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
178.30
154
—
—
l/—
0.9330
247.37
130/20
—
—
l/—
205.29
95–98/10
—
—
234.41
90/10
—
196.34
93/40
180.34
Densitya (g/cc)
Miscellaneous
Reference
0.99
n20 = 1.3960; flash point: 42°C; viscosity: 0.8 cSt n20 = 1.419; flash point: 80°C
13, p. 165; 1, p. 214 1, p. 215
l/—
1.06
n20 = 1.4219
1, p. 215
—
l/—
0.887
1, p. 215
—
—
l/—
1.051
96/30
—
—
l/—
1.00
n20 = 1.4176; flash point: 52°C; viscosity: 2 cSt n20 = 1.4502; toxic; flash point: 96°C; viscosity: 2 cSt n20 = 1.4502; toxic; flash point: 93°C
238.38
210
—
—
l/—
Flash point: 88°C
13, p. 168
377.51
—
—
—
l/—
0.993 (25°C) 1.051
n20 = 1.446
1, p. 215
202.32
65/0.9
—
—
l/—
0.928
n20 = 1.4280; flash point: 76°C
1, p. 215
262.38
65–8/2
—
—
l/—
—
220.30
48–50/2
—
—
l/—
1.07
l/—
1.17
301.41
State/Color
— n20 = 1.4271
13, p. 168 1, p. 215 1, p. 215
1, p. 216 1, p. 216
—
n20 = 1.4310; flash point: 92°C; viscosity: 2cSt n20 = 1.4716; flash point: 32°C
1, p. 216
248.35
78–81/1
—
—
l/—
1.045
1, p. 217
158.27
51–52/20
—
—
l/—
0.885
460–590
—
—
—
l/—
1.076
n20 = 1.403; Flash point: 88°C; viscosity: 29cSt
1, p. 218
194.30
98-9/40
—
—
l/—
0.995
Flash point: 53°C
1, p. 218
1, p. 217
© 2005 by CRC Press
174.31
57/15
—
—
l/—
0.858
n20 = 1.4150; flash point: 43°C
1, p. 218
177.32
93/25
—
—
l/—
0.9173
n20 = 1.4224; flash point: 80°C
1, p. 218
193.32
106/30
—
—
l/—
0.978
n20 = 1.4194; flash point: 82°C
1, p. 218
134.25
9495
—
—
l/—
n20 = 1.3275
13, p. 173
106.20
61
136
—
—/—
0.829 (25°C) 0.861
n20 = 1.360
13, p. 173
302.57
140/0.5
—
—
l/—
—
—
13, p. 173
386.73
197/2.0
—
—
l/—
—
—
13, p. 174
210.35
117118/31
—
—
l/—
0.963
n20 = 1.4690
13, p. 174
182.29
199200
—
—
l/—
0.993
13, p. 174
220.25
87–8/3
40
—
l/—
1.175
n20 = 1.4694; toxic; flash point: 76°C n20 = 1.4083; flash point: 85°C
178.30
142
—
—
l/—
0.8948
13, p. 176; 1, p. 219
Methyltrimethoxysilane CH3Si(OCH3)3
136.22
102103
78
—
l/—
0.955
Methyl tri-n-propoxysilane CH3Si(O-nC3H7) 3 Methyltris(methylethylketoxime)silane (CH3(CH3CH2)CNO)3SiCH3 n-Octadecyltriethoxysilane CH3(CH2)17Si(OC2H5)3 n-Octadecyltrimethoxysilane nC18H37Si(OCH3)3 Octyldimethylmethoxysilane CH3(CH2)7CH3Si(CH3)2OCH3 n-Octylmethyldimethoxysilane CH3(CH2)7CH2Si(OCH3)2 n-Octyltriethoxysilane n-C8H17Si(OC2H5)3
220.38
8384/13
—
—
l/—
0.88
n20 = 1.3832; toxic; flash point: 30°C; viscosity: 0.6 cSt; )Hcomb = 1831 kcal/mol n20 = 1.3696; toxic; flash point: 8°C; viscosity: 0.50 cSt; )Hcomb = 1142 kcal/mol n20 = 1.4085
301.46
110–1/2
22
—
l/—
0.982
n20 = 1.4548; flash point: 90°C
1, p. 220
416.76
165169/2
—
—
l/—
0.87
374.68
170/0.1
13–17
—
l/—
0.885
n20 = 1.439; flash point: 140°C
202.42
221–223
—
—
l/—
0.813
n20 = 1.4230; flash point: 82°C
218.41
107108/10 87–89/5 9899/2
—
—
l/—
0.858
n20 = 1.4190; flash point: 94°C
110°C
1, p. 235
257.83
—
—
—
l/—
0.927
n20 = 1.3966; flash point: 11°C
1, p. 235
118.25
7576
—
—
l/—
0.757
104.22
5758
—
—
l/—
0.7560
n20 = 1.374; )Hvap = 8.0 kcal/mol; 13, p. 210 flash point: 18°C n20 = 1.3678; flash point: 30°C 13, p. 211
132.28
100–101/735
—
—
l/—
0.768
n20 = 1.384
13, p. 211
304.46
—
6365
—
s/—
—
13, p. 220
264.40
—
97
—
l/—
0.92
)Hvap = 20.2 kcal/mol; )Hcomb = 10,962.9 12.6 kJ/mol; )Hform = 671.1 12.6 kJ/mol n20 = 1.386; flash point: 14°C
222.32
217–225
—
—
l/—
1.150
n20 = 1.386; flash point: 99°C
1, p. 238
130.26
99100/170
—
—
l/—
0.790
n20 = 1.3983; flash point: 3°C
13, p. 225
1, p. 238
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Vinylmethyldiethoxysilane (CH2CH)Si(OC2H5)2CH3 O-(vinyloxyethyl)-N(triethoxysilylpropyl)urethane CH2CHOCH2CH2OOCNH(CH2)3Si (OC2H5)3 Vinyloxytrimethylsilane H2CCHOSi(CH3)3 Vinyltriethoxysilane CH2CHSi(OC2H5)3
160.29
133134
—
—
l/—
0.858
335.47
60–65/0.1–0.2
—
—
l/—
—
—
116.23
74–75
—
—
l/—
0.77
n20 = 1.3880; flash point: 10°C
190.31
160161
—
—
l/—
0.903
Vinyltriisopropenoxysilane CH2CHSi(OC(CH3)CH2)3 Vinyltriisopropoxysilane CH2CHSi(O-iC3H7)3 Vinyltrimethoxysilane CH2CHSi(OCH3)3 Vinyltriphenoxysilane CH2CHSi(OC6H5)3 Vinyltris-t-butoxysilane CH2CHSi(OtC4H9)3 Vinyltris(2-methoxyethoxy)silane CH2CHSi(OCH2CH2OCH3)3 Vinyltris(methyethylketoximino)silane CH2CHSi(ONC(CH3)CH2CH3)3
226.35
73–75/12
—
—
l/—
0.934
n20 = 1.3960; toxic; flash point: 13, p. 227; 44°C; viscosity: 0.70 cSt; )Hvap 1, p. 240 = 6.8 kcal/mol; )Hform = 463.5 kcal/mol n20 = 1.4360 1, p. 240
232.39
179–181
—
—
l/—
0.8659
n20 = 1.3961; flash point: 51°C
1, p. 240
148.23
123
—
—
l/—
0.970
334.45
210/7
—
—
l/—
13, p. 227; 1, p. 241 13, p. 227
274.47
54/2
—
—
l/—
1.130 (25) 0.869
n20 = 1.3930; toxic; flash point: 28°C; viscosity: 0.6 cSt n20 = 1.562 (25)
280.39
284–286
—
—
l/—
1.0336
n20 = 1.4271; flash point: 115°C 1, p. 241
313.47
113/0.1
22
—
l/—
0.982
Flash point: 91°C
1, p. 241
194.30
127130/44
—
—
l/—
1.006
n20 = 1.4907
13, p. 184
234.37
106107/1
—
—
l/—
—
n20 = 1.5068; flash point: 105°
13, p. 184; 1, p. 216
Compound
State/Color
Densitya (g/cc)
Miscellaneous n20 = 1.4000; flash point: 16°C
—
Reference 13, p. 225; 1, p. 239 1, p. 239
1, p. 239
13, p. 227
VI. Ketoxysilanes Phenyldimethylacetoxysilane (95%) C6H5Si(CH3)2OOCCH3 (Phenyldimethylsilyl)methylmethacrylate C6H5Si(CH3)2CH2OOCC(CH3)CH2
© 2005 by CRC Press
Silver Compounds I. Silver Alkoxides and Diketonates 403.05
—
160
—
s/—
—
423.1
—
118–189
—
s/—
—
206.98
—
82–86
—
s/—
—
Light sensitive; decomposes slowly at >70°C
1, p. 249
256.14
—
172–175
—
s/—
—
Soluble in pyridine
1, p. 248
Silver butylacetyllide C4H9C}CAg
189.01
—
—
—
—/—
—
2, p. 723; 8, p. 4
Silver phenylacetylide C6H5C}CAg
209.00
—
—
—
—/—
—
More stable than alkyl/aryl analogues; soluble in chloroform, CCl4, ppyridine, benzene More stable than alkyl/aryl analogues; soluble in chloroform, CCl4, U^WNINSJ; UTQ^µJWNH NS SFYZWJ
Phenyl silver [Ag(C6H5)]n
184.97
—
74 (decomposes)
—
s/—
—
Styrenylsilver Ag(CH = CHC6H5)
211.01
—
—
—
—/—
—
Silver I 6,6,7,7,8,8,8-Heptafluoro-2,2dimethyl-3,5-octanedionate AgOC(C3F7)CHC(C(CH3)3)O Silver hexafluoropentanedionatecyclooctadiene OC(CF3)CH(CF3)COAg-cycloC8H12 Silver (I) 2,4-pentanedionate Ag(OC(CH3)CH(CH3)CO)
Light sensitive
1, p. 248
—
1, p. 248
II. Silver Alkyl Thiol Amide Silver diethyldithiocarbamate AgS2CN(CH2CH3)2 III. Silver Alkylenyls
2, p. 723
IV. Arylsilver compounds Polymeric; not very sensitive to 8, p. 4 oxygen, water; slightly sensitive to light; slightly soluble in benzene, CHCl, pyridine; insoluble in aliphatic hydrocarbons Light, air, and moisture sensitive; 2, p. 719 complete decomposition requires several days at room temperature or hours in boiling ethanol
© 2005 by CRC Press
Compound
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
166.92
—
—
—
—/—
3.259
178.93
—
—
—
—/—
—
—
1, p. 248
320.90
—
292–294
—
s/—
—
—
1, p. 248
196.94
—
120–122
—
s/—
—
192.95
—
—
—
—/—
—
—
1, p. 249
279.13
—
106–116
—
s/—
—
—
1, p. 249
279.07
—
—
—
—/—
—
Soluble in acetonitrile
1, p. 249
220.88
—
251–253
—
s/—
—
Soluble in dimethyl-acetamide
1, p.249
State/Color
Densitya (g/cc)
Miscellaneous
Reference
V. Silver Salts Silver acetate CH3COOAg Silver acrylate CH2CHCOOAg Silver heptafluorobutryrate C3F7COOAg Silver lactate CH3CH(OH)COOAg Silver methacrylate CH2C(CH3)COOAg Silver neodecanoate C6H13C(CH3)2COOAg Silver p-toluenesulfonate p-CH3C6H4SO3)Ag Silver trifluoroacetate CF3COOAg
Soluble in water
Soluble in water
1, p. 248
1, p. 249
Sodium Compounds I. Sodium Alkoxides and Diketonates Sodium bis-2-(allyloxymethyl)-butoxide 10% in toluene CH2CH3(CH2CHCH2OCH2)2CCH2ONa Sodium bis(2-propenoxyethyl)ethoxide 10% in toluene (CH2CHCH2OCH2CH2)2CHCH2ONa Sodium n-butoxide 20% in n-butanol NaO-n-C4H9 Sodium t-butoxide NaOC(CH3)3 Sodium ethoxide 95% NaOC2H5 Sodium Hexafluoropentanedionate Na(-OC(CF3)CH(CF3)CO-)
236.28
—
—
—
s/—
—
—
1, p. 251
236.28
—
—
—
s/—
—
—
27, p. 37
96.11
—
—
—
—/—
0.86
Flash point: 36°C
1, p. 251
96.11
—
263270
—
s/—
1.104
1, p. 251
68.05
—
260
—
s/—
—
Soluble in diglyme, THF (33g/l), cyclohexane Solubility: ethanol, 20° 250 g/l
230.04
—
230
—
s/—
—
1, p. 252
Soluble in water, methanol, warm 1, p. 252 methoxypropanol, propanol
© 2005 by CRC Press
Sodium hexafluoropentanedionate NaOC(CF3)CH(CF3)CO Sodium methoxide 95% NaOCH3 Sodium methoxyethoxide 20% NaOCH2CH2OCH3 Sodium methylacetoacetate Na-OC(CH3O)CH(CH3)COSodium methoxide 25% in methanol NaOCH3 Sodium 2-methyl-2-butoxide Sodium t-pentyloxide NaOC(CH3)2C2H5 Sodium 2, 4-pentanedionate Na(OC(CH3)CH(CH3)CO) Sodium isopropoxide 15% in isopropanol (frozen solution) NaOCH(CH3)2 Sodium n-propoxide 20% CH3CH2CH2ONa
230.04
—
230
—
s/—
—
Soluble in water, methanol, 1, p. 252 propanol Soluble in methanol, 20°(330g/l) 1, p. 253
54.02
—
>300(d)
—
s/—
—
116.09
—
—
—
—/—
—
—
1, p. 253
138.10
—
—
—
—/—
—
—
1, p. 253
54.02
—
—
—
—/—
0.945
110.13
—
200 (decomposes)
—
s/—
—
122.09
—
210
—
s/—
—
82.08
—
7075
—
s/—
0.82
82.08
—
—
—
—/—
38.02
—
—
—
s(Powder)/ —
—
Decomposes without melting; burns explosively in air, irritant; corrosive
8, p. 1305
82.03
—
324(d)
—
s/—
—
Soluble in methanol (210g/l)
1, p. 250
229.24
—
—
—
—/—
—
—
1, p. 250
94.04
—
230(d)
—
s/—
—
—
1, p. 250
144.12
—
—
—
—/—
1.25
—
1, p. 251
237.36
—
—
—
—/—
1.09
232.31
—
—
—
—/—
1.14
n20 = 1.3700; flash point: 29°C; viscosity (25°C): 2025 cSt —
1, p. 253 1, p. 254
—
1, p. 254
Flash point: 12°C
1, p. 252
0.866 Flash point: 23°C (solution in propanol)
1, p. 254
II. Alkyl Sodium Methyl sodium CH3Na
III. Sodium Salts Sodium acetate CH3COONa Sodium 2-acrylamido-2-methylpropane CH2CHC(O)ONHC(CH3)2CH2SO3Na Sodium acrylate CH2CHCOONa Sodium allylsulfonate CH2CHCH2SO3Na Sodium di-n-butyldithiocarbamate NaS2CN((CH2)3CH3)2 Sodium di(isobutyl)dithiophosphinate NaS2P(CH2CH(CH3)2)2
Soluble in water —
1, p. 251 1, p. 251
© 2005 by CRC Press
Compound Sodium dimethyldithiocarbamate NaS2CN(CH3)2 Sodium formate HCOONa Sodium fumarate NaOOCHCHCOONa Sodium itaconate NaOOCC(CH2)CH2COOH Sodium maleate cis-NaOOCHCHCOONa Sodium methacrylate CH2C(CH3)COONa Sodium phenoxide C6H5ONa Sodium thiophenoxide C6H5SNa Sodium trifluoroacetate CF3COONa Sodium trifluoromethanesulfonate CF3SO3Na Sodium trimethylsilanolate (CH3)3SiONa Sodium vinylsulfonate CH2CHSO3Na
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
143.21
—
—
—
68.02
—
253
160.04
—
174.06
Densitya (g/cc)
Miscellaneous
—/—
—
—
1, p. 252
—
s/—
1.92
—
1, p. 252
>300
—
s/—
1.92
—
1, p. 252
—
—
—
—/—
—
—
1, p. 253
160.04
—
—
—
—/—
—
—
1, p. 253
108.07
—
310
—
s/—
2.703
116.10
—
—
—
—
132.17
—
>300(d)
—
—/white to reddish s/
Soluble in warm methanol, water, 1, p. 253 hot dimethylacetamide Decomposes in CO2 1, p.,254
—
Soluble in water
1, p. 254
136.0
—
207 (d)
—
s/—
—
Soluble in trifluoroacetic acid
1, p. 254
172.05
—
253–255
—
s/—
—
—
1, p. 255
112.18
—
147–150
—
s/—
—
—
1, p. 255
130.11
—
—
—
l/yellow
State/Color
1.206
Soluble in water, methanol
Reference
1, p. 255
Strontium Compounds I. Strontium Alkoxides and Diketonates Strontium hexafluoropentanedionate Sr(OC(CF3)CH(CF3)CO)2 Strontium methoxypropoxide 20% Sr(OCH(CH3)CH2OCH3)2 Strontium 2,4-pentanedionate Sr(OC(CH3)CH(CH3)CO)2
501.75
—
220/0.02
s/—
—
—
260 (decomposes) —
297.84
—
—/—
0.99
285.84
—
220
—
s/—
—
— Soluble in methoxypropanol
1, p. 256 1, p. 256
Solubility in water at 30°C: 21 g/l 1, p. 256
© 2005 by CRC Press
Strontium isopropoxide ((CH3)2CHO)2Sr Strontium 2,2,6,6-tetramethyl-3,5heptanedionate Sr(OC(C(CH3)3)CH(C(CH3)3)CO)2
205.80
—
130
—
s/—
—
—
1, p. 256
453.94
—
110–112
230/0.05
s/—
—
—
1, p. 256
—
II. Dialkyl and Diaryl Strontium Compounds Dibenzylstrontium (Sr(CH2C6H5)2
269.89
—
—
—
Dimethylstrontium Sr(CH3)2 Diphenylstrontium Sr(C6H5)2
117.69
—
—
—
s/yellow-red (in solution) —/—
241.83
—
—
—
s/orange
—
—
Soluble in ether tetrahydrofuran; 2, p. 231; decomposes at ambient 8, p. 2221 temperature Unstable in solution at room 2, p. 230 temperature Unstable in solution at room 2, p. 230; temperature; sp soluble in 8, p. 2221 tetrahydrofuran
III. Dialkenyl and Dialkynl Strontium Compounds Bisphenyl ethynyl strontium Sr(C}CC6H5)2
289.88
—
—
—
s(powder)/ white
—
Diallyl strontium Sr(CH2CH = CH2)2 Strontium divinyl Sr(CH = CH2)
169.77
—
—
—
—
114.67
—
—
—
s(powder)/ colorless —/orangeyellow
205.72
—
—
—
—
Thermally stable; decomposes at 2, p. 231; >360ºC; insoluble in benzene; 8, p. 2221 soluble in tetrahydrofuran and liquid ammonia Pyrophoric; soluble in 8, p. 2221 tetrahydrofuran Soluble in tetrahydrofuran 2, p. 231; 8, p. 2221
IV. Strontium Salt Strontium acetate (CH3COO)2Sr
s/—
2.099
—/—
—
Dehydrates at >150°C
1, p. 256
Sulfur Compounds I. Sulfur Alkyls Diethylsulfur S(C2H5)2
90.18
—
—
—
—
3, p. 72
© 2005 by CRC Press
Compound
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
State/Color
Densitya (g/cc)
Miscellaneous
Reference
Tantalum Compounds I. Tantalum Alkoxides and Diketonates Tantalum V n-butoxide Ta(O-n-C4H9)5
546.51
217/0.15
—
—
l/—
1.310
n20 = 1.48302
1, p. 257 4, p. 71
Tantalum V t-butoxide Ta(O-C(CH3)3)5 Tantalum V ethoxide Ta(OC2H5)5
546.52
96/0.1
—
—
1/—
—
Molecular complexity: 2.02 Flash point: 66°C Molecular complexity: 1.00
406.26
145/0.1
18–19
—
l/—
1.58
Molecular complexity: 1.98
1, p. 257
Tantalum V-1-ethylpropoxide Ta(O-CH(C2H5)2)5 Tantalum V methoxide Ta(OCH3)5 Tantalum 1-methyl butoxide Ta(O-CH(CH3)(nC3H7))5 Tantalum 3-methyl butoxide Ta(OCH2CH2CH(CH3)2)5 Tantalum n-pentoxide Ta(O-n-C5H11)5 Tantalum n-propoxide Ta(O-n-C3H7)5 Tantalum isopropoxide Ta(O-CH(CH3)2)5 Tantalum tetraethoxide dimethylaminoethoxide (C2H5O)4TaOCH2CH2N(CH3)2) Tantalum V tetraethoxidepentanedionate (OC2H5)4Ta(-OC(CH3)CH(CH3)CO-) Tantalum V trifluoroethoxide Ta(OCH2CF3)5
616.66
146/0.15 153/0.1
—
—
1/—
—
Soluble in toluene, ethanol Molecular complexity: 1.02
4, p. 71 4, p. 71
50
—
—/—
—
Molecular complexity: 1.98.
616.66
189/10; 130/0.2 148/0.1
—
—
1/—
—
Molecular complexity: 0.99
1, p. 258; 4, p. 71 4, p. 71
616.66
210/0.1
—
—
1/—
—
Molecular complexity: 1.98
4, p. 71
616.66
239/0.02
—
—
1/—
—
Molecular complexity: 2.01
4, p. 71
476.39
184/0.15
—
—
1/—
—
Molecular complexity: 1.95
4, p. 71
458.24
122/0.1
—
—
1/—
—
Molecular complexity: 1.00
4, p. 71
449.33
125/1
—
—
l/—
1.5
—
1, p. 258
460.30
95/0.5
44–45
—
s/—
1.5
—
1, p. 258
676.14
70/2
110
—
s/—
1.9
—
1, p. 258
336.12
4, p. 71
© 2005 by CRC Press
II. Miscellaneous Tantalum Compounds Bismethylcyclopentadienyldimethyltantalum (CH3C5H4)2Ta(CH3)2 Tantalum pentakis(dimethylamide) Ta(N(CH3)2)5 Trimethyl dichlrotantalum (CH3)3TaCl2
369.26
100–102
90/10–4
—
401.33
—
>150
100/0.01
296.96
Volatile
—
—
Crystalline solid/deep red s/—
—
—
21
—
—
1, p. 258
s/pale yellow
—
Air and moisture sensitive; very soluble in organic solvent
8, p. 2225; 22
Crystalline solid/ yellow (in toluene) Crystalline solid/—
—
Air sensitive
2, p. 206; 8, p. 2234
—
Crystallized by subliming in high vacuum
2, p. 207; 8, p. 2234
Technetium Compounds I. Technetium Carbonyls Biscyclopentadienyl hydridotechnetium TcH(M-C5H5)2
229.20
—
—
—
Cyclopentadienyl technetiumtricarbonyl Tc(CO)3(M-C5H5)
247.13
—
87.5
—
Tellurium Compounds I. Alkyl Tellurium Compounds Bistrifluoromethyl ditelluride (CF3)2Te2 Dibenzyltelluride (C6H5CH2)2Te Di-n-butyltelluride (C4H9)2Te Di-t-butyltelluride (C4H9)2Te Diethyltelluride (C2H5)2Te Dimethyltelluride (CH3)2Te Dimethylditelluride (CH3)2Te2 Di-i-propyltelluride (C3H7)2Te
393.21
—
73
—
1/—
—
Thermally unstable
27
272.39
—
—
—
1/—
—
Flammable
6, p. 90
241.82
—
—
—
1/—
—
Flammable
6, p. 90
241.82
132–135
—
—
1/—
1.334
Flammable
6, p. 90
185.72
137–138
—
—
1/—
1.599
Flammable
6, p. 90
157.68
82
10
—
1/—
—
Flammable
6, p. 90
270.24
—
—
—
1/—
—
Flammable
6, p. 90
213.77
49
—
—
1/—
—
Flammable
6, p. 90
© 2005 by CRC Press
Compound Di-n-propyltelluride (C3H7)2Te Tellurium IV diethyldithiocarbamate Te(S2CN(CH2CH3)2) Tellurium IV ethoxide Te(OC2H5)4
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
213.77
—
—
—
1/—
—
720.69
—
108–109
—
s/—
1.55
307.84
88–90/2
—
—
l/dark brown
1.52
State/Color
Densitya (g/cc)
Miscellaneous
Reference
Flammable
6, p. 90
Soluble in toluene, carbon disulfide Light sensitive Decomposes t > 100°C
1, p. 260 1, p. 260
Terbium Compounds I. Terbium Alkoxides and Diketonates Terbium 2,4-pentanedionate trihydrate Tb(–OC(CH3)CH(CH3)CO–)3 Terbium 2,4-pentanedionate trihydrate Tb(-OC(CH3)CH(CH3)CO-)3 Terbium 2,2,6,6-tetramethyl-3,5heptanedionate Tb(-OC(C(CH3)3)CH((CH3)3C)CO-)3
456.25/ 510.31 456.25/ 510.31 708.74
—
169–173
—
s/—
—
Hygroscopic
1, p. 173
—
169–170
—
s/—
—
1, p. 173
—
155–156
—
s/—
—
Soluble in tetrahydrofuran; hygroscopic )Hsub = 33.8 kcal/mol; soluble in toluene, THF
354.21
—
316
230 (under vacuum)
Crystalline solid/ colorless
—
336.06
—
—
—
—/—
—
—
1, p. 173
II. Organoterbium Compounds Tricyclopentadienyl terbium Tb(C5H5)3
Soluble in tetrahydrofuran; hydrolyzed by water
8, p. 2232
III. Terbium Salt Terbium acetate (CH3COO)3Tb
—
1, p. 173
Thallium Compounds I. Thallium Alkoxides and Diketonates Thallium benzoylacetonate Tl(–OC(C6H5)CH(CH3)CO–) Thallium I ethoxide TlOC2H5
365.55
—
103–104
—
s/—
249.43
—
3
—
l/hazy
3.493
Soluble in benzene
1, p. 261
n20 =1.6714; decomposes at 130°C
1, p. 261
© 2005 by CRC Press
Thallium hexafluoropentanedionateOC(CF3)CH(CF3)COTl Thallium 2,4-pentanedionate Ti(–OC(CH3)CH(CH3)CO–) Thallium 2,2,6,6-tetramethyl-3,5Heptanedionate Tl(OC(C(CH3)3)CH(C(CH3)3)CO)
411.42
—
126–128
140/0.1
s/—
—
—
1, p. 261
303.50
—
—
100/105
—/—
—
—
1, p. 261
387.62
—
159–164
110/1
s/—
—
—
1, p. 261
Cyclopentadienyl, dimethyl thallium (CH3)2TlC5H5
299.55
—
—
—
Crystalline solid/ colorless
—
Air sensitive, fluxional molecule
Dimethyl thallium methylacetylide (CH3)2(CH3C}C)Tl Dimethyl thallium phenylacetylide (CH3)2(C6H5C}C)Tl
273.51
—
—
—
—/—
—
335.58
—
—
—
—/—
—
Triethyl thallium (C2H5)3Tl Trimethyl thallium (CH3)3Tl
291.57
74/25
43/1
249.49
76/85
38.5
Tri(methylvinyl)thallium (CH3CH2 = CH)3Tl
330.62
—
—
Triphenyl thallium (C6H5)Tl
435.70
—
188–189
Isolated by vacuum sublimation —
Trispentachlorophenyl thallium (C6Cl5)3Tl Trispentafluorophenylthallium (C6F5)3Tl Tristetrachlorophenyl thallium (2,3,5,6-Cl4C6H)3Tl
952.38
—
280
435.70
—
849.04
—
II. Triorganothallium Compounds
>125 s/— (decomposes) >90 s/— (decomposes)
1.952 —
Crystalline solid/ colorless s/—
—
—
s/white
—
139–141
—
s/—
—
209
—
Crystalline solid/ colorless
—
—
2, p. 727; 8, p. 2298; 16; 27 Dimeric in solution 2, p. 727; 17; 27 Toxic 2, p. 727; 8, p. 2310; 17 Light sensitive; may be explosive 2, p. 726; 5, p. 141 Light sensitive; dissociation 2, p. 726; energy for first TI-C: 152 kJ/mol; 5, p. 141; may be explosive; purified by 25 vacuum sublimation Air and light sensitive; 25 decomposes at room temperature If temperature greater than 2, p. 726; melting point, it decomposes 5, p. 141 into Tl and Ph2 — 2, p. 727; 23 — 2, p. 727 —
2, p. 727; 14, p. 11
© 2005 by CRC Press
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
269.48
—
>270
—
s/—
—
283.50
—
109–10
—
s/—
—
249.39
—
101
—
s/off white
494.81
—
—
—
—/—
—
—
325.57
—
27–28
—
s/—
—
—
Biscyclohexyl thallium chloride (cyclo-C6H11)2TlCl
406.14
—
210–230 (explodes)
—
s/—
—
Bis(trans-methylethylenyl) thallium chloride (trans-CH3CH = CH)2TlCl Bis(cis-methylethylenyl) thallium chloride (cis-CH3CH = CH)2TlCl Di/(n-butyl)thallium chloride n-(C4H9)2TlCl Di/(sec-butyl)thallium chloride s-(C4H9)2TICl Di(isobutyl)thallium chloride i-(C4H9)2TlCl Diethyl thallium chloride (C2H5)2TlCl
321.98
—
>310
—
s/—
—
333.99
—
>310
—
s/—
—
354.07
—
—
s/—
—
354.07
—
—
s/—
—
354.07
—
240–250 (explodes) 150 (explodes) —
—
—/—
—
297.96
—
205–206 (decomposes)
—
s/—
—
314.36
—
295 (decomposes)
—
s/—
—
Stable; very high melting point; not very soluble in H2O, alcohol, or other common solvents Stable; very high melting point; not very soluble in H2O, alcohol, or other common solvents Stable; very high melting point; not very soluble in H2O, alcohol, or other common solvents More soluble than lower alkyl analogues Decomposes more easily when heated Decomposes more easily when heated Low solubility in H2O, alcohol; soluble in pyridine, aqueous NH3 Low solubility in H2O alcohol; soluble in pyridine, aqueous NH3
Compound
Formula Weight
State/Color
Densitya (g/cc)
Miscellaneous
Reference
III. Miscellaneous Organothallium Compounds Cyclopentadienylthallium C5H5Tl Methylcyclopentadienyl thallium C5H4TlCH3 Thallium formate HCOOTl Triethylthallium trimethylamine (C6H5)3TlN(CH3)3 Trimethyl thallium (trimethyl phospine) (CH3)3TlP(CH3)3
4.97
Soluble in polar solvents; stable in air, H2O —
2, p. 749
Soluble in water, methanol
1, p. 261
2, p. 750
2, p. 728; 26 2, p. 728
IV. Organohalo Thallium Compounds
Dimethyl thallium bromide (CH3)2TIBr
2, p. 731
2, p. 731
2, p. 731
2, p. 731 2, p. 731 2, p. 731 2, p. 731
2, p. 731
© 2005 by CRC Press
Dimethyl thallium chloride (CH3)2TICl
269.91
—
>280 (decomposes)
—
s/—
—
Dimethylthallium fluoride (CH3)2TIF Dimethyl thallium iodide (CH3)2TlI
253.45
—
—
—
s/—
—
373.37
—
264–266 (decomposes)
—
s/—
—
Di(pentachlorophenyl) thallium chloride (C6Cl5)2TlCl Di(pentafluorophenyl) thallium chloride (C6F5)2TlCl Dipentylthallium chloride ((CH3)3CCH2)2TlCl Diphenyl thallium chloride (C6H5)2TiCl
738.50
—
314
—
s/—
—
573.95
—
237–279
—
s/—
—
382.12
—
>340
—
s/—
—
394.05
—
>310
—
s/—
—
326.01
—
198–202
—
s/—
—
326.01
—
—
s/—
—
363.57
—
198–202 (decomposes) 123–5 (decomposes)
—
s/—
—
More soluble than other diphenyl analogues Stable and soluble in H2O, alcohol, other common solvents Stable; very high melting point; not very soluble in H2O, alcohol, or other common solvents More soluble than lower alkyl analogues Decomposes more easily when heated; toxic —
363.557
—
149–151 (decomposes)
—
s/—
—
—
283.93
—
>250
—
s/—
—
441.30
—
149
—
s/—
—
352.39
—
—
s/—
—
—
2, p. 742
663.96
—
235 (decomposes) —
—
—/—
—
Stable in air, H2O
2, p. 749
441.70
—
—
—
—/—
—
Unstable; ignites spontaneously in air
2, p. 749
337.51
—
102–103 (decomposes)
—
s/—
—
—
2, p. 742
Di-n-propyl thallium chloride n-(C3H7)2TlCl Di(isopropyl)thallium chloride i-(C3H7)2TlCl Fluorophenyl, n5-cyclopentadienyl thallium (3-FC6H4)C5H4Tl Fluorophenyl, n5-cyclopentadienyl thallium 4-FC6H4C5H4Tl Methyl, ethyl thallium chloride CH3(C2H5)TlCl Phenylthallium dibromide C6H5TlBr2 Phenylthallium dichloride C6H5TlCl2 Pentabromocyclopentadienyl thallium C5Br5Tl Pentachlorocyclopentadienyl thallium C5Cl5Tl
Low solubility in H2O, alcohol; soluble in pyridine, aqueous NH3 Toxic Low solubility in H2O, alcohol; soluble in pyridine, aqueous NH3 —
2, p. 731
2, p. 731; 8, p. 2281 2, p. 731
2, p. 731 2, p. 731 2, p. 731 2, p. 731
2, p. 731 2, p. 731; 8, p. 2294 2, p. 750
2, p. 750
Stable; very high melting point; 2, p. 731 not very soluble in H2O, alcohol, or other common solvents — 2, p. 742
V. Organo Acetate Thallium Compounds Methyl thallium diacetate CH3Tl(OOCCH3)2
© 2005 by CRC Press
Compound Phenyl thallium di(trifluoro acetate) C6H5Tl(OOCCF3)2
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
507.52
—
184–189
—
Densitya (g/cc)
Miscellaneous
s/—
—
—
State/Color
Reference 2, p. 742
Thorium Compounds I. Thorium Alkoxides and Diketonates Thorium-t-butoxide Th(OC(CH3)3)4 Thorium 1-diethyl propoxide Th(OC(C2H5)3)4
524.50
160/0.1
—
—
1/–
—
Molecular complexity: 3.4
692.82
148/0.05
—
—
1/—
1.2230
Thorium 1-dimethyl propoxide Th(OC(CH3)2C2H5)4 Thorium ethoxide Th(OC2H5)4 Thorium 1-ethyl, 1-methyl butoxide Th(OCCH3(C2H5)(n-C3H7))4 Thorium 1-ethyl, 1-methyl propoxide Th(OCCH3(C2H5)2)4 Thorium 1-ethyl(1,2 di-methylpropoxide) or Thorium heptoxide Th(OCCH3(C2H5)(i-C3H7))4 Thorium methoxide Th(OCH3)4 Thorium 2,4-pentanedionate Th(–OC(CH3)CH(CH3)CO–)4 Thorium n-propoxide Th(O-n-C3H7)4 Thorium isopropoxide Th(OCH(CH3)2)4
580.61
208/0.3
—
—
1/—
—
Molecular complexity: 1.0; 4, p. 70; surface tension: 22.0; viscosity: 109 0.4920 cSt Molecular complexity: 2.8 4, p. 70
412.28
300/0.05
—
—
1/—
—
Degree of polymerization: 6.0
4, p. 45
692.82
153/0.1
—
—
1/—
—
Molecular complexity: 1.7
4, p. 70
636.71
148/0.1
—
—
1/—
—
692.81
139/0.05
—
—
1/—
—
356.17
—
—
>300/0.05
s/—
—
628.49
—
159–161
160/8
s/—
—
468.39
—
—
—
—/—
—
468.39
200–210/0.1
—
—
1/—
—
Molecular complexity: 3.8
440.34
160/0.03
>190 (decomposes)
—
s/bright yellow
—
Soluble in (CH3)2SO; air sensitive 2, p.195; 8, p.2239
— Molecular complexity: 1.0
— Soluble in toluene —
4, p. 70
4, p. 70 4, p. 70
4, p. 72 27, p. 41 4, p.72 4, p.70
II. Organothorium Compounds Biscyclooctatetraene thorium Th(C8H8)2
© 2005 by CRC Press
Tetraallyl thorium Th(C3H4)4 Tricyclopentadienyl thorium Th(C5H5)3
396.33
—
427.32
—
0 (decomposes) >270 (decomposes)
— —
s/dark yellow s/purple
—
Soluble in benzene
8, p. 2238
—
Soluble in tetrahydrofuran; insoluble in benzene
8, p. 2239
Thulium Compounds I. Thulium Alkoxides and Diketonates Thulium 2,4-pentanedionate, trihydrate Tm(–OC(CH3)CH(CH3)CO–)3 Thulium 2,2,6,6-tetramethyl-3,5heptanedionate Tm(–OC(C(CH3)3)CH(C(CH3)3)CO–)3
466.26/ 520.31 718.75
—
—
—
s/—
—
—
1, p. 174
—
169–172
—
s/—
—
—
1, p. 174
346.07
—
—
—
—/—
—
—
1, p. 174
II. Thulium Salt Thulium acetate (CH3COO)3Tm
Tin Compounds I. Tin Alkoxides and Diketonates Bis(2-ethylhexanoate)tin Tin II Octoate Sn(OOCCH(C2H5)C4H9)2 Bis(Tri-n-butyltin)acetylenedicarboxylate (nC4H9)3SnOOCC2COOSn(nC4H9)3 Diacetonxytin 95% Stannous Acetate Sn(OOCCH3)2
405.11
—
—
—
—/—
1.28
92.11
—
176–177(d)
—
s/—
—
236.79
—
180–183
—
s/—
2.31
Di-n-butyldiacrylatetin (CH2CHCOO)2Sn(nC4H9)2 Di-n-butyldi-n-butoxytin (CH3(CH2)3O)2Sn(nC4H9)2 Di-n-butyldimethacrylatetin (CH2C(CH3)COO)2Sn(nC4H9)2 Di-n-butyl dineodecanoate (CH3(CH2)5C(CH3)2COO)2Sn(nC4H9)2
375.02
—
—
—
—/—
1.175
379.15
136–138/0.05
—
—
l/—
1.122
403.09
—
54–58
—
s/—
1.175
575.44
—
—
—
—/—
1.09
Toxic; flash point: >110°C; soluble in xylene, cyclic siloxanes —
1, p. 266
1, p. 267
Reducing agent; promotes dye 1, p. 269 uptake by fabrics; soluble in acetic acid, water; decomposes at >238°C n20 = 1.4771 1, p. 271 n20=1.4721; flash point: 116°C; soluble in hexane — —
1, p. 271 1, p. 272 1, p. 272
© 2005 by CRC Press
Compound Dioctyldineodecanoatetin (CH3(CH2)6CH2)2Sn(OOCC(CH3)2 C6H13)2 Tetraisopropoxytin isopropanol adduct ((CH3)2CHO)4Sn Tin IV t-butoxide 95% Tetra-t-butoxytin Sn(Ot-C4H9)4 Tin dichloride bis(2,4-pentanedionate) Cl2Sn(–OC(CH3)CH(CH3)CO–)2 Tin 1,1-dimethyl butoxide (tin hexoxide) Sn(OC(CH3)2CH2CH2CH2)4 Tin II ethoxide Sn(OC2H5)2 Tin IV ethoxide Sn(OC2H5)4 Tin II methoxide Sn(OCH3)2 Tin 1-methyl, 1-ethyl propoxide (tin hexoxide) Sn(OCCH3(C2H5)2)4 Tin II oxalate Sn(OOC)2 Tin II 2,4-pentanedionate Stannous acetylacetonate Sn(–OC(CH3)CH(CH3)CO–)2 Tin sodium ethoxide 95% NaSn2(OC2H5)9 Tin tetra-ter-amyloxide, tin tetra(1-methyl butyl) Sn(Ot-Am)4
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
687.66
—
—
—
—/—
355.05
131/1.6
—
—
l/—
—
411.14
99/4
—
—
1/—
—
387.83
202–203
199
—
s/—
—
498.3
—
—
—
1/—
1.0499
208.81
—
200
—
s/—
298.93
—
—
—
180.76
—
242–246
—
488.5
—
—
—
206.72
—
—
316.90
100–105/0.02
25 to 19
665.91
—
>250
—
s/—
—
425.4
—
—
—
—/—
331.11
88–92/0.2
—
—
1/—
State/Color
Densitya (g/cc) 1.03
Miscellaneous
Reference
n20=1.4680 Flash point: 140°C
1, p. 274
Soluble in hydrocarbons, warm isopropanol —
1, p. 278
—
1, p. 278
1, p. 266
Viscosity: 0.0986 cSt
4, p. 108
—
Insoluble in ethanol
1, p. 280
—/—
—
Degree of polymerization: 4.0
4, p. 45
Solid (polymeric) /white 1/—
—
280 s/— (decomposes) — 1/bright yellow
1.1768
3.56 —
—
1, p. 280
Viscosity: 0.4127 cSt
4, p. 108
Solubility: H2O: 0.5 g/1
1, p. 280
—
1, p. 280
Soluble in ethanol, hexane
1, p. 277
1.0984
Surface tension: 21.7 dyn/cm; viscosity: 0.1664 cSt
4, p. 108
1.068
n20 = 1.4846; flash point: 103°C
1, p. 265
II. Alkyl Organotin Compounds Allyltri-n-butyltin (C4H9)3SnCH2CHCH2
© 2005 by CRC Press
Allyltrimethyltin (CH3)3SnCH2CHCH2 Biscyclopentadienyl tin Sn(C5H5)2 Bisphenyl tin cyclobutane (C6H5)2Sn(C4H8) Bis(tri-n-butylstannyl)acetylene (nC4H9)3SnCCSn(nC4H9)3 Bis(tri-n-butyltin)oxide Hexabutyldistannoxane (C4H9)3SnOSn(C4H9)3 Bis(triethyltin)oxide (C2H5)3SnOSn(C2H5)3 Diallyldi-n-butyltin (C4H9)2Sn(CH2CHCH2)2 Di-n-Butylbis(1-thioglycerol)tin Dibutylbis(2,3-dihydroxypropylmercaptan (C4H9)2Sn(SCH2CH(OH)CH2OH)2 Diallyldi-n-butyltin (CH2CHCH2)2Sn(C4H9)2 Di-n-butylbis(dodecylthio)tin 95% Dibutyltindilaurylmercaptide (C4H9)2Sn(S(CH2)11CH3)2 Di-n-butyltin oxide ((C4H9)2SnO)n Di-n-Butyltin Sulfide ((C4H9)2SnS)n Diethyldibutyl tin (C2H5)2Sn(C4H9)2 Dimethyl tin cyclopentane (CH3)2Sn(C5H10) Dioctyltin oxide (SnO(nC8H17)2)n Diphenyldiethyl tin (C2H5)2Sn(C6H5)2 Divinyldi-n-butyltin (CH2CH)2Sn(C4H9)2 1-ethoxyvinyltri-n-butylin C2H5OC(CH2)Sn(C4H9)3
204.87
125–129
—
—
1/—
248.88
—
—
—
329.01
—
33
—
Crystalline solid/white s/none
604.10
140–145/0.1
—
—
l/—
1.170
596.08
180/2
—
—
1/—
1.170
427.75
125/4
—
—
l/—
1.377
315.07
93/0.1
—
—
l/—
1.100
447.24
—
22
—
l/—
1.39
315.07
93/0.1
—
—
l/—
1.100
635.67
160/10
—
—
1/—
1.04
248.92
—
>150(d)
—
s/—
1.58
264.98
—
90–98
—
s/off-white
1.42
291.04
205–208/760
—
—
1/none
—
218.89
63/15
—
—
1/none
—
361.13
—
245-8
331.02
—
154–156
287.01
—
60/0.4
—
l/—
1.122
361.14
85–86/1
—
—
l/—
1.069
245–248 s/— (decomposes) — s/none
1.255 — —
1.30 —
n20 = 1.4734
1, p. 265
Air sensitive; soluble in aprotic solvents Stable to 200ºC
3, p. 72; 8, p. 2184 2, p. 553, 535 n20 = 1.4930; flash point: >110°C 1, p. 266 n20 = 1.4864, viscosity: 25º: 4.8 cSt; flash point: 168°C; surface tension at 25ºC: 30.6 dyn/cm Toxic
1, p. 267
n20 = 1.500 Flash point: 101°C n20 = 1.5691 Flash point: 176°C
1, p. 269
n20 = 1.500 Flash point: 101°C n20 = 1.4992; soluble in toluene, heptane; flash point: >204ºC
1, p. 269
1, p. 267
1, p. 270
1, p. 270
Autoignition temperature: 280ºC; 1, p. 273 polymeric infusion solid Trimeric; soluble in THF, hot 1, p. 273 toluene 2, p. 533, Stable to 200ºC 535 2, p. 533, Stable to 200ºC 535 — 1, p. 275 Stable to 200º n20=1.4749; soluble in hexane, THF Toxic n20 = 1.4760
2, p. 533, 535 1, p. 275 1, p. 275
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Ethynyltri-n-butyltin Tributylstannylacetylene Sn(nBu)3CCH Hexa-n-butylditin Bis(tributyl)tin (Sn(nBu)3)2 Hexamethylditin (Sn(CH3)3)2 Propynyltri-n-butyltin (C4H9)3SnCCCH3 Tetraallytin Sn(CH2CHCH2)4 Tetra-n-butyltin Sn(C4H9)4
315.07
71/0.2
—
—
1/—
1.092
n20 = 1.4760; flash point: 73ºC
1, p. 275
580.08
197–198/1
—
—
1/—
1.148
n25 = 1.5990
1, p. 275
327.59
85–88/45
23–24
—
—/—
1.570
1, p. 276
329.09
277
—
—
l/—
1.082
Flash point: 61ºC; inflames in air at 182ºC —
282.98
—
—
1/—
1.179
n20 = 1.5385; flash point: 75ºC
347.15
69–70/1.5; 128–130/760 145/10
97
—
—/—
1.057
Tetra(chloromethyl)tin (ClCH2)4Sn Tetraethyltin (C2H5)4Sn
316.61
—
49–49.5
—
s/none
234.94
181; 63–65/12
112
—
1/—
1.187
Tetramethyltin (CH3)4Sn
178.83
74-5
53
—
1/—
1.291
Tetra-n-Octyltin Sn(C8H17)4 Tetra-n-pentyltin (CH3(CH2)3CH2)4Sn Trimethyltin hydride Sn(CH3)3H Tetraoctenyl tin (C8H15)4Sn Tetra-n-octyltin Sn(C8H17)4 Tetra(pentachlorophenyl)tin (Cl5C6)4Sn
571.58
224/1
—
—
l/—
0.961
403.11
135/0.25
—
—
l/—
1.016
164.80
59
—
—
1/—
—
Easily oxidized
563.52
268/10
—
—
1/none
—
Stable to 200ºC
571.58
224/1
—
—
1/—
1116.01
—
446–447 (decomposes)
—
s/none
Compound
State/Color
Densitya (g/cc)
—
0.961 —
Miscellaneous
Reference
1, p. 277
2, p. 532; 1, p. 277 n20 = 1.4742, flash point: 107ºC; 2, p. 532; surface tension at 23º: 30.1 dyn/ 1, p. 278 cm; viscosity at 25º: 4.2 cSt 2, p. 532, Stable to 200ºC 535 Flammable; n20 = 1.4725; highly 2, p. 532; toxic; flash point: 53°C 1, p. 278; 6, p. 92 Flammable; n20 = 1.4410; )Hvap: 2, p. 532; 6.8 kcal/mol; )Hform, (gas) 27º: 1, p. 279; 13.6 kcal/mol; Hcomb: 903.5 6, p. 92 kcal/mol; flash point: –12ºC; toxic n20 = 1.4677; decomposesat 1, p. 279 >270°C — 1, p. 279
n20 = 1.4677 Stable to 200ºC
3, p. 72; 8, p. 2165 2, p. 532, 535 1, p. 279 2, p. 532, 535
© 2005 by CRC Press
Tetraisopropyltin Sn(CH(CH3)2)4 Tetra-n-propyltin (C3H7)4Sn Tetratolyl tin (C6H5CH2)4Sn Tetravinyltin (CH2 = CH)4Sn Tin tetra(methyl acetylide) (CH3C}C)4Sn Tin tetracyclopentadienyl (C5H5)4Sn Tri-n-butylmethyltin (C4H9)3SnCH3 Triphenylbutyl tin C4H9Sn(C6H5)3 Vinyltri-n-butyltin (C4H9)3SnCHCH2
n20 = 1.4851
1, p. 278
—
Stable to 200ºC
s/none
—
Stable to 200ºC
—
s/none
—
Stable to 200ºC
139–150
—
s/none
—
Stable to 200ºC
—
81–82
—
s/none
—
Stable to 200ºC
305.07
122–4/11
—
—
l/—
2, p. 532, 535 2, p. 532, 535 2, p. 532, 535 2, p. 532, 535 2, p. 532, 535 1, p. 282
407.12
—
60–62.5
—
s/none
317.09
104–106/3.5
—
—
1/—
1.085
716.02
—
119–123
—
s/—
—
732.07
—
141–143
—
s/—
—
1076.89
—
142–145
—
s/—
—
427.11
420–425
224–227
—
s/none
421.06
—
150–155
—
s/—
—
—
1, p. 265
391.10
—
71–73
—
s/—
—
—
1, p. 265
355.13
132–133/1
—
—
1/—
1.12
n20 = 1.5150
1, p. 269
391.17
—
—
—
—/—
1.116
n20 = 1.5320
1, p. 276
291.04
89/4
—
—
1/–
291.04
131
—
—
1/none
483.22
—
41.5–43
—
226.87
160
55–57
274.92
—
379.07
1.124
1.090 —
— Stable to 200ºC n20 = 1.4776
2, p. 533, 535 1, p. 284
III. Tin Aryls Bis(triphenyltin)oxide Hexaphenyldistannoxane (C6H5)3SnOSn(C6H5)3 Bis(triphenylntin)sulfide (C6H5)3SnSSn(C6H5)3 Bis[tris(2-methyl-2-phenylpropyl)]tin oxide (((C6H5)C(CH3)2CH2)3Sn)2O Tetraphenyltin Sn(C6H5)4
1.490
Antifouling agent; soluble in THF 1, p. 267
—
Toxic; soluble in warm toluene, THF Flash point: 231ºC; stable to 200º; soluble in hot toluene
2, p. 532, 535; 1, p. 268 1, p. 268
1, p. 279
IV. Tin Alkyl and Aryl Compounds Acryloxytriphenyltin (C6H5)3SnOOCCHCH2 Allytriphenyltin (C6H5)3SnCH2CHCH2 Cyclopentadienyltri-n-butyltin C5H5Sn(C4H9)3 Phenyethynyltri-n-butyltin C6H5CCSn(C4H9)3
© 2005 by CRC Press
Compound Phenyltri-n-butyltin (C6H5)Sn(C4H9)3 Tetra-p-tolyltin (p-CH3C6H4) 4Sn Tri-p-tolylchlorotin (p-CH3C6H4)3SnCl Tri-p-tolyhydroxytin (p-CH3C6H4)3SnOH
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
367.13
130/0.2
—
—
1/—
1.125
483.22
—
236–237
—
s/—
—
—
1, p. 279
427.56
—
108
—
s/—
—
—
1, p. 284
409.11
—
108–109
—
s/—
—
—
1, p. 284
340.97
—
—
—
—/—
—
—
1, p. 269
687.46
—
25
>215(d)
370.99
—
—
351.01
—
447.23
State/Color
Densitya (g/cc)
Miscellaneous n20 = 1.5155
Reference 1, p. 277
V. Tin Alkyl Ketonates Carbomethoxyethyltriethoxytin CH3OOCCH2CH2Sn(OC2H5)3 Di-n-butylbis(2-ethylhexylmaleate)tin (C4H9CH(C2H5)CH2OOCCHCHCOO)2 Sn(C4H9)2 Di-n-butylbis(2-methylmaleate)tin (CH3OOCCHCHCOO)2Sn(C4H9)2 Di-t-butyldiacetoxytin (CH3COO)2Sn(tC4H9)2 Dimethylhydroxy(oleate)tin 90% (CH3)2Sn(OH)OOC(CH2)7C2H2(CH2)7CH3 1,3-Diacetoxy-1,1,3,3-tetrabutyltin oxide (C4H9)2(CH3COO)Sn–O–Sn (OOCCH3)(C4H9)2 Di-n-butylbis(2,4-pentanedionate)tin (C4H9)2Sn(OC(CH3)CH(CH3)CO)2 Di-n-butylbis(2-ethylhexanoate)tin (C4H9)2Sn(OOCCH(C2H5)C4H9)2 Di-n-butylbis(2-ethylhexanoxy)tin Dibutyltindioctoate (C4H9)2Sn(OOCCH(C2H5)C4C9)2 Di-n-butylbis(2,4-pentanedionate)tin (C4H9)2Sn(OC(CH3)CH(CH3)CO)2 Di-n-butyldiacetoxytin Dibutyltindiacetate C4H9Sn(OOCCH3)2
l/—
1.145
Flash point = 123°C
1, p. 270
—
—/—
1.36
1, p. 270
104
—
s/—
—
n20 = 1.5005 Flash point: 135°C —
—
—
—
1/—
1.15
n20 = 1.492; viscous liquid; toxic
1, p. 274
599.94
—
56–58
—
s/—
—
Soluble in acetone, THF
1, p. 269
431.13
132/0.4
25–26
—
l/—
1.21
n20 = 1.4653; flash point: 91°C
1, p. 270
519.34
—
—
—
l/—
0.97
Flash point: 26°C
1, p. 270
519.34
215–220/2
54–60
—
—/—
1.070
n20 = 1.4653
1, p. 270
431.13
132/0.4
—
—
1/—
1.2
Flash point: 91ºC
1, p. 270
351.01
142–145/10
10
—
1/—
1.320
n20 = 1.4773; flash point: 143ºC; toxic
1, p. 271
1, p. 271
© 2005 by CRC Press
n-Butyltris(2-ethylhexanoate)tin C4H9Sn(OOCHCH(C2H5)C4H9)3 Di-n-butyldilauryltin Dibutyltin dilaurate (C4H9)2Sn(OOC(CH2)10CH3)2
605.43
—
—
—
—/—
1.105
n20 = 1.4650; flash point: >110ºC 1, p. 268
631.55
—
22–24
—
s/—
1.066
1, p. 272
Di-n-butyl(maleate)tin ((C4H9)2SnOOCCHCHCOO)n
346.98
—
103–105
—
s/white
1.318
Di-n-butyl-S,Sebis(isooctylmercaptoacetate)tin 95% (C4H9)2Sn(SCH2COOiC8H17)2 Dimethyl-S,Sebis(isooctylmercaptoacetate)tin 80% Bis(isooctylthioglycolate)dimethyltin (CH3)2Sn(SCH2COOiC8H17)2 Dimethyldineodecanoatetin Dimethyl tin dineodecanoate (CH3)2Sn(OOCC(CH3)2C6H13)2 Dioctyldilauryltin 95% Dioctyltindilaurate (C8H17)2Sn(OOC(CH2)10CH3)2 Tetraacetoxytin (CH3COO)4Sn Tin II oleate (CH3(CH2)7CHCH(CH2)7COO)2Sn Tri-n-butylacetoxytin (C4H9)3SnOOCCH3 Tri-n-butylbenzoyloxytin 95% (C4H9)3SnOOCC6H5
639.54
—
—
—
—/—
1.120
n20 = 1.4708; flash point: 231°C; viscosity at 25°C: 31–34 cSt; toxic; soluble in benzene, acetone, ether n20 = 1.502; flash point: 204ºC; polymeric solid; white powder; soluble in benzene, organic esters Flash point: 140ºC; toxic
555.38
—
—
—
—/—
1.17
Flash point: 127ºC; viscosity at 25º: 50 cSt; toxic
1, p. 273
491.26
—
6
—
s/—
1.14
n20 = 1.470; flash point: 153ºC
1, p. 274
743.89
—
17–18
—
s/—
0.998
Flash point: 70ºC; toxic
1, p. 274
354.87
—
232–234
—
s/—
—
—
1, p. 277
381.71
—
—
—
—/—
1.06
—
1, p. 280
349.08
—
85–87
—
s/—
1.27
411.14
166–168/1
—
—
1/—
1.193
409.05
—
123
—
s/—
—
Toxic; soluble in toluene, 1, p. 281 methanol n20 = 1.5157; flash point: >110ºC; 1, p. 281 toxic; solubility in H2O at 20ºC: 0.02 g/l; viscosity at 25ºC: 9 cSt Solubility in H2O: 9 mg/l; toxic 1, p. 283
612.14
208/1
—
—
l/—
—
n20 = 1.518
Triphenylacetoxytin (C6H5)3SnOOCCH3
1, p. 272
1, p. 273
VI. Haloalkyl Tin Bis(tri-n-butyltin)sulfide (C4H9)3SnSSn(C4H9)3
1, p. 267
© 2005 by CRC Press
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
77–79/0.2 (decomposes)
—
—
1/—
—
245.27
—
130–139(d)
—
s/—
1.26
241.33
108/30
—
—
l/—
—
282.17
93/10
63
—
—
1.693
Butyl trifluoride tin C4H9SnF3
232.80
—
337–338
—
s/—
—
Butyl triiodide tin C4H9SnI3
556.52
154/5
—
—
1/—
—
Carbomethoxyethyltrichlorotin CH3OOCCH2CH2SnCl3 Chloromethyltrimethyltin ClCH2Sn(CH3)3 Diallyldibromotin (CH2CHCH2)2SnBr2 Dibenzyldibromo tin (C6H5CH2)2SnBr2
312.14
174/4
69
—
s/—
—
213.29
70/57
—
—
—/—
1.507
360.65
77–79/2
—
—
l/—
1.864
460.76
—
123–124
—
s/—
—
Formula Weight
Boiling Point (°C/mmHg)
Butyltribromide tin C4H9SnBr3
415.52
Butylchlorodihydroxytin C4H9Sn(OH)2Cl Butyldimethylchlorotin C4H9Sn(CH3)2Cl n-Butyltrichlorotin C4H9SnCl3
Compound
State/Color
Densitya (g/cc)
Miscellaneous
Reference
Soluble in organic solvents; 2, p. 553 monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition — 1, p. 268 n20 = 1.4922
1, p. 268
n20 = 1.5229; toxic; soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution in nonconducting solvents; close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition —
2, p. 553; 1, p. 268
n20 = 1.4863
2, p. 553
2, p. 553
1, p. 268 1, p. 269
—
1, p. 269
Soluble in organic solvents; 2, p. 553 monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition
© 2005 by CRC Press
Dibenzyldichloro tin (C6H5CH2)2SnCl2
371.86
—
163
—
s/—
—
Dibenzyl diiodide tin (C6H5CH2)2SnI2
554.76
—
88
—
s/—
—
Dibutyldibromo tin (C4H9)2SnBr2
392.73
96/0.1
20
—
Solid–liquid/ —
—
Di-n-butylbutoxychlorotin C4H9OSnCl(C4H9)2 Di-n-butyldibromotin Br2Sn(C4H9)2 Di-n-butyldicholorotin (n-C4H9)2SnCl2
341.48
—
35–38
—
s/—
1.2
392.74
150/10
20
—
l/—
1.739
303.83
153/5
39–41
—
s/—
1.36(50)
Di-t-butyldichlorotin (t-C4H9)2SnCl2 Di-n-butyldifluorotin (C4H9)2SnF2
303.83
66/3
42–43
—
s/—
—
270.92
—
157–159
—
s/—
—
Dibutyl diiodide tin (C4H9)2SnI2
486.73
145/6
—
—
1/—
—
Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition —
2, p. 553
2, p. 553
2, p. 553
1, p. 270
Flash point: >110°C; soluble in 1, p. 271 hexane n50 = 1.499; toxic; flash point: 2, p. 553; 168ºC; soluble in organic 1, p. 271 solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas — 1, p. 271 Toxic; insoluble in most organic 2, p. 553; solvents and H2O; monomer in 1, p. 272 vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; 2, p. 553 monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Diethyldibromo tin (C2H5)2SnBr2
336.62
—
63
—
s/—
—
Diethyldichloro tin (C2H5)2SnCl2
247.72
—
84
—
s/—
—
Diethyldiflouro tin (C2H5)2SnF2
241.81
—
310–320
—
s/—
—
Diethyl diiodo tin (C2H5)2SnI2
430.62
—
44
—
s/—
—
Dimethylbis(dodecylthio)tin (CH3(CH2)10CH2S)2Sn(CH3)3 Dimethyldibromo tin (CH3)2SnBr2
557.58
—
—
—
—/—
1.08
308.57
—
75–77
—
s/—
—
Dimethyldichlorotin (CH3)2SnCl2
219.67
185–190
103–105
—
s/—
—
Compound
State/Color
Densitya (g/cc)
Miscellaneous Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition —
Reference 2, p. 553
2, p. 553
2, p. 553
2, p. 553
1, p. 273
Soluble in organic solvents and 2, p. 553 H2O; monomeric, vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Toxic; soluble in organic solvents 2, p. 553; and H2O; monomer in vapor and 1, p. 274 dilute solution (in nonconducting solvents); close to tetrahedral in gas
© 2005 by CRC Press
Dimethyl diiodide tin (CH3)2SnI2
402.57
—
43–44
—
s/—
—
Dioctyldichlorotin 95% (C8H17)2SnCl2
416.04
175/1
46–48
—
s/—
1.15
Dioctyldifluoro tin (C8H15)2SnF2
379.10
—
125–127
—
s/—
—
Dioctyl diiodide tin (C8H15)2SnI2
594.91
225–230/1
—
—
1/—
—
Diphenyldibromo tin (C6H5)2SnBr2
432.71
—
37
—
s/—
—
Diphenyldichlorotin 95% (C6H5)2SnCl2
343.81
—
41–43
333–337 s/— (decomposes)
—
Diphenyldifluoro tin (C6H5)2SnF2
310.90
—
>300
—
s/—
—
Diphenyldiiodo tin (C6H5)2SnI2
526.71
—
72–73
—
s/—
—
Soluble in organic solvents and H2O; monomeric, vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Toxic; soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Toxic; soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents) Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition
2, p. 553
2, p. 553; 1, p. 274
2, p. 553
2, p. 553
2, p. 553
2, p. 553; 1, p. 275
2, p. 553
2, p. 553
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Dipropyldibromo tin (C3H7)2SnBr2
364.68
—
49
—
s/—
—
Dipropyldichloro tin (C3H7)2SnCl2
275.77
—
81
—
s/—
—
Dipropylfluoro tin (C3H7)2SnF2
242.86
—
262–270
—
s/—
—
Dipropyl diiodide tin (C3H7)2SnI2
458.68
270–273
—
—
1/—
—
Divinyldichlorotin (CH2CH)2SnCl2 Ethyl tribromide tin C2H5SnBr3
243.69
54–56/3
—
—
l/—
1.122
387.46
46/0.1
—
—
1/—
—
Ethyl trichloride tin C2H5SnCl3
254.11
86/12
—
—
1/—
—
Compound
State/Color
Densitya (g/cc)
Miscellaneous Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition —
Reference 2, p. 553
2, p. 553
2, p. 553
2, p. 553
1, p. 275
Soluble in organic solvents; 2, p. 553 monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents; 2, p. 553 monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas
© 2005 by CRC Press
Ethyl trifluoride tin C2H5SnF3
204.75
—
269–272
—
s/—
—
Ethyl triiodide tin C2H5SnI3
528.47
181–184.5/19
—
—
1/—
—
Methyl tribromide tin CH3SnBr3
373.44
—
55
—
s/—
—
Methyltrichlorotin CH3SnCl3
240.08
171
43–48
—
s/—
—
Methyl trifluoride tin CH3SnF3
190.72
—
321–327
—
s/—
—
Methyl triiodide tin CH3SnI3
514.44
—
85
—
s/—
—
Phenyl tribromide tin C6H5SnBr3
435.51
182–3/29
—
—
1/—
—
Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents and H2O; distill at low pressure to avoid thermal decomposition; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Toxic; solute in H2O and organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Insoluble in organic solvents and H2O; monomer in vapor and in dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents and H2O; monomeric, vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition
2, p. 553
2, p. 553
2, p. 553
2, p. 553; 1, p. 276
2, p. 553
2, p. 553
2, p. 553
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Phenyl trifluoride tin C6H5SnF3
252.79
—
~220
—
s/—
—
Phenyl triiodide tin C6H5SnI3
576.51
—
31–32
—
s/—
—
Propyl trichloride tin C3H7SnCl3
268.14
98–99/12
—
—
1/—
—
Propyl trifluoride tin C3H7SnF3
218.77
—
296–299
—
s/—
—
Propyl triiodide tin C3H7SnI3
542.49
200/16 (decomposes)
—
—
1/—
—
Octyltrichlorotin 95% C8H17SnCl3 Phenyltrichlorotin C6H5SnCl3
338.28
150–160/10
—
—
1/—
—
302.16
141–143/25 128/15
—
—
1/—
1.839
2-thienyltri-n-butylin C4H3SSn(C4H9)3 Tin II hexafluoropentanedionate (-OC(CF3)CHC(CF3)O-)2Sn
373.17
155/0.1
—
—
l/—
1.175
532.78
125/2
71–72
—
l/—
—
Compound
State/Color
Densitya (g/cc)
Miscellaneous Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Toxic
Reference 2, p. 553
2, p. 553
2, p. 553
2, p. 553
2, p. 553
1, p. 276
n20 = 1.5851; soluble in organic 2, p. 553; solvents; monomer in vapor and 1, p. 277 dilute solution (in nonconducting solvents); close to tetrahedral in gas n20 = 1.518 1, p. 280 Flash point: 106°C — 1, p. 280
© 2005 by CRC Press
Tribenzylbromo tin (C6H5CH2)3SnBr
471.99
—
125–128
—
s/—
—
Tribenzylchloro tin (C6H5CH2)3SnCl
427.54
—
142–144
—
s/—
—
Tribenzylfluoro tin (C6H5CH2)3SnF
411.09
—
242
—
s/—
—
Tribenzyliodo tin (C6H5CH2)3SnI
518.99
—
102–103
—
s/—
—
Tri-n-butylbromo tin 95% (C4H9)3SnBr
369.95
163/12; 120–122/2
—
—
1/—
1.338
Tri-n-butylchlorotin (C4H9)3SnCl
325.49
171–173/25 152–156/14
—
—
l/—
1.186
Tri-n-butylfluorotin (C4H9)3SnF
309.04
—
248–52
—
s/—
1.28
Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition n20 = 1.5070; toxic; soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid decomposition n20 = 1.4905; toxic; flash point: 120ºC; soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Toxic; insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas
2, p. 553
2, p. 553
2, p. 553
2, p. 553
2, p. 553; 1, p. 281
2, p. 553; 1, p. 281
2, p. 553; 1, p. 282
© 2005 by CRC Press
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
172/10; 108/0.07
—
—
l/—
1.460
285.79
222–224; 224/760
—
—
l/—
1.630
Triethylchloro tin (C2H5)3SnCl
241.33
210
—
—
l/—
—
Triethylfluoro tin (C2H5)3SnF
224.87
—
302
—
s/—
—
Triethyliodo tin (C2H5)3SnI
332.78
234
—
—
l/—
—
Trimethylbromo tin (CH3)3SnBr
243.70
—
2627
—
s/—
—
Formula Weight
Boiling Point (°C/mmHg)
Tri-n-butyliodotin 95% (C4H9)3SnI
416.94
Triethylbromotin (C2H5)3SnBr
Compound
State/Color
Densitya (g/cc)
Miscellaneous
Reference
n20 = 1.5300; stabilized with copper powder; soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas n20 = 1.5260; flash point: 99ºC; highly toxic; soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition
2, p. 553; 1, p. 282
2, p. 553; 1, p. 283
2, p. 553
2, p. 553
2, p. 553
2, p. 553
© 2005 by CRC Press
Trimethylchloro tin (CH3)3SnCl
199.25
154
379
—
s/—
—
Trimethylfluoro tin (CH3)3SnF
182.79
—
375 (decomposes)
—
s/—
—
Trimethyliodo tin (CH3)3SnI
290.70
6768/15
—
—
l/—
—
Tri-n-octylchlorotin (CH3(CH2)6CH2)3SnCl Tri-n-pentylchlorotin (CH3(CH2)3CH2)3SnCl Triphenylbromo tin (C6H5)3SnBr
493.82
—
—
—
—/—
1.041
Flash point: 97°C; toxic; soluble in organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents and H2O; monomeric in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition n20 = 1.478
367.57
120/0.25
—
—
—/—
1.137
n20 = 1.4860
1, p. 283
429.91
—
124–125
—
s/—
—
2, p. 553
Triphenylchlorotin 95% (C6H5)3SnCl
385.46
244/13.5
106; 105
—
s/—
—
Triphenylfluorotin 95% (C6H5)3SnF
368.99
—
—
357 s/— (decomposes)
—
Triphenyliodo tin (C6H5)3SnI
476.91
—
122124
Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Flash point: 70°C; toxic; soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Toxic; insoluble in most organic solvents and H2O; monomer in vapor and in dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition
—
s/—
—
2, p. 553; 1, p. 283
2, p. 553
2, p. 553
1, p. 283
2, p. 553; 1, p. 284
2, p. 553; 1, p. 284
2, p. 553
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Tripropylbromo tin (C3H7)3SnBr
327.86
126127/12
—
—
l/—
—
Tripropylchloro tin (C3H7)3SnCl
283.41
98100/4
—
—
l/—
—
Tripropylfluoro tin (C3H7)3SnF
266.95
—
275
—
s/—
—
Tripropyliodo tin (C3H7)3SnI
374.86
147148/20
—
—
l/—
—
268.91
—
—
s/—
294.99
136139/1.2
220225 (decomposes) —
—
351.10
99100/0.1
—
321.03
—
291.00 292.97
Compound
State/Color
Densitya (g/cc)
Miscellaneous
Reference
Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Insoluble in most organic solvents and H2O; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas Soluble in organic solvents; monomer in vapor and dilute solution (in nonconducting solvents); close to tetrahedral in gas; distill at low pressure to avoid thermal decomposition
2, p. 553
—
—
2, p. 579
l/—
1.286
n20 = 1.4854; flash point: 110°C
1, p. 272
—
l/—
—
—
2, p. 579
124126
—
s/—
—
—
2, p. 579
—
220224
—
s/—
—
—
2, p. 579
—
223226.5
—
s/—
—
—
2, p. 579
2, p. 553
2, p. 553
2, p. 553
VII. Tin Alkyl Alkoxides Butyl trimethoxy tin C4H9Sn(OCH3)3 Di-n-butyldimethoxytin (C4H9)2Sn(OCH3)2 Dibutyldipropoxy tin (C4H9)2Sn(OC3H7)2 Dibutyl tin(2-methyl, 3-methylbutanedionato) (C4H9)2Sn(OCH(CH3)CH(CH3)O) Dibutyl tin propoxide (C4H9)2SnOCH2CH2CH2 Dibutyl tin butanedianato (C4H9)2Sn(OCH2CH2O)
© 2005 by CRC Press
Dimethyl dimethoxy tin (CH3)2Sn(OCH3)2 Ethyl trimethoxy tin C2H5Sn(OCH3)3 Tri-n-butylethoxytin (C4H9)3SnOC2H5 Tri-n-butylmethoxytin (C4H9)3SnOCH3
210.83
—
8687
—
s/—
—
—
2, p. 579
240.85
—
—
s/—
—
—
2, p. 579
335.10
92/0.1
230235 (decomposes) —
—
l/—
1.098
n20 = 1.4672; flash point: 40°C
1, p. 281
321.07
97/0.06
—
—
l/—
1.169
n20 = 1.4745; flash point: 98°C; sensitive to moisture, CO2
Tributyl pentoxy tin (C4H9)3SnOCH2C(CH3)3 Triethyl ethoxy tin (C2H5)3SnOC2H5 Trimethyl methoxy tin (CH3)3SnOCH3 Trimethyl phenoxy tin (CH3)3SnOC6H5 Trioctyl benzoxy tin (C8H15)3SnOCH2C6H5 Triphenyl ethoxy tin (C6H5)3SnOC2H5
377.18
122/0.3
—
—
l/—
—
—
2, p. 577, 579; 1, p. 282 2, p. 579
250.94
8284/11
—
—
l/—
—
—
2, p. 579
194.83
—
75
—
s/—
—
—
2, p. 579
256.90
109/8
—
—
l/—
—
—
2, p. 579
538.28
225/0.2
—
—
l/—
—
—
2, p. 579
395.07
—
112
—
s/—
—
—
2, p. 579
439.47
112/0.05
37–38
—
s/—
1.136
1, p. 266
369.07
—
77
—
s/—
—
n20 = 1.5140 Flash point: 56°C —
316.96
—
4448
—
s/—
—
—
2, p. 554
349.08
—
144145
—
s/—
—
—
2, p. 554
292.97
—
188.5190
—
s/—
—
—
2, p. 554
334.11
86/0.1
—
—
l/—
—
207.87
126
—
—
l/—
1.274
264.92
—
194196
—
s/—
457.26
—
106107
—
s/—
VIII. Organotin Nitrogen Compounds Bis[bis(bistTrimethylsilyl)amino]tin II Sn(N(Si(CH3)3)2) 2 Butylphenyltin diisothiocyanide C4H9(C6H5)Sn(NCS)2 Dibutyltin diisocyanide (C4H9)2Sn(NCO)2 Dibutyltin diisothiocyanide (C4H9)2Sn(NCS)2 Diethyltin diisothiocyanide (C2H5)2Sn(NCS)2 Dimethylaminotri-n-butyltin (CH3)2NSn(C4H9)3 Dimethylaminotrimethyltin (CH3)2NSn(CH3)3 Dimethyltin diisothiocyanide (CH3)2(NCS)2 Dioctyltin diisothiocyanide (C8H15)2Sn(NCS)2
2, p. 554
n20 = 1.4737
1, p. 273 1, p. 273
—
n20 = 1.4630 Flash point: 1°C —
—
—
2, p. 554
2, p. 554
© 2005 by CRC Press
Compound Diphenyltin diisothiocyanide (C6H5)2Sn(NCS)2 Dipropyltin diisothiocyanide (C3H7)2Sn(NCS)2 Tetrakis(diethylamino)tin ((C2H5)2N)4Sn Tetrakis(dimethylamino)tin ((CH3)2N)4Sn Tri-n-butylcyanotin (C4H9)3SnCN Tributyl stannyl (dimethyl) amine (C4H9)3SnN(CH3)2 Tributyl stannyl (phenyl) amine (C4H9)3SnNHC6H5 Tributyltin thiocyanide (C4H9)3SnNCS Triethyl stannyl (dimethyl) amine (C2H5)3SnN(C2H5)2 Triethyltin thiocyanide (C2H5)3SnNCS Trimethyl azide (CH3)3SnN3 Trimethyltin thiocyanide (CH3)3SnNCS Trimethyl tin (dimethyl) amine (CH3)3SnN(CH3)2 Triphenyl stannyl (phenyl) amine (C6H5)3SnNHC6H5 Triphenyl tin azide (C6H5)3SnN3 Triphenyltin thiocyanide (C6H5)3SnNCS Tripropyltin thiocyanide (C3H7)3SnNCS
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
389.06
—
176177
-
321.02
—
135136
407.20
90/0.05
294.99
Densitya (g/cc)
Miscellaneous
s/—
—
—
2, p. 554
—
s/—
—
—
2, p. 554
—
—
l/—
1.104
53–55/0.1
—
—
l/—
1.169
316.06
—
105–107
—
s/—
—
334.11
86/0.1
—
—
l/—
—
—
2, p. 599
382.16
—
—
s/—
—
—
2, p. 599
348.11
155/0.4
140 (decomposes) —
—
l/—
—
—
2, p. 554
278.01
72/2
—
—
l/—
—
—
2, p. 599
263.95
—
33
—
s/—
—
—
2, p. 554
205.81
—
119121.5
—
s/—
—
—
2, p. 554
221.87
—
104106
—
s/—
—
—
2, p. 554
207.87
126
—
—
l/—
—
—
2, p. 599
442.13
—
9596
—
s/—
—
—
2, p. 599
392.03
—
115116
—
s/—
—
—
2, p. 554
408.08
—
172173
—
s/—
—
—
2, p. 554
306.03
1268/0.2
—
—
l/—
—
—
2, p. 554
State/Color
n20 = 1.4800
Reference
1, p. 278 —
Toxic
1, p. 278 1, p. 281
© 2005 by CRC Press
IX. Organotin Carboxylates Acryloxytri-n-butylin (C4H9)3SnOOCCHCH2 Bis(neodecanoate)tin C6H13C(CH3)2COO)2Sn Butyl tin triacetate C4H9Sn(OOCCH3)3 Dibutyl tin diacetate (C4H9)2Sn(OOCCH3)2 Ethyl tin tribenzoate C2H5Sn(OOCC6H5)3 Methacryloxytri-n-butyltin CH2CHC(CH3)COOSn(nC4H9) Phenyl tin tripropionate C6H5Sn(OOCC2H5)3 Tributyl tin acetate (C4H9)3SnOCOCCH3 Tributyl tin benzoate (C4H9)3SnOOCC6H5 Tributyl tin formate (C4H9)3SnOOCH Triethyl tin acetate (C2H5)3SnOOCCH3 Trimethyl tin acetate (CH3)3SnOOCCH3
361.09
—
69–70
—
s/—
—
—
1, p. 265
461.23
—
—
—
—/—
1.16
—
1, p. 266
352.94
—
46
—
s/—
—
—
2, p. 565
351.01
144.5145.5/10
—
—
l/—
—
—
2, p. 565
511.10
—
67.5
—
s/—
—
—
2, p. 565
375.17
—
17–20
—
s/—
1.565
415.01
—
76
—
s/—
—
349.08
—
85
—
s/—
—
—
2, p. 565
411.15
166168/1
—
—
l/—
—
—
2, p. 565
335.05
120125/0.7
—
—
l/—
—
264.92
—
134–135
—
s/—
—
222.84
—
196.5197.5
—
s/—
—
Trimethyl tin formate (CH3)3SnOOCH
208.81
—
146
—
Crystalline solid/white
—
Triphenyl tin acetate (C6H5)3SnOOCCH3 Triphenyl tin benzoate (C6H5)3SnOOCC6H5 Tripropyl tin acetate (C3H7)3SnOOCCH3
409.05
—
121–122
—
s/—
—
471.12
—
84–85.5
—
s/—
—
307.00
—
99100
—
s/—
—
354.06
156157/1
—
—
l/—
—
n20 = 1.4811; soluble in hydrocarbons —
1, p. 276 2, p. 565
Soluble in organic solvents polymeric Soluble in organic solvents
2, p. 565
Low solubility in organic solvents; polymeric; soluble in cyclohexane at 90°C Soluble in CHCl3 and cyclohexane; sp soluble in CCl4; low solubility in organic solvents Relatively more soluble than alkyl analogues Relatively more soluble than alkyl analogues Relatively more soluble than alkyl analogues
2, p. 565
2, p. 565
2, p. 565; 8, p. 2167 2, p. 565 2, p. 565 2, p. 565
X. Organotin Nitrates Tributyl tin nitrate (C4H9)3SnNO3
—
2, p. 569
© 2005 by CRC Press
Compound Trimethyl tin nitrate (CH3)3SnNO3 Triphenyl tin nitrate (C6H5)3SnNO3
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
225.80
—
140
—
s/—
—
412.01
—
184186
—
s/—
—
—
2, p. 569
416.82
—
—
—
—/—
—
—
1, p. 281
439.11
156–157/0.08
31–34
—
s/—
—
320.96
—
6769
—
s/—
—
—
2, p. 571
242.89
—
112
—
s/—
—
—
2, p. 571
491.17
—
228229
—
s/—
—
—
2, p. 571
507.17
—
254256
—
s/—
—
—
2, p. 571
262.95
9899/5
—
—
l/—
—
—
2, p. 581
220.87
8486/25
—
—
l/—
—
—
2, p. 581
282.94
8989.5/1.5
—
—
l/—
—
—
2, p. 581
305.03
105106/2
—
—
l/—
—
—
2, p. 581
291.00
—
—
—
—/—
—
—
2, p. 581
178.83
98100
—
—
l/—
—
State/Color
Densitya (g/cc)
Miscellaneous Deliquescent
Reference 2, p. 569
XI. Organotin Sulphonates/Sulphites Tin II trifluoromethanesulphonate (CF3SO3)2Sn Tri-n-butyl(trifluoromethanesulphonate)tin CF3SO3Sn(C4H9)3 Trimethyl tin (phenyl) sulphonate (CH3)3SnOSO2(C6H5) Trimethyl tin (methyl) sulphite (CH3)3SnOSOCH3 Triphenyl tin (phenyl) sulphite (C6H5)3SnOSOC6H5 Triphenyl tin (phenyl) sulphonate (C6H5)3SnOSO3(C6H5)
Flash point: >110°C
1, p. 283
XII. Organotin Enolates Triethyl tin (1-methylvinyloxide) (C2H5)3SnOC(CH3) = CH2 Trimethyl tin (1-methylvinyloxide) (CH3)3SnOC(CH3) = CH2 Trimethyl tin (1-phenylvinyloxide) (CH3)3SnOC(C6H5) = CH2 Tripropyl tin (1-methylvinyloxide) (C3H7)3SnOC(CH3) = CH2 Tripropyl tin vinyloxide (C3H7)3SnOCH = CH2 XIII. Organotin Hydrides Butyl tin trihydride C4H9SnH3
Monomeric in solution; less 2, p. 586 stable compared with mono and dihydrides
© 2005 by CRC Press
Dibutyl tin chlorohydride (C4H9)2SnClH Dibutyl tin dihydride (C4H9)2SnH2 Dimethyl tin hydride (CH3)2SnH2 Diphenyl tin bromohydride (C6H5)2SnBrH Diphenyl tin hydride (C6H5)2SnH2 Ethyl tin bromodihydride C2H5SnH2Br Methyl tin dihydride CH3SnH2 Phenyl tin bromodihydride C6H5SnH2Br Phenyl tin trihydride C6H5SnH3
269.38
—
35 to 33
—
—/—
—
234.94
70/12
—
—
1/—
—
Monomeric in solution
2, p. 586
150.78
35
—
—
l/—
—
Monomeric in solution
2, p. 586
353.81
—
—
—
s/white
—
Stable only at 78°C
274.92
8993/0.3
—
—
l/—
—
Monomeric in solution
2, p. 586; 8, p. 2188 2, p. 586
229.67
—
—
s/—
—
135.74
014
~65 (decomposes) —
—
l/—
—
277.72
—
—
s/—
—
—
2, p. 586
198.82
5764/106
~65 (decomposes) —
—
l/—
—
2, p. 586
Tri-n-butyltin hydride (C4H9)3SnH Triethyl tin hydride (C2H5)3SnH Trimethyl tin hydride (CH3)3SnH Trioctyl tin hydride (C8H15)3SnH Triphenyl tin hydride (C6H5)3SnH
291.05
—
—
l/—
1.082
206.88
80/0.4; 7681/ 0.7 39/12; 148150
—
—
l/—
—
Monomeric in solution; less stable compared to mono- and dihydrides n20 = 1.4731; flash point: 40°C; monomeric in solution Monomeric in solution
164.80
59
—
—
l/—
—
Monomeric in solution
2, p. 586
453.32
164166/103
—
—
l/—
—
Monomeric in solution
2, p. 586
3351.01
165/0.3; 157/ 0.15
2628
—
l/—
1.374
n20 = 1.632; sensitive to air and light; monomeric in solution
248.96
7678/12
—
—
l/—
—
Monomeric in solution
2, p. 586; 1, p. 284; 8, p. 220 2, p. 586
612.13
208/1
—
—
l/—
—
Not readily hydrolyzed
2, p. 605
443.81
127129/1.5
—
—
l/—
—
Not readily hydrolyzed
2, p. 605
732.07
—
144144.5
—
s/—
—
Tripropyl tin hydride (C3H7)3SnH
—
— Monomeric in solution
2, p. 586
2, p. 586 2, p. 586
2, p. 586; 1, p. 282 2, p. 586
XIV. Organotin Sulfides Bis(tributyltin) sulfide ((C4H9)3Sn)2S Bis(triethyltin) sulfide ((C2H5)3Sn)2S Bis(triphenyltin) sulfide ((C6H5)3Sn)2S
—
2, p. 605
© 2005 by CRC Press
Compound Dibutyl tin bis(methylthiolate) (C4H9)2Sn(SCH3)2 Dimethyl tin bis(methylthiolate) (CH3)2Sn(SCH3)2 Ethyl tin tris(methylthiolate) C2H5Sn(SCH3)3 Methyl tin tris(ethylthiolate) CH3Sn(SC2H5)3 Trimethyl tin methylthiolate (CH3)3SnSCH3 Trimethyl tin isopropylthiolate (CH3)3SnSi-C3H7 Triphenyl tin phenylthiolate (C6H5)3SnSC6H5
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
327.11
81/0.1
—
—
l/—
242.95
44/0.05
—
—
1/colorless
1.547
nD20 = 1.6003
289.04
66/0.001
—
—
l/—
1.548
nD20 = 1.6232
317.09
90/0.05
—
—
l/—
1.469
nD20 = 1.5972
211.77
163
—
—
l/—
1.43
nD20 = 1.5303
305.72
2425/0.01
—
—
l/—
—
522.73
—
9899.5
—
s/colorless (in water)
—
375.17
—
17–20
—
s/—
226.88
160–163
—
—
427.54
—
142–144
403.60
—
367.02
—
State/Color
Densitya (g/cc)
Miscellaneous
—
—
2, p. 605
—
2, p. 605; 8, p. 2169 2, p. 605; 8, p. 2171 2, p. 605; 8, p. 2177 2, p. 605; 8, p. 2168 2, p. 605
Reference
Soluble in organic solvents
2, p. 605; 8, p. 2207
1.565
n20 = 1.4811
1, p. 276
l/—
1.257
1, p. 280
—
s/—
—
n20 = 1.4914 Flash point: 40°C Soluble in ethyl acetate
129–130
—
s/—
—
128
—
s/—
—
—/—
1.08
XV. Miscellaneous Tin Compounds Methacryloxytri-n-butyltin H2CC(CH3)COOSn(C4H9)3 Soluble in hydrocarbonsTetravinyltin Sn(CHCH2)4 Tribenzylchlorotin (C6H5CH2)3SnCl Tricyclohexychlorotin (C6H11)3SnCl Triphenylhydroxytin (C6H5)3SnOH
Soluble in ethanol, ether, toluene, chloroform Toxic; soluble in warm THF
1, p. 281 1, p. 283 1, p. 284
Titanium Compounds I. Titanium Alkoxides and Diketonates O-Allyloxy(polyethyleneoxy)triisopropoxytitanate (iC3H7O)3Ti-(OCH2CH2)10CH2CHCH2
660–780
—
—
—
—
1, p. 289
© 2005 by CRC Press
(2-Methacryloxyethoxy)triisopropoxytitanate (CH2C(CH3)COOCH2CH2O-)Ti (OiC3H7)3 Methyltitanium triisopropoxide (iC3H7O)3TiCH3 Titanium allylacetoacetatetriisopropoxide (iC3H7O)3Ti (-OC(OCH2CHCH2)CHC(CH3)O-) Titanium bis(triethanolamine)diisopropoxide 80% in isopropanol (OiC3H7)2Ti-(N (CH2CH2OH)3)2 (mixed chelates) Titanium isobutoxide Tetraisobutyl titanate Ti(OiC4H9)4 Titanium n-Butoxide Tetrabutyltitanate (nC4H9)4Ti Titanium di-n-butoxide (Bis-2,4-pentanedionate) (-OC(CH3)CHC(CH3)O-)2 Ti(OnC4H9)2 Titanium 1,2-dimethyl propoxide(titanium pentoxide) Ti(OCH(CH3)CH(CH3)2)4 Titanium 1,1-dimethyl propoxide(titanium pentoxide) Ti(OC(CH3)2C2H5)4 Titanium 2,2-dimethylpropoxide (titanium pentoxide) Ti(OCH2C(CH3)2CH3)4 Titanium iisopropoxide bis(Ethylacetoacetate) (C3H7O)2Ti (OC(OC2H5)CH (CH3)CO)2
354.29
—
—
—
—/—
1.05
—
1, p. 292
240.18
50–52/0.02
10
—
l/—
—
—
1, p. 289
358.25
—
—
—
—/—
1.06
—
1, p. 289
462.42
—
—
—
—/—
1.065
n20 = 1.488; flash point: 12°C; 1, p. 289 viscosity at 25°C: 90 cSt; soluble in H2O and isopropanol
340.36
141/1
—
—
l/—
1.02
n20= 1.495; )Hform = 403 kcal/mol
340.36
142.7/5 135/1 98/0.1
40
—
l/—
0.998
392.32
—
—
—
—/—
1.085
Flash point: 76°C; toxic; viscosity 1, p. 290; at 25°C: 67 cSt; dipole moment: 4, p. 47, 1.68; )Hform = 399 63 kcal/mol; n20 = 1.493; degree of polymerization: 1 Flash point: >110°C 1, p. 290 Viscosity (25°): 3545 cSt
396.45
131/0.5
—
—
l/—
—
Degree of polymerization: 1.0
4, p. 47, 63
396.45
98/0.1; 142.7/5
—
—
l/—
—
Degree of polymerization: 1.0
4, p. 47, 63
396.45
105/0.05
—
—
l/—
—
Degree of polymerization: 1.3
4, p. 47, 63
452.02
—
—
—
—/—
1.05
Toxic; viscosity at 25°C: 4555 cSt; flash point: 27°C
1, p. 290
1, p. 291
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Titanium diisopropoxide bis (Tetramethylheptanedionate) (-OC(C(CH3)3)CHC(C(CH3)3)CO-)2 Ti(OiC3H7)2 Titanium diisopropoxy (bis-2,4pentanedionate) 75% in isopropanol (C3H7O)2Ti (OC(CH3)CH(CH3)CO)2 Titanium ethoxide Ti(OC2H5)4
532.60
150/0.1
170–177
—
364.26
—
—
228.14
122/1; 103/0.1
Titanium 2-ethylhexoxide Tetraoctyltitanate Ti[OCH2CH(C2H5)C4H9]4 Titanium 1-ethylpropoxide (titanium pentoxide) Ti(OCH(C2H5)2)4 Titanium lactate (CH3CH(OH)COO)2Ti Titanium methoxide 95% Tetramethyl titanate Ti(OCH3)4 Titanium methacrylate triisopropoxide CH2C(CH3)COO-Ti(OiC3H7)3 Titanium methacryloxyethylacetoacetate triisopropoxide (-OC(OCH2CH2OOCC(CH3)CH2) CH(CH3)CO-)Ti(OiC3H7)3 Titanium methoxypropoxide 95% Tetramethoxypropyl titanate Ti(OCH(CH3)CH2OCH3)4 Titanium 3-methylbutoxide (titanium pentoxide) Ti(O(CH2)2CH(CH3)2)4
564.79
Compound
Densitya (g/cc)
Miscellaneous
s/—
—
—
—
—/—
0.992
n20 = 1.4935; flash point: 12°C; viscosity at 25°C: 11 cSt
—
—
l/—
1.107
194/0.25
—
—
l/—
0.937
n20 = 1.5043; flash point: 28°C; 1, p. 291; 4, p. 45, molecular complexity: 2.4; 63 surface tension at 25°C: 23.1 dyn/cm; degree of polymerization: 2.4; viscosity at 25°C: 40 cSt; )Hvap = 21.6 kcal/ mol; )Hform = 349 kcal/mol Viscosity at 25°C: 120130 cSt; 1, p. 291 flash point: 60°C; n20 = 1.482
396.45
112/0.05
—
—
l/—
—
404.16
—
—
—
—/—
1.27
172.04
—
210
170/0.01
s/—
302.18
—
—
—
438.38
—
—
404.35
136/0.12
396.45
148/0.1
State/Color
Reference 1, p. 290
1, p. 290
Degree of polymerization: 1.0
4, p. 47, 63
n20 = 1.475
1, p. 292
—
Flash point: 10°C
1, p. 292
—/—
—
—
1, p. 292
—
—/—
—
—
1, p. 292
—
—
l/—
1.10
—
1, p. 292
—
—
l/—
—
Degree of polymerization: 1.2
4, p. 47, 63
© 2005 by CRC Press
Titanium 1-methylbutoxide (titanium pentoxide) Ti(OCH(CH3)C3H7n ) 4 Titanium 2-methylbutoxide (titanium pentoxide) Ti(OCH2CH(CH3)C2H5)4 Titanium methylphenoxide 95% Tetramethylphenyl titanate Ti(O2CH3C6H4)4 Titanium n-nonoxide 95% Tetranonyl titanate Ti(OnC9H19)4 Titanium oxide bis-(pentanedionate) (-OC(CH3)CH(CH3)CO-)2TiO Titanium oxide bis(tetramethylheptanedionate) (-OC(C(CH3)3)CHC(CH3)3C) CO-)2TiO Titanium n-pentoxide Tetrapentyl titanate Ti(O(CH2)4CH3)4 Titanium isopropoxide Tetraisopropyl titanate Ti(iOC3H7)4 Titanium n-propoxide Tetra-n-propyl titanate Ti(nOC3H7)4 Titanium sec-propoxide Tetra-s-propyl titanate Ti(OCH(CH3)2)4 Titanium stearyloxide Ti(OC18H37)4 Titanium tetrakis (bis 2,2-(Allyloxymethyl)butoxide) Ti(OCH2C(CH2OCH2CHCH2)2 CH2CH3)4 Titanium triisostearoylisopropoxide (iC3H7O)Ti(OiC18H37)3 Titanium trimethacrylate mMethoxyethoxyethoxide (CH2C(CH3)COO-)3 TiOCH2CH2OCH2CH2OCH3
396.45
135/1.0
—
—
l/—
—
Degree of polymerization: 1.0
4, p. 47, 63
396.45
154/0.5
—
—
l/—
—
Degree of polymerization: 1.1
4, p. 47, 63
476.40
—
—
—
—/—
1.055
Flash point: 40°C
1, p. 292
620.85
226/1
—
—
l/—
0.93
n20 = 1.486; flash point: 60°C
1, p. 292
262.12
—
184
—
s/—
—
—
1, p. 292
430.42
—
120
—
s/—
—
—
1, p. 293
396.45
175/0.8
—
—
l/—
—
284.25
58/1
1519
—
—/—
0.937
284.25
137/5
—
—
l/—
0.955
284.25
49/0.1
—
—
l/—
—
1125.84
—
55–60
—
s/—
0.91
—
1, p. 293
901.06
—
—
—
—/—
1.08
—
1, p. 293
957.37
—
—
—
l/—
0.95
Flash point: 93°C; n20 = 1.481
1, p. 293
422.28
—
—
—
—/amberred
1.11
Flash point: 49°C Miscible in toluene, isopropanol
1, p. 293
Degree of polymerization: 1.4
4, p. 47, 63
n20 = 1.4654; flash point: 25°C; 1, p. 291 molecular complexity: 1.4; toxic; )Hvap = 14.7 kcal/mol; )Hform = 377 kcal/mol Viscosity at 25°C: 150165 cSt; 1, p. 293 surface tension: 25.4 dyn/cm; n20 = 1.498 Degree of polymerization: 1.4 4, p. 63
© 2005 by CRC Press
Compound Titanium tris(dioctylphosphato)isopropoxide ((C8H17O)2PO2-)3TiOiC3H7 Titanium tris(dodecylbenzenesulfonate) isopropoxide (C12H23(C6H4)SO3-)3TiOiC3H7
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
1191.33
—
—
—
l/amber
1.04
Flash point: 63°C
1, p. 294
1077.40
—
—
—
—/dark amber
1.08
Viscosity: 8000 cSt
1, p. 294
346.35
70/5° 10–3
—
—
Liquid oil/ yellow
—
—
2, p. 340
332.32
—
—
—
—
2, p. 340
332.32
102/1
—
124.5125.5/ l/yellow 0.5 (decomposes) — l/colorless
—
—
2, p. 340
521.50
—
—
—
—/yellow
—
248.16
106107/3
—
—
l/colorless
—
413.46
177181/1
—
—
l/pale yellow
—
—
2, p. 340
206.08
88/1.5
5012
—
s/white
—
—
2, p. 340
495.63
—
—
—
s/yellow
—
446.26
—
—
—
s/yelloworange
—
434.37
—
6566
—
s/yellow
—
476.45
—
6465
—
Solid crystals/ yellow
—
State/Color
Densitya (g/cc)
Miscellaneous
Reference
II. Titanium Alkyl/Aryl Alkoxides and Aryloxides tert-butylcyclopentadienyl titanium triisopropoxide (Ti(OiC3H7)3(M-C5H4C(CH3)3) Cyclopentadienyl titanium tri-n-butoxide (Ti(OC4H9n)3C5H5) Cyclopentadienyl titanium tri-tertbutoxide (Ti(OC4H9t)3C5H5) Cyclopentadienyl titaniumtri(4dimethylamino)phenoxide (Ti(OC6H4N(CH3)24)3C5H5) Cyclopentadienyl titanium triethoxide (Ti(OC2H5)3C5H5 Cyclopentadienyl titaniumtri-n-hexoxide (Ti(On-C6H13)3C5H5 Cyclopentadienyl titanium trimethoxide Ti(OCH3)3C5H5 Cyclopentadienyl titanium tri(4chloro)phenoxide Ti(OC6H4Cl-4)3C5H5 Cyclopentadienyl titanium tri(4fluoro)phenoxide Ti(OC6H4F-4)3C5H5 Cyclopentadienyl titanium tri(3methyl)phenoxide Ti(OC6H4CH3-3)3C5H5 Cyclopentadienyl titanium di(2,4methyl)phenoxide Ti(OC6H3(CH3)2-2,4)3C5H5
Characterized by nuclear magnetic resonance and infrared spectroscopies —
Characterized by nuclear magnetic resonance and infrared spectroscopies Characterized by nuclear magnetic resonance and infrared spectroscopies —
—
2, p. 340
2, p. 340
2, p. 340
2, p. 340
2, p. 340
2, p. 340
© 2005 by CRC Press
Cyclopentadienyl titanium di(3,5methyl)phenoxide Ti(OC6H3(CH3)2-3,5)3C5H5) Cyclopentadienyl titanium tri(4methyl)phenoxide Ti(OC6H4CH3-4)3C5H5 Cyclopentadienyl titanium tri(3nitro)phenoxide Ti(OC6H4NO2-3)3C5H5 Cyclopentadienyl titanium tri(4nitro)phenoxide Ti(OC6H4NO2-4)3C5H5 Cyclopentadienyl titanium triphenoxide Ti(OC6H5)3C5H5
476.45
—
8081
—
s/yellow
—
—
2, p. 340
434.37
—
—
—
—/yellow
—
527.28
—
—
—
s/yellow
—
527.28
—
—
—
s/yellow
—
392.29
—
102104
—
s/yellow
—
Cyclopentadienyl titanium tri-npropoxide (Ti(OC3H7n)3C5H5 Cyclopentadienyl titanium triisopropoxide Ti(OC3H7i)3C5H5 Cyclopentadienyl titanium tri(trifluoromethylethoxide) Ti(OCH2CF3)3C5H5 Ethyl cyclopentadienyl titanium triethoxide Ti(OC2H5)3(M-C5H4C2H5) Methyl cyclopentadienyl titanium triethoxide Ti(OC2H5)3(h-C5H4CH3) Methyl cyclopentadienyl titanium triisopropoxide Ti(OC3H7i)3(h-C5H4CH3) Pentamethyl cyclopentadienyl titanium triethoxide Ti(OC2H5)3(h-C5(CH3)5) Pentamethyl cyclopentadienyl titanium triphenoxide Ti(OC6H5)3(h-C5(CH3)5) Titanium methyl triethoxide TiCH3(OC2H5)3 Titanium methyl triisopropoxide TiCH3(O(C3H7)i)3
290.24
106107/0.51
—
—
l/colorless
—
290.24
8082/0.5
—
—
l/colorless
—
—
2, p. 340
410.07
72/0.01
—
—
l/yellow
—
—
2, p. 340
276.21
101102/2
—
—
l/—
—
—
2, p. 341
262.18
8081/1
—
—
l/—
—
—
2, p. 340
304.27
56/103
—
—
Liquid oil/ yellow
—
—
2, p. 340
318.29
115117/1
—
—
l/yellow
—
—
2, p. 341
430.43
214216/1
—
—
l/—
—
—
2, p. 341
198.10
—
—
—
l/dark red
—
Soluble in benzene
2, p. 447
240.18
102(50/0.01)
—
—
l/yellow
—
Soluble in benzene
2, p. 447
Characterized by nuclear magnetic resonance and infrared spectroscopies Characterized by infrared spectroscopies
2, p. 340
Characterized by nuclear magnetic resonance and infrared spectroscopies Characterized by nuclear magnetic resonance and infrared spectroscopies —
2, p. 340
2, p. 340
2, p. 340; 8, p. 2266 2, p. 340
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Titanium phenyl triisobutoxide TiC6H5(OC4H9i)3 Titanium phenyl triisopropoxide TiC6H5(OC3H7i)3
344.33
—
—
—
—/—
—
302.25
—
8890
—
—
Titanium pentafluorophenyl triisopropoxide Ti(C6F5)(OC3H7i)3 Titanium 4-toulyl tributoxide Ti(C6H4CH3–4)(OC4H9)3
392.20
—
133135
—
Solid crystal/ white or light yellow s/white
—
358.36
—
—
—
—/—
—
257.00
—
—
—
Crystals/ yellow
—
—
2, p. 343
339.11
136145/0.8
—
—
l/yellow
—
—
2, p. 343
283.00
118119/1
—
—
l/—
—
—
2, p. 343
238.55
109111/1
—
—
l/—
—
—
2, p. 343
222.10
—
—
—
—/—
—
305.04
—
114116
—
s/yellow
—
—
2, p. 343
424.63
—
—
2124 s/yellow (decomposes)
—
—
2, p. 343
334.64
—
3942
—
—
2, p. 343
Compound
State/Color
Densitya (g/cc)
Miscellaneous Could be only isolated as an impure compound —
—
Obtained as a solution only
Reference 2, p. 447 2, p. 447
2, p. 447
2, p. 447
III. Alkoxides and Related Complexes of Titanium Cyclopentadienyl tert-butoxy titanium dichloride TiCl2(OC4H9i)C5H5 Cyclopentadienyl dibutoxy titanium bromide (TiBr(OC4H9)2C5H5 Cyclopentadienyl diethoxy titanium bromide TiBr(OC2H5)2C5H5 Cyclopentadienyl diethoxy titanium chloride TiCl(OC2H5)2C5H5 Cyclopentadienyl diethoxy titanium fluoride TiF(OC2H5)2C5H5 Cyclopentadienyl (2,6 dimethyl) phenoxy titanium dichloride TiCl2(OC6H3(CH3)2-2,6)C5H5 Cyclopentadienyl di(4-nitro) phenoxy titanium chloride TiCl(OC6H4NO2-4)2C5H5 Cyclopentadienyl diphenoxy titanium chloride (TiCl(OC6H5)2C5H5)
—
s/orange
Characterized by infrared spectroscopy
2, p. 343
© 2005 by CRC Press
Cyclopentadienyl di-n-propoxy titanium chloride TiCl(OC3H7n)2C5H5 Cyclopentadienyl diisopropoxy titanium chloride (TiCl(OC3H7i)2C5H5) Cyclopentadienyl ethoxy titanium dibromide (TiBr2(OC2H5)C5H5) Cyclopentadienyl ethoxy titanium dichloride (TiCl2(OC2H5)C5H5 Cyclopentadienyl ethoxy titanium difluoride TiF2(OC2H5)C5H5 Cyclopentadienyl methoxy titanium dichloride (TiCl2(OCH3)C5H5 Cyclopentadienyl isopropoxy titanium dichloride TiCl2(OC3H7i)C5H5 Cyclopentadienyl (2,4,6-trimethyl) phenoxy titanium dichloride TiCl2(OC6H2(CH3)3-2,4,6)C5H5 Methyl cyclopentadienyl diethoxy titanium chloride TiCl(OC2H5)2(h-C5H4CH3) Pentamethyl cyclopentadienyl diethoxy titanium chloride TiCl(OC2H5)2(C5(CH3)5) Pentamethyl cyclopentadienyl ethoxy titanium dichloride TiCl2(OC2H5)(C2(CH3)5) Pentamethyl cyclopentadienyl titanium trichloride (CH3)5C5TiCl3 Pentamethylcyclopentadienyltitanium trimethoxide (CH3)5C5Ti(OCH3)3 Titanium chloride triisopropoxide (-OiC3H7O)3TiCl Titanium dichloride diethoxide (C2H5O)2TiCl2
266.60
—
—
132145/1 Liquid oil/ (decomposes) yellowgreen — l/—
—
—
2, p. 343
266.60
8284/0.5
—
—
—
2, p. 343
317.84
—
5053
—
s/—
—
—
2, p. 343
228.94
—
4849
—
s/yellow
—
—
2, p. 343
196.03
120123/1
—
—
l/—
—
—
2, p. 343
214.91
—
93–96
—
—
—
2, p. 343
242.97
—
113114
—
Solid crystal/ yellow —/—
—
—
2, p. 343
319.07
—
107108
—
s/yelloworange
—
—
2, p. 343
252.58
143145/2
—
—
l/—
—
—
2, p. 344
308.68
125/2
—
—
l/—
—
—
2, p. 344
263.04
—
4647
—
s/—
—
—
2, p. 344
289.47
—
225
—
s/—
—
—
1, p. 289
276.21
285
—
—
l/yellow
1.081
n20 = 1.5540 Flash point: 61°C
1, p. 289
260.62
63–66/0.1
34–36
—
s/—
1.091
Flash point: 22°C
1, p. 290
208.91
142/18
40–50
—
s/—
—
—
1, p. 290
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
352.07
—
—
—
—/—
1.04
Flash point: 22°C
1, p. 290
249.00
—
288–289
—
s/—
1.600
—
1, p. 294
Biscyclopentadienyl titanium di(trifluoro acetate) Ti(O2CCF3)2(C5H5)2 Cyclopentadienyl titanium triacetate Ti(OCOCH3)3C5H5
404.10
—
175179
—
s/—
—
Prepared from aqueous solution 2, p. 378
290.11
—
115117
—
s/orange
—
Cyclopentadienyl titanium tri(phenyl acetate) Ti(OCOC6H5)3C5H5
476.32
—
—
Decomposes
—/yellow
—
Cyclopentadienyl titanium tri(trifluoro acetate) (Ti(OCOCF3)3C5H5)
452.02
—
—
179181 s/orange (decomposes)
—
Pentamethyl cyclopentadienyl titanium triacetate Ti(OCOCH3)3(h-C5(CH3)5)
360.24
—
136138
Pentamethyl cyclopentadienyl titanium tri(trifluoroacetate) Ti(OCOCF3)3(M-C5(CH3)5)
522.16
—
—
Reasonably soluble in polar solvents; less stable than biscyclopentadienyl analogues; readily hydrolyzed Reasonably soluble in polar solvents; less stable than biscyclopentadienyl analogues; readily hydrolyzed Reasonably soluble in polar solvents; less stable than biscyclopentadienyl analogues; readily hydrolyzed Reasonably soluble in polar solvents; less stable than biscyclopentadienyl analogues; readily hydrolyzed Reasonably soluble in polar solvents; less stable than biscyclopentadienyl analogues; readily hydrolyzed
146/0.2
—
Compound Titanium iodide triisopropoxide (iC3H7O)3TiI Titanocene dichloride (C5H5)2TiCl2
State/Color
Densitya (g/cc)
Miscellaneous
Reference
IV. Titanium Carboxylates
—
s/yellow
243246 s/orange (decomposes)
—
—
2, p. 348
2, p. 348
2, p. 348
2, p. 348
2, p. 348
V. Tris(amido) Titanium Aryl Compounds Tris(diethyl amido) (M-cyclopentadienyl) titanium Ti(N(C2H5)2)3(C5H5)
329.37
—
l/red-brown; oil/red
—
Reasonably soluble in polar 2, p. 351 solvents; less stable than biscyclopentadienyl analogues; readily hydrolyzed
© 2005 by CRC Press
Tris(dimethyl amido) (M-tertbutylcyclopentadienyl) titanium Ti(N(CH3)2)3(M-C5H4(C4H9)t)
301.31
70/103
—
—
Solid crystal/ yellow
—
Tris(dimethyl amido) (Mcyclopentadienyl) titanium Ti(N(CH3)2)3(M-C5H5)
245.20
95/0.05
—
—
Liquid oil/ red
—
Tris(dimethyl amido) (M-di-tertbutylcyclopentadienyl) titanium Ti(N(CH3)2)3(M-C5H3(C4H9)2t)
357.42
90/5 × 103
—
—
Liquid oil/ red
—
Tris(dimethyl amido) (M-diethylmethyl cyclopentadienyl) titanium Ti(N(CH3)2)3(M-C5H4(C2H5)2CH)
315.34
85/103
—
—
Liquid oil/ red
—
Tris(dimethyl amido) (M-diphenylmethyl cyclopentadienyl) titanium Ti(N(CH3)2)3(M-C5H4(C6H5)2CH
411.43
—
—
—
Solid crystal/ yellow
—
Tris(dimethyl amido (Methylcyclopentadienyl) titanium Ti(N(CH3)2)3(M-C5H4C2H5)
273.26
78/103
—
—
Liquid oil/ red
—
Tris(dimethyl amido (Mmethylcyclopentadienyl) titanium Ti(N(CH3)2)3(M-C5H4CH3)
259.23
84/0.02
—
—
l/red oil (or low melting point)
—
Tris(dimethyl amido (M-methyl, tert-butyl cyclopentadienyl) titanium Ti(N(CH3)2)3(M-C5H3CH3(C4H9)t)
315.34
70/103
—
—
Liquid oil/ red
—
Tris(dimethyl amido (M-isopropyl cylcopentadienyl) titanium Ti(N(CH3)2)3(M-C5H4CH3(C3H7)i)
287.28
64/78 Crystalline (decomposes) solid/ yellow ~105 Crystalline (decomposes) solid/ yellow — Crystalline solid/ yellow ~45 Crystalline (decomposes) solid/ yellow — s/red
—
Soluble in acetone, toluene, methylethylketone
Very unstable compound
1, p. 289
2, p. 459
—
—
2, p. 459
—
—
2, p. 459
—
—
2, p. 459
—
Soluble in CH2Cl2, toluene
1, p. 290
© 2005 by CRC Press
Compound Titanium tetrakis(diethylamide) ((CH3CH2)2N-)4Ti N20 = 1.536Titanium tetrakis(dimethylamide) ((CH3)2N-)4Ti
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
336.4
133/1.2
—
—
l/—
0.938
224.20
50/0.5
—
—
—/—
0.96
—
1, p. 293
—
—
1, p.296
1.3
—
1, p.296
State/Color
Densitya (g/cc)
Miscellaneous Flash point: 165°C
Reference 1, p. 293
Tungsten Compounds I. Tungsten Alkoxides and Diketonates 409.15
110–115/1
—
—
454.21
105–110/0.05
105–115
—
M-Benzene tungsten tricarbonyl W(CO)3(M-C6H6)
345.99
—
140–145
—
Cyclooctatetraene tungsten tricarbonyl W(CO)3(M6C8H10)
372.03
—
—
—
Trisdiethyl acetylide tungsten carbonyl Carbonyl tris(3-hexyne) tungsten W(CO)(M-C2H5C CC2H5)3 Trisdiphenyl acetylide tungsten carbonyl W(CO)(M-C6H5C CC2H5)3
458.30
—
55–56
—
746.56
—
—
—
Tungsten hexacarbonyl W(CO)6
351.91
Decomposes
169
—
Tungsten V ethoxide 95% W(OC2H5)5 Tungsten VI ethoxide 95% W(OC2H5)6
1/purpleblack s/light yellow
II. Tungsten Carbonyls Crystalline solid/ yellow Crystalline solid/redbrown Crystalline solid/pale yellow Prismatic crystal/ yellow s/white; crystal/ colorless
—
Air stable; soluble in organic solvents
2, p. 1359; 8, p. 2391
—
Soluble in hexane
2, p. 1368; 8, p. 2395
—
—
2, p. 1375; 8, p. 2403
—
—
2, p. 1375
2.65
Volatile, octahedral, odorless, diamagnetic, air-stable crystal; melts with decomposition at ~150ºC; hydrophobic; stable to oxidation; slightly soluble in polar and nonpolar solvents, sublimes under vacuum
2, p. 1256; 3, p. 63
© 2005 by CRC Press
III. Tungsten Aryl Compounds Bis-M6– benzene tungsten W(M-C6H6)2 Tungsten VI phenoxide W(OC6H5)6
340.08
—
—
—
747.53
—
72–76
—
Crystalline solid/green s/dark red
—
—
—
Soluble in THF, toluene
Soluble in tetrahydrofuran, cyclohexane; slightly soluble in pentane Soluble in tetrahydrofuran, benzene; slightly soluble in pentane —
2, p. 1356; 8, p. 2397 1, p. 296
Uranium Compounds I. Uranium Alkoxides and Diketonates Tricyclopentadienyl uranium n-butoxide (C5H5)3U(O-n-C4H9)
506.43
—
149–151
120 (in vacuo)
Crystalline solid/green
—
Tricyclopentadienyl uranium ethoxide (C5H5)3U(OC2H5)
478.37
—
210–213
—
Crystalline solid/green
—
Uranium VI oxide 2,4-pentanedionate UO2(–O–C(CH3)CH(CH3)CO–)2
468.25
—
—
—
—/—
—
8, p. 2353
8, p. 2353
27, p. 44
II. Alkyl and Aryl Compounds of Uranium Tetraethyl uranium U(C2H5)4 Tetrakis (M3-2-propenyl) uranium U(CH2–CH = CH2)4 Tricyclopentadiene uranium U(C5H5)3 Triscyclopentadienyl n-butyl uranium U(C5H5)3n-C4H9
354.28
—
—
—
—/—
—
402.32
—
—
—
—/dark red
—
433.31
—
—
—
—
490.43
—
130 (decomposes)
—
Triscyclopentadienyl 2-methylallyl uranium U(C5H5)32-(CH2C(CH3) = CH2) Triscyclopentadienyl p-methylbenzeneyl uranium U(C5H5)3p-(CH3C6H4) Triscyclopentadienyl uranium phenylacetylide U(C5H5)3C}CC6H5
488.41
—
—
—
524.45
—
200 (decomposes)
—
534.44
—
183–185 (decomposes)
—
Crystalline solid/— Crystalline solid/dark red Crystalline solid/deep red-brown Crystalline solid/dark violet Crystalline solid/ yellow green
—
—
Unstable at room temperature; volatile Pyrophoric; reacts with alcohol to yield mixed complexes Forms complexes and adducts with solvents Soluble in benzene, toluene, ether, hot hexane; smokes on exposure to air Soluble in toluene, air sensitive
2, p. 241 2, p. 239; 8, p. 2351 2, p. 213 2, p. 243; 8, p. 2354 2, p. 243; 8, p. 2353
—
Soluble in benzene, tetrahydrofuran; air sensitive
2, p. 243; 8, p. 2356
—
Soluble in hexane, tetrahydrofuran, water; sensitive to oxygen
2, p. 243; 8, p. 2357
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Triscyclopentadienyl uranium ethynyl U(C5H5)3(C}CH)
458.34
—
—
—
Uranocene biscyclo octatetraene uranium U(M-C8H8)2
446.33
—
—
180/0.03
Compound
State/Color
Densitya (g/cc)
s/yellowgreen
—
Plates/ green
—
Miscellaneous
Reference
Soluble in tetrahydrofuran, 2, p. 243; toluene, sensitive to oxygen and 8, p. 2353 moisture Sp soluble in organic solvents; 2, p. 31, flammable in air but stable to 95; 8, water p. 2352
Vanadium Compounds I. Vanadium Alkoxides and Diketonates Vanadium IV oxide bis(benzoylacetonate) (-OC(C6H5)CHC(CH3)O-)2VO Vanadium IV oxide bis(hexafluoropentanedionate) (-OC(CF3)CH(CF3)CO-)2VO Vanadium IV oxide bis(2, 4pentandionate) or Vanadylacetylacetonate VO(OC(CH3)CH(CH3)CO)2 Vanadium III 2, 4-pentanedionate V(OC(CH3)CH(CH3)CO)3 Vanadium triisobutoxide oxide OV(OiC4H9)3 Vanadium triisopropoxide oxide VO(OiC3H7)3 Vanadium tri-n-propoxide oxide VO(O–n-C3H7)3
389.31
—
218
—
s/—
—
Soluble in xylene
1, p. 297
481.04
—
—
—
—/—
—
—
1, p. 298
265.16
—
243–246
—
s/blue-green
348.26
—
178–190
—
s/brown
286.29
105/1.5
10 to 5
—
242.21
80–82/2
11 to 14
242.21
100–102/2
350.29
322.28
1.52– 1.74
Solubility in water: 13 g/l, methanol: 64 g/l
1, p. 298
—
Solubility in water: 2 g/l; toxic
1, p. 298
—/—
1.011
1, p. 298
—
—/—
1.029
Flash point: 64°C; n20 = 1.487; viscosity (38°): 3 cSt n20 = 1.481; flash point: 58ºC
1, p. 298
—
—
1/—
1.077
n20 = 1.500; flash point: 62ºC
1, p. 298
—
58–60
—
Crystalline solid/green
—
Air sensitive
2, p. 666
—
105–110 (decomposes)
—
s/orange
—
Air sensitive
2, p. 666
II. Vanadium Carbonyl Compounds Cyclopentadienyl (diphenylacetylide) vanadium carbonyl V(CO2)(C6H5C}CC6H5)(C5H5) Cyclopentadienyl bis(diphenylacetylide) vanadium carbonyl V(CO)(C6H5C}CC6H5)2(C5H5)
© 2005 by CRC Press
Cyclopentadienyl tetracarbonyl vanadium V(CO)4(C5H5) Cyclopentadienyl thiocarbonyl vanadium tricarbonyl V(CO)3(CS)(C5H5) Vanadium hexacarbonyl V(CO)6
228.08
—
139
80–100/0.5
Crystalline solid/ orange s/yellow (in hexane)
—
244.14
—
69–72
—
219.00
Decomposes
65
—
s/black; crystalline solid/ yellowgreen
—
—
Air sensitive; sublimes; soluble in 2, p. 663; arene solvents 8, p. 2369 —
2, p. 665; 8, p. 2369
Volatile; very unstable; 2, p. 651; octahedral; yellow-orange in 3, p. 63 solution; soluble in benzene and toluene
III. Miscellaneous Vanadium Alkyl/Aryl Compounds Biscyclopentadienyl vanadium 2methylpropylenyl V(2-CH3C3H4)(C5H5)2 Biscyclopentadienyl vanadium pentafluorophenyl VC6F5(C5H5)2 Biscyclopentadienyl vanadium phenyl VC6H5(C5H5)2 Biscyclopentadienyl vanadium-n-propyl VC3Hn7(C5H5)2 n-Butyl vanadium trisdiethylamine VC4Hn9(N(C2H5)2)3 Dibenzene vanadium V(M-C6H6)2
236.23
—
65
—
s/black
—
—
2, p. 677
348.19
—
208
—
s/blue-black
—
—
2, p. 677
258.24
—
92
—
s/black
—
—
2, p. 677
224.22
—
41
—
—
—
2, p. 677
324.45
—
—
—
—
—
120–125 (in vacuo)
Dicyclopentadienyl vanadium V(C5H5)2
181.13
—
277 under nitrogen decomposes >300 167–168
—
Crystal/ violet
—
Ethyl vanadium trisdiethylamine VC2H5(N(C2H5)2)3
296.39
71–73/0.001
—
—
1/dark green
—
Phenylvanadium trichloride C6H5VCl3
234.41
—
—
—
—/—
—
n-Propyl vanadium trisdiethylamine VC3Hn7 (N(C2H5)2)3
310.42
—
—
—
1/dark green
—
Air sensitive; can be vacuum distilled Soluble in organic solvents; )H°f = 322(6) and 36(10); thermally stable; insoluble in CCl4, methanol )H°f = 123 and 142 kJ/mol; air sensitive; soluble in tetrahydrofuran, benzene Air sensitive, can be vacuum distilled; stable to 115°C, soluble in hydrocarbons; paramagnetic Decomposes to lower V halides and biphenyl, used as a catalyst for vinylchloride polymers Air sensitive, can be vacuum distilled
2, p. 660
207.17
s/greenblack 1/dark green Liquid or solid/redbrown
—
2, p. 689; 8, p. 2373
2, p. 673, 142(8); 8, p. 2371 2, p. 660; 8, p. 2375
2, p. 659
2, p. 660
© 2005 by CRC Press
Compound Tetramethyl vanadium V(CH3)4 Tetraphenyl vanadium V(C6H5)4
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
111.08
—
—
—
—/—
—
359.36
—
—
—
—/—
—
State/Color
Densitya (g/cc)
Miscellaneous Thermally unstable and cannot be isolated Thermally unstable and cannot be isolated
Reference 2, p. 660 2, p. 660
Ytterbium Compounds I. Ytterbium Alkoxides and Diketonates 470.37
—
122–129
—
s/—
—
1058.58
—
165–168
—
s/—
—
794.19
—
—
—
s/—
—
722.86
—
167–169
—
s/—
—
Biscylopentadienyl ytterbium(n-butyl acetylide) (C5H5)2YbC}CC4Hn9 Biscyclooctatetraene methyl ytterbium (C5H5)2 YbCH3
384.37
—
—
—
—/—
—
636.53
—
—
—
Crystal/ orange
—
Cyclooctatetraene ytterbium Yb(C8H8)
277.19
—
>500
—
s/pink
—
Ytterbium 2,4-pentanedionate Yb(OC(CH3)CH(CH3)CO)3 Ytterbium 6,6,7,7,8,8,8 heptafluoro-2,2dimethyl-3,5-octanedionate Yb(OC(nC3F7)CH(C(CH3)3)CO)3 Ytterbium Hexafluoropentanedionate (OC(CF3)CH(CF3)CO)3Ba Ytterbium 2,2,6,6-tetramethyl-3,5heptanedionate Yb(-OC(C(CH3)3)CHC(C(CH3)3O-)3
— )Hsub = 37 kcal/mol — )Hsub = 31.9 kcal/mol
1, p. 174 1, p. 175
1, p. 175 1, p. 175
II. Ytterbium Alkyl/Aryl Compounds —
2, p. 203
Degree of association: 2; soluble 2, p. 203; in benzene, toulene, CH2Cl2; air 8, p. 2415 and moisture sensitive; decomposes at >165ºC Air and moisture sensitive; stable 2, p. 194; to 500ºC in vacuum; insoluble 8, p. 2415 in ammonia or etheral solvents yet exposure brings strong color changes; pyridine, dimethylformamide will dissolve it, yielding deep red solutions; decomposed by water
© 2005 by CRC Press
Tricyclopentadienyl ytterbium Yb(C5H5)3
368.22
—
273 (decomposes)
150 (in vacuo)
Ytterbocene Yb(C5H5)2 Ytterbium 3-hexyne Ytterbium diethylacetylide Yb(C2H5–C}C-C2H5)
303.30
—
—
255.19
—
—
400 (in vacuo) —
Crystalline solid/dark green s/red
—
Soluble in tetrahydrofuran; hydolyzed by water
8, p. 2416
—
Soluble in tetrahydrofuran
8, p. 2415
s/brown
—
Soluble in tetrahydrofuran; decomposes at 220ºC
2, p. 206
Yttrium Compounds I. Yttrium Alkoxides and Diketonates Yttrium 6,6,7,7,8,8,8 heptafluoro-2,2dimethyl-3,5-octanedionate Y(OC(nC3F7)CH(C(CH3)3)CO)3 Yttrium Hexafluoroisopropoxide diammonia Y(OCH(CF3)2)3 Yttrium hexafluoropentanedionate Y(-OC(CF3)CH(CF3)CO-)3 Yttrium methoxyethoxide 15–18% in methoxyethanol Y(OCH2CH2OCH3)3
974.45
—
97–102
—
s/—
—
—
1, p. 175
590.0
—
—
—
s/—
—
—
1, p. 175
710.1
—
166–70
100/0.2
s/—
—
—
1, p. 176
314.17
—
—
—
—/—
1.01
Yttrium 2,4-pentanedionate Y(OC(CH3)CH(CH3)CO)3 Yttrium isopropoxide 95% Y(OiC3H7)3
386.23
—
130–133
—
s/—
266.17
—
—
200–210/1
Yttrium 2,2,6,6-tetramethylheptanedionate Y(-OC(C(CH3)3)CH(C(CH3)3)CO-)3 Ytrrium 2,2,6,6-tetramethylheptanedionate Y(–OC(C(CH3)3)CH(C(CH3)3)CO–)3
638.72
—
169–73
638.72
—
570.06
—
Prepared as solution
1, p. 176
—
Soluble in toluene, acetone
1, p. 176
—/—
—
1, p. 176
95/0.05
s/—
—
Solubility: isopropanol, 30 g/l; toluene >200 g/l; molecular complexity: 1.6 Soluble in acetone Decomposes>290°C
169–173
—
s/—
—
—
1, p. 176
180–184
105/10–14
s/—
—
—
1, p. 177
1, p. 175
II. Yttrium Alkyl Amide Yttrium tris(bis(trimethylsilylamide)) Y(N(Si(CH3)3)2)3
© 2005 by CRC Press
Compound
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
284.19
—
295
200–250 (in vacuo)
266.04
—
285
—
s/—
—
314.14
—
110
—
s/—
—
—
1, p. 176
427.95
—
138–142
—
s/—
—
—
1, p. 176
536.11
—
—
—
—/—
—
—
1, p. 177
State/Color
Densitya (g/cc)
Miscellaneous
Reference
III. Organoyttrium Compounds Tri-U-cyclopentadienyl yttrium Y(C5H5)3
Crystalline solid/pale yellow
Soluble in tetrahydrofuran; hydrolyzed by water
8, p. 2410
Soluble in water (90g/l)
1, p. 175
IV. Yttrium Salt Yttrium Acetate (CH3COO)3Y Yttrium methacrylate (CH2C(CH3)COO)3Y Yttrium trifluoroacetate (CF3COO)3Y Yttrium trifluoromethanesulfonate (CF3SO3)3Y
Zinc Compounds I. Zinc Alkoxides and Diketonates t-Butyl t-butoxyzinc C4Ht9ZnOC4Ht9 Ethyl pentafluorophenoxy zinc C2H5ZnOC6F5 Ethyl phenoxy zinc C2H5ZnOC6F5 Ethyl zinc acetylacetonate C2H5Zn(OC(CH3)CHC(CH3)O) Methyl methoxy zinc CH3ZnOCH3 Phenyl triphenyl methoxy zinc C6H5ZnOC(C6H5)3 Zinc N,N-dimethylaminoethoxide Zn-(OCH2CH2NMe2)2 Zinc 8-hydroxyquinolinate Cu(-OC9H8N-)2
195.61
—
169
—
s/—
—
Degree of association: 3
2, p. 838
277.50
—
114
—
s/—
—
Degree of association: 2
2, p. 838
187.55
—
177
—
s/—
—
Degree of association: 4
2, p. 838
229.58
—
95
—
s/—
—
Degree of association: 2
2, p. 838
111.45
—
—
s/—
—
Degree of association: 4
2, p. 838
401.81
—
—
s/—
—
Degree of association: 2
2, p. 838
241.63
—
190 (decomposes) 236 (decomposes) —
170/104
—/—
—
—
1, p. 300
353.68
—
>350
—
s/—
—
—
1, p. 300
© 2005 by CRC Press
Zinc methoxyethoxide 90% Zn-(OCH2CH2OCH3)2 Zinc 2,4-pentanedionate Zn(OC(CH3)CH(CH3)CO)2
215.54
—
—
—
—/—
—
Slowly decomposes at >130ºC
1, p. 300
263.59
—
136–8
110/1
s/—
—
Solubility in H2O: 6.9 g/l, in methanol: 135 g/l; trimeric
1, p. 300
335.66
—
—
Sinters at 107ºC
—
—
Crystalline solid/— s/—
—
399.50
112 (decomposes) 91–93
—
179.61
61/4
57
—
1/none
—
179.61
34/12
28.8
—
s/none
—
231.69
65/104
55
—
s/—
—
203.63
45/104
36
—
s/none
—
123.50
118
28
—
1/none
1.2065
Di-n-hexylzinc (C6H13)2Zn Dimethylzinc (CH3)2Zn
235.72
258
—
—
1/—
95.45
46
42; 29
—
1/none
Di-2-methylphenylzinc (2-CH3C6H4)2Zn Di-3-methylphenylzinc (3-CH3C6H4)2Zn Di-4-methylphenylzinc (4-CH3C6H4)2Zn Di-2,6-dimethylphenylzinc (2,6-(CH3)2C6H3)2Zn Dipentylzinc (C5H11)2Zn Diphenylzinc (C6H5)2Zn
247.65
—
70
—
s/—
—
247.65
—
53
—
s/—
—
247.65
—
168
—
s/—
—
275.70
—
166
—
s/—
—
207.66
231
—
—
1/none
—
219.59
280–285 (decomposes)
107
—
—/—
—
Soluble in nonprotic organic solvents )H°f (l) = 104.2 kJ/mol; soluble in nonprotic organic solvents Soluble in nonprotic organic solvents Soluble in nonprotic organic solvents Soluble in nonprotic organic solvents Pyrophoric; )H°f (l) = 16.74 kJ/ mol; air and moisture sensitive; soluble in nonprotic organic solvents Soluble in nonprotic organic solvents Pyrophoric; )H°f (l) = 25.1 kJ/mol; air and moisture sensitive; soluble in nonprotic organic solvents Soluble in nonprotic organic solvents Soluble in nonprotic organic solvents Soluble in nonprotic organic solvents Soluble in nonprotic organic solvents Soluble in nonprotic organic solvents Soluble in nonprotic organic solvents
2, p. 669; 8, p. 2443 2, p. 827
II. Zinc Alkyl/Aryls Bis(benzeneoyloxymethyl)zinc (C6H5COOCH2)2Zn Bis(pentafluorophenyl)zinc (C6F5)2Zn Di-n-butylzinc (C4H9)2Zn Di-t-butylzinc ((CH3)3C)2Zn Dicyclohexylzinc (C6H11)2Zn Dicyclopentylzinc (C5H9)2Zn Diethylzinc (C2H5)2Zn
— 1.386
2, p. 827, 832 2, p. 827 2, p. 827 2, p. 827 2, p. 827, 832; 6, p. 93 2, p. 827 2, p. 827, 832; 6, p. 93 2, p. 827 2, p. 827 2, p. 827 2, p. 827 2, p. 827 2, p. 827
© 2005 by CRC Press
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
Di-n-propylzinc (C3Hn7)2Zn
151.56
139
81 to 84
—
1/none
—
)H°f (l) = 57.7 kJ/mol; pyrophoric; air and moisture sensitive; soluble in nonprotic organic solvents
2, p. 827, 832
Diisoprpylzinc (i-C3H7)2Zn or ((CH3)2CH)2Zn Ethyl-n-propylzinc (C2H5)Zn(n-C3H7) Phenyl(phenylethynyl)zinc C6H5C}C-ZnC6H5
151.56
40/12
—
—
1/none
—
2, p. 827
137.53
27/10
—
—
1/—
—
243.61
—
132.5–133.5 (decomposes)
—
Crystalline solid/—
—
165.58
38–43/3
—
—
1/—
—
2, p. 827
267.64
—
—
—
Crystalline solid/—
—
Pyrophoric; air and moisture sensitive Soluble in nonprotic organic solvents Very soluble in tetrahydrofuran; soluble in ether, benzene; turns yellow on storage; readily hydrolyzed; forms ethrates Soluble in nonprotic organic solvents Polymeric in solid state; aggregate in pyridine solution; soluble in dimethylsulfoxide, dimethylformamide; slightly soluble in pyridine; insoluble in ether, tetrahydrofuran, HC; decomposes at 200ºC without melting; readily hydrolyzes
183.46
—
242–244
350(d)
s/—
1.735
Soluble in water
1, p. 299
207.50
—
>250
—
s/—
1.600
351.79
—
—
—
—/—
1.18
Flash point: 127°C
1, p. 300
155.41
—
—
—
—/—
2.21
Solubility in water 52g/l
1, p. 300
235.53
—
250(d)
—
s/—
1.48
Soluble in warm acetic acid
1, p. 300
407.89
—
—
—
—/—
1.10
Compound
n-Propyl-n-butylzinc (n-C3H7)Zn(n-C4H9) Zinc diphenyl acetylide Bis(phenylethynyl) zinc (C6H5C}C-)2Zn
State/Color
Densitya (g/cc)
Miscellaneous
Reference
2, p. 827 2, p. 829; 8, p. 2441
8, p. 2442
III. Zinc Salts Zinc acetate (CH3COO)2Zn Zinc acrylate (CH2CHCOO)2Zn Zinc 2-ethylhexanoate (C4H9CH(C2H5)COO)2Zn Zinc formate (HCOO)2Zn Zinc methacrylate (CH2C(CH3)COO)2Zn Zinc neodecanoate (C6H13C(CH3)2COO)2Zn
—
—
1, p. 299
1, p. 300
© 2005 by CRC Press
Zinc 2,2,6,6-tetramethyl-3,5heptanedionate Zn(-OC(C(CH3)3)CHC(C(CH3)3)O-)2 Zinc undecylenate (CH2CH(CH2)8COO)2Zn
431.92
144/0.1
132–134
—
s/—
—
1, p. 301
431.92
—
116–119
—
s/—
—
—
1, p. 301
233.23
—
—
—
—/—
—
—
2, p. 669
235.68
—
37
—
s/—
—
—
2, p. 829
271.75
143–144/1
—
—
1/—
—
—
2, p. 829
237.65
105–106/2.5
—
—
1/—
—
—
2, p. 829
262.66
—
106
—
s/—
—
Degree of association: 2
2, p. 841
239.65
—
43
—
s/—
—
2, p. 843
279.63
—
>300
—
s/—
—
Degree of association: “associated” Polymer
127.51
—
—
s/—
—
Polymer
2, p. 843
189.58
—
—
s/—
—
Polymer
2, p. 843
155.56
—
90 (decomposes) 60 (decomposes) 90–105
—
s/—
—
Degree of association: 6
2, p. 843
287.67
—
—
—
1/—
—
2, p. 843
327.67
—
179
—
s/—
—
Degree of association: “associated” Degree of association: >7
2, p. 843
386.15
—
12–13
—
l/—
0.957
Flash point: 40°C
1, p. 299
474.13
—
104–110
—
s/
1.21
Soluble in toluene, CS2, CHCl3
1, p. 299
361.91
—
178–181
—
s/red
1.48
—
1, p. 299
305.80
—
250–252
—
s/—
1.71
—
1, p. 300
IV. Miscellaneous Zinc Compounds Bis(dichloromethyl)zinc Zn(CHCl2)2 Di-3-dimethylaminopropylzinc Zn(CH2CH2CH(N(CH3)2)2 Di3-ethylmercaptopropylzinc Di3-ethyl thiopropylzinc Zn(SCH2CH2CH2(C2H5))2 Di4-methoxybutylzinc Zn(H2CCH2CH2CH(OCH3))2 Ethyl diphenylamide zinc C2H5ZnN(C6H5)2 Ethyl zinc dibutyl phosphide C2H5ZnP(C4H9)2 Ethyl zinc dephenylphosphide C2H5ZnP(C6H5)2 Methyl zinc thiomethoxide CH3ZnSCH3 Methyl zinc thiophenoxide CH3ZnSC6H5 Methyl zinc thioisopropoxide CH3ZnSC3Hi7 Phenyl zinc dibutyl phosphide C6H5ZnP(C4H9)2 Phenyl zinc diphenylphosphide C6H5ZnP(C6H5)2 Zinc bis[bis(trimethylsilyl)amide] Zn(N(Si(CH3)3)2)2 Zinc di-n-butyldithiocarbamate (C4H9)2NCS2)2Zn Zinc diethyldithiocarbamate (CH3CH2)2NCS2)2Zn Zinc dimethyldithiocarbamate (CH3)2NCS2)2Zn
2, p. 843
© 2005 by CRC Press
Compound
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
State/Color
Densitya (g/cc)
Miscellaneous
—
—
Reference
Zirconium Compounds I. Zirconium Alkoxides and Diketonates Zirconium acetylacetonate Zr(–OC(CH3)CHC(CH3)O–)3 Zirconium n-butoxide 80% in n-butanol Zr(O–N-C4H9)4 Zirconium t-butoxide Zr(OtC4H9)4 Zirconium di-n-butoxide (Bis-2,4pentanedionate) (-OC(CH3)CHC(CH3)O-)2Zr(OnC4H9)2 Zirconium dichloride bis(pentanedionate) (-OC(CH3)CH(CH3)CO-)2ZrCl2 Zirconium diisopropoxide bis(2,2,6,6tetramethyl-3,5-heptanedionate) (-OC(C(CH3)3)CH(C(CH3)3CO-)2 Zr(OiC3H7)2 Zirconium dimethacrylate dibutoxide (CH2C(CH3)COO)2Zr(OnC4H9)2 Zirconium 2dimethylpropoxide(zirconium pentoxide) Zr(OCH2C(CH3)3)4 Zirconium 1,2dimethylpropoxide(zirconium pentoxide) Zr(OCH(C3H7i )CH3)4 Zirconium 1,1dimethylpropoxide(zirconium pentoxide) Zr(OC(C2H5)(CH3)2)4 Zirconium ethoxide Zr(OC2H5)4
388.55
—
—
—
—/—
2, p. 562
383.68
260/0.1
—
—
l/—
1.07
383.68
70/2
>250(d)
—
s/—
0.96
435.66
—
—
—
—/—
1.05
360.35
—
180–182
—
s/—
—
575.94
140/0.1
110
—
s/—
—
—
1, p. 302
379.55
—
—
—
—/—
—
—
1, p. 302
439.79
188/0.2
—
—
l/—
—
Degree of polymerization: 2.4
4, p. 47
439.79
156/0.01
—
—
l/—
—
Degree of polymerization: 2.0
4, p. 47
439.79
95/0.1
—
—
l/—
—
Degree of polymerization: 1.0
4, p. 47
271.47
180/13
171–173
—
—/—
—
)Hvap: 30.2 kCal/mol; molecular complexity: 3.0; degree of polymerization: 3.6
1, p. 302; 4, p. 45
n20 = 1.4565; flash point: 30°C; molecular complexity: 3.4 Flash point: 85°C; )Hvap = 14.8 kcal/mol Miscible in isopropanol
1, p. 301
Soluble in toluene
1, p. 302
1, p. 301 1, p. 302
© 2005 by CRC Press
Zirconium 2-ethylhexoxide (C4H9CC(C2H5)HCH2O)4Zr Zirconium hexafluoropentanedionate Zr(-OC(CF3)CH(CF3)CO-)4 Zirconium methacryloxyethylacetoacetate tri-n-propoxide (-OC(OCH2CH2OC(O)C(CH3)CH2) CH(CH3)CO-)Zr(OnC3H7)3 Zirconium 2-methyl-2-butoxide Zirconium t-pentyloxide, Zirconium t-amyloxide Zr(OC(CH3)2C2H5)4 Zirconium 1-methylbutoxide(zirconium pentoxide) Zr(OCH(C2H5)2)4 Zirconium 1-methylbutoxide(zirconium pentoxide) Zr(OCH(C3Hn7)CH3)4 Zirconium 3-methylbutoxide(zirconium pentoxide) Zr(O(CH2)2CH(CH)3)2)4 Zirconium 2-methyl butoxide (Zirconium pentoxide) Zr(OCH2CH(C2H5)CH3)4 Zirconium 2,4-pentanedionate Zr(OC(CH3)CH(CH3)CO)4 Zirconium n-pentoxide Zr(O(CH2)4CH3)4 Zirconium isopropoxide 70–75% in heptane Zr(O–i-C3H7)4 Zirconium n-propoxide 70% in propanol Zr(O–n-C3H7)4 Zirconium 2,2,6,6-tetramethyl-3,5heptanedionate Zr(-OC(C(CH3)3)CH(C(CH3)3COO-)4 Zirconium trifluoropentanedionate Zr(–OC(CF3)CH(CH3)CO–)4 Zirconocene diethoxide Dicyclopentadienylzirconium Diethoxide Zr(OC2H5)2(C5H5)2
591.13
—
55–60
—
s/—
1.00
—
919.47
225
41–43
—
s/—
—
481.68
—
60–65
—
s/—
0.978
—
1, p. 303
436.79
138/5
—
—
l/—
0.961
)Hvap = 16.3 kCal/mol; molecular complexity: 1.0
1, p. 303
439.79
178/0.5
—
—
l/—
—
Degree of polymerization: 2.0
4, p. 47
439.79
175/0.05
—
—
l/—
—
Degree of polymerization: 2.0
4, p. 47
439.79
247/0.1
—
—
l/—
—
Degree of polymerization: 3.3
4, p. 47
439.79
238/0.1
—
—
l/—
—
Degree of polymerization: 3.7
4, p. 47
487.66
—
186–188
—
s/—
—
439.79
256/0.01
—
—
l/—
—
Solubility: H2O = 4.5 g/l; ethanol: 1, p. 303 30 g/l; toluene: 54 g/l; toxic; bulk density: 500 g/l — 4, p. 47
327.56
160/0.1
—
—
l/—
—
327.56
208/0.1
—
—
l/—
1.05
824.30
—
308–310
185/0.1
s/—
703.54
—
125–128
—
311.52
—
52–57
—
Soluble in pentane
1, p. 302 1, p. 302
)Hvap = 31.5 kCal/mol; molecular 1, p. 302 complexity: 3.0 n20 = 1.457; flash point: 16°C
1, p. 303
—
Soluble in hexane
1, p. 303
s/—
—
—
1, p. 304
s/—
—
—
27, p. 47
© 2005 by CRC Press
Compound
Formula Weight
Boiling Point (°C/mmHg)
Melting Point (°C)
Sublimation Temperature (°C/mmHg)
659.99
—
—
—
431.55
—
225–230(d)
293.39
—
215.31
Densitya (g/cc)
Miscellaneous
—/—
1.27
—
—
—/—
—
>250(d)
—
s/—
1.69
—
160(d)
—
s/—
State/Color
Reference
II. Zirconium Salts Zirconium 2-ethylhexanoate (C4H9CH(C2H5)COO)4Zr Zirconium methacrylate (CH2C(CH3)COO-)4Zr Zirconyl dimethacrylate (CH2C(CH3)COO-)2ZrO Zirconyl propionate (CH3CH2COO-)2ZrO
1, p. 302
Soluble in isopropanol, THF
1, p. 303
Soluble in ethylacetate
1, p. 304
—
Soluble in ethylacetate, ethanol
1, p. 304
—
Characterized by infrared 2, p. 561; spectroscopy; could exist in 8, p. 2453 oligomeric form; decomposes at 178°C
—
Characterized by infrared spectroscopy; could exist in oligomeric form —
III. Miscellaneous Zirconium Compounds Cyclopentadienyl zirconium triacetate Triacetoxy cyclopentadienyl ziroconium Zr(O2CCH3)3(M-C5H5)
333.45
—
~170
—
Cyclopentadienyl zinc tripivalate Zr(O2CC(CH3)3t ) 3 (M -C5H5)
459.69
—
—
—
Crystalline solid/white (in benzene, petroleum ether) s/—
Dimethylzirconocene (C5H5)2Zr(CH3)2 Dimethyl[bis(cyclopentadienyl)- silyl]zirconium dichloride (CH3)2Si(C5H5)2ZrCl2 Tetracyclopentadienyl zirconium Zr(C5H5)4
251.38
—
170
—
s/—
—
348.46
—
—
—
—/—
—
—
1, p. 301
351.60
—
—
—
—/—
—
—
2, p. 562
Zirconocene dichloride (C5H5)2ZrCl2
292.32
—
242–245
—
s/white
—
—
1, p. 304
2, p. 561
1, p. 301
REFERENCES 1. The Gelest Inc. Catalog, Gelest, Inc., Bensalem, PA, 2001. 2. Comprehensive Organometallic Chemistry: The Synthesis, Reactions, and Structures of Organometallic Compounds, edited by G. Wilkinson, F. G. Stone, and E. W. Abel, Pergamon Press, New York, 1982, Vol. 1–9. 3. H. D. Pierson, Handbook of Chemical Vapor Deposition: Principles, Technology, and Applications, Noyes, Park Ridge, NJ, 1992. 4. D. C. Bradley, R. C. Mehrotra, and D. P. Gaur, Metal Alkoxides, Academic Press, New York, 1978. 5. E. G., Rochow, D. T. Hurd, and R. N. Lewis, The Chemistry of Organometallic Compounds, John Wiley & Sons, New York, 1957. 6. Organometallics for Vapor Phase Epitaxy, Morton Thiokol Catalog, Morton Thiokol CVD, Woburn, MA, 1987. 7. The Chemat Catalog, Chemat Technology, Northridge, CA, 1993. 8. Dictionary of Organometallic Compounds, Chapman and Hall, New York, 1984, Vol. 1–4 and Suppl. 1–4. 9. G. E. Coates et al., Alkylberyllium alkoxides and some of their reactions with bases, J. Chem. Soc. (A), 477, 1968. 10. R. A. Andresen et al., Reactions of beryllium with carbonyl and azomethine groups: additions, reductions, complex formation, and ortho-metallation, J. Chem. Soc. Dalton Trans., 1171, 1974. 11. CRC Handbook of Physics and Chemistry, edited by D. R. Lide, 73rd ed., CRC Press, Boca Raton, FL, 1992–1993. 12. N. A. Bell et al., The addition of alkylberyllium hydrides to some unsaturated compounds, J. Chem. Soc. (A), 1969, 1966. 13. Silicon Compounds, Register and Review, edited by R. Anderson, B. C. Arkles, and G. L. Larson, 4th ed., Petrarch Systems, Bristol, PA, 1987. 14. D. S. Brown et al., The crystal and molecular structure of bis(2,3,4,5-tetrafluorophenyl)mercury, J. Organometallic Chem., 194, 131–135, 1980. 15a. J. C. Mill et al., The crystal structure of methylmercury (II) cyanide, J. Organometallic Chem., 14, 33–41, 1968. 16. D. J. Brauer et al., Vibrational spectra of normal coordinate analysis of CF3 compounds. XIX. Molecular structure and vibration spectra of bis(trifluoromethyl)mercury, J. Organometallic Chem., 135, 281–299, 1977. 17. P. B. Hitchcock et al., Metallocene derivates of early transition elements. Part 1. Niobium IV chlorides, chloroalkyls, and dialkyls and the crystal and molecular structure of [Nb(M-C5H5)2(Ch2Ph)2], J. Chem. Soc. Dalton Trans., 180, 1981. 18. E. E. H. Otto et al., Ligand exchange and ligand migration reactions involving dicyclopentadienylniobium (III) carbonyl derivatives, J. Organometallic Chem., 170, 209–216, 1978. 19. C. P. Verkade et al., Organoniobium compounds containing cyclooctatetraene as a ligand, J. Organometallic Chem., 154, 317–321, 1978. 20. R. S. Threlkel et al., Migratory insertion reactions of carbenes. Kinetics and mechanisms of migratory insertion reactions of zirconoxy carbene complexes of niobocene hydride and alkyls, J. Am. Chem. Soc., 2550, 1981. 21. L. E. Manzer, Preparation of the paramagnetic alkyls Cp2NbMe2 and (MeCp)2TaMe2 and some sixand eight-coordinate phosphine derivatives of Nb(IV), Inorg. Chem., 16 (3), 525, 1977. 22. G. W. A. Fowles et al., Reaction of dimethylzinc and tantalum(V) chloride and some coordination compounds of methyltantalum(V) chloride, dimethyltantalum(V) chloride and methylniobium(V) chloride, J. Chem. Soc. Dalton Trans., 961, 1973. 23. S. Numat et al., Preparation and some reactions of tris(polychlorophenyl)thallium(III) compounds, J. Organometallic Chem., 102, 259–263, 1975. 24. A. G. Lee, Cyclopentadienyl- and phenylethyinyl-dimethylthallium, J. Chem. Soc. (A), 2157, 1970. 25. J. P. Maher et al., Proton magnetic resonance spectra of thallium trialkyls, chemical exchange, and the formation of a mixed tri(methyl, vinyl)thallium, Proc. Chem. Soc., 5534, 1963.
© 2005 by CRC Press
26. B. G. Gowenlock et al., The organometallic chemistry of the alkaline-earth metals. Part 3. Preparation and properties of alkylhalogen metal compounds and related species of calcium, strontium, and barium, J. Chem. Soc. Dalton Trans., 657, 1978. 27. These compounds originally appeared in The Gelest Inc. Catalog (Ref. 2), Gelest, Inc., Bensalem, PA, 1992, but were no longer in the 2001 catalog.
© 2005 by CRC Press
0910_book.fm Page 295 Wednesday, September 22, 2004 9:01 AM
CHAPTER 4 Properties of Solid-State Inorganic Materials I. GENERAL PROPERTIES
© 2005 by CRC Press
Density (g/cc)
Ac2O3 Ac2S3
502 550.19
9.19 6.75
AlB2 Al4C3 AlN Al2O3 α-Al2O3 γ-Al2O3 Al2Se3 Al2S3
48.6 143.96 40.99 101.96 101.96 101.96 290.84 150.16
Am2O3 AmO2
Crystalline Form
Miscellaneous
Hexagonal Cubic
White, insoluble in water
3.19 2.36 3.26 3.965 3.97 3.5–3.9 3.437 2.02
Hexagonal Hexagonal Hexagonal Hexagonal Rhombohedral Microcrystalline powder Powder Hexagonal
Copper red; melts at 1654°C Yellow-green; dissolves in dilute acid White; dissolves in acid; alkali Colorless; soluble in acid; alkali Colorless; soluble in acid; alkali; insoluble in water White; soluble in acid; alkali Light brown; dissolves in acid Yellow; soluble in acid; insoluble in acetone; smell of H2S
534.26 275.13
— 11.68
Cubic or hexagonal Cubic
Red-brown; soluble in acid Black; soluble in acid
SbN Sb2O5 Sb2O4 Sb2O3
135.76 323.50 307.50 291.05
Antimony selenide Antimony (penta)sulfide Antimony (tri)sulfide
Sb2Se3 Sb2S5 Sb2S3
480.38 403.82 339.69
Antimony telluride
Sb2Te3
626.30
— 3.80 5.82 5.2 5.67 — 4.12 4.64 4.12 6.5
Powder Powder Powder Cubic Rhombohedral Crystalline Powder Rhombohedral Amorphous —
Orange powder; decomposes on melting; dissolves in cold H2O Yellow; very slightly soluble in H2O and acid; alkali White; n0 = 2.0; very slightly soluble in H2O and acid; alkali White; slightly soluble in H2O; soluble in acid; alkali Colorless; slightly soluble in H2O; soluble in acid, alkali Gray; very slightly soluble in H2O; soluble in concentrated HCl Yellow; insoluble in H2O and ethanol; soluble in HCl Black; n0 = 3.2; very slightly soluble in H2O; soluble in ethanol Yellow-red; very slightly soluble in H2O; soluble in ethanol Gray; soluble in HNO3; aqua regia
As2O5
229.04
4.32
Amorphous
White deliquescent; soluble in H2O; ethanol, acid, alkali
Actinium Materials Actinium sesquioxide Actinium sesquisulfide Aluminum Materials Aluminum Aluminum Aluminum Aluminum Aluminum Aluminum Aluminum Aluminum
(di)boride carbide nitride oxide oxide oxide selenide sulfide
Americium oxide Americium (di)oxide Antimony Materials Antimony Antimony Antimony Antimony
nitride (penta)oxide (tetra)oxide (tri)oxide
Arsenic Materials Arsenic (penta)oxide
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
Americium Materials
0910_book.fm Page 296 Wednesday, September 22, 2004 9:01 AM
Molecular Weight
Formula
296
© 2005 by CRC Press
Material
197.84
Arsenic selenide Arsenic sulfide
As2Se3 As2S3
386.72 213.97
Arsenic (penta)sulfide Arsenic (tri)sulfide
As2S5 As2S3
310.16 246.04
BaB6 BaC2 Ba3N2 BaO
202.19 161.35 440.00 153.33
Barium (per)oxide
BaO2
Barium selenide Barium telluride
3.74 3.87 4.15 4.75 α 3.51 β 3.25 — 3.43
Amorphous Cubic Monoclinic Crystalline Monoclinic — — Monoclinic
Soluble in H2O, alkali Colorless; n0 = 1.76; soluble in H2O, ethanol, acid, alkali Colorless; n0 = 1.8−2.0; soluble in H2O, ethanol, acid, alkali Brown; insoluble in cold H2O, acid; dissolves in hot H2O; soluble in base Red-brown; insoluble in H2O; soluble in K2S, bicarbonate n0 = 2.4−2.6 Yellow; insoluble in H2O; soluble in alkali, HNO3 Yellow red; n0 = 2.4−2.8; soluble in water, ethanol, alkali
4.36 3.75 4.783 5.72
Cubic Tetragonal — Cubic
169.33
4.96
—
BaSe BaTe
216.29 264.93
5.02 5.13
Cubic disk Cubic disk
Metallic black; insoluble in H2O and HCl; soluble in HNO3 Gray; dissolves in acid; reacts with H2O Yellow brown; dissolves in H2O Colorless, yellowishwhite powder; soluble in dilute acid and alkali; insoluble in acetone, NH3 Whitish gray powder; soluble in dilute acid; insoluble in acetone; very slightly soluble in H2O White; n0 = 2.268; dissolves in H2O, HCl Yellow-white; nD = 2.440; dissolves in acid
Be2C Be3N2 BeO BeS
30.04 55.05 25.01 41.07
1.90 — 3.01 2.36
Hexagonal Cubic Hexagonal Regular
Yellow; decomposes on melting; reacts with H2O; soluble in acid Colorless; dissolves in H2O, acid and concentrated alkali White; n0 = 1.719, 1.733; soluble in concentrated H2SO4, fused KOH Dissolves in H2O
Bismuth (mono)oxide Bismuth (penta)oxide Bismuth (tri)oxide
BiO Bi2O5 Bi2O3
224.98 497.96 465.96
Bismuth (mono)sulfide
BiS
241.04
7.15 5.10 8.9 8.20 8.55 7.6–7.8
Powder — Rhombohedral Cubic Rhombohedral Powder
Dark gray powder; dissolves in H2O, dilute acid; soluble in dilute KOH Red or brown; insoluble in H2O; soluble in KOH Yellow; insoluble in H2O; soluble in acid Gray-black; insoluble in H2O; soluble in acid White to light yellow; n0 = 1.91; insoluble in H2O; slightly soluble in acid Dark gray powder; decomposes on boiling; very slightly soluble in H2O
B 4C BN
55.26 24.82
2.52 2.25
Rhombohedral Hexagonal
Black; insoluble in H2O, acid; soluble in fused alkali White; insoluble in cold H2O; dissolves slightly in hot H2O; slightly soluble in hot acid
Barium Materials Barium Barium Barium Barium
(hexa)boride carbide nitride oxide
Beryllium Materials Beryllium Beryllium Beryllium Beryllium
carbide nitride oxide sulfide
Bismuth Materials
Boron Materials
297
(Tetra)boron carbide Boron nitride
0910_book.fm Page 297 Wednesday, September 22, 2004 9:01 AM
As2O3
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
© 2005 by CRC Press
Arsenic (tri)oxide
B 2O 3 BP B2Se3 B 2S 5 B 2S 3
69.62 41.78 258.50 181.92 117.80
2.46 ± 0.01 — — 1.85 1.55
BrO2 Br2O Br3O8
111.91 175.81 367.71
— — —
Cadmium oxide
CdO
128.41
Cadmium phosphide Cadmium selenide Cadmium telluride
Cd3P2 CdSe CdTe
Boron Boron Boron Boron Boron
oxide phosphide (tri)selenide (penta)sulfide (tri)sulfide
Crystalline Form
Miscellaneous
Rhombohedral Powder Powder Tetragonal Vitreous
Colorless; n0 = 1.61, 1.64; soluble in H2O Maroon; insoluble in H2O, all solvents Yellow-gray powder; dissolves in H2O Colorless; dissolves in H2O, ethanol White; dissolves in H2O, ethanol
— — —
Light yellow Dark brown White
399.18 191.37 240.01
6.95 8.15 5.60 5.81 5.850
Amorphous Cubic Tetragonal Powder; hexagonal Cubic
Brown; insoluble in H2O and alkali Brown; insoluble in H2O and alkali; soluble in acid Green; soluble in dilute HCl; soluble in concentrated HNO3 Green-brown or red; insoluble in H2O; dissolves in acid Black; insoluble in H2O and acid; dissolves in HNO3
Ca3N2 CaO2 Ca3P2 CaSe CaS CaTe
148.25 72.08 182.19 119.04 72.14 167.68
2.63 2.92 2.51 3.57 2.5 4.873
Hexagonal Tetragonal Lumps Cubic Cubic Cubic
Brown crystal; dissolves in H2O; soluble in dilute acid White; n0 = 1.895; slightly soluble in H2O; soluble in acid Gray; soluble in acid; insoluble in ethanol, benzene n0 = 2.274 Colorless; n0 = 2.137; dissolves in H2O, acid n0 = 2.51, 2.58
CeB6 CeB4 CeC2 Ce2O3 CeO2
204.98 183.36 164.14 328.24 172.12
— 5.74 5.23 6.86 7.132
Cubic Tetragonal Hexagonal Trigonal Powder
Ce2S3
376.42
5.020
Powder
Metallic blue, insoluble in H2O, HCl; decomposes upon boiling — Red; dissolves in H2O; soluble in acid Gray-green; insoluble in H2O, HCl; soluble in H2SO4 Brownish white; insoluble in H2O and dilute acid; soluble in H2SO4, HNO3 Red crystals; purple powder; insoluble in H2O; soluble in dilute acid
Bromine Materials Bromine (di)oxide Bromine (mono)oxide (Tri)bromine octoxide Cadmium Materials
Calcium Calcium Calcium Calcium Calcium Calcium
nitride (per)oxide phosphide selenide sulfide telluride
Cerium Materials Cerium Cerium Cerium Cerium Cerium
(hexa)boride (tetra)boride carbide (III) oxide (IV) (di)oxide
Cerium (III) sulfide
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
Calcium Materials
0910_book.fm Page 298 Wednesday, September 22, 2004 9:01 AM
Density (g/cc)
Formula
298
© 2005 by CRC Press
Molecular Weight
Material
CsN3 Cs2O Cs2O2 Cs2O3 Cs2S2 Cs2S6 Cs2S5 Cs2S4 Cs2S3
174.93 281.81 297.81 313.81 329.93 458.17 426.11 394.05 361.99
— 4.25 4.25 4.25 — — 2.806 — —
Needle Needle Needle Cubic Amorphous — — — Leaf
Colorless; deliquescent Orange; very soluble in H2O; soluble in acid Pale yellow; soluble in H2O, acid Chocolate brown crystals; dissolves in H2O; soluble in acid Dark red Brownish red — Yellow Yellow
CrB Cr3C2 CrN CrO2 CrO Cr2O3 CrO3 CrP CrS Cr2S3
62.81 180.01 66.00 83.99 68.00 151.99 99.99 82.97 84.06 200.17
6.17 6.68 5.9 — — 5.21 2.70 5.7 4.85 3.77
Orthorhombic/crystalline Rhombohedral Cubic/amorphous Powder Powder Hexagonal Rhombohedral Crystalline Powder/hexagonal Powder
Silver; insoluble in H2O Gray; insoluble in H2O Insoluble in H2O Brown-black; insoluble in cold H2O; soluble in HNO3 Black; insoluble in H2O, dilute HNO3 Green; n0 = 2.551; insoluble in H2O, acid, alkali Red; deliquescent; decomposes upon boiling; soluble in H2SO4, HNO3 Gray-black; insoluble in cold H2O; soluble in HNO3 Black; insoluble in cold H2O; very soluble in acid Brown-black; insoluble in H2O; soluble in HNO3
Cobalt (mono)boride Cobalt (II) oxide Cobalt (III) oxide
CoB CoO Co2O3
69.74 74.93 165.86
7.25 6.45 5.18
Cobalt Cobalt Cobalt Cobalt Cobalt
Co3O4 Co2P CoSe CoS2 Co2S3
240.80 148.84 137.89 123.05 214.05
6.07 6.4 7.65 4.269 4.8
Prism Cubic Hexagonal Rhombohedral Cubic Need Hexagonal Cubic Crystalline
Dissolves in H2O; soluble in HNO3 Pink, insoluble in H2O, soluble in acid Black-gray; insoluble in H2O, ethanol Soluble in acid Black; insoluble in H2O; very slightly soluble in acid Gray; insoluble in H2O; soluble in HNO3 Yellow; soluble in HNO3; insoluble in ethanol Black; soluble in HNO3; insoluble in H2O Black crystal; dissolves in acid
Cu2C2 CuN3 Cu(N3)2
151.11 105.57 147.59
— 3.26 2.604
Amorphous Crystalline Crystalline
Red; explosive; soluble in acid Colorless; very explosive; dissolves in concentrated H2SO4 Brown-red/yellow; explosive; very soluble in dilute acid
Chromium Compounds Chromium (mono)boride Trichromium (di)carbide Chromium (mono)nitride Chromium (di)oxide Chromium (II) monoxide Chromium (III) (sesqui)oxide Chromium (tri)oxide Chromium (mono)phosphide Chromium (II) (mono)sulfide Chromium (III) (sesqui)sulfide Cobalt Compounds
(II, III) oxide phosphide (mono)selenide (di)sulfide sesquisulfide
Copper Compounds
299
Copper (III) acetylide Copper (I) azide Copper (II) azide
0910_book.fm Page 299 Wednesday, September 22, 2004 9:01 AM
Compounds azide oxide (per)oxide (tri)oxide (di)sulfide (hexa)sulfide (penta)sulfide (tetra)sulfide (tri)sulfide
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
© 2005 by CRC Press
Cesium Cesium Cesium Cesium Cesium Cesium Cesium Cesium Cesium Cesium
Density (g/cc)
Cu3B2 Cu3N CuO
212.26 204.64 79.55
8.116 5.84 6.3−6.49
(Tri)copper phosphide
Cu3P
221.61
6.4−6.8
Copper (I) selenide Copper (II) selenide
Cu2Se CuSe
206.05 142.51
6.749 5.99
Copper telluride
Cu2Te
254.69
7.27
Cubic Hexagonal plates (Unstable) Hexagonal
Dy2O3
373.00
7.81
Powder
White
Er2O3
382.52
8.640
Powder; trigonal to cubic at 1300
Rose red; insoluble in H2O; soluble in acid
Eu2O3
351.92
7.42
Powder
Pale rose
Formula
Copper boride Copper nitride Copper (II) oxide
Crystalline Form
Miscellaneous
— Powder Bulk powder or monoclinic crystals —
Yellow Dark green powder; dissolves in H2O, acid Insoluble in H2O; ethanol; soluble in acid, KCN, NH4Cl Gray-black; insoluble in H2O, HCl; soluble in HNO3; decomposes upon melting Black; dissolves in HCl Green-black; insoluble in H2O; slightly soluble in HCl, NH4OH Blue-black; insoluble in acid
Dysprosium Compounds Dysprosium oxide
Erbium oxide
Europium Compounds Europium oxide Gadolinium Compounds Gadolinium oxide Gadolinium sulfide Gallium Compounds Gallium nitride Gallium (α)-(sesqui)oxide Gallium (β)-(sesqui)oxide
Gd2O3 Gd2S3
362.50 410.70
7.407 6.1
Amorphous powder Cubic
White; hygroscopic; soluble in acid Yellow; hygroscopic; dissolves in acid, H2O
GaN Ga2O3 Ga2O3
83.73 187.44 187.44
6.1 6.44 5.88
Dark gray; sublimes at 800°C; insoluble in H2O, dilute acid White; insoluble in H2O; soluble in alkali; n0 = 1.92, 1.95 Insoluble in H2O; soluble in alkali
Gallium Gallium Gallium Gallium Gallium
Ga2O GaSe GasSe3 Ga2Se GaS
155.44 148.68 376.32 218.40 101.78
4.77 5.03 4.92 5.02 3.86
Powder Hexagonal Rhombohedral; monoclinic Powder Leaf — — Crystalline
(sub)oxide (mono)selenide (sesqui)selenide (sub)selenide (mono)sulfide
Black-brown; insoluble in H2O; soluble in acid, alkali Dark red-brown; greasy Red-brown; brittle; hard Blue Yellow; insoluble in H2O; soluble in acid, alkali
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
Erbium Compounds
0910_book.fm Page 300 Wednesday, September 22, 2004 9:01 AM
300
© 2005 by CRC Press
Molecular Weight
Material
235.62
3.65 4.18 5.44 5.57
Crystalline or amorphous — Soft crystalline Brittle crystalline
Yellow crystal; white amorphous; dissolves in H2O, acid; soluble in alkali Dark gray; dissolves in H2O; soluble in acid, alkali Black Black
Gallium (sub)sulfide Gallium (mono)telluride Gallium (sesqui)telluride
Ga2S GaTe Ga2Te3
171.50 197.32 522.24
Ge3N2 Ge3N4 GeO2 GeO2 GeO GeSe2 GeS2 GeS
245.78 273.80 104.59 104.59 88.59 230.51 136.71 104.65
— 5.25 4.228 6.239 — 4.56 2.94 3.31 4.01
Crystalline Powder Hexagonal Tetragonal Powder Rhombohedral Powder/orthorhombic Amorphous Rhombohedral pyramid
Black White to light brown; insoluble in H2O, acid, alkali Colorless; n0 = 1.650; soluble in acid, alkali; insoluble in HCl Insoluble in H2O, HCl; slightly soluble in NaOH Black crystalline powder; n0 = 1.607; insoluble in H2O, acid, alkali Orange; slightly soluble in acid, alkali White; soluble in alkali, ethanol, acid Yellow-red Black; insoluble in H2O; soluble in HCl, alkali
Au2O3 Au2P3 Au2Se2 Au2S Au2S3 AuTe2
441.93 486.85 630.81 425.99 490.11 452.17
— 6.67 4.65 — 8.754 8.2–9.3
— — — Powder Powder Rhombohedral Monoclinic Triclinic
Insoluble in H2O; soluble in HCl, concentrated HNO3 Gray; insoluble in HCl, dilute HNO3 — Brown-black; insoluble in acid Brown-black; insoluble in H2O, alkali Insoluble in H2O — Yellow
HfC Hf N HfO2
190.50 192.50 210.49
12.20 — 9.68
— Cubic Cubic
Insoluble in cold H2O Yellow-brown White; insoluble in H2O
Iridium dioxide Iridium (sesqui)oxide
IrO2 Ir2O3
224.22 432.44
11.665 —
Crystalline or tetragonal —
Iridium selenide
IrSe2
350.14
—
Black tetragonal or blue crystal; insoluble in acid, alkali Blue-black crystals; insoluble in H2O alkali; soluble in acid; decomposes at 1000οC Insoluble in acid
Germanium Compounds (Tri)germanium (di)nitride (Tri)germanium (tetra)nitride Germanium (di)oxide (soluble) Germanium (di)oxide (insoluble) Germanium (mono)oxide Germanium selenide Germanium (di)sulfide Germanium (mono)sulfide
Gold Compounds Gold Gold Gold Gold Gold Gold
(III) oxide phosphide selenide (I) sulfide (III) sulfide (di)telluride
Hafnium Compounds Hafnium carbide Hafnium nitride Hafnium oxide Iridium Compounds
301
Crystalline or powder
0910_book.fm Page 301 Wednesday, September 22, 2004 9:01 AM
Ga2S3
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
© 2005 by CRC Press
Gallium (sesqui)sulfide
IrS2 IrS Ir2O3
256.34 224.28 480.62
IrTe3 FeB Fe3C Fe4N Fe2N Fe3O4
Crystalline Form
Miscellaneous
8.43 — 9.64
— — —
575.02
9.5
Crystalline
Brown-black; insoluble in H2O, acid Blue-black; decomposes upon boiling; insoluble in H2O, acid Brown-black; decomposes upon melting; slightly soluble in H2O; soluble in HNO3 Dark gray; insoluble in H2O, acid
Iridium telluride Iron Compounds Iron boride Iron carbide Iron nitride Iron nitride Iron oxide
66.66 179.55 237.39 125.70 231.54
7.15 7.694 6.57 6.35 5.18
Crystalline Cubic — — Cubic or powder
Iron (mono)phosphide
FeP
86.82
(Di)iron phosphide (Tri)iron phosphide Iron (di)sulfide
Fe2P Fe3P FeS2
142.67 198.51 119.97
Iron (II) sulfide Iron (III) sulfide
FeS Fe2S3
87.91 207.87
LaB6 LaC2 La2S3
203.77 162.93 373.99
Lead azide Lead (di)oxide Lead (mono)oxide
Pb(N3)2 PbO2 PbO
291.24 239.20 223.20
Lead (red)oxide Lead (sesqui)oxide Lead (sub)oxide
Pb3O4 Pb2O3 Pb2O
685.60 462.40 430.40
Rhombohedral
Gray; insoluble in H2O Gray; insoluble in H2O; soluble in acid — Gray; insoluble in H2O; soluble in acid Black cubic or red to black powder; n0 = 2.42; insoluble in H2O, ethanol; soluble in concentrated acid —
Crystalline or powder — Cubic Rhombohedral Hexagonal —
Blue-gray; insoluble in H2O, dilute acid Gray; insoluble in H2O Yellow; dissolves in dilute acid; HNO3 Yellow; insoluble in dilute acid; dissolves in HNO3 Black-brown; dissolves in hot H2O; soluble in dilute acid Yellow-green; decomposes upon melting; dissolves in acid
2.61 5.02 4.911
Cubic Crystalline Crystalline; hexagonal
Purple metallic; decomposes upon boiling; insoluble in H2O, HCl Yellow; dissolves in H2O; soluble in H2SO4 Red-yellow; dissolves in H2O; soluble in acid
— 9.375 9.53 8.0 9.1 — 8.342
Needles or powder Tetragonal Tetragonal Rhombohedral Tetragonal Powder; amorphous Amorphous
Colorless; very soluble in acetone, acid; insoluble in NH4OH Bronze-black, insoluble in H2O, ethanol; soluble in dilute HCl Yellow; soluble in HNO3, alkali Yellow; n0 = 2.51, 2.6; insoluble in H2O; soluble in alkali Red; insoluble in H2O and ethanol, soluble in hydrocarbon, hot HCl Orange-yellow; insoluble in H2O; dissolves in hot H2O, acid Black; decomposes upon melting; insoluble in H2O; soluble in acid, alkali
6.07 (5.2) 6.56 6.74 5.0 4.87 4.74 4.3
Lanthanum Compounds Lanthanum (hexa)boride Lanthanum carbide Lanthanum sulfide Lead Compounds
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
Iridium (di)sulfide Iridium (mono)sulfide Iridium (sesqui)sulfide
0910_book.fm Page 302 Wednesday, September 22, 2004 9:01 AM
Density (g/cc)
Formula
302
© 2005 by CRC Press
Molecular Weight
Material
362.07 286.16
— 8.10
Unstable Cubic
Black; flammable; dissolves in H2O, dilute acid Gray; insoluble in H2O; soluble in HNO3
Lithium azide Lithium carbide Lithium nitride
LiN3 Li2C2 Li3N
48.96 37.90 34.83
— 1.65 —
Colorless White; dissolves in H2O; soluble in acid Red-brown amorphous, black-gray crystal
Lithium oxide Lithium sulfide
Li2O Li2S
29.88 45.94
2.013 1.66
Crystalline; hygroscopic Crystalline/powder Amorphous; cubic; crystalline Crystalline/cubic Cubic
Lu2O3
397.93
9.42
Cubic crystalline
—
Magnesium boride Magnesium nitride
MgB4 Mg3N2
89.17 100.93
— 2.712
— Powder mass
Magnesium Magnesium Magnesium Magnesium Magnesium
MgO2 Mg3P2 MgSe MgS MgTe
56.30 134.86 103.27 56.37 151.91
— 2.055 4.21 2.84 3.86
Powder Cubic crystalline Powder/crystalline Cubic Hexagonal crystalline
Blue; dissolves in H2O; slightly soluble in acid Green-yellow powder; dissolves in H2O; soluble in acid; decomposes at 270οC White; insoluble in H2O; soluble in acid Yellow-green; dissolves in H2O Light gray; n0 = 2.44; dissolves in H2O, acid Pale red-brown; n0 = 2.271; dissolves in H2O; soluble in acid White; dissolves in H2O, acid
Crystalline Crystalline powder Tetragonal Tetragonal; rhombohedral Rhombohedral; powder Oil; hygroscopic Cubic Cubic (tetragonal) —
Lithium Compounds
White; n0 = 1.644 White to yellow; cubic; deliquescent; very soluble in H2O
Lutetium Compounds Lutetium oxide Magnesium Compounds
(per)oxide phosphide selenide sulfide telluride
Manganese Compounds (di)boride (mono)boride carbide (II, III) oxide
MnB2 MnB Mn3C Mn3O4
76.56 65.75 176.83 228.81
6.9 6.2 6.89 4.856
Manganese Manganese Manganese Manganese Manganese
(di)oxide (hepta)oxide (mono)oxide (III) (sesqui)oxide (tri)oxide
MnO2 Mn2O7 MnO Mn2O3 MnO3
86.94 221.87 70.94 157.87 102.94
5.026 2.396 5.43−5.46 4.50 —
Manganese (mono)phosphide (Tri)manganese (di)phosphide
MnP Mn3P2
85.91 226.76
5.39 5.12
— —
Gray-violet; dissolves in H2O; soluble in acid — Dissolves in H2O; soluble in acid Black; n0 = 2.46; insoluble in H2O; soluble in HCl Black, brown-black powder; insoluble in H2O, HNO3; soluble in HCl Dark red oil; hygroscopic; explosive; dissolves in H2O; soluble in H2SO4 Green; n0 = 2.16; insoluble in H2Ol soluble in acid Black; insoluble in H2O, acetone, acid; soluble in acid Reddish; deliquescent; decomposes upon melting; soluble in alkali, H2O, H2SO4 Dark gray; insoluble in H2O; slightly soluble in HNO3 Dark gray; insoluble in H2O; slightly soluble in dilute HNO3
303
Manganese Manganese Manganese Manganese
0910_book.fm Page 303 Wednesday, September 22, 2004 9:01 AM
PbP5 PbSe
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
© 2005 by CRC Press
Lead phosphide Lead selenide
MnSe MnS2
133.90 119.06
Hg(N3)2 Hg3N2 Hg2O HgO Hg2S HgS
Manganese selenide Manganese (IV) sulfide
Crystalline Form
Miscellaneous
5.55 3.463
Cubic Cubic
Gray; insoluble in H2O; dissolves in dilute acid Black; n0 = 2.69; decomposes upon melting; insoluble in H2O; dissolves in HCl
485.22 629.78 417.18 216.59
— — 9.8 1.1
Crystalline Powder Powder Rhombohedral
433.24 232.65
— 8.10
— Crystalline hexagonal/powder Cubic/amorphous powder
White; explodes in light Brown; explodes on melting; dissolves in acid, H2O Black or brownish-black; insoluble in H2O; soluble in HNO3 Yellow, red; n0 = 2.37, 2.5, 2.65; soluble in acid; insoluble in ethanol, alkali Black; decomposes upon melting; insoluble in H2O, ethanol Red; n0 = 2.854 3.201; insoluble in HNO3
Mercury Compounds Mercury Mercury Mercury Mercury
(I) azide nitride (I) oxide (II) oxide
Mercury (I) sulfide Mercury (II) sulfide
7.73
Black; insoluble in H2O, HNO3; soluble in alkali
Molybdenum (di)boride Molybdenum (mono)boride (Di)molybdenum boride Molybdenum (mono)carbide (Di)molybdenum carbide Molybdenum (di)oxide
MoB2 MoB Mo2B MoC Mo2C MoO2
117.56 106.75 202.69 107.95 203.89 127.94
7.12 8.65 9.26 8.20 8.9 6.47
Rhombohedral Tetragonal Tetragonal Hexagonal Hexagonal prism Tetragonal or monoclinic
Molybdenum (penta)oxide
Mo2O5
271.88
Molybdenum (sesqui)oxide Molybdenum phosphide Molybdenum (di)sulfide
Mo2O3 MoP2 MoS2
239.88 157.89 160.06
— 3.6 — 5.35 4.80
Powder Colorless/powder — Powder Hexagonal
Molybdenum (sesqui)sulfide Molybdenum (tetra)sulfide
Mo2S3 MoS4
288.06 224.18
5.91 —
Needles Powder
Molybdenum (tri)sulfide
MoS3
192.12
—
Plates
— — — Gray; insoluble in H2O, alkali; slightly soluble in acid White; slightly soluble in acid; insoluble in alkali Lead gray; insoluble in H2O; slightly soluble in hot concentrated H2SO4; insoluble in alkali, HCl, HF Violet-black; soluble in hot acid Dark blue; soluble in acid; insoluble in benzene Blue; opaque; insoluble in H2O, acid, alkali Black; soluble in acid; insoluble in concentrated HCl Black luster; insoluble in H2O; soluble in acid; insoluble in dilute acid, concentrated H2SO4 Steel gray; insoluble in concentrated HCl Brown; decomposes upon melting; insoluble in H2O, acid; soluble in hot H2SO4 Black; decomposes upon melting or boiling; soluble in H2O, alkali
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
Molybdenum Compounds
0910_book.fm Page 304 Wednesday, September 22, 2004 9:01 AM
Density (g/cc)
Formula
304
© 2005 by CRC Press
Molecular Weight
Material
NdC2
168.26
5.15
Hexagonal leaf
Neodymium nitride Neodymium oxide Neodymium sulfide
NdN Nd2O3 Nd2S3
158.25 336.48 384.66
— 7.24 5.179
Powder Powder Powder
NpO2 Np3O3
269.05 839.14
Nickel boride Nickel carbide Nickel (mono)oxide (Di)nickel phosphide (Penta)nickel (di)phosphide (Tri)nickel (di)phosphide Nickel selenide Nickel (mono)sulfide Nickel (sub)sulfide
NiB Ni3C NiO Ni2P Ni5P2 Ni3P2 NiSe NiS Ni3S2
69.50 188.08 74.69 148.35 355.40 238.01 137.65 90.75 240.19
Nickel (II, III) sulfide
Ni3S4
304.31
4.7
Cubic
Niobium boride Niobium carbide
NbB2 NbC
114.53 104.92
6.97 7.6
Hexagonal Cubic/powder
Niobium nitride Niobium (di)oxide Niobium (mono)oxide Niobium (penta)oxide (Sesqui)niobium (tri)oxide
NbN NbO2 NbO Nb2O5 Nb2O3
106.91 124.91 108.91 265.81 233.81
8.4 5.9 7.30 4.47 —
Cubic — Cubic Rhombohedral —
Yellow; decomposes upon melting; dissolves in H2O; soluble in dilute acid; insoluble in concentrated HNO3 Black; dissolves in H2O Light blue; red fluorescence; soluble in acid Olive green; decomposes upon melting; insoluble in cold H2O; dissolves in hot H2O; soluble in dilute acid
Neptunium Compounds Neptunium (di)oxide (Tri)neptunium (octa)oxide
11.11 —
Cubic Cubic
Apple green; insoluble in H2O; soluble in concentrated acid Brown; soluble in HNO3
Prisms Powder Cubic Crystalline Needles/tablet crystals — Cubic Trigonal/amorphous —
Dissolves in H2O; soluble in HNO3 Dark gray Green-black; n0 = 2.1818 (red); soluble in acid; insoluble in H2O Gray; insoluble in H2O, acid — Dark green-black White or gray; insoluble in H2O, acid, HCl Black; soluble in HNO3 Pale, yellowish, bronze metallic luster; insoluble in cold H2O; soluble in HNO3 Gray-black; insoluble in cold H2O; soluble in HNO3
Nickel Compounds 7.39 7.957 6.67 6.31 — 5.99 8.46 5.3–5.65 5.82
Niobium Compounds — Black, lavender-gray powder; insoluble in cold H2O; soluble in HNO3, HF Black; insoluble in cold H2O, HNO3 Black; insoluble in H2O, acid Black; insoluble in H2O; soluble in acid, alkali White; insoluble in H2O acid; soluble in alkali Blue-black
0910_book.fm Page 305 Wednesday, September 22, 2004 9:01 AM
Neodymium carbide
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
© 2005 by CRC Press
Neodymium Compounds
305
Molecular Weight
Density (g/cc)
Crystalline Form
Miscellaneous
Crystalline Powder — — Monoclinic Cubic
Osmium Compounds Osmium (di)oxide
OsO2
222.20
Osmium Osmium Osmium Osmium
OsO Os2O3 OsO4 OsS2
206.20 428.40 254.20 254.32
11.37 7.71 — — 4.906 9.47
Osmium (tetra)sulfide
OsS4
318.44
—
—
Osmium telluride
OsTe2
445.40
—
Crystalline
Brown; insoluble in H2O, acid Black; insoluble in H2O; soluble in dilute Black; insoluble in H2O Dark brown; decomposes upon melting; insoluble in H2O, acid Colorless Black; decomposes upon melting; insoluble in H2O, alkali; soluble in HNO3 Brown-black; decomposes upon melting; insoluble in cold H2O; soluble in dilute HNO3 Gray-black; insoluble in acid; dissolves in dilute HNO3
PdO PdSe PdSe2 PdS4 PdS Pd2S PdTe2
122.24 185.38 264.34 170.54 138.48 244.90 361.62
9.70 — — 4.7–4.8 6.6 7.303 —
Mass/powder — Hexagonal Crystalline Tetragonal — Crystalline/hexagonal
Greenish blue or amber/black powder; insoluble in H2O Dark gray; insoluble in cold H2O Olive gray; insoluble in H2O, alkali Dark brown; decomposes upon melting; insoluble in H2O Brown-black; insoluble in H2O, HCl Green-gray; insoluble in H2O; slightly soluble in acid Silvery crystal; insoluble in H2O, alkali; soluble in HNO3
Phosphorus (penta)oxide Phosphorus (sesqui)oxide
P 2O 5 P 4O 6
141.94 219.89
2.39 2.135
Monoclinic/powder Powder/crystalline
Phosphorus (tetra)oxide Phosphorus (tri)oxide
P 2O 4 P 2O 3
125.95 109.95
2.54 2.135
Rhombohedral Powder
Phosphorus (penta)selenide (Tetra)phosphorus (tri)selenide (Tetra)phosphorus (hepta)sulfide Phosphorus (penta)sulfide
P2Se5 P4Se3 P 4S 7
456.75 360.78 348.32
— 1.31 2.19
Needles Crystalline Crystalline
White; very deliquescent; monoclinic; soluble in H2SO4 Colorless or white powder; monoclinic crystal; deliquescent; dissolves in hot H2O Colorless; deliquescent; dissolves in hot H2O Colorless or white powder or monoclinic; deliquescent; dissolves in hot H2O Dark red-black; decomposes upon melting; dissolves in cold H2O Orange-red Light yellow
P 2S 5
222.25
2.03
Crystalline
Phosphorus (sesqui)sulfide
P 4S 3
220.08
2.03
Rhombohedral
(mono)oxide (sesqui)oxide (tetra)oxide (di)sulfide
Palladium Compounds (mono)oxide selenide (di)selenide (di)sulfide (mono)sulfide (sub)sulfide (di)telluride
Phosphorus Compounds
Gray–yellow crystal; deliquescent; insoluble in cold H2O; dissolves in hot H2O; soluble in alkali Yellow; insoluble in cold H2O; dissolves in hot H2O
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
Palladium Palladium Palladium Palladium Palladium Palladium Palladium
0910_book.fm Page 306 Wednesday, September 22, 2004 9:01 AM
Formula
306
© 2005 by CRC Press
Material
(II) (mono)oxide (IV) (di)oxide (II,IV) oxide (tri)oxide phosphide (di)selenide (tri)selenide (IV) (di)sulfide (II) (mono)sulfide (sesqui)sulfide telluride
PtO PtO2 Pt3O4 PtO3 PtP2 PtSe2 PtSe3 PtS2 PtS Pt2S3 PtTe2
211.08 227.08 649.24 243.09 257.03 353.00 431.96 259.20 227.14 486.34 450.28
14.9 10.2 — — 9.01 7.65 7.15 7.66 10.04 5.52 —
— — — Powder — Crystalline/amorphous Flakes Powder Tetragonal — Hexagonal
Violet-black; insoluble in H2O acid; soluble in HCl Black; insoluble in H2O acid Decomposes upon melting; insoluble in H2O, acid Reddish brown; soluble in HCl, H2SO4 Metallic shine; insoluble in H2O, acid Black or gray; slightly soluble in acid Blue; insoluble in H2O, concentrated acid Black-brown; insoluble in H2O; soluble in acid Black; decomposes upon melting; insoluble in H2O, acid, alkali Gray; decomposes upon melting; insoluble in H2O, acid Gray
PuN PuO2
253.06 271.05
14.25 11.46
Cubic Cubic
Black; soluble in acid Yellowish-green; slightly soluble in acid
PoO2 PoS
240.98 401.10
— —
Tetragonal —
Red Purple; insoluble in ethanol
KN3 K 3N K 2O K 2O 2 KO2 K 2O 3 K2Se K 2S 2 K 2S K 2S 5 K 2S 4 K 2S 3 K2Te
81.12 131.30 94.20 110.20 71.10 126.20 157.16 142.32 110.26 238.50 206.44 174.38 205.80
2.04 — 2.32 — 2.14 — 2.851 — 1.805 — — — 2.51
Tetragonal — Cubic Amorphous Cubic — Cubic Crystalline Cubic Crystalline Crystalline Crystalline Cubic
Colorless; soluble in ethanol Greenish black; decomposes upon melting; dissolves in cold H2O Colorless; hygroscopic; very soluble in H2O White; deliquescent; decomposes upon boiling Yellow leaf; decomposes upon boiling Red; dissolves in dilute H2SO4 White; turns red in air; hygroscopic Red-yellow; soluble in cold H2O; dissolves in hot H2O Yellow-brown; deliquescent; soluble in H2O Orange; hygroscopic; very soluble in H2O Red-brown; soluble in cold H2O Bright yellow; soluble in cold H2O; dissolves in hot H2O Colorless; hygroscopic; soluble in H2O
Plutonium Compounds Plutonium nitride Plutonium (di)oxide Polonium Compounds Polonium (di)oxide Polonium (mono)sulfide Potassium Compounds Potassium azide Potassium nitride Potassium (mono)oxide Potassium (per)oxide Potassium (super)oxide (Sesqui)potassium (tri)oxide Potassium selenide Potassium (di)sulfide Potassium (mono)sulfide Potassium (penta)sulfide Potassium (tetra)sulfide Potassium (tri)sulfide Potassium telluride
0910_book.fm Page 307 Wednesday, September 22, 2004 9:01 AM
Platinum Platinum Platinum Platinum Platinum Platinum Platinum Platinum Platinum Platinum Platinum
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
© 2005 by CRC Press
Platinium Compounds
307
Molecular Weight
Density (g/cc)
Crystalline Form
Miscellaneous
Praseodymium Compounds Praseodymium carbide
PrC2
164.93
5.10
Crystalline
Praseodymium (di)oxide (Sesqui)praseodymium oxide Praseodymium selenate Praseodymium sulfide
PrO2 Pr2O3 Pr2(Se)4)3 Pr2S3
172.91 329.81 710.69 378.00
6.82 7.07 4.30 5.042
Powder Amorphous — Powder
Yellow; decomposes upon melting; dissolves in H2O; soluble in dilute acid Bright blue Yellow-green; decomposes upon melting soluble in acid — Brown; dissolves in hot H2O; soluble in dilute acid
PaO2 Pa2O5
263.03 542.07
— —
Cubic Cubic
Black Black
Rhenium (di)oxide Rhenium (hepta)oxide
ReO2 Re2O7
218.21 484.41
11.4 6.103
Black; insoluble in H2O; soluble in concentrated HCl Yellow; hygroscopic; very soluble in H2O; soluble in alkali, acid
Rhenium (per)oxide Rhenium (tri)oxide Rhenium (di)sulfide
Re2O3 ReO3 ReS2
500.41 234.21 250.33
8.4 6.9–7.4 7.506
— Plates or hexagonal or powder — Cubic Hexagonal
Rhenium (hepta)sulfide
Re2S7
596.83
4.866
Powder
Rhodium (di)oxide Rhodium (sesqui)oxide
RhO2 Rh2O3
134.90 253.81
— 8.20
Brown; insoluble in H2O, acid, alkali Gray; insoluble in H2O, acid, KOH
Rhodium (mono)sulfide Rhodium (sesqui)sulfide
RhS Rh2S3
134.97 302.00
— 6.40
— Crystalline or amorphous Crystalline —
RuO2 RuO4 RuS2
133.07 165.07 165.19
6.97 3.29 6.99
Tetragonal Needles, rhombohedral Cubic
Dark blue; decomposes upon melting; insoluble in H2O, acid Yellow; soluble in acid, alkali Gray-black; insoluble in H2O, acid
Protactinium Compounds Protactinium (di)oxide Protactinium (penta)oxide Rhenium Compounds
Rhodium Compounds
Gray-black; decomposes upon melting; insoluble in H2O, acid Black; decomposes upon melting; insoluble in H2O, acid
Ruthenium Compounds Ruthenium (di)oxide Ruthenium (tetra)oxide Ruthenium sulfide
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
White; very soluble in H2O; soluble in alkali Red, blue; insoluble in H2O; soluble in HNO3 Black; decomposes at 1000οC; insoluble in H2O, alkali, HCl; soluble in HNO3 Black; decomposes upon boiling; insoluble in H2O; soluble in HNO3
0910_book.fm Page 308 Wednesday, September 22, 2004 9:01 AM
Formula
308
© 2005 by CRC Press
Material
174.38 348.72 396.90
5.86 8.347 5.729
Hexagonal Powder —
Yellow; dissolves in H2O, acid White to yellowish; insoluble in cold H2O; very soluble in acid Yellowish pink; dissolves in hot H2O, dilute acid
ScO2
137.91
3.864
Powder
White; insoluble in H2O; soluble in hot acid
SeC2 Se4N4 SeO2 SeO3 SeS2
102.98 371.87 110.96 126.96 143.08
2.682 — 3.95 3.6 —
Liquid Amorphous Tetragonal Tetragonal —
SeS
11.02
3.056
Powder or tablets
Yellow; n0 = 1.845; insoluble in cold H2O Orange-yellow, brick red; hygroscopic; decomposes upon boiling Colorless-white; poisonous; soluble in ethanol, methanol White, deliquescent, very soluble in H2O Bright red-yellow; decomposes upon boiling; insoluble in cold H2O; dHNO3 Orange-yellow; insoluble in H2O
Silicon carbide Silicon (di)oxide
SiC SiO2
40.10 60.08
Hexagonal or cubic Cubic or tetragonal Amorphous Rhombohedral Hexagonal
Colorless to black; n0 = 2.654, 2.697; insoluble in H2O, acid Colorless; n0 = 1.487, 1.484; insoluble in H2O Colorless; vitreous; n0 = 1.4588, insoluble in H2O Colorless; n0 = 1.469, 1.470, 1.471; insoluble in H2O Colorless; n0 = 1.544, 1.553; insoluble in H2O
Silicon (mono)oxide Silicon (di)sulfide Silicon (mono)sulfide
SiO SiS2 SiS
44.08 92.21 60.15
3.217 2.32 2.19 2.26 2.635− 2.660 2.13 2.02 1.853
Cubic Needles, rhombohedral Needles
White; insoluble in H2O White; dissolves in cold H2O; soluble in dilute alkali Yellow; dissolves in H2O, alkali
AgN3 Ag2C2 Ag2O Ag2O2 Ag2Se
149.89 239.76 231.74 247.74 294.70
— — 7.143 7.44 8.0
Rhombohedral prism Precipitate Cubic Cubic Cubic or plates
Ag2S
247.80
7.326 7.317
Rhombohedral Cubic
White; explosive; insoluble in cold H2O White; insoluble in cold H2O; soluble in acid Brown-black; soluble in acid Gray-black; insoluble in cold H2O; soluble in acid Gray; decomposes upon boiling; insoluble in cold H2O; soluble in hot HNO3 Gray-black; decomposes upon boiling; soluble in acid Black; decomposes upon boiling; soluble in acid
Scandium Compounds Scandium oxide Selenium Compounds Selenium Selenium Selenium Selenium Selenium
carbide nitride (di)oxide (tri)oxide (di)sulfide
Selenium (mono)sulfide Silicon Compounds
Silver Compounds Silver Silver Silver Silver Silver
azide acetylide oxide (per)oxide selenide
309
Silver sulfide
0910_book.fm Page 309 Wednesday, September 22, 2004 9:01 AM
SmC2 Sm2O2 Sm2S3
Samarium carbide Samarium (sesqui)oxide Samarium (III) sulfide
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
© 2005 by CRC Press
Samarium Compounds
Silver telluride
Ag2Te
343.34
NaN3 Na2C2 Na3N Na2O Na2O2 Na3P Na2Se Na2S Na2S5 Na2S4 Na2Te
Density (g/cc)
Crystalline Form
Miscellaneous
8.5
Cubic
Gray, insoluble in H2O
65.01 70.00 82.98 61.98 77.98 99.94 124.94 78.04 206.28 174.22 173.58
1.846 1.575 — 2.27 2.805 — 2.625 1.856 — — 2.90
Hexagonal Powder — — Powder — Crystalline Crystalline — Cubic Crystalline/powder
Colorless White; dissolves in H2O; soluble in acid Dark gray; dissolves in cold H2O White to gray; deliquescent; dissolves in H2O Yellowish white; soluble in cold H2O; dissolves in hot H2O Red; decomposes upon melting White to red; deliquescent; dissolves in cold H2O White; deliquescent; dissolves in acid Yellow; soluble in acid Yellow; hygroscopic; decomposes upon boiling; soluble in cold H2O White; very hygroscopic; dissolves in air; very soluble; dissolves in H 2O
SrB6 SrC2 Sr3N2 SrO SrO2 SrSe SrS
152.48 111.64 290.87 103.62 119.62 166.58 119.68
3.39 3.2 — 4.7 4.56 4.38 3.70
Cubic Tetragonal — Cubic Powder Cubic Cubic
SrTe
215.22
4.83
Cubic
Black; insoluble in H2O, HCl Black; dissolves in H2O, acid Dissolves in H2O; soluble in HCl Gray-white; n0 = 1.810 White; dissolves in cold H2O White; n0 = 2.220; dissolves in H2O; soluble in HCl Colorless to light gray; n0 = 2.107; insoluble in cold H2O; dissolves in hot H2O acid White; n0 = 2.408
(Tetra)sulfur (di)nitride (Tetra)sulfur (tetra)nitride Sulfur (di)oxide
S 4N 2 S 4S 4 SO2
156.25 184.27 64.06
Liquid or solid — Gas; liquid
Red liquid or gray solid; insoluble in cold H2O Orange-red; dissolves in cold H2O Colorless; soluble in acid; suffocating odor; soluble in acid
Sulfur (hepta)oxide Sulfur (mono)oxide Sulfur (sesqui)oxide
S 2O 7 SO S 2O 2
176.12 48.06 112.12
1.901 2.22 2.927 1.434 — — —
Needles or liquid Gas Crystalline
Viscous liquid; dissolves in H2O; soluble in H2SO4 Colorless; decomposes on melting, boiling, H2O Blue-green; dissolves in H2O; soluble in fumed H2SO4
Sodium Compounds Sodium Sodium Sodium Sodium Sodium Sodium Sodium Sodium Sodium Sodium Sodium
azide carbide nitride (mono)oxide (per)oxide phosphide selenide (mono)sulfide (penta)sulfide (tetra)sulfide telluride
Strontium Strontium Strontium Strontium Strontium Strontium Strontium
(hexa)boride carbide nitride oxide (per)oxide selenide (mono)sulfide
Strontium telluride Sulfur Compounds
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
Strontium Compounds
0910_book.fm Page 310 Wednesday, September 22, 2004 9:01 AM
Formula
310
© 2005 by CRC Press
Molecular Weight
Material
SO4 SO3 (SO3)2 SO3
96.06 80.06 160.12 80.06
TaB2 TaC TaN Ta2N5 Ta2O4 Ta2S4
202.57 192.96 194.95 441.89 425.89 490.14
Tellurium (di)oxide
TeO2
159.60
Tellurium (mono)oxide
TeO
143.60
Tellurium (tri)oxide
TeO3
175.60
Tellurium sulfide
TeS2
191.72
Tb2O3 Tb4O7
365.85 747.70
Thallium azide Thallium (I) oxide Thallium (III) oxide
TlN3 Tl2O Tl2O3
246.40 424.77 456.76
Thallium selenide Thallium (I) sulfide
Tl2Se Tl2S
487.73 440.83
Thallium (III) sulfide
Tl2S3
504.93
— 1.97 — 1.920 2.29
— Fibrous needles Asbestos-like fiber Liquid Solid
White; dissolves in dilute H2SO4 Silky; stable; dissolves in H2O Metastable; dissolves in H2O Vitreous; orthorhombic; dissolves in H2O Metastable
— Cubic Hexagonal Rhombohedral Powder Powder/crystalline
— Black; insoluble in H2O; slightly soluble in acid Bright bronze or black; insoluble in H2O; slightly soluble in acid Colorless; insoluble in H2O; acid Dark gray; insoluble in H2O; acid Black; insoluble in H2O, HCl
5.67 5.91 5.682
Tetragonal Rhombohedral Amorphous
5.0752 6.21 —
Amorphous Crystalline Amorphous/powder
White; insoluble in H2O; soluble in acid, alkali n0 = 2.00, 2.18, 2.35 Black; decomposes upon boiling; insoluble in H2O; soluble in dilute acid Yellow amorphous, gray crystal; insoluble in H2O, acid Dissolves in concentrated HCl Red-black; insoluble in cold H2O, acid
Solid Solid
White; soluble in dilute acid Dark brown or black; insoluble in H2O; soluble in hot concentrated acid
Tetragonal — Hexagonal Amorphous prisms Leaf Tetragonal
Yellow Black; deliquescent; soluble in acid Insoluble in H2O, alkali; soluble in acid Colorless Gray; insoluble in cold H2O; soluble in acid Blue-black; decomposes upon boiling; soluble in acid; insoluble in alkali Black; decomposes upon boiling; insoluble in H2O; soluble in hot H2SO4
Tantalum Compounds Tantalum Tantalum Tantalum Tantalum Tantalum Tantalum
diboride carbide nitride (penta)oxide (tetra)oxide sulfide
11.15 13.9 16.30 8.2 — —
Tellurium Compounds
Terbium Compounds Terbium oxide Terbium (per)oxide
— —
Thallium Compounds — 9.52 10.19 9.65 9.05 8.46 —
Amorphous
0910_book.fm Page 311 Wednesday, September 22, 2004 9:01 AM
(tetra)oxide (α)trioxide (β)trioxide (γ)trioxide
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
© 2005 by CRC Press
Sulfur Sulfur Sulfur Sulfur
311
Density (g/cc)
Crystalline Form
Miscellaneous
ThB6 ThB4 ThC2 Th3N4 ThO2 ThS2
296.90 275.28 256.06 752.14 264.04 296.16
6.4 7.5 8.96 — 9.86 7.30
Cubic Tetragonal prisms Tetragonal Powder/crystalline Cubic Crystalline
Dark violet-black metallic; insoluble in H2O, alkali, acid; soluble in HCl Insoluble in H2O; soluble in acid Yellow, dissolves in cold H2O, very slightly soluble in concentrated acid Dark brown powder, black crystal; dissolves in H2O; soluble in HCl White; n0 = 2.20; insoluble in H2O, dilute acid, alkali Dark brown-black; insoluble in cold H2O
Tm2O3
385.87
—
Powder
Greenish white
Tin (II) (mono)oxide Tin (IV) (di)oxide Tin (mono)phosphide
SnO SnO2 SnP
134.69 150.69 149.66
6.446 6.95 6.56
Cubic (tetragonal) Tetragonal —
Tin (tri)phosphide (Tetra)tin (tri)phosphide Tin (II) selenide Tin (II) sulfide Tin (IV) sulfide Tin (II) telluride Tin (IV) telluride
SnP3 Sn4P3 SnSe SnS SnS2 SnTe SnTe2
211.61 567.68 197.65 150.75 182.81 246.29 373.89
4.10 5.181 6.179 5.22 4.5 6.48 —
Crystalline Crystalline Crystalline Cubic, monoclinic Hexagonal Crystalline Precipitate
Black; insoluble in H2O; soluble in acid, alkali White; n0 = 1.997, 2.093; insoluble in H2O Silver-white; decomposes on melting, boiling; insoluble in H2O HNO3; soluble in HCl Insoluble in H2O, HCl; dissolves in HNO3 White; insoluble in H2O Steel gray; insoluble in H2O; dissolves in acid Gray-black; dissolves in HCl, alkali Golden yellow; insoluble in acid Gray; decomposes upon boiling; insoluble in H2O Black flocculated percipitate; insoluble in H2O; dissolves in dilute acid, alkali
Formula
Thorium Compounds Thorium Thorium Thorium Thorium Thorium Thorium
(hexa)boride (tetra)boride carbide nitride (di)oxide sulfide
Thulium Compounds Thulium oxide Tin Compounds
Titanium (di)boride Titanium carbide Titanium (di)oxide
TiB2 TiC TiO2
69.50 59.89 79.88
4.5 4.93 4.17 3.84 4.26
Hexagonal Cubic Rhombohedral Tetragonal Tetragonal
Titanium (mono)oxide Titanium (sesqui)oxide
TiO Ti2O3
63.85 143.76
4.93 4.6
Prisms Hexagonal
— Gray metallic; insoluble in H2O; soluble in HNO3 White; n0 = 2.583, 2.586, 2.741 Brown-black; n0 = 2.554, 2.493 Colorless; n0 = 2.616, 2.903; for all three forms: insoluble in H2O, acid, soluble in alkali, H2SO4 Yellow-black; insoluble in HNO3; soluble in dilute H2SO4 Violet-black; insoluble in H2O, acid; soluble in H2SO4
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
Titanium Compounds
0910_book.fm Page 312 Wednesday, September 22, 2004 9:01 AM
312
© 2005 by CRC Press
Molecular Weight
Material
78.85 112.00 79.94
3.95 3.22 4.05
— Hexagonal Hexagonal
Titanium (sesqui)sulfide
Ti2S3
191.94
3.584
Hexagonal
Gray metallic; insoluble in H2O, acid Yellow; dissolves in HCl, soluble in dilute acid Reddish bronze; insoluble in cold H2O, acid; soluble in concentrated H2SO4 Grayish black; insoluble in H2O, dilute acid; soluble in concentrated acid
WB2 WC W 2C WN2 WO2 W 2O 5 WO3 WP WP2 W 2P WS2 WS3
205.47 195.86 379.71 211.86 215.85 447.70 231.85 214.82 245.80 398.67 247.97 280.03
10.77 15.63 17.75 — 12.11 — 7.16 8.5 5.8 5.21 7.5 —
Octahedral Hexagonal Hexagonal Cubic Cubic Triclinic Rhombohedral/powder Prism Crystalline Prism Hexagonal Powder
Silvery; insoluble in H2O Black; insoluble in cold H2O Black; insoluble in cold H2O Brown, dissolves in H2O Brown; insoluble in H2O; soluble in acid, KOH Blue-violet; insoluble in H2O, acid Yellow-orange powder; insoluble in H2O, acid; soluble in hot alkali Gray; insoluble in cold H2O, alkali, HCl Black; decomposes upon melting; insoluble in H2O Dark gray; decomposes upon melting; insoluble in acid Dark gray; insoluble in cold H2O; soluble in fused alkali Chocolate brown; soluble in H2O, alkali
UB2 UC2 UN UO2 UO3
259.65 262.05 252.04 270.03 286.93
12.70 11.28 14.31 10.96 7.29
Hexagonal Crystalline Powder Rhombohedral/cubic Crystalline
Uranium (sesqui)oxide Uranium (di)sulfide
U 2O 3 US2
842.08 302.15
8.30 7.96
Uranium (mono)sulfide Uranium (sesqui)sulfide
US U 2S 3
270.09 572.24
10.87 —
Amorphous powder Rhombohedral needles
— Metallic; dissolves in H2O, dilute inorganic acid Brown; insoluble in HCl, H2SO4 Brown-black; insoluble in H2O; soluble in acid Yellow-red; decomposes upon melting; insoluble in cold H2O; soluble in acid Olive green to black; insoluble in H2O; soluble in acid Gray-black; slightly dissolves in cold H2O; soluble in concentrated HCl; dissolves in HNO3 Black, insoluble in acid Gray black, insoluble in dilute acid
VB2 VC VN VO
72.56 62.95 64.95 66.94
Hexagonal Cubic Cubic Crystalline
— Black; insoluble in cold H2O, acid; soluble in HNO3 Black; insoluble in cold H2O Light gray; insoluble in H2O; soluble in acid
Tungsten Compounds Tungsten (di)boride Tungsten carbide (Di)tungsten carbide Tungsten (di)nitride Tungsten (di)oxide Tungsten (penta)oxide Tungsten (tri)oxide Tungsten (mono)phosphide Tungsten (di)phosphide (Di)tungsten phosphide Tungsten (di)sulfide Tungsten (tri)sulfide Uranium Compounds Uranium Uranium Uranium Uranium Uranium
(di)boride (di)carbide (mono)nitride (di)oxide (tri)oxide
— Tetragonal
Vanadium Compounds (di)boride carbide nitride oxide
5.10 5.77 6.13 5.758
313
Vanadium Vanadium Vanadium Vanadium
0910_book.fm Page 313 Wednesday, September 22, 2004 9:01 AM
Tip TiS2 TiS
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
© 2005 by CRC Press
Titanium phosphide Titanium (di)sulfide Titanium (mono)sulfide
Molecular Weight
Density (g/cc)
Crystalline Form
Miscellaneous
(di)oxide (penta)oxide (sesqui)oxide (mono)sulfide
VO2 V 2O 5 V 2O 3 VS
82.94 181.88 149.88 83.00
4.339 3.357 4.87 4.20
Crystalline Rhombohedral Crystalline Hexagonal
Vanadium (penta)sulfide
V 2S 5
262.18
3.0
Powder
Vanadium (sesqui)sulfide
V 2S 3
198.06
4.72
Plates/powder
Blue; insoluble in H2O; soluble in acid, alkali Yellow to red; n0 = 1.46, 1.52, 1.76; soluble in acid, alkali Black; soluble in H2O, HNO3, alkali Black plates; decomposes upon melting; soluble in acid; insoluble in HCl, alkali Black to green; decomposes upon melting; insoluble in cold H2O; soluble in HNO3, alkali Green to black; insoluble in cold H2O; slightly soluble in alkali, acid
Yb2O3
394.08
9.17
Cubic
Colorless; insoluble in H2O; soluble in hot dilute acid
YC2 Y 2O 3
112.93 225.81
4.13 5.01
Microcrystalline Cubic/powder
Yellow; dissolves in cold H2O Colorless to yellowish; soluble in acid; insoluble in alkali
Zn3N2 Zn3P2 ZnSe ZnS ZnS ZnTe
224.15 258.09 144.34 97.44 97.44 192.98
6.22 4.55 5.42 3.98 4.102 6.34
Cubic Tetragonal Cubic Hexagonal Cubic Cubic
Gray; dissolves in cold H2O; soluble in HCl Dark gray; poisonous; dissolves in cold H2O; soluble in dilute acid Yellowish to reddish; n0 = 2.89; insoluble in cold H2O; soluble in acid Colorless; n0 = 2.356, 2.378; very soluble in acid Colorless; n0 = 2.368; very soluble in acid Insoluble in H2O; slowly dissolves in acid
Zirconium (di)boride Zirconium carbide
ZrB2 ZrC
112.84 103.23
6.085 6.73
Hexagonal Cubic
Zirconium nitride Zirconium oxide
ZrN ZrO2
105.23 123.22
7.09 5.89
Crystalline Monoclinic
Zirconium phosphide
ZrP2
153.17
4.77
—
Zirconium sulfide
ZrS2
155.34
3.87
Crystalline
— Gray metallic; insoluble in cold H2O; slightly soluble in concentrated H2SO4 Yellow-brown; insoluble in H2O; soluble in concentrated acid Colorless to yellow brown; n0 = 2.13, 2.19, 2.20; insoluble in H2O; soluble in acid Gray; brittle; insoluble in cold H2O; very soluble in concentrated hot H2SO4 Steel gray crystal; hexagonal; insoluble in H2O, acid
Ytterbium Compounds Ytterbium (III) oxide Yttrium Compounds
Zinc Compounds Zinc nitride Zinc phosphide Zinc selenide Zinc α-sulfide Zind β-sulfide Zinc telluride Zirconium Compounds
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
Yttrium carbide Yttrium oxide
0910_book.fm Page 314 Wednesday, September 22, 2004 9:01 AM
Vanadium Vanadium Vanadium Vanadium
Formula
314
© 2005 by CRC Press
Material
0910_book.fm Page 315 Wednesday, September 22, 2004 9:01 AM
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
II. ELECTRICAL PROPERTIES
© 2005 by CRC Press
315
Aluminum (III) oxide or alumina (Al2O3)
Dielectric Strength (kV/mm)
—
—
Dielectric Loss at ~1 MHz (tan )
Curie, Tc, or (Neel, Tn) Temp. (°C)
References and Miscellaneous
—
—
24.00
—
5.10
—
—
—
—
5.30
—
—
1, p. 308
—
—
3.30
—
—
1, p. 306
—
—
11.40
—
—
1, p. 306
—
—
34.00
—
1, p. 306; 5, p. 933
—
—
19.23
—
—
1, p. 306
—
—
0.01–0.02; 0.01–0.02 at 1 kHz for thin films
135; 115−140 for thin films
—
—
1,000−5,000; 1,200−1,600 at 1 kHz; 550−1800 at 1 kHz for thin films 43.00
—
—
1, p. 306; 4, p. 180; 5, p. 868; 7, p. 1113; 8, p. 192; 10, p. 965; 12; Eg = 2.5−3.2 eV 1, p. 306
—
—
18.00
—
—
1, p. 306
—
—
10,000−20,000
—
—
7, p. 1113; 8, p. 192
(1−3) × 10−4; 4 × 10−4 for thin film
—
1, p. 306; 3, p. TD25, TD27; 6, p. 710; 7, p. 1108; 13
10; ∼2,000 (single crystal)
8.8−10.0
1 × 10−3 to 2 × 10−4
—
∼1010−1013
10; 23.6 for thick film
8.60−12.3, 10.10 (γ-Al2O3)
1 × 10−3 to 1 × 10−5
—
>1015
24; 9.5 for thin film
6.4−6.8
1 × 10−3
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
—
1, p. 306; 12, p. 63; Eg = 1.6 eV 3, p. TD25, TD27, TD29, TD30; 6, p. 709; 7, p. 1108 1, p. 306; 2, p. 233; 3, p. TD25, TD27; 4, p. 180; 5, p. 868, 933; 6, p. 710; 7, p. 1108; 8, p. 192; 9, p. 400; 11−13; Eg > 8 eV 1, p. 308
2 × 109−1011
Antimony bromide (SbBr3) Antimony chloride (SbCl3) Arsenic boride (AsBr3) Barium chloride (BaCl2) Barium oxide (BaO) Barium sulfide (BaS) Barium titanate (BaTiO3) Barium zirconate (BaZrO3) Barium-tin IV oxide (barium stannate) (BaSnO3) Barium−zirconiumtitanate (BaZrxTi1–xO3) Berrylium oxide (BeO)
Dielectric Constant at ~25°C and ~1 MHz
0910_book.fm Page 316 Wednesday, September 22, 2004 9:01 AM
Aluminum antimonide (AlSb) Alumium nitride (AIN)
Resistivity (·m at ~25°C)
316
© 2005 by CRC Press
Material
Boron nitride (BN)
1010 to 1.7 × 1011; 3 × 102 at 1000οC
Cadmium bromide (CdBr2) Cadmium oxide (CdO) Cadmium sulfide (CdS) Cadmium telluride (CdTe) Calcium carbonate (CaCO3) Calcium fluoride (CaF2) Calcium oxide (CaO)
Calcium titanate (CaTiO3) Cesium chloride (CsCl) Cesium iodide (CsI) Chromium boride (CrB2) Chromium oxide (Cr2O3)
— —
135.00
10−3−10−1
— 112 at 1 kHz
—
31−39
—
3−4.11; 7.1 at i.r
—
—
2, p. 231
—
—
1, p. 306
—
—
5, p. 851; 6, p. 707; 7, p. 806; 9, p. 400; 11; 12; Eg = 1.64 eV 3, p. TD29; 5, p. 868; 6, p. 709; 11−14; Eg = 4.8 eV 1, p. 306
3.4−11
—
—
—
8.60
—
—
67.3 at 795οC; 7.13 at 1000οC; 0.326 at 1200οC —
—
17.2 at 4.5 × 108 Hz
—
—
5, p. 868; 13; Eg = 2.1 eV
—
9.53−10.33 at 104 Hz
—
—
—
—
7−10.60 at i.r.
—
—
—
—
7.80−8.50
—
—
3, p. TD30; 5, p. 868; 12; 14; Eg = 2.42 eV 1, p. 306; 5, p. 868; 12; 14; Eg = 1.45 eV 2, p. 233
—
—
6.25−6.79
—
—
41.75 × 103 at 930οC; 10.4 × 102 at 1235οC; 20.45 at 1370οC —
—
0.10−11.80
—
—
—
160−165
—
—
—
—
6.34−7.2
—
—
7, p. 1113; 8, p. 192; 14 1, p. 306; 14
—
—
5.60; 6.31 at 1 kHz —
—
—
1, p. 306; 14
—
—
6, p. 707; 7, p. 799
9.2 at 450 MHz; 11.9−13.3 at 1 kHz
—
—
9, p. 400; 12−14
—
3 × 102; 1.3 × 101 at 350ο C; 7.8 × 10–1 at 750οC; 4.0 × 10−1 at 1000οC; 2.2 × 10−1 at 1200οC
—
Note: Eg = band gap; 1 kV/mm = 0.0393 V/mil; i.r. (infrared) frequency range = 0.7 to 15 µm or (0.33−5) × 1014 Hz.
317
21−30 × 10−8
2, p. 233; 5, p. 868; Eg = 12 eV 1, p. 306; 12; 13
0910_book.fm Page 317 Wednesday, September 22, 2004 9:01 AM
3−570
PROPERTIES OF SOLID-STATE INORGANIC MATERIALS
© 2005 by CRC Press
Bismuth sulfide (Bi2S3) Bismuth titanate (Bi4Ti3O12) Boron carbide (B4C)
1 × 106; 1.0 at 300οC
—
10−50
—
(80–100) × 10−6
Dielectric Loss at ~1 MHz (tan )
Curie, Tc, or (Neel, Tn) Temp. (°C)
References and Miscellaneous
12.90
—
—
7.5−10
—
—
—
—
1, p. 306; 5, p. 868; 13; 14; Eg = 4 eV 2, p. 231; 5, p. 868; 13; 14; Eg = 2.1 eV 2, p. 231
Dielectric Constant at ~25°C and ~1 MHz
—
—
—
—
9.80
—
—
1, p. 306
6000
—
10.68−18.1
—
—
2, p. 231; 13; 14
(0.30–83) × 10−6
—
—
—
2, p. 231
—
11
>1012
14
— 60 × 10−4
10.6
—
—
15.69 at i.r.
—
—
—
—
12.95
—
—
—
—
11.1
—
—
(10−2) × 10−8
—
—
—
—
1, p. 307; 12; 14; Eg = 0.8 eV 1, p. 307; 5, p. 868; 12; Eg = 1.4 eV 5, p. 868; 12; 14; Eg = 1.3−2.25 eV 6, p. 707; 7, p. 799; 12
10.9 × 10−7 − 60 × 10−8
—
—
—
—
6, p. 708; 7, p. 810; 12
—
—
17.88 at i.r.
—
—
—
—
14.55 at i.r.
—
—
—
—
—
—
1, p. 307; 12; 14; Eg = 0.18 eV 1, p. 307; 12; 14; Eg = 0.47 eV 2, p. 231
(1−150) × 10−3 (marcasite) (1.2−600) × 10−3 (pyrite) — 4 × 10−2; 10.38 at 700οC; 8.23 × 10−1 at 1,000οC
—
14.20
—
(−87 to −83)
—
25.0
—
575-(γ−Fe2 O3), 675-(α and γ forms)
1, p. 307; 2, p. 256; 13−14 2, pp. 233, 256; 5, pp. 868, 993; 9, p. 400; 13; Eg = 3.1 eV
0910_book.fm Page 318 Wednesday, September 22, 2004 9:01 AM
Iron II oxide (FeO) Iron III oxide (Fe2O3)
Dielectric Strength (kV/mm)
INORGANIC MATERIALS CHEMISTRY DESK REFERENCE
Cobalt oxide (CoO) Copper I oxide (Cu2O) Copper I sulfide (Cu2S) Copper II chloride (CuCl2) Copper II oxide (CuO) Copper II sulfide (CuS) Cordierite (2MgO. 2Al2O3. 5SiO2) Gallium antimonide (GaSb) Gallium arsenide (GaAs) Gallium phosphide (GaP) Hafnium boride (HfB2) Hafnium carbide (HfC) Indium antimonide (InSb) Indium arsenide (InAs) Iron disulfide (marcasite-FeS2) (Pyrite-FeS2)
Resistivity (·m at ~25°C)
318
© 2005 by CRC Press
Material
10–3−4.0
—
20 —
—
(575−580)
—
(−216 to −205)
2, pp. 231, 256; 5, p. 851; 13, 14 2, pp. 231, 256; 14
—
—